CN216775119U

CN216775119U - Pcb stiffening plate

Info

Publication number: CN216775119U
Application number: CN202220434420.0U
Authority: CN
Inventors: 吴炜; 吴辉; 叶琪文; 劳飞霖; 夏润鑫; 廉泽阳
Original assignee: Canyon Circuit Technology Huizhou Co ltd
Current assignee: Canyon Circuit Technology Huizhou Co ltd
Priority date: 2022-03-02
Filing date: 2022-03-02
Publication date: 2022-06-17
Anticipated expiration: 2032-03-02

Abstract

The utility model provides a PCB reinforcing plate which mainly comprises an L1/2 layer, an L3/4 layer and a PP layer, wherein the L1/2 layer is a PCB plate with a circuit, a PTH hole and solder mask, the L3/4 layer is a PCB reinforcing position and is a copper-free optical plate and is used as a reinforcing layer, the PP layer is used for bonding the L1/2 layer and the L3/4 layer between the L1/2 layer and the L3/4 layer, the PTH hole metallization is used for completing the electrical performance conduction among the layers, and the L3/4 layer is used for completely etching copper foils on two sides of a copper-clad plate during etching, and a core plate is left to be used as the reinforcing plate. The utility model provides a PCB reinforcing plate which is reliable in production, and solves the problem that the electric performance of the PCB reinforcing plate is affected by PP cull holes.

Description

Pcb stiffening plate

Technical Field

The utility model relates to the technical field of pcb reinforcing plates, in particular to a pcb reinforcing plate.

Background

The pcb stiffening plate is also called reinforcing plate, and its main role is the whole flexibility nature of strengthening the circuit board, improves the intensity at plug-in components position, makes things convenient for whole equipment when strengthening the product reliability, and the stiffening plate is of a great variety, and at present, the hole electrical properties that pp cull hand-hole leads to in the pcb stiffening plate production process is failed and is scrapped.

SUMMERY OF THE UTILITY MODEL

The utility model provides a utility model aiming at providing a pcb stiffening plate to solve the above problems.

In order to achieve the purpose, the utility model is realized by the following technical scheme: a PCB reinforcing plate mainly comprises an L1/2 layer, an L3/4 layer and a PP layer, wherein the L1/2 layer is a PCB plate with a circuit, a PTH hole and solder mask, the L3/4 layer is a PCB reinforcing position and is a copper-free optical plate and is used as a reinforcing layer, and the PP layer is used for bonding the L1/2 layer and the L3/4 layer between the L1/2 layer and the L3/4 layer.

Preferably, the PTH via metallization completes electrical performance continuity between layers.

Preferably, the L3/4 layer completely etches the copper foils on two sides of the copper-clad plate during etching, and the core plate is left as a reinforcing plate.

The utility model provides a pcb stiffening plate. The method has the following beneficial effects:

the utility model provides a PCB reinforcing plate which is reliable in production, good in reinforcing effect and complete in production process, and solves the problem that the electric performance of the PCB reinforcing plate is affected by PP cull holes.

Drawings

FIG. 1 is a schematic view of a pcb stiffener structure according to the present invention.

FIG. 2 is a table showing parameters of an oil press for manufacturing a pcb stiffener according to the present invention.

In the figure: 1. l1/2 layer; 2. l3/4 layer; 3. a PP layer; 4. a PTH hole; 5. and (4) solder mask.

Detailed Description

The utility model is further described with reference to the following drawings and detailed description:

in the description of the present invention, it should be noted that the terms "top", "bottom", "one side", "the other side", "front", "back", "middle part", "inside", "top", "bottom", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, as they may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

As shown in fig. 1-2, a PCB stiffener mainly comprises an L1/2 layer 1, an L3/4 layer 2 and a PP layer 3, wherein the L1/2 layer 1 is a PCB board with a circuit, a PTH hole 4 and a solder mask 5, the L3/4 layer 2 is a PCB stiffener position and is a copper-free optical board and is used as a stiffener, the PP layer 3 bonds the L1/21 layer and the L3/4 layer 2 between the L1/21 layer and the L3/4 layer 2, the PTH hole 4 is metalized to complete electrical performance conduction between the layers, the L3/4 layer 2 completely etches copper foils on both sides during etching, and a core board is left as the stiffener.

The specific production flow is as follows:

(1) process flow of L1/2 layer: cutting material → drilling hole → electroplating → circuit pattern → solder mask, which is a common double-sided PCB flow, drilling PTH hole and rivet hole with 3.2mm of board edge by the drilling process, and compensating for 4mil PTH; the electroplating process realizes the metallization of PTH holes by depositing copper in the holes to complete the electrical performance conduction among all layers, the circuit graph process completes the circuit manufacture of all layers by the processes of film pasting, exposure, development and etching, and the solder mask process protects the circuits and maintains good insulation of the board surface by the screen printing ink of the PCB board.

(2) The L3/4 layer is used as a reinforcing position, and the main process flow is as follows: cutting → etching → drilling the rivet hole at the edge of the plate, wherein the copper foils on the two sides of the copper-clad plate are completely etched during the etching of the L3/4 layer, the core plate is left for reinforcing, and then the rivet hole at the edge of the plate with the thickness of 3.2mm is drilled.

(3) The main process of the PP layer is as follows: collar → drill PP holes, the PP layer of the present invention is a special PP that is phenolic cured low flow and no flow product, which is mainly characterized by the use of special resin technology to optimize resin flow while ensuring adhesion and thermal stability in pcb production, and to provide controlled flow range and stability during lamination. In the PP drilling process, in order to prevent the PP from flowing into the glue hole, the design is made 0.7mm larger than the single side of all PTH through holes of L1/2, and rivet holes with the thickness of 3.2mm of the plate edges are also drilled.

(4) After the whole processes of the L1/2 layer, the L3/4 layer and the PP layer are completed, the laminated layer is sent to a laminating process, the laminating is carried out in a core + core mode, a release film, silica gel and a release film are used for welding prevention of the L2 layer, rivets need to be punched at plate edge rivet holes of the L1/2 layer, the L3/4 layer and the PP layer for riveting in order to prevent deviation of the layers in the laminating process, and laminating manufacturing is carried out by using special parameters of an oil press, wherein the parameters of the oil press are shown in a table in figure 2.

(5) And (4) after the pressing is finished, carrying out normal character, surface treatment, forming and electrical measurement on the pcb.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art will understand that various changes, modifications and substitutions can be made without departing from the spirit and scope of the utility model as defined by the appended claims. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A PCB reinforcing plate is characterized by mainly comprising an L1/2 layer, an L3/4 layer and a PP layer, wherein the L1/2 layer is a PCB plate with a circuit, a PTH hole and solder mask, the L3/4 layer is a PCB reinforcing position and is a copper-free optical plate and is used as a reinforcing layer, and the PP layer is used for bonding the L1/2 layer and the L3/4 layer between the L1/2 layer and the L3/4 layer.

2. A pcb stiffener according to claim 1, wherein: and the PTH hole metallization completes the electrical performance conduction among the layers.

3. A pcb stiffener according to claim 1, wherein: and the L3/4 layer completely etches the copper foils on two sides of the copper-clad plate during etching, and a core plate is left as a reinforcing plate.