CN105934110A - Sandwich structure for ultrathin laminated board processing and laminated board manufacturing method - Google Patents
Sandwich structure for ultrathin laminated board processing and laminated board manufacturing method Download PDFInfo
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- CN105934110A CN105934110A CN201610403486.2A CN201610403486A CN105934110A CN 105934110 A CN105934110 A CN 105934110A CN 201610403486 A CN201610403486 A CN 201610403486A CN 105934110 A CN105934110 A CN 105934110A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1484—Simultaneous treatments, e.g. soldering lead-in-hole components simultaneously with surface mounted components
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention provides a method for manufacturing laminated board. The method comprises the following steps: firstly laminating two double-sided copper-clad boards on an upper surface and a lower surface of one bearing plate board at low temperature at a second prepreg and a third prepreg so as to form a sandwich structure for the ultrathin laminated board processing; forming blind holes on the two double-sided copper-clad boards on the upper surface and the lower surface of the sandwich structure for the ultrathin laminated board processing through laser drilling; forming the other surface circuit of each of two double-sided copper-clad boards on the structure of step S5 through metallization; laminating two outer layer copper foils on the upper surface and the lower surface of the sandwich structure for the ultrathin laminated board processing through a fourth prepreg and a fifth prepreg so as to form cured sandwich structure; forming two four-layer circuit board structures on the outside of a release film of the bearing board; and finally peeling off two four-layer circuit board structures on the outside of the release film of the bearing board. Through the adoption of the structure provided by the invention, the process difficulty can be reduced, two circuit boards are prepared at once, the efficiency is improved, and the warping problem produced in the base plate manufacturing is solved.
Description
Technical field
The present invention relates to a kind of processing technique, the processing technique of ultra-thin wiring board below a kind of 80 μ m thick.
Background technology
Thickness circuit board through-hole filling perforation below 80 μm manufactures difficulty, is difficult to fill up hole by plating, thus, it is impossible to complete multi-layer sheet and fold hole, it is difficult to the problem completing to electroplate filling perforation.
Ultra thin plate processing processing on the horizontal line that substrate is commonly used below 80 μ m thick there will be flap and clamp, easily occurs useless plate time serious.
Thickness double face copper below 80 μm at present, the aperture through hole less than 100 μm can be formed in copper-clad plate by laser drill, and this small through hole needs to carry out electro-coppering filling perforation, require nothing cavity in hole, and the thickness of central layer is less than the wiring board of 80 μm, make multi-layer sheet, it is desirable to carry out the folded hole machined of multistage blind hole.But, conventional filling perforation plating, either imposite plating or graphic plating, all cannot meet the requirement of filling up of the electroplates in hole, and face copper has plated the thickest, and through hole still fails to fill up.Then it has been proposed that the technology of a kind of two-sided through hole.The method using laser out of focus, at a certain distance from laser spot is placed on double face copper surface, allow the copper face processed not in focus, the blind hole of an inverted trapezoidal is made a call in the side of double face copper, again double face copper is turned over, form another and inverted trapezoidal blind hole back-to-back inverted trapezoidal blind hole above at same position by same method, by the deep processing of second inverted trapezoidal blind hole to the blind hole UNICOM with opposite, form the through hole of a waist-drum-shaped, the most so-called butterfly hole；As shown in Figure 1；In Fig. 1, labelling 1 is the Copper Foil of double face copper, and labelling 2 is central layer, and labelling 3 is butterfly hole；
After this butterfly hole 3 forms the via hole by electroless copper, then electroplate, owing to the aperture in the middle of through hole is little, so along with the lengthening of electroplating time, in the middle of through hole, gradually Guan Bi forms two, both sides blind hole, is finally filled up by the electroplates in hole；As shown in Figure 2；
It can be seen in fig. 2 that prolongation over time, through hole 3 is gradually filled up by electro-coppering 4.Though this method can realize the electroplates in hole, but, its technology difficulty is relatively big, exist of both problem:
1, owing to being the hole using out of focus mode or other modes to manufacture inverted trapezoidal, technique controlling difficulty is bigger, it is desirable to the consistency of thickness of dual platen is good, and laser drill machine table top rises and falls little, and in processing, granule and dust etc. are serious on processing impact.
2, positive and negative aperture aligning accuracy requires height, if positive and negative dislocation, plating can be produced impact.Visible, this kind of control process difficulty is big, and concordance and repeatability and environmental requirement are high.
Summary of the invention
It is an object of the invention to overcome the deficiencies in the prior art, sandwich structure and method for producing multi-layer board that a kind of ultra-thin multi-layer sheet processes are provided, solve the technical barrier of the electroplates in hole of the ultra-thin wiring board of below 80 μ m thick, through hole process change is become to run through the processing of central layer blind hole, become the blind hole plating that circuit-board industry is conventional, Simplified flowsheet, reduces technology difficulty；By the interim bonding structure of loading plate, ultra-thin double face copper process change is become slab processing, it is to avoid clamp and flap；It can be avoided that manufacture, with the interim bonding structure of loading plate, the warpage issues that substrate produces；The technical solution used in the present invention is:
A kind of method that multi-layer sheet makes, comprises the steps:
Step S1, it is provided that two double face copper；Being placed in by first prepreg in the middle of two double face copper, low temperature pressing forms three layers of interim bonding structure, and wherein the first prepreg is uncured；
Step S2, the upper outer lower face surface at three layers of interim bonding structure makes circuit；
Two double face copper are opened from the first prepreg by step S3, form two circuit boards with one side circuit；
Two double face copper with one side circuit are pressed together on a loading plate upper and lower surface by step S4 by the second prepreg, the 3rd prepreg low temperature, form the interim bonding structure of loading plate, are the sandwich structure of ultra-thin multi-layer sheet processing；During pressing double face copper established one side circuit to inner side towards loading plate；Second prepreg, the 3rd prepreg are uncured；
Described loading plate includes middle central layer, is pressed together on the loading plate Copper Foil on middle central layer two sides；It is coated with mould release membrance above the loading plate Copper Foil on middle central layer two sides；Mould release membrance outer side covers has Copper Foil support plate；
Step S5, the sandwich structure upper and lower surface in the processing of ultra-thin multi-layer sheet forms the blind hole in upper and lower double face copper by laser drill；
Step S6, forms the another side circuit in two double face copper by metallization in the structure of step S5；
Step S7, then two outer copper foils are passed through the 4th prepreg, the 5th prepreg high-temperature laminating by the sandwich structure upper and lower surface in the processing of ultra-thin multi-layer sheet, form sandwich structure after solidification；
Two four-layer circuit board structures are formed outside the mould release membrance of loading plate；
Two four-layer circuit board structures outside the mould release membrance of loading plate are peeled by step S9.
Further, in step S1, the temperature of low temperature pressing is at 80 DEG C～140 DEG C.
Further, in step S4, the temperature of low temperature pressing is at 80 DEG C～140 DEG C.
Further, in step S5, in blind hole, carry out de-smear process.
Further, step S6 specifically includes:
Step S6.1, removes face copper on the sandwich structure that the ultra-thin multi-layer sheet making blind hole is processed；
Step S6.2, then the sandwich structure Electroless copper of the ultra-thin multi-layer sheet processing after the copper of the face of removal, forms chemical plating copper layer；
Step S6.3, the sandwich structure of the ultra-thin multi-layer sheet processing after copper coating is lithographically formed graphic plating mask；
Step S6.4, utilizes graphic plating mask, carries out graphic plating, forms the another side circuit of two double face copper on the sandwich structure of ultra-thin multi-layer sheet processing；
Step S6.5, stripping: remove the graphic plating mask formed in step S6.3；
Step S6.6, removes the chemical plating copper layer under graphic plating mask by the method dodging erosion.
The sandwich structure of a kind of ultra-thin multi-layer sheet processing formed in above-mentioned processing technology, including:
Loading plate, described loading plate includes middle central layer, is pressed together on the loading plate Copper Foil on middle central layer two sides；It is coated with mould release membrance above the loading plate Copper Foil on middle central layer two sides；Mould release membrance outer side covers has Copper Foil support plate；
Two double face copper with one side circuit are pressed together on described loading plate upper and lower surface by the second prepreg, the 3rd prepreg low temperature, form the interim bonding structure of loading plate；
During low temperature pressing, the second prepreg, the 3rd prepreg are uncured, and during pressing, double face copper established one side circuit is to inner side.
It is an advantage of the current invention that:
1) through hole process change is become to run through the processing of central layer blind hole by the present invention, and the copper at the back side retains, and directly by the electroplates in hole, becomes the blind hole plating that circuit-board industry is conventional.Simplified flowsheet, reduces technology difficulty.
2) by the interim bonding structure of loading plate, ultra-thin double face copper process change is become slab processing, it is to avoid clamp and flap.
3) by loading plate transition, once manufacture two circuit boards, improve efficiency.
4) four-layer circuit board formed has the good symmetry in structure, is prevented effectively from and manufactures, with the interim bonding structure of loading plate, the warpage issues that substrate produces.
Accompanying drawing explanation
Fig. 1 is that prior art makes through hole schematic diagram in ultrathin double-face copper-clad plate.
Fig. 2 is that prior art electroplates filling perforation schematic diagram in ultrathin double-face copper-clad plate.
Fig. 3 is that two double face copper of low temperature pressing of the present invention form three layers of interim bonding structural representation.
Fig. 4 be the present invention make conspectuses at three layers of interim bonding body structure surface.
Fig. 5 is that two double face copper of the present invention open two circuit board schematic diagrams with one side circuit of formation from the first prepreg.
Fig. 6 is that the sandwich structure of the ultra-thin multi-layer sheet processing of the present invention forms schematic diagram.
Fig. 7 is the sandwich structure drilling blind hole schematic diagram in the processing of ultra-thin multi-layer sheet of the present invention.
Fig. 8 is that the sandwich structure of the ultra-thin multi-layer sheet processing of the present invention removes face copper schematic diagram.
Fig. 9 is that the sandwich structure surface of the ultra-thin multi-layer sheet processing of the present invention forms chemical plating copper layer schematic diagram.
Figure 10 is to make graphic plating mask schematic diagram on the sandwich structure of the ultra-thin multi-layer sheet processing of the present invention.
Figure 11 is that the graphic plating of the present invention forms the another side conspectus of two double face copper on the sandwich structure of ultra-thin multi-layer sheet processing.
Figure 12 is to remove graphic plating mask schematic diagram on the sandwich structure of the ultra-thin multi-layer sheet processing of the present invention.
Figure 13 is the chemical plating copper layer schematic diagram removed under graphic plating mask of the present invention.
Figure 14 is sandwich structure and the prepreg of the ultra-thin multi-layer sheet processing of the present invention and outer copper foil high-temperature laminating forms sandwich structure schematic diagram after solidification.
Figure 15 is the four-layer circuit board schematic diagram after separating.
Detailed description of the invention
Below in conjunction with concrete drawings and Examples, the invention will be further described.
The present embodiment introduces the sandwich structure of ultra-thin multi-layer sheet processing, and the method that the sandwich structure using this ultra-thin multi-layer sheet to process carries out multi-layer sheet making；
The method that multi-layer sheet makes, comprises the steps:
Step S1, it is provided that two ultrathin double-face copper-clad plates 1,2；Being placed in by first prepreg 3 in the middle of two double face copper 1,2, low temperature pressing forms three layers of interim bonding structure, and wherein the first prepreg 3 is uncured；The temperature of low temperature pressing is at 80 DEG C～140 DEG C；As shown in Figure 3；
Ultrathin double-face this example of copper-clad plate refers to the double face copper of below 80 μm；
The prepreg used in the present invention can be the prepreg of FR4, and BT prepreg, RCC removes the semi-solid preparation resin sheet of Copper Foil；
As a example by double face copper 1, the structure of double face copper includes the layers of copper 102,103 on central layer 101 and central layer two sides；
Step S2, the upper outer lower face surface at three layers of interim bonding structure makes circuit, forms structure as shown in Figure 4；In Fig. 4, labelling 4 and 5 is the circuit making formation on three layers of interim bonding structure；
Two double face copper 1,2 are opened from the first prepreg 3 by step S3, form two circuit boards with one side circuit；As shown in Figure 5；
Step S4, as shown in Figure 6, two double face copper 1,2 with one side circuit are pressed together on loading plate 8 upper and lower surface by the second prepreg the 6, the 3rd prepreg 7 low temperature, form the interim bonding structure of loading plate, be the sandwich structure of ultra-thin multi-layer sheet processing；As shown in Figure 6；During pressing the established one side circuit of double face copper 1,2 to inner side towards loading plate 8；
The temperature of low temperature pressing is at 80 DEG C～140 DEG C；Second prepreg the 6, the 3rd prepreg 7 is uncured；
Described loading plate 8 is a double face copper with extra thin copper foil, can be included middle central layer 801 by city available from, loading plate 8, be pressed together on the loading plate Copper Foil 802,803 on middle central layer 801 two sides；It is coated with mould release membrance 804,805 above the loading plate Copper Foil 802,803 on middle central layer 801 two sides；Mould release membrance 804,805 outer side covers has Copper Foil support plate 806,807；
This loading plate 8 is the double face copper with extra thin copper foil, and wherein, the loading plate Copper Foil 802,803 on middle central layer 801 two sides is extra thin copper foil, and the Copper Foil support plate thickness outside mould release membrance is thicker, plays protection and carrying effect.
Step S5, the sandwich structure upper and lower surface in the processing of ultra-thin multi-layer sheet forms the blind hole 9 in upper and lower double face copper 1,2 by laser drill；As shown in Figure 7；
Preferably, de-smear process is carried out in blind hole 9；Concrete available alkaline permanganate solution removes de-smear；
Step S6, forms the another side circuit in two double face copper 1,2 by metallization in the structure of step S5；Metallized method can be a subtractive to method, improvement semi-additive process, it is also possible to is semi-additive process.Flow process is the manufacturing process of semi-additive process below:
Step S6.1, as shown in Figure 8, removes face copper on the sandwich structure that the ultra-thin multi-layer sheet making blind hole is processed；Will the outer surface layers of copper in double face copper 1,2 remove；This step can use the method for etching；
Step S6.2, as it is shown in figure 9, the sandwich structure Electroless copper of then ultra-thin multi-layer sheet processing after removing face copper, forms chemical plating copper layer 10；
Step S6.3, as shown in Figure 10, the sandwich structure of the ultra-thin multi-layer sheet processing after copper coating is lithographically formed graphic plating mask 11；
Step S6.4, as shown in figure 11, utilizes graphic plating mask 11, carries out graphic plating, forms the another side circuit 12 of two double face copper 1,2 on the sandwich structure of ultra-thin multi-layer sheet processing；In this step, blind hole 9 has carried out plating filling perforation；
Step S6.5, stripping: remove the graphic plating mask 11 formed in step S6.3；As shown in figure 12；The method that can use the molten film of alkali liquor is removed；
Step S6.6, removes the chemical plating copper layer 10 under graphic plating mask by the method dodging erosion；As shown in figure 13；
Then, carry out:
Step S7, then two outer copper foils 15,16 are passed through the 4th prepreg the 13, the 5th prepreg 14 high-temperature laminating by the sandwich structure upper and lower surface in the processing of ultra-thin multi-layer sheet, form sandwich structure after solidification；As shown in figure 14；
The second prepreg the 6, the 3rd prepreg 7 during high-temperature laminating makes the sandwich structure that ultra-thin multi-layer sheet is processed in this step；And the 4th prepreg the 13, the 5th prepreg 14 in this step can solidify；
Prepreg to FR4, BT prepreg, the temperature of hot setting can be respectively 200 DEG C, 260 DEG C；
Two four-layer circuit board structures are formed outside the mould release membrance of loading plate 8；
Step S8, in previous step, after prepreg solidification, Copper Foil support plate 806,807 the most respectively with the second prepreg the 6, the 3rd prepreg 7 of loading plate 8 both sides combines；Thus outside the mould release membrance of loading plate 8, form two four-layer circuit board structures；
In this step, two four-layer circuit board structures outside the mould release membrance of loading plate 8 are peeled；
Owing to there being the existence of mould release membrance 804,805, therefore can be easy to directly be peeled by the four-layer circuit board of both sides, form two four-layer circuit boards and two sides only has the double face copper of extra thin copper foil；
The four-layer circuit board peeled is as shown in figure 15.
Subsequent step, it is also possible to the outer-layer circuit carrying out four-layer circuit board makes, and the upper and lower surface making technique such as solder mask and solderability protective layer at four-layer circuit board, introduction is omitted.
In above-mentioned steps,
Three layers of interim bonding structure are formed by low temperature pressing ultrathin double-face copper-clad plate and prepreg, three layers of interim bonding structure have bigger thickness, convenient processing on plate line, easy and simple to handle, reduce card plate problem, this structure manufactures the one side circuit of ultra thin plate, and effective Simplified flowsheet reduces manufacture difficulty, reduces process costs.
Two ultra thin plates are pressed together in a double face copper with extra thin copper foil (i.e. loading plate 8) by the circuit board that one side has circuit by low temperature pressing prepreg, form the sandwich structure of ultra-thin multi-layer sheet processing, ultra thin plate carried out blind hole processing without circuit surface, remanufacture the circuit without circuit surface and form the two sides interconnection of ultra thin plate central layer, the most significantly increase the thickness of substrate processing, reduce difficulty of processing, Simplified flowsheet, simultaneously, it is blind hole processing by the through hole process change of original ultra thin plate, utilize ripe blind hole processing technique, replace machining process for through hole, difficulty of processing is greatly lowered, avoid butterfly hole machined manufacture, effectively reduce processing cost, and disclosure satisfy that via metal plating is filled a vacancy, without cavity requirement.And with the double face copper of extra thin copper foil as the loading plate in processing, after use, still can be as central layer for the processing and manufacturing of other substrates.
In above-mentioned technique, first with two ultrathin double-face copper-clad plates (step S4) of low temperature pressing, again at sandwich structure two sides high-temperature laminating prepreg and the outer copper foil of the processing of ultra-thin multi-layer sheet, in bonding processes, the prepreg of above low temperature pressing solidifies simultaneously, two prepregs in the four-layer circuit board structure finally peeled are solidified under same high temperature curing conditions, the four-layer circuit board formed has the good symmetry in structure, is prevented effectively from and manufactures, with the interim bonding structure of loading plate, the warpage issues that substrate produces.
The present invention is this utilizes the method that two kinds of interim bonding structures manufacture ultra thin substrates (substrate of the present embodiment is exactly the four-layer circuit board after separating), has techniques below advantage compared with traditional ultra thin substrate manufacture method:
1. ultra thin plate process change is conventional slab processing, it is not necessary to the special tools such as the guided plate required for conventional ultra thin plate processing, reduces technology difficulty, does not has complex processing requirements, therefore reduce process costs, Simplified flowsheet.
2. ultra thin substrate the electroplates in hole is converted into blind hole plating, effectively realizes plated metal and fill the technology requirement of through hole.Solve the technical problem of ultra thin plate the electroplates in hole difficulty, it is to avoid using highly difficult through hole to be processed into repeatedly laser drill and the alignment issues in butterfly hole, Simplified flowsheet reduces technology difficulty.
3. solve to use the two-sided interim bonding of loading plate to manufacture the substrate warping problems that the manufacture method of multilayered coreless plate produces.
4. the technical solution used in the present invention has advantage high for high efficiency with conventional ultra thin substrate processing ratio, and the interim bonding structure of time processing forms two substrates.
The most above-mentioned 4 advantages causing a low cost.
Claims (6)
1. the method that a multi-layer sheet makes, it is characterised in that comprise the steps:
Step S1, it is provided that two double face copper (1,2)；Being placed in by first prepreg (3) in the middle of two double face copper (1,2), low temperature pressing forms three layers of interim bonding structure, and wherein the first prepreg (3) is uncured；
Step S2, the upper outer lower face surface at three layers of interim bonding structure makes circuit；
Two double face copper (1,2) are opened from the first prepreg (3) by step S3, form two circuit boards with one side circuit；
Step S4, two double face copper (1,2) with one side circuit are pressed together on loading plate (8) upper and lower surface by the second prepreg (6), the 3rd prepreg (7) low temperature, form the interim bonding structure of loading plate, be the sandwich structure of ultra-thin multi-layer sheet processing；During pressing double face copper (1,2) established one side circuit to inner side towards loading plate (8)；Second prepreg (6), the 3rd prepreg (7) are uncured；
Described loading plate (8) includes middle central layer (801), is pressed together on the loading plate Copper Foil (802,803) on middle central layer (801) two sides；It is coated with mould release membrance (804,805) above the loading plate Copper Foil (802,803) on middle central layer (801) two sides；Mould release membrance (804,805) outer side covers has Copper Foil support plate (806,807)；
Step S5, the sandwich structure upper and lower surface in the processing of ultra-thin multi-layer sheet forms the blind hole (9) in upper and lower double face copper (1,2) by laser drill；
Step S6, forms the another side circuit on two double face copper (1,2) by metallization in the structure of step S5；
Step S7, then two outer copper foils (15,16) are passed through the 4th prepreg (13), the 5th prepreg (14) high-temperature laminating by the sandwich structure upper and lower surface in the processing of ultra-thin multi-layer sheet, form sandwich structure after solidification；
Two four-layer circuit board structures are formed outside the mould release membrance of loading plate (8)；
Two four-layer circuit board structures outside the mould release membrance of loading plate (8) are peeled by step S9.
2. the method that multi-layer sheet as claimed in claim 1 makes, it is characterised in that:
In step S1, the temperature of low temperature pressing is at 80 DEG C～140 DEG C.
3. the method that multi-layer sheet as claimed in claim 1 makes, it is characterised in that:
In step S4, the temperature of low temperature pressing is at 80 DEG C～140 DEG C.
4. the method that multi-layer sheet as claimed in claim 1 makes, it is characterised in that:
In step S5, blind hole carries out de-smear process in (9).
5. the method that multi-layer sheet as claimed in claim 1 makes, it is characterised in that:
Step S6 specifically includes:
Step S6.1, removes face copper on the sandwich structure that the ultra-thin multi-layer sheet making blind hole is processed；
Step S6.2, then the sandwich structure Electroless copper of the ultra-thin multi-layer sheet processing after the copper of the face of removal, forms chemical plating copper layer (10)；
Step S6.3, the sandwich structure of the ultra-thin multi-layer sheet processing after copper coating is lithographically formed graphic plating mask (11)；
Step S6.4, utilizes graphic plating mask (11), carries out graphic plating, forms the another side circuit of two double face copper (1,2) on the sandwich structure of ultra-thin multi-layer sheet processing；
Step S6.5, stripping: remove the graphic plating mask (11) formed in step S6.3；
Step S6.6, removes the chemical plating copper layer (10) under graphic plating mask by the method dodging erosion.
6. the sandwich structure of a ultra-thin multi-layer sheet processing, it is characterised in that including:
Loading plate (8), described loading plate (8) includes middle central layer (801), is pressed together on the loading plate Copper Foil (802,803) on middle central layer (801) two sides；It is coated with mould release membrance (804,805) above the loading plate Copper Foil (802,803) on middle central layer (801) two sides；Mould release membrance (804,805) outer side covers has Copper Foil support plate (806,807)；
Two double face copper (1,2) with one side circuit are pressed together on described loading plate (8) upper and lower surface by the second prepreg (6), the 3rd prepreg (7) low temperature, form the interim bonding structure of loading plate；
During low temperature pressing, the second prepreg (6), the 3rd prepreg (7) are uncured, and during pressing, double face copper (1,2) established one side circuit is to inner side.
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