CN217770551U - Flexible circuit board and LED lamp area - Google Patents

Abstract

The utility model provides a flexible circuit board and an LED lamp strip, which comprises a first circuit layer; a second circuit layer; the insulating layer is positioned between the first circuit layer and the second circuit layer; the first insulation solder mask layer is arranged on the first circuit layer; the second insulation solder mask layer is arranged on the second circuit layer, and a pad window is arranged on the second insulation solder mask layer; the conducting hole is arranged on the second circuit layer and extends downwards to the first circuit layer, a copper conducting layer is arranged in the conducting hole, and the copper conducting layer conducts the first circuit layer and the second circuit layer; the recess, for one or more, the recess extends to first circuit layer from second circuit layer downwardly, divide into the multistage short circuit layer with second circuit layer, has the recess circuit in the recess. The drilling efficiency is high, the production efficiency of the long flexible circuit board and the LED lamp strip made of the long flexible circuit board is improved, the manufacturing cost of the long flexible circuit board and the LED lamp strip made of the long flexible circuit board is reduced, and the competitiveness of enterprises is improved.

Description

Flexible circuit board and LED lamp area

Technical Field

The utility model relates to a circuit board field, concretely relates to flexible line way board and LED lamp area.

Background

The traditional technology for manufacturing the double-layer flexible circuit board is to drill a through hole on the flexible copper clad laminate by using a drilling machine and then manufacture the flexible circuit board, because the flexible copper clad laminate used by the flexible circuit board is several meters long, the flexible copper clad laminate is a tape reel for convenient transportation, so that a plurality of tape reels cannot be overlapped together for punching, the flexible copper clad laminate on a single tape reel can only be straightened and then single-piece segmented punching is carried out, and the efficiency is very low; if the punching mode is adopted, burrs are formed by punching, so that the product quality of the circuit board is influenced, and the circuit condition of the circuit board in the using process can be possibly caused; the drilling machine is adopted for drilling, although burrs cannot be generated, the drilling machine is limited by the limitation of the drillable length range of the drilling machine, and the existing drilling machine can only drill the flexible copper clad laminate with the length of 1.5 meters at most each time.

However, with the development of science and technology, many products need a double-layer flexible circuit board with a length of more than 1.5 meters, such as a satellite power control board in the aerospace field, a signal control board of a new energy vehicle, an LED strip, and the like. And if bore when exceeding the long flexible copper-clad plate of 1.5 meters, can only the segmentation is bored, the mode of whole book flexible copper-clad plate segmentation drilling makes folding multilayer flexible copper-clad plate bore simultaneously very difficult, even can be with several layers of flexible copper-clad plate stack back drilling, bore when boring one section back again, just need stop the rig, overlap on the rig, and it is fixed with the sticky tape, stromatolite operating speed is slow, efficiency is very low, the utilization ratio of drilling machine is also very low, lead to the productivity of machine not high, therefore, the preparation of long flexible circuit board conducting hole is waited for to solve urgently.

For this reason, it is necessary to optimize and improve the structure and the like of the existing flexible wiring board.

SUMMERY OF THE UTILITY MODEL

The utility model discloses aim at solving one of the technical problem that exists among the prior art at least. Therefore, the utility model provides a flexible line way board and LED lamp area, production efficiency is high, and the defective percentage is low.

An embodiment of the utility model provides a flexible line way board, include:

a first circuit layer;

a second circuit layer;

the insulating layer is positioned between the first circuit layer and the second circuit layer;

the first insulation solder mask layer is arranged on the first circuit layer;

the second insulating solder mask is arranged on the second circuit layer, and a pad window is arranged on the second insulating solder mask;

the conducting hole is arranged on the second circuit layer and extends downwards to the first circuit layer, a copper conducting layer is arranged in the conducting hole, and the first circuit layer and the second circuit layer are conducted through the copper conducting layer;

the groove is one or more, the groove extends downwards from the second circuit layer to the first circuit layer, the second circuit layer is divided into a plurality of sections of short circuit layers, and groove lines are arranged in the groove.

According to the utility model discloses flexible line way board has following beneficial effect at least: through setting up one or many recesses, the recess extends to first circuit layer from second circuit layer downwardly, thereby divide into the multistage short circuit layer with the second circuit layer, make the preparation on second circuit layer can bond on first circuit layer then realize through the etching through many short flexible copper-clad plate pressfittings, and the copper conducting layer that is arranged in the recess has etched for the recess circuit, the quick system hole of many flexible copper-clad plates of single of conducting hole had both been satisfied, the copper conducting layer of having avoided the groove position again brings the short circuit problem between the circuit, very big improvement the production efficiency of long flexible printed circuit board, the cost of manufacture of long flexible printed circuit board has been reduced, the competitiveness of enterprise has been improved.

According to the utility model discloses a some embodiments, short circuit layer is less than or equal to 1.5 meters, first circuit layer is greater than 1.5 meters.

According to the utility model discloses a some embodiments, the both sides of recess are provided with the pad window, have tin or tin alloy on the pad window and will be located the pad window connection of recess both sides to increase the circuit board intensity of groove position.

According to some embodiments of the invention, the second insulating solder mask covers part or all of the via hole.

An embodiment of the utility model provides a still provide a LED lamp area, including any one of the above-mentioned embodiments the flexible line way board, and set up in components and parts on the flexible line way board, components and parts with the flexible line way board electricity is connected.

According to the utility model discloses flexible line way board has following beneficial effect at least: through setting up one or many recesses, the recess extends to first circuit layer from second circuit layer downwardly, thereby divide into multistage short circuit layer with the second circuit layer, make the preparation on second circuit layer can bond on first circuit layer then realize through the etching through many short flexible copper-clad plate pressfitting, and the copper conducting layer that is arranged in the recess has etched for the recess circuit, the quick system hole of many flexible copper-clad plate of single of via hole had both been satisfied, the copper conducting layer of having avoided the groove position again brings the short circuit problem between the circuit, very big improvement the production efficiency of long flexible line board, the cost of manufacture in the LED lamp area of being made by long flexible line board has been reduced, the competitiveness of enterprise has been improved.

According to the utility model discloses a some embodiments, be provided with components and parts on the flexible line way board of groove position, the leg of components and parts spanes the recess setting to increase groove position's lamp area intensity.

Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

Drawings

The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

fig. 1 is a schematic plan view of a single-layer bare circuit board according to an embodiment of the present invention;

FIG. 2 is a schematic view of the three-dimensional structure of the short flexible copper-clad plate after a plurality of holes are drilled in a stacked manner in the embodiment of the present invention;

FIG. 3 is a schematic view of the plane structure of the short flexible copper clad laminate after drilling in the embodiment of the present invention;

FIG. 4 is a schematic view of a planar structure of a single-layer bare circuit board bonded with a plurality of short flexible copper-clad plates by pressing in the embodiment of the present invention;

FIG. 5 is a schematic cross-sectional view of FIG. 4;

FIG. 6 is an enlarged view of a portion of FIG. 5;

FIG. 7 is a partial perspective view of FIG. 4;

FIG. 7-1 is a partial enlarged view of B in FIG. 7;

FIG. 8 is a schematic cross-sectional view of the copper conductive layer of FIG. 6 after electroplating;

FIG. 9 is a schematic perspective view of the structure of FIG. 7 after electroplating of the copper conductive layer;

FIG. 9-1 is an enlarged view of a portion C of FIG. 9;

FIG. 10 is a schematic plan view of the structure of FIG. 4 after etching;

FIG. 11 is a schematic perspective view (partially in cross-section) of FIG. 9 after etching;

FIG. 12 is a schematic cross-sectional view of FIG. 8 after etching;

fig. 13 is a schematic plan view of the structure of fig. 10 after a second insulating solder resist layer is applied;

FIG. 14 is a schematic cross-sectional view of FIG. 12 after a second insulating solder mask layer is applied;

fig. 15 is a schematic plan view of the LED strip of fig. 13 after components are attached;

fig. 16 is a schematic plan view of the LED strip of fig. 15 after being singulated;

FIG. 17 is a schematic view showing the cross-sectional structure of the embodiment of the present invention, wherein a plurality of short flexible copper clad laminates are bonded on the copper foil by pressing;

FIG. 18 is an enlarged view of a portion D of FIG. 17;

FIG. 19 is a schematic view of a three-dimensional structure of a copper foil laminated and bonded with a plurality of short flexible copper clad laminates in the embodiment of the present invention;

FIG. 19-1 is an enlarged view of a portion E of FIG. 19;

FIG. 20 is a schematic cross-sectional view of the copper conductive layer of FIG. 18 after electroplating;

FIG. 21 is a schematic perspective view of FIG. 19 after electroplating of the copper conductive layer;

FIG. 21-1 is an enlarged view of a portion F of FIG. 21;

FIG. 22 is a schematic plan view of the structure of FIG. 21 after etching;

FIG. 23 is a schematic cross-sectional view of FIG. 21 after etching;

FIG. 24 is a schematic perspective view (partially in cross section) of FIG. 21 after etching;

fig. 25 is a schematic plan view of the structure of fig. 22 after the first and second insulating solder resist layers are attached;

fig. 26 is a schematic cross-sectional view of fig. 23 after attaching a first insulating solder resist layer and a second insulating solder resist layer;

fig. 26-1 is a partial enlarged view of G in fig. 26.

Reference numerals:

the circuit board comprises a single-layer bare circuit board 1, a first circuit layer 11 and a first insulation solder mask layer 12;

the short flexible copper clad laminate comprises a short flexible copper clad laminate 2, a via hole 21, a groove 22, an insulating layer 23, a second circuit layer 24 and an adhesive 25;

a copper conductive layer 3, a groove line 31;

a second insulating solder resist layer 4, a pad window 41;

a copper foil 5;

a component 6;

an etching bath 7;

and (3) tin 8.

Detailed Description

Reference will now be made in detail to the embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary only for explaining the present invention, and should not be construed as limiting the present invention.

In the description of the present invention, it should be understood that the orientation or positional relationship referred to, for example, the orientation or positional relationship indicated above, below, front, back, left, right, inside, outside, etc., is the orientation or positional relationship shown on the drawings, and is only for convenience of description and simplification of the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore, should not be construed as limiting the present invention.

In the description of the present invention, a plurality of means are one or more, a plurality of means are two or more, and the terms greater than, less than, exceeding, etc. are understood as not including the number, and the terms greater than, less than, within, etc. are understood as including the number. If there is a description of first and second for the purpose of distinguishing technical features only, this is not to be understood as indicating or implying a relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of technical features indicated.

In the description of the present invention, unless there is an explicit limitation, the words such as setting, installation, connection, assembly, cooperation, etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the meaning of the above words in the present invention by combining the specific contents of the technical solution.

The following provides many different embodiments, or examples, for implementing different methods, structures, and/or the invention.

The flexible copper clad plate that uses on the traditional double-deck flexible line way board is the flexible copper clad plate of continuity (length generally exceeds 1.5 meters), to being greater than the flexible copper clad plate of 1.5 meters, punch on the flexible copper clad plate and form when being used for the conducting hole that switches on first circuit layer and second circuit layer, generally go on after flare-outing flexible copper clad plate reel, the limit is flare-outed and is punched promptly, only can go on to one section flexible copper clad plate at every turn, beat one section and take off one section again, it is extravagant mutually to punch to extremely expensive drilling machine for circuit board drilling machine.

Based on this, the embodiment of the first aspect of the present invention provides a method for manufacturing a flexible printed circuit, including:

a. preparing a single-layer bare circuit board 1 and a single-layer copper flexible copper clad laminate, wherein the single-layer bare circuit board 1 comprises a first circuit layer 11 and a first insulation solder mask layer 12 as shown in figure 1;

b. the adhesive 25 is coated on the back surface of the flexible copper clad laminate, and the adhesive can be coated on the back surface of the flexible copper clad laminate in a roll-to-roll mode;

c. cutting the flexible copper clad laminate coated with the adhesive 25 into 20 short flexible copper clad laminates 2, wherein the short refers to that the length of the single-layer bare circuit board 1 is longer than that of the short flexible copper clad laminate 2 relative to the length of the single-layer bare circuit board 1;

d. after the 20 short flexible copper clad laminates 2 are stacked together, a drilling machine is used for drilling holes to form the via holes 21, as shown in fig. 2 and fig. 3, when the drilling machine drills holes, the via holes 21 can be formed on the 20 short flexible copper clad laminates 2 at the same time by one drilling, and the punching efficiency is obviously improved compared with the traditional single punching;

e. referring to fig. 4, the drilled short flexible copper clad laminate 2 is arranged on the single-layer bare circuit board 1, two adjacent short flexible copper clad laminates 2 are spaced apart from each other to form a groove 22, the size of the groove 22 is 0-10mm, so the groove 22 is not shown in fig. 4, and the groove 22 can be referred to fig. 5 to 7; then, a short flexible copper clad laminate 2 is bonded on the single-layer bare circuit board 1 in a pressing mode through a pressing machine, one part of the line of the first circuit layer 11 is covered by the short flexible copper clad laminate 2 in a pressing mode, the other part of the line of the first circuit layer 11 is exposed at the positions of the via hole 21 and the groove 22, namely the first circuit layer 11 at the positions of the via hole 21 and the groove 22 is not covered by the short flexible copper clad laminate 2, and after the pressing, the insulating layer 23 on the short flexible copper clad laminate 2 insulates and separates the short flexible copper clad laminate 2 from the covered part of the first circuit layer 11;

f. referring to fig. 8 to 9-1, a copper conductive layer 3 is formed on the short flexible copper clad laminate 2, the via hole 21 and the groove 22, and the copper conductive layer 3 is formed by electroplating. Before the copper conducting layer 3 is manufactured, the side wall of the groove 22 is free of metal copper, a plurality of lines of the first line layer 11 at the bottom of the groove 22 are exposed, when the copper conducting layer 3 is manufactured, firstly, a conducting object is manufactured on a conducting resin production line, so that a layer of conducting object is attached to the hole wall of the conducting hole 21, the side wall of the groove 22 and the plurality of lines at the bottom of the groove 22, then, copper is electroplated on a whole roll electroplating production line, so that the hole wall of the conducting hole 21, the side wall of the groove 22, the lines at the bottom of the groove 22 and the copper surface of the short flexible copper clad laminate 2 are all plated with a layer of copper conducting layer 3 which is connected into a whole, the copper conducting layer 3 positioned on the conducting hole 21 conducts the short flexible copper clad laminate 2 and the single-layer bare circuit board 1, the copper conducting layer 3 positioned on the surface of the short flexible copper clad laminate 2 and the copper surface of the short flexible copper clad laminate 2 are fused into a whole, and the thickness of the copper surface of the short flexible copper clad laminate 2 is thickened;

g. referring to fig. 10 to 12, the copper layer and the copper conductive layer 3 of the short flexible copper clad laminate 2 are etched by an etching method, in this embodiment, the following method is adopted for etching: coating photosensitive circuit ink on the copper surface by using a whole roll continuous coating machine, covering a layer of ink on the surfaces of the short flexible copper-clad plate 2, the via hole 21 and the copper conducting layer 3 of the groove 22 after coating, and baking and removing a solvent in the ink by using a dryer at the temperature of 80-120 ℃; then selectively exposing on a continuous whole-roll exposure machine (the prior art) to expose the printing ink at the position where the circuit metal needs to be reserved, and not exposing the position where the copper needs to be etched and removed; on a developing production line, carrying out developing treatment by using a 2% sodium carbonate aqueous solution, and removing unexposed ink to expose copper; on the etching production line, the copper is removed by etching at the position where the copper is exposed, the etched part forms an etching groove 7, after the etching is completed, the copper layer of the short flexible copper clad laminate 2 and the copper conducting layer 3 on the surface of the short flexible copper clad laminate 2 form a second circuit layer 24, the copper conducting layer 3 on the side wall of the groove 22 forms a groove circuit 31, it can be understood that the groove circuit 31 refers to a circuit on the side wall of the groove 22, so as to be different from the first circuit layer 11 on the lower surface of the circuit board and the second circuit layer 24 on the upper surface of the circuit board, and the groove circuit 31 can be conducted with the first circuit layer 11 and the second circuit layer 24. The copper conductive layer 3 formed after the electroplating of the groove 22 covers the bottom of the groove 22, so that the first circuit layer 11 is communicated, and a plurality of circuits on the first circuit layer 11 are short-circuited, therefore, during etching, the copper conductive layer 3 at the bottom of the groove 22 is etched to restore the circuits on the first circuit layer 11, and the copper conductive layer on the side wall of the groove 22 forms a groove circuit 31, so that the problem of short circuit among the plurality of circuits on the first circuit layer 11 is solved ingeniously;

h. referring to fig. 13 to 14, a second insulating solder mask layer 4 with a pad window 41 is fabricated on the second circuit layer 24, the fabrication of the second insulating solder mask layer 4 is prior art, and details are not repeated herein, and the second insulating solder mask layer 4 covers part or all of the via holes 21 to improve the aesthetic property.

Through cutting the flexible copper-clad plate that has glued adhesive 25 into many short flexible copper-clad plate 2, realized that many short flexible copper-clad plate 2 can superpose and utilize drilling machine drilling preparation conducting hole 21 after reaching 20, drilling efficiency is high, 2 pressfitting of the short flexible copper-clad plate after the drilling bonds on individual layer naked circuit board 1, copper conducting layer 3 in the recess 22 between the adjacent short flexible copper-clad plate 2 utilizes the etching to form recess circuit 31, the quick system hole of many flexible copper-clad plate of single that had both satisfied conducting hole 21, the copper conducting layer 3 of having avoided the recess 22 position again brings the short circuit problem between the circuit, very big improvement long flexible line board's production efficiency, the cost of manufacture of long flexible line board has been reduced, the competitiveness of enterprise has been improved.

In some embodiments of the first aspect of the present invention, the length of the single-layer bare circuit board 1 is 10 meters, and the length of the short flexible copper-clad plate 2 is 0.5 meter; in other embodiments, the length of the single-layer bare circuit board 1 is 30 meters, and the length of the short flexible copper-clad plate 2 is 1.5 meters.

The utility model discloses some embodiments of first aspect, consider because the existence of recess 22, lead to the intensity of flexible line way board at the recess 22 position relatively less, for this reason, second insulation solder mask 4 covers recess 22 part or whole to improve the circuit board intensity of recess 22 position, avoid the flexible line way board at the in-process fracture of using.

For solving the problem of traditional double-deck flexible line way board inefficiency of punching, the embodiment of the first aspect of the utility model provides still another flexible line way board's manufacturing method, include:

a. preparing a copper foil 5 and a single-layer copper flexible copper clad laminate;

b. the adhesive 25 is coated on the back surface of the flexible copper clad laminate, and the adhesive 25 can be coated on the back surface of the flexible copper clad laminate in a roll-to-roll mode;

c. cutting the flexible copper clad laminate coated with the adhesive 25 into 30 short flexible copper clad laminates 2, wherein the short flexible copper clad laminate 2 is shorter than the copper foil 5 relative to the length of the copper foil 5;

d. after 30 pieces of the short flexible copper-clad plate 2 are overlapped, drilling holes by using a drilling machine to form a via hole 21;

e. referring to fig. 17 to 19-1, arranging the drilled short flexible copper clad laminate 2 on a copper foil 5, forming a groove 22 at a distance between two adjacent short flexible copper clad laminates 2, wherein the size of the groove 22 is 0-10mm, pressing and bonding the short flexible copper clad laminate 2 on the copper foil 5 by using a pressing machine, pressing and covering one part of the copper foil 5 by the short flexible copper clad laminate 2, and exposing the other part of the copper foil 5 at the position of a via hole 21 and the position of the groove 22, namely the copper foil 5 at the position of the via hole 21 and the position of the groove 22 is not covered by the short flexible copper clad laminate 2, and after pressing, insulating layers 23 on the short flexible copper clad laminate 2 insulate and separate the short flexible copper clad laminate 2 from the copper foil 5 at the covered part;

f. referring to fig. 20 to 21-1, a copper conducting layer 3 is manufactured on a copper foil 5, a short flexible copper clad laminate 2, a via hole 21 and a groove 22, the copper foil 5 at the bottom of the groove 22 is exposed before the copper conducting layer 3 is manufactured, no metal copper is arranged on the side wall of the groove 22, a conducting object is manufactured on a conducting adhesive production line, a layer of conducting object is attached to the hole wall of the via hole 21 and the side wall of the groove 22, then, copper is electroplated on a whole roll electroplating production line, the copper conducting layer 3 in the via hole 21 conducts the short flexible copper clad laminate 2 and the copper surface of the copper foil 5, the side wall of the via hole 21, the side wall of the groove 22 and the copper foil surface at the bottom of the groove 22, the short flexible copper clad laminate 2 and the copper foil 5, the copper conducting layer 3 in the via hole 21 fuses the short flexible copper clad laminate 2 and the copper surface of the copper foil 5 into a whole, the copper conducting layer 3 on the surface of the short flexible copper clad laminate 2 and the copper foil 2 are thickened, the copper surface of the copper foil 3 on the copper foil 5 and the copper surface of the copper foil 5 are fused into a whole, and the copper surface of the copper foil 5 is thickened;

g. referring to fig. 22 to 24, the copper layer, the copper conductive layer 3 and the copper foil 5 of the short flexible copper clad laminate 2 are etched by using an etching method, in this embodiment, photosensitive circuit ink is coated on both sides of the short flexible copper clad laminate 2 by using a roll-to-roll continuous coating machine, after coating, a layer of ink is coated on the short flexible copper clad laminate 2, the copper foil 5, the via hole 21 and the groove 22, and then a dryer is used to bake and remove a solvent in the ink at a temperature of 80 to 120 ℃; on a continuous whole-roll exposure machine, selectively exposing (in the prior art) to ensure that the printing ink at the position where the circuit metal needs to be reserved is exposed, and the position where the copper needs to be etched and removed is not exposed; on a developing production line, carrying out developing treatment by using a 2% sodium carbonate aqueous solution, and removing unexposed ink to expose copper; on an etching production line, the position where copper is exposed is etched to remove the copper, wherein a copper conducting layer 3 at the bottom of a groove 22 and the copper conducting layer 3 on the surface of a copper foil 5 are used as the upper surface and the lower surface of the copper foil 5 and are etched together with the copper foil to form a first circuit layer 11 after etching, a copper layer of a short flexible copper-clad plate 2 and the copper conducting layer 3 on the surface of the short copper-clad plate 2 are etched to form a second circuit layer 24, the copper conducting layer 3 on the side wall of the groove 22 are etched to form a groove circuit 31, and the etched part forms an etching groove 7, so that the problem of short circuit at the groove position between a plurality of circuits on the first circuit layer 11 or/and the second circuit layer 24 is solved skillfully;

h. referring to fig. 25 to 26, a first insulating solder resist layer 12 is fabricated on the first wiring layer 11; manufacturing a second insulating solder mask layer 4 on the second circuit layer 24, wherein a pad window 41 is arranged on the second insulating solder mask layer 4, or the first insulating solder mask layer 12 and the second insulating solder mask layer 4 are both provided with the pad window 41, and the pad window is used for soldering to weld and fix the component 6; the first insulating solder mask layer 12 and the second insulating solder mask layer 4 are manufactured in the prior art, and are not described herein again, and the second insulating solder mask layer 4 covers part or all of the via holes 21 to improve the aesthetic property.

Cut into many short flexible copper clad laminate 2 through the flexible copper clad laminate that will glue adhesive 25, it utilizes drilling machine drilling preparation conducting hole 21 to have realized that many short flexible copper clad laminate 2 can superpose up to 30 after, drilling efficiency is high, 2 pressfitting of short flexible copper clad laminate after the drilling bonds on copper foil 5, copper conducting layer 3 in the recess 22 between the adjacent short flexible copper clad laminate 2 utilizes the etching to form recess circuit 31, the quick system hole of many flexible copper clad laminate 2 of single that had both satisfied conducting hole 21, the copper conducting layer 3 of having avoided the recess 22 position again brings the short circuit problem between the circuit, very big improvement the production efficiency of long flexible circuit board, the cost of manufacture of long flexible circuit board has been reduced, the competitiveness of enterprise has been improved.

In some embodiments of the first aspect of the present invention, the length of the copper foil 5 is 15 meters, and the length of the short flexible copper clad laminate 2 is 0.5 meter; in other embodiments, the length of the copper foil 5 is 45 meters, and the length of the short flexible copper clad laminate 2 is 1.5 meters.

In some embodiments of the first aspect of the present invention, it is considered that the strength of the flexible printed circuit board at the position of the groove 22 is relatively small due to the existence of the groove 22, for this reason, the groove 22 of the second insulation solder mask layer 4 is partially or completely covered, and the first circuit layer 11 just opposite to the groove 22 is partially or completely covered by the first insulation solder mask layer 12, so as to improve the strength of the circuit board at the position of the groove 22.

An embodiment of the second aspect of the present invention provides a method for manufacturing a LED light strip, including any one of the above-mentioned first aspect embodiments, the flexible circuit board is manufactured, and the component 6 is an LED or an LED and a control element, specifically, the component 6 is an LED lamp bead or an LED chip, and one or more of a resistor, a capacitor and an IC, or the component 6 only includes an LED lamp bead or an LED chip.

Through cutting the flexible copper-clad plate that has glued adhesive 25 into many short flexible copper-clad plate 2, realized that many short flexible copper-clad plate 2 can superpose the back and utilize drilling machine drilling preparation conducting hole 21, 2 pressfitting of short flexible copper-clad plate after the drilling bond on individual layer naked circuit board 1 or copper foil 5, copper conducting layer 3 in the recess 22 between the adjacent short flexible copper-clad plate 2 utilizes the etching to form recess circuit 31, the quick system hole of many flexible copper-clad plate 2 of single that had both satisfied conducting hole 21, the copper conducting layer 3 of having avoided the recess 22 position again brings the short circuit problem between the circuit, very big improvement long flexible circuit board's production efficiency, the cost of manufacture in the LED lamp area of being made by long flexible circuit board has been reduced, the competitiveness of enterprise has been improved.

An embodiment of the third aspect of the present invention provides a flexible printed circuit board, which can be manufactured by the method according to any one of the embodiments of the first aspect, including: a first wiring layer 11; a second circuit layer 24; an insulating layer 23 between the first wiring layer 11 and the second wiring layer 24; a first insulating solder resist layer 12 disposed on the first circuit layer 11, where the first solder resist layer 12 may or may not have a pad window as required; a second insulating solder resist layer 4 disposed on the second circuit layer 24, wherein a pad window 41 is disposed on the second insulating solder resist layer 4, and the pad window 41 is used for soldering to solder and fix the component 6; a via hole 21 disposed on the second circuit layer 24 and extending downward to the first circuit layer 11, wherein a copper conductive layer 3 is disposed in the via hole, and the copper conductive layer 3 connects the first circuit layer 11 and the second circuit layer 24; the flexible printed circuit board comprises grooves 22, one or more grooves 22 are formed according to the length requirement of the flexible printed circuit board, the grooves 22 are formed by arranging short flexible copper clad plates 2 at intervals, two adjacent short flexible copper clad plates are not in direct contact to form the grooves 22, the grooves 22 extend downwards from a second circuit layer 24 to a first circuit layer 11, the second circuit layer 24 is divided into a plurality of short circuit layers, the short circuit layers are relatively relative to the first circuit layer 11, the first circuit layer 11 is formed by etching continuous copper foils or formed by a single-layer bare circuit board, the length of each short circuit layer is longer than that of the short flexible copper clad plates 2, the plurality of short flexible copper clad plates 2 are arranged on a copper foil 5 or the single-layer bare circuit board, and it can be understood that the adjacent short circuit layers are only disconnected in physical distance due to the existence of the grooves 22 and are not electrically disconnected, the adjacent short circuit layers are communicated through groove circuits 31, and the groove circuits 31 in the grooves 22 are obtained by etching copper conducting layers 3 arranged on the side walls of the grooves 22; the first insulating solder mask layer 12 and the second insulating solder mask layer 4 are manufactured in the prior art, and are not described herein again, and the second insulating solder mask layer 4 covers part or all of the via holes 21 to improve the aesthetic property.

In some embodiments of the third aspect of the present invention, the short circuit layer has a length of 5 meters, and the first circuit layer 11 has a length of 0.5 meters; in other embodiments, the short wire layer has a length of 10 meters and the first wire layer has a length of 1 meter.

In some embodiments of the third aspect of the present invention, the two sides of the groove 22 are provided with the pad windows 41, and the pad windows 41 have the tin alloy or tin 8 thereon to connect the pad windows located at the two sides of the groove 22, so as to increase the strength of the circuit board at the position of the groove 22, as shown in fig. 15, 16 and 25.

An embodiment of the fourth aspect of the present invention provides an LED light strip, including the flexible circuit board described in any of the embodiments of the third aspect, and a component 6 disposed on the flexible circuit board, where the component 6 is electrically connected to the flexible circuit board, the component 6 is an LED, or an LED and a control element, specifically, the component 6 is an LED lamp bead or an LED chip, and one or more of a resistor, a capacitor, and an IC; or the component 6 only comprises an LED lamp bead or an LED chip.

The utility model discloses in the embodiment of third aspect, be provided with components and parts 6 on the flexible line way board of recess 22 position, the leg of components and parts 6 spanes the recess 22 setting to increase the lamp area intensity of recess 22 position, utilize the hardness of components and parts self to improve the lamp area structural strength of recess 22 position, design benefit.

Through setting up one or many recesses 22, recess 22 extends to from second circuit layer 24 downwardly extending first circuit layer 11, thereby divide into multistage short circuit layer with second circuit layer 24, thereby make the preparation of second circuit layer 24 realize through 2 pressfitting bonds on copper foil or the naked circuit board of individual layer of many short flexible copper-clad plates, and the copper conducting layer 3 that is arranged in recess 22 has formed the recess circuit through the etching, the quick system hole of many flexible copper-clad plates of single of via hole 21 has both been satisfied, the copper conducting layer 3 of having avoided the recess 22 position again brings the short circuit problem between the circuit, very big improvement the production efficiency in long flexible line way and the LED lamp area of making by long flexible line way, the cost of manufacture in flexible line way and LED lamp area has been reduced, the competitiveness of enterprise has been improved.

The embodiments of the present invention have been described in detail with reference to the drawings, but the present invention is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present invention within the knowledge of those skilled in the art.

Claims (6)

1. A flexible wiring board, comprising:

a first circuit layer;

a second circuit layer;

the insulating layer is positioned between the first circuit layer and the second circuit layer;

the first insulation solder mask layer is arranged on the first circuit layer;

the second insulating solder mask is arranged on the second circuit layer, and a pad window is arranged on the second insulating solder mask;

the conducting hole is arranged on the second circuit layer and extends downwards to the first circuit layer, a copper conducting layer is arranged in the conducting hole, and the first circuit layer and the second circuit layer are conducted through the copper conducting layer;

the recess, for one or more, the recess is followed second circuit layer downwardly extending to first circuit layer will second circuit layer divide into the multistage short circuit layer, the recess circuit has in the recess.

2. The flexible wiring board of claim 1, wherein: the short circuit layer is smaller than or equal to 1.5 meters, and the first circuit layer is larger than 1.5 meters.

3. The flexible wiring board of claim 1, wherein: the circuit board is characterized in that pad windows are arranged on two sides of the groove, and tin or tin alloy is arranged on the pad windows to connect the pad windows on the two sides of the groove, so that the strength of the circuit board at the position of the groove is improved.

4. The flexible wiring board of claim 1, wherein: the second insulating solder mask covers part or all of the via holes.

5. A LED lamp area which characterized in that: the flexible circuit board comprises the flexible circuit board as claimed in any one of claims 1 to 4, and a component arranged on the flexible circuit board and electrically connected with the flexible circuit board.

6. A LED strip according to claim 5, wherein: be provided with components and parts on the flexible line way board of recess position, the leg of components and parts spanes the recess setting to increase the lamp area intensity of recess position.

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