CN212211553U - Solder resist is double-layer wire circuit board that printing ink hinders solder resist - Google Patents
Solder resist is double-layer wire circuit board that printing ink hinders solder resist Download PDFInfo
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- CN212211553U CN212211553U CN201921429344.9U CN201921429344U CN212211553U CN 212211553 U CN212211553 U CN 212211553U CN 201921429344 U CN201921429344 U CN 201921429344U CN 212211553 U CN212211553 U CN 212211553U
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Abstract
The utility model relates to a hinder welds double-deck wire circuit board that is resistance-welded of printing ink, specifically speaking, arrange wire parallel arrangement and cover on the substrate of taking the glue, printing hinders and welds printing ink, expose component pad and the metal tie point on the wire during printing, it needs the etching disconnection department to expose on the wire simultaneously, toast the solidification, reprint anti-etching printing ink, printing anti-etching printing ink at pad and metal tie point department on the wire, then bake, the copper clad aluminum wire that the etching exposes makes the disconnection, after the etching, go back printing ink with the alkaline and get rid of anti-etching printing ink, remain and hinder and weld printing ink, make positive single face wire circuit board, make the conducting hole, again cover back parallel wire on another layer of back face membrane of taking the glue, then paste back parallel wire together towards the back counterpoint of single face wire circuit board, back parallel wire exposes from the front in hole position department, toast the, thus, the novel double-layer lead circuit board is manufactured.
Description
Technical Field
The utility model relates to a circuit board field, concretely relates to hinder welds double-deck wire circuit board that is printing ink hinders and welds.
Background
The utility model discloses a series of conductor board patents before people, for example: patent numbers: 201010232487.8, patent name: a single-sided circuit board manufactured by juxtaposing flat wires and a manufacturing method thereof are disclosed in the patent number: 201010232506.7, patent name: the method for manufacturing the single-sided circuit board by adopting the juxtaposed leads has the following patent numbers: 201010232506.7, patent name: the method comprises the following steps of respectively using insulating layers to simultaneously carry out hot pressing on two surfaces of a flat wire to manufacture a single-sided circuit board, wherein the method comprises the following steps: 201010232526.4, patent name: the single-sided circuit board is manufactured by bonding juxtaposed flat leads by using a thermosetting adhesive film, and the patent number is as follows: 201010232547.6, patent name: the method for manufacturing the single-sided circuit board by using the transshipment adhesive film and the juxtaposed flat wires adopts a mode of die cutting or drilling by a drilling machine to break the wires, and has the defects of high die opening cost and inflexible design due to the use of the die, difficulty in changing once the die opening is finished, high cost due to the adoption of a mode of heavy drilling for drilling, insufficient alignment precision and high defective scrap due to easy drilling deviation.
In order to overcome defect more than and not enough, the utility model discloses a with the wire parallel arrangement cover on the substrate of taking the glue, printing hinders solder ink, expose component pad and the metal tie point on the wire, it needs etching disconnection department to expose on the wire simultaneously, the anti etching ink of reprinting is protected and is lived pad and metal tie point, then bake, the wire of the position department that the wire circuit needs the disconnection exposes outside, the mode of taking the etching makes the wire etching disconnection that will expose, form the circuit, design flexibility like this, and is low in cost.
SUMMERY OF THE UTILITY MODEL
The utility model relates to a hinder welds double-deck wire circuit board that is resistance-welded of printing ink, specifically speaking, arrange wire parallel arrangement and cover on the substrate of taking the glue, printing hinders and welds printing ink, expose component pad and the metal tie point on the wire during printing, it needs the etching disconnection department to expose on the wire simultaneously, toast the solidification, reprint anti-etching printing ink, printing anti-etching printing ink at pad and metal tie point department on the wire, then bake, the copper clad aluminum wire that the etching exposes makes the disconnection, after the etching, go back printing ink with the alkaline and get rid of anti-etching printing ink, remain and hinder and weld printing ink, make positive single face wire circuit board, make the conducting hole, again cover back parallel wire on another layer of back face membrane of taking the glue, then paste back parallel wire together towards the back counterpoint of single face wire circuit board, back parallel wire exposes from the front in hole position department, toast the, thus, the novel double-layer lead circuit board is manufactured.
According to the utility model provides a hinder and weld double-deck wire circuit board that ink hinders welds, include: a front single-sided wire circuit board; a via hole disposed on the front single-sided wire circuit board; a back side parallel conductor circuit; a film with adhesive on the back; it is characterized in that the front single-side lead circuit board comprises: the substrate layer with the glue is the substrate layer with the glue of the single-sided conducting wire circuit board and is also the middle insulating layer of the double-layer conducting wire board; a front parallel conductor circuit layer; a front solder resist ink layer; a disconnection port of the conductive line circuit disposed on the front parallel conductive line circuit layer; a bonding pad and a metal connection point on the wire; specifically, a plurality of completely disconnected openings from the middle are formed on all the leads or part of the leads in the front circuit of the lead circuit board, the completely disconnected leads are all copper-clad aluminum leads, the disconnected openings of the copper-clad aluminum leads disconnected from the middle are in a near-sighted C-shaped structure on the section of the leads cut towards the longitudinal direction (the long direction), the middle aluminum forms a recess, a window is arranged on the front solder mask ink layer at the disconnected opening of the middle copper-clad aluminum leads, the disconnected position of the leads is at the edge position of the window of the front solder mask ink, the disconnected surface of the leads and the edge of the window of the solder mask ink are at one section or close to one section, or the disconnected position of the leads is in the solder mask ink window, the leads at the disconnected positions of the leads are exposed from the window, the welding pads are welding elements and are arranged on two leads or are arranged on two sides of one lead disconnected opening, the metal connection points are connection points used for being connected with a power supply circuit or connection points used for being interconnected between circuit boards, the solder mask ink layer is provided with a plurality of windows, wherein one part of the windows are a pad window and a metal connection point window, one part of the windows are windows at the disconnection positions of leads, the via holes arranged on the front single-sided lead circuit board are arranged at the positions where the parallel leads on the back need to be communicated with the front, the holes penetrate through the solder mask layer covering the front, the circuit layer of the parallel leads on the front and the substrate with glue (namely the middle insulating layer) or adhesive tapes are arranged at the local positions on the back of the single-sided lead circuit board, the via holes penetrate through the solder mask layer covering the front, the circuit layer of the parallel leads on the front, the substrate with glue (namely the middle insulating layer) and the adhesive tapes, the parallel lead circuit, the back parallel wires are exposed from the front at the positions of the via holes, so that the back wires and the front are conveniently connected and conducted at the hole positions to form the double-layer wire circuit board.
According to a preferred embodiment of the present invention, the solder resist is a double-layer wire circuit board with ink solder resist, which is characterized in that the substrate with glue is polyimide PI substrate, or PET substrate, or epoxy glass fiber substrate, or phenolic aldehyde substrate, or ceramic substrate.
According to the utility model discloses a preferred embodiment, one kind hinder and weld double-deck wire circuit board that ink hinders and welds, its characterized in that, parallel conductor all be copper clad aluminum wire, or partly be copper clad aluminum wire, partly be the copper line, it is copper clad aluminum wire only to etch into the complete disconnection.
According to the utility model discloses a preferred embodiment, one kind hinder and weld double-deck wire circuit board that ink hinders and weld, its characterized in that can be in the disconnection department after the copper clad aluminum wire etching add the printing insulating ink, make the disconnection mouth form insulation protection.
The details of one or more embodiments of the invention are set forth in the accompanying drawings and the description below.
Drawings
The features, objects, and advantages of the present invention will become more apparent from the reading of the specification in conjunction with the following drawings, a brief description of which follows.
Fig. 1 is a schematic plan view of a tape base material with wires arranged in parallel.
Fig. 2 is a schematic plan view of a solder resist printed on a conductive line.
Fig. 3 is a schematic plan view of the exposed component pads and metal contacts after printing of a resist ink.
FIG. 4 is a schematic cross-sectional view of a copper-clad aluminum wire at an etching cut-off position, a window is arranged on the front solder resist ink layer, and the cut-off surface of the copper-clad aluminum wire and the window edge of the solder resist ink are on a cross section.
FIG. 5 is a schematic cross-sectional view of a copper-clad aluminum wire at an etching cut-off position, a window is arranged on the front solder resist ink layer, the cut-off position of the copper-clad aluminum wire is in the solder resist ink window, and a lead at the cut-off position of the lead is exposed from the window.
FIG. 6 is a schematic cross-sectional view of applying insulating ink to the cut-off portion after etching of copper clad aluminum wire to form insulation protection at the cut-off portion.
Fig. 7 is a schematic plan view of a front-side single-conductor circuit board.
Fig. 8 is a schematic plan view of a front side single-sided wire circuit board with vias.
Fig. 9 is a schematic cross-sectional view of a front side single-sided wire circuit board with vias.
FIG. 10 is a schematic plan view of a backside parallel conductive line overlaid on another layer of adhesive backside film.
Fig. 11 is a schematic plan view of a double-layer wiring board formed by bonding back parallel wires to the back of a single-side wiring circuit board in a butted manner, wherein the back parallel wires are exposed from the front at the positions of via holes.
Fig. 12 is a schematic cross-sectional view of a two-layer wire guide plate at the via location.
Detailed Description
The present invention will be described in detail below by taking preferred embodiments as examples.
It will be understood by those skilled in the art that the following descriptions are provided for purposes of illustration and description of certain preferred embodiments only and are not intended to limit the scope of the present invention.
A plurality of coils of copper-clad aluminum conductors 2 are placed on a pay-off rack of a wire covering machine, and are positioned and distributed through a spacing rod mould arranged on the wire covering machine to be covered and adhered with a PI substrate 1 with glue at the bottom layer (as shown in figure 1).
On a coil screen printing machine, a copper-clad aluminum conductor 2 arranged on a PI substrate 1 is upwards arranged on a platform below a screen of the screen printing machine, solder resist ink 3 is printed, element pads 3.1a and 3.2a and metal connecting points 3.3a and 3.4a on the conductor are exposed during printing, positions 2.2a and 2.2b (shown in figure 2) needing etching disconnection on the copper-clad aluminum conductor 2 are exposed, after the solder resist ink is baked, etching resistant ink 3.1b, 3.2b, 3.3b and 3.4b are printed on the element pads 3.1a and 3.2a and the metal connecting points 3.3a and 3.4a (shown in figure 3) and then baked to form two-ink etching resistant layers, wherein the solder resist ink 3 is a solder resist layer when a circuit board is used, and is a circuit during etching, and the solder resist ink 3.1a and the metal connecting points 3.2a are used for welding components, the metal connection points 3.3a, 3.4a are used when the circuit board is connected with a power circuit or when the circuit board is interconnected, then the copper-clad aluminum conductor 2 exposed at the positions 2.2a and 2.2b to be disconnected is etched and disconnected by a chemical method by using an aqueous solution of which the main components are hydrochloric acid, copper dichloride and aluminum trichloride as an etching solution to form a circuit, because the etching speed of aluminum in the copper-clad aluminum conductor 2 is higher than that of copper, the section of the conductor cut towards the longitudinal direction (the long direction) forms a structure 2.1 which is nearly in a C shape at the position of the section after the etching disconnection, aluminum in the middle of the copper-clad aluminum conductor forms a recess, and the front solder resist ink layer is provided with a window at the etching disconnection position of the copper-clad aluminum conductor 2, the disconnection surface of the copper-clad aluminum conductor 2 and the window edge of the solder resist ink are on one section (as shown in figure 4), or the front solder resist ink layer is provided with a window at the etching disconnection position of, the broken position of the copper-clad aluminum wire is in a solder resist ink window, the wire at the broken position of the wire is exposed from the window (shown in figure 5), the anti-etching line ink 3.1b, 3.2b, 3.3b and 3.4b printed on the welding spots 3.1a, 3.2a, 3.3a and 3.4a is removed by caustic soda aqueous solution at the film removing section, and then the insulating ink 4 is additionally printed at the broken position of the etched copper-clad aluminum wire to form insulating protection at the broken opening (shown in figure 6), thus manufacturing the front single-side wire circuit board shown in figure 7.
On the front-side single-conductor circuit board, a via hole 5 is drilled at a position where the front-side parallel conductor 2 and the back-side parallel conductor 6 need to be conducted, or after an adhesive tape is pasted at a local position on the back side of the single-conductor circuit board, the via hole 5 is drilled, the via hole 5 penetrates through the front-side cover film solder resist 3, the front-side parallel conductor 2, the substrate 1 with the adhesive, or the adhesive tape (as shown in fig. 8 and 9).
And then the back parallel wires 6 are covered on another layer of back film 7 with glue (as shown in figure 10), then the back parallel wires 6 and the front single-sided wire circuit board are aligned and hot-pressed and bonded together, the glue layer of the back film 7 is arranged at the gap of the back wires 6 and an intermediate insulating film, namely the substrate 1 with glue is bonded together, so that the back parallel wires 6 are fixed and sealed and insulated, the back parallel wires 6 are exposed from the front at the positions of the via holes 5 (as shown in figures 11 and 12), so that the front parallel wires 2 and the back parallel wires 6 at the positions of the via holes 5 can be connected and conducted at the via holes 5 when in use, the glue layer is baked and cured, and then the novel double-layer wire circuit board is manufactured through the processes of silk-screen character printing, OSP surface oxidation resistance treatment, molding, FQC inspection, packaging.
The present invention has been described in detail with reference to the accompanying drawings, which show an embodiment of a double-layer wire circuit board with solder resist being ink solder resist. It will be understood by those skilled in the art, however, that the foregoing is illustrative and descriptive of some specific embodiments only, and not limiting as to the scope of the invention, and particularly the scope of the claims.
Claims (4)
1. A double-layer wire circuit board with solder resist being ink solder resist comprises:
a front single-sided wire circuit board;
a via hole disposed on the front single-sided wire circuit board;
a back side parallel conductor circuit;
a film with adhesive on the back;
it is characterized in that the front single-side lead circuit board comprises: the substrate layer with the glue is the substrate layer with the glue of the single-sided conducting wire circuit board and is also the middle insulating layer of the double-layer conducting wire board; a front parallel conductor circuit layer; a front solder resist ink layer; a disconnection port of the conductive line circuit disposed on the front parallel conductive line circuit layer; a bonding pad and a metal connection point on the wire; specifically, a plurality of cut-off openings which are completely cut off from the middle are formed on all the leads or part of the leads in the front circuit of the lead circuit board, the completely cut-off leads are all copper-clad aluminum leads, the cut-off openings of the copper-clad aluminum leads which are cut off from the middle show a short-sighted C-shaped structure on the section of the leads which is cut off towards the longitudinal direction, the aluminum in the middle forms a depression, a window is arranged on the front solder resist ink layer at the cut-off opening of the copper-clad aluminum leads, the cut-off positions of the leads are at the edge position of the window of the front solder resist ink, the cut-off surfaces of the leads and the window edge of the solder resist ink are at one section or close to one section, or the cut-off positions of the leads are in the solder resist ink window, the leads at the cut-off positions of the leads are exposed from the window, and the bonding pads are bonding pads of the welding elements, the metal connection points are connection points used for being connected with a power circuit or connection points used for being interconnected between circuit boards, the solder mask ink layer is provided with a plurality of windows, one part of the windows are a pad window and a metal connection point window, one part of the windows are windows at the disconnection positions of leads, the via holes arranged on the front single-sided lead circuit board are arranged at the positions where the parallel leads on the back are required to be communicated with the front, holes penetrate through the solder mask layer covering the front, the circuit layer of the parallel leads on the front and the base material with glue, or adhesive tapes are arranged at the local positions on the back of the single-sided lead circuit board, the via holes penetrate through the solder mask layer covering the front, the circuit layer of the parallel leads on the front, the base material with glue and the adhesive tapes, the parallel lead circuits on the back are overlapped and adhered with the circuit board of the single-sided, the back lead and the front lead are conveniently connected and conducted at the hole position to form the double-layer lead circuit board.
2. The double-layer wire circuit board with solder resist being ink solder resist as claimed in claim 1, wherein the substrate with glue is polyimide PI substrate, or PET substrate, or epoxy glass fiber substrate, or phenolic aldehyde substrate, or ceramic substrate.
3. The circuit board with double-layer conducting wires and solder resist ink as claimed in claim 1, wherein the parallel conducting wires are all copper-clad aluminum wires, or a part of the parallel conducting wires are copper-clad aluminum wires, a part of the parallel conducting wires are copper wires, and the parallel conducting wires are etched to be completely disconnected and only copper-clad aluminum wires.
4. The circuit board with double-layer conducting wires and solder resist as claimed in claim 1, wherein the solder resist is an ink solder resist, and the insulation ink is printed on the etched break of the copper clad aluminum wire to form insulation protection at the break.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921429344.9U CN212211553U (en) | 2019-08-24 | 2019-08-24 | Solder resist is double-layer wire circuit board that printing ink hinders solder resist |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921429344.9U CN212211553U (en) | 2019-08-24 | 2019-08-24 | Solder resist is double-layer wire circuit board that printing ink hinders solder resist |
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| Publication Number | Publication Date |
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| CN212211553U true CN212211553U (en) | 2020-12-22 |
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| CN201921429344.9U Active CN212211553U (en) | 2019-08-24 | 2019-08-24 | Solder resist is double-layer wire circuit board that printing ink hinders solder resist |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112437552A (en) * | 2019-08-24 | 2021-03-02 | 王定锋 | Solder resist is double-layer wire circuit board of ink solder resist and manufacturing method thereof |
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- 2019-08-24 CN CN201921429344.9U patent/CN212211553U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112437552A (en) * | 2019-08-24 | 2021-03-02 | 王定锋 | Solder resist is double-layer wire circuit board of ink solder resist and manufacturing method thereof |
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