JP2006228887A - Manufacturing method of rigid and flexible multilayer printed circuit board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent a fluidic adhesive layer from flowing out from an opening onto a flexible region during a step of forming rigid regions in a multilayer structure. <P>SOLUTION: A dam effect region (adhesive hardened region 18) for preventing the adhesive layer 16 on the side of the rigid region R from flowing out to the flexible region F is provided on a boundary between the rigid region R and the flexible region F. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a rigid-flex multilayer printed wiring board and a method for manufacturing the same.

  In recent years, a rigid-flex multilayer printed wiring board having a structure in which multilayered rigid wiring boards are connected by a flexible wiring board has been actively developed (for example, Patent Documents 1 and 2).

  FIG. 13 shows a typical structural example of a rigid-flex multilayer printed wiring board.

  The rigid-flex multilayer printed wiring board is multilayered with a specific region on each of the front and back sides of a double-sided FPC (Flexible Printed Circuit board) 100 as a rigid portion R, and a flexible portion that forms a cable that connects the rigid portions R together except for the multilayered portion. F.

  The double-sided FPC 100 has a conductive pattern layer 102 made of copper foil or the like on both front and back surfaces of a flexible base film 101 made of a polyimide film or the like, and the entire surface thereof is covered with a coverlay film 103.

  The rigid portion R is laminated on a glass epoxy substrate 105 (insulating layer) 105 with a copper foil 106 laminated and adhered to the cover lay film 103 by an adhesive layer (interlayer adhesive layer) 104, and the glass epoxy substrate 105. A build-up resin layer 107 and a surface copper foil 108.

  The rigid-flex multilayer printed wiring board can be mounted with high density by forming the rigid portion R in a multi-layer structure, and since a board (rigid portion R) is connected by a flexible wiring board, no connector or connection cable is required. Furthermore, since the flexible portion F can be bent, a three-dimensional space can be utilized, and the degree of design freedom is improved.

  As described above, the rigid-flex multilayer printed wiring board can realize space saving and high density, and thus has been attracting attention as a substrate that can be used for further miniaturization of electronic devices.

  As a method of manufacturing a rigid-flex multilayer printed wiring board, after laminating a glass epoxy base material and build-up resin on the entire surface of the flexible wiring board to form an outer layer circuit, etc., only the rigid part on the predetermined flexible part is made of gold. There are methods of removing by die punching or laser processing.

  However, in this manufacturing method, if the die punching or laser processing is performed with the strength to cut the rigid part, not only the rigid part but also the flexible part to be left will be cut, and the circuit pattern part will be damaged and the disconnection will occur. Cause. It is practically difficult to select a processing condition for removing only the rigid portion.

  As a manufacturing method overcoming this problem, a method in which a flexible portion corresponding to a flexible portion is laminated with a pre-opened adhesive layer or a glass epoxy base material, and a non-multilayered portion is provided as a flexible portion. (For example, Patent Documents 1 and 2).

  In this manufacturing method, as shown in FIG. 14A, an adhesive layer 202 in which an opening 201 corresponding to a flexible portion formation scheduled portion is formed is laminated on the coverlay film 103 of the double-sided FPC 100, and thereafter As shown in FIG. 14B, a glass epoxy base material 204 similarly having an opening 203 formed thereon is laminated on the adhesive layer 202.

  In this lamination process, since the glass epoxy base material 204 is laminated under heating and pressure through the adhesive layer 202 made of thermoplastic resin, the adhesive layer 202 having fluidity is indicated by reference numeral 202A. In addition, a phenomenon of flowing out on the flexible portion F that is the opening 201 occurs. When the adhesive layer 202A that has flowed out in this way is cured on the flexible portion F, the flexibility of the flexible portion F is lowered, and the bending function that is one of the advantages of the rigid-flex multilayer printed wiring board is hindered.

For this reason, in the conventional manufacturing method, it is necessary to remove the adhesive layer 202A that has flowed out onto the flexible portion F by some method. However, the removal process of the adhesive layer 202A takes extra time and cost. Further, as the adhesive layer 202 flows out, the adhesive 202 becomes thinner, and it becomes difficult to manufacture a rigid-flex multilayer printed wiring board having a predetermined substrate thickness. From the above, it is required to laminate the adhesive layer without flowing out on the flexible part.
JP 2001-156445 A Japanese Patent Laid-Open No. 2002-158445

  The problem to be solved by the present invention is to manufacture a rigid-flex multilayer printed wiring board without causing a fluid adhesive layer to flow out from the opening onto the flexible part during the rigid part multilayering process. is there.

  The rigid-flex multilayer printed wiring board according to the present invention is a rigid-flex multilayer printed wiring board comprising a multilayered rigid portion and a flexible portion forming a connection cable, wherein the boundary is formed between the rigid portion and the flexible portion. It has a dam effect part that prevents the interlayer adhesive on the rigid part side from flowing out to the flexible part side.

  In the manufacturing method of a rigid-flex multilayer printed wiring board according to the present invention, a rigid part base material having an opening corresponding to a flexible part forming scheduled part is laminated on the flexible wiring board by an adhesive layer having an equivalent opening. In the manufacturing method of manufacturing a rigid-flex multilayer printed wiring board by a rigid portion that is multilayered and a flexible portion that forms a connection cable, prior to the step of laminating the rigid portion base material, Including a step of forming a dam effect portion at a portion corresponding to a boundary portion between the rigid portion and the flexible portion in the outer edge portion of the flexible portion forming scheduled portion.

  In the method of manufacturing a rigid-flex multilayer printed wiring board according to the present invention, preferably, the dam effect portion corresponds to a boundary portion between the rigid portion and the flexible portion of the edge portion of the opening of the adhesive layer. It is the adhesive cured part in which the part to be cured is cured.

  In the method of manufacturing a rigid-flex multilayer printed wiring board according to the present invention, preferably, a thermoplastic resin imparted with photocurability is used as the adhesive layer, and the adhesive-cured portion is formed of the rigid portion base material. Prior to the laminating step, light is locally irradiated to a portion corresponding to a boundary portion between the rigid portion and the flexible portion of the edge portion of the opening portion of the adhesive layer, and the opening portion of the adhesive layer A portion corresponding to a boundary portion between the rigid portion and the flexible portion in the edge portion is cured.

  The method of manufacturing a rigid-flex multilayer printed wiring board according to the present invention preferably uses a thermoplastic resin exhibiting thermosetting as the adhesive layer, and the adhesive-cured portion is a step of laminating the base material for the rigid portion. Before, the portion corresponding to the boundary between the rigid portion and the flexible portion of the edge of the opening of the adhesive layer is locally heated, and the edge of the opening of the adhesive layer A portion corresponding to a boundary portion between the rigid portion and the flexible portion is cured.

  In the method of manufacturing a rigid-flex multilayer printed wiring board according to the present invention, preferably, the dam effect portion is formed of a thermoplastic resin imparted with photocurability separately from the adhesive layer.

  In the method of manufacturing a rigid-flex multilayer printed wiring board according to the present invention, preferably, the dam effect portion is formed of a thermoplastic resin that is hardened at a lower temperature than the adhesive layer, separately from the adhesive layer.

  In the rigid-flex multilayer printed wiring board according to the present invention, since there is a dam effect portion that prevents the interlayer adhesive on the rigid portion side from flowing out to the flexible portion side at the boundary portion between the rigid portion and the flexible portion, The adhesive layer having fluidity does not flow out to the flexible part side during the multilayering process, and the original flexibility of the flexible part is ensured.

  Embodiment 1 of the manufacturing method of the rigid-flex multilayer printed wiring board by this invention is demonstrated with reference to FIGS. 1-3.

  As shown in FIG. 1A, a polyimide base material 9 with a double-sided copper foil having a copper foil 12 on both front and back sides of the polyimide film 11 is prepared.

  First, as shown in FIG. 1B, the copper foil 12 is etched (subtractive method) to form a conductor pattern (circuit pattern) 13.

  Next, as shown in FIG. 1C, the coverlay film 14 is laminated by heating and pressurizing under vacuum on the entire front and back surfaces of the polyimide film 11 on which the conductor pattern 13 is formed. . Thereby, a double-sided FPC (double-sided flexible wiring board) 10 is obtained.

  Next, as shown in FIG. 1 (d), an adhesive layer (interlayer adhesive layer) 16 in which an opening 15 corresponding to the flexible portion formation scheduled portion is formed by router processing is formed on the coverlay film 14. Laminate by heating and pressurizing under vacuum. For the adhesive layer 16, a thermoplastic resin imparted with ultraviolet light curability was used.

  Next, as shown in FIG. 1E, a rigid portion R (see FIG. 3) and a flexible portion F (of the edge portion of the opening 15 of the adhesive layer 16 using the optical mask 17 and the flexible portion F ( The ultraviolet light UV is locally irradiated on the edge 15A of the portion corresponding to the boundary with the boundary portion of the opening 15 (see FIG. 3), and the adhesive cured portion (dam effect portion) 18 is formed on the edge 15A of the opening 15.

  Next, as shown in FIG. 2 (f), a glass epoxy base material 21 with a single-sided copper foil provided with a copper foil 20 on one side of a glass epoxy base material 19 is prepared as a rigid part base material. Then, an opening 22 similar to the opening 15 of the adhesive layer 16 is formed in the glass epoxy base material 21 with the single-sided copper foil, and this is heated on the adhesive layer 16 including the adhesive cured portion 18 under vacuum.・ Pressurize and laminate.

  Since the adhesive-cured portion 18 has already been formed at the edge 15A of the opening 15 at the time of this lamination step, the adhesive layer 16 having fluidity is provided at the time of the lamination step of the glass epoxy substrate 21 with a single-sided copper foil. Is about to flow out to the side of the opening 15 by the dam effect of the cured adhesive portion 18. Thereby, the adhesive layer 16 having fluidity is prevented from flowing out to the opening 15.

  Next, as shown in FIG. 2G, the conductor pattern (circuit pattern) 23 is formed by etching (subtractive method) the copper foil 20 of the glass epoxy substrate 21 with the single-sided copper foil. .

  Next, as shown in FIG. 2 (h), an opening 24 similar to the opening 15 of the adhesive layer 16 was formed on the glass epoxy base material 21 with the copper foil on which the conductor pattern had been formed. The buildup resin layer 25 is laminated by heating and pressing under vacuum.

  Next, as shown in FIG. 3 (i), electroless copper plating (not shown) is performed on the laminated build-up resin layer 25, and further, overall panel plating is performed, and then the outer layer is formed by a subtractive method. A conductor pattern 26 was formed.

  As a result, a rigid-flex multilayer printed wiring board is formed by the rigid portions R that are multilayered and the flexible portions F that form the cables that connect the rigid portions R to each other.

  In addition, description about formation of the interlayer connection part by a through hole, a via hole, or the like is omitted.

  In this rigid-flex multilayer printed wiring board, during the laminating process of the glass epoxy base material 21 with the single-sided copper foil, due to the dam effect of the already-cured adhesive-cured portion 18, that is, between the rigid portion R and the flexible portion F. The adhesive cured portion 18 present at the boundary portion functions as a dam effect portion that prevents the interlayer adhesive on the rigid portion R side from flowing out to the flexible portion F side, thereby opening the adhesive layer 16 having fluidity. Since the adhesive layer 16 does not flow out on the flexible portion F because the flow to the side of the portion 15 is prevented, the inherent flexibility of the flexible portion F is ensured, and the rigid-flex multilayer printed wiring There is no hindrance to the folding function, which is one of the advantages of the plate.

  Embodiment 2 of the method for producing a rigid-flex multilayer printed wiring board according to the present invention will be described with reference to FIGS. 4 to 6, parts corresponding to those in FIGS. 1 to 3 are denoted by the same reference numerals as those in FIGS. 1 to 3, and description thereof is omitted.

  Since the steps of FIGS. 4A to 4C are the same as the steps of FIGS. 1A to 1C of the first embodiment, description thereof is omitted.

  As shown in FIG. 4D, an adhesive layer (interlayer adhesive layer) 28 having an opening 27 formed by router processing is heated and pressed under pressure on the cover lay film 14. Laminate. In this embodiment, the adhesive layer 28 is made of a thermoplastic resin provided with a thermosetting function that exhibits thermosetting properties at a high temperature.

  Next, as shown in FIG. 4E, a rigid portion R (see FIG. 6) and a flexible portion F (see FIG. 6) of the edges of the opening 27 of the adhesive layer 28 using the heater 29 are used. The edge portion 27 </ b> A corresponding to the boundary portion with the reference portion is locally heated at a high temperature to form an adhesive cured portion (dam effect portion) 30 on the edge portion 27 </ b> A of the opening portion 27.

  Next, as shown in FIG. 5 (f), a glass epoxy base material 21 with a single-sided copper foil provided with a copper foil 20 on one side of a glass epoxy base material 19 is prepared as a rigid part base material. Then, an opening 22 similar to the opening 27 of the adhesive layer 28 is formed in the glass epoxy substrate 21 with a single-sided copper foil, and this is heated on the adhesive layer 28 including the adhesive cured portion 30 under vacuum.・ Pressurize and laminate.

  Since the adhesive-cured portion 30 has already been formed at the edge 27A of the opening 27 at the time of the laminating step, the adhesive layer 28 having fluidity at the time of the laminating step of the glass epoxy substrate 21 with single-sided copper foil. Is about to flow out toward the opening 27 by the dam effect of the adhesive-cured portion 30. Thereby, the adhesive layer 28 having fluidity is prevented from flowing out to the opening 27.

  Thereafter, as shown in FIGS. 5 (g) to 6 (i), by etching the copper foil 20 of the glass epoxy base material 21 with the single-sided copper foil, a conductor pattern 23 is formed thereon, In addition, the process of forming the outer conductor pattern 26 by laminating the build-up resin layer 25 is the same as the process shown in FIGS. 2 (g) to 3 (i) of the first embodiment.

  Thereby, also in this embodiment, the rigid-flex multilayer printed wiring board by the rigid part R multilayered and the flexible part F which makes the cable which connects the rigid parts R is completed.

  Also in this embodiment, it exists in the boundary part of the rigid part R and the flexible part F by the dam effect of the adhesive hardening part 30 already formed at the time of the lamination | stacking process of the glass epoxy base material 21 with a single-sided copper foil. The adhesive cured portion 30 functions as a dam effect portion that prevents the interlayer adhesive on the rigid portion R side from flowing out to the flexible portion F side, so that the adhesive layer 28 having fluidity moves to the opening 27 side. Since the flow is prevented from flowing out, the adhesive layer 28 does not flow out on the flexible portion F, the original flexibility of the flexible portion F is ensured, and one of the advantages of the rigid-flex multilayer printed wiring board. It does not interfere with the bending function.

  Embodiment 3 of the method for producing a rigid-flex multilayer printed wiring board according to the present invention will be described with reference to FIGS. 7 to 9, portions corresponding to those in FIGS. 1 to 3 are denoted by the same reference numerals as those in FIGS. 1 to 3, and description thereof is omitted.

  Since the steps of FIGS. 7A to 7C are the same as the steps of FIGS. 1A to 1C of the first embodiment, description thereof is omitted.

  As shown in FIG. 7D, among the outer edge portions of the flexible portion formation scheduled portion Fp on the cover lay film 14, the rigid portion R (see FIG. 9) and the flexible portion F (see FIG. 9) An adhesive ridge 31 made of a thermoplastic resin imparted with ultraviolet light curability is formed in a bank shape at a site corresponding to the boundary portion.

  Next, as shown in FIG. 7 (e), an adhesive layer (interlayer adhesive layer) 32 is heated on the coverlay film 14 in the region outside the adhesive ridges 31 under vacuum. Pressurize and laminate. A thermoplastic resin was used for the adhesive layer 32.

  Next, as shown in FIG. 8 (f), the adhesive ridges 31 are cured by irradiating with ultraviolet light UV, and an adhesive cured portion (dam effect portion) is formed on the outer edge portion of the flexible portion formation scheduled portion Fp. ) 33 is formed.

  Next, as shown in FIG. 8G, a glass epoxy base material 21 with a single-sided copper foil provided with a copper foil 20 on one side of a glass epoxy base material 19 is prepared as a rigid part base material. The opening 22 having the same shape as the flexible part formation scheduled part Fp is formed in the glass epoxy base material 21 with the single-sided copper foil, and this is heated on the adhesive cured part 33 and the adhesive layer 32 under vacuum. Pressurize and laminate.

At the time of this lamination process, since the adhesive cured portion 33 has already been formed on the outer edge portion of the flexible portion formation scheduled portion Fp (the portion corresponding to the boundary portion between the rigid portion R and the flexible portion F), a single-sided copper foil is attached. During the laminating process of the glass epoxy base material 21, the adhesive layer 32 having fluidity is prevented from flowing toward the flexible part formation scheduled part Fp by the dam effect of the adhesive hardened part 33. As a result, the adhesive layer 32 having fluidity is prevented from flowing out to the flexible part formation scheduled portion Fp.

  Thereafter, as shown in FIG. 8 (h) to FIG. 9 (j), the conductor pattern 23 is formed by etching the copper foil 20 of the glass epoxy base material 21 with the single-sided copper foil. In addition, the process of forming the outer conductor pattern 26 by laminating the build-up resin layer 25 is the same as the process shown in FIGS. 2 (g) to 3 (i) of the first embodiment.

  Thereby, also in this embodiment, the rigid-flex multilayer printed wiring board by the rigid part R multilayered and the flexible part F which makes the cable which connects the rigid parts R is completed.

  Also in this embodiment, at the time of the laminating process of the glass epoxy base material 21 with the single-sided copper foil, it exists due to the dam effect of the already formed adhesive cured portion 33, that is, at the boundary portion between the rigid portion R and the flexible portion F. The adhesive cured portion 33 functions as a dam effect portion that prevents the interlayer adhesive on the rigid portion R side from flowing out to the flexible portion F side, so that the adhesive layer 32 having fluidity can be formed into the flexible portion forming scheduled portion Fp. Since the adhesive layer 32 does not flow out on the flexible portion F, the inherent flexibility of the flexible portion F is ensured, and the advantages of the rigid-flex multilayer printed wiring board are prevented. There is no hindrance to the folding function.

  Embodiment 4 of the manufacturing method of the rigid-flex multilayer printed wiring board by this invention is demonstrated with reference to FIGS. 10 to 12, portions corresponding to those in FIGS. 1 to 3 are denoted by the same reference numerals as those in FIGS. 1 to 3, and description thereof is omitted.

  Since the steps of FIGS. 10A to 10C are the same as the steps of FIGS. 1A to 1C of the first embodiment, description thereof is omitted.

  As shown in FIG. 10 (d), among the outer edge portions of the flexible portion formation scheduled portion Fp on the cover lay film 14, the rigid portion R (see FIG. 12) and the flexible portion F (see FIG. 12). Adhesive ridges 34 made of a thermoplastic resin exhibiting thermosetting properties in a low temperature region are formed in a bank shape at a portion corresponding to the boundary portion.

  Next, as shown in FIG. 10 (e), an adhesive layer (interlayer adhesive layer) 35 is heated on the coverlay film 14 in the region outside the adhesive protrusion 34 under vacuum. Pressurize and laminate. For the adhesive layer 35, a thermoplastic resin exhibiting thermosetting properties in a high temperature region was used.

  Next, as shown in FIG. 8 (f), a glass epoxy base material 21 with a single-sided copper foil provided with a copper foil 20 on one side of a glass epoxy base material 19 is prepared as a rigid part base material. The opening 22 having the same shape as the flexible part formation scheduled portion Fp is formed in the glass epoxy base material 21 with the single-sided copper foil, and this is heated on the adhesive protrusion 34 and the adhesive layer 35 under vacuum, Pressurize and laminate.

  At the time of this lamination process, the adhesive ridge 34 that is cured at a lower temperature than the adhesive layer 35 is cured before the adhesive layer 35 has fluidity due to the difference in the thermosetting temperature. As a result, the adhesive layer 35 that has been hardened earlier may cause the adhesive layer 35 having fluidity to flow out toward the flexible part formation scheduled part Fp during the laminating process of the glass epoxy substrate 21 with the single-sided copper foil. It is stopped by the dam effect of the strip (dam effect part) 34. Thereby, the adhesive layer 35 having fluidity is prevented from flowing out to the flexible part formation scheduled part Fp.

  Thereafter, as shown in FIG. 11 (g) to FIG. 12 (i), the conductor pattern 23 is formed by etching the copper foil 20 of the glass epoxy base material 21 with the single-sided copper foil. In addition, the process of forming the outer conductor pattern 26 by laminating the build-up resin layer 25 is the same as the process shown in FIGS. 2 (g) to 3 (i) of the first embodiment.

  Thereby, also in this embodiment, the rigid-flex multilayer printed wiring board by the rigid part R multilayered and the flexible part F which makes the cable which connects the rigid parts R is completed.

  Also in this embodiment, during the laminating process of the glass epoxy base material 21 with the single-sided copper foil, due to the dam effect of the adhesive ridge 34 that has been hardened first, that is, the bonding existing at the boundary between the rigid portion R and the flexible portion F. The adhesive ridge 34 functions as a dam effect portion that prevents the interlayer adhesive on the rigid portion R side from flowing out to the flexible portion F side, so that the adhesive layer 35 having fluidity is on the flexible portion formation scheduled portion Fp side. Since the adhesive layer 35 does not flow out onto the flexible portion F, the inherent flexibility of the flexible portion F is ensured, and the advantages of the rigid-flex multilayer printed wiring board are prevented. There is no problem with one folding function.

  In the present invention, as means for opening the adhesive layer and the like, laser processing and die punching can be used in addition to router processing. In addition to the electroless copper plating, the entire panel plating can be performed on the build-up resin by forming a seed layer by sputtering. In addition to the subtractive method, the additive outer layer circuit pattern can be formed by using an additive method.

It is process drawing which shows Embodiment 1 of the manufacturing method of the rigid-flex multilayer printed wiring board by this invention. It is process drawing which shows Embodiment 1 of the manufacturing method of the rigid-flex multilayer printed wiring board by this invention. It is process drawing which shows Embodiment 1 of the manufacturing method of the rigid-flex multilayer printed wiring board by this invention. It is process drawing which shows Embodiment 2 of the manufacturing method of the rigid-flex multilayer printed wiring board by this invention. It is process drawing which shows Embodiment 2 of the manufacturing method of the rigid-flex multilayer printed wiring board by this invention. It is process drawing which shows Embodiment 2 of the manufacturing method of the rigid-flex multilayer printed wiring board by this invention. It is process drawing which shows Embodiment 3 of the manufacturing method of the rigid-flex multilayer printed wiring board by this invention. It is process drawing which shows Embodiment 3 of the manufacturing method of the rigid-flex multilayer printed wiring board by this invention. It is process drawing which shows Embodiment 3 of the manufacturing method of the rigid-flex multilayer printed wiring board by this invention. It is process drawing which shows Embodiment 4 of the manufacturing method of the rigid-flex multilayer printed wiring board by this invention. It is process drawing which shows Embodiment 4 of the manufacturing method of the rigid-flex multilayer printed wiring board by this invention. It is process drawing which shows Embodiment 4 of the manufacturing method of the rigid-flex multilayer printed wiring board by this invention. It is explanatory drawing which shows the general structural example of a rigid-flex multilayer printed wiring board. It is explanatory drawing which shows the problem of the rigid-flex multilayer printed wiring board manufactured by the conventional method.

Explanation of symbols

9 Polyimide substrate with double-sided copper foil 10 Double-sided FPC
DESCRIPTION OF SYMBOLS 11 Polyimide film 12 Copper foil 13 Conductor pattern 14 Coverlay film 15 Opening part 16 Adhesive layer 17 Optical mask 18 Adhesive hardening part 19 Glass epoxy base material 20 Copper foil 21 Glass epoxy base material with single-sided copper foil 22 Opening part 23 Conductor Pattern 24 Opening 25 Build-up resin layer 26 Outer conductor pattern 27 Opening 28 Adhesive layer 29 Heater 30 Adhesive cured portion 31 Adhesive ridge 32 Adhesive layer 33 Adhesive cured portion 34 Adhesive ridge 35 Adhesive layer F Flexible part Fp Flexible part formation scheduled part R Rigid part

Claims (7)

In the rigid-flex multilayer printed wiring board by the rigid part made into a multilayer and the flexible part which makes a connection cable,
The rigid-flex multilayer printed wiring board which has a dam effect part which prevents the interlayer adhesive of the said rigid part side from flowing out to the said flexible part side in the boundary part of the said rigid part and the said flexible part. By laminating a rigid part base material having an opening corresponding to the flexible part formation scheduled part on the flexible wiring board with an adhesive layer having an equivalent opening, a multilayered rigid part and a connection cable are formed. In a manufacturing method for manufacturing a rigid-flex multilayer printed wiring board with a flexible part,
Prior to the step of laminating the rigid portion base material, a step of forming a dam effect portion at a portion corresponding to a boundary portion between the rigid portion and the flexible portion of the outer peripheral portion of the flexible portion forming scheduled portion of the flexible wiring board. A method for producing a rigid-flex multilayer printed wiring board comprising:   3. The rigid according to claim 2, wherein the dam effect portion is an adhesive cured portion obtained by curing a portion corresponding to a boundary portion between the rigid portion and the flexible portion in an edge portion of the opening of the adhesive layer. -Manufacturing method of a flex multilayer printed wiring board.   A thermoplastic resin imparted with photo-curing property is used as the adhesive layer, and the adhesive-cured portion is included in the edge of the opening of the adhesive layer before the step of laminating the rigid portion base material. The portion corresponding to the boundary portion between the rigid portion and the flexible portion is locally irradiated with light, and corresponds to the boundary portion between the rigid portion and the flexible portion in the edge portion of the opening of the adhesive layer. 4. The method for producing a rigid-flex multilayer printed wiring board according to claim 3, wherein a portion to be cured is cured.   A thermosetting thermoplastic resin is used as the adhesive layer, and the adhesive-cured portion is bonded to the rigid portion of the edge of the adhesive layer before the step of laminating the rigid portion base material. A portion corresponding to a boundary portion between the portion and the flexible portion is locally heated, and a portion corresponding to a boundary portion between the rigid portion and the flexible portion of the edge portion of the opening of the adhesive layer is formed. The method for producing a rigid-flex multilayer printed wiring board according to claim 3, which is cured.   The manufacturing method of the rigid-flex multilayer printed wiring board of Claim 2 which forms the said dam effect part with the thermoplastic resin to which photocurability was provided separately from the said adhesive bond layer. The manufacturing method of the rigid-flex multilayer printed wiring board of Claim 2 which forms the said dam effect part with the thermoplastic resin hardened | cured at lower temperature than the said adhesive bond layer separately from the said adhesive bond layer.

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