WO2013008415A1 - Wiring board and method for manufacturing three-dimensional wiring board - Google Patents

Abstract

Disclosed is a wiring board, wherein a first substrate, which has an opening and first surface layer wiring disposed on a surface layer, and a second substrate, which has second surface layer wiring disposed on a surface layer, are bonded to each other by having a bonding section therebetween, and the opening forms a cavity having the second substrate as the bottom surface. At least a part of a resist section is formed in a region, which has the first substrate and the second substrate facing each other, and surrounds the cavity. A possibility of having a part of the bonding section protrude to the cavity side through a gap between the first substrate and the second substrate is eliminated, and a three-dimensional wiring board necessary for the purpose of achieving size reduction, thickness reduction, weight reduction, high accuracy, multifunctional characteristics, and the like of mobile apparatuses is provided.

Description

Wiring board and method of manufacturing three-dimensional wiring board

The present invention relates to a wiring board widely used in various electronic devices such as personal computers, mobile phones for mobile communication, video cameras and the like, and a method of manufacturing the same.

Recently, personal computers, digital cameras, mobile phones, etc. have become widespread as mobile products, and in particular there is a strong demand for small size, thin type, light weight, high definition, multi-functionalization etc.・ Lower height, three-dimensional implementation is in progress. For example, Patent Document 1 is known as a method of using a three-dimensional wiring substrate having a cavity as one of methods for easily realizing such reduction in height and three-dimensional mounting of a semiconductor package.

In addition, as a method for preventing the flow of the conductive paste filled in the connection portion, for example, Patent Document 2 is known.

JP 2004-253774 A JP, 2009-28364, A

The conventional three-dimensional wiring substrate disclosed in Patent Document 1 generally uses a prepreg for the bonding portion, but since the prepreg contains a core material such as a woven fabric, a non-woven fabric, or a film, it is particularly conductive. Although it is effective for shape retention of vias made of paste, it is difficult to embed the wiring patterns formed on the upper and lower printed wiring board surfaces.

In addition, when a bonding sheet is used for the bonding portion, embedding of the wiring pattern is easy, but there is a problem that the conductive paste filled in the bonding portion flows.

In order to solve these problems, two wiring boards (one with a cavity) are attached at the bonding portion to form a three-dimensional wiring board, and then through holes are formed in the three-dimensional wiring board with a drill or the like. In this case, a technique for forming a via hole by plating was also proposed, but in this case, the via hole penetrates both the bonding portion and the two wiring boards (or IVH does not have an IVH structure, so IVH means the meaning of Interstitial Via Hole). And the freedom of design of the wiring pattern of the three-dimensional wiring board, which has a problem that it can not cope with high density mounting.

The present invention has been made in view of the above problems, and is a wiring board in which a first substrate and a second substrate are connected by an adhesive portion, and a wire which prevents the adhesive portion from flowing out into the cavity. It will be a substrate. Therefore, high density mounting of semiconductors and the like in the cavity and wiring density are enhanced.

In order to achieve the above object, a wiring substrate which is one aspect of the present invention has a first substrate having an opening and a first surface wiring disposed in the surface, and a second surface wiring disposed in the surface. It is a wiring board which has a 2nd substrate. And an adhesion part is arranged between the 1st substrate and the 2nd substrate, and the 1st substrate and the 2nd substrate are pasted up mutually. Furthermore, a resist portion is disposed between the first substrate and the second substrate, and the resist portion is in contact with the first substrate and the second substrate. Furthermore, the opening forms a cavity whose bottom surface is the second substrate, and the bonding part has a via made of a conductive paste filled in a hole formed in the bonding part. The via electrically connects the first surface layer wiring and the second surface layer wiring, and at least a portion of the resist portion is formed in a region where the first substrate and the second substrate face each other and which surrounds the cavity. It is characterized by

Therefore, the outflow of the bonding portion into the cavity can be prevented, so that further miniaturization, thinness, light weight, high definition, multifunctionalization and the like of the three-dimensional wiring substrate can be realized.

Moreover, the manufacturing method of the three-dimensional wiring board which is the other aspect of this invention can manufacture the said wiring board.

FIG. 1 is an enlarged cross-sectional view of a part of the three-dimensional wiring substrate in the first embodiment of the present invention. FIG. 2 is a perspective view schematically showing the situation in which the three-dimensional wiring substrate in the first embodiment of the present invention is formed. FIG. 3 is a perspective view schematically showing the entire three-dimensional wiring board in the first embodiment of the present invention. FIG. 4A is a cross-sectional view showing an example of a method of manufacturing a three-dimensional wiring substrate according to Embodiment 1 of the present invention. FIG. 4B is a cross-sectional view showing an example of a method of manufacturing a three-dimensional wiring substrate according to Embodiment 1 of the present invention. FIG. 4C is a cross-sectional view showing an example of a method of manufacturing a three-dimensional wiring substrate according to Embodiment 1 of the present invention. FIG. 4D is a cross-sectional view showing an example of a method of manufacturing a three-dimensional wiring substrate according to Embodiment 1 of the present invention. FIG. 5A is a cross-sectional view showing an example of a method of manufacturing a body wiring board in the first embodiment of the present invention. FIG. 5B is a cross-sectional view showing an example of a method of manufacturing a three-dimensional wiring substrate according to Embodiment 1 of the present invention. FIG. 6 is a cross-sectional view showing an example of a method of manufacturing a three-dimensional wiring substrate in the first embodiment of the present invention. FIG. 7 is an enlarged sectional view of a part of the three-dimensional wiring substrate in the second embodiment of the present invention. FIG. 8A is a cross-sectional view showing an example of a method of manufacturing a three-dimensional wiring substrate according to Embodiment 2 of the present invention. FIG. 8B is a cross-sectional view showing an example of a method of manufacturing a three-dimensional wiring substrate according to Embodiment 2 of the present invention. FIG. 9A is a cross-sectional view showing an example of a method of manufacturing a three-dimensional wiring substrate in the second embodiment of the present invention. FIG. 9B is a cross-sectional view showing an example of a method of manufacturing a three-dimensional wiring substrate in the second embodiment of the present invention. FIG. 10 is a perspective view schematically showing a part of a cross section taken along arrow 10 in FIG. 11A is a perspective view schematically showing a part of a cross section taken along arrow 11 in FIG. 11B is a perspective view schematically showing a part of a cross section taken along arrow 11 in FIG. FIG. 12A is a perspective view schematically showing a state in which the adhesive layer is prevented from flowing out to the cavity side. FIG. 12B is a perspective view schematically showing a state in which the adhesive layer is prevented from flowing out to the cavity side. FIG. 13A is a cross-sectional view showing how the resists adhere or adhere to each other. FIG. 13B is a cross-sectional view showing how the resists adhere or adhere to each other. FIG. 13C is a cross-sectional view showing how the resists adhere or adhere to each other. FIG. 14 (a) is a cross-sectional view showing the state of the fixed surface, and FIG. 14 (b) is a top view of the interface portion of the fixed surface. FIG. 15 is a view showing a photomicrograph of the peeled surface of the sample actually prepared. FIG. 16 is a plan view schematically showing the microphotograph of FIG. FIG. 17 is an enlarged sectional view of a part of a three-dimensional wiring board according to a modification of the second embodiment of the present invention. FIG. 18 is an enlarged sectional view of a part of the three-dimensional wiring substrate according to the third embodiment of the present invention. FIG. 19 is a perspective view schematically showing a part of a cross section of a three-dimensional wiring substrate in the third embodiment of the present invention. FIG. 20 is a perspective view schematically showing a part of a cross section of a three-dimensional wiring substrate in the third embodiment of the present invention. FIG. 21 is a cross-sectional view showing a part of the semiconductor mounted structure in an enlarged manner, in the fourth embodiment of the present invention. FIG. 22A is a cross-sectional view schematically illustrating how metal powder is deformed. FIG. 22B is a cross-sectional view schematically illustrating how the metal powder is deformed. FIG. 23 is a diagram showing an example of a trial production result. FIG. 24 is a perspective view for explaining the first comparison substrate. FIG. 25 is a perspective view for explaining the first comparison substrate. FIG. 26 is a perspective view for explaining the first comparison substrate. FIG. 27A is a cross-sectional view showing a second method of manufacturing a three-dimensional wiring substrate. FIG. 27B is a cross-sectional view showing a second method of manufacturing the three-dimensional wiring substrate. FIG. 27C is a cross-sectional view showing a second method of manufacturing the three-dimensional wiring substrate.

Embodiment 1
<Structure of Embodiment 1>
Hereinafter, Embodiment 1 of the present invention will be described with reference to the drawings.

FIG. 1 is an enlarged cross-sectional view of a part of the three-dimensional wiring substrate in the first embodiment of the present invention. In FIG. 1, the three-dimensional wiring substrate 110 is formed by bonding the first substrate 120 and the second substrate 130 at the bonding portion 140. The first substrate 120 is formed of an insulating layer 160 and a first surface layer wiring 170 formed on the surface of the insulating layer 160. Furthermore, the second substrate 130 is formed of an insulating layer 160 and a second surface layer wiring 180 formed on the surface of the insulating layer 160. Holes (numbers are not assigned to the holes, and are illustrated as holes 270 in FIG. 4B described later) are formed in the bonding portion 140, and the holes are filled with the conductive paste 150. The conductive paste 150 also functions as a via, and electrically connects the first surface wiring 170 and the second surface wiring 180. The first substrate 120 has an opening, and the opening becomes a cavity 190. The configuration of the cavity will be described later with reference to FIGS. 2 and 3. The resist 220 is disposed in a region (peripheral portion 200) in which the first substrate 120 and the second substrate 130 face each other and surrounds the cavity 190, the upper surface is in contact with the first substrate, and the lower surface is in contact with the second substrate. ing. In the present embodiment, a conductive paste 150 containing metal powder is used.

Next, the entire configuration of the first substrate 120 and the second substrate 130 in the first embodiment of the present invention will be described with reference to FIGS. 2 and 3. FIG. 2 is a perspective view schematically showing the situation in which the three-dimensional wiring substrate in the first embodiment of the present invention is formed. FIG. 3 is a perspective view schematically showing the entire three-dimensional wiring board in the first embodiment of the present invention.

As shown in FIG. 2, an opening 290 is formed in the first substrate 120. Then, the first substrate 120 and the second substrate 130 are integrated as indicated by an arrow 280 via an adhesive portion (not shown in FIGS. 2 and 3). As a result, as shown in FIG. 3, a three-dimensional wiring board (hereinafter referred to as a three-dimensional wiring board) having a cavity 190 is formed. Although the wiring board having a cavity as in this embodiment is referred to as a three-dimensional wiring board, it may be called a wiring board without any problem.

In FIG. 2 and FIG. 3, the description of the bonding portion 140, the conductive paste 150, the insulating layer 160, the first surface wiring 170, the second surface wiring 180, etc. shown in FIG. 1 is omitted.

<Example of Specific Material and Size of Embodiment 1>
In the wiring structure of the first embodiment described with reference to FIG. 1, specific examples of materials and sizes will be described below.

A wiring substrate (so-called completed wiring substrate) using an insulating layer 160 as the first substrate 120 and the second substrate 130, using a commercially available glass epoxy resin (using an insulating layer formed by impregnating glass fiber with the epoxy resin) Can be used. A first surface layer wiring 170 and a second surface layer wiring 180 are formed on the surfaces of the first substrate 120 and the second substrate 130 that face each other through the bonding portion 140. As the first surface layer wiring 170 and the second surface layer wiring 180, those obtained by etching a commercially available copper foil (for example, having a thickness of 18 to 36 μm or the like) can be used. It is also useful to use an ALIVH substrate (ALIVH is a registered trademark of Panasonic Corporation) as the first substrate 120 and the second substrate 130. Since the ALIVH substrate has the Any Layer Interstitial Via Hole, the degree of freedom in wiring design of the three-dimensional wiring substrate 110 is enhanced. In addition, since via paste (not shown in FIG. 1 and the like) is used for interlayer connection of the ALIVH substrate, the reliability of the via portion at the time of compression is improved with respect to a wiring substrate using ordinary plated vias. high. Therefore, in order to increase the adhesion between the first surface layer wiring 170 and the second surface layer wiring 180 and the conductive paste 150, the effects of the pressure and the heating of the first substrate 120 and the second substrate 130 in the case of pressing and heating. It is hard to receive.

Moreover, as the resist 220, a commercially available solder resist can be used.

<One Example of Method of Manufacturing Wiring Board of First Embodiment>
Next, an example of a method of manufacturing the three-dimensional wiring substrate 110 of the first embodiment described with reference to FIG. 1 will be described with reference to the drawings.

4A to 4D, 5A, 5B, and 6 are cross-sectional views showing an example of a method of manufacturing the three-dimensional wiring substrate 110.

The same components as those of the three-dimensional wiring substrate 110 described with reference to FIG. 1 will be assigned the same reference numerals and descriptions thereof will be omitted.

As shown to FIG. 4A, the protective film 260 is formed in the both surfaces of the adhesion part 140. As shown in FIG. As the protective film 260, for example, a resin film with a thickness of 5 to 50 microns, such as a PET film, can be used.

As the bonding part 140, for example, a bonding part having a thickness of 5 to 200 microns, which contains a thermosetting resin and an inorganic filler for adjusting the thermal expansion coefficient, can be used.

Next, as shown in FIG. 4B, holes 270 are opened in the protective film 260 and the bonding part 140. A drill or a laser can be used to form the holes 270.

Thereafter, as shown in FIG. 4C, the holes 270 are filled with the conductive paste 150. For the filling of the conductive paste 150, for example, a commercially available screen printer can be used.

Thereafter, as shown in FIG. 4D, an opening 290 b is formed in the bonding portion 140 and the protective film 260. As a method of forming the opening 290b, a punching method or a cutting method using a mold or a laser can be selected. Then, a part of the bonding part 140 is removed as shown by the arrow 280, and the opening 290 is also provided in the bonding part 140. Thereafter, the protective film 260 is removed (step of removing the protective film 260 is not shown in FIG. 4).

Although the method for forming the opening 290 and the like has been described with reference to FIGS. 4A to 4D, the method for forming the opening 290 is not limited to this, and the order of the steps is also limited to this. It is not something to be done.

Next, a method of attaching the first substrate 120 and the second substrate 130 will be described.

As shown in FIG. 5A, the adhesive film 140 and the conductive paste 150 shown in FIG. 5A are obtained by removing the protective film 260 from the structure shown in FIG. 4D. The trace from which the protective film has been removed is a portion (protruding portion 300) where the conductive paste 150 protrudes from the surface of the bonding portion 140. The thickness of the protrusion 300 can be adjusted by the thickness of the protective film 260.

The first substrate 120 has an opening 290 a and has a first surface wiring 170 on the surface. In addition, the second substrate 130 has the surface layer second surface wiring 180. Then, a resist 220 is formed on the second surface wiring 180. The resist 220 is formed on the periphery (peripheral portion 200) of the opening of the first substrate 120 with the first substrate 120 and the second substrate 130 facing each other. The resist 220 is formed at a position closer to the cavity than the bonding portion 140.

Although the resist 220 is formed on the second surface layer wiring 180 in FIG. 1 and the like, the surface layer wiring does not necessarily have to be formed under the resist 220, and is formed on the insulating layer 160. May be

Then, a conductive paste 150 having a bonding portion 140 and a projecting portion 300 shown in FIG. 4D is set between the first substrate 120 and the second substrate 130.

The opening 290 b provided in the bonding unit 140 is made larger than the opening 290 a provided in the first substrate 120. The opening 290 b formed in the bonding part 140 is provided outside the resist 220 (or on the side farther from the cavity 190 formed by stacking these). By this, the overlap between the bonding portion 140 and the resist 220 can be reduced.

Then, FIG. 5A is pressed, and a state in which the first substrate 120 and the second substrate 130 are integrated by the bonding part 140 sandwiched in the middle is shown in FIG. 5B, and the result of pressing is shown in FIG. The pressing device and the mold are not shown.

In FIG. 5B, a gap 310 is formed in the process of pressing, and the vented arrow 320 indicates, for example, a state in which air remaining in the gap between the first substrate 120, the second substrate 130, and the bonding portion 140 is released (or ventilated) to the outside. Indicates By providing the air permeability as shown by the air flow arrow 320 on the side surface of the cavity 190 at the time of stacking, the effect of suppressing the generation of a void at the interface between the bonding portion 140 and the first substrate 120, the second substrate 130 and the like can be obtained.

Finally, as shown in FIG. 6, a contact portion (or a contact surface) in which the resist 220 and the first substrate 120 are in close contact with the region (peripheral portion 200) where the first substrate 120 and the second substrate 130 face each other. Can) The contact portion (or contact surface) is shown in FIG.

As indicated by a dotted line 330, in accordance with the surface condition of the first substrate 120 (or unevenness or waviness of the surface of the first substrate 120, etc.), an adhesion portion in which parts of the surface of the resist 220 adhere to each other is formed. As a result, the adhesion portion 140 which has been pressurized, heated and softened (further, the first surface wiring 170 and the second surface wiring 180 are embedded) is reliably prevented from flowing into the interior of the cavity 190 from the gap of the resist 220. can do.

In the cavity 190 in FIG. 6, the side surface is formed by the opening of the first substrate 120, the resist 220, and the bottom surface is formed by the second substrate 130.

As described above, according to the wiring substrate of the first embodiment described with reference to FIGS. 1 to 6, the first substrate 120 and the second substrate 130 are connected by the resist 220 at the periphery of the cavity. Thus, the flow out of the bonding portion 140 into the cavity 190 can be more reliably prevented.

Depending on the shape of the bonding portion 140 or the like, the effect of preventing the bonding portion 140 from flowing into the cavity 190 can be obtained without necessarily forming the resist 220 so as to surround the entire peripheral region of the cavity 190.

Further, in the present embodiment, the second surface layer wiring 180 provided on the surface layer of the second substrate 130 is drawn out into the cavity 190, whereby a fanout-type routing is made at the peripheral portion 200 of the cavity 190. The formation of the pattern is very easy. That is, the second surface layer wiring 180 provided on the surface layer of the second substrate 130 can be drawn directly into the cavity 190 at the shortest distance, and a semiconductor chip or the like is directly mounted on the second surface layer wiring 180. Can. As a result, the line length of the wiring can be kept shortest on the same plane without via holes and the like, and the ESR (equivalent series resistance) and ESL (equivalent series inductance) of the three-dimensional wiring board 110 can be reduced.

Further, in the present embodiment, since the conductive paste 150 filling the electrical connection between the first surface layer wiring 170 and the second surface layer wiring 180 is used, the first surface layer wiring 170 and the second surface layer wiring 180 are used. It is possible to increase the design freedom of the wiring pattern of the inner layer to be formed and the like (both not shown in FIG. 1). The reason for the increased design freedom is that the via made of the conductive paste 150 can be made IVH.

Second Embodiment
<Structure of Embodiment 2>
Second Embodiment A second embodiment of the present invention will be described below with reference to the drawings.

FIG. 7 is an enlarged sectional view of a part of the three-dimensional wiring substrate in the second embodiment of the present invention. The same components as in the first embodiment described with reference to FIG. 1 will be assigned the same reference numerals and descriptions thereof will be omitted.

The configuration of the first embodiment differs from the configuration of the second embodiment in the structure of the resist portion, which is the resist 220 in the first embodiment shown in FIG. 1, while in the second embodiment shown in FIG. The point is that the portion is formed of the first resists 220a and 220b. About a perspective view, since it is the same as that of Embodiment 1 demonstrated with reference to FIG. 2 and FIG. 3, description is abbreviate | omitted.

In addition, the specific material and the example of the size are also the same as in the first embodiment, so the description will be omitted.

<One Example of Method of Manufacturing Wiring Substrate of Second Embodiment>
Next, an example of a method of manufacturing the three-dimensional wiring substrate 110 of the second embodiment described with reference to FIG. 7 will be described with reference to the drawings. The same members of the present embodiment as those of the wiring board manufacturing method according to the first embodiment described with reference to FIGS.

The manufacturing method of the bonding portion 140 and the conductive paste 150 in the first embodiment described with reference to FIGS. 4A to 4D is the same as that of the first embodiment, and thus the drawings are omitted.

8A, 8B, and 9A are cross-sectional views showing an example of a method of manufacturing the three-dimensional wiring substrate 110 according to the second embodiment.

The difference from the first embodiment is that the first resist 220 a is formed on the insulating layer 160 forming the first substrate 120, and the second resist 220 b is formed on the insulating layer 160 forming the second substrate 130. It is only a point.

Next, the contact portion of the first resist 220a and the second resist 220b will be described with reference to FIG. 9B.

The first resist 220a and the second resist 220b are mutually heated and pressed to be in close contact with each other, so that the surface shapes of the first and second resists 220a and 220b are matched (or a surface formed by fitting) with each other. It remains to correspond to each other. This is because the first resist 220a and the second resist 220b are softened together when pressurized and heated. Even if the trace parts 340 are in contact with each other or apart from each other, there is no influence on the flow preventing effect of the adhesive part 140 into the cavity 190. The reason why the flow prevention effect is not affected is that, even if the first resist 220a and the second resist 220b constituting the trace portion 340 are separated from each other, the distance is substantially constant (further, all around the cavity 190). Because it is narrow.

The same effects as in the first embodiment can be obtained in the second embodiment described above.

Hereinafter, the bonding surface between the resists will be described in more detail with reference to FIGS. 2, 7 and 10 to 12.

FIG. 10 is a schematic view showing a part of the cross section in arrow 10 of FIG. FIG. 10 corresponds to an enlarged perspective view in which the side surface of the cavity 190 is observed from the inside of the cavity 190. In FIG. 10, the undeformed resist 370 corresponds to, for example, a first resist 220a provided on the peripheral portion 200 of the cavity 190 shown in FIG. The concavo-convex resist 380 corresponds to a second resist 220 b that covers a part of the second surface layer wiring 180 provided on the surface layer of the second substrate 130.

The unevenness of the uneven resist 380 is caused by the thickness of the second surface layer wiring (for example, fan-out wiring) embedded in the second resist 220 b. The thickness of the second surface layer wiring is effective for ensuring air permeability at the time of lamination. Further, the unevenness does not have to depend only on the thickness of each second surface layer wiring. In addition to the unevenness generated due to the presence or absence of the surface layer wiring, even if the unevenness is caused by the waviness or the like of the second substrate, it is effective for ensuring air permeability at the time of lamination.

As described above, by overlapping the second resist 220b on the second surface layer wiring 180 at the peripheral portion 200 of the cavity 190, it is useful to provide the surface with a concavo-convex shape according to the thickness of the second surface layer wiring 180. is there. An arrow 280 indicates that the first resist 220a and the second resist 220b are pressed, heated, and brought into close contact with each other in a state of facing each other.

FIG. 11A is a perspective view schematically showing a state in which the first resist 220 a and the second resist 220 b facing each other are provided on the peripheral portion 200 of the cavity 190 of the first substrate 120 and the second substrate 130. . A ventilation arrow 320 in FIG. 11A indicates a state in which internal air escapes (vents) to the outside through the gap 310 of the unevenness due to the second surface layer wiring 180 in which the second resist 220b is embedded. As shown in FIG. 11A, it is useful to form the second surface wiring 180 as a wiring pattern (so-called fan-out wiring or FANOUT wiring) extending from the outside of the cavity 190 into the inside of the cavity 190.

FIG. 11B is a perspective view schematically showing a state in which the first resist 220 a and the second resist 220 b facing each other are provided on the peripheral portion 200 of the cavity 190 of the first substrate 120 and the second substrate 130. is there. Even when the first resist 220a and the second resist 220b are in close contact with each other as shown in FIG. 11B, air permeability can be maintained as shown by the air flow arrow 320 from the gap of the unevenness of the surface of the second resist 220b. It becomes possible. Thereafter, they can be brought into close contact with each other by pressurizing and heating them.

FIGS. 12A and 12B schematically show that the first resist 220 a and the second resist 220 b are mutually heated and adhered in a softened state, thereby preventing the softened adhesive portion 140 from flowing out to the cavity 190 side. It is a perspective view shown to. In FIG. 12A, both 390a and 390b are deformed resists, and the first resist 220a and the second resist 220b in a heated state are pressed against each other, and they are mutually deformed.

FIG. 12A shows that the first resist 220a and the second resist 220b still maintain close contact with each other as the deformed resists 390a and 390b even after completion (that is, after the adhesive portion 140 is thermally cured). The adhesive surface is shown by dotted line 330 in FIG. 12A.

In FIG. 12B, the first resist 220a and the second resist 220b which are in close contact with each other are in close contact with each other after completion (that is, after the adhesive portion 140 is thermally cured). It is a perspective view which shows the case where the clearance gap 310 is formed via the trace part corresponded to a contact surface (or the trace of a contact surface). As shown in FIG. 12B, even if the first resist 220a and the second resist 220b are separated from each other, the gap 310 is uniform and sufficiently narrow, thereby preventing the adhesive portion 140 from flowing out to the cavity 190 side. You can do it. This is because the first resist 220a and the second resist 220b are heated and brought into close contact with each other to form a replica state in which the shape of the other is transferred to itself. Therefore, the contact surfaces of the first resist 220a and the second resist 220b are deformed. This deformed contact surface is called a deformed portion.

A more detailed description will now be given with reference to FIGS. 13-15.

13A to 13C are cross-sectional views showing how a part of the first resist 220a and a part of the second resist 220b adhere or adhere to each other.

In FIG. 13A, the bonding portion 140 has not flowed to the vicinity of the first resist 220a and the second resist 220b. The arrow SR1 indicates the thickness of the first resist 220a, the arrow SR2 indicates the thickness of the second resist 220b, and the arrow T indicates the thickness of the bonding portion 140. In FIG. 13A, it is desirable that the relational expression “(SR1 + SR2) ≦ T” holds.

As shown in FIGS. 13B and 13C, as indicated by arrows 280, the first substrate 120 and the second substrate 130 are pressurized and heated. As a result, an adhered surface or an adhered surface is formed in which a part of the first resist 220a and a part of the second resist 220b adhere or adhere to each other. In FIG. 12A, the adhesive or bonding surface is indicated by a dotted line 330. Here, the close contact surface means that the first resist 220a and the second resist 220b are in close contact with each other. When the first resist 220a and the second resist 220b are in close contact with each other, they may be deformed due to the influence of their surface shapes. Further, in the case of close contact, cohesive failure may not occur even if it is attempted to peel off the close contacts. Further, the term "adhesion" refers to a state in which parts are physically and chemically integrated while being in close contact with each other. Therefore, when it is going to peel away the adhering partner, the part may carry out cohesive failure. In addition, it is not necessary to necessarily limit that a part of 1st resist 220a and a part of 2nd resist 220b contact | adhere directly or adhere. This is because the same effect can be obtained even if a part of the first resist 220 a and a part of the second resist 220 b are in close contact or adhered via the bonding part 140.

When a part of the first resist 220 a and a part of the second resist 220 b are adhered and integrated with each other, or a part of the first resist 220 a and a part of the second resist 220 b via the adhesive portion 140. When they are fixed to each other and integrated, they are used as a fixed resist 400.

In FIGS. 14A and 14B, when a part of the first resist and a part of the second resist are mutually adhered and integrated, or a part of the first resist and a part of the second resist are integrated. They are sectional drawing explaining the adhering surface at the time of adhering and integrating mutually via an adhesion part, and a top view of the interface portion.

In the fixing resist 400, a part of the first resist 220a and a part of the second resist 220b are adhered and integrated with each other, or a part of the first resist 220a and a part of the second resist 220b are adhered. They are formed by being fixed and integrated with each other through the portion 140.

FIG. 14B is a top view showing an example of the peeling portion in the dotted line 330 (that is, the adhesion surface or the adhesion surface) of the adhesion resist 400. The peeling surface of the fixing resist 400 can be obtained, for example, by peeling the first substrate 120 and the second substrate 130 that constitute the three-dimensional wiring substrate 110 from each other.

FIG. 14 (b) is an example of the peeling surface. As shown in FIG. 14B, the second resist 220b serving as a base, the liquid bonding portion 410, and the trace portion (or aggregation portion) 340 can be observed on the peeling surface. In the liquid adhesive portion 410, when the inorganic filler or the like contained in the adhesive portion 140 intrudes into the gap between the first resist 220a and the second resist 220b as shown by the arrow 380, the inorganic filler or the like in the gap Is a cured product of the liquid resin component obtained by filtration. In addition, the trace portion 340 may be used as an aggregation portion. In this case, the aggregation portion 340 is a peeling surface formed by peeling a part of the first resist 220a, a part of the second resist 220b, the liquid bonding part 410, or a part of the bonding part 140 Or cohesively broken parts (when they are stuck to each other). The trace portion 340 may be an aggregation portion 340 formed by aggregation and destruction. This is because there is no difference whether it is a trace part or an aggregation part.

As shown in FIG. 14 (b), by pressing and heating with a press, the first resist 220a and the second resist 220b are in close contact with each other, or with the entire surface and a part, or all surfaces, and adhere An adhesion resist 400 is formed. Further, the adhering surface by the adhering resist 400 prevents the exudation or the exudation of the resin component constituting the adhesive portion 140. In addition, a liquid component (for example, liquid adhesive portion 410) that has leaked out from the adhesive portion 140 is also useful for forming such a sticking resist 400.

FIG. 15 is a view showing a micrograph of the peeled surface of a sample actually prepared by the inventor. FIG. 16 is a plan view schematically showing the microphotograph of FIG.

A region indicated by an arrow 480 in FIGS. 15 and 16 corresponds to a peeling portion between the first resist 220a and the second resist 220b. In the region indicated by the arrow 480 in FIGS. 15 and 16, as described in FIG. 14 described above, there remains a trace that these members adhere (or adhere to). The fixing resist 400 desirably has the members fixed, but may be in close contact with each other. This is because they are in close contact with each other, and when these members are peeled off as shown in FIGS. Therefore, if the interface of the exfoliation part of these members is observed with a microscope or SEM, and if the trace of these adhering (or adhering) is observed, it is sufficient. This means that if the trace portion observed with the microscope or the SEM is adhered or adhered, it is adhered (or adhered) with only the trace remaining. The purpose of the present invention is to achieve the effects of the present invention. In addition, a special and expensive analysis method is required to distinguish adhesion and adhesion, and in the present invention, the operation and effect are the same whether it is adhesion or adhesion.

Thus, at least a portion of the first resist 220a and a portion of the second resist 220b are in close contact or adhered to each other, or a portion of the first resist 220a and a portion of the second resist 220b are If the members are in close contact or adhered through the adhesive portion, the excellent effects of the present invention can be exhibited.

Further, while the resist and the insulating layer 160 are bonded in the first embodiment, since the resists are in close contact with each other in the second embodiment, the adhesion is higher than in the first embodiment. Therefore, in the second embodiment, compared to the first embodiment, it is possible to prevent the adhesive from flowing into the cavity more reliably.

(Modification of Embodiment 2)
Next, a modification of the second embodiment will be described with reference to FIG. FIG. 17 is a cross-sectional view enlarging a part of a three-dimensional wiring board in a modification of the second embodiment of the present invention.

The point different from the second embodiment is that the resist 220a protrudes into the cavity. As shown in FIG. 17, a part of the resist 220 protrudes into the cavity 190, so that an effect of absorbing an alignment error with the peripheral portion 200 of the first substrate 120 can be obtained.

In the present embodiment, the same effects as in the second embodiment can be obtained. The manufacturing method can also be manufactured by the same method as that of the second embodiment.

Third Embodiment
<Structure of Embodiment 3>
Hereinafter, Embodiment 3 of the present invention will be described with reference to the drawings.

FIG. 18 is an enlarged sectional view of a part of the three-dimensional wiring board in the third embodiment of the present invention. The same components as in the second embodiment described with reference to FIG. 7 are assigned the same reference numerals and descriptions thereof will be omitted.

The difference from the configuration of the second embodiment is that in the second embodiment shown in FIG. 7, the first surface layer wiring 170 does not enter between the first resist 220 a and the insulating layer 160. On the other hand, the third embodiment shown in FIG. 18 is only that the first surface layer wiring 170a is formed between the first resist 220a and the insulating layer 160. About a perspective view and an example of a concrete material and a size, since it is the same as that of Embodiment 2, explanation is omitted.

Further, the manufacturing method of the third embodiment is the same as the manufacturing method of the three-dimensional wiring substrate of the first embodiment and the second embodiment, so the description will be omitted.

Next, the bonding surface between the resists will be described in more detail with reference to FIGS. 18 to 20.

As shown in FIG. 18, the peripheral portion 200 is provided with a first resist 220 a and a first surface layer wiring 170 overlapping the first resist 220 a, and the second substrate 130 constituting the peripheral portion 200 of the cavity 190 is a second The case where the second surface layer wiring overlapping with the resist 220 b and the second resist 220 b is provided will be described.

In FIG. 18, the first substrate 120 constituting the peripheral portion 200 of the cavity 190 is provided with a first resist 220 a and a first surface layer wiring 170 overlapping the first resist 220 a to form the peripheral portion 200 of the cavity 190. The second substrate 130 is provided with a second resist 220 b and a second surface wiring overlapping the second resist 220 b. As described above, by providing the surface layer wiring so as to overlap the resist facing each other at the peripheral portion of the cavity 190, it is possible to reduce the bleeding of the bonding portion 140 to the cavity 190 side.

FIG. 19 is a cross-sectional view for explaining the case where a line-shaped surface layer wiring is provided so as to overlap with the opposing resist at the peripheral portion of the cavity 190. In FIG. 19, on the second substrate 130 side, the line-shaped first surface layer wiring 170 is formed on the first substrate 120 side so that the second surface layer wiring 180 consisting of fan-out wiring overlaps the second resist 220 b. It is provided to overlap 220a. The line-shaped first surface layer wiring 170 is desirably provided so as to be orthogonal to the second surface layer wiring 180 which is a fan-out wiring.

FIG. 20 is a cross-sectional view for explaining the case where a surface layer wiring of a reverse (for example, a negative-positive reverse pattern) surface layer is provided so as to overlap with the opposing resist at the peripheral portion of the cavity 190. In FIG. 20, a line-shaped first surface layer wiring 170 is formed on the first substrate 120 side so that the second surface layer wiring 180 consisting of fan-out wiring overlaps the second resist 220b on the second substrate 130 side. It is provided to overlap 220a. The line-shaped first surface layer wiring 170 is desirably provided so as to fill (or invert) the unevenness of the second surface layer wiring 180 which is a fan-out wiring.

Fourth Embodiment
<Structure of Embodiment 4>
Fourth Embodiment A fourth embodiment will be described with reference to FIG.

The embodiment shown in FIG. 21 is a three-dimensional wiring substrate in which the semiconductor element 230 is mounted inside the cavity 190 of the three-dimensional wiring substrate 110 described with reference to FIG. 7. Hereinafter, a semiconductor mounted product in which a semiconductor element is connected to a wiring board is referred to as a semiconductor mounted structure 250.

The semiconductor element 230 is mounted on the second surface layer wiring 180 exposed in the cavity 190 provided in the three-dimensional wiring substrate 110 shown in FIG. 7. In the present embodiment, for example, a solder bump is used as the mounting portion 240. The semiconductor element 230 is not limited to a silicon semiconductor, and includes a bare chip, a chip part, an optical element such as a lens, or an optical element. Wire bonding or the like may be used as the mounting unit 240. In addition, after the semiconductor element 230 and the like are mounted in the cavity 190, the semiconductor element 230 can be resin-sealed using a commercially available potting resin (sealing resin) or the like as necessary.

The semiconductor mounting structure 250 in which the semiconductor element 230 is mounted on the wiring substrate can contribute to downsizing and high performance of various mobile terminals such as mobile phones.

(Other embodiments)
<State of conductive paste surface contact>
Next, referring to FIGS. 22A and 22B, the use of a conductive paste containing metal powder as the conductive paste 150 shows that the metal powders are deformed to be in surface contact with each other.

FIGS. 22A and 22B are cross-sectional views schematically illustrating how metal powders contained in the conductive paste 150 are compressed and deformed with each other by the function and effect of the protrusion 300.

FIG. 22A is a cross-sectional view before the conductive paste 150 is pressure-compressed, and FIG. 22B is a cross-sectional view after the conductive paste 150 is pressure-compressed.

In FIG. 22B, the metal powder 350 contained in the conductive paste 150 is deformed to form a surface contact portion to form a deformed powder 360. In addition to the metal powder 350, a thermosetting resin such as an epoxy resin, a dispersant, an additive, a solvent, and the like may be added to the conductive paste 150 as necessary. The various members such as these thermosetting resins are not shown in FIGS. 22A and 22B. Arrow 280 a corresponds to the thickness of conductive paste 150 before compression. Next, the conductive paste is compressed more by the thickness of the first surface layer wiring 170 and the second surface layer wiring 180 provided so as to project from the surface of the protrusion 300, the first substrate 120, and the second substrate 130. , The state shown in FIG. 22B.

As shown in FIG. 22B, the plurality of metal powders 350 form deformed powder 360 which is in surface contact via a surface contact portion (or surface contact surface) indicated by dotted lines 330 which are compressed and deformed with each other. Also, at the interface between the deformed powder 360 and the deformed powder 360, a surface contact portion (or an interface in surface contact) indicated by a dotted line 330 is formed. Then, the plurality of metal powders 350 are electrically connected via the surface contact portion indicated by the dotted line 330, and the via resistance between the first surface layer wiring 170 and the second surface layer wiring 180 is reduced. Arrow 280 b in FIG. 22B indicates the thickness of the conductive paste 150 after being compressed. It goes without saying that the relationship “280a> 280b” is shown as described above.

Comparative Example of Flowing Out of Conductive Paste
Next, in order to confirm the superiority of the present invention, a trial product (hereinafter referred to as “comparative substrate 1”) in which the first comparative resist 430 is disposed in the cavity 190, and the trial of the second embodiment of the present application. For each of the works, the result of the exuding situation of the bonding part 140 will be described. In addition, an example of a trial production result is shown in FIG.

The prototype of the comparative substrate 1 will be described below with reference to FIGS. 24 to 26.

FIG. 24 is a perspective view for explaining the first comparison substrate 420. The first comparison resist 430 is disposed in the cavity. As shown by the arrow 280, the first substrate 120 and the second substrate 130 are brought into pressure contact with each other, resulting in the state of FIG.

FIG. 25 is an enlarged perspective view of the vicinity of the cavity 190 of the first comparison substrate 420. As shown in FIG. 25, a gap 310 a is formed between the first comparison resist 430 and the first substrate 120. Further, a gap 310 b resulting from the thickness of the second surface layer wire 180 is formed between the first substrate 120 and the second substrate 130. The ventilation arrow 320 indicates how internal air leaks to the outside through the gaps 310 b and 310 a.

FIG. 26 is a perspective view schematically showing how the bonding part 440 flows into the cavity side in the first comparison substrate 420. As shown in FIG. The heated and softened bonding portion 440 leaks to the outside through the gaps 310 b and 310 a shown in FIG. 24.

Next, it demonstrates using the table | surface which shows an example of a trial production result in FIG. The prototype of the present invention shown in FIG. 23 is a trial result using a test pattern in which several tens of approximately 10 mm square cavities 190 are formed in an outer dimension of approximately 300 × 300 mm. For the first substrate 120 and the second substrate 130, a 4-layer ALIVH substrate (ALIVH is a registered trademark of Panasonic Corporation) was used. This is because the ALIVH substrate is more resistant to pressure and heating than a multilayer substrate using a glass epoxy resin using general through-hole plating. Further, for the bonding portion 140, a sheet-like bonding layer (kneaded product of an inorganic filler and an epoxy resin) in which the thermal expansion coefficient is matched to the ALIVH substrate was used. Further, as the conductive paste 150, a conductive paste for an ALIVH substrate, which is obtained by kneading copper powder (3 to 10 microns) in an epoxy resin as the metal powder 350, was used. The pressure applied to the first substrate 120, the second substrate 130, and the bonding portion 140 can be increased stepwise from room temperature (20.degree. C.) to about 200.degree. C. while maintaining the pressure, using a vacuum press. And adjusted the heating condition profile. A negative resist was used as the first resist 220a and the second resist 220b. Further, the Tg of this negative resist was selected to be 200 ° C. or less (desirably 150 ° C. or less). Then, after the conductive paste 150 is started to be pressurized at around room temperature (20 ° C.) and brought into the state of FIG. 8B, these members are heated and the first resist 220a and the second resist 220b do not break even when they contact each other. It was softened to a certain degree, brought into close contact with each other, and softened the bonding portion 140.

The prototype of the present application shown in FIG. 23 corresponds to the second embodiment described with reference to FIG. The first comparison substrate corresponds to the first comparison substrate 420 shown in FIGS. 24 to 26 described above. The first substrate 120, the second substrate 130, the bonding portion 140, the conductive paste 150, and the like are common.

Moreover, the presence or absence of a void is the result of having observed the cross section of a part of each sample produced experimentally. Further, the protrusion of the bonding part is an example of the observation result of whether or not a part of the bonding part 140 inserted between the first substrate 120 and the second substrate 130 leaks into the cavity 190 with a stereomicroscope, It is shown in FIG.

As shown in FIG. 23, no void was generated in the prototype of the present invention and the first comparison substrate. It is considered that this is because an ALIVH substrate excellent in heating and pressurizing properties is used for the first substrate 120 and the second substrate 130. In addition, the protrusion of the bonding part 140 into the inside of the cavity 190 was observed at the first comparison substrate 420. On the other hand, in the prototype of the present application (the three-dimensional wiring substrate 110), the protrusion of the bonding portion 140 into the cavity 190 was not observed. In the product of the present invention, as shown in FIG. 5B and FIG. 11A, it is excellent in the dischargeability of air from the gap to the outside, which causes the generation of voids, and the bonding portion 140 is softened to enhance its flowability. In the temperature range (or under the pressure condition), it is considered that the sticking of the first resist 220 a and the second resist 220 b prevents the sticking of the bonding portion 140 to the cavity 190 side.

<Another Example of Manufacturing Method (Second Manufacturing Method of Three-Dimensional Wiring Board)>
Next, a method of manufacturing the second three-dimensional wiring substrate of Embodiments 1 to 3 will be described with reference to FIG.

In the above embodiment, in the method of manufacturing a three-dimensional wiring substrate described with reference to FIGS. 4 to 6, the first substrate having the first opening 290 a is bonded to the second substrate. In the second method of manufacturing a three-dimensional wiring substrate to be described below, the cavity is formed after bonding.

First, as shown in FIG. 27A, an adhesive portion 140 having a conductive paste 150 is set between the first substrate 120 and the second substrate 130. The method of manufacturing the bonding portion 140 having the conductive paste 150 is the same as the method of manufacturing the three-dimensional wiring substrate described with reference to FIGS. 4A to 4D, and thus the description thereof is omitted here. Then, as shown by an arrow 340a, these members are pressurized and integrated. Thereafter, as shown by an arrow 340 b in FIG. 27B, a part of any one or more of the first substrate 120 or the second substrate 130 is removed. Mechanical (router etc.), laser etc. can be used for removal. When a laser is used, it is useful to use a copper foil (for example, a part of surface wiring) as a stopper for the laser so that no laser processing mark is left on the surface (or the bottom) of the cavity 190. Thereafter, as shown by an arrow 340c in FIG. 27C, the unnecessary portion is removed to form a cavity 190.

As shown in FIGS. 27A to 27C, in the first substrate 120 and the second substrate 130, a portion of the first resist 220a and a portion of the second resist 220b are integrated so that they face each other at the peripheral portion of the cavity. After forming the cavity 190, the coplanarity of the mounting surface of the cavity 190 (Coplanarity means the uniformity of the lower surface of each terminal or electrode of the component with respect to the mounting surface). In this case, the terminal bottom surface uniformity can be improved.

Needless to say, the second manufacturing method described above can be applied to all of the first to fourth embodiments.

In the first to fourth embodiments, it is desirable that the resist 220 cover the circumference of the cavity 190. However, even if the resist does not completely go around the cavity 190 completely by providing an opening or the like, it is not necessary to completely go around the circumference if the outflow from the bonding part 140 can be prevented.

The resists formed of the wiring substrates described in the first to fourth embodiments can generally be disposed in the remaining area of the peripheral edge portion of the cavity, and therefore, the same may be applied without increasing the area of the wiring substrate. It has a function and can prevent the flow out of the bonding part. For example, in the first comparative substrate 420 shown in FIG. 25, since the first comparative resist 430 is formed in the cavity, it affects the area in the cavity. That is, in the case where the first comparative resist is formed in the cavity, for example, when the semiconductor element is disposed in the cavity, it is necessary to make the surface contact of the cavity larger than in the first to fourth embodiments of the present application.

In addition, electrical connection between the first surface layer wiring 170 and the second surface layer wiring 180 is formed on the first surface layer wiring 170 and the second surface layer wiring 180 by the conductive paste 150 filled in the bonding portion. It is possible to increase the design freedom of the wiring patterns of the inner layer etc. and vias (both not shown in FIG. 1). This is because the via formed of the conductive paste 150 can be IVH. Depending on the application, it is possible to form a through hole through the three-dimensional wiring substrate 110 with a drill or the like, and to form a through hole while applying a plating technique to this through hole.

In the first to fourth embodiments, the second surface wiring 180 is drawn into the cavity 190, but the second surface wiring 180 is not necessarily drawn into the cavity 190.

In the present embodiment, the pattern of the resist 220 provided on the peripheral portion 200 is a quadrangle in the present embodiment, but is not necessarily limited thereto. When the cavity 190 is square, the pattern of the resist 220 is preferably square.

The pattern width of the resist 220 may be arbitrarily designed to be 50 microns or more (or 100 microns or more) or 2000 microns or less.

The overlapping width between the peripheral portion 200 of the first substrate 120 and the resist 220 is preferably 50 microns or more. If the pattern width of the resist 220 (in particular, the pattern width of the narrowest portion) is less than 50 microns, the width of the overlapping portion between the peripheral portion 200 of the first substrate 120 and the resist 220 may be insufficient. If it exceeds 2000 microns, there is no problem if the pattern width of the resist 220 is changed (the pattern width is locally expanded or locally narrowed). For such pattern design, a solder resist design method may be applied.

In the present embodiment, since the resist 220 is formed on the peripheral portion 200 of the first substrate 120, the area of the substrate is generally obtained by spreading the first resist where the surface layer wiring does not exist on the peripheral portion 200. It is possible to easily secure a region for arranging the resist 220 without the need to expand the

The thickness of the second surface layer wiring 180 depends on the thickness (eg, 9 to 36 microns) of the copper foil used for the second surface layer wiring 180. It is desirable to make the thickness of the resist 220 thicker than the thickness of the second surface layer wiring 180. Also, by setting the thickness of the resist 220 to 100 microns or less, the possibility of affecting the total thickness of the three-dimensional wiring substrate 110 is reduced.

Note that, if necessary, the resist 220 is formed only in part of the cavity 190 (for example, a portion near the mounting area where the fan-out wiring is formed or the bottom of the cavity 190, for example, within 2 mm from the mounting area). You may make it oppose the peripheral part of 1 board | substrate 120. FIG. The position where the resist 220 is formed in this manner is on the entire circumference (or the entire peripheral edge) of the cavity 190 or on a part of the cavity 190 (at least 50% or more of the entire circumference of the cavity 190, or 60% or more. In the case of less than the above, the effect of preventing the flow of the bonding portion 140 into the cavity 190 may be affected.

As the first substrate 120 and the second substrate 130, it is useful to use a multilayer wiring substrate (a via may be a plated via or a paste via) using a commercially available glass epoxy resin. Alternatively, a buildup layer (the buildup layer is a kind of multilayer substrate having a blind via or the like) may be formed on the surface layer of the first substrate 120 and the second substrate 130. Further, in FIG. 1, a wiring substrate having a buildup layer is referred to as a first substrate 120, a surface wiring of the buildup layer is referred to as a first surface wiring 170 of the first substrate 120, and a wiring substrate having another buildup layer is referred to as a first wiring. The surface wiring of this second buildup layer is used as the second surface wiring 180 of the second substrate 130, and IVH connection is performed with the conductive paste 150 filled in the holes formed in the conductive paste 150. It is also useful to set it to 110. By doing this, the second surface layer wiring 180 of the second substrate 130 exposed to the bottom surface of the cavity 190 of the three-dimensional wiring substrate 110 can be made more functional (fine patterning or the like). As described above, also in the case where the buildup layers of the wiring substrate are made to face each other and are laminated and integrated through the bonding portion 140 to form the three-dimensional wiring substrate 110, the flow into the cavity 190 of the bonding portion 140 This can be effectively stopped by the resist 220 provided in the opposite buildup layer.

The three-dimensional wiring board, the semiconductor mounting structure, and the method of manufacturing the same according to the present invention make it possible to further reduce the size, thickness, weight, high definition, and multifunctionality of personal computers, digital cameras, mobile phones and the like.

DESCRIPTION OF SYMBOLS 110 Three-dimensional wiring board 120 1st board | substrate 130 2nd board | substrate 140 Bonding part 150 Conductive paste 160 Insulating layer 170 1st surface layer wiring 180 2nd surface layer wiring 190 Cavity 200 Peripheral part 220, 220a, 220b Resist 230 Semiconductor element 240 Mounting part 250 Semiconductor Mounting structure 260 Protective film 270 Hole 280, 280a, 280b Arrow 290, 290a, 290b Opening 300 Projection 310, 310a, 310b Clearance 320 Vented arrow 330 Dotted line 350 Metal powder 360 Deformed powder 370 Undeformed resist 380 Irregularity resist 420 1 Comparison substrate 430 1st comparison resist

Claims (9)

1. A first substrate having an opening and a first surface wiring disposed on the surface;
   A second substrate having a second surface wiring disposed on the surface;
   An adhesive unit disposed between the first substrate and the second substrate and adhering the first substrate and the second substrate to each other;
   A resist portion disposed between the first substrate and the second substrate and in contact with the first substrate and the second substrate;
   A wiring board having
   The opening forms a cavity whose bottom surface is the second substrate,
   The bonding portion has a via made of a conductive paste filled in a hole formed in the bonding portion,
   The via electrically connects the first surface layer wiring and the second surface layer wiring,
   A wiring substrate, wherein at least a part of the resist portion is formed in a region where the first substrate and the second substrate face each other and which surrounds the cavity.
2. The wiring board according to claim 1, wherein
   The resist portion is formed of a first resist and a second resist,
   The wiring substrate, wherein the first resist is in contact with the first substrate, and the second resist is in contact with the second substrate.
3. The wiring board according to claim 2, wherein
   In a region where the first substrate and the second substrate face each other and surrounds the cavity, an adhesion portion in which the first resist and the second resist are in close contact with each other is formed. Wiring board to be.
4. The wiring board according to claim 3, wherein
   The wiring board, wherein the adhesion portion is a deformation portion.
5. The wiring board according to claim 2, wherein
   At least a portion of the first resist and at least a portion of the second resist are directly or through the bonding portion in the peripheral region of the cavity where the first substrate and the second substrate face each other. A wiring board characterized by adhering or adhering.
6. The wiring board according to claim 2, wherein
   A wiring substrate in which the first resist and the first substrate are in contact with each other through surface wiring.
7. The wiring board according to claim 1, wherein
   Furthermore, it has a semiconductor element disposed in the cavity,
   The wiring substrate, wherein the semiconductor element is connected to a surface layer wiring disposed on a surface layer of the second substrate in the cavity.
8. A first step of opening a hole in a bonding portion to which a protective film is attached on the surface;
   A second step of filling the hole of the bonding portion opened in the first step with a conductive paste;
   A third step of peeling the protective film;
   A first substrate having an opening portion and a first surface layer wiring disposed in the surface layer, and a second substrate having a second surface layer wiring disposed in the surface layer are pasted through the adhesive portion, and the first substrate And a fourth step in which a cavity having an opening as a side surface and the second substrate as a bottom surface is formed,
   When bonding the first substrate and the second substrate in the fourth step, at least a part of the resist portion is in a region where the first substrate and the second substrate face each other and surrounds the cavity. A manufacturing method of a wiring board characterized by being formed.
9. A first step of opening a hole in a bonding portion to which a protective film is attached on the surface;
   Filling the conductive paste in the holes of the bonding portion opened in the first step;
   A third step of peeling the protective film;
   A fourth step of bonding a first substrate having a first surface layer wiring disposed on the surface layer, and a second substrate having a second surface layer wiring disposed on the surface layer, through the adhesive portion;
   A fifth step of removing a part of at least one of the first substrate and the second substrate to form a cavity,
   When bonding the first substrate and the second substrate in the fourth step, at least a part of the resist portion is in a region where the first substrate and the second substrate face each other and surrounds the cavity. A manufacturing method of a wiring board characterized by being formed.

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