CN114080118B - Manufacturing method of stepped golden finger circuit board and circuit board - Google Patents
Manufacturing method of stepped golden finger circuit board and circuit board Download PDFInfo
- Publication number
- CN114080118B CN114080118B CN202010809399.3A CN202010809399A CN114080118B CN 114080118 B CN114080118 B CN 114080118B CN 202010809399 A CN202010809399 A CN 202010809399A CN 114080118 B CN114080118 B CN 114080118B
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- circuit
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- copper
- circuit board
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 239000000758 substrate Substances 0.000 claims abstract description 119
- 239000010410 layer Substances 0.000 claims abstract description 100
- 239000002184 metal Substances 0.000 claims abstract description 64
- 229910052751 metal Inorganic materials 0.000 claims abstract description 64
- 239000012790 adhesive layer Substances 0.000 claims abstract description 30
- 238000000034 method Methods 0.000 claims abstract description 30
- 239000012792 core layer Substances 0.000 claims abstract description 27
- 238000003825 pressing Methods 0.000 claims abstract description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 26
- 239000010931 gold Substances 0.000 claims description 26
- 229910052737 gold Inorganic materials 0.000 claims description 26
- 229910000679 solder Inorganic materials 0.000 claims description 15
- 238000005530 etching Methods 0.000 claims description 9
- 238000009713 electroplating Methods 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims description 3
- 238000010030 laminating Methods 0.000 abstract 1
- 239000002390 adhesive tape Substances 0.000 description 15
- 238000003486 chemical etching Methods 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 3
- 238000003801 milling Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 239000007888 film coating Substances 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
Abstract
A manufacturing method of a stepped golden finger circuit board and the circuit board are provided, the method comprises the steps of providing a first circuit substrate, comprising a first core layer and a first circuit layer, wherein golden fingers are arranged on the first circuit layer; providing at least one copper-clad substrate, wherein the copper-clad substrate comprises a second core layer and two metal layers, a slot is formed in the copper-clad substrate, the slot does not penetrate through one of the metal layers, and a metal block is arranged in the slot; providing a first adhesive layer provided with a first window; laminating a first circuit substrate, a first adhesive layer and a copper-clad substrate with a metal block in sequence to obtain an intermediate by pressing, so that the golden finger, the first window and the groove correspond to each other; and removing the metal block of the intermediate body and the metal layer which is not penetrated by the slot to form an opening, and communicating the opening with the window to form a groove to obtain the stepped golden finger circuit board. In addition, the invention also provides a stepped golden finger circuit board.
Description
Technical Field
The invention relates to a printed circuit board technology, in particular to a manufacturing method of a stepped golden finger circuit board and the circuit board.
Background
In order to meet the market demands, a circuit board with a groove and a golden finger arranged on the bottom surface of the groove, namely a stepped golden finger circuit board, needs to be manufactured. The traditional manufacturing method of the ladder-type golden finger circuit board comprises the following steps: firstly, a figure of a golden finger is manufactured on the bottom surface of a groove, then a high-temperature resistant adhesive tape is stuck on the surface of the figure of the golden finger, then a plurality of layers of circuit substrates are laminated on the surface of the high-temperature resistant adhesive tape, after the plurality of layers of circuit substrates are laminated, the circuit substrates positioned above the high-temperature resistant adhesive tape are removed through a cutting mode (such as CNC milling cutter cutting), finally, the high-temperature resistant adhesive tape is torn off, and the figure of the golden finger is electroplated, so that the stepped golden finger circuit board is manufactured.
However, this preparation method has the following drawbacks: the process is very complicated, especially the pasting and tearing of the high temperature resistant adhesive tape are all carried out manually, and the production efficiency is low; the high-temperature-resistant adhesive tape is easy to age and sticky under high temperature and high pressure for a long time, is not easy to tear off from the surface of the golden finger, and is easy to pollute the golden finger, so that the quality of the golden finger is poor; aiming at the ultra-thick hard plate, the CNC milling is adopted to remove the circuit substrate above the high-temperature-resistant adhesive tape, so that the time consumption is long and the difficulty is high.
Disclosure of Invention
In view of the above, it is necessary to provide a method for manufacturing a stair-type golden finger circuit board with simple process and convenient molding.
In addition, the invention also provides a circuit board manufactured by adopting the manufacturing method of the stepped golden finger circuit board.
The invention provides a manufacturing method of a stepped golden finger circuit board, which comprises the following steps:
the method comprises the steps of providing a first circuit substrate, wherein the first circuit substrate comprises a first core layer and a first circuit layer positioned on the first core layer, and a golden finger is arranged on the first circuit layer.
Providing at least one copper-clad substrate, wherein the copper-clad substrate comprises a second core layer and metal layers positioned on two opposite surfaces of the second core layer, a slot is arranged in the copper-clad substrate, the slot does not penetrate through one of the metal layers, and a metal block is arranged in the slot.
Providing a first adhesive layer, wherein the first adhesive layer is provided with a first window.
And sequentially stacking the first circuit substrate, the first adhesive layer and the copper-clad substrate with the metal block, so that the golden finger, the first window and the slot correspond to each other, and then pressing to obtain an intermediate.
And removing the metal block of the intermediate body and the metal layer which is not penetrated by the slot to form an opening, wherein the opening is communicated with the first opening window to form a groove, so that the stepped golden finger circuit board is obtained.
In this embodiment, an etching process is used to remove the metal block and the metal layer that is not penetrated by the slot to form an opening.
In this embodiment, the method for manufacturing the stair-step golden finger circuit board further includes:
and etching the metal layer of the copper-clad substrate far away from the first circuit substrate to form a second circuit layer.
In this embodiment, the first circuit substrate further includes a solder mask layer, and the solder mask layer covers an area of the first circuit layer except for the golden finger.
In this embodiment, the metal block is formed in the slot by electroplating.
In this embodiment, the intermediate includes a plurality of copper-clad substrates, and two adjacent copper-clad substrates are connected by a second adhesive layer.
The invention also provides a stepped golden finger circuit board, which comprises a first circuit substrate and at least one second circuit substrate which is laminated on the surface of the first circuit substrate, wherein the first circuit substrate is connected with the second circuit substrate through a first adhesive layer, a first circuit layer is formed on one surface of the first circuit substrate, which is close to the second circuit substrate, a golden finger is formed on the first circuit layer, each second circuit substrate is provided with an opening corresponding to the golden finger, the first adhesive layer is provided with a first opening corresponding to the opening, the opening is communicated with the first opening to form a groove, and the golden finger is exposed from the groove.
In this embodiment, the second circuit substrate includes a second circuit layer, and the second circuit layer is far away from the first circuit substrate.
In this embodiment, a solder mask layer is formed on the first circuit layer except for the gold finger.
In this embodiment, a plurality of second circuit substrates are disposed on one side of the first circuit substrate, and two adjacent second circuit substrates are connected by a second adhesive layer.
Compared with the prior art, the manufacturing method of the stepped golden finger circuit board provided by the invention has the advantages that the process is simple, the multilayer board is convenient to form, the stepped golden finger circuit board is suitable for manufacturing the ultra-thick hard board, the golden finger is not required to be protected by the adhesive tape, the procedures of sticking the adhesive tape and tearing the adhesive tape are avoided, and meanwhile, the influence of the adhesive tape on the appearance and the performance of the golden finger is avoided; filling up the grooves through a metal coating on the second copper-clad substrate, removing the metal coating through a chemical etching process, windowing to expose the golden fingers, and forming grooves in a chemical etching mode instead of a laser or a forming groove-fishing mode, so that a large number of CNC machine tables are avoided, the forming process is simplified, and the forming difficulty and the forming cost are reduced; through the metal plating piece in the slot, when avoiding multilayer second copper-clad substrate to press, second sandwich layer and second adhesive layer melt inflow in the slot under high temperature, influence golden finger's performance and outward appearance.
Drawings
Fig. 1 to 12 are flowcharts of a method for manufacturing a stair-step gold finger circuit board according to an embodiment of the invention.
Fig. 13 is a schematic structural diagram of a second copper-clad substrate with grooves and a second circuit layer formed simultaneously according to an embodiment of the present invention.
Fig. 14 is a schematic structural diagram of a stair-step golden finger circuit board according to another embodiment of the present invention.
Description of the main reference signs
Stepped golden finger circuit board 100
First circuit board 10
First copper-clad substrate 1
First core layer 11
First metal layer 12
Through hole 13
First circuit layer 14
Golden finger 15
Solder mask layer 16
Second circuit board 20
Second copper-clad substrate 2
Second core layer 21
Second metal layer 22
Slotting 23
Metal block 24
Dry film 25
Second circuit layer 26
Opening 27
First adhesive layer 30
First fenestration 31
Groove 40
Second adhesive layer 50
Second fenestration 51
The invention will be further described in the following detailed description in conjunction with the above-described figures.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
Referring to fig. 1 to 12, a method for manufacturing a stair-step gold finger circuit board 100 according to an embodiment of the invention includes the following steps:
s1, referring to FIG. 1, a first copper-clad substrate 1 is provided, wherein the first copper-clad substrate 1 includes a first core layer 11 and first metal layers 12 respectively disposed on two surfaces of the first core layer 11.
The first copper-clad substrate 1 may be a double-sided copper-clad substrate, or may be a multi-layer copper-clad substrate, and may be designed according to different requirements.
In this embodiment, the first copper-clad substrate 1 is a double-sided copper-clad substrate, the first core layer 11 is made of polyimide, and the first metal layer 12 is a copper foil layer.
S2, referring to FIG. 2, a via hole 13 is formed in the first copper-clad substrate 1, and then a conductive material (not shown) may be formed in the via hole 13 to electrically connect different circuit layers.
S3, referring to FIG. 3, etching at least one of the first metal layers 12 to form a first circuit layer 14.
In this embodiment, the first circuit layer 14 is manufactured by a subtractive process. Specifically, the first circuit layer 14 may be obtained by exposing and developing the first metal layer 12.
In this embodiment, one of the first metal layers 12 is etched to form the first wiring layer 14.
S3, referring to FIG. 4, a gold finger 15 is formed on the first circuit layer 14.
Etching the region of the first circuit layer 14 where the gold finger 15 is required to be designed according to the design requirement to obtain a finger position, and electroplating gold on the finger position to form the gold finger 15.
S4, referring to fig. 5, a solder mask 16 is formed on the first circuit layer 14 except for the gold finger 15, that is, the solder mask 16 is used to expose the gold finger 15, so as to obtain the first circuit substrate 10.
In another embodiment, a solder resist process may be performed before step S3 according to actual needs, that is, after the first circuit layer 14 is formed, a solder resist layer 16 is formed on the first circuit layer 14, and the solder resist layer 16 exposes the position where the gold finger 15 needs to be formed, and then the gold finger 15 is formed.
S5, referring to FIG. 6, at least one second copper-clad substrate 2 is provided, wherein the second copper-clad substrate 2 includes a second core layer 21 and second metal layers 22 respectively disposed on two surfaces of the second core layer 21.
The second copper-clad substrate 2 can be a double-sided copper-clad plate or a multilayer copper-clad plate and can be designed according to different requirements.
In this embodiment, the second copper-clad substrate 2 is a double-sided copper-clad plate, the material of the second core layer 21 is polyimide, and the second metal layer 22 is a copper foil layer.
S6, referring to FIG. 7, a slot 23 is formed in the second copper-clad substrate 2.
In the present embodiment, the grooves 23 are formed in the second copper-clad substrate 2 by chemical etching or laser cutting, but other grooves may be used. Taking a double-sided copper-clad plate as an example, the slot 23 penetrates through one of the second metal layers 22 and the second core layer 21, and penetrates through part of the other second metal layer 22, that is, the slot 23 does not completely penetrate through the second copper-clad substrate 2.
S7, referring to FIGS. 8 to 10, a metal block 24 is formed in the slot 23.
In this embodiment, the thickness of the metal block 24 may be greater than the depth of the slot 23, and of course, may be less than or equal to the depth of the slot 23, which is specifically selected according to practical requirements.
In one embodiment, the method for forming the slot 23 is: as shown in fig. 8, a dry film 25 is first covered on the two second metal layers 22 of the second copper-clad substrate 2, as shown in fig. 9, then the metal block 24 is formed in the slot 23 by electroplating, so that the metal block 24 is flush with the surface of the dry film 25, and finally the dry film 25 is removed.
In this embodiment, the metal block 24 is a copper-plated block.
S8, referring to FIG. 11, a first adhesive layer 30 is provided, at least one of the second copper-clad substrate 2, the first adhesive layer 30 and the first circuit substrate 10 with the metal block 24 formed thereon are sequentially stacked, such that the gold finger 15 faces the slot 23 and corresponds to the slot 23, and then pressed to obtain an intermediate, and a first opening 31 is formed on the first adhesive layer 30 corresponding to the slot 23.
In this embodiment, the first adhesive layer 30 is a prepreg (perperg PP), and the prepreg of the present application can be a common prepreg without special material selection, thereby reducing the usage requirement for the prepreg.
In this embodiment, the intermediate body comprises a second copper-clad substrate 2. Of course, in other embodiments, a plurality of second copper-clad substrates 2 may be stacked and bonded to obtain the intermediate.
S9, referring to FIG. 12, the metal block 24 of the intermediate and the second metal layer 22 corresponding to the metal block 24 are removed to form an opening 27, the opening 27 is communicated with the first opening 31 to form a groove 40, and the gold finger is exposed from the groove 40, so as to obtain the step-type gold finger circuit board 100.
In this embodiment, the metal block 24 and the second metal layer 22 located below the metal block may be removed simultaneously by an etching process, so that the slot 23 is communicated with the first window 31 to form the groove 40, without using a CNC machine, which simplifies the process and reduces the operation difficulty and cost. In this embodiment, the etching process is chemical etching, and the specific process includes the steps of dry film coating, exposure, development, etching, dry film removal, and the like.
In this embodiment, it can be understood that by adding the metal block 24, the slot 23 is fully plated at the slot 23 by electroplating, so that on one hand, the strength of the second copper-clad substrate 2 is improved, and the second copper-clad substrate 2 can bear relatively high pressure when the second copper-clad substrate 2 is pressed against the first circuit substrate 10 in the later stage, and meanwhile, the slot 23 is fully plated, so that the whole second copper-clad substrate 2 is supported, and the later stage forming operation is facilitated. On the other hand, when the intermediate includes a plurality of the second copper-clad substrates 2, referring to fig. 14, it is possible to avoid the second core layer 21, the first adhesive layer 30, and the second adhesive layer 50 of the second copper-clad substrates 2 from being melt overflowed onto the first wiring layer 14 or the solder resist layer 16 at high temperature.
In step S10, referring to fig. 12, the second metal layer 22 of the second copper-clad substrate 2 is etched away from the first circuit substrate 10 to form a second circuit layer 26, thereby forming a second circuit substrate 20 on the first circuit substrate 10. At this time, the stair-step golden finger circuit board 100 is obtained.
In another embodiment, as shown in fig. 13, the second circuit layer 26 may be formed before the grooves 23 are formed in step S6, or may be formed while the metal block 24 is removed in step S9.
Referring to fig. 12, the embodiment of the invention further provides a stair-step golden finger circuit board 100, which includes a first circuit substrate 10 and at least one second circuit substrate 20 stacked on the surface of the first circuit substrate 10, wherein the first circuit substrate 10 and the second circuit substrate 20 are pressed together by a first adhesive layer 30. A first circuit layer 14 is formed on a surface of the first circuit substrate 10, which is close to the second circuit substrate 20, a gold finger 15 is formed on the first circuit layer 14, an opening 27 is formed on each second circuit substrate 20 corresponding to the gold finger 15, a first window 31 is formed on the first adhesive layer 30 corresponding to the opening 27, the opening 27 is communicated with the first window 31 to form a groove 40, and the gold finger 15 is exposed from the groove 40.
The first circuit substrate 10 further includes a first core layer 11 and a first metal layer 12 disposed on a side of the first core layer 11 away from the second circuit substrate 20, and the first circuit layer 14 is disposed on a side of the first core layer 11 close to the second circuit substrate 20.
In this embodiment, the first core layer 11 is made of polyimide, and the first metal layer 12 is a copper layer.
In this embodiment, the first copper-clad substrate 1 further includes a solder mask layer 16, where the solder mask layer 16 is disposed to cover the first circuit layer 14, and exposes a region of the first circuit layer 14 where the gold finger 15 is formed.
The second circuit substrate 20 further includes a second core layer 21 and a second metal layer 22 disposed on a side of the second core layer 21 adjacent to the first circuit substrate 10.
In this embodiment, the second core layer 21 is made of polyimide, and the second metal layer 22 is a copper layer.
Referring to fig. 14, in another embodiment, when a plurality of layers of the second circuit substrates 20 are stacked on the first circuit layer 14 on the same side of the first circuit substrate 10, two adjacent second circuit substrates 20 are bonded together by another second adhesive layer 50, and accordingly, the openings 27 are formed on each second circuit substrate 20 corresponding to the gold fingers 15, the second openings 51 are formed on each second adhesive layer 50 corresponding to the gold fingers 15, the plurality of openings 27, the plurality of second openings 51 and the first openings 31 together form the grooves 40, and the gold fingers 15 on the first circuit substrate 10 are exposed from the grooves 40.
Compared with the prior art, the manufacturing method of the stepped golden finger circuit board provided by the invention has the advantages that the process is simple, the multilayer board is convenient to form, the stepped golden finger circuit board is suitable for manufacturing the ultra-thick hard board, the golden finger is not required to be protected by the adhesive tape, the procedures of sticking the adhesive tape and tearing the adhesive tape are avoided, and meanwhile, the influence of the adhesive tape on the appearance and the performance of the golden finger is avoided; the grooves are filled and leveled on the second copper-clad substrate through the metal plating layer, then the metal plating layer is removed through a chemical etching process, the gold finger is exposed through windowing, and the groove is formed in a mode of cutting by using a chemical etching mode instead of a CNC milling cutter, so that the forming process is simplified, and the forming difficulty and the forming cost are reduced; through the metal plating piece in the slot, when avoiding multilayer second copper-clad substrate to press, second sandwich layer and adhesive layer melt inflow in the slot influence golden finger's performance and outward appearance.
In addition, various other corresponding changes and modifications will be apparent to those skilled in the art from the technical idea of the present invention, and all such changes and modifications are intended to be included in the scope of the present invention.
Claims (10)
1. The manufacturing method of the stepped golden finger circuit board is characterized by comprising the following steps of:
providing a first circuit substrate, wherein the first circuit substrate comprises a first core layer and a first circuit layer positioned on the first core layer, and a golden finger is arranged on the first circuit layer;
providing at least one copper-clad substrate, wherein the copper-clad substrate comprises a second core layer and metal layers positioned on two opposite surfaces of the second core layer, a slot is arranged in the copper-clad substrate, the slot does not penetrate through one of the metal layers, and a metal block is arranged in the slot;
providing a first adhesive layer, wherein the first adhesive layer is provided with a first window;
sequentially stacking the first circuit substrate, the first adhesive layer and the copper-clad substrate with the metal block, so that the golden finger, the first window and the slot correspond to each other, and then pressing to obtain an intermediate;
and removing the metal block of the intermediate body and the metal layer which is not penetrated by the slot to form an opening, wherein the opening is communicated with the first opening window to form a groove, so that the stepped golden finger circuit board is obtained.
2. The method of claim 1, wherein the metal block and the metal layer not penetrated by the slot are removed by etching process to form an opening.
3. The method for manufacturing a stair-step gold finger circuit board according to claim 1, further comprising:
and etching the metal layer of the copper-clad substrate far away from the first circuit substrate to form a second circuit layer.
4. The method of claim 1, wherein the first circuit substrate further comprises a solder mask layer, and the solder mask layer covers an area of the first circuit layer except the gold finger.
5. The method of claim 1, wherein the metal block is formed in the slot by electroplating.
6. The method of claim 1, wherein the intermediate comprises a plurality of copper-clad substrates, and two adjacent copper-clad substrates are connected by a second adhesive layer.
7. The utility model provides a cascaded golden finger circuit board which characterized in that, include a first circuit substrate and range upon range of set up in at least one second circuit substrate of first circuit substrate surface, first circuit substrate with connect through first adhesive layer between the second circuit substrate, first circuit substrate is close to a surface of second circuit substrate is formed with first circuit layer, be formed with the golden finger on the first circuit layer, every second circuit substrate corresponds the golden finger is equipped with an opening, first adhesive layer corresponds the opening is equipped with a first window, the opening with first window intercommunication forms a recess, first circuit substrate is close to the surface of second circuit substrate constitutes the bottom surface of recess, the golden finger is located on the bottom surface and by the recess exposes, run through first circuit substrate is provided with the through-hole, be equipped with conductive material in the through-hole, conductive material is used for electrically connecting first circuit layer and other circuit layers.
8. The stair nosing circuit board as claimed in claim 7, wherein the second circuit board includes a second wiring layer, the second wiring layer being remote from the first circuit board.
9. The stair-step gold finger circuit board according to claim 7, wherein a solder resist layer is formed on the first circuit layer except for the gold finger.
10. The stair-step type golden finger circuit board according to claim 7, wherein a plurality of second circuit substrates are arranged on one side of the first circuit substrate, and two adjacent second circuit substrates are connected through a second adhesive layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010809399.3A CN114080118B (en) | 2020-08-12 | 2020-08-12 | Manufacturing method of stepped golden finger circuit board and circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010809399.3A CN114080118B (en) | 2020-08-12 | 2020-08-12 | Manufacturing method of stepped golden finger circuit board and circuit board |
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| Publication Number | Publication Date |
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| CN114080118A CN114080118A (en) | 2022-02-22 |
| CN114080118B true CN114080118B (en) | 2024-03-12 |
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| CN202010809399.3A Active CN114080118B (en) | 2020-08-12 | 2020-08-12 | Manufacturing method of stepped golden finger circuit board and circuit board |
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| CN107770952A (en) * | 2016-08-16 | 2018-03-06 | 新华三技术有限公司 | PCB preparation method and PCB construction |
| JP2018117082A (en) * | 2017-01-20 | 2018-07-26 | 京セラ株式会社 | Wiring board and manufacturing method thereof |
| CN108323039A (en) * | 2018-01-26 | 2018-07-24 | 景旺电子科技(龙川)有限公司 | A kind of multi-layer flexible circuit board manufacture craft that internal layer pad is exposed |
| CN109195361A (en) * | 2018-10-23 | 2019-01-11 | 湖北金禄科技有限公司 | The processing method and golden finger circuit board of golden finger |
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