JP2019192680A - Method for manufacturing rigid multilayer printed wiring board - Google Patents

Abstract

To provide a method for manufacturing a rigid multilayer printed wiring board, capable of eliminating a process for forming a gap portion in a layer that serves as a core, and capable of easily adjusting the film thickness of a rigid multilayer wiring board that is produced by adjusting a stacking position of each of layer constitution materials during a process for stacking the layer constitution materials and also capable of easily adjusting a layer exposed to the outside.SOLUTION: A method for manufacturing a rigid multilayer printed wiring board includes: a resin dam layer formation step of forming one or more resin dam layers made of a resin composition on at least one of an upper face and a lower face of at least one or more conductor layers and at least one selected from an intermediate material, a resin material and a cured product thereof; and a stacking step of stacking a conductor layer and at least one selected from an intermediate material, a resin material and a cured product thereof where the resin dam layer is formed and one or more other conductor layers and at least one selected from an intermediate material, a resin material and a cured product thereof.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a method for manufacturing a rigid multilayer printed wiring board.

With the recent improvement in performance of electronic control devices, the number of electronic components mounted on an electronic circuit mounting board used for this has been increasing. On the other hand, however, the electronic control device is becoming smaller and the space inside the electronic control device is decreasing.
Therefore, also in the electronic circuit mounting substrate, along with the high density mounting of electronic components, efficient utilization of the space in the electronic control device in which the electronic components are incorporated is one of the problems.

As a method for solving the above problems, a method is widely used in which an electronic component is mounted on a flexible printed wiring board or a flexible rigid printed wiring board, and the board is incorporated into an electronic control device in a bent state (patents). Reference 1).
However, many flexible printed wiring boards have high flexibility but low heat resistance and durability, and some resins having special performance are difficult to be made into flexible printed wiring boards.
Further, in the case of a flexible rigid printed wiring board, if the material of the flexible portion and the material of the rigid portion are different, there is a possibility that damage is likely to occur due to a difference in thermal expansion coefficient. Further, as described above, since a resin having special performance may not be used as a material for the flexible portion, it is difficult to produce a substrate having high flexibility and desired characteristics.

  Therefore, a method for manufacturing a bent type rigid printed wiring board has been proposed in which a part of the rigid printed wiring board (multilayer board) is thinned and the part has flexibility (so-called flexibility) (patent) Reference 2).

Japanese Patent Laying-Open No. 2015-8315 International Publication No. 2007/013595

In Patent Document 2, there is a method in which a gap portion is provided in a hard core material, a heat resistant resin layer including the gap portion is laminated on the surface of the core material, and a heat resistant resin layer is laminated on the back surface except for the gap portion. The heat resistant resin material is embedded in the gap portion after the heat resistant resin material is buried in the gap portion, the heat resistant resin layer is laminated on both sides of the core material, and a circuit (conductor layer) is formed thereon. Is disclosed together with the corresponding heat-resistant resin layer and conductor layer.
In the case of such a method, a step of forming a gap portion in the core material is necessary as a premise. In addition, Teflon (registered trademark) sheets, silicon rubber, and the like are listed in paragraph [0016] of Patent Document 2 as materials of the heat-resistant resin material buried in the gap portion of the core material. Is a resin that is difficult to bond (highly releasable). Therefore, depending on the thickness, size, width, etc. of the heat-resistant resin material, for example, when the laminated heat-resistant resin layer is thermocompression bonded, the heat-resistant resin eluted from the heat-resistant resin layer is in contact with the core material in the gap portion. It is easy to enter the gap with the heat-resistant resin material, and there is a possibility that it takes time to remove the heat-resistant resin material. Also, in this case, the heat-resistant resin that has entered the gap between the core material and the heat-resistant resin material may adhere to an undesired part of the design and harden. There is a possibility that the surface of the heat-resistant resin layer must be smoothed by removing objects.

In addition, when removing heat-resistant resin material, when using the method of making a cut in the gap portion to remove the heat-resistant resin material, it is necessary to make a cut in the gap portion according to the thickness of the heat-resistant resin material. Required.
That is, for example, when using a heat-resistant resin material having a thickness of 0.4 mm as exemplified in paragraph [0016] of Patent Document 2, a heat-resistant resin layer having a thickness of 0.1 mm laminated on the back surface of the core material. And the depth of cutting (thickness from the back surface of the copper layer to the surface of the heat-resistant resin material) is very shallow at less than 0.6 mm even when a copper layer having a thickness of 200 μm to 600 μm (see the same paragraph [0017]) is combined. . Therefore, in removing the heat-resistant resin material, a very high processing accuracy is required in order to make a cut without damaging other layer constituent materials constituting the bent rigid printed wiring board.
As described above, in the above method, there is a possibility that the circuit formed on the bending type rigid printed wiring board and other parts may be damaged or damaged when the heat-resistant resin material is taken out, and dust or dust generated at the time of removal is bent. There is a risk of remaining as foreign matter on the rigid-type printed wiring board.

  Here, a heat-resistant resin material made of an amorphous material such as silicon rubber has a property of easily changing its shape during thermocompression bonding of a heat-resistant resin layer or the like. Therefore, when using a heat-resistant resin material made of an amorphous material, the heat-resistant resin eluted from the heat-resistant resin layer during thermocompression can easily enter the gap between the core material and the heat-resistant resin material, and the heat-resistant resin material is removed. Sometimes it may take time to make the position, shape, thickness, etc. of the bent part desired.

  In addition, heat-resistant resin materials made of crystalline materials such as Teflon (fluorine resin) are unlikely to change shape when heat-bonding heat-resistant resin layers, etc. When laminating the heat-resistant resin layer, there is a possibility that the resin eluted during the pressure bonding may reach the back surface of the heat-resistant resin material. In particular, when the core material and the heat-resistant resin material have different thicknesses, it becomes difficult to control the eluted resin.

  Patent Document 1 discloses a method in which a flexible part and a rigid part are provided, a space part is provided in a part of the rigid part, an electronic component is connected thereto, and the electronic component is sealed. In order to prevent the flexible part from being connected to the layer connecting the part, a layer made of an anti-adhesive material is laminated at the position where the space part is formed in the rigid part, and then the layer constituting the rigid part is laminated, and then the space part is formed The space is formed by removing a part of the rigid portion and the adhesion preventing material layer, and it is not intended to make the rigid portion thin and to have flexibility. In addition, this method requires time and effort because it is necessary to remove a part of the rigid portion and further remove the adhesion preventing material layer. Furthermore, since the layer made of the adhesion preventing material formed on the rigid portion is removed by using the cleaning component, the component remaining in the rigid portion without being cleaned may be ionized to reduce the reliability of the substrate.

  The present invention solves the above-described problems, and does not require a step of forming a gap portion in a layer constituting material that becomes a core of a rigid multilayer printed wiring board to be produced, and is a layer used for manufacturing a rigid multilayer printed wiring board. Rigid multilayer printed wiring that can easily adjust the film thickness of the rigid multilayer printed wiring board produced by adjusting the stacking position of each layer constituent material in the process of stacking the constituent materials, and can easily adjust the layer exposed to the outside It is an object of the present invention to provide a method for manufacturing a plate.

  In order to achieve the above object, a method for manufacturing a rigid multilayer printed wiring board according to the present invention has the following configuration.

(1) The present invention is a rigid multilayer printed wiring board in which one or more layers each having one or more resin dam layers and at least one other layer are laminated on at least one of an upper surface portion and a lower surface portion, The layer including the resin dam layer and the other layer are each composed of at least one of a conductor layer and a non-conductor layer, and the non-conductor layer is composed of a cured product of at least one of an intermediate material and a resin material. A part or all of one side surface part constitutes part or all of any side surface part of the rigid multilayer printed wiring board, and a surface in contact with the resin dam layer of the layer including the resin dam layer or the surface The outermost surface of the other layer that is laminated on the side and in contact with the resin dam layer and any side surface portion of the rigid multilayer printed wiring board are configured to be L-shaped or inverted L-shaped. A method for manufacturing a rigid multilayer printed wiring board configured such that a part of the film thickness is different from that of the other part, and is selected from one or more conductor layers, an intermediate material, a resin material, and a cured product thereof. A resin dam layer forming step of forming at least one resin dam layer made of a resin composition on at least one of the upper surface portion and the lower surface portion, and a conductor layer, an intermediate material, and a resin formed with the resin dam layer A stacking step of stacking at least one selected from a material and a cured product thereof, one or more other conductor layers, and at least one selected from an intermediate material, a resin material, and a cured product thereof, and the stacking step And at least one selected from the conductor layer, the intermediate material, the resin material, and a cured product thereof, and the other conductor layer, the intermediate material, the resin material, and the resin dam layer. At least one selected from these cured products is such that a part or all of at least one side surface of the resin dam layer constitutes part or all of any side surface of the rigid multilayer printed wiring board. In addition, a conductor layer provided with the resin dam layer, an intermediate material, a resin material, and at least one selected from these cured products, a surface in contact with the resin dam layer, or stacked on the surface side and in contact with the resin dam layer The outermost surface selected from the conductor layer and the intermediate material, the resin material, and a cured product thereof, and any one of the side surfaces of the rigid multilayer printed wiring board are L-shaped or inverted L-shaped. At least one selected from a conductor layer and an intermediate material, a resin material, and a cured product thereof, which are stacked and the resin dam layer is formed, and the other conductor At least one selected from a layer, an intermediate material, a resin material, and a cured product thereof is characterized by being in a laminated state by heating in any of the manufacturing processes of a rigid multilayer printed wiring board.

(2) The present invention is a rigid multilayer printed wiring board in which one or more layers each having one or more resin dam layers and at least one other layer are laminated on at least one of an upper surface portion and a lower surface portion, The layer including the resin dam layer and the other layer are each composed of at least one of a conductor layer and a non-conductor layer, and the non-conductor layer is composed of a cured product of at least one of an intermediate material and a resin material. A part or all of one side surface part constitutes part or all of any side surface part of the rigid multilayer printed wiring board, and a surface in contact with the resin dam layer of the layer including the resin dam layer or the surface The outermost surface of the other layer that is laminated on the side and in contact with the resin dam layer and any side surface portion of the rigid multilayer printed wiring board are configured to be L-shaped or inverted L-shaped. A method for manufacturing a rigid multilayer printed wiring board configured such that a part of the film thickness is different from that of the other part, and is selected from one or more conductor layers, an intermediate material, a resin material, and a cured product thereof. A resin dam layer forming step of forming at least one resin dam layer made of a resin composition on at least one of the upper surface portion and the lower surface portion, and a conductor layer, an intermediate material, and a resin formed with the resin dam layer A stacking step of stacking at least one selected from materials and at least one selected from these cured products and at least one selected from one or more other conductor layers and intermediate materials, resin materials and these cured products, and at least the resin dam layer A part of or all of one side surface part of the rigid multilayer printed wiring board constitutes part or all of one side surface part of the rigid multi-layer printed wiring board and includes the resin dam layer. Layers, intermediate materials, resin materials, and other conductive layers that are in contact with the resin dam layer stacked on the surface side or the surface side in contact with the resin dam layer selected from these cured products and intermediate materials, resin materials And at least one of the outermost surfaces selected from these cured products and the side surface of any of the rigid multilayer printed wiring boards are L-shaped or reverse L-shaped so that the outer layer side of the resin dam layer. Including a removal step of removing at least a part selected from the other conductor layer and the intermediate material, the resin material, and a cured product thereof, and the conductor layer and the intermediate material on which the resin dam layer is formed, At least one selected from a resin material and a cured product thereof, and at least one selected from the other conductor layer and the intermediate material, a resin material, and a cured product thereof. It is characterized in that it is brought into a laminated state by heating in any step of the manufacturing process of the rigid multilayer printed wiring board.

(3) In the manufacturing method according to the above (1) or (2), the resin dam layer is at least one of screen printing, flexographic printing, gravure printing, inkjet printing, dispenser printing, and offset printing. The resin composition is formed by printing on at least one of the upper surface portion and the lower surface portion of at least one of the conductor layer, the intermediate material, the resin material, and a cured product thereof, and the resin dam layer is a rigid multilayer print. It is characterized in that it is cured by at least one of ultraviolet curing and thermal curing in any of the manufacturing processes of the wiring board.

(4) In the manufacturing method according to any one of (1) to (3), the resin composition includes at least an ultraviolet curable resin, a thermosetting resin, and an ultraviolet curable / thermosetting resin. It is characterized by including either.

(5) The present invention resides in the method for producing a rigid multilayer printed wiring board according to any one of (1) to (4) above, wherein the non-conductive layer made of a cured product of the other intermediate material and the resin dam The resin dam layer and the non-conductive layer made of a cured product of the other intermediate material are partially or entirely resin derived from the other intermediate material. A method for manufacturing a rigid multilayer printed wiring board configured to be adjacent via a cured product, wherein the gap is provided between the resin dam layer and the other intermediate material in the stacking step. The conductive layer in which the resin dam layer is formed and at least one selected from an intermediate material, a resin material, and a cured product thereof and the other intermediate material are stacked.

(6) The present invention resides in the method for producing a rigid multilayer printed wiring board according to any one of (1) to (5) above, wherein a part or all of the method exists on the same plane and the other intermediate A method for manufacturing a rigid multilayer printed wiring board in which a plurality of non-conductive layers and cured resin dam layers, which are adjacent to each other through a cured resin derived from a material, are present, the stacking step And at least one selected from a conductor layer, an intermediate material, a resin material, and a cured product thereof, in which the resin dam layer is formed so that a gap is provided between the resin dam layer and the other intermediate material. It is characterized by being stacked with other intermediate materials.

(7) The present invention is the method for producing a rigid multilayer printed wiring board according to any one of (1) to (6) above, and in any of the steps of producing the rigid multilayer printed wiring board, At least one selected from the conductor layer and the intermediate material, the resin material, and a cured product thereof, and the other conductor layer, the intermediate material, the resin material, and the cured product thereof, which are formed on the resin dam layer to be stacked. Alternatively, the method includes a step of forming a via hole in the stacked state.

  The method for producing a rigid multilayer printed wiring board according to the present invention does not require a step of forming a gap portion in a layer constituting material that is a core of the produced rigid multilayer printed wiring board, and is used for producing a rigid multilayer printed wiring board. In the step of stacking the layer constituent materials, the film thickness of the rigid multilayer printed wiring board produced by adjusting the stacking position of each layer constituent material can be easily adjusted, and the layer exposed to the outside can be easily adjusted.

It is a schematic sectional drawing explaining the manufacturing method of the rigid multilayer printed wiring board in the 1st Embodiment of this invention. It is a manufacturing method of the rigid multilayer printed wiring board in the modification of the embodiment. It is a schematic top view of the rigid multilayer printed wiring board in the same embodiment. It is a schematic top view showing the modification of the formation method of the resin dam layer in the embodiment. It is a schematic sectional drawing of the state which bent the rigid multilayer printed wiring board in the same embodiment. It is a schematic sectional drawing explaining the manufacturing method of the rigid multilayer printed wiring board in the 2nd Embodiment of this invention. It is a schematic sectional drawing explaining the manufacturing method of the rigid multilayer printed wiring board in the 3rd Embodiment of this invention. It is a schematic sectional drawing of the state which bent the rigid multilayer printed wiring board in the same embodiment. It is a schematic sectional drawing of the rigid multilayer printed wiring board in the modification of the embodiment. It is a schematic sectional drawing explaining the manufacturing method of the rigid multilayer printed wiring board in the 4th Embodiment of this invention. It is a 1st schematic sectional drawing explaining the manufacturing method of the rigid multilayer printed wiring board in the 5th Embodiment of this invention. It is a 2nd schematic sectional drawing explaining the manufacturing method of the rigid multilayer printed wiring board in the same embodiment. It is the schematic top view and schematic sectional drawing of the rigid multilayer printed wiring board in the 6th Embodiment of this invention. It is a 1st schematic sectional drawing explaining the manufacturing method of the rigid multilayer printed wiring board in the 7th Embodiment of this invention. It is a 2nd schematic sectional drawing explaining the manufacturing method of the rigid multilayer printed wiring board in the same embodiment. It is a 3rd schematic sectional drawing explaining the manufacturing method of the rigid multilayer printed wiring board in the same embodiment. It is a 4th schematic sectional drawing explaining the manufacturing method of the rigid multilayer printed wiring board in the same embodiment. It is a 1st schematic sectional drawing explaining the manufacturing method of the rigid multilayer printed wiring board in the 8th Embodiment of this invention. It is a 2nd schematic sectional drawing explaining the manufacturing method of the rigid multilayer printed wiring board in the same embodiment. It is a 3rd schematic sectional drawing explaining the manufacturing method of the rigid multilayer printed wiring board in the same embodiment. It is a 1st schematic sectional drawing explaining the manufacturing method of the rigid multilayer printed wiring board in the 9th Embodiment of this invention. It is a 2nd schematic sectional drawing explaining the manufacturing method of the rigid multilayer printed wiring board in the same embodiment. It is a 3rd schematic sectional drawing explaining the manufacturing method of the rigid multilayer printed wiring board in the same embodiment. It is a 1st schematic sectional drawing explaining the manufacturing method of the rigid multilayer printed wiring board in the 10th Embodiment of this invention. It is a 2nd schematic sectional drawing explaining the manufacturing method of the rigid multilayer printed wiring board in the same embodiment. It is a 3rd schematic sectional drawing explaining the manufacturing method of the rigid multilayer printed wiring board in the same embodiment.

  Hereinafter, an embodiment of a method for producing a rigid multilayer printed wiring board according to the present invention will be described in detail. Of course, the present invention is not limited to the following embodiments.

<First Embodiment>
A first embodiment will be described with reference to FIG.
First, the conductor layer 132 is stacked on the upper surface portion 111a of the core material 111 and the conductor layer 131 is stacked on the lower surface portion 111b to form a laminated state (adhered state) (see FIG. 1A).

The core material 111 is produced, for example, by thermosetting a resin material or an intermediate material. The film thickness of the core material 111 is desirably 10 μm or more and 6 mm or less.
In this specification, the “layer constituent material” refers to an intermediate material, a resin material, and a cured product thereof, which form a conductor layer and a non-conductor layer.
The “resin material” is formed by applying and drying a resin composition such as an adhesive resin composition containing a resin such as an epoxy resin, a curable resin composition, and an insulating resin composition on another layer constituent material. It refers to a sheet-like material made of a resin composition such as a layer and a layer made of an adhesive resin composition, a curable resin composition, an insulating resin composition, and the like constituting a dry film and a bonding sheet.
Further, in the present specification, the “intermediate material” means a sheet impregnated with a resin composition such as an adhesive resin composition containing a resin such as an epoxy resin such as a prepreg, a curable resin composition, and an insulating resin composition. Say.

The conductor layers 131 and 132 can be stacked on the upper surface portion 111a and the lower surface portion 111b of the core material 111 by conductor plating such as copper, for example.
In addition, the conductor layers 131 and 132 are stacked and heated (thermocompression bonding), for example, on the upper surface portion 111a and the lower surface portion 111b of the core material 111 such that layers (adhesive layers; not shown) made of an adhesive resin composition are interposed therebetween. The same shall apply hereinafter). As a result, the upper surface portion 111a and the conductor layer 132 of the core material 111 and the lower surface portion 111b and the conductor layer 131 can be laminated through the adhesive layer.
In this case, a sheet-like conductor such as a foil may be used as the conductor layers 131 and 132. For example, the adhesive layer and the sheet-like conductor layer 132 are sequentially stacked on the upper surface portion 111a of the core material 111, and the lower surface of the core material 111 The adhesive layer and the sheet-like conductor layer 131 may be sequentially stacked on the portion 111b and heated to form a laminated state.

  The adhesive layer is stacked on the upper surface portion 111a and the lower surface portion 111b of the core material 111 by applying and drying an adhesive resin composition containing a resin such as an epoxy resin on the upper surface portion 111a and the lower surface portion 111b of the core material 111, for example. May be. Further, the upper surface of the core material 111 is formed using a resin sheet (dry film, bonding sheet, etc.) made of an adhesive resin composition, or a sheet in which a carbon fiber or the like such as a prepreg is impregnated with an adhesive or thermosetting resin. You may stack on the part 111a and the lower surface part 111b.

  Next, two resin dam layers 121 (resin dam layers 1211 and 1212) are formed on the upper surface portion of the conductor layer 132 (the surface not in contact with the upper surface portion 111a of the core material 111) (see FIG. 1B). .

As a method of forming the resin dam layer 121 on the upper surface portion of the conductor layer 132, for example, at least one of screen printing, flexographic printing, gravure printing, inkjet printing, dispenser printing, and offset printing can be used. In addition, the number of times the resin composition is printed on the upper surface portion of the conductor layer 132 can be appropriately adjusted according to the design content of the film thickness of the resin dam layer 121, and may be once or plural times.
Among these printing methods, since the fine resin dam layer 121 can be formed, an inkjet printing method is particularly preferably used. Further, when the resin dam layer 121 having a certain thickness or more is to be formed and it is desired to achieve a desired film thickness by one printing, for example, a resin composition having a high viscosity is printed using a dispenser printing method. Is preferred.

The layer constituting material for forming the resin dam layer 121 and the position thereof can be appropriately adjusted depending on the design content of the manufactured rigid multilayer printed wiring board 100, the position where the film thickness is desired to be adjusted, and the like. In the present embodiment, the positions of the side surface portion 121b of the resin dam layer 1211 and the side surface portion 121c of the resin dam layer 1212 are adjusted so that the side surface portions 100a and 100b of the rigid multilayer printed wiring board 100 to be described later are formed. It is desirable to form the resin dam layer 121.
Further, the film thickness of the resin dam layer 121 can be appropriately adjusted depending on the film thickness of the rigid multilayer printed wiring board 100 to be produced, the layer constituent material forming the resin dam layer 121, the film thickness of other layer constituent materials, and the like.

  In this embodiment, two resin dam layers 121 are formed on the upper surface portion of the conductor layer 132. However, if the film thickness of the produced rigid multilayer printed wiring board 100 can be adjusted, the resin dam layer 121 is formed. The number of dam layers 121 may be one or plural.

  The resin composition used for forming the resin dam layer 121 preferably includes, for example, at least one of an ultraviolet curable resin, a thermosetting resin, and an ultraviolet curable / thermosetting resin. Moreover, you may mix | blend resin other than these resin, a photoinitiator, a thermosetting catalyst, a solvent, an additive, etc. suitably with the said resin composition.

  The ultraviolet curable resin is preferably used as long as it has a functional group that cures in response to ultraviolet rays. For example, a monofunctional acrylate resin, a polyfunctional acrylate resin, etc. are mentioned. These can be used individually by 1 type or in combination of multiple types.

  Examples of the thermosetting resin include epoxy resin, phenol resin, amino resin, silicone resin, triazine resin, and melamine resin. These can be used individually by 1 type or in combination of multiple types.

  Examples of the other resin include styrene resin and urethane resin.

  The photopolymerization initiator is preferably used as long as it accelerates the ultraviolet curing of the ultraviolet curable resin and the ultraviolet curable / thermosetting resin, for example, a radical photopolymerization initiator and a cationic photopolymerization initiator. Etc. These can be used individually by 1 type or in combination of multiple types.

  The thermosetting catalyst is preferably used as long as it accelerates the thermosetting of the thermosetting resin and the ultraviolet curable / thermosetting resin, such as an imidazole-based curing catalyst, an amine-based curing catalyst, and a phosphorus-based curing catalyst. Is mentioned. These can be used individually by 1 type or in combination of multiple types.

  Examples of the solvent include ketone solvents, aromatic hydrocarbon solvents, glycol ether solvents, ester solvents, aliphatic hydrocarbon solvents, petroleum solvents, and the like. These can be used individually by 1 type or in combination of multiple types.

Examples of the additive include an antifoaming agent, a filler, a thickener, a plasticizer, and a nucleating agent.
As the antifoaming agent, for example, polyalkylsiloxane can be used. Moreover, a metal oxide, a silicon compound, a glass filler, talc, etc. can be used as a filler.
These can be used individually by 1 type or in combination of multiple types.

  The composition of the resin composition and the blending amount of each composition are appropriately adjusted in consideration of the hardness, formation range and position of the resin dam layer 121 after curing, the material of the layer constituent material on which the resin dam layer 121 is formed, and the like. The

The resin dam layer 121 can be cured by at least one of ultraviolet curing and thermosetting in any of the manufacturing processes of the rigid multilayer printed wiring board 100, and can be laminated with other layer constituent materials in contact therewith.
Note that the thermosetting may be performed simultaneously with the heating of the resin layer 141 and the heating of the resin layer 142 described later.

A resin layer is formed on the upper surface portion side of the conductor layer 132 so that the side surface portion 121b of the resin dam layer 1211 and the side surface portion 121c of the resin dam layer 1212 constitute side surfaces 100a and 100b of the rigid multilayer printed wiring board 100 described later. 141 and the conductor layer 133 are stacked (see FIG. 1C).
In the present embodiment, the resin layer 141 and the conductor layer 133 are stacked on the surface of the upper surface portion of the conductor layer 132 other than the gap between the two resin dam layers 1212111 and 1212. That is, as shown in FIG. 1C, one resin layer 141 and one conductor layer 133 are in contact with the side surface 121a of the resin dam layer 1211 so that each one side surface is in contact with another resin. Each of the side surfaces of the layer 141 and the conductor layer 133 is stacked so as to be in contact with the side surface 121d of the resin dam layer 1212.
When an intermediate material is used as the resin layer 141, the intermediate material and the conductor layer 133, which are the resin layer 141, are respectively resin dams, as in a modification of the first embodiment (see FIG. 2) described in detail below. Stacked on the upper surface portion side of the conductor layer 132 with a slight gap provided in the vicinity of the side surface portion of the layer 121 (the side surface portion 121a of the resin dam layer 1211 and the side surface portion 121d of the resin dam layer 1212). It is desirable that By adopting such a configuration, the resin composition eluted from the intermediate material (resin layer 141) flows into the gap when the resin layer 141 described later is heated, and the resin composition is cured to become a cured resin product. Thus, the resin dam layer 121, the resin layer 141, and the conductor layer 133 can be stacked so as to be adjacent to each other.

  In this embodiment, the height (film thickness) of the resin dam layer 121 to be formed is equal to the height (film thickness) of the resin layer 141 and the conductor layer 133, but the respective film thicknesses are adjusted as appropriate. Of course, you may do.

The conductor layer 133 can be stacked in the same manner as the conductor layer 131 by stacking it on the upper surface of the resin layer 141 (the surface not in contact with the conductor layer 132).
The conductor layer 133 may be laminated with the resin layer 141 when the resin layer 141 described later is heated.

  As the resin layer 141, a resin material and an intermediate material are preferably used. The resin layer 141 may be stacked by applying and drying the resin composition on the upper surface portion of the conductor layer 132, and a sheet-like material or intermediate material made of the resin composition is used as the resin layer 141 to form the conductor layer 132. It may be stacked on the upper surface.

The resin layer 141 is cured by heating in any step of the manufacturing process of the rigid multilayer printed wiring board 100, and can be in a laminated state with another layer constituent material in contact therewith.
The resin layer 141 stacked to be in contact with the side surface portion 121a of the resin dam layer 1211 is laminated with the side surface portion 121a of the resin dam layer 1211, and the resin layer 141 stacked to be in contact with the side surface portion 121d of the resin dam layer 1212 is a resin. The side surface portion 121d of the dam layer 1212 can be laminated.
However, depending on the timing of heating the resin layer 141, there may be a case where the resin dam layer 121 and the resin layer 141 are in a laminated state before the resin layer 141 is heated. The dam layer 121 and the cured resin layer 141 can be in a laminated state.
In this specification, both the state before curing by heating and the state after curing are referred to as “resin layer”. The same applies to resin layers other than the resin layer 141 and resin layers in other embodiments.
The resin dam layer 121 serves as a wall that stops the flow of the resin composition eluted from the resin layer 141 during the heating, and the resin composition is formed between the two resin dam layers 1211 and 1212 on the upper surface portion of the conductor layer 132. Elution to the surface of the gap portion can be suppressed. Thereby, the upper surface part of the conductor layer 132 can be kept smooth, and the film thickness adjustment of the rigid multilayer printed wiring board 100 can be made easy.

  In the present embodiment, the resin layer 142 is stacked on the surface of the gap between the two resin dam layers 1211 and 1212 in the upper surface of the conductor layer 132.

  As the resin layer 142, a resin material and an intermediate material using an insulating resin composition are preferably used. The resin layer 142 may be stacked by applying and drying an insulating resin composition at a predetermined position on the upper surface portion of the conductor layer 132, and a sheet-like material or intermediate material made of the insulating resin composition may be used as a resin. The layer 142 may be stacked at a predetermined position on the upper surface portion of the conductor layer 132. When the rigid multilayer printed wiring board 100 manufactured as shown in FIG. 3 is used in a bent state, the resin layer 142 laminated with the conductor layer 132 by heating and / or ultraviolet irradiation described later has flexibility. It is desirable to adjust the components of the resin composition so as to have.

  As described above, the resin layer 142 can be cured by heating and / or ultraviolet irradiation in any step of the manufacturing process of the rigid multilayer printed wiring board 100, and can be laminated with other layer constituent materials in contact therewith. . Note that the heating may be performed simultaneously with the heating of the resin layer 141.

In this embodiment, the resin layer 142 is stacked on the upper surface portion of the conductor layer 132 after stacking other layer constituent materials. For example, before the other layer constituent materials are stacked or simultaneously with stacking of the other layer constituent materials. The conductor layer 132 may be stacked on the upper surface portion.
In the present embodiment, the resin dam layer 121 is formed on the upper surface of the conductor layer 132. For example, the resin dam layer 121 is formed on the resin layer 142, and the resin layer 142 formed with the resin dam layer 121 is formed on the conductor layer 132. You may stack in a predetermined position.
When the conductor layer 132 is not provided on the surface corresponding to the gap between the resin dam layers 1211 and 1212 in the upper surface portion 111a of the core material 111, for example, the conductor layer 132 laminated on the portion is removed by etching or the like. When the resin dam layer 121 is formed on the portion of the upper surface portion 111a of the material 111 where the conductor layer 132 is removed and another layer constituent material is stacked, the resin layer 142 is excluded from the components of the rigid multilayer printed wiring board 100. May be.

Then, the resin dam layer 121 and the resin layers 141 and 142 are set in a cured state, and all the layer constituent materials are set in a laminated state, whereby the rigid multilayer printed wiring board 100 of the present embodiment is manufactured (FIG. 1D). reference).
In the rigid multilayer printed wiring board 100 of the present embodiment, as shown in FIG. 1 (d), the side surface portion 121 b of the resin dam layer 1211 and the side surface portion 121 c of the resin dam layer 1212 are each of the rigid multilayer printed wiring board 100. The side portions 100a and 100b are stacked so as to constitute the side portions 100a and 100b.
Further, the resin layer 142 is laminated with the upper surface portion of the conductor layer 132 including the resin dam layer 121 and is in contact with the resin dam layer 121. In the rigid multilayer printed wiring board 100, the upper surface portion of the resin layer 142 and the side surface portion 100a of the rigid multilayer printed wiring board 100 are L-shaped (the side surface portion 100a of the rigid multilayer printed wiring board 100 is a vertical line, The upper surface portion of the resin layer 142 and the side surface portion 100b of the rigid multilayer printed wiring board 100 are inverted L-shaped (the side surface portion 100b of the rigid multilayer printed wiring board 100 is formed). Vertical lines, and when the upper surface portion of the resin layer 142 is viewed as horizontal lines).
The rigid multilayer printed wiring board 100 of the present embodiment has such a configuration, so that the height (film thickness H1) from the upper surface portion of the conductor layer 133 to the lower surface portion of the conductor layer 131 and the upper surface portion of the resin layer 142 are increased. The film thickness H2 can be made thinner than the film thickness H1 so that the height (film thickness H2) to the lower surface portion of the conductor layer 131 is different.

  In the rigid multilayer printed wiring board 100, the film thickness H1 is preferably 100 μm or more and 6 mm or less. The film thickness H2 is preferably 30 μm or more and is preferably 100 μmm or less thinner than the film thickness H1.

  As described above, the rigid multilayer printed wiring board 100 manufactured by the manufacturing method according to the present embodiment does not require a step of forming a gap portion in a layer (core material 111) serving as a core of the rigid multilayer printed wiring board 100. Moreover, the film thickness (H1, H2) of the rigid multilayer printed wiring board 100 can be easily adjusted by adjusting the stacking position of each layer constituent material in the process of stacking the layer constituent materials.

  The conductive layers 131, 132, and 133 can remove unnecessary portions by etching or the like so as to form a desired circuit pattern in any step of the manufacturing process of the rigid multilayer printed wiring board 100.

The thickness of the resin layer between the conductor layers like the resin layer 141 is desirably 20 μm or more in the cured state. In addition, the thickness of the resin layer serving as a surface insulating layer such as the resin layer 142 is desirably 5 μm or more and 30 μm or less in the cured state.
The film thickness of the conductor layers 131, 132, 133 is preferably 5 μm or more and 300 μm or less.

In the present embodiment, the conductor layer 132 is stacked on the upper surface portion 111 a of the core material 111, and the conductor layer 131 is stacked on the lower surface portion 111 b of the core material 111. Other layer constituent materials are laminated. For example, the core material 111, the conductor layers 131 and 132 (the resin dam layer 121 is formed on the upper surface portion), 133, and the resin layers 141 and 142 are stacked so as to have a predetermined configuration. Each of them may be laminated by heating.
In addition, stacking and stacking of each layer constituent material may be performed by stacking, for example, one layer at a time, a plurality of layer constituent materials may be stacked and stacked, or a combination thereof.

Further, in the present embodiment, the process includes a step of stacking the conductor layers 131 and 132 on the upper surface portion 111a and the lower surface portion 111b of the core material 111, respectively. , 132 may be omitted by using a copper-clad laminate (not shown) in which conductor layers corresponding to.
Such a copper-clad laminate can be produced by a method similar to the method of stacking the conductor layers 131 and 132 on the upper surface portion 111a and the lower surface portion 111b of the core material 111, respectively.

In the present embodiment, a step of forming a via hole may be provided in any manufacturing process of the rigid multilayer printed wiring board 100. For example, after all layer constituent materials that are constituent elements of the rigid multilayer printed wiring board 100 are in a laminated state, via holes (not shown) are formed at predetermined positions thereof to form conductor layers 131, 132, and 133. Can be electrically connected. Further, for example, the via hole may be provided when a part of the layer constituent materials is in a laminated state.
The position where the via hole is formed can be appropriately adjusted according to the design circuit pattern in the rigid multilayer printed wiring board 100.
Then, by mounting predetermined electronic components on predetermined positions (for example, land portions, not shown) of the conductor layers 131 and 133 and formed via holes, a desired rigid multilayer printed circuit board is manufactured.

<Modification of First Embodiment>
Next, a modification of the first embodiment will be described with reference to FIG. In addition, the same code | symbol is attached | subjected to the component same as 1st Embodiment, and the overlapping description is abbreviate | omitted suitably.
First, the copper clad laminated board 161 by which the conductor layers 131 and 132 were each laminated | stacked on the upper surface part 111a and the lower surface part 111b of the core material 111 is prepared (refer Fig.2 (a)). The film thickness of the copper clad laminate 161 is desirably 40 μm or more and 3.2 mm or less.

  Next, a resin dam layer 121 is formed on the upper surface portion of the conductor layer 132 constituting the copper clad laminate 161 (the surface not in contact with the upper surface portion 111a of the core material 111) (see FIG. 2B).

The conductor dam layer 121 has a side surface portion 121b of the resin dam layer 1211 and a side surface portion 121c of the resin dam layer 1212 so as to form side surfaces 100a and 100b of the rigid multilayer printed wiring board 100 described later. The intermediate material and the conductor layer 133 are stacked as the resin layer 141 on the upper surface side of the layer 132 (see FIG. 2C).
In the present modification, the resin layer 141 and the conductor layer 133 are stacked on a surface other than the gap between the two resin dam layers 1211 and 1212 on the upper surface portion of the conductor layer 132. That is, as shown in FIG. 2C, a small gap is provided so that each of the resin layer 141 and the conductor layer 133 is in the vicinity of the side surface portion 121a of the resin dam layer 1211 and does not come into contact therewith. The conductor layer 132 is stacked on the upper surface side.
In addition, another resin layer 141 and conductor layer 133 are stacked on the upper surface portion side of the conductor layer 132 with a slight gap provided in the vicinity of the side surface portion 121d of the resin dam layer 1212 so as not to come into contact therewith. It is done.

When the resin layer 141 is heated, the resin composition flowing out from the resin layer 141 stacked on the side surface 121a side of the resin dam layer 1211 is the side surface portion 121a of the resin dam layer 1211 shown in FIG. It flows into a gap surrounded by the conductor layers 132 and 133 and the resin layer 141, and is cured to form a resin layer 1431 (cured resin). Also, during the heating, the resin composition that has flowed out of the resin layer 141 stacked on the side surface 121d side of the resin dam layer 1212 is the side surface portion 121d of the resin dam layer 1212 and the conductor layer 132 shown in FIG. , 133 and the resin layer 141 flow into a gap, which is cured to form a resin layer 1432 (cured resin).
Then, the resin dam layer 1211 (side surface portion 121a side), the resin layer 141, and the conductor layer 133 are laminated so as to be adjacent to each other via the resin layer 1431, and the resin dam layer 1212 (side surface portion 121d) is interposed via the resin layer 1432. Side), the resin layer 141, and the conductor layer 133 are adjacent to each other (see FIG. 2B).
Thus, the resin dam layer 121 serves as a wall that stops the flow of the resin composition eluted from the resin layer 141 during the heating, and the resin composition is the two resin dam layers 1211 on the upper surface portion of the conductor layer 132. , 1212 can be prevented from eluting to the surface of the gap portion. Thereby, the upper surface part of the conductor layer 132 can be kept smooth, and the film thickness adjustment of the rigid multilayer printed wiring board 100 can be made easy.

  In the present modification, when the rigid multilayer printed wiring board 100 is manufactured by removing the surface corresponding to the gap between the resin dam layers 1211 and 1212 with respect to the conductor layer 132 constituting the copper clad laminate 161, The resin layer 142 may be excluded from the components of the rigid multilayer printed wiring board 100.

Then, the resin dam layer 121 and the resin layers 141, 142, 1421, and 1432 are set in a cured state, and the layer constituent materials that are in contact with each other are set in a laminated state, whereby the rigid multilayer printed wiring board 100 of the present modification is manufactured (FIG. 2 (e)).
In the rigid multilayer printed wiring board 100 of this modification, as shown in FIG. 2E, the side surface portions 121 b and 121 c of the resin dam layer 121 constitute the side surface portions 100 a and 100 b of the rigid multilayer printed wiring board 100, respectively. It is laminated so that.
Further, the resin layer 142 is laminated with the upper surface portion of the conductor layer 132 including the resin dam layer 121 and is in contact with the resin dam layer 121. In the rigid multilayer printed wiring board 100, the upper surface portion of the resin layer 142 and the side surface portion 100a of the rigid multilayer printed wiring board 100 are L-shaped (the side surface portion 100a of the rigid multilayer printed wiring board 100 is a vertical line, The upper surface portion of the resin layer 142 and the side surface portion 100b of the rigid multilayer printed wiring board 100 are inverted L-shaped (the side surface portion 100b of the rigid multilayer printed wiring board 100 is formed). Vertical lines, and when the upper surface portion of the resin layer 142 is viewed as horizontal lines).
With this configuration, the rigid multilayer printed wiring board 100 according to this modification has a height (film thickness H1) from the upper surface portion of the conductor layer 133 to the lower surface portion of the conductor layer 131 and the upper surface portion of the resin layer 142. The film thickness H2 can be made thinner than the film thickness H1 so that the height (film thickness H2) to the lower surface portion of the conductor layer 131 is different.

  In the rigid multilayer printed wiring board 100 of this modification, the film thickness H1 is desirably 100 μm or more and 6 mm or less. The film thickness H2 is preferably 30 μm or more and is preferably 100 μmm or less thinner than the film thickness H1.

  As described above, the rigid multilayer printed wiring board 100 manufactured by the manufacturing method of the present modification does not require a step of forming a gap portion in a layer (core material 111) that becomes a core of the rigid multilayer printed wiring board 100. The film thickness (H1, H2) of the rigid multilayer printed wiring board 100 can be easily adjusted by adjusting the stacking position or the like of each layer constituent material in the step of stacking the layer constituent materials.

  In this modification, stacking and stacking of each layer constituent material may be performed by stacking, for example, one layer at a time, or a plurality of layer constituent materials may be stacked and stacked, or a combination thereof. Also good.

  In this modification, the copper clad laminate 161 is used. However, for example, a step of laminating the conductor layers 131 and 132 on the upper surface portion 111a and the lower surface portion 111b of the core material 111 may be included. .

Next, the configuration of the rigid multilayer printed wiring board 100 according to the first embodiment viewed from the top will be described with reference to FIG.
As shown in FIG. 3, the resin dam layers 1211 and 1212, the conductor layer 133, and the resin layer 142 are laminated so as to be the outermost upper layer of the rigid multilayer printed wiring board 100.
The upper outermost layer has a film thickness (film thickness H2) in the range of the resin layer 142, and the upper outermost layer is thinner than the resin dam layers 1211 and 1212 and the conductor layer 133 (film thickness H1).

In the step of forming the resin dam layer 121, the resin composition may be printed only on the upper surface portion of the conductor layer 132. Further, as shown in FIG. ) May also be printed (see FIG. 4A). Then, in any of the manufacturing processes of the rigid multilayer printed wiring board 100, the resin dam layer 121e printed in a region outside the upper surface portion of the conductor layer 132 is removed to remove the resin dam layer 121f (corresponding to the resin dam layers 1211 and 1212). ) May be left (see FIG. 4B).
In this case, the resin dam layers 121e and 121f are desirably printed so as to be adjacent to each other, and the resin dam layer 121 is preferably printed to have an arbitrary shape such as a circle, an ellipse, and a rectangle. By printing the resin dam layer 121 in such a manner, the resin composition eluted from the resin layer 141 during the heating described above is prevented from adhering to the side surfaces (161a, 161b) of the copper-clad laminate 161. be able to.
If the portion corresponding to the resin dam layer 121e can prevent the resin composition eluted from the resin layer 141 during the above-mentioned heating from adhering to the side surfaces (161a, 161b) of the copper-clad laminate 161, A structure other than the resin dam layer 121e, for example, a dam layer made of a conductive paste may be used. However, even in this case, it is desirable that the resin dam layer 121f and the dam layer made of the conductive paste are formed adjacent to each other.

  Thus, part or all of the resin dam layer 121 can be appropriately removed in any of the manufacturing processes of the rigid multilayer printed wiring board 100. Such a method for forming a resin dam layer can also be used in other embodiments.

A configuration in which the rigid multilayer printed wiring board 100 is bent will be described with reference to FIG.
As shown in FIG. 5, the rigid multilayer printed wiring board 100 can bend the portion where the resin layer 142 is laminated (having the film thickness H <b> 2) so that the conductor layer 131 is the outermost layer. Thus, since the rigid multilayer printed wiring board 100 can be used in a bent state, the space in the electronic control device can be efficiently utilized, and electronic components can be mounted on the rigid multilayer printed wiring board 100 ( Design) and the degree of freedom in designing an electronic control device incorporating the same.

  The rigid multilayer printed wiring board 100 can adjust the film thickness without selecting the material of the portion to be bent (the portion where the resin layer 142 is laminated (having the film thickness H2)). In addition, since a highly durable material can be used and a resin having special performance can be used, high reliability can be realized.

Further, in the rigid multilayer printed wiring board 100, the core material 111 and the conductor layers 131, 132, and 133 constituting the portion having the thickness H2 and the core material 111 and the conductor layers 131 and 132 constituting the portion having the thickness H1 are formed. , 133 can be made of the same material, so that the difference in thermal expansion coefficient can be suppressed and the occurrence of breakage can also be suppressed. Further, when these materials are the same, the dielectric constants also match, so that it is possible to easily cope with high frequency characteristics as compared with the case where these materials are different.
And since the material of each layer constituent material which comprises the part used as the film thickness H2 and each layer constituent material which comprises the part used as the film thickness H1 can be made the same, and since the existing layer constituent material can be utilized, the existing layer The results of reliability evaluation, etc. that have already been obtained for components (for example, circuits, through holes, etc.) can be partially used for reliability evaluation of the rigid multilayer printed wiring board 100 itself, thereby reducing the cost and time required for this. can do.

<Second Embodiment>
A second embodiment will be described with reference to FIG.
First, the resin dam layer 221 is formed on the upper surface portion 211a of the core material 211 (see FIG. 6A). In the present embodiment, one resin dam layer 221 may be formed on the upper surface portion 211 a of the core material 211.
The core material 211 can be manufactured by the same method as the core material 111 of the first embodiment described above. Further, the resin dam layer 211 can be formed on the upper surface portion 211a of the core material 211 by using the same method as the method for forming the resin dam layer 121 of the first embodiment described above, and can have the same configuration.
The layer constituent material for forming the resin dam layer 221 and the position thereof can be appropriately adjusted depending on the design content of the manufactured rigid multilayer printed wiring board 200 and the position where the film thickness is to be adjusted. In the present embodiment, it is desirable to form the resin dam layer 221 by adjusting its position so that the side surface portion 221a of the resin dam layer 221 constitutes a side surface portion 200a of the rigid multilayer printed wiring board 200 described later.
Further, the film thickness of the resin dam layer 221 can be appropriately adjusted depending on the film thickness of the rigid multilayer printed wiring board 200 to be manufactured, the layer constituent material forming the resin dam layer 221 and the film thicknesses of other layer constituent materials.
Further, the resin dam layer 221 can be cured by at least one of ultraviolet curing and heat curing in any of the manufacturing processes of the rigid multilayer printed wiring board 200, and can be laminated with another layer constituent material in contact therewith.
In addition, you may perform the said thermosetting simultaneously with the heating of the resin layer 241 mentioned later.

Next, the conductor layer 231 is stacked on the lower surface portion 211b of the core material 211 to form a laminated state (see FIG. 6B).
For the lamination of the conductor layer 231 to the lower surface portion 211b of the core material 211, a method similar to the method of laminating the conductor layer 131 to the lower surface portion 111b of the core material 111 in the first embodiment can be used. It can be set as this structure.

The conductor layer 232, the resin layer 241, and the conductor layer 233 are disposed on the upper surface portion 211 a side of the core material 211 so that the side surface portion 221 a of the resin dam layer 221 constitutes a side surface portion 200 a of the rigid multilayer printed wiring board 200 described later. Are stacked.
In this embodiment, the conductor layer 232, the resin layer 241, and the conductor layer 233 are stacked on the upper surface portion 211 a side of the core material 211 so that one side surface portion of each of the conductor layers 232, 241 and 233 is in contact with the side surface portion 221 b of the resin dam layer 221. It is done.
When an intermediate material is used as the resin layer 241, the conductor layer 232, the intermediate material that is the resin layer 241, and the conductor layer 233 are in the vicinity of the side surface portion 221 b of the resin dam layer 221 and slightly in contact with each other. It is desirable that the gap portion is provided and stacked on the upper surface portion 211 a side of the core material 211. With this configuration, the resin composition eluted from the intermediate material (resin layer 241) flows into the gap when the resin layer 241 to be described later is heated, and the resin composition cures to become a cured resin product. The resin dam layer 221, the conductor layer 232, the resin layer 241, and the conductor layer 233 can be stacked so as to be adjacent to each other.

  In the present embodiment, the height (film thickness) of the resin dam layer 221 to be formed is equal to the height (film thickness) of the resin layer 241 and the conductor layers 232 and 233 combined. Of course, it may be adjusted appropriately.

The conductor layers 232 and 233 can be laminated by stacking the upper surface portion 211a of the core material 211 and the upper surface portion of the resin layer 241 in the same manner as the conductor layer 132 of the first embodiment described above.
The conductor layers 232 and 233 may be laminated with the resin layer 241 when the resin layer 241 described later is heated.

  The resin layer 241 can have the same configuration as the resin layer 141 in the first embodiment described above, and can be stacked on other layer constituent materials by the same method.

The resin layer 241 is cured by heating in any step of the manufacturing process of the rigid multilayer printed wiring board 200, and can be laminated with other layer constituent materials in contact therewith. In addition, the resin layer 241 stacked so as to be in contact with the side surface portion 221b of the resin dam layer 221 may be laminated with the side surface portion 221b of the resin dam layer 221. However, depending on the timing of heating the resin layer 241, there may be a case where the resin dam layer 221 and the resin layer 241 are laminated before the resin layer 241 is heated. In this case, the resin layer 241 is heated to The dam layer 221 and the cured resin layer 241 can be in a laminated state.
The resin dam layer 221 serves as a wall that stops the flow of the resin composition eluted from the resin layer 241 during the heating, and can prevent the resin composition from being eluted to the upper surface portion 211 a of the core material 211. Thereby, the upper surface part 211a of the core material 211 can be kept smooth, and the film thickness adjustment of the rigid multilayer printed wiring board 200 can be facilitated.

Then, the resin dam layer 221 and the resin layer 241 are set in a cured state, and the layer constituent materials in contact with each other are set in a laminated state, whereby the rigid multilayer printed wiring board 200 of the present embodiment is manufactured (see FIG. 6C). .
As shown in FIG. 2C, the rigid multilayer printed wiring board 200 of this embodiment is laminated so that the side surface portion 221 a of the resin dam layer 221 constitutes the side surface portion 200 a of the rigid multilayer printed wiring board 200. ing. In the rigid multilayer printed wiring board 200, the upper surface portion 211a of the core material 211 including the resin dam layer 221 and the side surface portion 200a of the rigid multilayer printed wiring board 200 are inverted L-shaped (the side surface portion 200a of the rigid multilayer printed wiring board 200). Is a vertical line, and the upper surface portion 211a of the core material 211 is a horizontal line).
The rigid multilayer printed wiring board 200 of the present embodiment has such a configuration, so that the height (film thickness H1) from the upper surface portion of the conductor layer 233 to the lower surface portion of the conductor layer 231 and the upper surface portion 211a of the core material 211 are increased. From the height of the conductor layer 231 to the lower surface portion (film thickness H2), that is, the film thickness H2 can be made thinner than the film thickness H1.

  In the rigid multilayer printed wiring board 200, the film thickness H1 is preferably 100 μm or more and 6 mm or less. The film thickness H2 is preferably 30 μm or more and is preferably 100 μmm or less thinner than the film thickness H1.

  Thus, the rigid multilayer printed wiring board 200 produced by the manufacturing method of the present embodiment does not require a step of forming a gap portion in the layer (core material 211) that becomes the core of the rigid multilayer printed wiring board 200. The film thickness (H1, H2) of the rigid multilayer printed wiring board 100 can be easily adjusted by adjusting the stacking position or the like of each layer constituent material in the step of stacking the layer constituent materials.

  The conductive layers 231, 232, and 233 can remove unnecessary portions by etching or the like so as to form a desired circuit pattern in any step of the manufacturing process of the rigid multilayer printed wiring board 200.

The film thickness of the resin layer between the conductor layers like the resin layer 241 is desirably 20 μm or more in the cured state.
The film thicknesses of the conductor layers 231, 232, and 233 are preferably 5 μm or more and 300 μm or less.

In the present embodiment, the conductor layer 231 is stacked on the lower surface portion 211b of the core material 211 to form a laminated state, and another layer constituent material is stacked on the upper surface portion 211a side of the core material 211. 211 (resin dam layer 221 is formed on upper surface portion 211a), conductor layers 231, 232, 233, and resin layer 241 are stacked so as to have a predetermined configuration, and these are heated, so that each becomes a laminated state. May be.
In addition, stacking and stacking of each layer constituent material may be performed by stacking, for example, one layer at a time, a plurality of layer constituent materials may be stacked and stacked, or a combination thereof.

In addition, the present embodiment includes a step of stacking the conductor layers 231 and 232 on the upper surface portion 211a and the lower surface portion 211b of the core material 211, respectively. The above process may be omitted by using a copper-clad laminate (not shown) in which conductor layers corresponding to the conductor layers 231 and 232 are laminated.
Such a copper-clad laminate can be manufactured by a method similar to the method of stacking the conductor layers 231 and 232 on the upper surface portion 211a and the lower surface portion 211b of the core material 211, respectively.

In the present embodiment, a step of forming a via hole may be provided in any manufacturing process of the rigid multilayer printed wiring board 200. For example, after all layer constituent materials that are constituent elements of the rigid multilayer printed wiring board 200 are in a laminated state, via holes (not shown) are formed at predetermined positions thereof to form conductor layers 231, 232, 233. Can be electrically connected. Further, for example, the via hole may be provided when a part of the layer constituent materials is in a laminated state.
The position where the via hole is formed can be appropriately adjusted according to the design circuit pattern in the rigid multilayer printed wiring board 200.
Then, by mounting predetermined electronic components on predetermined positions (for example, land portions, not shown) of the conductor layers 231 and 233 and formed via holes, a desired rigid multilayer printed circuit board is manufactured.

The rigid multilayer printed wiring board 200 can bend a portion having a film thickness H2 or embed an electronic component in the portion to efficiently use a space. The degree of freedom of component mounting (design) and design of an electronic control unit incorporating the component can be expanded.
Since the rigid multilayer printed wiring board 200 can adjust its film thickness without selecting a material, for example, a material having high heat resistance and durability can be used for this portion, and a resin having a special performance can be used. Since it can be used, high reliability can be realized.

Further, in the rigid multilayer printed wiring board 200, the core material 211 and the conductor layer 231 constituting the portion having the thickness H2, and the core material 211 and the conductor layer 231 (232, 233) constituting the portion having the thickness H1. Since each can be made of the same material, the difference in thermal expansion coefficient can be suppressed and the occurrence of breakage can also be suppressed. Further, when these materials are the same, the dielectric constants also match, so that it is possible to easily cope with high frequency characteristics as compared with the case where these materials are different.
And since the material of each layer constituent material which comprises the part used as the film thickness H2 and each layer constituent material which comprises the part used as the film thickness H1 can be made the same, and since the existing layer constituent material can be utilized, the existing layer The results of reliability evaluation, etc. that have already been acquired for component materials (for example, circuits, through holes, etc.) can be partially used for reliability evaluation of the rigid multilayer printed wiring board 200 itself, and the cost and time required for this can be suppressed. can do.

<Third Embodiment>
A third embodiment will be described with reference to FIG.
First, a copper clad laminate 361 in which conductor layers 331 and 332 are laminated on the upper surface portion 311a and the lower surface portion 312b of the core material 311 is prepared (see FIG. 7A).
For the copper-clad laminate 361, a method similar to the method for producing the copper-clad laminate 161 of the modified example of the first embodiment described above can be used, and a similar configuration can be used.

Next, the upper surface portion of the conductor layer 332 (the surface not in contact with the upper surface portion 311a of the core material 311) and the lower surface portion of the conductor layer 331 (not in contact with the lower surface portion 311b of the core material 311) constituting the copper clad laminate 361. Resin dam layers 321 and 322 are respectively formed on the surface (see FIG. 7B).
The formation of the resin dam layer 321 on the upper surface portion of the conductor layer 332 and the formation of the resin dam layer 322 on the lower surface portion of the conductor layer 331 are similar to the method of forming the resin dam layer 121 of the first embodiment described above. Can be used, and the same configuration can be adopted.
In this embodiment, two resin dam layers 321 are formed on the upper surface portion of the conductor layer 332 (resin dam layers 3211 and 3212), and two resin dam layers 322 are formed on the lower surface portion of the conductor layer 331 (see FIG. If the resin dam layers 3221 and 3222) can adjust the film thickness of the rigid multilayer printed wiring board 300 to be produced, the number of the resin dam layers 321 and 322 formed may be one each. There may be more than one.
The layer constituent material for forming the resin dam layers 321 and 322 and the position thereof can be appropriately adjusted depending on the design content of the manufactured rigid multilayer printed wiring board 300, the position where the film thickness is desired to be adjusted, and the like. In the present embodiment, the side surface portion 321b of the resin dam layer 3211, the side surface portion 321c of the resin dam layer 3212, the side surface portion 322b of the resin dam layer 3221, and the side surface portion 322c of the resin dam layer 3222 are described later in a rigid multilayer printed wiring board 300. The resin dam layers 321 and 322 are preferably formed by adjusting the positions so as to constitute the side portions 300a, 300b, 300c, and 300d, respectively.
The film thickness of the resin dam layers 321 and 322 is appropriately adjusted according to the film thickness of the rigid multilayer printed wiring board 300 to be produced, the layer constituent materials forming the resin dam layers 321 and 322, the film thicknesses of other layer constituent materials, and the like. Can do.
In addition, the resin dam layers 321 and 322 are cured by at least one of ultraviolet curing and thermal curing in any of the manufacturing processes of the rigid multilayer printed wiring board 300, and are laminated with other layer constituent materials in contact with them. Can be.
The thermosetting may be performed simultaneously with the heating of resin layers 341 and 343 and the heating of resin layers 342 and 344 described later.

The resin layer 341 is formed on the upper surface of the conductor layer 332 so that the side surface 321b of the resin dam layer 3211 and the side surface 321c of the resin dam layer 3212 constitute side surfaces 300a and 300b of the rigid multilayer printed wiring board 300 described later. And the conductor layer 333 is stacked. Further, the resin layer 343 and the conductor are formed on the lower surface side of the conductor layer 331 so that the side surface portion 322b of the resin dam layer 3221 and the side surface portion 322c of the resin dam layer 3222 constitute the side surface portions 300c and 300d of the rigid multilayer printed wiring board 300, respectively. Layers 334 are stacked (see FIG. 7B).
In the present embodiment, as shown in FIG. 7C, each side surface portion of each of the resin layer 341 and the conductor layer 333 is in contact with the side surface portion 321 a of the resin dam layer 3211, and One side surface portion of each of another resin layer 341 and another conductor layer 333 is stacked on the upper surface portion side of the conductor layer 332 so as to be in contact with the side surface portion 321 d of the resin dam layer 3212.
Further, one side of each of the resin layer 343 and one of the conductor layers 334 is in contact with the side of the side surface 322 a of the resin dam layer 3221, and one of each of the other resin layer 343 and conductor layer 334 of each other. The side surface portion is stacked on the lower surface portion side of the conductor layer 321 so as to contact the side surface portion 322 d of the resin dam layer 3222.

When an intermediate material is used as the resin layer 341, the intermediate material and the conductor layer 333, which are the resin layer 341, are respectively a side surface portion of the resin dam layer 321 (a side surface portion 321a of the resin dam layer 3211 and a side surface portion of the resin dam layer 3212). 321d) is preferably stacked on the upper surface side of the conductor layer 332 with a slight gap between them. When an intermediate material is used as the resin layer 343, the intermediate material and the conductor layer 334, which are the resin layers 343, are respectively provided on the side surface portions of the resin dam layer 322 (the side surface portion 322a of the resin dam layer 3221 and the side surface portion 321d of the resin dam layer 3222). It is desirable that a slight gap is provided between them so that they are stacked on the lower surface side of the conductor layer 331.
With such a configuration, the resin compositions eluted from the intermediate materials (resin layers 341 and 343) flow into the gaps when the resin layers 341 and 343, which will be described later, are heated, and these are cured and cured. The resin dam layer 321, the resin layer 341, and the conductor layer 333, and the resin dam layer 322, the resin layer 343, and the conductor layer 334 can be laminated through the cured product.

  In the present embodiment, the height (film thickness) of the resin dam layer 321 and the height (film thickness) of the conductor layer 333 and the resin layer 341 are made equal, and the height (film thickness) of the resin dam layer 322 is made. ) And the combined height (film thickness) of the conductor layer 334 and the resin layer 343, it is of course possible to adjust the film thicknesses appropriately.

The conductor layers 333 and 334 can be stacked on the upper surface portion of the resin layer 341 and the lower surface portion of the resin layer 343 in the same manner as the conductor layer 131 of the first embodiment described above.
Further, the conductor layers 333 and 334 may be laminated with the resin layers 341 and 344 when the resin layers 341 and 343 described later are heated.

  The resin layers 341 and 343 can have the same configuration as the resin layer 141 in the first embodiment described above, and can be stacked on other layer constituent materials by the same method.

The resin layers 341 and 343 can be laminated with other layer constituent materials in contact with them by heating in any step of the manufacturing process of the rigid multilayer printed wiring board 300.
In addition, the resin layer 341 stacked to be in contact with the side surface portion 321a of the resin dam layer 3211 is laminated with the side surface portion 321a of the resin dam layer 3211, and the resin layer 341 stacked to be in contact with the side surface portion 321d of the resin dam layer 3212 is The side surface portion 321d of the resin dam layer 3212 can be laminated. Similarly, the resin layer 343 stacked to be in contact with the side surface portion 322 a of the resin dam layer 3221 is laminated with the side surface portion 322 a of the resin dam layer 3221, and the resin layer 343 stacked to be in contact with the side surface portion 322 d of the resin dam layer 3222. Can be laminated with the side surface portion 322 d of the resin dam layer 3222.
However, depending on the timing at which the resin layers 341 and 343 are heated, the resin dam layer 321 and the resin layer 341 are laminated, and the resin dam layer 322 and the resin layer 343 are laminated before the resin layers 341 and 343 are heated. In some cases, by heating the resin layers 341 and 343, the resin dam layer 321 and the cured resin layer 341 can be laminated with the resin dam layer 321 and the cured resin layer 343, respectively.
The resin dam layer 321 serves as a wall that stops the flow of the resin composition eluted from the resin layer 341 during the heating, and the resin composition is formed by the two resin dam layers 3211 and 3212 on the upper surface portion of the conductor layer 322. Elution to the surface of the gap portion can be suppressed. Thereby, the upper surface part of the conductor layer 322 can be kept smooth, and the film thickness adjustment of the rigid multilayer printed wiring board 300 can be facilitated.
Further, the resin dam layer 322 serves as a wall that stops the flow of the resin composition eluted from the resin layer 343 during the heating, and the resin composition adheres to and cures at a place where the resin composition should not originally adhere in each layer constituent material. This can be suppressed.

  In the present embodiment, the resin layer 342 is provided on the surface of the gap between the two resin dam layers 3211 and 3212 in the upper surface portion of the conductor layer 332, and the two resin dam layers 3221 and 3222 in the lower surface portion of the conductor layer 331. The resin layers 344 are stacked on the surface of the gap portion.

  The resin layers 342 and 344 can have the same configuration as the resin layer 142 in the first embodiment described above, and can be stacked on other layer constituent materials by the same method. When the rigid multilayer printed wiring board 300 to be produced is used in a bent state, the resin layers 342 and 344 that are laminated with the conductor layers 332 and 331 by heating and / or ultraviolet irradiation described later are flexible. It is desirable to adjust the components of the resin composition used for these formations so as to have

  The resin layers 342 and 344 may be cured by being heated and / or irradiated with ultraviolet rays or the like in any step of the manufacturing process of the rigid multilayer printed wiring board 300, and may be laminated with other layer constituent materials in contact therewith. Note that the heating may be performed simultaneously with the heating of the resin layers 341 and 343.

In this embodiment, the resin layers 342 and 344 are stacked on the upper surface portion of the conductor layer 332 and the lower surface portion of the conductor layer 331 after stacking other layer constituent materials, respectively, for example, before stacking other layer constituent materials Alternatively, they may be stacked on the upper surface portion of the conductor layer 332 and the lower surface portion of the conductor layer 331 simultaneously with the stacking of other layer constituent materials.
In this embodiment, the resin dam layers 321 and 322 are formed on the upper surface portion of the conductor layer 332 and the lower surface portion of the conductor layer 331, respectively. For example, the resin dam layer 321 is formed on the upper surface portion of the resin layer 342, and the resin dam is formed. The resin layer 342 on which the layer 321 is formed may be stacked at a predetermined position on the upper surface portion of the conductor layer 332, the resin dam layer 322 is formed on the lower surface portion of the resin layer 344, and the resin layer 344 on which the resin dam layer 322 is formed is formed. The conductor layer 331 may be stacked at a predetermined position on the lower surface portion.
When the conductor layer 332 is not provided on the surface corresponding to the gap between the resin dam layers 3211 and 3212 in the upper surface portion 311a of the core material 311, for example, the conductor layer 332 laminated on the portion is removed by etching or the like. In the case where the resin dam layer 321 is formed on the portion of the upper surface portion 311a of the material 311 where the conductor layer 332 is removed and another layer constituent material is stacked, the resin layer 342 is excluded from the components of the rigid multilayer printed wiring board 300. May be. Similarly, when the conductor layer 331 is not laminated on the surface corresponding to the gap between the resin dam layers 3221 and 3222 in the lower surface portion 311b of the core material 311, for example, the conductor layer 331 laminated on the portion is removed by an etching process or the like, When the resin dam layer 322 is formed on the portion of the lower surface portion 311b of the core material 311 where the conductor layer 331 is removed and another layer constituent material is stacked, the resin layer 344 is excluded from the components of the rigid multilayer printed wiring board 300. May be.

Then, the resin dam layers 321 and 322 and the resin layers 341, 342, 343, and 344 are set in a cured state, and the layer constituent materials that are in contact with each other are set in a laminated state, whereby the rigid multilayer printed wiring board 300 of this embodiment is manufactured. (See FIG. 7 (d)).
In the rigid multilayer printed wiring board 300 of this embodiment, as shown in FIG. 7D, the side surface portion 321 b of the resin dam layer 3211 and the side surface portion 321 c of the resin dam layer 3212 are side surfaces of the rigid multilayer printed wiring board 300. The layers 300a and 300b are stacked so as to constitute each. Further, the side surface portion 322b of the resin dam layer 3221 and the side surface portion 322c of the resin dam layer 3222 are laminated so as to constitute the side surface portions 300c and 300d of the rigid multilayer printed wiring board 300, respectively.
Further, the resin layer 342 is laminated with the upper surface portion of the conductor layer 332 including the resin dam layer 321 and is in contact with the resin dam layer 321. In the rigid multilayer printed wiring board 300, the upper surface portion of the resin layer 342 and the side surface portion 300a of the rigid multilayer printed wiring board 300 are L-shaped (the side surface portion 300a of the rigid multilayer printed wiring board 300 is a vertical line, and the resin layer 342 has The upper surface portion of the resin layer 342 and the side surface portion 300b of the rigid multilayer printed wiring board 300 are formed in an inverted L shape (the side surface portion 300b of the rigid multilayer printed wiring board 300). Vertical lines, and the upper surface portion of the resin layer 342 as horizontal lines).
Further, the resin layer 344 is laminated with the lower surface portion of the conductor layer 331 including the resin dam layer 322 and is in contact with the resin dam layer 322. In the rigid multilayer printed wiring board 300, the lower surface portion of the resin layer 344 and the side surface portion 300c of the rigid multilayer printed wiring board 300 are inverted L-shaped (the side surface portion 300c of the rigid multilayer printed wiring board 300 is a vertical line, and the resin layer 344 is formed. The bottom surface portion of the resin layer 344 and the side surface portion 300d of the rigid multilayer printed wiring board 300 form an L-shape (the side surface portion 300d of the rigid multilayer printed wiring board 300). Vertical lines, and the lower surface portion of the resin layer 344 as horizontal lines).
The rigid multilayer printed wiring board 300 of the present embodiment has such a configuration, so that the height (film thickness H1) from the upper surface portion of the conductor layer 333 to the lower surface portion of the conductor layer 331 and the upper surface portion of the resin layer 342 are increased. The thickness (film thickness H2) to the lower surface portion of the conductor layer 331 can be made different, that is, the film thickness H2 can be made thinner than the film thickness H1.

  In the rigid multilayer printed wiring board 300, the film thickness H1 is desirably 100 μm or more and 6 mm or less. The film thickness H2 is preferably 30 μm or more and is preferably 100 μmm or less thinner than the film thickness H1.

  As described above, the rigid multilayer printed wiring board 300 manufactured by the manufacturing method of the present embodiment does not require a step of forming a gap portion in a layer (core material 311) that becomes a core of the rigid multilayer printed wiring board 300. The film thickness (H1, H2) of the rigid multilayer printed wiring board 300 can be easily adjusted by adjusting the stacking position of each layer constituent material in the step of stacking the layer constituent materials.

  The conductive layers 331, 332, 333, and 334 can remove unnecessary portions by etching or the like so as to form a desired circuit pattern in any step of the manufacturing process of the rigid multilayer printed wiring board 300.

The thickness of the resin layer between the conductor layers like the resin layers 341 and 343 is preferably 20 μm or more in the cured state. In addition, the thickness of the resin layer serving as the surface insulating layer such as the resin layers 342 and 344 is desirably 5 μm or more and 30 μm or less in the cured state.
The film thickness of the conductor layers 331, 332, 333, and 334 is preferably 5 μm or more and 300 μm or less.

  In the present embodiment, stacking and stacking of each layer constituent material may be performed by stacking, for example, one layer at a time, or a plurality of layer constituent materials may be stacked and stacked, or a combination thereof. Also good.

  In the present embodiment, the copper clad laminate 361 is used. However, for example, a step of stacking the conductor layers 331 and 332 on the upper surface portion 311a and the lower surface portion 311b of the core material 311 may be included. .

In this embodiment, a step of forming a via hole may be provided in any manufacturing process of the rigid multilayer printed wiring board 300. For example, after all layer constituent materials that are constituent elements of the rigid multilayer printed wiring board 300 are in a laminated state, via holes (not shown) are formed at predetermined positions thereof to form conductor layers 331, 332, and 333. , 334 may be electrically connected. Further, for example, the via hole may be provided when a part of the layer constituent materials is in a laminated state.
The position where the via hole is formed can be appropriately adjusted according to the design circuit pattern in the rigid multilayer printed wiring board 300.
Then, by mounting predetermined electronic components on predetermined positions (for example, land portions, not shown) of the conductor layers 333 and 334 and formed via holes, a desired rigid multilayer printed circuit board is manufactured.

A configuration in which the rigid multilayer printed wiring board 300 is bent will be described with reference to FIG.
As shown in FIG. 8A, the rigid multilayer printed wiring board 300 bends the portion where the resin layers 342 and 344 are laminated (the film thickness is H2) so that the conductor layer 334 is the outermost layer. be able to. Further, as shown in FIG. 8B, in the rigid multilayer printed wiring board 300, the resin layers 342 and 344 are laminated (the film thickness is H2) so that the conductor layer 333 is the outermost layer. Can be bent.
In this way, the rigid multilayer printed wiring board 300 can be used in a bent state in either direction, whether the conductor layer 333 side is the outermost layer or the conductor layer 334 side is the outermost layer. Therefore, the space in the electronic control device can be utilized more efficiently, and the degree of freedom in designing (mounting) the electronic component on the rigid multilayer printed wiring board 300 and the design of the electronic control device incorporating the electronic component is further increased. Can be spread.

  The rigid multilayer printed wiring board 300 can adjust the film thickness without selecting the material of the part to be bent (the part where the resin layers 342 and 344 are laminated (the film thickness becomes H2)). Since a material having high heat resistance and durability can be used and a resin having special performance can be used, high reliability can be realized.

Further, in the rigid multilayer printed wiring board 300, the core material 311 and the conductor layers 331 and 332 constituting the portion having the film thickness H2, and the core material 311 and the conductor layers 331 and 332 (333) constituting the portion having the film thickness H1. , 334) can be made of the same material, so that the difference in thermal expansion coefficient can be suppressed and the occurrence of breakage can also be suppressed. Further, when these materials are the same, the dielectric constants also match, so that it is possible to easily cope with high frequency characteristics as compared with the case where these materials are different.
And since the material of each layer constituent material which comprises the part used as the film thickness H2 and each layer constituent material which comprises the part used as the film thickness H1 can be made the same, and since the existing layer constituent material can be utilized, the existing layer The results of reliability evaluation, etc. that have already been acquired for the components (for example, circuits, through-holes, etc.) can be partially used for reliability evaluation of the rigid multilayer printed wiring board 300 itself, and the cost and time required for this can be suppressed. can do.

In the rigid multilayer printed wiring board 300, the side surfaces 321 a and 321 b of the resin dam layer 3211, the side surfaces 321 c and 321 d of the resin dam layer 3212, the side surfaces 322 a and 322 b of the resin dam layer 3221, and the resin dam layer 3222. The side surface portions 322c and 322d are configured to be vertically and collinear, but each side surface portion of the resin dam layer 321 is, for example, a modification of the third embodiment shown in FIG. The resin dam layers 321 and 322 may be formed such that the side surfaces of the resin dam layer 322 do not exist vertically and on the same straight line, or only part of the resin dam layers 322 exist on the same straight line. .
Since such a rigid multilayer printed wiring board 300 can bend the portion having the film thickness H2 so that it is S-shaped or corrugated, the space in the electronic control device is more efficiently utilized. In addition, the degree of freedom in mounting (designing) electronic components on the rigid multilayer printed wiring board 300 and designing an electronic control device incorporating the electronic components can be further expanded.

<Fourth Embodiment>
A fourth embodiment will be described with reference to FIG.
First, a copper clad laminate 461 in which conductor layers 431 and 432 are respectively laminated on the upper surface portion 411a and the lower surface portion 412b of the core material 411 is prepared (see FIG. 10A).
For the copper-clad laminate 461, a method similar to the method for producing the copper-clad laminate 161 of the modified example of the first embodiment described above can be used, and a similar configuration can be used.

Next, a resin dam layer 421 is formed on the upper surface portion of the conductor layer 432 constituting the copper-clad laminate 461 (the surface not in contact with the upper surface portion 411a of the core material 411) (see FIG. 10B).
For the formation of the resin dam layer 421 on the upper surface portion of the conductor layer 432, a method similar to the method for forming the resin dam layer 121 of the first embodiment described above can be used, and a similar configuration can be adopted.
In the present embodiment, two resin dam layers 421 are formed on the upper surface of the conductor layer 432 (resin dam layers 4211 and 4212), and the thickness of the rigid multilayer printed wiring board 400 to be manufactured can be adjusted. In this case, the number of the resin dam layers 421 to be formed may be one or plural.
The layer constituting material for forming the resin dam layer 421 and the position thereof can be appropriately adjusted depending on the design content of the manufactured rigid multilayer printed wiring board 400, the position where the film thickness is to be adjusted, and the like. In this embodiment, the position is adjusted so that the side surface portion 421b of the resin dam layer 4211 and the side surface portion 421c of the resin dam layer 4212 constitute side surfaces 400a and 400b of the rigid multilayer printed wiring board 400 described later, respectively. It is desirable to form the dam layer 421.
Further, the film thickness of the resin dam layer 421 can be appropriately adjusted depending on the film thickness of the rigid multilayer printed wiring board 400 to be produced, the layer constituent material forming the resin dam layer 421, the film thickness of other layer constituent materials, and the like.
Further, the resin dam layer 421 can be cured by at least one of ultraviolet curing and thermal curing in any of the manufacturing processes of the rigid multilayer printed wiring board 400, and can be laminated with other layer constituent materials in contact therewith.
Note that the thermosetting may be performed simultaneously with the heating of the resin layer 443 and the heating of the resin layer 422 described later.

The resin layer is formed on the upper surface of the conductor layer 432 so that the side surface portion 421b of the resin dam layer 4211 and the side surface portion 421c of the resin dam layer 4212 constitute side surfaces 400a and 400b of the rigid multilayer printed wiring board 400 described later. As 441, an intermediate material, a conductor layer 433, a resin layer 443, and a conductor layer 434 are stacked (see FIG. 10C).
In the present embodiment, the resin layer 441, the conductor layer 433, the resin layer 443, and the conductor layer 434 are stacked on the surface of the upper surface portion of the conductor layer 432 other than the gap between the two resin dam layers 4211 and 4212.
That is, as shown in FIG. 10C, the height (film thickness) of the resin dam layer 421 and the height (film thickness) of the resin layer 441 and the conductor layer 433 are set to be approximately equal, and 1 The resin layer 441 and the conductor layer 433 are stacked on the upper surface portion of the conductor layer 332 with a slight gap provided in the vicinity of the side surface portion 421a of the resin dam layer 4211 so as not to come into contact therewith. Another resin layer 441 and conductor layer 433 are stacked on the upper surface portion of the conductor layer 332 with a slight gap provided in the vicinity of the side surface portion 421d of the resin dam layer 4212 so as not to come into contact therewith. .
Furthermore, in the present embodiment, one resin layer 443 and one conductor layer 434 are provided on the upper surface portion side of one conductor layer 433 so as to cover the upper surface portion of the resin dam layer 4211 and one conductor layer 434 is provided. The side surface portion 434a and the one side surface portion 443a of the resin layer 443 are stacked so as to be vertically aligned with the side surface portion 421b of the resin dam layer 4211. Further, another one resin layer 443 and one conductor layer 434 on the upper surface portion side of the other conductor layer 433 cover the upper surface portion of the resin dam layer 4212, and one side surface portion 434 b and the resin layer of the conductor layer 434. One side surface portion 443b of 443 is stacked so as to exist on the same straight line as the side surface portion 421c of the resin dam layer 4212.
By stacking the layer constituent materials in this manner, the side surface portion 421b of the resin dam layer 4211, the side surface portion 434a of the conductor layer 434, and the side surface portion 443a of the resin layer 443 constitute the side surface portion 400a of the rigid multilayer printed wiring board 400. The side surface portion 421c of the resin dam layer 4212, the side surface portion 434b of the conductor layer 434, and the side surface portion 443b of the resin layer 443 can constitute the side surface portion 400b of the rigid multilayer printed wiring board 400. With this configuration, the rigid multilayer printed wiring board 400 can be used in a bent state so that the conductor layer 431 is the outermost layer, as will be described later.
As described above, in the present embodiment, for the layer constituent material that is stacked so as to be positioned outside the resin dam layer, one side surface portion of the rigid multilayer printed wiring board is combined with one of the side surface portions of the resin dam layer. They can be stacked to form part of the side part. The same applies to other embodiments.

  In the present embodiment, the height (film thickness) of the resin dam layer 421 and the height (film thickness) of the resin layer 441 and the conductor layer 433 are made equal, but the resin layer 443 and the conductor layer 434 are included. Of course, each film thickness may be adjusted appropriately.

The conductor layers 433 and 434 can be stacked on the upper surface portion of the resin layer 441 and the upper surface portion of the resin layer 443 by a method similar to that of the conductor layer 131 of the first embodiment described above.
The conductor layers 433 and 434 may be laminated with the resin layers 441 and 443 when the resin layers 441 and 443 described later are heated.

  The resin layers 441 and 443 can have the same configuration as the resin layer 141 in the first embodiment described above, and can be stacked on other layer constituent materials by the same method.

The resin layers 441 and 443 can be cured by heating in any step of the manufacturing process of the rigid multilayer printed wiring board 400 and can be laminated with other layer constituent materials in contact therewith.
During the heating, the resin composition flowing out from the resin layer 441 stacked on the side surface portion 421a side of the resin dam layer 4211 is the side surface portion 421a of the resin dam layer 4211 shown in FIG. The resin flows into a gap surrounded by 432 and 433 and the resin layers 441 and 443, and is cured to form a resin layer 4441 (cured resin). Further, during the heating, the resin composition flowing out from the resin layer 441 stacked on the side surface portion 421d side of the resin dam layer 4212 has a side surface portion 421d of the resin dam layer 4212 and the conductor layer 432 shown in FIG. , 433 and the resin layers 441, 443, and is cured to form a resin layer 4442 (cured resin).

Then, the resin dam layer 4211 (side surface portion 421a side), the conductor layer 433, and the resin layer 441 are laminated so as to be adjacent to each other through the resin layer 4441, and the resin dam layer 4212 (side surface portion 421d) is interposed through the resin layer 4442. Side), the conductor layer 433, and the resin layer 441 may be in a stacked state (see FIG. 10E).
Thus, the resin dam layer 421 serves as a wall that stops the flow of the resin composition eluted from the resin layer 441 during the heating, and the resin composition is in contact with the two resin dam layers 4211 on the upper surface of the conductor layer 432. , 4212 can be prevented from eluting to the surface of the gap portion. Thereby, the upper surface part of the conductor layer 432 can be kept smooth, and the film thickness adjustment of the rigid multilayer printed wiring board 400 can be facilitated.

  In the present embodiment, the resin layer 442 is stacked on the surface of the gap between the two resin dam layers 4211 and 4212 in the upper surface portion of the conductor layer 432.

  The resin layer 442 can have the same configuration as that of the resin layer 142 in the first embodiment described above, and can be stacked on other layer constituent materials by the same method. When the rigid multilayer printed wiring board 400 to be produced is used in a bent state, the resin layer 442 that is laminated with the conductor layer 432 by heating and / or ultraviolet irradiation, which will be described later, is flexible. It is desirable to adjust the components of the composition.

  The resin layer 442 may be cured by being heated and / or irradiated with ultraviolet rays or the like in any step of the manufacturing process of the rigid multilayer printed wiring board 400, and may be laminated with another layer constituent material in contact therewith. Note that the heating may be performed simultaneously with the heating of the resin layers 441 and 443.

In this embodiment, the resin layer 442 is stacked on the upper surface portion of the conductor layer 432 after stacking other layer constituent materials. For example, before the other layer constituent materials are stacked or simultaneously with stacking of other layer constituent materials. The conductive layer 432 may be stacked on the upper surface portion.
In this embodiment, the resin dam layer 421 is formed on the upper surface portion of the conductor layer 432. For example, the resin layer 442 having the resin dam layer 421 formed on the upper surface portion of the resin layer 442 is disposed at a predetermined position on the upper surface portion of the conductor layer 432. May be stacked.
Further, when the conductor layer 432 is not provided on the surface corresponding to the gap portion of the resin dam layer 421 in the upper surface portion 411a of the core material 411, for example, the conductor layer 432 laminated on the portion is removed by an etching process or the like. In the case where the resin dam layer 421 is formed on the portion of the upper surface portion 411a from which the conductor layer 432 is removed and another layer constituent material is stacked, the resin layer 442 may be excluded from the components of the rigid multilayer printed wiring board 400. Good.

Then, the resin dam layer 421 and the resin layers 441, 443, 4441, and 4442 are set in a cured state, and the layer constituent materials in contact with each other are set in a laminated state, whereby the rigid multilayer printed wiring board 400 of the present embodiment is manufactured (FIG. 10 (e)).
In the rigid multilayer printed wiring board 400 of this embodiment, as shown in FIG. 10D, the side surface portion 421b of the resin dam layer 4211 and the side surface portion 421c of the resin dam layer 4212 are the side surface portion 400a of the rigid multilayer printed wiring board 400. , 400b are stacked.
Further, the resin layer 442 is laminated with the upper surface portion of the conductor layer 432 including the resin dam layer 421 and is in contact with the resin dam layer 421. In the rigid multilayer printed wiring board 400, the upper surface portion of the resin layer 442 and the side surface portion 400a of the rigid multilayer printed wiring board 400 are L-shaped (the side surface portion 400a of the rigid multilayer printed wiring board 400 is a vertical line, and the resin layer 442 The upper surface portion of the resin layer 442 and the side surface portion 400b of the rigid multilayer printed wiring board 400 form an inverted L-shape (the side surface portion 400b of the rigid multilayer printed wiring board 400). Vertical lines, and the upper surface portion of the resin layer 442 as horizontal lines).
The rigid multilayer printed wiring board 400 of the present embodiment has such a configuration, so that the height (film thickness H1) from the upper surface portion of the conductor layer 434 to the lower surface portion of the conductor layer 431 and the upper surface portion of the resin layer 442 are reduced. The thickness (film thickness H2) to the lower surface portion of the conductor layer 431 can be made different, that is, the film thickness H2 can be made thinner than the film thickness H1.

  In the rigid multilayer printed wiring board 400, the film thickness H1 is preferably 100 μm or more and 6 mm or less. The film thickness H2 is preferably 30 μm or more and is preferably 100 μmm or less thinner than the film thickness H1.

  As described above, the rigid multilayer printed wiring board 400 manufactured by the manufacturing method of the present embodiment does not require a step of forming a gap portion in a layer (core material 411) serving as a core of the rigid multilayer printed wiring board 400. Moreover, the film thickness (H1, H2) of the rigid multilayer printed wiring board 400 can be easily adjusted by adjusting the stacking position of each layer constituent material in the step of stacking the layer constituent materials.

  The conductive layers 431, 432, 433, and 434 can remove unnecessary portions by etching or the like so as to form a desired circuit pattern in any step of the manufacturing process of the rigid multilayer printed wiring board 400.

The thickness of the resin layer between the conductor layers like the resin layers 441 and 443 is desirably 20 μm or more in the cured state. In addition, the thickness of the resin layer serving as a surface insulating layer such as the resin layer 442 is preferably 5 μm or more and 30 μm or less in the cured state.
The film thickness of the conductor layers 431, 432, 433, and 434 is preferably 5 μm or more and 300 μm or less.

  In the present embodiment, stacking and stacking of each layer constituent material may be performed by stacking, for example, one layer at a time, or a plurality of layer constituent materials may be stacked and stacked, or a combination thereof. Also good.

  In the present embodiment, the copper clad laminate 461 is used. However, for example, a step of stacking the conductor layers 431 and 432 on the upper surface portion 411a and the lower surface portion 411b of the core material 411 may be included. .

In the present embodiment, a step of forming a via hole may be provided in any manufacturing process of the rigid multilayer printed wiring board 400. For example, after all layer constituent materials that are constituent elements of the rigid multilayer printed wiring board 400 are in a laminated state, via holes (not shown) are formed at predetermined positions thereof to form conductor layers 431, 432, and 433. , 434 can be electrically connected. Further, for example, the via hole may be provided when a part of the layer constituent materials is in a laminated state.
The position where the via hole is formed can be appropriately adjusted according to the design circuit pattern in the rigid multilayer printed wiring board 400.
Then, by mounting predetermined electronic components on predetermined positions (for example, land portions, not shown) of the conductor layers 431 and 434 and formed via holes, a desired rigid multilayer printed circuit board is manufactured.

The rigid multilayer printed wiring board 400 can bend the portion where the resin layer 442 is laminated (having a film thickness H2) so that the conductor layer 431 is the outermost layer. Thus, since the rigid multilayer printed wiring board 400 can be used in a bent state, it is possible to efficiently use the space in the electronic control device and mount electronic components on the rigid multilayer printed wiring board 400 ( Design) and the degree of freedom in designing an electronic control device incorporating the same.
Since the rigid multilayer printed wiring board 400 can adjust its film thickness without selecting a material, for example, a material having high heat resistance and durability can be used in this portion, and a resin having a special performance can be used. Since it can be used, high reliability can be realized.

Further, in the rigid multilayer printed wiring board 400, the core material 411 and the conductor layers 431 and 432 constituting the portion having the thickness H2, and the core material 411 and the conductor layers 431 and 432 (433) constituting the portion having the thickness H1. , 434) can be made of the same material, so that the difference in thermal expansion coefficient can be suppressed and the occurrence of breakage can also be suppressed. Further, when these materials are the same, the dielectric constants also match, so that it is possible to easily cope with high frequency characteristics as compared with the case where these materials are different.
And since the material of each layer constituent material which comprises the part used as the film thickness H2 and each layer constituent material which comprises the part used as the film thickness H1 can be made the same, and since the existing layer constituent material can be utilized, the existing layer The results of reliability evaluation, etc. that have already been obtained for component materials (for example, circuits, through holes, etc.) can be partially used for reliability evaluation of the rigid multilayer printed wiring board 400 itself, and the cost and time required for this can be suppressed. can do.

<Fifth Embodiment>
A fifth embodiment will be described with reference to FIGS. 11 and 12.
First, a copper clad laminate 561 in which conductor layers 531 and 532 are respectively laminated on the upper surface portion 511a and the lower surface portion 511b of the core material 511 is prepared. Also, a copper clad laminate 562 in which a conductor layer 533 is laminated on the lower surface portion 512b of the core material 512 is prepared. (See FIG. 11 (a)).
For the copper-clad laminate 561, a method similar to the method for producing the copper-clad laminate 161 of the modified example of the first embodiment described above can be used, and a similar configuration can be adopted. Further, the copper clad laminate 562 can use a method similar to the method for producing the copper clad laminate 161 except that the conductor layer is not laminated on the upper surface portion 512a of the core material 512, and can have the same configuration.

  Next, a resin dam layer 521 is formed on the upper surface portion of the conductor layer 532 constituting the copper-clad laminate 561 (the surface not in contact with the upper surface portion 511a of the core material 511). Also, a resin dam layer 522 is formed on the lower surface portion of the conductor layer 533 constituting the copper clad laminate 562 (the surface not in contact with the lower surface portion 512b of the core material 512) (see FIG. 11B).

The formation of the resin dam layer 521 on the upper surface portion of the conductor layer 532 and the formation of the resin dam layer 522 on the lower surface portion of the conductor layer 533 are the same as the method for forming the resin dam layer 121 of the first embodiment described above. Can be used, and the same configuration can be adopted.
In this embodiment, two resin dam layers 521 are formed on the upper surface portion of the conductor layer 532 (resin dam layers 5211 and 5212), and two resin dam layers 522 are formed on the lower surface portion of the conductor layer 533 (see FIG. If the resin dam layers 5221 and 5222) can adjust the film thickness of the rigid multilayer printed wiring board 500 to be produced, the number of the resin dam layers 521 and 522 formed may be one, There may be more than one.
The layer constituent material for forming the resin dam layers 531 and 532 and the position thereof can be appropriately adjusted depending on the design content of the manufactured rigid multilayer printed wiring board 500 and the position where the film thickness is to be adjusted. In the present embodiment, the position is adjusted so that the side surface portion 521b of the resin dam layer 5211 and the side surface portion 521c of the resin dam layer 5221 constitute side surfaces 500a and 500b of the rigid multilayer printed wiring board 500 described later, respectively. Preferably, the dam layer 521 is formed, and the side surface portion 522b of the resin dam layer 5221 and the side surface portion 522b of the resin dam layer 5222 are positioned so as to constitute side surfaces 500c and 500d of the rigid multilayer printed wiring board 500 described later. It is desirable to adjust to form the resin dam layer 522.
The film thickness of the resin dam layers 521 and 522 is appropriately adjusted depending on the film thickness of the rigid multilayer printed wiring board 500 to be manufactured, the layer constituent materials forming the resin dam layers 521 and 522 and the film thicknesses of other layer constituent materials. Can do.
Also, the resin dam layers 521 and 522 are cured by at least one of ultraviolet curing and thermal curing in any of the manufacturing processes of the rigid multilayer printed wiring board 500, and are laminated with other layer constituent materials in contact therewith. obtain.
In addition, you may perform the said thermosetting simultaneously with the heating of the resin layers 541 and 543 and the resin layers 542 and 546 which are mentioned later.

Then, the resin layer 541 is formed on the upper surface side of the conductor layer 532 so that the side surface portion 521b of the resin dam layer 5211 and the side surface portion 521c of the resin dam layer 5212 constitute side surfaces 500a and 500b of the rigid multilayer printed wiring board 500, which will be described later. Intermediate material and conductor layer 534 are stacked. Further, a side surface portion 522b of the resin dam layer 5221 and a side surface portion 522c of the resin dam layer 5222 are formed as a resin layer 543 on the lower surface side of the conductor layer 533 so that the side surface portions 500c and 500d of the rigid multilayer printed wiring board 500 are formed. The material and conductor layers 535 are stacked, and the copper-clad laminates 561 and 562 are stacked with the copper-clad laminate 561 as the upper side and the copper-clad laminate 562 as the lower side (see FIG. 11C).
In the present embodiment, the resin layer 541 and the conductor layer 534 are stacked on a surface other than the gap between the two resin dam layers 5211 and 5212 on the upper surface portion of the conductor layer 532, and the two resin dams on the lower surface portion of the conductor layer 531. A resin layer 543 and a conductor layer 535 are stacked on the surface of the layers 5221 and 5222 other than the gap portion.
That is, as shown in FIG. 11C, the height (film thickness) of the resin dam layer 521 and the height (film thickness) of the resin layer 541 and the conductor layer 534 are set to the same level, and one by one. The resin layer 541 and the conductor layer 534 are stacked in the vicinity of the side surface portion 521a of the resin dam layer 5211 and are provided on the upper surface portion side of the conductor layer 532 with a slight gap so as not to come into contact therewith. In addition, the resin layer 541 and the conductor layer 534 are stacked on the upper surface portion side of the conductor layer 532 by providing a slight gap so that the resin layer 541 and the conductor layer 534 are in the vicinity of the side surface portion 521d of the resin dam layer 5212 and do not come into contact therewith. It is done.
Further, the height (film thickness) of the resin dam layer 522 and the height (film thickness) obtained by combining the resin layer 543 and the conductor layer 535 are approximately the same, and the resin layer 543 and the conductor layer 535 are made of resin. A small gap is provided in the vicinity of the side surface portion 522 a of the dam layer 5221 so as not to contact with the side surface portion 522 a, and the conductor layer 533 is stacked on the lower surface portion side. Another resin layer 543 and conductor layer 535 are stacked on the lower surface portion side of the conductor layer 533 with a slight gap provided in the vicinity of the side surface portion 521d of the resin dam layer 5222 so as not to come into contact therewith. It is done.

  In the present embodiment, the height (film thickness) of the resin dam layer 521 is equal to the height (film thickness) of the resin layer 541 and the conductor layer 534, and the height (film thickness) of the resin dam layer 522 is the same. However, it is a matter of course that the film thicknesses of the resin layers 541 and 543 and the conductor layers 534 and 535 may be appropriately adjusted. .

  The copper-clad laminates 561 and 562 are, for example, stacked by interposing layers (adhesive layers; not shown) made of an adhesive resin composition between the copper-clad laminates 561 and 562 to form a rigid multilayer printed wiring board. By heating in any of the 500 manufacturing steps, the lower surface portion of the conductor layer 531 constituting the copper-clad laminate 561 and the upper surface portion 512a of the core material 512 constituting the copper-clad laminate 562 via the adhesive layer, These can be laminated so that they are in contact with each other.

The conductor layers 534 and 535 can be laminated by stacking them on the upper surface portion of the resin layer 541 and the lower surface portion of the resin layer 543 in the same manner as the conductor layer 131 of the first embodiment.
The conductor layers 534 and 535 may be laminated with the resin layers 541 and 543 when the resin layers 541 and 543 described later are heated.

  The resin layers 541 and 543 can have the same configuration as the resin layer 141 in the first embodiment described above, and can be stacked on other layer constituent materials by the same method.

The resin layers 541 and 543 can be cured by heating in any step of the manufacturing process of the rigid multilayer printed wiring board 500, and can be laminated with other layer constituent materials in contact therewith.
During the heating, the resin composition flowing out from the resin layer 541 stacked on the side surface portion 521a side of the resin dam layer 5211 is the side surface portion 521a of the resin dam layer 5211 shown in FIG. It flows into a gap surrounded by 534 and the resin layer 541 and is cured to become a resin layer 5441 (cured resin). During the heating, the resin composition that has flowed out of the resin layer 541 stacked on the side surface portion 521d side of the resin dam layer 5212 is the side surface portion 521d of the resin dam layer 5212 and the conductor layer 532 shown in FIG. , 534 and the resin layer 541 and flows into a gap surrounded by the resin layer 541 to be cured into a resin layer 5442 (cured resin).
Further, during the heating, the resin composition that has flowed out from the resin layer 543 stacked on the side surface 522a side of the resin dam layer 5221 is the side surface portion 522a of the resin dam layer 5221 and the conductor layer 533 shown in FIG. , 535 and the resin layer 543 and flows into a gap surrounded by the resin layer 543 to be cured into a resin layer 5451 (cured resin). Further, during the heating, the resin composition flowing out from the resin layer 543 stacked on the side surface portion 522d side of the resin dam layer 5222 is the side surface portion 522d of the resin dam layer 5222 and the conductor layer 533 shown in FIG. , 535 and the resin layer 543 and flows into a gap surrounded by the resin layer 543 to be cured into a resin layer 5452 (cured resin).
Then, the resin dam layer 5211 (side surface portion 521a side), the resin layer 541, and the conductor layer 534 are laminated so as to be adjacent to each other through the resin layer 5441, and the resin dam layer 5212 (side surface portion 521d is interposed through the resin layer 5442. Side), the resin layer 541, and the conductor layer 534 may be in a laminated state (see FIG. 12E).
Further, the resin dam layer 5221 (side surface portion 522a side) is laminated to the resin layer 543 and the conductor layer 535 via the resin layer 5451, and the resin dam layer 5222 (side surface portion 522d side) is interposed therebetween. ), The resin layer 543, and the conductor layer 535 may be in a laminated state (see FIG. 12E).
Thus, the resin dam layer 521 serves as a wall that keeps the flow of the resin composition eluted from the resin layer 541 during the heating, and the resin composition is the two resin dam layers 5211 on the upper surface of the conductor layer 532. , 5212 can be prevented from eluting to the surface of the gap portion. Thereby, the upper surface part of the conductor layer 532 can be kept smooth, and the film thickness adjustment of the rigid multilayer printed wiring board 500 can be facilitated.
In addition, the resin dam layer 522 serves as a wall that stops the flow of the resin composition eluted from the resin layer 543 during the heating, and the resin composition adheres to and cures at a place where the resin composition should not originally adhere in each layer constituent material. This can be suppressed.

  In the present embodiment, the resin layer 542 is provided on the surface of the gap between the two resin dam layers 5211 and 5212 in the upper surface portion of the conductor layer 532, and the two resin dam layers 5221 and 5222 in the lower surface portion of the conductor layer 533. The resin layers 546 are stacked on the surface of the gap portion.

  The resin layers 542 and 546 can have the same configuration as the resin layer 142 in the first embodiment described above, and can be stacked on other layer constituent materials by the same method. When the rigid multilayer printed wiring board 500 to be produced is used in a bent state, the resin layers 542 and 546 that are laminated with the conductor layers 532 and 533 by heating and / or ultraviolet irradiation described later are flexible. It is desirable to adjust the components of the resin composition used for these formations so as to have

  The resin layers 542 and 546 are cured by being heated and / or irradiated with ultraviolet rays or the like in any step of the manufacturing process of the rigid multilayer printed wiring board 500, and can be laminated with other layer constituent materials in contact therewith. Note that the heating may be performed simultaneously with the heating of the resin layers 541 and 545.

In the present embodiment, the resin layers 542 and 546 are stacked on the upper surface portion of the conductor layer 532 and the lower surface portion side of the conductor layer 533 after stacking other layer constituent materials. You may stack | stack on the upper surface part of the conductor layer 532, and the lower surface part of the conductor layer 533, respectively, simultaneously with the stack | stacking of the front or another layer structure material.
In this embodiment, the resin dam layers 521 and 522 are formed on the upper surface portion of the conductor layer 532 and the lower surface portion of the conductor layer 533, respectively. For example, the resin dam layer 521 is formed on the upper surface portion of the resin layer 542, and the resin dam is formed. The resin layer 542 on which the layer 521 is formed may be stacked at a predetermined position on the upper surface portion of the conductor layer 532. The resin dam layer 522 is formed on the lower surface portion of the resin layer 546, and the resin layer 546 on which the resin dam layer 522 is formed is formed. The conductor layer 533 may be stacked at a predetermined position on the lower surface portion.
When the conductor layer 532 is not provided on the surface corresponding to the gap between the resin dam layers 5211 and 5212 in the upper surface portion 511a of the core material 511, for example, the conductor layer 532 laminated on the portion is removed by an etching process or the like. When the resin dam layer 521 is formed on the portion of the upper surface portion 511a of the material 511 where the conductor layer 532 is removed and another layer constituent material is stacked, the resin layer 542 is excluded from the components of the rigid multilayer printed wiring board 500. May be. Similarly, when the conductor layer 533 is not provided on the surface corresponding to the gap between the resin dam layers 5221 and 5222 in the lower surface portion 511b of the core material 512, for example, the conductor layer 533 laminated on the portion is removed by an etching process or the like. When the resin dam layer 522 is formed on the portion of the lower surface portion 511b of the core material 511 where the conductor layer 533 is removed and another layer constituent material is stacked, the resin layer 546 is excluded from the components of the rigid multilayer printed wiring board 500. May be.

Then, the resin dam layers 521, 522 and the resin layers 541, 542, 543, 5441, 5442, 5451, 5452, 546 are set in a hardened state, and the respective layer constituent materials that are in contact with each other are set in a laminated state. A printed wiring board 500 is manufactured (see FIG. 12E).
In the rigid multilayer printed wiring board 500 of this embodiment, as shown in FIG. 11E, the side surface portion 521b of the resin dam layer 5211 and the side surface portion 521c of the resin dam layer 5212 are side surfaces 500a of the rigid multilayer printed wiring board 500. , 500b, respectively. The side surface portion 522b of the resin dam layer 5221 and the side surface portion 522c of the resin dam layer 5222 are laminated so as to constitute the side surface portions 500c and 500d of the rigid multilayer printed wiring board 500, respectively.
The resin layer 542 is laminated with the upper surface portion of the conductor layer 532 including the resin dam layer 521 and is in contact with the resin dam layer 521. In the rigid multilayer printed wiring board 500, the upper surface portion of the resin layer 542 and the side surface portion 500a of the rigid multilayer printed wiring board 500 are L-shaped (the side surface portion 500a of the rigid multilayer printed wiring board 500 is a vertical line, and the resin layer 542 has The upper surface portion of the resin layer 542 and the side surface portion 500b of the rigid multilayer printed wiring board 500 form an inverted L-shape (the side surface portion 500b of the rigid multilayer printed wiring board 500). Vertical lines, and the upper surface portion of the resin layer 542 as horizontal lines).
Further, the resin layer 546 is laminated with the lower surface portion of the conductor layer 533 including the resin dam layer 522 and is in contact with the resin dam layer 522. In the rigid multilayer printed wiring board 500, the lower surface portion of the resin layer 546 and the side surface portion 500c of the rigid multilayer printed wiring board 500 are inverted L-shaped (the side surface portion 500c of the rigid multilayer printed wiring board 500 is a vertical line, and the resin layer 546 The bottom surface portion of the resin layer 546 and the side surface portion 500d of the rigid multilayer printed wiring board 500 form an L-shape (the side surface portion 500d of the rigid multilayer printed wiring board 500). Vertical lines, and the lower surface portion of the resin layer 546 as horizontal lines).
The rigid multilayer printed wiring board 500 of the present embodiment has such a configuration, so that the height (film thickness H1) from the upper surface portion of the conductor layer 534 to the lower surface portion of the conductor layer 535 and the upper surface portion of the resin layer 542 are increased. The height (film thickness H2) to the lower surface portion of the resin layer 546 can be made different, that is, the film thickness H2 can be made thinner than the film thickness H1.

  In the rigid multilayer printed wiring board 500, the film thickness H1 is preferably 100 μm or more and 6 mm or less. The film thickness H2 is preferably 30 μm or more and is preferably 100 μmm or less thinner than the film thickness H1.

  As described above, the rigid multilayer printed wiring board 500 manufactured by the manufacturing method of the present embodiment does not require a step of forming a gap portion in a layer (core material 511, 512) that becomes a core of the rigid multilayer printed wiring board 500. In addition, the thickness (H1, H2) of the rigid multilayer printed wiring board 500 can be easily adjusted by adjusting the stacking position of each layer constituent material in the step of stacking the layer constituent materials.

  The conductor layers 531, 532, 533, 534, and 535 can remove unnecessary portions by etching or the like so as to form a desired circuit pattern in any step of the manufacturing process of the rigid multilayer printed wiring board 500.

The thickness of the resin layer between the conductor layers like the resin layers 541 and 543 is desirably 20 μm or more in the cured state. In addition, the thickness of the resin layer serving as the surface insulating layer such as the resin layers 542 and 546 is desirably 5 μm or more and 30 μm or less in the cured state.
The film thickness of the conductor layers 531, 532, 533, 534, and 535 is preferably 5 μm or more and 300 μm or less.

  In the present embodiment, stacking and stacking of each layer constituent material may be performed by stacking, for example, one layer at a time, or a plurality of layer constituent materials may be stacked and stacked, or a combination thereof. Also good.

  In the present embodiment, the copper clad laminates 561 and 562 are used. However, for example, there is a step of stacking the conductor layers 531 and 532 on the upper surface portion 511a and the lower surface portion 511b of the core material 511, respectively. Alternatively, a step of stacking the conductor layer 533 on the lower surface portion 512b of the core material 512 to form a laminated state may be included.

In the present embodiment, a step of forming a via hole may be provided in any manufacturing process of the rigid multilayer printed wiring board 500. For example, after all the layer constituent materials which are constituent elements of the rigid multilayer printed wiring board 500 are laminated, via holes (not shown) are formed at predetermined positions thereof, thereby forming the conductor layers 531, 532 and 533. 534, 535 can be electrically connected. Further, for example, the via hole may be provided when a part of the layer constituent materials is in a laminated state.
The position where the via hole is formed can be appropriately adjusted according to the design circuit pattern in the rigid multilayer printed wiring board 500.
Then, by mounting predetermined electronic components on predetermined positions (for example, land portions, not shown) of the conductor layers 534 and 535 and formed via holes, a desired rigid multilayer printed circuit board is manufactured.

The rigid multilayer printed wiring board 500 can bend the portion where the resin layers 542 and 546 are laminated (having the film thickness H2) so that the conductor layer 534 is the outermost layer. Further, the rigid multilayer printed wiring board 500 can bend the portion where the resin layers 542 and 546 are laminated (having the film thickness H2) so that the conductor layer 535 is the outermost layer.
In this way, the rigid multilayer printed wiring board 500 can be used in a bent state in either direction, such that the conductor layer 534 side is the outermost layer and the conductor layer 535 side is the outermost layer. Therefore, the space in the electronic control device can be used more efficiently, and the degree of freedom in designing (mounting) the electronic component on the rigid multilayer printed wiring board 500 and the electronic control device incorporating the electronic component is further increased. Can be spread.

  The rigid multilayer printed wiring board 500 can adjust the film thickness without selecting the material of the part to be bent (the part where the resin layers 542 and 546 are laminated (the film thickness becomes H2)). Since a material having high heat resistance and durability can be used and a resin having special performance can be used, high reliability can be realized.

Further, in the rigid multilayer printed wiring board 500, the core materials 511, 512 and the conductor layers 531, 532, 533 constituting the portion having the film thickness H2 and the core materials 511, 512 and the conductor constituting the portion having the film thickness H1. Since the layers 531, 532, and 533 (534 and 535) can be made of the same material, the difference in thermal expansion coefficient can be suppressed and the occurrence of breakage can also be suppressed. Further, when these materials are the same, the dielectric constants also match, so that it is possible to easily cope with high frequency characteristics as compared with the case where these materials are different.
And since each layer constituent material which comprises the part used as the film thickness H2 and each layer constituent material which comprises the part used as the film thickness H1 can be made the same material, and since the existing layer constituent material can be utilized, the existing layer The results of reliability evaluation, etc. that have already been obtained for components (for example, circuits, through holes, etc.) can be partially used for reliability evaluation of the rigid multilayer printed wiring board 500 itself, thereby reducing the cost and time required for this. can do.

Note that in the rigid multilayer printed wiring board 500, the side surfaces 521 a and 521 b of the resin dam layer 5211, the side surfaces 521 c and 521 d of the resin dam layer 5212, the side surfaces 522 a and 522 b of the resin dam layer 5221, The parts 522c and 522d are configured so as to exist on the same straight line in the vertical direction, but do not exist on the same straight line in the vertical direction, or only partially on the same straight line in the vertical direction. The resin dam layers 521 and 522 may be formed as existing.
Since such a rigid multilayer printed wiring board 500 can bend the portion having the film thickness H2 so that it is S-shaped or corrugated, the space in the electronic control device is more efficiently utilized. In addition, it is possible to further expand the degree of freedom in mounting (designing) electronic components on the rigid multilayer printed wiring board 500 and designing an electronic control device incorporating the electronic component.

<Sixth Embodiment>
A rigid multilayer printed wiring board 600 according to the sixth embodiment will be described with reference to FIG.
As shown in FIG. 13B, the rigid multilayer printed wiring board 600 has a conductor layer 632, a resin layer 641, and a conductor layer 633 laminated on the upper surface portion 611 a side of the core material 611, and the lower surface of the core material 611. A conductor layer 631 is stacked on the portion 611b side. A resin dam layer 621 is provided on the upper surface of the conductor layer 632. As shown in FIG. 13A, the resin dam layer 621 is provided on the upper surface portion of the conductor layer 632 so as to draw a rectangular outline.
In the present embodiment, the side surfaces of the outer peripheral portion of the resin dam layer 621 are side surfaces 621a, 621b, 621c, and 621d, and the side surfaces of the inner peripheral portion are side surfaces 621e, 621f, 621g, and 621h. did.

  The manufacturing process of the rigid multilayer printed wiring board 600 may include a step of stacking and laminating the conductor layers 631 and 632 on the upper surface portion 611a and the lower surface portion 611b of the core material 611, respectively, and the upper surface portion 611a of the core material 611. Alternatively, a copper clad laminate 661 (not shown) in which conductor layers 631 and 632 are respectively laminated on the lower surface portion 611b may be used.

  The conductor layers 631 and 632 may be stacked on the upper surface portion 611a and the lower surface portion 611b of the core material 611 in the same manner as the conductor layers 131 and 132 of the first embodiment described above, and may be laminated.

For the formation of the resin dam layer 621 on the upper surface portion of the conductor layer 632, a method similar to the method for forming the resin dam layer 121 of the first embodiment described above can be used, and the same configuration can be adopted.
The layer constituent material for forming the resin dam layer 621 and its position can be appropriately adjusted depending on the design content of the rigid multilayer printed wiring board 600 to be produced, the position where the film thickness is to be adjusted, and the like.
Further, the film thickness of the resin dam layer 621 can be appropriately adjusted depending on the film thickness of the rigid multilayer printed wiring board 600 to be produced, the layer constituent material forming the resin dam layer 621, the film thickness of other layer constituent materials, and the like.
Further, the resin dam layer 621 can be cured by at least one of ultraviolet curing and heat curing in any of the manufacturing processes of the rigid multilayer printed wiring board 600, and can be laminated with another layer constituent material in contact therewith.
In addition, you may perform the said thermosetting simultaneously with the heating of the resin layer 641 mentioned later.

  In the rigid multilayer printed wiring board 600, as shown in FIGS. 13A and 13B, 621e, 621f, 621g, and 621h of the side surfaces of the resin dam layer 621 are the side surfaces of the rigid multilayer printed wiring board 600. The layer constituent materials can be stacked to form a laminated state so as to constitute the parts 600a, 600b, 600c, and 600d, respectively.

  In the present embodiment, the resin layer 641 and the conductor layer 633 are stacked on the upper surface side of the conductor layer 632 so that the resin layer 141 and the conductor layer 133 are stacked on the upper surface side of the conductor layer 132 of the first embodiment. A method similar to stacking can be used, and a similar configuration can be employed.

The resin layer 641 can have the same configuration as that of the resin layer 141 in the first embodiment described above, and can be stacked on other layer constituent materials by the same method. In the present embodiment, the resin layer 641 is stacked on the upper surface portion of the conductor layer 632 so as to be in contact with the side surface portions 621a, 621b, 621c, and 621d of the resin dam layer 621.
In addition, the conductor layer 633 can have the same configuration as that of the conductor layer 131 in the first embodiment described above, and can be stacked on other layer constituent materials by the same method. The conductor layer 633 may be laminated with the resin layer 641 when the resin layer 641 described later is heated.

  In this embodiment, the height (film thickness) of the resin dam layer 621 is equal to the height (film thickness) of the resin layer 641 and the conductor layer 633, but these film thicknesses are adjusted as appropriate. Of course it is good.

The resin layer 641 can be cured by heating in any step of the manufacturing process of the rigid multilayer printed wiring board 600 and can be laminated with another layer constituent material in contact therewith. However, depending on the timing at which the resin layer 641 is heated, there is a case where the resin dam layer 621 and the resin layer 641 are in a laminated state before the resin layer 641 is heated. The dam layer 621 and the cured resin layer 641 can be in a laminated state.
The resin dam layer 621 serves as a wall that stops the flow of the resin composition eluted from the resin layer 641 during the heating, and can suppress the resin composition from being eluted to the upper surface of the conductor layer 632. Thereby, the upper surface part of the conductor layer 632 can be kept smooth, and the film thickness adjustment of the rigid multilayer printed wiring board 600 can be facilitated.

The rigid multilayer printed wiring board 600 of the present embodiment is manufactured by the resin dam layer 621 and the resin layer 641 being cured, and the layer constituent materials in contact with each other being laminated.
The rigid multilayer printed wiring board 600 includes an upper surface portion of the conductor layer 632 including the resin dam layer 621, a side surface portion 600a of the rigid multilayer printed wiring board 600, and an upper surface portion of the conductor layer 632 and a side surface portion of the rigid multilayer printed wiring board 600. 600b are L-shaped (when the side surface portions 600a and 600b of the rigid multilayer printed wiring board 600 are viewed as vertical lines and the upper surface portion of the conductor layer 632 as horizontal lines), and the upper surface portion of the conductor layer 632 The side surface portion 600c of the rigid multilayer printed wiring board 600, and the upper surface portion of the conductor layer 632 and the side surface portion 600d of the rigid multilayer printed wiring board 600 are respectively reverse L-shaped (the side surface portions 600c and 600d of the rigid multilayer printed wiring board 600 are Vertical lines, when the upper surface portion of the conductor layer 632 is viewed as horizontal lines).
The rigid multilayer printed wiring board 600 of the present embodiment has such a configuration, so that the height (film thickness H1) from the upper surface portion of the conductor layer 633 to the lower surface portion of the conductor layer 631 and the upper surface portion of the conductor layer 632 are reduced. The thickness (film thickness H2) to the lower surface portion of the conductor layer 631 can be made different, that is, the film thickness H2 can be made thinner than the film thickness H1.

  In the rigid multilayer printed wiring board 600, the film thickness H1 is preferably 100 μm or more and 6 mm or less. The film thickness H2 is preferably 30 μm or more and is preferably 100 μmm or less thinner than the film thickness H1.

That is, the rigid multilayer printed wiring board 600 manufactured by the manufacturing method of the present embodiment does not require a step of forming a gap portion in a layer (core material 611) that becomes the core of the rigid multilayer printed wiring board 600. The film thickness (H1, H2) of the rigid multilayer printed wiring board 300 can be easily adjusted by adjusting the stacking position of each layer constituent material in the step of stacking the constituent materials.
Further, a region in which a part of the side surface portion of the resin dam layer 621 of the rigid multilayer printed wiring board 600 constitutes a part of the side surface portion of the rigid multilayer printed wiring board 600 is depressed in a square shape (concave shape). Therefore, in accordance with the shape of the region, it is possible to embed and mount an electronic component (not shown) that conforms to the shape of the region. In particular, when the resin dam layer 641 is formed using an ink jet printing method, the resin composition can be printed on the upper surface portion of the conductor layer 632 in a fine shape. In this case, a fine electronic component can be embedded and mounted. A rigid multilayer printed wiring board 600 can be produced.
Thus, the rigid multilayer printed wiring board 600 can be embedded with various electronic components. Further, since the rigid multilayer printed wiring board 600 is provided with a plurality of resin dam layers 621, the space in the electronic control device in which the board on which the electronic component is mounted can be efficiently used.

  The conductive layers 631, 632, and 633 can remove unnecessary portions by etching or the like so as to form a desired circuit pattern in any step of the manufacturing process of the rigid multilayer printed wiring board 600.

The film thickness of the resin layer between the conductor layers like the resin layer 641 is desirably 20 μm or more in the cured state.
The film thickness of the conductor layers 631, 632, 633 is preferably 5 μm or more and 300 μm or less.

  In the present embodiment, stacking and stacking of each layer constituent material may be performed by stacking, for example, one layer at a time, or a plurality of layer constituent materials may be stacked and stacked, or a combination thereof. Also good.

In this embodiment, a step of forming a via hole may be provided in any manufacturing process of the rigid multilayer printed wiring board 600. For example, after all layer constituent materials that are constituent elements of the rigid multilayer printed wiring board 600 are in a laminated state, via holes (not shown) are formed at predetermined positions thereof to form conductor layers 631, 632, and 633. Can be electrically connected. Further, for example, the via hole may be provided when a part of the layer constituent materials is in a laminated state.
The position where the via hole is formed can be appropriately adjusted according to the design circuit pattern in the rigid multilayer printed wiring board 600.
Then, by mounting predetermined electronic components on predetermined positions (for example, land portions, not shown) of the conductor layers 631 and 633 and formed via holes, a desired rigid multilayer printed circuit board is manufactured.

  In addition, since the thickness of the rigid multilayer printed wiring board 600 can be adjusted without selecting the material of the part having the film thickness H2, for example, a material having high heat resistance and durability can be used for this part. Since a resin having special performance can be used, high reliability can be realized.

Further, in the rigid multilayer printed wiring board 600, the core material 611 and the conductor layers 631, 632 constituting the part having the film thickness H2 and the core material 611 and the conductor layers 631, 632 (633) constituting the part having the film thickness H1. ) Can be made of the same material, so that the difference in thermal expansion coefficient can be suppressed and the occurrence of breakage can also be suppressed. Further, when these materials are the same, the dielectric constants also match, so that it is possible to easily cope with high frequency characteristics as compared with the case where these materials are different.
And since each layer constituent material which comprises the part used as the film thickness H2 and each layer constituent material which comprises the part used as the film thickness H1 can be made the same material, and since the existing layer constituent material can be utilized, the existing layer The results of reliability evaluation, etc. that have already been obtained for component materials (for example, circuits, through holes, etc.) can be partially used for reliability evaluation of the rigid multilayer printed wiring board 600 itself, and the cost and time required for this can be suppressed. can do.

<Seventh Embodiment>
A seventh embodiment will be described with reference to FIGS. 14 to 17.
A copper-clad laminate 761 in which conductor layers 731 and 732 are respectively laminated on the upper surface portion 711a and the lower surface portion 711b of the core material 711 is prepared (see FIG. 14A).
For the copper-clad laminate 761, a method similar to the method for producing the copper-clad laminate 161 of the modified example of the first embodiment described above can be used, and a similar configuration can be used.

  Next, a gap 751 is formed at a predetermined position of the copper-clad laminate 761 (see FIG. 14B).

For the conductor layers 731 and 732 constituting the copper clad laminate 761, after removing regions corresponding to positions where resin layers 745, 746, 748, and 749 made of a cured resin described later are formed by etching or the like, the conductor layers A resin dam layer 721 is formed on the upper surface portion of 732 (the surface not in contact with the upper surface portion 711a of the core material 711) (see FIG. 14C).
For the formation of the resin dam layer 721 on the upper surface portion of the conductor layer 732, a method similar to the method for forming the resin dam layer 121 of the first embodiment described above can be used, and the same configuration can be adopted.
In this embodiment, two resin dam layers 721 are formed on the upper surface portion of the conductor layer 732 (resin dam layers 7211 and 7212), and one resin dam layer 7211 has a side surface portion 721b of the copper-clad laminate 761. The other resin dam layer 7212 is formed such that the side surface portion 721c is perpendicular to the side surface portion 761b of the copper-clad laminate 761 so as to be on the same straight line as the vertical surface of the side surface portion 761a. The
Note that the number of the resin dam layers 721 formed may be one or plural as long as the thickness of the manufactured rigid multilayer printed wiring board 700 can be adjusted.
Further, the resin dam layer 721 is cured by at least one of ultraviolet curing and thermal curing in any of the manufacturing processes of the rigid multilayer printed wiring board 700, and can be laminated with other layer constituent materials in contact therewith.
In addition, you may perform the said thermosetting simultaneously with the thermocompression bonding mentioned later.

A copper-clad laminate 762 in which conductor layers 733 and 734 are respectively laminated on the upper surface portion 712a and the lower surface portion 712b of the core material 712 is prepared (see FIG. 15D).
For the copper-clad laminate 762, a method similar to the method for producing the copper-clad laminate 161 of the modified example of the first embodiment described above can be used, and a similar configuration can be used.

  Next, with respect to the conductor layers 733 and 734 constituting the copper clad laminate 762, a region corresponding to a position where resin layers 747 and 749 made of a cured resin, which will be described later, are formed, and a side surface portion 721a of the resin dam layer 7211 when stacked. To the side surface portion 721d of the resin dam layer 7212 is removed by etching or the like (see FIG. 15E).

A copper-clad laminate 763 in which conductor layers 735 and 736 are respectively laminated on the upper surface portion 713a and the lower surface portion 713b of the core material 713 is prepared (see FIG. 16F).
For the copper-clad laminate 763, a method similar to the method for producing the copper-clad laminate 161 of the modified example of the first embodiment described above can be used, and a similar configuration can be used.

  Next, in the conductor layer 736 constituting the copper-clad laminate 763, a region corresponding to a position where a resin layer 744 made of a cured resin, which will be described later, is formed is removed by etching or the like (see FIG. 16G).

  Then, the resin layer 741 is stacked at a predetermined position on the upper surface portion of the conductor layer 736 (see FIG. 16H). The resin layer 741 can have the same configuration as the resin layer 142 in the first embodiment described above, and can be stacked on other layer constituent materials by the same method. In addition, when the rigid multilayer printed wiring board 700 to be manufactured is used in a bent state, the resin layer 741 that is laminated with the conductor layer 736 by heating and / or ultraviolet irradiation, which will be described later, is flexible. It is desirable to adjust the components of the resin composition used for formation.

The resin layer 741 can be cured by being heated and / or irradiated with ultraviolet rays or the like in any step of the manufacturing process of the rigid multilayer printed wiring board 700, and can be laminated with other layer constituent materials in contact therewith.
The position of the conductor layer 736 on which the resin layer 741 is stacked and the size (width) of the resin layer 741 are such that the side surface portion 722b of the resin dam layer 7221 described later is a rigid multilayer print in the manufactured rigid multilayer printed wiring board 700. Adjust appropriately so that a part of the side part 700a of the wiring board 700 is configured, and the side part 722c of the resin dam layer 7222 is stacked so as to form a part of the side part 700b of the rigid multilayer printed wiring board 700. Can do.

Then, a resin dam layer 722 is formed on the upper surface portion of the resin layer 741 (the surface not in contact with the upper surface portion of the conductor layer 736) (see FIG. 16I).
For the formation of the resin dam layer 721 on the upper surface portion of the resin layer 741, a method similar to the method for forming the resin dam layer 121 of the first embodiment described above can be used, and a similar configuration can be adopted.
In the present embodiment, two resin dam layers 722 are formed on the upper surface of the resin layer 741 (resin dam layers 7221 and 7222). Further, the resin dam layer 722 includes a resin dam layer 7211 in which side surfaces 722a and 722b of the resin dam layer 7221 and side surfaces 722c and 722d of the resin dam layer 7222 are respectively stacked when copper clad laminates 761, 762 and 763 described later are stacked. The side surfaces 721a and 721b of the resin dam layer 7212 and the side surfaces 721c and 721d of the resin dam layer 7212 are formed so as to be on the same straight line.
Note that the number of the resin dam layers 722 formed may be one or plural as long as the thickness of the manufactured rigid multilayer printed wiring board 700 can be adjusted.
The resin dam layer 722 is cured by at least one of ultraviolet curing and heat curing in any of the manufacturing processes of the rigid multilayer printed wiring board 700, and is laminated with the lower surface portion 711b of the core material 711 and the resin layer 741. Become. In addition, you may perform the said thermosetting simultaneously with the thermocompression bonding mentioned later.

Then, the side surface portion 721b of the resin dam layer 7211, the side surface portion 721c of the resin dam layer 7212, the side surface portion 722b of the resin dam layer 7221, and the side surface portion 722c of the resin dam layer 7222 are respectively described. , 700b, the copper clad laminates 761, 762, 763 are stacked so as to be 763, 761, 762 from the bottom, and the resin layer 742, as shown in FIG. 743 is stacked.
In this embodiment, as shown in FIG. 17J, one resin layer 742 is in contact with the upper surface portion of the conductor layer 736 and the lower surface portion of the conductor layer 731 and the side surface portion 722a of the resin dam layer 7221. The resin dam layer 7222 is stacked such that another resin layer 742 is in contact with the upper surface portion of the conductor layer 736 and the lower surface portion of the conductor layer 731. In the vicinity of the side surface portion 722d, a small gap is provided so as not to contact the side surface portion 722d.
17J, one resin layer 743 is in contact with the upper surface portion of the conductor layer 732 and the lower surface portion of the conductor layer 733, and in the vicinity of the side surface portion 721a of the resin dam layer 7211. The resin layer 743 is stacked with a slight gap so as not to contact it, and another resin layer 743 is in contact with the upper surface portion of the conductor layer 732 and the lower surface portion of the conductor layer 733 and the side surface portion 721d of the resin dam layer 7212 They are stacked with a slight gap so that they are close to each other and not in contact therewith.

  In the present embodiment, the height (film thickness) of the resin dam layer 721 is equal to the height (film thickness) of the conductor layers 732 and 733 and the resin layer 743, and the resin dam layer 722 and the resin layer 741 are Although the combined height (film thickness) and the combined height (film thickness) of the conductor layer 731 and the resin layer 742 are made equal, it goes without saying that the respective film thicknesses may be adjusted as appropriate. Similarly, the film thickness of other layer constituent materials can be adjusted as appropriate.

The resin layers 742 and 743 can be cured by heating in any step of the manufacturing process of the rigid multilayer printed wiring board 700, and can be laminated with other layer constituent materials in contact therewith. In the present embodiment, it is desirable to stack each layer constituent material and then put each layer constituent material into a laminated state by thermocompression bonding.
During the heating, the resin composition flowing out from the resin layer 742 stacked on the side surface portion 722a side of the resin dam layer 7221 is the upper surface portion 713a, the conductor layer 736, and the resin of the core material 713 shown in FIG. The gap surrounded by the layer 742, the lower face 711b of the core material 711, the gap surrounded by the conductor layer 731 and the resin layer 742, the lower face 711b of the core material 711, the side face 722a of the resin dam layer 7221, and the conductor layer. 731 and 736 and the resin layers 741 and 742, respectively, are introduced into the gaps, which are cured to become resin cured products (resin layers 744, 745 and 7481), respectively.
Further, during the heating, the resin composition that has flowed out of the resin layer 742 stacked on the side surface portion 722d side of the resin dam layer 7222 has an upper surface portion 713a, a conductor layer 736, and a core layer 713 shown in FIG. The gap surrounded by the resin layer 742, the lower face 711b of the core material 711, the gap surrounded by the conductor layer 731 and the resin layer 742, the lower face 711b of the core material 711, the side face 722d of the resin dam layer 7222, the conductor The resin flows into gaps surrounded by the layers 731 and 736 and the resin layers 741 and 742, and is cured to become cured resin products (resin layers 744, 745 and 7482), respectively.
Furthermore, the resin composition that has flowed out of the resin layer 743 stacked on the side surface portion 721a side of the resin dam layer 7211 during the above heating is the upper surface portion 711a of the core material 711 shown in FIG. 732 and the gap surrounded by the resin layer 743, the lower surface portion 712b of the core material 712, the gap surrounded by the conductor layer 733 and the resin layer 743, the lower surface portion 712b of the core material 712, and the side surface portion 721a of the resin dam layer 7211. Then, they flow into gaps surrounded by the conductor layers 732 and 733 and the resin layer 743, respectively, and are cured to become cured resin products (resin layers 746, 747 and 7491), respectively.
In addition, the resin composition that has flowed out of the resin layer 743 stacked on the side surface portion 721d side of the resin dam layer 7212 during the heating is the upper surface portion 711a, the conductor layer 732, and the resin of the core material 711 shown in FIG. The gap surrounded by the layer 743, the lower face 712b of the core material 712, the gap surrounded by the conductor layer 733 and the resin layer 743, the lower face 712b of the core material 712, the side face 721d of the resin dam layer 7212, and the conductor layer 732 and 733, and the resin layer 743, respectively, flow into the gaps, which are cured to become cured resin products (resin layers 746, 747, and 7492), respectively.
Then, the resin dam layer 7221 (side surface portion 722a side) is laminated so that the conductor layer 731 and the resin layer 742 are adjacent to each other via the resin layer 7481, and the resin dam layer 7222 (side surface portion) is interposed via the resin layer 7482. 722d side), the conductor layer 731 and the resin layer 742 may be in a stacked state (see FIG. 17K). At this time, the resin layer 7481, the lower surface portion 711b of the core material 711, and the upper surface portion of the conductor layer 736 can be laminated, and the resin layer 7482, the lower surface portion 711b of the core material 711, and the upper surface portion of the conductor layer 736 can be laminated. .
In addition, the resin dam layer 7211 (side surface portion 721a side), the conductor layers 732 and 733, and the resin layer 743 are stacked so as to be adjacent to each other through the resin layer 7491, and the resin dam layer 7212 (side surface) is interposed through the resin layer 7492. (The portion 721d side), the conductor layers 732 and 733, and the resin layer 743 are adjacent to each other (see FIG. 17K). At this time, the resin layer 7491, the upper surface portion 711a of the core material 711, and the lower surface portion 712b of the core material 712 are laminated, and the resin layer 7492, the upper surface portion 711a of the core material 711, and the lower surface portion 712b of the core material 712 are laminated. Can be.
The resin layer 744 is laminated with the upper surface portion 713a of the core material 713, the side surface portion of the conductor layer 736, and the lower surface portion of the resin layer 742, and the resin layer 745 is the lower surface portion 711b of the core material 711 and the side surface portion of the conductor layer 732. The resin layer 746 is laminated with the upper surface portion 711 a of the core material 711, the side surface portion of the conductor layer 733 and the lower surface portion of the resin layer 743, and the resin layer 747 is laminated with the upper surface portion of the core material 712. The lower surface portion 712b, the side surface portion of the conductor layer 733, and the upper surface portion of the resin layer 743 can be stacked.
The resin dam layer 721 serves as a wall that stops the flow of the resin composition eluted from the resin layer 743 during the heating, and can prevent the resin composition from being eluted to the upper surface of the resin layer 741. Thereby, the upper surface part of the resin layer 741 can be kept smooth, and the film thickness adjustment of the rigid multilayer printed wiring board 700 can be facilitated.
In addition, the resin dam layer 722 serves as a wall that stops the flow of the resin composition eluted from the resin layer 743 during the heating, and can suppress the resin composition from being eluted to the upper surface of the resin layer 741. Thereby, the upper surface part of the resin layer 741 can be kept smooth, and the film thickness adjustment of the rigid multilayer printed wiring board 700 can be facilitated.

  In the present embodiment, the resin layers 742 and 743 and the copper-clad laminates 761, 762 and 763 are stacked at the same time to form a laminated state. For example, the resin layer 742 and the copper-clad laminates 761 and 763 are These may be stacked to form a laminated state, and then the resin layer 743 and the copper-clad laminate 762 may be stacked to form a laminated state. The resin layer 743 and the copper-clad laminates 761 and 762 may be stacked to form a laminated state. Then, the resin layer 742 and the copper clad laminate 763 may be stacked to form a laminated state.

In the present embodiment, the resin dam layers 721 and 722 and the resin layers 741, 742, 743, 744, 745, 746, 747, 7481, 7482, 7491, and 7492 are in a cured state, and the layer constituent materials that are in contact with each other are in a laminated state. After that, the core material 712 and the conductor layer 734 are cut at positions corresponding to the same straight line and perpendicular to the side surface portion 721b of the resin dam layer 7211 and the side surface portion 722b of the resin dam layer 7221. The core material 712 and a part of the conductor layer 734 are removed by cutting positions corresponding to the same vertical line on the side surface portion 721c of the layer 7212 and the side surface portion 722c of the resin dam layer 7222. Thereby, the rigid multilayer printed wiring board 700 of this embodiment is produced (refer FIG.17 (l)).
In this embodiment, the core material 712 and a part of the conductor layer 734 are removed after all the layer constituting materials are in the laminated state. However, these removals are performed in any of the manufacturing processes of the rigid multilayer printed wiring board 700. There may be.
As shown in FIG. 17L, the rigid multilayer printed wiring board 700 has a side surface portion 721b of the resin dam layer 7211 and a side surface portion 722b of the resin dam layer 7221 of the side surface portion 700a of the rigid multilayer printed wiring board 700. A part of the side surface portion 721c of the resin dam layer 7212 and a side surface portion 722c of the resin dam layer 7222 constitute a part of the side surface portion 700b of the rigid multilayer printed wiring board 700.
In the rigid multilayer printed wiring board 700, the upper surface portion of the resin layer 741 including the resin dam layer 722 and the side surface portion 700a of the rigid multilayer printed wiring board 700 are L-shaped (the side surface portion 700a of the rigid multilayer printed wiring board 700 is vertically formed). The upper surface of the resin layer 741 and the side surface 700b of the rigid multilayer printed wiring board 700 are inverted L-shaped (rigid multilayer printed wiring board). The side surface portion 700b of 700 is a vertical line, and the upper surface portion of the resin layer 741 is a horizontal line).
With this configuration, the rigid multilayer printed wiring board 700 of the present embodiment has a height (film thickness H1) from the upper surface portion of the conductor layer 734 to the lower surface portion of the conductor layer 735 and the upper surface portion of the resin layer 741. The height (film thickness H2) to the lower surface portion of the conductor layer 735 can be made different, that is, the film thickness H2 can be made thinner than the film thickness H1.

  In the rigid multilayer printed wiring board 700, the film thickness H1 is desirably 100 μm or more and 6 mm or less. The film thickness H2 is preferably 30 μm or more and is preferably 100 μmm or less thinner than the film thickness H1.

  As described above, the rigid multilayer printed wiring board 700 manufactured by the manufacturing method according to the present embodiment does not require a step of forming a gap portion in a layer (core material 713) serving as a core of the rigid multilayer printed wiring board 700. Further, by adjusting the stacking position of each layer constituent material in the step of stacking the layer constituent materials constituting the rigid multilayer printed wiring board 700, the film thickness (H1, H2) of the rigid multilayer printed wiring board 700 can be easily adjusted. In addition, the layer (resin layer 741) exposed to the outside can be easily adjusted.

  The conductor layers 731, 732, 733, 734, 735, and 736 can remove unnecessary portions by etching or the like so that a desired circuit pattern is obtained in any step of the manufacturing process of the rigid multilayer printed wiring board 700. .

The thickness of the resin layer between the conductor layers like the resin layers 742 and 743 is preferably 20 μm or more in the cured state. In addition, the thickness of the resin layer serving as a surface insulating layer such as the resin layer 741 is desirably 5 μm or more and 30 μm or less in the cured state.
Further, the film thickness of the conductor layers 731, 732, 733, 734, 735, 736 is desirably 5 μm or more and 300 μm or less.

  In this embodiment, the copper clad laminates 761, 762, 763 are used. For example, the step of stacking the conductor layers 731 and 732 on the upper surface portion 711a and the lower surface portion 711b of the core material 711, respectively, Conductive layers 733 and 734 are stacked on the upper surface portion 712a and the lower surface portion 712b of the material 712 to form a laminated state, and conductive layers 735 and 736 are stacked on the upper surface portion 713a and the lower surface portion 713b of the core material 713, respectively. The process to perform may be included.

In this embodiment, a step of forming a via hole may be provided in any manufacturing process of the rigid multilayer printed wiring board 700. For example, after all the layer constituent materials that are constituent elements of the rigid multilayer printed wiring board 700 are laminated, via holes (not shown) are formed at predetermined positions thereof, thereby forming the conductor layers 731, 732, and 733. , 734, 735, 736 can be electrically connected. Further, for example, the via hole may be provided when a part of the layer constituent materials is in a laminated state.
The position where the via hole is formed can be appropriately adjusted according to the design circuit pattern in the rigid multilayer printed wiring board 700.
Then, by mounting predetermined electronic components on predetermined positions (for example, land portions, not shown) of the conductor layers 734 and 735 and formed via holes, a desired rigid multilayer printed circuit board is manufactured.

The rigid multilayer printed wiring board 700 can bend the portion where the resin layer 741 is laminated (having the film thickness H2) so that the conductor layer 735 is the outermost layer. Thus, since the rigid multilayer printed wiring board 700 can be used in a bent state, it is possible to efficiently use the space in the electronic control device and mount electronic components on the rigid multilayer printed wiring board 700 ( Design) and the degree of freedom in designing an electronic control device incorporating the same.
Since the rigid multilayer printed wiring board 700 can be adjusted in film thickness without selecting a material, for example, a material having high heat resistance and durability can be used in this portion, and a resin having special performance can be used. Since it can be used, high reliability can be realized.

Furthermore, in the rigid multilayer printed wiring board 700, the core material 713 and the conductor layers 735 and 736 constituting the portion having the film thickness H2, and the core material (711, 712) 713 and the conductor layer constituting the portion having the film thickness H1. Since (731, 732, 733, 734) 735, 736 can be the same material, the difference in thermal expansion coefficient can be suppressed and the occurrence of breakage can also be suppressed. Further, when these materials are the same, the dielectric constants also match, so that it is possible to easily cope with high frequency characteristics as compared with the case where these materials are different.
And since the material of each layer constituent material which comprises the part used as the film thickness H2 and each layer constituent material which comprises the part used as the film thickness H1 can be made the same, and since the existing layer constituent material can be utilized, the existing layer The results of reliability evaluation, etc. that have already been obtained for component materials (for example, circuits, through holes, etc.) can be partially used for reliability evaluation of the rigid multilayer printed wiring board 700 itself, and the cost and time required for this can be suppressed. can do.

<Eighth Embodiment>
The eighth embodiment will be described with reference to FIGS.
A copper-clad laminate 861 in which conductor layers 831 and 832 are laminated on the upper surface portion 811a and the lower surface portion 811b of the core material 811 is prepared (see FIG. 18A).
For the copper-clad laminate 861, a method similar to the method for producing the copper-clad laminate 161 of the modified example of the first embodiment described above can be used, and a similar configuration can be used.

  Next, with respect to the conductor layers 831 and 832 constituting the copper-clad laminate 861, regions corresponding to positions where resin layers 845 and 846 made of a resin cured material described later are formed are removed by etching or the like (see FIG. 18B). ).

Then, the resin layer 8412 is stacked at a predetermined position on the upper surface portion of the conductor layer 832, and the resin layer 8411 is stacked at a predetermined position on the lower surface portion of the conductor layer 831 (see FIG. 18C).
The resin layers 8411 and 8412 can have the same configuration as the resin layer 142 in the first embodiment described above, and can be stacked on other layer constituent materials in the same manner. When the rigid multilayer printed wiring board 800 to be manufactured is used in a bent state, the resin layer 8411 that is laminated with the conductor layer 831 by heating and / or ultraviolet irradiation described later, and the conductor layer 832 are laminated. It is desirable to adjust the components of the resin composition used for forming the resin layer 8412 so that the resin layer 8412 has flexibility.

The resin layers 8411 and 8412 can be cured by heating and / or ultraviolet irradiation or the like in any step of the manufacturing process of the rigid multilayer printed wiring board 800, and can be laminated with other layer constituent materials in contact therewith.
Further, the position where the resin layers 8411 are stacked and the size (width) of the resin layer 8411 are such that the side surface portion 821b of the resin dam layer 8211 to be described later is formed on the rigid multilayer printed wiring board 800. It can be adjusted as appropriate so as to constitute a part of the side surface part 800a and so that the side surface part 821c of the resin dam layer 8212 forms a part of the side surface part 800b of the rigid multilayer printed wiring board 800.
Similarly, the position at which the resin layers 8412 are stacked and the size (width) of the resin layer 8412 are such that the side surface portion 822b of the resin dam layer resin dam layer 8221 described later is a rigid multi-layer printed wiring board 800. Appropriately so as to constitute a part of the side surface portion 800c of the printed wiring board 800 and so that the side surface portion 822c of the resin dam layer 8222 constitutes a part of the side surface portion 800d of the rigid multilayer printed wiring board 800. Can be adjusted.

A resin dam layer 821 is formed on the upper surface portion of the resin layer 8412 (the surface not in contact with the upper surface portion of the conductor layer 832), and the lower surface portion of the resin layer 8411 (the surface not in contact with the lower surface portion of the conductor layer 831). A resin dam layer 822 is formed on the surface (see FIG. 18D).
The formation of the resin dam layer 821 on the upper surface portion of the resin layer 8412 and the formation of the resin dam layer 822 on the lower surface portion of the resin layer 8411 are similar to the method for forming the resin dam layer 121 of the first embodiment described above. Can be used, and the same configuration can be adopted.
In this embodiment, two resin dam layers 821 are formed on the upper surface portion of the conductor layer 8412 (resin dam layers 8211 and 8212), and two resin dam layers 822 are formed on the lower surface portion of the conductor layer 8411 (see FIG. Resin dam layers 8221, 8222). The resin dam layers 821 and 822 include side surfaces 821a and 821b of the resin dam layer 8211, side surfaces 821c and 821d of the resin dam layer 8212, side surfaces 822a and 822b of the resin dam layer 8221, and side surfaces 822c of the resin dam layer 8222. , 822d are formed on the same straight line in the vertical direction.
Note that the number of the resin dam layers 821 and 822 to be formed may be one or plural as long as the thickness of the manufactured rigid multilayer printed wiring board 800 can be adjusted.
Also, the resin dam layers 821 and 822 are cured by at least one of ultraviolet curing and thermal curing in any of the manufacturing processes of the rigid multilayer printed wiring board 800, and are laminated with other layer constituent materials in contact with them. Can be.
In addition, you may perform the said thermosetting simultaneously with the thermocompression bonding mentioned later.

A copper-clad laminate 862 in which conductor layers 833 and 834 are respectively laminated on the upper surface portion 812a and the lower surface portion 812b of the core material 812 is prepared (see FIG. 19E).
For the copper-clad laminate 862, a method similar to the method for producing the copper-clad laminate 161 of the modified example of the first embodiment described above can be used, and a similar configuration can be used.

  Regarding the conductor layers 833 and 834 constituting the copper-clad laminate 862, regions corresponding to positions where resin layers 847, 8491 and 8492 made of a cured resin, which will be described later, are formed, and side surfaces of the resin dam layer 8211 when stacked. A corresponding region between 821a and the side surface portion 821d of the resin dam layer 8212 is removed by etching or the like (see FIG. 19F).

A copper-clad laminate 863 in which conductor layers 835 and 836 are respectively laminated on the upper surface portion 813a and the lower surface portion 813b of the core material 813 is prepared (see FIG. 19G).
For the copper-clad laminate 863, a method similar to the method for producing the copper-clad laminate 161 of the modified example of the first embodiment described above can be used, and a similar configuration can be used.

  With respect to the conductor layer 836 constituting the copper clad laminate 863, the region corresponding to the position where the resin layers 844, 8481, and 8482 made of a cured resin, which will be described later, are formed and from the side surface portion 822 a of the resin dam layer 8221 when stacked. A region corresponding to the side portion 822d of the resin dam layer 8222 is removed by etching or the like (see FIG. 19H).

The side surface portion 821b of the resin dam layer 8211 constitutes a part of a side surface portion 800a of the rigid multilayer printed wiring board 800 described later, and the side surface portion 821c of the resin dam layer 8212 is one of the side surface portions 800b of the rigid multilayer printed wiring board 800. The side part 822b of the resin dam layer 8221 constitutes a part of a side part 800c of the rigid multilayer printed wiring board 800, which will be described later, and the side part 822c of the resin dam layer 8222 constitutes a side part of the rigid multilayer printed wiring board 800. The copper clad laminates 861, 862, and 863 are stacked so as to be 863, 861, and 862 from the bottom so as to constitute a part of 800d, respectively, and the resin layer 842 and the resin layer 842 as shown in FIG. 843 is stacked.
In the present embodiment, as shown in FIG. 20I, one resin layer 842 is in contact with the upper surface portion of the conductor layer 836 and the lower surface portion of the conductor layer 831, and the side surface portion 822 a of the resin dam layer 8221. Are stacked with a slight gap so that they are not in contact with each other. Further, a slight gap is provided so that another resin layer 842 is in contact with the upper surface portion of the conductor layer 836 and the lower surface portion of the conductor layer 831 and in the vicinity of the side surface portion 822d of the resin dam layer 8222. Are stacked.
20J, one resin layer 843 is in contact with the upper surface portion of the conductor layer 832 and the lower surface portion of the conductor layer 833, and in the vicinity of the side surface portion 821a of the resin dam layer 8211. They are stacked with a slight gap so as not to contact this. Further, a slight gap is provided so that another resin layer 843 is in contact with the upper surface portion of the conductor layer 832 and the lower surface portion of the conductor layer 833, and is in the vicinity of the side surface portion 821d of the resin dam layer 8212. Are stacked.

  In the present embodiment, the combined height (film thickness) of the resin layer 8411 and the resin dam layer 822 is equal to the combined height (film thickness) of the conductor layer 836 and the resin layer 843, and the resin layer 8412 and the resin Although the height (film thickness) of the dam layer 821 combined with the height (film thickness) of the conductor layer 833 and the resin layer 843 is equal, it goes without saying that the respective film thicknesses may be adjusted as appropriate. It is. Similarly, the film thickness of other layer constituent materials can be adjusted as appropriate.

The resin layers 842 and 843 can be cured by heating in any step of the manufacturing process of the rigid multilayer printed wiring board 800, and can be laminated with other layer constituent materials in contact therewith. In the present embodiment, it is desirable to stack each layer constituent material and then put each layer constituent material into a laminated state by thermocompression bonding.
During the heating, the resin composition that has flowed out of the resin layer 842 stacked on the side surface portion 822a side of the resin dam layer 8221 is the upper surface portion 813a, the conductor layer 836, and the resin of the core material 813 shown in FIG. The gap surrounded by the layer 842, the lower face 811b of the core material 811, the gap surrounded by the conductor layer 831 and the resin layer 842, the upper face 813ab of the core material 813, the side face 822a of the resin dam layer 8221, the conductor layer 831 and 836 and the gap portions surrounded by the resin layers 8411 and 842, respectively, are cured to become cured resin products (resin layers 844, 845 and 8481), respectively.
Further, during the heating, the resin composition that has flowed out of the resin layer 842 stacked on the side surface portion 822d side of the resin dam layer 8222 has an upper surface portion 813a, a conductor layer 836, and a core layer 813 shown in FIG. The gap surrounded by the resin layer 842, the lower surface 811b of the core material 811, the gap surrounded by the conductor layer 831 and the resin layer 842, the upper surface 813a of the core material 813, the side surface 822d of the resin dam layer 8222, the conductor The resin flows into gaps surrounded by the layers 831 and 836 and the resin layers 8411 and 842, and is cured to become cured resin products (resin layers 844, 845 and 8482), respectively.
Furthermore, the resin composition that has flowed out of the resin layer 843 stacked on the side surface portion 821a side of the resin dam layer 8211 during the heating is the upper surface portion 811a of the core material 811 shown in FIG. 832 and the gap surrounded by the resin layer 843, the lower surface portion 812b of the core material 812, the gap surrounded by the conductor layer 833 and the resin layer 843, the lower surface portion 812b of the core material 812, and the side surface portion 821a of the resin dam layer 8211. Then, they flow into gaps surrounded by the conductor layers 832 and 833 and the resin layers 8412 and 843, respectively, and are cured to become cured resin products (resin layers 864, 847, and 8491), respectively.
In addition, the resin composition that has flowed out of the resin layer 843 stacked on the side surface portion 821d side of the resin dam layer 8212 during the heating is the upper surface portion 811a, the conductor layer 832, and the resin of the core material 811 shown in FIG. The gap surrounded by the layer 843, the lower surface portion 812b of the core material 812, the gap surrounded by the conductor layer 833 and the resin layer 843, the lower surface portion 812b of the core material 812, the side surface portion 821d of the resin dam layer 8212, and the conductor layer 832 and the resin layers 8412 and 843, respectively, are introduced into the gaps, and are cured to become cured resin products (resin layers 846, 847, and 8492), respectively.
Then, the resin dam layer 8221 (side surface portion 822a side), the conductor layer 836, and the resin layer 842 are laminated through the resin layer 8421, and the resin dam layer 8222 (side surface portion 822d) is interposed therebetween. Side), the conductor layer 836, and the resin layer 842 can be laminated (see FIG. 20J). At this time, the resin layer 8481, the upper surface portion 813a of the core material 813, the lower surface portion of the conductor layer 831, and the side surface portion of the resin layer 8411 are laminated, and the resin layer 8482, the upper surface portion 813a of the core material 813, and the conductor layer 831 are stacked. Each of the lower surface portion and the side surface portion of the resin layer 8411 can be laminated.
Further, the resin dam layer 8211 (side surface portion 821a side), the conductor layer 833, and the resin layer 843 are laminated so as to be adjacent to each other via the resin layer 8491, and the resin dam layer 8212 (side surface portion) is interposed via the resin layer 8492. 821d side), the conductor layer 833, and the resin layer 843 may be in a laminated state (see FIG. 20J). At this time, the resin layer 8491 and the lower surface portion 812b of the core material 812, the upper surface portion of the conductor layer 832 and the side surface portion of the resin layer 8412 are connected to the resin layer 8492, the lower surface portion 812b of the core material 812, and the upper surface portion of the conductor layer 832. And the side surface portion of the resin layer 8412 may be laminated.
The resin layer 844 is laminated with the upper surface portion 813a of the core material 813, the side surface portion of the conductor layer 836, and the lower surface portion of the resin layer 842, and the resin layer 845 is the lower surface portion 811b of the core material 811 and the side surface of the conductor layer 831. The resin layer 846 is laminated with the upper surface 811a of the core material 811, the side surface of the conductor layer 832 and the lower surface of the resin layer 843, and the resin layer 847 is the core. The lower surface portion 812b of the material 812, the side surface portion of the conductor layer 833, and the upper surface portion of the resin layer 843 can be laminated.
The resin dam layer 821 serves as a wall that stops the flow of the resin composition eluted from the resin layer 843 during the heating, and can prevent the resin composition from being eluted to the upper surface of the resin layer 8412. Thereby, the upper surface part of the resin layer 8412 can be kept smooth, and the film thickness adjustment of the rigid multilayer printed wiring board 800 can be facilitated.
In addition, the resin dam layer 822 serves as a wall for stopping the flow of the resin composition eluted from the resin layer 842 during the heating, and the resin composition adheres to and cures at a place where the resin composition should not originally adhere in each layer constituent material. This can be suppressed.

  In the present embodiment, the resin layers 842 and 843 and the copper-clad laminates 861, 862 and 863 are stacked at the same time to form a laminated state. However, for example, the resin layer 842 and the copper-clad laminates 861 and 863 are combined. These may be stacked to form a laminated state, and then the resin layer 843 and the copper-clad laminate 862 may be stacked to form a laminated state. The resin layer 843 and the copper-clad laminates 861 and 862 may be stacked to form a laminated state. Then, the resin layer 842 and the copper clad laminate 863 may be stacked to form a laminated state.

In the present embodiment, the resin dam layers 821, 822 and the resin layers 841, 842, 843, 844, 845, 846, 847, 8481, 8482, 8491, 8492 are in a cured state, and the layer constituent materials that are in contact with each other are in a laminated state. Then, of the core material 812 and the conductor layer 834 and the core material 813 and the conductor layer 835, the side surface portion 821b of the resin dam layer 8211 and the side surface portion 822b of the resin dam layer 8221 correspond to the same vertical line. The core material 812, the conductor layer 834, and the core material 813 are cut by cutting the positions and cutting the positions corresponding to the same vertical line on the side surface portion 821 c of the resin dam layer 8212 and the side surface portion 822 c of the resin dam layer 8222. And a part of the conductor layer 835 are removed. Thereby, the rigid multilayer printed wiring board 800 of this embodiment is produced (refer FIG.20 (k)).
In this embodiment, the core material 812, the conductor layer 834, and a part of the core material 813 and the conductor layer 835 are removed after all the layer constituent materials are in the laminated state. Any of the manufacturing steps of the plate 800 may be used.
In the rigid multilayer printed wiring board 800, as shown in FIG. 20 (k), the side surface portion 821b of the resin dam layer 8211 constitutes a part of the side surface portion 800a of the rigid multilayer printed wiring board 800, and the resin dam layer The side surface portion 821c of 8212 constitutes a part of the side surface portion 800b of the rigid multilayer printed wiring board 800, the side surface portion 822b of the resin dam layer 8221 constitutes a part of the side surface portion 800c of the rigid multilayer printed wiring board 800, and resin The side surface portion 822 c of the dam layer 8222 constitutes a part of the side surface portion 800 d of the rigid multilayer printed wiring board 800.
In the rigid multilayer printed wiring board 800, the upper surface portion of the resin layer 8412 including the resin dam layer 821 and the side surface portion 800a of the rigid multilayer printed wiring board 800 are L-shaped (the side surface portion 800a of the rigid multilayer printed wiring board 800 is vertically formed). The upper surface portion of the resin layer 8412 and the side surface portion 800b of the rigid multilayer printed wiring board 800 are in an inverted L-shape (rigid multilayer printed wiring board). The side surface portion 800b of 800 is a vertical line, and the upper surface portion of the resin layer 8412 is a horizontal line).
Further, in the rigid multilayer printed wiring board 800, the lower surface portion of the resin layer 8411 including the resin dam layer 822 and the side surface portion 800c of the rigid multilayer printed wiring board 800 are inverted L-shaped (the side surface portion of the rigid multilayer printed wiring board 800). The bottom surface of the resin layer 8411 and the side surface portion 800d of the rigid multilayer printed wiring board 800 are L-shaped (when the bottom surface of the resin layer 8411 is viewed as a horizontal line). The side surface portion 800d of the wiring board 800 is a vertical line, and the lower surface portion of the resin layer 8411 is a horizontal line).
The rigid multilayer printed wiring board 800 of the present embodiment has such a configuration, so that the height (film thickness H1) from the upper surface portion of the conductor layer 834 to the lower surface portion of the conductor layer 835 and the upper surface portion of the resin layer 8412 are increased. The height (film thickness H2) to the lower surface portion of the resin layer 8411 can be made different, that is, the film thickness H2 can be made thinner than the film thickness H1.

  In the rigid multilayer printed wiring board 800, the film thickness H1 is preferably 100 μm or more and 6 mm or less. The film thickness H2 is preferably 30 μm or more and is preferably 100 μmm or less thinner than the film thickness H1.

  As described above, the rigid multilayer printed wiring board 800 manufactured by the manufacturing method of the present embodiment does not require a step of forming a gap portion in a layer (core material 811) serving as a core of the rigid multilayer printed wiring board 800. Further, in the step of stacking the layer constituent materials constituting the rigid multilayer printed wiring board 800, the film thickness (H1, H2) of the rigid multilayer printed wiring board 800 can be easily adjusted by adjusting the stacking position of each layer constituent material. In addition, the layers (resin layers 8411 and 8412) exposed to the outside can be easily adjusted.

  The conductor layers 831, 832, 833, 834, 835, and 836 can remove unnecessary portions by etching or the like so that a desired circuit pattern is obtained in any step of the manufacturing process of the rigid multilayer printed wiring board 800. .

The film thickness of the resin layer between the conductor layers like the resin layers 842 and 843 is preferably 20 μm or more in the cured state. In addition, it is desirable that the film thickness of the resin layer serving as the surface insulating layer such as the resin layers 8411 and 8412 be 5 μm or more and 30 μm or less in the cured state.
Further, the film thickness of the conductor layers 831, 832, 833, 834, 835, 836 is desirably 5 μm or more and 300 μm or less.

  In the present embodiment, the copper clad laminates 861, 862, and 863 are used. For example, the step of stacking the conductor layers 831 and 832 on the upper surface portion 811a and the lower surface portion 811b of the core material 811 to form a laminated state, Conductive layers 833 and 834 are stacked on the upper surface portion 812a and the lower surface portion 812b of the material 812 to form a stacked state, and conductive layers 835 and 836 are stacked on the upper surface portion 813a and the lower surface portion 812b of the core material 813, respectively. The process to perform may be included.

In the present embodiment, a step of forming a via hole may be provided in any manufacturing process of the rigid multilayer printed wiring board 800. For example, after all the layer constituent materials that are constituent elements of the rigid multilayer printed wiring board 800 are laminated, via holes (not shown) are formed at predetermined positions thereof to thereby form the conductor layers 831, 832, and 833. , 834, 835, 836 can be electrically connected. Further, for example, the via hole may be provided when a part of the layer constituent materials is in a laminated state.
The position where the via hole is formed can be appropriately adjusted according to the design circuit pattern in the rigid multilayer printed wiring board 800.
Then, by mounting predetermined electronic components on predetermined positions (for example, land portions, not shown) of the conductor layers 834 and 835 and formed via holes, a desired rigid multilayer printed circuit board is produced.

The rigid multilayer printed wiring board 800 can bend the portion where the resin layers 8411 and 8412 are laminated (having a film thickness H2) so that the conductor layer 835 is the outermost layer, and the conductor layer 834 is the outermost layer. Thus, the portion where the resin layers 8411 and 8412 are laminated (having the film thickness H2) can be bent.
Thus, since the rigid multilayer printed wiring board 800 can be used in a bent state so that any of the conductor layers 834 and 835 is the outermost layer, the space in the electronic control device can be utilized more efficiently. In addition, the degree of freedom in the design (mounting) of electronic components on the rigid multilayer printed wiring board 800 and the design of an electronic control device incorporating the electronic components can be further expanded.
Since the thickness of the rigid multilayer printed wiring board 800 can be adjusted without selecting a material, for example, a material having high heat resistance and durability can be used for this portion, and a resin having a special performance can be used. Since it can be used, high reliability can be realized.

Furthermore, in the rigid multilayer printed wiring board 800, the core material 813 and the conductor layers 835 and 836 constituting the portion having the film thickness H2, and the core material (811, 812) 813 and the conductor layer constituting the portion having the film thickness H1. Since (831, 832, 833, 834) 835 and 836 can be made of the same material, the difference in thermal expansion coefficient can be suppressed and the occurrence of breakage can also be suppressed. Further, when these materials are the same, the dielectric constants also match, so that it is possible to easily cope with high frequency characteristics as compared with the case where these materials are different.
And since each layer constituent material which comprises the part used as the film thickness H2 and each layer constituent material which comprises the part used as the film thickness H1 can be made the same material, and since the existing layer constituent material can be utilized, the existing layer The results of reliability evaluation, etc. that have already been obtained for component materials (for example, circuits, through holes, etc.) can be partially used for reliability evaluation of the rigid multilayer printed wiring board 800 itself, thereby reducing the cost and time required for this. can do.

<Ninth Embodiment>
A ninth embodiment will be described with reference to FIGS.
A copper-clad laminate 961 in which conductor layers 931 and 932 are respectively laminated on the upper surface portion 911a and the lower surface portion 911b of the core material 911 is prepared (see FIG. 21A).
The copper-clad laminate 961 can use the same method as the method for producing the copper-clad laminate 161 of the modified example of the first embodiment described above, and can have the same configuration.

  Next, with respect to the conductor layer 931 constituting the copper-clad laminate 961, the region corresponding to the position where the resin layers 9944, 9451, and 9452 made of a cured resin, which will be described later, are formed and from the side surface portion 921a of the resin dam layer 9211 when stacked. A region corresponding to the side portion 921d of the resin dam layer 9212 is removed by etching or the like (see FIG. 21B).

And the space | gap part 951 is formed in the predetermined position of the copper clad laminated board 961 (refer FIG.21 (c)).
The gap portion 951 is such that the side surface portion 951a is perpendicular to the side surface portion 921b of the resin dam layer 9211 described later, and the side surface portion b of the gap portion 951 is on the side surface portion 921c of the resin dam layer 921. It is desirable to be provided on the copper clad laminate 961 (core material 911) so as to be on the same straight line in the vertical direction.

A copper-clad laminate 962 in which conductor layers 933 and 934 are respectively laminated on the upper surface portion 912a and the lower surface portion 912b of the core material 912 is prepared (see FIG. 22D).
For the copper-clad laminate 962, a method similar to the method for producing the copper-clad laminate 161 of the modified example of the first embodiment described above can be used, and a similar configuration can be used.

  Next, with respect to the conductor layer 934 constituting the copper clad laminate 962, a region corresponding to a position where a resin layer 943 made of a cured resin described later is formed is removed by etching or the like (see FIG. 22E).

  Then, the resin layer 941 is stacked at a predetermined position on the upper surface portion of the conductor layer 934 (see FIG. 20F). The resin layer 941 can have the same configuration as the resin layer 142 in the first embodiment described above, and can be stacked on other layer constituent materials by the same method. When the rigid multilayer printed wiring board 900 to be produced is used in a bent state, the resin layer 941 that has been laminated with the conductor layer 934 by heating and / or ultraviolet irradiation, which will be described later, is flexible. It is desirable to adjust the components of the resin composition used for formation.

The resin layer 941 can be cured by heating and / or ultraviolet irradiation or the like in any step of the manufacturing process of the rigid multilayer printed wiring board 900, and can be laminated with other layer constituent materials in contact therewith.
The position and range of the resin layer 941 when the resin layer 941 is stacked on the upper surface portion of the conductor layer 943 are such that the side surface portion 921b of the resin dam layer 9211 described later is formed in the rigid multilayer printed wiring board 900. The side surface portion 921c of the resin dam layer 9212 may be appropriately adjusted so that the side surface portion 921c of the resin dam layer 9212 is stacked to form a part of the side surface portion 900b of the rigid multilayer printed wiring board 900.

Then, a resin dam layer 921 is formed on the upper surface portion of the resin layer 941 (the surface not in contact with the upper surface portion of the conductor layer 934) (see FIG. 22G).
The formation of the resin dam layer 921 on the upper surface portion of the resin layer 941 can use the same method as the method for forming the resin dam layer 121 of the first embodiment described above, and can have the same configuration.
In the present embodiment, two resin dam layers 921 are formed on the upper surface of the resin layer 941 (resin dam layers 9211 and 9212).
The resin dam layer 9211 is formed so that the side surface portion 921b of the resin dam layer 9211 exists on the same straight line as the above-described side surface portion 951a of the gap portion 951 and a part of the side surface portion 900a of the rigid multilayer printed wiring board 900. Formed to compose. Further, the resin dam layer 9212 constitutes a part of the side surface portion 900b of the rigid multilayer printed wiring board 900 so that the side surface portion 921c of the resin dam layer 9212 is perpendicular to the side surface portion 951b of the gap portion 951 and is collinear. To be formed.
Note that the number of the resin dam layers 921 formed may be one or plural as long as the thickness of the rigid multilayer printed wiring board 900 to be manufactured can be adjusted.
The resin dam layer 921 can be cured by at least one of ultraviolet curing and heat curing in any of the manufacturing processes of the rigid multilayer printed wiring board 900, and can be laminated with another layer constituent material in contact therewith.
In addition, you may perform the said thermosetting simultaneously with the thermocompression bonding mentioned later.

The side surface portion 921b of the resin dam layer 9211 and the side surface portion 921c of the resin dam layer 9212 constitute part of side surface portions 900a and 900b of the rigid multilayer printed wiring board 900, which will be described later, and the side surface portions of the gap portion 951. 951a exists on the same straight line as the vertical side surface 921a of the resin dam layer 9211, and so that the side surface part 951b of the gap 951 exists on the same vertical line as the vertical side surface part 921c of the resin dam layer 9212. The copper clad laminates 961 and 962 are stacked so as to be 962 and 961 from the bottom, and the resin layers 942 are stacked as shown in FIG.
In this embodiment, as shown in FIG. 23H, one resin layer 942 is in contact with the upper surface portion of the conductor layer 934 and the lower surface portion of the conductor layer 931, and the side surface portion 921 a of the resin dam layer 9211. The resin dam layer 9212 is stacked such that another resin layer 942 is in contact with the upper surface portion of the conductor layer 934 and the lower surface portion of the conductor layer 931. In the vicinity of the side surface portion 921d, a small gap portion is provided so as not to contact the side surface portion 921d.

  In the present embodiment, the height (film thickness) of the resin dam layer 921 and the resin layer 941 is equal to the height (film thickness) of the conductor layer 931 and the resin layer 942. Of course, the thickness may be appropriately adjusted. Similarly, the film thickness of other layer constituent materials can be adjusted as appropriate.

The resin layer 942 can be cured by heating in any step of the manufacturing process of the rigid multilayer printed wiring board 900, and can be laminated with another layer constituent material in contact therewith. In the present embodiment, it is desirable to stack each layer constituent material and then put each layer constituent material into a laminated state by thermocompression bonding.
During the heating, the resin composition that has flowed out of the resin layer 942 stacked on the side surface 921a side of the resin dam layer 9211 is the upper surface portion 912a, the conductor layer 934, and the resin of the core material 912 shown in FIG. The gap surrounded by the layer 942, the lower surface portion 911b of the core material 911, the gap surrounded by the conductor layer 931 and the resin layer 942, the lower surface portion 911b of the core material 911, the side surface portion 921a of the resin dam layer 9211, and the conductor layer. 931 and 934 and resin layers 941 and 942 are respectively surrounded by gaps, which are cured to form resin cured products (resin layers 943, 944 and 9451), respectively.
Also, during the heating, the resin composition that has flowed out of the resin layer 942 stacked on the side surface portion 921d side of the resin dam layer 9212 has an upper surface portion 912a, a conductor layer 934, and a core material 912 shown in FIG. The gap surrounded by the resin layer 942, the lower surface portion 911b of the core material 911, the gap surrounded by the conductor layer 931 and the resin layer 942, the lower surface portion 911b of the core material 911, the side surface portion 921d of the resin dam layer 9212, and the conductor. The resin flows into gaps surrounded by the layers 931 and 934 and the resin layers 941 and 942, respectively, and is cured to become cured resin products (resin layers 943, 944 and 9452), respectively.
Then, the resin dam layer 9211 (side surface portion 921a side), the conductor layer 931, and the resin layer 942 are laminated so as to be adjacent to each other through the resin layer 9451, and the resin dam layer 9212 (side surface portion 921d) is interposed therebetween. Side), the conductor layer 931, and the resin layer 942 can be in a laminated state (see FIG. 23I). At this time, the resin layer 9451, the lower surface portion 911b of the core material 911, and the upper surface portion of the conductor layer 934 can be laminated, and the resin layer 9452, the lower surface portion 911b of the core material 911, and the upper surface portion of the conductor layer 934 can be laminated. .
The resin layer 943 is laminated with the upper surface portion 912a of the core material 912, the side surface portion of the conductor layer 934, and the lower surface portion of the resin layer 942, and the resin layer 944 is the lower surface portion 912b of the core material 911 and the side surface portion of the conductor layer 934. In addition, the upper surface portion of the resin layer 942 can be laminated.
The resin dam layer 921 serves as a wall that stops the flow of the resin composition eluted from the resin layer 942 during the heating, and can prevent the resin composition from being eluted to the upper surface of the resin layer 941. Thereby, the upper surface part of the resin layer 941 can be kept smooth, and the film thickness adjustment of the rigid multilayer printed wiring board 900 can be facilitated.

In the present embodiment, after the resin dam layer 921 and the resin layers 941, 942, 943, 944, 9451, and 9452 are in a cured state and the layer constituent materials that are in contact with each other are in a laminated state, the core material 911 and the conductor layer 932 Among them, the core material 911 and a part of the conductor layer 932 are removed by cutting the positions that are perpendicular to the side surface portions 951a and 951b of the gap portion 951 and are on the same straight line. Thereby, the rigid multilayer printed wiring board 900 of this embodiment is produced (refer FIG.23 (j)).
In this embodiment, the core material 911 and a part of the conductor layer 932 are removed after all the layer constituent materials are in the laminated state. However, these removals are performed in any of the manufacturing processes of the rigid multilayer printed wiring board 900. There may be.
In the rigid multilayer printed wiring board 900, as shown in FIG. 23 (j), the side surface portion 921b of the resin dam layer 9211 constitutes a part of the side surface portion 900a of the rigid multilayer printed wiring board 900, and the resin dam layer The side surface portion 921 c of 9212 constitutes a part of the side surface portion 900 b of the rigid multilayer printed wiring board 900.
In the rigid multilayer printed wiring board 900, the upper surface portion of the resin layer 941 including the resin dam layer 921 and the side surface portion 900a of the rigid multilayer printed wiring board 900 are L-shaped (the side surface portion 900a of the rigid multilayer printed wiring board 900 is vertically formed). The upper surface portion of the resin layer 941 and the side surface portion 900b of the rigid multilayer printed wiring board 900 are reverse L-shaped (rigid multilayer printed wiring board). The side surface portion 900b of 900 is a vertical line, and the upper surface portion of the resin layer 941 is a horizontal line.
The rigid multilayer printed wiring board 900 according to the present embodiment has such a configuration, so that the height (film thickness H1) from the upper surface portion of the conductor layer 932 to the lower surface portion of the conductor layer 933 and the upper surface portion of the resin layer 941. The thickness (film thickness H2) to the lower surface portion of the conductor layer 933 can be made different, that is, the film thickness H2 can be made thinner than the film thickness H1.

  In the rigid multilayer printed wiring board 900, the film thickness H1 is desirably 100 μm or more and 6 mm or less. The film thickness H2 is preferably 30 μm or more and is preferably 100 μmm or less thinner than the film thickness H1.

  That is, the rigid multilayer printed wiring board 700 manufactured by the manufacturing method of the present embodiment does not require a step of forming a gap portion in a layer (core material 912) that becomes a core of the rigid multilayer printed wiring board 900. In the process of stacking the layer constituent materials constituting the multilayer printed wiring board 900, the film thickness (H1, H2) of the rigid multilayer printed wiring board 900 can be easily adjusted by adjusting the stacking position and the like of each layer constituent material. The layer exposed to the outside (resin layer 941) can be easily adjusted.

  The conductive layers 931, 932, 933, and 934 can remove unnecessary portions by etching or the like so as to form a desired circuit pattern in any step of the manufacturing process of the rigid multilayer printed wiring board 700.

The film thickness of the resin layer between the conductor layers like the resin layer 942 is desirably 20 μm or more in the cured state. In addition, the thickness of the resin layer serving as a surface insulating layer such as the resin layer 941 is preferably 5 μm or more and 30 μm or less in the cured state.
The film thickness of the conductor layers 931, 932, 933, and 934 is preferably 5 μm or more and 300 μm or less.

  In the present embodiment, the copper clad laminates 961 and 962 are used. For example, the core material 912 includes a step of stacking the conductor layers 931 and 932 on the upper surface portion 911a and the lower surface portion 911b of the core material 911, respectively. A step of stacking conductor layers 933 and 934 on the upper surface portion 912a and the lower surface portion 912b, respectively, may be included.

In the present embodiment, a step of forming a via hole may be provided in any manufacturing process of the rigid multilayer printed wiring board 900. For example, after all layer constituent materials that are constituent elements of the rigid multilayer printed wiring board 900 are in a laminated state, via holes (not shown) are formed at predetermined positions thereof to form conductor layers 931, 932, and 933. , 934 can be electrically connected. Further, for example, the via hole may be provided when a part of the layer constituent materials is in a laminated state.
The position where the via hole is formed can be appropriately adjusted according to the design circuit pattern in the rigid multilayer printed wiring board 900.
Then, by mounting predetermined electronic components on predetermined positions (for example, land portions, not shown) of the conductor layers 932 and 933 and formed via holes, a desired rigid multilayer printed circuit board is manufactured.

The rigid multilayer printed wiring board 900 can bend the portion where the resin layer 941 is laminated (having the film thickness H2) so that the conductor layer 933 is the outermost layer. Thus, since the rigid multilayer printed wiring board 900 can be used in a bent state, it is possible to efficiently utilize the space in the electronic control device and to mount electronic components on the rigid multilayer printed wiring board 900 ( Design) and the degree of freedom in designing an electronic control device incorporating the same.
Since the rigid multilayer printed wiring board 900 can adjust its film thickness without selecting a material, for example, a material having high heat resistance and durability can be used for this portion, and a resin having a special performance is used. Since it can be used, high reliability can be realized.

Further, in the rigid multilayer printed wiring board 900, the core material 912 and the conductor layers 933 and 934 constituting the portion having the thickness H2 and the core material (911) 912 and the conductor layer (931 constituting the portion having the thickness H1 are formed. 932) 933 and 934 can be made of the same material, so that the difference in thermal expansion coefficient can be suppressed and the occurrence of breakage can also be suppressed. Further, when these materials are the same, the dielectric constants also match, so that it is possible to easily cope with high frequency characteristics as compared with the case where these materials are different.
And since the material of each layer constituent material which comprises the part used as the film thickness H2 and each layer constituent material which comprises the part used as the film thickness H1 can be made the same, and since the existing layer constituent material can be utilized, the existing layer The results of reliability evaluation, etc. that have already been obtained for components (for example, circuits, through holes, etc.) can be partially used for reliability evaluation of the rigid multilayer printed wiring board 900 itself, and the cost and time required for this can be suppressed. can do.

<Tenth Embodiment>
The tenth embodiment will be described with reference to FIGS.
A copper-clad laminate 1061 in which conductor layers 1031 and 1032 are respectively laminated on the upper surface portion 1011a and the lower surface portion 1011b of the core material 1011 is prepared (see FIG. 24A).
The copper-clad laminate 1061 can use the same method as the method for producing the copper-clad laminate 161 of the modified example of the first embodiment described above, and can have the same configuration.

Then, a resin dam layer 1021 is formed on the upper surface portion of the conductor layer 1032 (the surface not in contact with the upper surface portion 1011a of the core material 1011) (see FIG. 24B).
For the formation of the resin dam layer 1021 on the upper surface portion of the conductor layer 1032, a method similar to the method for forming the resin dam layer 121 of the first embodiment described above can be used, and a similar configuration can be adopted.
In the present embodiment, two resin dam layers 1021 are formed on the upper surface portion of the conductor layer 1032 (resin dam layers 10211 and 10212), and the side surface portion 1021c of the resin dam layer 10211 is formed on a rigid multilayer printed wiring board 1000 described later. It forms so that a part of side part 1000b may be comprised.
Note that the number of the resin dam layers 1021 formed may be one or plural as long as the thickness of the manufactured rigid multilayer printed wiring board 1000 can be adjusted.
Further, the resin dam layer 1021 can be cured by at least one of ultraviolet curing and thermal curing in any of the manufacturing processes of the rigid multilayer printed wiring board 1000, and can be laminated with other layer constituent materials in contact therewith.
In addition, you may perform the said thermosetting simultaneously with the heating of the resin layers 1041 and 1042 mentioned later.

Next, the resin layer 1041 is stacked on the upper surface portion of the conductor layer 1032 (see FIG. 24C).
In the present embodiment, the resin layer 1041 is stacked on a surface other than the gap between the two resin dam layers 10211 and 10212 on the upper surface portion of the conductor layer 1032.
That is, as shown in FIG. 24C, the height (film thickness) of the resin dam layer 1021 and the resin layer 1041 (film thickness) are set to the same level, and one resin layer 1041 is the resin dam layer 10211. One resin layer 1041 is stacked on the upper surface portion of the conductor layer 1032 so as to be in contact with the side surface portion 1021a of the resin dam layer 10212. Of course, these film thicknesses may be appropriately adjusted.

  The resin layer 1041 can have the same configuration as the resin layer 141 in the first embodiment described above, and can be stacked on other layer constituent materials in the same manner.

The resin layer 1041 is cured by heating in any step of the manufacturing process of the rigid multilayer printed wiring board 1000, and can be in a laminated state with other layer constituent materials in contact therewith.
Further, the resin layer 1041 stacked to be in contact with the side surface portion 1021a of the resin dam layer 10211 is laminated with the side surface portion 1021a of the resin dam layer 10211, and the resin layer 1041 stacked to be in contact with the side surface portion 1021d of the resin dam layer 10212 is The resin dam layer 10212 is laminated with the side surface portion 1021d.
However, depending on the timing of heating the resin layer 1041, there may be a case where the resin dam layer 1021 and the resin layer 1041 are in a laminated state before the resin layer 1041 is heated. The dam layer 1021 and the cured resin layer 1041 are stacked.
The resin dam layer 1021 serves as a wall that stops the flow of the resin composition eluted from the resin layer 1041 during the heating, and the resin composition is formed between the two resin dam layers 10211 and 10212 on the upper surface portion of the conductor layer 1032. Elution to the surface of the gap portion can be suppressed. Thereby, the upper surface part of the conductor layer 1032 can be kept smooth, and the film thickness adjustment of the rigid multilayer printed wiring board 1000 can be facilitated.

Next, the core material 1012 is stacked on the upper surface portion of the resin layer 1041 in contact with the resin dam layer 10211 (see FIG. 24D). The core material 1012 can have the same configuration as the core material 111 in the first embodiment described above, and can be stacked on other layer constituent materials in the same manner.
The core material 1012 is preferably stacked such that a side surface portion 1012a, which is one side surface portion of the core material 1012, is vertically aligned with the side surface portion 1021b of the resin dam layer 10211.

Then, a heat dissipation layer 1071 which is a conductive layer having heat dissipation properties is stacked so as to cover the upper surface portion of the resin dam layer 10212 and the upper surface portion of the resin layer 1041 in contact with the resin dam layer 10212 (see FIG. 24E). The heat dissipation layer 1071 is preferably stacked such that the side surface portion 1071a which is one side surface portion of the heat dissipation layer 1071 is located closer to the resin dam layer 10211 side than the side surface portion 1021c of the resin dam layer 10212.
As the heat dissipation layer 1071, a heat dissipation material can be used, for example, at least one of copper, silver, gold, and aluminum, or a substrate coated with a heat dissipation resin, copper, zinc, nickel, etc. Etc. The film thickness of the heat dissipation layer 1071 is desirably 1 mm or more and 2 mm or less.
Note that the heat dissipation layer 1071 is preferably stacked so as not to be in contact with the core material 1012, and the heat dissipation layer 1071 and the core material 1012 are preferably formed to have the same thickness. By setting the heat dissipation layer 1071 to such a configuration, it is possible to easily remove a predetermined layer constituent material including a core material 1012 described later.

Also, one (resin dam layer 10221) and one upper surface portion (resin dam layer) of the core material 1012 (the upper surface portion of the resin dam layer 10211 and the surface not in contact with the upper surface portion of the resin layer 1041). One (resin dam layer 10222) and one resin dam layer 1022 are formed on the upper surface portion of the layer 10212 and the surface not in contact with the upper surface portion of the resin layer 1041 (see FIG. 24F).
The resin dam layer 1022 can be formed using a method similar to the method for forming the resin dam layer 121 of the first embodiment described above, and can have a similar configuration.
In this embodiment, as described above, two resin dam layers 1022 are formed, one on the upper surface portion of the core material 1012 and one on the upper surface portion of the heat dissipation layer 1071.
The resin dam layer 10221 is formed such that the side surface portion 1022b of the resin dam layer 10221, the side surface portion 1012a of the core material 1012, and the side surface portion 1021b of the resin dam layer 10211 exist on the same straight line.
The resin dam layer 10222 is formed such that the side surface portion 1022c of the resin dam layer 1022 constitutes a part of the side surface portion 1000b of the rigid multilayer printed wiring board 1000 described later.
Further, the resin dam layer 10221 is formed on the upper surface portion of the core material 1012 so that the side surface portions 1022a and 1022b of the resin dam layer 10221 and the side surface portions 1021a and 1021b of the resin dam layer 10211 are on the same vertical line. The resin dam layer 10222 is formed on the upper surface portion of the heat dissipation layer 1071 so that the side surface portions 1022c and 1022d of the resin dam layer 10222 and the side surface portions 1022c and 1022d of the resin dam layer 10221 are on the same straight line. The
Note that the number of the resin dam layers 1022 formed may be one or plural as long as the thickness of the manufactured rigid multilayer printed wiring board 1000 can be adjusted.
Further, the resin dam layer 1022 can be cured by at least one of ultraviolet curing and thermal curing in any of the manufacturing processes of the rigid multilayer printed wiring board 1000, and can be laminated with another layer constituent material in contact therewith.
Note that the thermosetting may be performed simultaneously with the heating of the above-described resin layer 1041 or a resin layer 1042 described later.

Next, the resin layer 1042 is stacked on the upper surface portion of the heat dissipation layer 1071 (see FIG. 23G).
In the present embodiment, as shown in FIG. 25G, the height (film thickness) of the resin dam layer 1022 and the resin layer 1042 (film thickness) are set to the same level, and one resin layer 1042 is formed. Is stacked on the upper surface portion of the core material 1012 so as to be in contact with the side surface portion 1022a of the resin dam layer 10221, and the upper surface portion of the heat dissipation layer 1071 so that another resin layer 1042 is in contact with the side surface portion 1022d of the resin dam layer 10222. Stacked on. Of course, these film thicknesses may be appropriately adjusted.

  The resin layer 1042 can have the same configuration as that of the resin layer 141 in the first embodiment described above, and can be stacked on other layer constituent materials by the same method.

The resin layer 1042 is cured by heating in any step of the manufacturing process of the rigid multilayer printed wiring board 1000, and can be laminated with other layer constituent materials in contact therewith.
In addition, the resin layer 1042 stacked so as to be in contact with the side surface portion 1022a of the resin dam layer 10221 is laminated with the side surface portion 1022a of the resin dam layer 10221, and the resin layer 1042 stacked so as to be in contact with the side surface portion 1022d of the resin dam layer 10222 is The resin dam layer 10222 is laminated with the side surface portion 1022d.
However, depending on the timing of heating the resin layer 1042, there may be a case where the resin dam layer 1022 and the resin layer 1042 are laminated before the resin layer 1042 is heated. In this case, the resin layer 1042 is heated to The dam layer 1022 and the cured resin layer 1042 are stacked.
The resin dam layer 1022 serves as a wall that stops the flow of the resin composition eluted from the resin layer 1042 during the heating, and the resin composition is eluted to the upper surface portion of the heat dissipation layer 1071 and the upper surface portion of the conductor layer 1032. It can be suppressed. Accordingly, it is possible to prevent the cured resin from adhering to the upper surface portion of the heat dissipation layer 1071 and to keep the upper surface portion of the heat dissipation layer 1071 and the upper surface portion of the conductor layer 1032 smooth. The film thickness can be easily adjusted.

Also, a copper clad laminate 1062 in which conductor layers 1013 and 1014 are respectively laminated on the upper surface portion 1013a and the lower surface portion 1013b of the core material 1013 is prepared, and the upper surface portion of the resin layer 1042 (the upper surface portion of the core material 1012 and the heat dissipation layer 1071). A copper-clad laminate 1062 is stacked on the surface not in contact with the upper surface portion (see FIG. 26H).
For the copper-clad laminate 1062, a method similar to the method for producing the copper-clad laminate 161 of the modified example of the first embodiment described above can be used, and a similar configuration can be used.
The copper clad laminate 1062 is preferably stacked so as to cover the upper surface of the core material 1012 and the outer layer of the heat dissipation layer 1071.

  In this embodiment, after the resin dam layers 1021 and 1022 and the resin layers 1041 and 1042 are in a cured state and the respective layer constituent materials in contact with each other are in a laminated state, the resin dam layer of the copper-clad laminates 1061 and 1062 The core material 1012, and the resin dam layers 10211, 10221, and the resin layers 1041, 1042 are respectively cut by cutting the positions corresponding to the same straight line perpendicular to the side surface portion 1021c of the resin dam layer 1022 and the side surface portion 1022c of the resin dam layer 10222. On the other hand, a part of the copper clad laminates 1061 and 1062 is removed (see FIG. 26 (i)).

  In this way, a part of each layer constituent material is removed, and a part of the heat radiation layer 1071 (near the side part 1071a) protrudes to the outer layer side from the side part 1021c of the resin dam layer 10212 and the side part 1022c of the resin dam layer 10222. Thus, the rigid multilayer printed wiring board 1000 of this embodiment that is exposed (so as to have a convex shape) is manufactured (see FIG. 26J).

In the rigid multilayer printed wiring board 1000 of the present embodiment, as shown in FIG. 26 (j), the side surface portion 1021c of the resin dam layer 10212 constitutes a part of the side surface portion 1000b of the rigid multilayer printed wiring board 1000. The side surface portion 1022 c of the layer 10222 is laminated so as to constitute a part of the side surface portion 1000 a of the rigid multilayer printed wiring board 1000.
The lower surface portion of the heat dissipation layer 1071 including the resin dam layer 10212 and the side surface portion 1000b of the multilayer printed wiring board 1000 are L-shaped (the side surface portion 1000b of the rigid multilayer printed wiring board 1000 is a vertical line, and the lower surface portion of the heat dissipation layer 1071 is The upper surface portion of the heat dissipation layer 1071 including the resin dam layer 10222 and the side surface portion 1000a of the rigid multilayer printed wiring board 1000 are inverted L-shaped (rigid multilayer printed wiring). The side surface portion 1000a of the plate 1000 is a vertical line, and the upper surface portion of the heat dissipation layer 1071 is a horizontal line).
The rigid multilayer printed wiring board 1000 of the present embodiment has such a configuration, so that the film thickness of a part of the rigid multilayer printed wiring board 1000 is adjusted, that is, a part of the heat dissipation layer 1071 can be easily exposed to the outside. Can do.

  Thus, the rigid multilayer printed wiring board 1000 produced by the manufacturing method of the present embodiment adjusts the stacking position and the like of each layer constituent material in the step of stacking the layer constituent materials constituting the rigid multilayer printed wiring board 1000, and By simply cutting predetermined positions of the copper-clad laminates 1061 and 1062 stacked on the outer layer side of the resin dam layers 1021 and 1022, a part of these and predetermined layer constituent materials can be removed, and the heat dissipation layer 1071 can be easily moved to the outside. It is possible to expose (adjust the film thickness of a part of the rigid multilayer printed wiring board 1000).

  The conductive layers 1031, 1032, 1033, and 1034 can remove unnecessary portions by etching or the like so as to obtain a desired circuit pattern in any step of the manufacturing process of the rigid multilayer printed wiring board 1000.

The film thickness of the resin layer between the conductor layers like the resin layers 1041 and 1042 is desirably 20 μm or more in the cured state.
The film thickness of the conductor layers 1031, 1032, 1033, and 1034 is preferably 5 μm or more and 300 μm or less.

  In the present embodiment, stacking and stacking of each layer constituent material may be performed by stacking, for example, one layer at a time, or a plurality of layer constituent materials may be stacked and stacked, or a combination thereof. Also good.

  In this embodiment, the copper clad laminates 1061 and 1063 are used. For example, the core material 1013 is a process of stacking the conductor layers 1031 and 1032 on the upper surface portion 1011a and the lower surface portion 1011b of the core material 1061, respectively. A step of stacking the conductor layers 1033 and 1034 on the upper surface portion 1013a and the lower surface portion 1013b, respectively, may be included.

In the present embodiment, a step of forming a via hole may be provided in any manufacturing process of the rigid multilayer printed wiring board 1000. For example, after all the layer constituent materials that are constituent elements of the rigid multilayer printed wiring board 1000 are laminated, via holes (not shown) are formed at predetermined positions thereof to form the conductor layers 1031, 1032, and 1033. , 1034 can be electrically connected. Further, for example, the via hole may be provided when a part of the layer constituent materials is in a laminated state.
The position where the via hole is formed can be appropriately adjusted according to the design circuit pattern in the rigid multilayer printed wiring board 1000.
Then, by mounting predetermined electronic components on predetermined positions (for example, land portions, not shown) of the conductor layers 1031 and 1034 and formed via holes, a desired rigid multilayer printed circuit board is manufactured.

As described above, the rigid multilayer printed wiring board 1000 is obtained by cutting a predetermined position of the copper clad laminates 1061 and 1062 stacked on the outer layer side of the resin dam layers 1012 and 1022 and a predetermined layer constituent material. The heat dissipation layer 1071 can be easily exposed to the outside. That is, since the heat dissipation layer 1071 can be exposed to the outside without cutting the layer constituent materials in contact with the upper surface portion and the lower surface portion of the heat dissipation layer 1071, an advanced cutting technique is not necessary. The risk of damage or damage to the heat dissipation layer 1071 can be reduced.
In addition, since the thickness of the rigid multilayer printed wiring board 1000 can be easily adjusted, the space in the electronic control device can be efficiently utilized, and the rigid multilayer printed wiring board 1000 can be used. The degree of freedom in the design (mounting) of electronic parts and the design of electronic control devices incorporating the electronic parts can be expanded.
Since the rigid multilayer printed wiring board 1000 can adjust the film thickness without selecting a material, for example, a material having high heat resistance and durability can be used in this portion, and a resin having a special performance is used. Since it can be used, high reliability can be realized.

  In addition, this invention is not limited to the said embodiment, Of course, a various deformation | transformation is possible unless it deviates from the summary of this invention.

Core material: 111, 211, 311, 411, 511, 512, 611, 711, 712, 713, 811, 812, 813, 911, 912, 913, 1011, 1012, 1013
Resin dam layer 121 (1211, 1212), 221, 321 (3211, 3212), 322 (3221, 3222), 421 (4211, 4212), 521 (5211, 5212), 522 (5221, 5222), 621 ( 6211, 6212), 721 (7211, 7212), 722 (7221, 7222), 821 (8211, 8212), 822 (8221, 8222), 921 (9211, 9212), 1021 (10211, 10212), 1022 (10221) , 10222)
Conductor layer 131, 132, 133, 134, 231, 232, 233, 331, 332, 333, 334, 431, 432, 433, 434, 531, 532, 533, 534, 535, 631, 632, 633, 731 , 732, 733, 734, 835, 736, 831, 832, 833, 834, 835, 836, 931, 932, 933, 1031, 1032, 1033, 1034
Resin layer: 141, 142, 1431, 1432, 241, 341, 342, 343, 344, 441, 442, 443, 4441, 4442, 541, 542, 543, 5441, 5442, 543, 5451, 5452, 546, 641 , 741, 742, 743, 744, 745, 746, 747, 7481, 7482, 7491, 7492, 8411, 8412, 843, 844, 845, 846, 847, 8481, 8482, 8491, 8492, 941, 942, 943 , 944,9451,9452,1041,1042
Copper-clad laminate… 161,361,461,561,761,762,763,861,862,863,961,962,1061,1063
Heat dissipation layer ... 1071
Rigid multilayer printed wiring board 100, 200, 300, 400, 500, 600, 700, 800, 900, 1000

Claims (7)

A rigid multilayer printed wiring board in which one or more layers each including one or more resin dam layers and at least one other layer are laminated on at least one of an upper surface portion and a lower surface portion, the layers including the resin dam layers; The other layers are each composed of at least one of a conductor layer and a non-conductor layer, and the non-conductor layer is composed of a cured product of at least one of an intermediate material and a resin material,
A part or all of at least one side surface of the resin dam layer constitutes part or all of any side surface of the rigid multilayer printed wiring board,
The surface of the layer comprising the resin dam layer or the outermost surface of another layer that is laminated on the surface side and in contact with the resin dam layer and any side surface portion of the rigid multilayer printed wiring board By being configured to be L-shaped or inverted L-shaped, a method for manufacturing a rigid multilayer printed wiring board configured such that a part of the film thickness is different from the film thickness of the other part,
Resin dam layer that forms one or more resin dam layers made of a resin composition on at least one of at least one of an upper surface portion and a lower surface portion selected from one or more conductor layers and intermediate materials, resin materials, and cured products thereof Forming process;
The conductor layer in which the resin dam layer is formed and at least one selected from an intermediate material, a resin material, and a cured product thereof, and at least one other conductor layer, and an intermediate material, a resin material, and a cured product thereof. Including a stacking process of stacking either
In the stacking step, the conductor layer in which the resin dam layer is formed, the intermediate material, the resin material, and a cured product thereof, and the other conductor layer, the intermediate material, the resin material, and the cured product thereof. At least one of the resin dam layers is selected such that a part or all of at least one side surface portion of the resin dam layer constitutes part or all of any side surface portion of the rigid multilayer printed wiring board. A conductor layer having a layer, an intermediate material, a resin material, and at least one surface selected from these cured products, the surface in contact with the resin dam layer, or another conductor layer stacked on the surface side and in contact with the resin dam layer, and an intermediate At least one outermost surface selected from a material, a resin material, and a cured product thereof, and any side surface portion of the rigid multilayer printed wiring board L-shaped or reverse L-shaped and made so stacked,
At least one selected from a conductor layer and an intermediate material, a resin material, and a cured product thereof formed with the resin dam layer, and at least one selected from the other conductor layer, an intermediate material, a resin material, and a cured product thereof. A method for producing a rigid multilayer printed wiring board, wherein the laminated state is formed by heating in any of the steps for producing a rigid multilayer printed wiring board. A rigid multilayer printed wiring board in which one or more layers each including one or more resin dam layers and at least one other layer are laminated on at least one of an upper surface portion and a lower surface portion, the layers including the resin dam layers; The other layers are each composed of at least one of a conductor layer and a non-conductor layer, and the non-conductor layer is composed of a cured product of at least one of an intermediate material and a resin material,
A part or all of at least one side surface of the resin dam layer constitutes part or all of any side surface of the rigid multilayer printed wiring board,
The surface of the layer comprising the resin dam layer or the outermost surface of another layer that is laminated on the surface side and in contact with the resin dam layer and any side surface portion of the rigid multilayer printed wiring board By being configured to be L-shaped or inverted L-shaped, a method for manufacturing a rigid multilayer printed wiring board configured such that a part of the film thickness is different from the film thickness of the other part,
Resin dam layer that forms one or more resin dam layers made of a resin composition on at least one of at least one of an upper surface portion and a lower surface portion selected from one or more conductor layers and intermediate materials, resin materials, and cured products thereof Forming process;
The conductor layer in which the resin dam layer is formed and at least one selected from an intermediate material, a resin material, and a cured product thereof, and at least one other conductor layer, and an intermediate material, a resin material, and a cured product thereof. A stacking process of stacking either
A conductor layer including the resin dam layer and an intermediate portion thereof, such that at least one side surface part of the resin dam layer constitutes part or all of any side surface part of the rigid multilayer printed wiring board. A material in contact with the resin dam layer selected from the materials, resin materials and cured products thereof, or other conductor layers stacked on the surface side and in contact with the resin dam layer, and intermediate materials, resin materials, and these At least one outermost surface selected from a cured product and any side surface portion of the rigid multilayer printed wiring board are stacked on the outer layer side of the resin dam layer so as to be L-shaped or inverted L-shaped. A removal step of removing at least one part selected from the other conductor layers and intermediate materials, resin materials, and cured products thereof,
At least one selected from a conductor layer and an intermediate material, a resin material, and a cured product thereof formed with the resin dam layer, and at least one selected from the other conductor layer, an intermediate material, a resin material, and a cured product thereof. A method for producing a rigid multilayer printed wiring board, wherein a laminated state is formed by heating in any of the steps of producing a rigid multilayer printed wiring board.   The resin dam layer is formed of the resin composition by using at least one of screen printing, flexographic printing, gravure printing, inkjet printing, dispenser printing, and offset printing, and the conductive layer, intermediate material, resin material, and cured products thereof. Is formed by printing on at least one of the upper surface portion and the lower surface portion, and the resin dam layer is formed by at least one of ultraviolet curing and thermosetting in any of the manufacturing steps of the rigid multilayer printed wiring board. The manufacturing method of the rigid multilayer printed wiring board according to claim 1 or 2, wherein the cured state is achieved.   4. The resin composition according to claim 1, wherein the resin composition includes at least one of an ultraviolet curable resin, a thermosetting resin, and an ultraviolet curable / thermosetting resin. 5. Manufacturing method of rigid multilayer printed wiring board.   The non-conductor layer made of a cured product of the other intermediate material and the resin dam layer partially or entirely on the same plane, and the non-conductor made of the cured product of the resin dam layer and the other intermediate material A rigid multi-layer printed wiring board configured to be adjacent to each other in part or in whole via a resin cured product derived from the other intermediate material, and in the stacking step, the resin dam layer and The conductor layer on which the resin dam layer is formed and at least one selected from the intermediate material, the resin material and a cured product thereof and the other intermediate material so that a gap is provided between the other intermediate material and the other intermediate material The method for manufacturing a rigid multilayer printed wiring board according to any one of claims 1 to 4, wherein the layers are stacked. A plurality of the non-conductive layer and the resin dam layer, which are partly or entirely on the same plane and made of the cured product of the other intermediate material that is adjacent to each other through the cured resin product of the other intermediate material. A method for manufacturing a rigid multilayer printed wiring board,
In the stacking step, a conductor layer on which the resin dam layer is formed, an intermediate material, a resin material, and a cured product thereof are selected so that a gap is provided between the resin dam layer and the other intermediate material. 6. The method of manufacturing a rigid multilayer printed wiring board according to claim 5, wherein at least one of the other intermediate materials is stacked.   In any step of the manufacturing process of the rigid multilayer printed wiring board, at least one selected from the conductive layer and the intermediate material, the resin material, and the cured product thereof, and the other conductive layer and the intermediate layer formed of the resin dam layer to be stacked 7. The method according to claim 1, further comprising a step of forming a via hole in at least one selected from a material, a resin material, and a cured product thereof, or in a stacked state thereof. Manufacturing method of rigid multilayer printed wiring board.