WO2016208651A1 - Three-dimensional molded component production method and three-dimensional molded component - Google Patents

Abstract

Provided is a three-dimensional molded component production method comprising: a three-dimensional molded product preparation step in which a three-dimensional molded product comprising a wiring pattern formed on the surface of a resin substrate is prepared; a protective film formation step in which a protective film is formed on at least the surface of the three-dimensional molded product by spray coating the three-dimensional molded product with a photosensitive material; an exposure mask film preparation step in which an exposure mask film that is three-dimensionally molded so as to correspond to the three-dimensional molded product is prepared; an exposure mask film arrangement step in which the exposure mask film is arranged so as to cover the protective film; a vacuum air removal step in which the three-dimensional molded product having the exposure mask film arranged thereon is inserted into a bag for vacuum air removal, the air is removed by vacuum, and the exposure mask film is made to adhere to the protective film; an exposure step in which the three-dimensional molded product is irradiated with light and thereby exposed while inserted in the bag for vacuum air removal; and an opening formation step in which the three-dimensional molded product is removed from the bag for vacuum air removal, development treatment is carried out, and a desired opening is formed in the protective film.

Description

Manufacturing method of three-dimensional molded part and three-dimensional molded part

The present invention is manufactured by a method of manufacturing a three-dimensional molded component in which at least a part of the surface on which the wiring pattern is formed is covered with a protective film with respect to a three-dimensional molding whose wiring pattern is formed on the surface It relates to a three-dimensional molded part.

As a conventionally known three-dimensional wiring substrate, there is a MID (Molded Interconnect Device) substrate which is a component in which an electric circuit is directly and three-dimensionally formed on the surface of a structure having a three-dimensional structure. As techniques related to MID substrates, methods such as a two-shot method, MIPTEC (Microscopic Integrated Processing Technology), and LDS (Laser Direct Structuring) are known. In any of the methods, after forming a three-dimensional structure on the mold resin, a wiring circuit is formed on the surface. For example, Patent Document 1 discloses a technique related to an MID substrate and its manufacture.

In the two-shot method, secondary molding with a new resin is performed on a portion on the primarily molded mold resin where wiring formation is not performed, and catalyst coating and plating are performed using the resin related to the secondary molding as a resist. Thus, a wiring circuit is formed on the mold resin. However, in order to regulate the wiring pattern shape by the secondarily molded resin, the L / S (line width and spacing) indicating the conductor width and the conductor gap is the minimum from the limit of the die processing accuracy for the second molding. The value was about 150/150 μm, and it was difficult to form a finer wiring pattern.

In MIPTEC, the entire surface of a molded mold resin is metallized, and laser light is used to remove the metal (metallized layer) on the outer edge portion of the wiring circuit. Thereafter, current is supplied to a region to be a wiring circuit to perform electrolytic plating, and then the entire surface of the molded body is subjected to flash etching to remove metal other than the wiring circuit, thereby forming a wiring circuit on the mold resin. However, when using a laser beam, a special laser irradiation apparatus corresponding to the three-dimensional shape of the molded mold resin is required, and the increase in manufacturing cost due to the labor of laser processing and equipment investment becomes a problem. In addition, since the metal necessary for the wiring circuit is deposited by electrolytic plating, it is necessary to energize only the region to be the wiring circuit, so the region to be the wiring circuit is electrically connected to the outer peripheral portion of the molded body. Or need to be electrically connected to the outer peripheral portion through a feeder line. That is, it is difficult to electrically separate the area to be the wiring circuit from the outer peripheral portion of the molded body (that is, formation of an independent wiring pattern); The problem of cost increase associated with the removal arises.

In LDS, primary molding is performed using a special resin material containing conductive particles, and laser light is irradiated to a region to be a wiring circuit to expose the conductive particles, and plating the exposed portion of the conductive particles To form a wiring circuit on the mold resin. However, the minimum value of L / S is about 100/150 μm due to the problem of accuracy in exposing the conductive particles in the molded mold resin, and it is difficult to form a finer wiring pattern. In addition, as with MIPTEC, a special laser irradiation apparatus is required, and the increase in manufacturing cost due to the labor of laser processing and equipment investment becomes a problem.

Then, in any of the above-described methods, in order to form the wiring circuit in the mold resin having a three-dimensional shape, the MID substrate finally manufactured becomes a single-sided substrate. For this reason, the degree of freedom of the wiring circuit becomes smaller than that of the double-sided board, and there arises a problem that miniaturization of the board itself becomes difficult. As a method of solving the said problem and the problem mentioned above, after forming a wiring circuit in thermoplastic resins, such as a polyimide, there exists the method of bending-processing to resin by heating and pressurization, and manufacturing a three-dimensional wiring board. For example, Patent Document 2 discloses that a metal foil is attached to a polyimide film by thermocompression bonding and then three-dimensional molding is disclosed, and Patent Document 3 discloses that a conductive paste is applied on a polysulfone resin and then three-dimensional molding is performed. It is disclosed.

In the above-described three-dimensional wiring board, since the formed wiring pattern is exposed, a bridge between the soldering lands occurs when soldering is performed for component mounting, connection with another component, or another substrate. Deterioration such as oxidation of the wiring pattern metal material due to being easy or exposed to temperature or moisture, a problem of short circuit due to mixed foreign matter, and the like easily occur. For this reason, coating with insulating resin is generally performed except for the land portions required for component mounting. As such a coating method, for example, an insulating resin is applied by screen printing, spray coating, or ink jet printing with an ink-like thermosetting resin or ultraviolet curing resin. Here, as a method of exposing the wiring pattern of the portion to be soldered, a method of applying an insulating resin so as to expose the portion to be soldered from the beginning, or UV curing of the entire coated surface After applying a resin, there is a method of forming an opening in a necessary portion using a photolithography technique.

JP 2012-94605 A Japanese Patent Application Publication No. 06-188537 JP 2000-174399 A

However, in the case of application by screen printing to a three-dimensionally shaped object, it is difficult to apply the insulating resin along the surface of the three-dimensionally shaped object because of the presence of steps in the three-dimensionally shaped object. Moreover, in coating by ink jet printing, it is frequently used nowadays to prevent application of the insulating resin along the surface of the three-dimensional molding and wetting and spreading of the landed droplets before curing due to the step of the three-dimensional molding. The UV radiation for temporary curing using a UV curable resin requires that the distance between the inkjet head and the substrate be made wider by the step, so that the resin before the injection in the inkjet head nozzle due to the reflection of the UV light on the substrate surface Is difficult due to problems such as curing the resin.

On the other hand, it is conceivable to use a film-like protective film used for a general flat substrate in place of the insulating resin for printing, but it is conceivable to increase the area of the three-dimensional molding and to make the shape complicated. It becomes difficult to uniformly press a thin protective film over the entire surface of a three-dimensional molded product, and air bubbles or gaps are generated between the three-dimensional molded product and the protective film, or a wiring pattern formed on the three-dimensional molded product There is a problem that a stress is applied to lead to disconnection. In addition, in the case where the protective film and the three-dimensional molded product are brought into close contact with each other to be pressurized, a molding die is required for each of the three-dimensional molded products, and occupation of the molding die by one three-dimensional molded product. As a result, it becomes difficult to expand the production scale and shorten the tact time, resulting in the problem of increased manufacturing costs. And, in the part of the wiring pattern to be exposed due to the influence of the use of the punching die for expansion and contraction of the protective film at the time of pressurization and the formation of the opening to the protective film (the formation of fine openings is difficult with the die) On the other hand, it is difficult to form finer openings with fine precision.

The present invention has been made in view of such problems, and the object of the present invention is to make a desired fine for a three-dimensional molded product having a wiring pattern formed on the surface without using an expensive apparatus. It is an object of the present invention to provide a method of manufacturing a three-dimensional molded part capable of manufacturing a three-dimensional molded part at low cost while easily forming a protective film having the above opening pattern with high accuracy. Another object of the present invention is to provide a low-cost three-dimensional molded component in which a protective film having a fine opening pattern is formed with high accuracy.

In order to achieve the above object, a method of manufacturing a three-dimensional molded part according to the present invention includes a three-dimensional molding preparation step of preparing a three-dimensional molding having a wiring pattern formed on a surface of a resin substrate; A protective film forming step of spray-coating a photosensitive material to form a protective film on at least the surface of the three-dimensional molding; and an exposure mask film preparing step of preparing a three-dimensionally formed exposure mask film corresponding to the three-dimensional molding. An exposure mask film disposing step of arranging to cover the protective film with the exposure mask film, and inserting the three-dimensional molded article in a state where the exposure mask film is disposed into a vacuum degassing bag, A vacuum degassing step of bringing the exposed mask film into intimate contact with the protective film, and exposing the three-dimensional molded product to the vacuum degassing bag in a state of being inserted with light for exposure An exposure step that, the three-dimensional molded article of subjected to a developing process the vacuum degassing bag was taken out, is to have a, an opening formation step of forming a desired opening in the protective film.

Further, in order to achieve the above object, the three-dimensionally formed component of the present invention is composed of a three-dimensional molding having a wiring pattern formed on the surface of a resin substrate and a photosensitive resin ink to protect the surface of the three-dimensional molding. The protective film and the protective film are provided with an opening corresponding to the area where the wiring pattern is to be exposed, and coat the three-dimensional object along the three-dimensional shape of the three-dimensional object.

According to the present invention, a three-dimensional molding can be easily and accurately formed on a protective film having a desired fine opening pattern with respect to a three-dimensional molding having a wiring pattern formed on the surface, without using an expensive apparatus. Parts can be manufactured at low cost. Further, according to the present invention, it is possible to provide a low-cost three-dimensional molded component in which a protective film having a fine opening pattern is formed with high accuracy.

It is sectional drawing in the manufacturing process of the three-dimensional wiring board which concerns on the Example of this invention. It is sectional drawing in the manufacturing process of the three-dimensional wiring board which concerns on the Example of this invention. It is the schematic in metal film formation about the three-dimensional wiring board which concerns on the Example of this invention. It is sectional drawing in the manufacturing process of the three-dimensional wiring board which concerns on the Example of this invention. FIG. 5 is an enlarged conceptual view of a broken line area V in FIG. 4; It is the schematic in metal film formation about the three-dimensional wiring board which concerns on the Example of this invention. It is the schematic in metal film formation about the three-dimensional wiring board which concerns on the Example of this invention. It is the schematic in metal film formation about the three-dimensional wiring board which concerns on the Example of this invention. It is sectional drawing in the manufacturing process of the three-dimensional wiring board which concerns on the Example of this invention. FIG. 10 is an enlarged conceptual view of a broken line area X in FIG. 9; It is the schematic in metal film formation about the three-dimensional wiring board which concerns on the Example of this invention. It is sectional drawing in the manufacturing process of the three-dimensional wiring board which concerns on the Example of this invention. It is the schematic which shows the manufacturing process which concerns on the three-dimensional shaping | molding which concerns on the Example of this invention. It is the schematic which shows the manufacturing process which concerns on the three-dimensional shaping | molding which concerns on the Example of this invention. It is the schematic which shows the manufacturing process which concerns on the three-dimensional shaping | molding which concerns on the Example of this invention. It is the schematic which shows the manufacturing process which concerns on the three-dimensional shaping | molding which concerns on the Example of this invention. It is sectional drawing in the manufacturing process of the three-dimensional wiring board which concerns on the Example of this invention. FIG. 18 is an enlarged conceptual view of a broken line area XVIII of FIG. 17; It is sectional drawing in the manufacturing process of the three-dimensional wiring board which concerns on the Example of this invention. FIG. 20 is an enlarged conceptual view of a dashed line area XX in FIG. It is the schematic in metal film formation about the three-dimensional wiring board which concerns on the Example of this invention. It is a perspective view of a substrate which constitutes a three-dimensional wiring board concerning an example of the present invention. It is sectional drawing in the manufacturing process of the three-dimensional wiring board which concerns on the Example of this invention. It is sectional drawing in the manufacturing process of the three-dimensional wiring board which concerns on the Example of this invention. It is sectional drawing in the manufacturing process of the three-dimensional wiring board which concerns on the Example of this invention. It is sectional drawing in the manufacturing process of the three-dimensional wiring board which concerns on the Example of this invention. It is sectional drawing in the manufacturing process of the three-dimensional wiring board which concerns on the Example of this invention. It is sectional drawing in the manufacturing process of the three-dimensional wiring board which concerns on the Example of this invention. It is sectional drawing in the manufacturing process of the three-dimensional wiring board which concerns on the Example of this invention. It is sectional drawing of the three-dimensional wiring board which concerns on the Example of this invention.

Hereinafter, embodiments of the present invention will be described in detail based on examples with reference to the drawings. The present invention is not limited to the contents described below, and can be arbitrarily changed and implemented without changing the gist of the present invention. Further, the drawings used for describing the embodiments are all schematically showing the three-dimensional molded part according to the present invention and the constituent members thereof, and the partial emphasis, enlargement, reduction, omission or the like is to be understood for further understanding. In some cases, the scale, shape, etc. of the three-dimensional molded part and its constituent members may not be accurately represented. Furthermore, various numerical values used in the embodiments may represent an example, and can be variously changed as needed.

<Example>
Hereinafter, a method of manufacturing a three-dimensional wiring substrate according to an embodiment of the present invention will be described in detail with reference to FIGS. 1 to 30. Here, FIGS. 1, 2, 4, 9, 12, 17, 19, and 23 to 29 are cross-sectional views in the manufacturing process of the three-dimensional wiring substrate. In particular, FIGS. 24 to 26 are cross-sectional views of an exposure mask film used for forming an opening in a protective film of a three-dimensional wiring substrate or a film used for the exposure mask film. 5 is an enlarged conceptual view of the broken line area V in FIG. 4, FIG. 10 is an enlarged conceptual view of the broken line area X in FIG. 9, and FIG. 18 is an enlarged conceptual view of the broken line area XVIII in FIG. FIG. 20 is an enlarged conceptual view of a broken line area XX in FIG. Furthermore, FIG. 13 to FIG. 16 are schematic views showing manufacturing steps according to three-dimensional molding according to an embodiment of the present invention. And FIG. 3, FIG. 6 thru | or FIG. 8, FIG. 11, FIG. 21 is the schematic in metal film formation about the three-dimensional wiring board based on the Example of this invention. FIG. 22 is a perspective view of a substrate constituting a three-dimensional wiring substrate according to an embodiment of the present invention, and FIG. 30 is a cross-sectional view of the three-dimensional wiring substrate according to the embodiment of the present invention.

First, as shown in FIG. 1, the thermoplastic resin film 1 which is a resin base material is prepared (resin base material preparation process). As the thermoplastic resin film 1, for example, a known resin film such as polyimide or polyethylene terephthalate can be used. The thickness of the thermoplastic resin film 1 is not limited, and can be appropriately changed according to the application and the required characteristics of the three-dimensional wiring substrate of the present example corresponding to the three-dimensional wiring component of the present invention. For example, in the present embodiment, the thickness of the thermoplastic resin film 1 is adjusted to about 125 μm (about 75 μm to 150 μm), but when the three-dimensional wiring board is used together with a holding member such as another mold resin, 50 μm You may adjust to the following.

The resin film to be prepared is not limited to the thermoplastic type, and if it is a resin film having a relatively large elongation at break, a thermosetting resin film or a thermosetting resin and a thermoplastic resin were laminated ( That is, a composite resin film having a structure in which a thermoplastic resin film and a thermosetting resin film are laminated may be used. Here, the relatively large elongation at break is a value of at least 50% or more, preferably 150% or more. The breaking elongation is required to have the necessary characteristics depending on the three-dimensional shape to be molded, and in the case of a complicated large step shape, a resin film material having a larger breaking elongation strength is required so that the material by three-dimensional molding can withstand. .

Next, as shown in FIG. 2, NC processing, laser processing, punching processing, etc., in order to ensure conduction on the front and back surfaces (first surface 1 a and second surface 1 b) of the thermoplastic resin film 1. The through hole 2 is formed using the opening technique of. In the present embodiment, the opening diameter of the through hole 2 is about 0.3 mm. Although only one through hole 2 is shown in FIG. 2, the actual three-dimensional wiring board has a plurality of through holes 2. In addition, the number of through holes 2 can be appropriately changed according to the circuit configuration of the three-dimensional wiring board. Furthermore, positioning holes (for example, an opening diameter of 3 mm) for use as positioning at the time of three-dimensional molding to be described later are removed without forming the outer edge portion of the thermoplastic resin film 1 (that is, finally forming a three-dimensional wiring board Part) may be formed.

Next, on the surface of the thermoplastic resin film 1 so as to cover the first surface 1a and the second surface 1b of the thermoplastic resin film 1 and the side surface 1c of the thermoplastic resin film 1 exposed by the through holes. The first metal film 3 is formed (first metal film forming step). In the present embodiment, metal is metallized on the surface of the thermoplastic resin film 1 by electroless plating using a known molecular bonding technology.

More specifically, first, as pretreatment, the thermoplastic resin film 1 is subjected to Ar plasma treatment to remove the fragile layer on the surface of the thermoplastic resin film 1, and a functional group having compatibility with the molecular bonding agent described later is removed. It is formed on the surface of the thermoplastic resin film 1. Thereafter, the thermoplastic resin film 1 after Ar plasma treatment is dipped in the solution of the molecular bonding agent 4 (FIG. 3). Here, since the molecular bonding agent 4 is provided with a functional group (first functional group) that reacts with the thermoplastic resin film 1, the functional group of the thermoplastic resin film 1 and the functional group of the molecular bonding agent 4 bond with each other. As shown in FIG. 4 and FIG. 5, a state in which the molecular bonding agent 4 is bonded to the surface of the thermoplastic resin film 1 is obtained. Although FIG. 4 illustrates the molecular bonding agent 4 in layers for easy understanding, in actuality, it exists in a nano level state (the thickness of the molecular bonding agent 4 is several nm) as shown in FIG. And very thin compared to other materials. Therefore, the molecular bonding agent 4 may be omitted in FIG. Further, straight lines extending in the upper and lower direction of the molecular bonding agent 4 in FIG. 5 indicate functional groups, and more specifically, a state in which the straight lines extending toward the thermoplastic resin film 1 are combined with the functional groups of the thermoplastic resin film 1 The functional group of the molecular bonding agent 4 is shown, and the straight line extending on the opposite side to the thermoplastic resin film 1 shows the functional group of the molecular bonding agent 4 that will react with the metal of the first metal film 3.

Next, the thermoplastic resin film 1 subjected to the molecular bonding treatment is impregnated with a catalyst solution (Sn—Pd colloid aqueous solution) (FIG. 6). Here, the Sn—Pd colloid is electrically adsorbed on the surface of the thermoplastic resin film 1. Thereafter, when the thermoplastic resin film 1 in a state where the Sn—Pd colloid is supported on the surface is impregnated into the accelerator solution, the Sn covering Pd is removed, and the Pd ion is changed to metal Pd (FIG. 7). That is, the catalyst treatment is performed to cause the thermoplastic resin film 1 to carry a catalyst (for example, Pd). In addition, as the accelerator solution, sulfuric acid (concentration: 10%) containing oxalic acid (about 0.1%) can be used. Thereafter, the thermoplastic resin film 1 supporting Pd as a catalyst is immersed in the electroless plating bath for 5 minutes, for example. By the immersion, for example, copper is deposited using Pd as a catalyst, and the deposited copper is bonded to the molecular bonding agent 4 (FIG. 8). Here, since the molecular bonding agent 4 also has a functional group (second functional group) that reacts with the metal of the first metal film 3, the end portion of the molecular bonding agent 4 bonded to the thermoplastic resin film 1 The metal is chemically bonded to the end (the second functional group) located on the opposite side to that using a catalyst. Subsequently, the thermoplastic resin film 1 is subjected to heat treatment at 150 ° C. for 10 minutes to terminate the chemical bond between the molecular bonding agent 4 and the metal, and as shown in FIG. 9, the surface of the thermoplastic resin film 1 The formation of the first metal film 3 (that is, the molecular bonding between the thermoplastic resin film 1 and the first metal film 3) is completed so as to cover the above.

Here, the above-mentioned molecular bonding agent 4 is a chemical for chemically bonding a resin and a metal or the like, and a functional group bonding to a resin and a functional group bonding to a metal are present in one molecular structure. It is Further, the molecular bonding technology is a technology for chemically bonding a resin, a metal or the like by using a molecular bonding agent 4 having such a structure. And, these molecular bonding agents, and molecular bonding techniques are described in more detail in Japanese Patent No. 04936344, Japanese Patent No. 05729852, and Japanese Patent No. 05083926.

In the present embodiment, copper is used as the metal of the first metal film 3, and as shown in FIG. 10, electroless plating is generated in the form of particles, and the first metal film 3 is formed in the porous state by the copper particles 3a. Be done. Here, the porous state does not have a film thickness in which the first metal film 3 is completely formed on the film, but at least a part of particles is not in contact with each other, but at least a part of them contact each other. (It does not necessarily mean that electrical conduction is necessary, and it may be conducted with a second metal film described later even if the distance between particles is separated by three-dimensional molding). In other words, in the present embodiment, copper is deposited in the form of particles 0.02 μm or more and 0.20 μm or less to form the first metal film 3 having a film thickness capable of transmitting light. . The reason for adjusting the state (that is, the film thickness) of the first metal film 3 in this way is that when the first metal film 3 is formed in a complete film shape that does not transmit light, it will be This is because, even if a crack is generated in the first metal film 3, repair of the crack becomes difficult also by the second metal film described later. More specifically, when the first metal film 3 is thinner than 0.02 μm, the contact between the resin and copper decreases and the adhesion decreases, and the distance between the particles after being stretched becomes too large to be described later. Repair of continuity in In addition, when it is stretched in the light transmitting state, the cracks are small because the distance between the particles is only large, but if it is stretched in a complete film shape which does not transmit the light, the metal film (first metal film 3) ) Is cracked to form a wide crack. In FIG. 10, only one particle 3a is shown to be present in the film thickness direction of the first metal film 3. However, if the first metal film 3 is porous, a plurality of particles 3a are formed. May be stacked in the film thickness direction.

The process of forming the first metal film 3 in a porous form will be described in more detail below. When copper deposition is further continued from the state where copper has started to be deposited as shown in FIG. 8, newly deposited copper is combined with the molecular bonding agent 4 or with copper already deposited and reacting with the molecular bonding agent 4. Bond metal. At this time, since the activity of Pd, which is a catalyst, is higher due to the autocatalytic action of copper, the formation of copper proceeds in the surface direction (that is, the direction of spreading on the surface of the thermoplastic resin film 1). It also starts to move in the direction (that is, the film thickness direction of the first metal film 3). Then, when the autocatalysis of copper starts, copper is sequentially deposited to promote metal bonding between the coppers, and copper growth proceeds in the thickness direction, and the film thickness is increased. In this state, as shown in FIG. 11, although there is a void where copper does not exist and there is a part where electric conduction is not obtained, the formed metal film as a whole is electrically Electrical continuity is obtained because the connection path exists. As described above, such a state is referred to as a porous state in the present embodiment. And, in such a porous first metal film 3, even if the elongation at break of copper is exceeded, large cracks do not occur, and the distance between the copper molecules is only partially extended. .

Further, in the present embodiment, since the thermoplastic resin film 1 and the first metal film 3 are chemically bonded via the molecular bonding agent 4, the interface between the thermoplastic resin film 1 and the first metal film 3 is While smoothing, both members can be firmly joined. As a result, it is not necessary to form asperities on the surface of the thermoplastic resin film 1, and the manufacturing process can be simplified, the manufacturing cost can be reduced, and the definition of the wiring circuit to be formed can be enhanced. In addition, the molecular bonding agent to be used is not limited to one type, For example, the molecular bonding agent 4 and another molecular bonding agent having a functional group that reacts with the molecular bonding agent 4 and the first metal film 3 are mixed. Depending on the materials of the thermoplastic resin film 1 and the first metal film 3, other process conditions may be appropriately changed.

Further, the material of the first metal film 3 is not limited to copper, and, for example, various metals such as silver, gold, or nickel, or an alloy containing at least one of these metals and copper, or each metal A laminate may be used, but it is preferable to use a metal that is relatively soft and high in breaking elongation strength. Here, since the film thickness for realizing the light transmitting and conducting state differs depending on the metal used, when other metals are used, the first metal film 3 is formed in a porous state. The film thickness is to be appropriately adjusted so as to realize the above.

Furthermore, the method of forming the first metal film 3 is not limited to the method using the above-described molecular bonding technique, and it is possible to form the first metal film 3 in a porous state, for example, sputtering, vapor deposition, Alternatively, film formation techniques such as wet plating other than the method using molecular bonding may be used. And about formation of the 1st metal film 3, you may select the optimal film-forming technique according to the metal material to be used.

In the present embodiment, the first metal film is coated so as to cover the first surface 1 a and the second surface 1 b of the thermoplastic resin film 1 and the side surface 1 c of the thermoplastic resin film 1 exposed by the through holes. Although 3 was formed, the first metal film 3 is formed only on either the first surface 1 a or the second surface 1 b of the thermoplastic resin film 1 depending on the structure and characteristics of the three-dimensional wiring substrate required. You may form. That is, the three-dimensional wiring board of the present invention includes not only one in which a wiring pattern is formed on both sides but also one in which a wiring pattern is formed only on one side.

Next, as shown in FIG. 12, the first metal film 3 is patterned by photolithography to form a desired wiring pattern (pattern formation step). Specifically, a resist film is thermocompression-bonded on the surface of the thermoplastic resin film 1 in a flat state before three-dimensional molding in a state in which the first metal film 3 is formed, and a mask film on which a predetermined pattern is printed Exposure and development are performed using Subsequently, the first metal film 3 is etched using the developed resist film as an etching mask to form a desired wiring pattern. Thereafter, the resist film is peeled and removed. Here, it is preferable to adjust the shape of the wiring pattern (wiring width, wiring length, wiring interval, etc.) in consideration of the elongation and deformation of the first metal film 3 due to three-dimensional molding described later.

As described above, since the first metal film 3 is patterned by photolithography, it is possible to realize a pattern with a higher definition than patterning using the inkjet printing technique or the gravure offset printing technique. That is, the first metal film 3 has a resolution higher than that of a wiring pattern patterned using an inkjet printing technique, a gravure offset printing technique, or the like (that is, excellent in linearity and high definition wiring formation is realized). )Become.

Next, the thermoplastic resin film 1 in a state in which the first metal film 3 is formed is subjected to heat treatment and pressure treatment to perform three-dimensional molding (first three-dimensional molding process). As a specific first three-dimensional molding process, first, the thermoplastic resin film 1 is positioned with respect to the mold 11 for molding using the positioning holes described above. This is for aligning the molding position and the wiring pattern position. That is, as shown in FIG. 13, the thermoplastic resin film 1 is disposed between the upper mold 12 and the lower mold 13 of the mold 11. Subsequently, as shown in FIG. 14, the upper mold 12 is heated by the upper heating device 14, and the lower mold 13 is heated by the lower heating device 15. Here, in the present embodiment, since the polyimide film is used for the thermoplastic resin film 1, the heating temperature is adjusted within the range of 270 ° C. to 350 ° C. (eg, 300 ° C.) higher than the glass transition temperature of the material. However, depending on the material of the thermoplastic resin film 1, the heating temperature is appropriately adjusted. Here, the heating temperature needs to be equal to or higher than the glass transition temperature and equal to or lower than the heat resistance temperature of the thermoplastic resin film 1, but it is preferable to set the temperature as low as possible within the range. This is to reduce the decrease in adhesion of the first metal film 3 formed on the thermoplastic resin film 1 and the thermoplastic resin film 1 due to heating.

While performing the heat treatment, the upper mold 12 and the lower mold 13 are brought close, and the pressing process is performed on the thermoplastic resin film 1 from above and below under a desired pressure (for example, 10 MPa) (FIG. 15). The desired pressure is appropriately adjusted in consideration of the fact that the material of the thermoplastic resin film 1 and the desired three-dimensional molding become difficult if the pressure is too weak. Then, after completion of the pressing process, the thermoplastic resin film 1 is taken out of the mold 11 (FIG. 16), and the three-dimensional molding of the thermoplastic resin film 1 is completed. In other words, the formation of the first base 16 for a three-dimensional wiring substrate is completed. The first metal film 3 is not shown in FIGS. 13 to 16. In addition, although depending on the required three-dimensional shape, the actual shape of the three-dimensional wiring substrate is to be formed with a plurality of asperities, so the mold 11 also has a plurality of asperities, and the upper mold 12 and A structure may be employed in which a plurality of concavities and convexities with the lower mold 13 are fitted to each other.

As shown in FIG. 17, in the thermoplastic resin film 1 (that is, the first base material 16 for a three-dimensional wiring substrate) which has been three-dimensionally molded, a crack 17 is generated in a bent portion 1 d which is bent by three-dimensional molding. It is easier. Here, as shown in FIG. 18, the crack 17 is a gap formed by an increase in the distance between particles of copper particles 3 a constituting the first metal film 3, and it is a complete metal film that does not transmit light. The structure is different in comparison with the crack caused by the metal film being stretched in. Cracks may not occur depending on the film formation state of the first metal film 3 and the three-dimensional shape by three-dimensional molding. Further, as shown in FIG. 18, while the cracks 17 in the thermoplastic resin film 1 are stretched, the inter-particle distance of the first metal film 3 is expanded accordingly, but the first metal film 3 is Because it is formed in a porous shape, the depth of the crack 17 itself is very small, equal to the size of the particle 3a, and compared with the case where the first metal film 3 is formed in a complete film shape. The width of the crack 17 also decreases. That is, the first base 16 for a three-dimensional wiring substrate according to the present embodiment makes it possible to easily repair the crack 17 as compared with the case where the first metal film 3 is formed in a complete film shape. It is in the state of In other words, when stretched in the light transmitting state, the cracks 17 (the gaps between the particles) are small because the distance between the particles is only large, but when stretched in a complete film shape that does not transmit the light, the limit is exceeded. In the metal film, cracks occur and wide cracks are generated.

Further, as a method of reducing the occurrence of the cracks 17 in the bent portion 1d, the above-described three-dimensional molding may be performed in a state in which the thermoplastic resin film 1 is sandwiched by two protective films. Thereby, the shape of the corner portion 1 e in the bent portion 1 d can be slightly smoothed, and the generation of the crack 17 can be suppressed. Here, the protective film is preferably formed of the same material as the thermoplastic resin film 1. Furthermore, as a method of reducing the occurrence of the cracks 17 in the bending portion 1d, the shape of the corner portion 1e in the bending portion 1d is curved or the angle is made smaller than 90 degrees (for example, 75 degrees to 85 degrees) Alternatively, the mold 11 may be designed.

In the present embodiment, although the thermoplastic resin film 1 is subjected to press processing from above and below using the upper mold 12 and the lower mold 13, the uniformity of the thickness of the thermoplastic resin film 1 after heat pressing As long as it can ensure, you may use other press processing methods, such as a vacuum press or a pneumatic press.

Next, a second metal film 21 is formed to cover the surface of the first metal film 3 of the first base 16 for a three-dimensional wiring substrate (second metal film forming step: FIG. 19). In this embodiment, a metal is additionally deposited on the surface of the first metal film 3 by general electroless plating.

As a specific second metal film forming step, first, in order to remove the oxide layer formed on the surface of the first base 16 by heating in the molding step, the first base 16 may be washed with a desired cleaning solution (for example, Soak in acid degreasing solution, sulfuric acid solution). Subsequently, the catalyst treatment is carried out to cause the first metal film 3 of the first substrate 16 to react with a catalyst of a type to be substituted for the first metal film 3 (for example, Pd catalyst). Immerse in electrolytic plating solution. Then, the metal is selectively deposited only on the periphery of the first metal film 3 on the surface of which the catalyst is present, and the metal does not become the wiring circuit (that is, the exposed region of the thermoplastic resin film 1) Is not deposited, and the additional patterning of the second metal film 21 is not necessary.

In the present embodiment, copper is used as the metal of the second metal film 21, and as can be seen from FIGS. 20 and 21, a plurality of copper particles 21a are deposited on the particles 3a of the first metal film 3. . Here, the second metal film 21 is formed in a complete film shape without being formed in a porous shape. In particular, in the present example, the second metal film 21 having a film thickness of 5 μm or more could be formed by immersion for 1 hour. Further, in the present embodiment, the particles 21 a constituting the second metal film 21 grow around the particles 3 a constituting the first metal film 3, and the thickness direction of the second metal film 21 and the thickness thereof The same growth occurs in the direction orthogonal to the direction (the planar direction of the second metal film 21). Thereby, the second metal film 21 can be formed so as to repair the cracks 17 of the first metal film 3 generated by three-dimensional molding. That is, the formation of the second metal film 21 recovers the conduction failure due to the crack 17 and forms a wiring circuit (a conductor layer formed of the first metal film 3 and the second metal film 21) capable of realizing reliable conduction. can do. Here, since repair of the crack 17 by the second metal film 21 can repair the width of the crack 17 about twice as large as the film thickness of the second metal film 21, the film thickness of the second metal film 21 is assumed. The thickness may be adjusted to 1/2 or more of the maximum width of the crack 17 or, more preferably, may be adjusted to the same thickness as the width of the crack 17. The second metal film 21 is also formed on the side surface 1 c of the through hole 2 in the same manner as the surface layer, and the conduction can be restored even if there is a conduction failure on the front and back due to the through hole 2 temporarily.

Furthermore, in the present embodiment, although the layer thickness (wiring pattern thickness) of the conductor layer required as the wiring circuit (wiring pattern) is insufficient at the film thickness of the first metal film 3, the second metal film 21 is used. By forming, the required layer thickness of the said conductor layer is securable.

In the present embodiment, the second metal film 21 is formed by electroless plating, but if the second metal film 21 can be finally formed only on the surface of the first metal film 3, other film formation is possible. Techniques (eg, electrolytic plating, application of conductive ink, etc.) may be used. However, in the case of forming the second metal film 21 by electroless plating as in this embodiment, it is possible to form an independent wiring, that is, even when the wiring circuit is electrically separated from the outer peripheral portion of the molded body. However, in the case of forming the second metal film 21 by electrolytic plating, it is necessary that all the wirings are electrically conducted to the outer peripheral portion of the molded body, and it is considered in design including the installation of the feeders. It will be necessary. Further, in this case, when a nonconductive portion is generated by three-dimensional molding, the second metal film 21 can not be formed because electricity does not flow from the nonconductive portion.

The material of the second metal film 21 is not limited to copper, and other metals such as nickel or nickel chromium, nickel copper, gold, or silver, or alloys containing these may be used. The material can be appropriately adjusted according to the required properties and reliability.

After passing through the above-described manufacturing process, the surface of the second metal film 21 is treated with a rust inhibitor to form a wiring pattern 22 having a laminated structure in which the first metal film 3 and the second metal film 21 are laminated. At the same time, the production of the second base material 30 for three-dimensional wiring composed of the thermoplastic resin film 1 and the wiring pattern 22 is completed. Here, the difference between the first base material 16 and the second base material 30 is only the presence or absence of the second metal film 21, and the second base material 30 corresponds to a three-dimensional molding for forming the three-dimensional wiring substrate. . That is, the three-dimensional molded object preparation step is completed by the above-described steps.

As can be seen from FIGS. 19 to 21, in the second base material 30 according to the present example, the cracks generated in the first metal film 3 formed in a porous shape on the surface of the thermoplastic resin film 1 are the first metal It is reliably repaired by the second metal film 21 formed to have a film thickness larger than that of the film 3 and has excellent reliability in which the disconnection of the wiring pattern 22 is prevented. Further, according to the manufacturing method described above, a finer wiring pattern (for example, L / S = 30/30 μm) can be realized more easily than the MID substrate, and miniaturization and cost reduction can also be realized. There is.

Then, as shown in FIG. 22, the second base material 30 finally formed has different dimensions (ie, heights) in the Z direction at respective positions in the X direction and the Y direction, and the XY plane The unevenness is formed in the. FIG. 22 is a schematic view for explaining the three-dimensional shape of the second base material 30, and the wiring pattern 22 and the through holes are omitted.

Next, as shown in FIG. 23, the photosensitive material is spray-coated on the second base material 30, and the front and back surfaces of the second base material 30 (ie, the first surface 1a side of the thermoplastic resin film 1 and The protective film 31 is formed on the second surface 1 b side) (protective film forming step). Specifically, first, a curing agent and a solvent are mixed in a predetermined ratio with a photosensitive resin ink (a negative photoresist) as a main material, and stirring is performed for 30 minutes. The mixing and stirring are performed in a yellow room in which light of a specific wavelength is cut, thereby preventing the progress of curing of the photosensitive resin ink. Subsequently, the photosensitive resin ink (that is, the photosensitive material) after being mixed and stirred is filled in an airbrush. The air brush may be a relatively large coating device used at mass production level, or may be a small one used for general model production. Thereafter, the photosensitive material is spray-coated uniformly on the front and back surfaces of the second base material 30 while being rotated 360 degrees while adjusting the angle at which the second base material 30 is sprayed. The reason for adjusting such a spray angle is that the spray from the vertical direction is not applied to the surface close to the vertical of the stepped portion or becomes thinner. By such spray coating, the photosensitive material can be reliably applied to the uneven portion of the second base 30 and the vicinity thereof, and the entire surface of the three-dimensionally shaped second base 30 can be uniformly coated. Can be coated with a photosensitive material.

In addition, about application | coating of the above-mentioned photosensitive material, the application | coating of a photosensitive material is divided into multiple times little by little and thinly coats, without applying the photosensitive material of the thickness required at once, and a photosensitive material is applied after each application. It is preferable to dry. In other words, it is preferable to form the protective film having a desired film thickness by repeating the spray application and the drying of the photosensitive material on the second substrate 30 a plurality of times while changing the angle and direction. This is because when a large amount of photosensitive material is applied at one time, application unevenness easily occurs in the concave and convex portions of the second base material 30, and the uniformity of the protective film 31 is reduced.

Next, predetermined heat treatment is performed on the second base material 30 in a state in which the protective film 31 is formed, and temporary curing of the applied photosensitive material is performed. Although the conditions of the said heat processing change with photosensitive materials used, heat processing are performed on the conditions (for example, 30 minutes at 80 degreeC) which the adhesiveness of a photosensitive material lose | eliminates substantially.

Next, a three-dimensionally formed exposure mask film corresponding to the second substrate 30 is prepared (exposure mask film preparation step). Specifically, known resin films 32 and 33 such as polyethylene terephthalate, which are main components of the exposure mask film, are prepared (FIG. 24). As conditions of the resin film used here, it is necessary to transmit the ultraviolet wavelength for exposure, and to have a breaking elongation that can correspond to three-dimensional molding. Further, in the present embodiment, although the film thickness of the resin films 32 and 33 used as the exposure mask film is about 50 μm, it can be adjusted within the range of about 25 μm to 100 μm. The reason why the film thickness is adjusted to such a thickness is that if the film thickness is too large, three-dimensional molding of the resin films 32 and 33 becomes difficult, and the second substrate 30 does not conform to the surface shape of the second substrate 30 This is because the reduction in adhesion may lead to a reduction in exposure resolution. The material of the exposure mask film is a thermoplastic resin film, a thermosetting resin film, or a thermosetting resin and a thermoplastic resin, which has a required breaking elongation (at least 50% or more, preferably 100% or more). The material may be selected appropriately from the viewpoint of ease of three-dimensional molding and repeated use of the exposure mask film.

Subsequently, as shown in FIG. 25, a black ink is applied on the surface of each of the resin films 32 and 33 by inkjet printing, screen printing, or the like printing method, and is irradiated at the time of exposure described later A light shielding portion 34 for shielding light is formed. Although a photomask film exposed to light and developed by exposing a silver salt photosensitive film on a general polyethylene terephthalate sheet may be used, the thickness of the photomask film coated with a commercially available silver salt photosensitive film may be used. Is as thick as about 150 to 200 μm, and the shape in the three-dimensional molding described later is difficult to reflect the mold shape and difficult to conform to the surface shape of the second substrate 30, and adhesion at the time of exposure is difficult. In the present embodiment, the formation position of the light shielding portion 34 is adjusted in correspondence with the opening formation position of the protective film 31. At this time, alignment marks corresponding to positioning pins provided on a mold used at the time of three-dimensional molding described later are also formed. Here, it is preferable that the black ink which is the material of the light shielding portion 34 be relatively flexible and stretchable. The reason why the ink having such characteristics is preferable is that, when three-dimensional molding described later is also performed on the formation region of the light-shielding portion 34, generation of cracks in the light-shielding portion 34 accompanying the three-dimensional molding is prevented. It is for. And although the thickness of the light shielding part 34 can be adjusted in the range which can light-block the light irradiated in the case of the exposure mentioned later reliably, in consideration of the crack generation accompanying solid molding, it is as thin as possible It is preferable to do. The lands of the three-dimensional wiring board and the resist opening corresponding to the land do not exist in the step, but the slope of the flat portion or an angle close to the flat portion, a curved surface, and the resist opening to the surface including the minute step It is assumed that the formation is limited, and it is necessary to design such a substrate. As a result, the black ink applied to the light shielding portion is basically limited and applied to a portion corresponding to a flat surface or an inclined surface having an angle close to the flat surface, a curved surface, or a surface including these minute step portions. Therefore, the application to the portion corresponding to the level difference which is likely to break due to elongation is basically not performed. In addition, as a material of the light shielding portion 34, ink or the like of another color may be used as long as the light irradiated in the exposure described later can be surely shielded.

After the formation of the light shielding portion 34, the resin films 32 and 33 are subjected to a heat treatment and a pressure treatment to perform a second three-dimensional molding. For example, the second three-dimensional molding is performed in the same manner as the first three-dimensional molding process (shown in FIGS. 13 to 16) for the thermoplastic resin film 1, and the mold 11 is used and a desired pressure (for example, , 10 MPa) is performed. Heating may be performed as necessary, but in any case, the temperature is equal to or less than the glass transition temperature of the resin ink used for the resin films 32 and 33 and the light shielding portion 34. When the film thickness is thin, it may be normal temperature without heating. In the present embodiment, a release film having a thickness substantially equal to that of the second base material 30 is prepared, and the above-described pressure treatment is performed while the release film is held by the resin films 32 and 33. Become. At this time, an opening is formed in the above-described alignment mark, and the positioning pin provided on the mold 11 is inserted into the opening, and accurate positioning is performed. After such pressure treatment, three-dimensional molding of the resin film 33 is performed corresponding to the shape on the first surface 1 a side of the thermoplastic resin film 1, and the exposure mask film 35 is completed. The three-dimensional molding of the resin film 32 is performed corresponding to the shape on the second surface 1 b side, and the exposure mask film 36 is completed.

The three-dimensional molding of the resin films 32 and 33 may be performed by three-dimensionally molding the resin films 32 and 33 in a shape corresponding to the second substrate 30, and the mold 11 used for the three-dimensional molding of the thermoplastic resin film 1. You may use another mold. Alternatively, the resin films 32 and 33 may be independently three-dimensionally molded without being simultaneously three-dimensionally molded.

Next, as shown in FIG. 27, the exposure mask films 35 and 36 are disposed so as to cover the protective film 31 (exposure mask film placement step). More specifically, the exposure mask film 35 is disposed on the second surface 1b side of the thermoplastic resin film 1 (second base 30), and the exposure mask film 36 is formed of the thermoplastic resin film 1 (second base 30). ) And the second base material 30 sandwiches the two exposure mask films 35 and 36. The exposure mask films 35 and 36 may not be in complete contact with the second base material 30 at the time of the arrangement. In the exposure mask film disposing step, the light shielding portions 34 of the exposure mask films 35 and 36 are disposed in contact with the protective film 31. In other words, the surface on which the light shielding portion 34 is formed, which is the surface of the exposure mask films 35 and 36, is disposed on the side of the protective film 31. By such an arrangement, the light shielding portion 34 and the protective film 31 are in direct contact with each other, so that the wraparound of light for exposure is reduced, and it is possible to perform exposure with higher accuracy. The formation side of the light shielding portion 34 may not be located on the protective film 31 side as long as the resin films 32 and 33 can be made extremely thin to reduce the wraparound of light for exposure to a certain extent. At this time, it is necessary to align the land opening position of the wiring pattern on the second base material 30 with the position of the light shielding portion of the exposure mask films 35 and 36, but since both are three-dimensionally formed, Inevitably alignment is made.

Next, as shown in FIG. 28, the vacuum degassing bag (vacuum packaging bag) 37 used for vacuum degassing of the second base material 30 with the exposure mask films 35 and 36 arranged on the front and back surfaces. Interpolate to The vacuum degassing bag 37 needs to have a characteristic of at least transmitting light for exposure in order to perform an exposure process described later. Although a general disposable polyethylene bag is used for the vacuum degassing bag 37 of this embodiment, it can transmit light for exposure, and the exposure mask films 35 and 36 are formed by vacuum degassing. As long as the second base material 30 can be firmly adhered, bags made of other materials may be used. In the present embodiment, although the thickness of the vacuum degassing bag 37 is 50 μm, it can be adjusted, for example, in the range of 25 to 100 μm. In particular, by using a thin vacuum degassing bag 37, the vacuum degassing bag 37 can be made to follow the fine irregularities of the second base material 30 at the time of vacuum degassing. On the other hand, the exposure mask films 35 and 36 can be adhered more reliably and precisely.

Subsequently, as shown in FIG. 29, the air in the vacuum degassing bag 37 is exhausted and vacuumed, and the vacuum degassing bag opening end 37a of the vacuum degassing bag 37 is further subjected to a heat treatment. The seal portion 38 is formed. When performing such vacuum degassing and seal part formation, a general vacuum degassing packing apparatus will be used. As types of the vacuum degassing packing apparatus, there are a relatively inexpensive apparatus for degassing by inserting an exhaust nozzle into the vacuum degassing bag 37, and a relatively expensive apparatus provided with a vacuum chamber, In view of the adhesion between the second substrate 30 and the exposure mask films 35, 36, it is preferable to use the latter device.

The vacuum degassing step is completed by the insertion of the second base material 30 into the vacuum degassing bag 37 and the vacuum degassing of the vacuum degassing bag 37, and the second base material 30 is completed. The exposure mask films 35 and 36 are in close contact with each other in a state where the ink resist openings in the lands and the light shielding portions 34 of the exposure mask films 35 and 36 are aligned.

Next, the second base material 30 in the state of being inserted into the vacuum degassing bag 37 is put into the exposure apparatus. Thereafter, as shown in FIG. 29, exposure is performed by irradiating the protective film 31 with light of a predetermined wavelength on the front and back sides through the vacuum degassing bag 37 and the exposure mask films 35, 36 (exposure step) . In the present embodiment, ultraviolet light having a wavelength of 365 nm is used as light for exposure, and irradiation is performed at 250 mJ on one side. Further, it is preferable that the exposure amount be slightly larger than the exposure amount designated by the material of the protective film 31. This is because the decrease in the exposure amount by the vacuum degassing bag 37 occurs, and the exposure amount is measured and adjusted. The wavelength of the light for exposure and the amount of exposure can be appropriately changed depending on the material of the protective film 31. It is possible to increase the resolution of exposure by using collimated light instead of scattered light as light used for exposure. The exposure may be performed simultaneously on both sides or each side. In the case where the portion close to the vertical of the step portion is exposed, there is a possibility that the exposure amount may become insufficient, but the land of the three-dimensional wiring substrate and the resist opening portion matched thereto do not exist in the step portion, and the flat portion It is premised to be limited to the formation of the resist opening on the inclined surface having an angle close to the flat portion, a curved surface, and a surface including these minute step parts, and it is necessary to design such a substrate.

Next, the vacuum state of the vacuum degassing bag 37 is released, the second base material 30 is taken out from the vacuum degassing bag 37, and the exposure mask films 35 and 36 are removed from the second base material 30. Under the present circumstances, since the exposure mask films 35 and 36 are not affixed with respect to the 2nd base material 30 using an adhesion member etc., they can be easily removed from the 2nd base material 30. FIG. And the said exposure mask films 35 and 36 can be repeatedly used with respect to the other 2nd base material 30. FIG. Subsequently, development processing is performed on the second base material 30 in a state in which the protective film 31 is formed. In the present embodiment, 1% sodium carbonate solution is sprayed on the protective film 31. By such development processing, as shown in FIG. 30, a portion not in contact with the light shielding portion 34 remains on the protective film 31 mainly made of a negative type photoresist, and is in contact with the light shielding portion 34. The ink solder resist opening 39 is formed in the portion where it was formed (opening forming step). That is, the ink solder resist opening 39 is formed by photolithography (exposure and development), and is positioned with high accuracy with respect to the area where the wiring pattern 22 is to be exposed.

Through the above-described steps, a three-dimensional wiring board 40 which is a kind of three-dimensional molded component as shown in FIG. 30 is completed. As shown in FIG. 30, in the three-dimensional wiring substrate 40, the portion other than the region where the wiring pattern 22 is to be exposed is reliably covered by the protective film 31, and the wiring used for electrical connection such as component mounting. A part of the area (such as a land) of the pattern 22 is exposed reliably and accurately by the ink solder resist opening 39. As a method of opening the ink resist, there is a method of removing the resist ink by irradiating it with YAG laser or the like, but in this case, there is no problem even if the laser is irradiated under the protective film 31 irradiated with the laser light. It needs to be a copper pattern. The reason is that if the ink resist without the underlying copper pattern is irradiated with laser light, the underlying substrate resin is also removed by the laser light and holes are opened, and in the case of this method, the inside is smaller than the land size. It needs to be a partial opening (so-called over resist). However, according to the proposed method, even if the opening is larger than the land size, or the pattern part which is not the land part or the opening without the copper, the design freedom is increased.

As described above, in the present embodiment, since the exposure mask films 35 and 36 can be reliably adhered to the second base material 30 by vacuum degassing using the vacuum degassing bag 37, the subsequent exposure accuracy is It is possible to improve and form the protective film 31 having a desired opening pattern easily and accurately on the second base material 30. In the present embodiment, in particular, the first metal film 3 is formed in a porous state to prevent breakage of the second metal film 21. However, the vacuum degassing bag 37 is used without using a mold. Unwanted stress is not applied to the second metal film 21 by exposure using vacuum degassing, and breakage of the second metal film 21 in the uneven portion of the second base 30 can be further prevented. Further, the vacuum degassing bag 37 is generally used to bring the exposure mask films 35 and 36 into close contact with the second base material 30, and the contact method is also simple vacuum degassing. An expensive exposure apparatus that can be controlled in three dimensions and a mold for close contact are not required, and the three-dimensional wiring substrate 40 can be manufactured at low cost.

Further, in the present embodiment, the photosensitive material which is a photosensitive ink resist is applied without using the resin film, and the ink solder resist opening 39 is formed in the protective film 31 using photolithography. The positional accuracy of the ink solder resist opening 39 with respect to the land of the three-dimensional wiring substrate 40 can be improved. In other words, in the present embodiment, since the photosensitive material can be used, the ink solder resist opening 39 with excellent resolution can be formed.

In the above-described embodiment, the front and back surfaces of the second base material 30 are covered with the protective film 31. However, depending on the state of the second base material 30, the protective film 31 may be covered on only one side. Good. For example, when the wiring pattern 22 is formed only on one side, only the side on which the wiring pattern 22 is formed may be covered.

Further, in the above-described embodiment, the protective film 31 is coated on the surface of the second base member 30 formed by three-dimensionally molding a film-like resin, but the three-dimensional molding covered by the protective film 31 is the present embodiment. It is not limited to such as the second base material 30 of the example. For example, various MID parts (MID substrates) can be selected as a three-dimensional molded product, the protective film 31 according to the present embodiment is coated on the circuit formation surface of the MID parts, and desired openings are obtained with excellent accuracy. It becomes possible to form.

Furthermore, in the above-described embodiment, a negative photoresist is used as the photosensitive resin ink, but a positive photoresist may be used. In this case, the relationship between the formation position and the non-formation position of the light shielding portion of the exposure mask film is reversed as compared with the above-described embodiment.

<Embodiment of the present invention>
In the method of manufacturing a three-dimensional wiring component according to the first embodiment of the present invention, a three-dimensional molding preparation step of preparing a three-dimensional molding having a wiring pattern formed on the surface of a resin substrate; A protective film forming step of spray-coating a hydrophobic material to form a protective film on at least the surface of the three-dimensional molding, and an exposure mask film preparing step of preparing a three-dimensionally formed exposure mask film corresponding to the three-dimensional molding An exposure mask film disposing step of arranging so as to cover the protective film with the exposure mask film; and inserting the three-dimensional molding in a state where the exposure mask film is disposed into a vacuum degassing bag; A vacuum degassing step of bringing the exposure mask film into intimate contact with the protective film, and exposing by irradiating light in a state in which the three-dimensional molded product is inserted in the vacuum degassing bag Degree and, the three-dimensional molding was subjected to a developing process the vacuum degassing bag was taken out, it is to have a, an opening formation step of forming a desired opening in the protective film.

In the first embodiment, since the exposure mask film can be reliably adhered to the three-dimensional molded product by vacuum degassing using a vacuum degassing bag, the subsequent exposure accuracy is improved, and a desired opening pattern is provided. It becomes possible to form a protective film easily and precisely to a three-dimensional object. Moreover, since it is a general vacuum degassing bag used to adhere the exposure mask film to a three-dimensional molded product and the adhesion method is also simple vacuum degassing, it can be controlled in three dimensions. This eliminates the need for an expensive exposure apparatus and a mold for close contact, and makes it possible to manufacture a three-dimensional molded part at low cost.

In the method of manufacturing a three-dimensional wiring component according to the second embodiment of the present invention, in the first embodiment described above, the photosensitive material includes a negative photoresist, and in the exposure mask film preparing step, the exposure mask film Forming a light shielding portion at a position corresponding to the opening on the surface of Thereby, the exposure mask film of a simple structure can be prepared with an easily available material, and the manufacturing cost of a three-dimensional wiring component can be reduced. In addition, by forming such a light shielding portion, the opening of the protective film can be formed more accurately and easily.

In the method of manufacturing a three-dimensional wiring component according to the third embodiment of the present invention, in the second embodiment described above, in the exposure mask film preparation step, the light shielding is performed by inkjet printing or screen printing before three-dimensional molding of the exposure mask film. To form a part. Thereby, the exposure mask film can be more easily prepared, and the manufacturing cost of the three-dimensional wiring component can be reduced. In addition, the light shielding portion can be formed with higher precision, and the opening of the protective film can be formed with higher precision and easily.

In the method of manufacturing a three-dimensional wiring component according to the fourth embodiment of the present invention, in any one of the first to third embodiments described above, the exposure mask film disposing step is a surface of the exposure mask film in the exposure mask film disposing step. The formation surface side is disposed on the protective film side. Thereby, the wraparound of the light for exposure at the time of exposure can be reduced, and the opening formation of the protective film can be performed with higher accuracy.

In the method of manufacturing a three-dimensional wiring component according to the fifth embodiment of the present invention, in any one of the first to fourth embodiments described above, the thickness of the resin film used for the exposure mask film is approximately 25 to 100 μm. It is. As a result, the adhesion between the three-dimensional molded article and the exposure mask film is improved, and it is possible to suppress the decrease in the resolution of exposure.

In the method of manufacturing a three-dimensional wiring component according to the sixth embodiment of the present invention, in any one of the first to fifth embodiments described above, the thickness of the vacuum degassing bag is approximately 25 to 100 μm. As a result, the vacuum degassing bag can be made to follow the fine irregularities of the three-dimensional molded product at the time of vacuum degassing, and the exposure mask film can be more reliably and precisely adhered to the three-dimensional molded product.

In the method of manufacturing a three-dimensional wiring component according to the seventh embodiment of the present invention, in the protective film forming step according to any one of the first to sixth embodiments described above, the spray application and the drying of the photosensitive material are Repeat several times while changing. Thereby, the application nonuniformity of the photosensitive material in the recessed part and convex part of a three-dimensional molded article can be prevented, and it becomes possible to improve the uniformity of a protective film.

In the method of manufacturing a three-dimensional wiring component according to the eighth embodiment of the present invention, in any of the first to seventh embodiments described above, the protective film is formed on the front and back surfaces of the three-dimensional molded article in the protective film forming step. It is. This makes it possible to protect the wiring pattern reliably and precisely even with respect to a three-dimensional object having the wiring pattern on both sides.

A three-dimensional wiring component according to a ninth embodiment of the present invention comprises a three-dimensional molded product having a wiring pattern formed on the surface of a resin substrate, and a protective film made of a photosensitive resin ink and protecting the surface of the three-dimensional molded product. The protective film has an opening corresponding to a region to be exposed of the wiring pattern, and covers the three-dimensional molding along a three-dimensional shape of the three-dimensional molding.

In the ninth embodiment, the protective member for covering the three-dimensional molded product is a protective film made of a photosensitive resin ink, and an opening corresponding to the area where the wiring pattern is to be exposed is formed in the protective film. That is, in the ninth embodiment, the openings can be formed by photolithography, and a finer opening pattern can be formed. In other words, it is possible to realize a low-cost three-dimensional molded component in which a protective film provided with a fine opening pattern is formed with high accuracy.
Further, according to the present invention, it is possible to provide a low-cost three-dimensional molded component in which a protective film having a fine opening pattern is formed with high accuracy.

In the three-dimensional wiring component according to the tenth embodiment of the present invention, in the above-mentioned ninth embodiment, the opening of the protective film is formed by photolithography, and with high accuracy with respect to the exposed area of the wiring pattern. It is being positioned. As a result, it becomes possible to form a fine opening pattern, and a protective film of a three-dimensional molded component can be formed with high accuracy, and cost reduction can be achieved.

The three-dimensional wiring component according to the eleventh embodiment of the present invention is that, in the ninth or tenth embodiment described above, the resin base material is made of a film-like resin having a breaking elongation of 50% or more. As a result, even in a member obtained by three-dimensionally molding a resin film, it is possible to accurately and reliably expose only the region to be exposed of the wiring pattern formed on the surface.

The three-dimensional wiring component according to the twelfth embodiment of the present invention has a layered structure in which the three-dimensional molded product is covered on both sides with two of the protective films in any of the ninth to eleventh embodiments described above. It is. This makes it possible to protect the wiring pattern reliably and precisely even with respect to a three-dimensional object having the wiring pattern on both sides.

The three-dimensional wiring component according to the thirteenth embodiment of the present invention is the first metal according to any of the ninth to twelfth embodiments, wherein the wiring pattern has a porous structure formed by depositing metal in the form of particles. And a second metal film laminated on the first metal film. Thereby, even if a crack occurs in the first metal film, it is repaired by the second metal film, and a wiring circuit having no conduction failure and excellent reliability is realized.

1 Thermoplastic resin film (resin base material)
DESCRIPTION OF SYMBOLS 1a 1st surface 1b 2nd surface 1c side 1d bent part 1e corner 2 through hole 3 1st metal film 3a particle 4 molecular bonding agent 11 mold 12 upper mold 13 lower mold 14 upper heating device 15 lower heating Apparatus 16 first base material 17 crack 21 second metal film 21a particle 22 wiring pattern 30 second base material (three-dimensional molding)
31 Protective film 32, 33 Resin film 34 Light shielding part 35, 36 Exposure mask film 37 Vacuum degassing bag 37a Vacuum degassing bag opening end 38 Sealing part 39 Ink solder resist opening (opening)
40 Three-dimensional wiring board (three-dimensional molded parts)

Claims (13)

1. A three-dimensional molding preparation step of preparing a three-dimensional molding having a wiring pattern formed on the surface of a resin substrate;
   A protective film forming step of spray-coating a photosensitive material on the three-dimensional molded product to form a protective film on at least a surface of the three-dimensional molded product;
   An exposure mask film preparing step of preparing a three-dimensionally formed exposure mask film corresponding to the three-dimensional molding;
   An exposure mask film disposing step of disposing so as to cover the protective film with the exposure mask film;
   A vacuum degassing step of inserting the three-dimensional molded product in a state in which the exposure mask film is disposed in a vacuum degassing bag and vacuum degassing to make the exposed mask film adhere to the protective film;
   An exposure step of irradiating with light and exposing in a state in which the three-dimensional molded product is inserted in the vacuum degassing bag;
   And a step of forming a desired opening in the protective film by taking out the three-dimensional molded product from the bag for vacuum degassing and subjecting it to a development treatment.
2. The photosensitive material comprises a negative photoresist.
   The manufacturing method of the three-dimensional molded component according to claim 1 which forms a shading part on the surface of said exposure mask film and a position corresponding to said opening in said exposure mask film preparation process.
3. The manufacturing method of the three-dimensional molded component according to claim 2, wherein the light shielding portion is formed by inkjet printing or screen printing before three-dimensional molding of the exposure mask film in the exposure mask film preparing step.
4. The said exposure mask film arrangement | positioning process WHEREIN: It is a surface of the said exposure mask film, Comprising: The formation surface side of the said light-shielding part is arrange | positioned to the said protective film side, Manufacture of the three-dimensional molded component of any one of Claims 1-3. Method.
5. The method for producing a three-dimensional molded part according to any one of claims 1 to 4, wherein the thickness of the resin film used for the exposure mask film is 25 to 100 μm.
6. The method for manufacturing a three-dimensional molded part according to any one of claims 1 to 5, wherein the thickness of the vacuum degassing bag is 25 to 100 μm.
7. The method for manufacturing a three-dimensional molded part according to any one of claims 1 to 6, wherein in the protective film forming step, spray application and drying of the photosensitive material are repeated a plurality of times while changing the angle and direction.
8. The method for manufacturing a three-dimensional molded component according to any one of claims 1 to 7, wherein the protective film is formed on the front and back surfaces of the three-dimensional molded product in the protective film forming step.
9. A three-dimensional molded product having a wiring pattern formed on the surface of a resin base material,
   A protective film made of a photosensitive resin ink and protecting the surface of the three-dimensional molding;
   The protective film has an opening corresponding to a region where the wiring pattern is to be exposed, and covers the three-dimensional molding along a three-dimensional shape of the three-dimensional molding.
10. The three-dimensional molded part according to claim 9, wherein the opening of the protective film is formed by photolithography and positioned with high accuracy with respect to the exposed area of the wiring pattern.
11. The three-dimensional molded part according to claim 9 or 10, wherein the resin base material is a film-like resin having a breaking elongation of 50% or more.
12. The three-dimensional molded part according to any one of claims 9 to 11, wherein the three-dimensional molded article has a laminated structure in which both surfaces are covered with two sheets of the protective film.
13. 13. The semiconductor device according to claim 9, wherein the wiring pattern comprises a first metal film having a porous structure formed by depositing metal in the form of particles, and a second metal film laminated on the first metal film. The three-dimensional molded part according to item 1.

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