CN112437553A - Etched copper-clad aluminum wire conductor circuit board using solder resist ink as anti-corrosion layer and manufacturing method thereof - Google Patents
Etched copper-clad aluminum wire conductor circuit board using solder resist ink as anti-corrosion layer and manufacturing method thereof Download PDFInfo
- Publication number
- CN112437553A CN112437553A CN201910835515.6A CN201910835515A CN112437553A CN 112437553 A CN112437553 A CN 112437553A CN 201910835515 A CN201910835515 A CN 201910835515A CN 112437553 A CN112437553 A CN 112437553A
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- ink
- copper
- etching
- clad aluminum
- circuit board
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0562—Details of resist
- H05K2203/0571—Dual purpose resist, e.g. etch resist used as solder resist, solder resist used as plating resist
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention relates to an etched copper-clad aluminum wire conductor circuit board using solder resist ink as an anti-corrosion layer and a manufacturing method thereof, in particular to a circuit board which uses the solder resist ink as an anti-corrosion layer and is characterized in that conductors are arranged in parallel and covered on a substrate with glue, the solder resist ink is printed, an element bonding pad and a metal connection point on the conductors are exposed during printing, meanwhile, the parts needing to be etched and disconnected on the conductors are exposed, baking and curing are carried out, then the anti-etching ink is printed, printing etching-resistant ink on the bonding pad and the metal connecting point on the lead, then baking to form two ink etching-resistant layers, wherein the solder resist ink is not only a solder resist layer when the circuit board is used, but also a circuit protective layer when in etching, the exposed copper clad aluminum conductor is etched by using an aqueous solution of which the main components are hydrochloric acid, copper dichloride and aluminum trichloride to be disconnected, after etching, and removing the etching-resistant ink by using alkaline ink removing liquid, and reserving the solder-resistant ink to prepare the conductor circuit board of the etched copper-clad aluminum wire by using the solder-resistant ink as an anti-corrosion layer.
Description
Technical Field
The invention relates to the field of circuit boards, in particular to an etched copper-clad aluminum wire lead circuit board taking solder resist ink as an anti-corrosion layer and a manufacturing method thereof.
Background
A series of prior wire guide plate patents by the present inventors, for example: patent numbers: 201010232487.8, patent name: a single-sided circuit board manufactured by juxtaposing flat wires and a manufacturing method thereof are disclosed in the patent number: 201010232506.7, patent name: the method for manufacturing the single-sided circuit board by adopting the juxtaposed leads has the following patent numbers: 201010232506.7, patent name: the method comprises the following steps of respectively using insulating layers to simultaneously carry out hot pressing on two surfaces of a flat wire to manufacture a single-sided circuit board, wherein the method comprises the following steps: 201010232526.4, patent name: the single-sided circuit board is manufactured by bonding juxtaposed flat leads by using a thermosetting adhesive film, and the patent number is as follows: 201010232547.6, patent name: the method for manufacturing the single-sided circuit board by using the transshipment adhesive film and the juxtaposed flat wires adopts a mode of die cutting or drilling by a drilling machine to break the wires, and has the defects of high die opening cost and inflexible design due to the use of the die, difficulty in changing once the die opening is finished, high cost due to the adoption of a mode of heavy drilling for drilling, insufficient alignment precision and high defective scrap due to easy drilling deviation.
In order to overcome the defects and the shortcomings, the invention adopts the steps of arranging and covering wires on a substrate with glue in parallel, printing solder resist ink to expose an element bonding pad and a metal connecting point on the wires, simultaneously exposing a part needing to be etched and disconnected on the wires, printing the etch resist ink to protect the bonding pad and the metal connecting point, then baking, exposing the wires at the position where a wire circuit needs to be disconnected outside, and etching and disconnecting the exposed wires by adopting an etching mode to form a circuit, thereby having flexible design and low cost.
Disclosure of Invention
The invention relates to an etched copper-clad aluminum wire conductor circuit board using solder resist ink as an anti-corrosion layer and a manufacturing method thereof, in particular to a circuit board which uses the solder resist ink as an anti-corrosion layer and is characterized in that conductors are arranged in parallel and covered on a substrate with glue, the solder resist ink is printed, an element bonding pad and a metal connection point on the conductors are exposed during printing, meanwhile, the parts needing to be etched and disconnected on the conductors are exposed, baking and curing are carried out, then the anti-etching ink is printed, printing etching-resistant ink on the bonding pad and the metal connecting point on the lead, then baking to form two ink etching-resistant layers, wherein the solder resist ink is not only a solder resist layer when the circuit board is used, but also a circuit protective layer when in etching, the exposed copper clad aluminum conductor is etched by using an aqueous solution of which the main components are hydrochloric acid, copper dichloride and aluminum trichloride to be disconnected, after etching, and removing the etching-resistant ink by using alkaline ink removing liquid, and reserving the solder-resistant ink to prepare the conductor circuit board of the etched copper-clad aluminum wire by using the solder-resistant ink as an anti-corrosion layer.
The invention provides a method for manufacturing an etched copper-clad aluminum wire conductor circuit board by using solder resist ink as an anti-corrosion layer, which comprises the following steps of arranging and coating conductors on a substrate with glue in parallel, printing the solder resist ink, exposing element pads and metal connection points on the conductors during printing, exposing parts needing to be etched and disconnected on the conductors, baking the solder resist ink, printing the anti-etching ink on the pads and the metal connection points on the conductors (but not limited to), and baking to form two ink anti-etching layers, wherein the solder resist ink is a solder resist layer during circuit board use and an anti-etching layer for circuit protection during etching, the pads are used for welding elements, the metal connection points are used during circuit board and power supply circuit connection or are used during circuit board interconnection, and the anti-etching layer comprises two materials, the method comprises the steps of forming a solder resist ink layer on a solder resist ink layer, forming an etching-resistant layer on a solder resist ink layer, forming the etching-resistant layer by overlapping the etching-resistant ink on the solder resist ink layer, using an aqueous solution mainly containing hydrochloric acid, copper dichloride and aluminum trichloride as an etching solution, chemically etching the exposed copper-clad aluminum conductor to break the copper-clad aluminum conductor, wherein the etching speed of aluminum is higher than that of copper, so that the section of the conductor cut towards the longitudinal direction (the long direction) at the section position after the copper-clad aluminum conductor is etched to form a C-shaped structure, forming a recess in the aluminum in the middle of the copper-clad aluminum conductor, removing the etching-resistant ink by using alkaline desizing ink after etching, and retaining the solder resist ink.
The invention also provides an etched copper-clad aluminum wire lead circuit board using solder resist ink as an anti-corrosion layer, which comprises the following components: a base material layer with glue on the bottom surface; a middle wire circuit layer; a front solder resist ink layer; a disconnection port of the wire circuit disposed on the intermediate wire circuit layer; a bonding pad and a metal connection point on the wire; the method is characterized in that a plurality of disconnection ports which are completely disconnected from the middle are formed on all leads or part of leads of a lead circuit, the completely disconnected leads are copper-clad aluminum leads, the disconnection ports of the copper-clad aluminum leads which are disconnected from the middle display a near-sighted C-shaped structure on the section of the leads which are cut towards the longitudinal direction (the long direction), aluminum in the middle of the leads forms a recess, a window is arranged at the disconnection port of the copper-clad aluminum leads in the middle, a solder mask ink layer is arranged on the front surface of the lead, the disconnection position of the lead is at the edge position of the solder mask ink window on the front surface, the disconnection surface of the lead and the edge of the solder mask ink window are on one section or close to one section, or the disconnection position of the lead is in the solder mask ink window, the lead at the disconnection position of the lead is exposed out of the window, the pads are positive and negative pads of an element, are arranged on two leads or on two, the metal connection points are connection points used for being connected with a power supply circuit or connection points used for interconnection between circuit boards, the solder mask ink layer is provided with a plurality of windows, wherein one part of the windows are a pad window and a metal connection point window, and one part of the windows are windows at the broken positions of the leads.
According to a preferred embodiment of the present invention, the etched copper-clad aluminum conductor circuit board using solder resist ink as an etch-resistant layer is characterized in that the substrate with glue is a polyimide PI substrate, a PET substrate, an epoxy glass fiber substrate, a phenolic substrate, or a ceramic substrate.
According to a preferred embodiment of the present invention, the etched copper-clad aluminum conductor circuit board using solder resist ink as an etch-resistant layer is characterized in that all the conductors of the intermediate conductor circuit layer are copper-clad aluminum conductors, or one part of the conductors are copper-clad aluminum conductors, and one part of the conductors are copper wires, and the other part of the conductors are copper wires, and the conductors are etched to be completely disconnected only with copper-clad aluminum conductors.
According to a preferred embodiment of the present invention, the etched copper-clad aluminum conductor circuit board using solder resist ink as an etch-resistant layer is characterized in that insulating ink can be printed at the cut-off position of the etched copper-clad aluminum conductor to form insulation protection at the cut-off position.
According to a preferred embodiment of the present invention, the etched copper-clad aluminum conductor circuit board using solder resist ink as an etch-resistant layer is characterized in that a metal plate with glue can be pasted on the back surface of the conductor circuit board.
The details of one or more embodiments of the invention are set forth in the accompanying drawings and the description below.
Drawings
The features, objects, and advantages of the present invention will become more apparent from the description set forth below when taken in conjunction with the drawings, a brief description of which follows.
Fig. 1 is a schematic plan view of a tape base material with wires arranged in parallel.
Fig. 2 is a schematic plan view of a solder resist printed on a conductive line.
Fig. 3 is a schematic plan view of the exposed component pads and metal contacts after printing of a resist ink.
FIG. 4 is a schematic cross-sectional view of a copper-clad aluminum wire at an etching cut-off position, a window is arranged on the front solder resist ink layer, and the cut-off surface of the copper-clad aluminum wire and the window edge of the solder resist ink are on a cross section.
FIG. 5 is a schematic cross-sectional view of a copper-clad aluminum wire at an etching cut-off position, a window is arranged on the front solder resist ink layer, the cut-off position of the copper-clad aluminum wire is in the solder resist ink window, and a lead at the cut-off position of the lead is exposed from the window.
FIG. 6 is a schematic cross-sectional view of applying insulating ink to the cut-off portion after etching of copper clad aluminum wire to form insulation protection at the cut-off portion.
FIG. 7 is a schematic plan view of an etched copper clad aluminum wire conductor circuit board with solder resist as the etch resistant layer.
Detailed Description
The present invention will be described in detail below by taking preferred embodiments as examples.
It will be understood by those skilled in the art that the following descriptions are provided for purposes of illustration and description of certain preferred embodiments only and are not intended to limit the scope of the present invention.
A plurality of coils of copper-clad aluminum conductors 2 are placed on a pay-off rack of a wire covering machine, and are positioned and distributed through a spacing rod mould arranged on the wire covering machine to be covered and adhered with a PI substrate 1 with glue at the bottom layer (as shown in figure 1).
On a coil screen printing machine, a copper-clad aluminum conductor 2 arranged on a PI substrate 1 is upwards arranged on a platform below a screen of the screen printing machine, solder resist ink 3 is printed, element pads 3.1a and 3.2a and metal connecting points 3.3a and 3.4a on the conductor are exposed during printing, positions 2.2a and 2.2b (shown in figure 2) needing etching disconnection on the copper-clad aluminum conductor 2 are exposed, after the solder resist ink is baked, etching resistant ink 3.1b, 3.2b, 3.3b and 3.4b are printed on the element pads 3.1a and 3.2a and the metal connecting points 3.3a and 3.4a (shown in figure 3) and then baked to form two-ink etching resistant layers, wherein the solder resist ink 3 is a solder resist layer when a circuit board is used, is a circuit pad during etching, and the copper-clad aluminum conductor 3.1a and the metal connecting points 3.2a are used for welding components, the metal connection points 3.3a, 3.4a are used when the circuit board is connected with a power circuit or when the circuit board is interconnected, then the copper-clad aluminum conductor 2 exposed at the positions 2.2a and 2.2b to be disconnected is etched and disconnected by a chemical method by using an aqueous solution of which the main components are hydrochloric acid, copper dichloride and aluminum trichloride as an etching solution to form a circuit, because the etching speed of aluminum in the copper-clad aluminum conductor 2 is higher than that of copper, the section of the conductor cut towards the longitudinal direction (the long direction) forms a nearly C-shaped structure 2.1 at the position of the section after the etching disconnection, aluminum in the middle of the copper-clad aluminum conductor forms a recess, and the front solder resist ink layer is provided with a window at the etching disconnection position of the copper-clad aluminum conductor 2, the disconnection surface of the copper-clad aluminum conductor 2 and the window edge of the solder resist ink are on one section (as shown in figure 4), or the front solder resist ink layer is provided with a window at the etching disconnection position of the copper-, the disconnected position of the copper-clad aluminum wire is positioned in a solder resist ink window, the wire at the disconnected position of the wire is exposed from the window (shown in figure 5), the anti-etching line inks 3.1b, 3.2b, 3.3b and 3.4b printed on welding spots 3.1a, 3.2a, 3.3a and 3.4a are removed by caustic soda aqueous solution at a film removing section, then the insulating ink 4 is additionally printed at the disconnected position of the etched copper-clad aluminum wire to form insulating protection at the disconnected position (shown in figure 6), and the wire circuit board (shown in figure 5) is manufactured through the processes of silk-screen character printing, OSP surface anti-oxidation treatment, molding, FQC inspection, packaging and the like.
Alternatively, a metal plate with adhesive can be attached to the back of the lead circuit board.
The present invention is described in detail with reference to the accompanying drawings by using an embodiment of an etched copper-clad aluminum conductor circuit board using solder resist ink as an etch-resistant layer and a method for manufacturing the same. It will be understood by those skilled in the art, however, that the foregoing is merely illustrative and descriptive of some specific embodiments and is not to be construed as limiting the scope of the invention, especially the scope of the claims.
Claims (6)
1. A method for making circuit board with etched copper-clad aluminium wire and conducting wire features that the conducting wires are parallelly arranged and coated on the substrate with adhesive, the solder resist ink is printed to expose the component pad and metal connection point on conducting wire and the part to be etched and cut on conducting wire, the etching-resistant ink is printed on the pad and metal connection point, and then baked to form two etching-resistant layers, where the solder resist ink is used as the solder resist layer for welding components and the metal connection point is used for connecting circuit board with power supply or connecting circuit board, and the etching-resistant layer contains two materials and is used as the etching-resistant layer, the method comprises the steps of forming an etching-resistant layer by using etching-resistant ink at some positions, forming the etching-resistant layer by overlapping the etching-resistant ink on a solder-resistant ink layer at some positions, then using aqueous solution of which the main components are hydrochloric acid, copper dichloride and aluminum trichloride as etching solution, chemically etching the exposed copper-clad aluminum conductor to break the copper-clad aluminum conductor, wherein the etching speed of aluminum is higher than that of copper, so that the section of the conductor cut towards the longitudinal direction (the long direction) at the position of the section after the etching break shows a short-sight C-shaped structure, a recess is formed in aluminum in the middle of the copper-clad aluminum conductor, removing the etching-resistant ink by using alkaline desizing ink after the etching, and retaining the solder-resistant ink, namely preparing the copper-clad aluminum conductor circuit board using the solder-resistant ink as an etching-resistant.
2. An etched copper-clad aluminum conductor circuit board using solder resist ink as an anti-corrosion layer comprises:
a base material layer with glue on the bottom surface;
a middle wire circuit layer;
a front solder resist ink layer;
a disconnection port of the wire circuit disposed on the intermediate wire circuit layer;
a bonding pad and a metal connection point on the wire;
the method is characterized in that a plurality of disconnection ports which are completely disconnected from the middle are formed on all leads or part of leads of a lead circuit, the completely disconnected leads are copper-clad aluminum leads, the disconnection ports of the copper-clad aluminum leads which are disconnected from the middle display a near-sighted C-shaped structure on the section of the leads which are cut towards the longitudinal direction (the long direction), aluminum in the middle of the leads forms a recess, a window is arranged at the disconnection port of the copper-clad aluminum leads in the middle, a solder mask ink layer is arranged on the front surface of the lead, the disconnection position of the lead is at the edge position of the solder mask ink window on the front surface, the disconnection surface of the lead and the edge of the solder mask ink window are on one section or close to one section, or the disconnection position of the lead is in the solder mask ink window, the lead at the disconnection position of the lead is exposed out of the window, the pads are positive and negative pads of an element, are arranged on two leads or on two, the metal connection points are connection points used for being connected with a power supply circuit or connection points used for interconnection between circuit boards, the solder mask ink layer is provided with a plurality of windows, wherein one part of the windows are a pad window and a metal connection point window, and one part of the windows are windows at the broken positions of the leads.
3. The etched copper-clad aluminum conductor circuit board taking solder resist ink as an anti-corrosion layer according to claim 1 or 2, characterized in that the substrate with glue is a polyimide PI substrate, a PET substrate, an epoxy glass fiber substrate, a phenolic aldehyde substrate or a ceramic substrate.
4. The circuit board of claim 1 or 2, wherein the conductor of the middle conductor circuit layer is completely copper-clad aluminum conductor, or a part of the conductor is copper-clad aluminum conductor, a part of the conductor is copper wire, and the conductor is etched to be completely broken but only copper-clad aluminum conductor.
5. The etched copper-clad aluminum conductor circuit board taking solder resist ink as an anti-corrosion layer according to claim 1 or 2, characterized in that insulating ink can be printed at the cut part of the etched copper-clad aluminum conductor to ensure that the cut part forms insulation protection.
6. The etched copper-clad aluminum conductor circuit board with solder resist ink as the anti-corrosion layer according to claim 1 or 2, characterized in that a metal plate with glue is pasted on the back of the conductor circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910835515.6A CN112437553A (en) | 2019-08-24 | 2019-08-24 | Etched copper-clad aluminum wire conductor circuit board using solder resist ink as anti-corrosion layer and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910835515.6A CN112437553A (en) | 2019-08-24 | 2019-08-24 | Etched copper-clad aluminum wire conductor circuit board using solder resist ink as anti-corrosion layer and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112437553A true CN112437553A (en) | 2021-03-02 |
Family
ID=74689872
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910835515.6A Pending CN112437553A (en) | 2019-08-24 | 2019-08-24 | Etched copper-clad aluminum wire conductor circuit board using solder resist ink as anti-corrosion layer and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112437553A (en) |
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2019
- 2019-08-24 CN CN201910835515.6A patent/CN112437553A/en active Pending
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