JP2006140213A - Rigid flexible multilayer printed wiring board - Google Patents

Rigid flexible multilayer printed wiring board Download PDF

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Publication number
JP2006140213A
JP2006140213A JP2004326561A JP2004326561A JP2006140213A JP 2006140213 A JP2006140213 A JP 2006140213A JP 2004326561 A JP2004326561 A JP 2004326561A JP 2004326561 A JP2004326561 A JP 2004326561A JP 2006140213 A JP2006140213 A JP 2006140213A
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rigid
multilayer printed
printed wiring
board
wiring board
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JP2004326561A
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Japanese (ja)
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Koichi Niisato
幸一 新里
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Cmk Corp
日本シイエムケイ株式会社
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Abstract

PROBLEM TO BE SOLVED: To provide a rigid flexible multilayer printed wiring board where connection reliability of a through hole can be secured even if a flexible board does not exist in the rigid part or the end part of the flexible board is included in a region of the rigid part.
SOLUTION: The rigid flexible multilayer printed wiring board is provided with the core substrate of the rigid part, the flexible board arranged adjacently to the horizontal direction of the core board, an insulating adhesive layer which is laminated on the surface and the rear face of the core board and the flexible board and has flexibility after curing, a wiring pattern which is positioned in the rigid part and is formed on the insulating adhesive layer having flexibility, and a blind via hole and/or the through hole which connect the wiring patterns formed in the respective layers.
COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明はリジッドフレックス多層プリント配線板に関し、特に、配線パターン形成層間を接続するブラインドバイアホール及び/又はスルーホールの接続信頼性に優れた薄型のリジッドフレックス多層プリント配線板に関する。 The present invention relates to a rigid-flex multilayer printed wiring board, more particularly, to a thin rigid-flex multilayer printed wiring board having excellent connection reliability of the blind via hole and / or through holes for connecting the wiring pattern forming layers.

従来のリジッドフレックス多層プリント配線板の構成について簡単に説明する。 Briefly describes the configuration of a conventional rigid-flex multilayer printed wiring board.

図3は4層のリジッドフレックス多層プリント配線板Pbを示したもので、配線パターン2が形成されたフレキシブル基板1と、当該配線パターン2を保護するために積層されたカバーレイ3と、フレックス部Fを除いた部位に積層された絶縁接着シート4と、当該絶縁接着シート4上に形成された配線パターン2と、各層に形成された配線パターン2間を接続するスルーホール5と、外層の配線パターン2を保護するソルダーレジスト6とを備えた構成となっている。 Figure 3 shows a rigid-flex multilayer printed wiring board Pb four layers of the flexible substrate 1 on which the wiring pattern 2 is formed, a coverlay 3 laminated to protect the wiring pattern 2, flex portion an insulating adhesive sheet 4 laminated to a site except for F, and the insulating adhesive sheet 4 wiring pattern 2 formed on a through hole 5 for connecting the formed layers a wiring pattern 2, the outer layer of wires It has a configuration in which a solder resist 6 to protect the pattern 2.

しかし、上記リジッドフレックス多層プリント配線板Pbの構成では、以下のような不具合があった。 However, in the configuration of the rigid-flex multilayer printed wiring board Pb, it had the following problems.

即ち、フレキシブル基板1が伸縮し易いため、スルーホール6の位置合わせが難しく、高密度配線化が困難であった。 That is, liable flexible substrate 1 expands and contracts, the alignment of the through hole 6 is difficult, it is difficult high-density wiring of.

そこで、このような不具合を解消するものとして、図4に示したような構成のリジッドフレックス多層プリント配線板Paが知られている(特許文献1参照)。 Therefore, such a problem as to eliminate, rigid-flex multilayer printed wiring board Pa having the structure shown in FIG. 4 is known (see Patent Document 1).

当該リジッドフレックス多層プリント配線板Paは、フレックス部Fに相当する部位に配置されたフレキシブル基板1と、当該フレキシブル基板1の水平方向に隣接して配置された絶縁接着シート4と、当該隣接して配置されたフレキシブル基板1と絶縁接着シート4の表裏に形成された配線パターン2と、当該配線パターン2が形成されたフレキシブル基板1と絶縁接着シート4の表裏に積層されたカバーレイ3と、フレックス部Fを除いた部位に積層された絶縁接着シート4と、当該絶縁接着シート4上に形成された外層の配線パターン2と、各層に形成された配線パターン2間を接続するスルーホール5と、外層の配線パターン2を保護するソルダーレジスト6とを備えた構成となっている。 The rigid-flex multilayer printed wiring board Pa includes a flexible substrate 1 which is disposed in a portion corresponding to a flex portion F, an insulating adhesive sheet 4 disposed adjacent to the horizontal direction of the flexible substrate 1, and the adjacent arranged with the flexible substrate 1 and the wiring pattern 2 formed on the front and back of the insulating adhesive sheet 4, the flexible substrate 1 to which the wiring pattern 2 is formed as a cover lay 3 laminated on both sides of the insulating adhesive sheet 4, flex an insulating adhesive sheet 4 laminated to a site except for the part F, the wiring pattern 2 of the outer layer formed over the insulating adhesive sheet 4, a through hole 5 for connecting the formed layers a wiring pattern 2, It has a configuration in which a solder resist 6 for protecting the outer layer of the wiring pattern 2.

このように、リジッド部Rにフレキシブル基板1が存在しない、あるいはフレキシブル基板1の端部がリジッド部Rの領域に若干含まれる構成とすることによって、スルーホール7と配線パターン2との位置合わせを向上できるというものである。 Thus, no flexible substrate 1 is present in the rigid section R, or by the end of the flexible substrate 1 is configured to be contained slightly in the region of the rigid portion R, the alignment of the through holes 7 and the wiring pattern 2 it is that it is possible to improve.

しかし、上記リジッドフレックス多層プリント配線板Paの構成においては、フレキシブル基板1と、当該フレキシブル基板1に隣接して配置される絶縁接着シート4とを一体化する手段として、カバーレイ3を表裏に積層(リジッド部Rも含めて)して一体化するようにしているため、以下のような不具合があった。 However, in the configuration of the rigid-flex multilayer printed wiring board Pa, laminated flexible substrate 1, as a means to integrate the insulating adhesive sheet 4 disposed adjacent to the flexible substrate 1, a coverlay 3 on the front and back since you have to integrate (rigid section R be included) that had the following problems.

即ち、当該カバーレイ3は、ポリイミド系樹脂の表面に、図示しないエポキシ系又はアクリル系の接着剤を塗布した二層構造からなり、低Tg(ガラス転移点)特性を有する接着剤が介在することから、スルーホールの接続信頼性が低下するというものであった。 That is, the coverlay 3, the surface of the polyimide resin, made a two-layer structure coated with epoxy or acrylic adhesive (not shown), the adhesive having a low Tg (glass transition point) characteristics is interposed from the connection reliability of through holes it was that lowered.
特開平7−94835号公報 JP 7-94835 discloses

本発明は、上記不具合を解消するためになされたもので、リジッド部にフレキシブル基板が存在しない、あるいはフレキシブル基板の端部がリジッド部の領域に若干含まれる構成とした場合においても、スルーホールの接続信頼性を確保することができるリジッドフレックス多層プリント配線板を提供することを課題とする。 The present invention has been made to solve the above problem, the flexible substrate is not present in the rigid portion, or even when the end portion of the flexible substrate is configured to be contained slightly in the region of the rigid portion, the through hole providing a rigid-flex multilayer printed wiring board can be secured connection reliability and an object.

本発明は、リジッド部とフレックス部とを備えたリジッドフレックス多層プリント配線板であって、少なくとも、リジッド部のコア基板と、当該コア基板の水平方向に隣接して配置されたフレキシブル基板と、当該コア基板とフレキシブル基板の表裏に積層された硬化後においても柔軟性を有する絶縁接着剤層と、リジッド部に位置する当該柔軟性を有する絶縁接着剤層上に形成された配線パターンと、各層に形成された配線パターン間を接続するブラインドバイアホール及び/又はスルーホールとを有することを特徴とするリジッドフレックス多層プリント配線板により上記課題を解決したものである。 The present invention relates to a rigid-flex multilayer printed wiring board comprising a rigid portion and a flex portion, at least, a core substrate of the rigid portion, and a flexible substrate disposed adjacent to the horizontal direction of the core substrate, the an insulating adhesive layer also has a flexibility after curing which is laminated on both sides of the core substrate and the flexible substrate, a wiring pattern formed on the insulating adhesive layer having the flexibility to position the rigid portion, the layers the rigid-flex multilayer printed wiring board characterized by having a blind via hole and / or through holes for connecting the formed wiring pattern is obtained by solving the above problems.

フレキシブル基板とリジッド部のコア基板とを、硬化後においても柔軟性を有する絶縁接着剤層にて一体化する構成としたため、スルーホールの接続信頼性を向上させることができる。 The core substrate of the flexible substrate and the rigid portion, due to the configuration of integrating with the insulating adhesive layer also has a flexibility after curing, thereby improving the connection reliability of through holes. また、当該柔軟性を有する絶縁接着剤層を、フレキシブル基板のカバーレイと、多層化する際の絶縁接着シートの機能とを兼用させる構成としたため、リジッドフレックス多層プリント配線板を薄型化することができる。 Further, the insulating adhesive layer having the flexibility, and the coverlay of the flexible substrate, since a structure which also serves the function of the insulating adhesive sheet at the time of multi-layered, can be thinner rigid-flex multilayer printed wiring board it can.

以下本発明リジッドフレックス多層プリント配線板の実施の形態を、図1(e)を用いて説明する。 Preferred embodiments of the present invention rigid-flex multilayer printed wiring board will be described with reference to FIG. 1 (e). 尚、従来技術と同じ部位には、同じ符号を付すようにした。 Note that the same site as the prior art, and so given the same reference numerals.

図1(e)は、本発明のリジッドフレックス多層プリント配線板Pの概略断面図を示したもので、当該多層プリント配線板Pは、リジッド部Rのコア基板7と、当該コア基板7の水平方向に隣接して配置されたフレキシブル基板1と、当該コア基板7とフレキシブル基板1上に形成された内層の配線パターン2と、当該コア基板7とフレキシブル基板1の表裏に積層された柔軟性絶縁接着剤層9と、リジッド部Rに位置する当該柔軟性絶縁接着剤層9上に形成された外層の配線パターン2と、各層の配線パターン2間を接続するスルーホール5と、フレキシブル基板1の配線パターン2とリジッド部に形成されている配線パターン2とを接続するブラインドバイアホール14と、外層の配線パターン2を保護するソルダーレジスト6とからな FIG. 1 (e) shows a schematic cross-sectional view of a rigid-flex multilayer printed wiring board P of the present invention, the multilayer printed wiring board P includes a core substrate 7 of the rigid portion R, the horizontal of the core substrate 7 a flexible substrate 1 which is positioned adjacent to the direction, flexibility insulation with the core substrate 7 and the wiring pattern 2 of the inner layer which is formed on the flexible substrate 1, stacked on the front and back of the core substrate 7 and the flexible substrate 1 and the adhesive layer 9, and the wiring pattern 2 of the outer layer formed on the flexible insulating adhesive layer 9 located on the rigid section R, a through hole 5 for connecting the wiring pattern of each layer 2, the flexible substrate 1 I from the blind via hole 14 for connecting the wiring pattern 2 formed on the wiring pattern 2 and the rigid portion, a solder resist 6 for protecting the outer layer of the wiring pattern 2 、リジッド部Rとフレックス部Fとは略フラットに形成されている。 It is formed in a substantially flat and rigid section R and the flex portion F.

次に、斯かる本発明リジッドフレックス多層プリント配線板の製造方法を、図1及び図2を用いて説明する。 Next, a manufacturing method of such the present invention rigid-flex multilayer printed wiring board will be described with reference to FIGS.

まず、一般的なサブトラクティブ法、あるいはアディティブ法によって、絶縁基材の表裏に配線パターン2を形成し、次いで、ルーター、金型等により、後にフレキシブル基板が配置される部分に開口部8を形成することによって、図1(a)及び図2に示したコア基板7を得る。 First, typical subtractive process, or by an additive method, a wiring pattern 2 is formed on the front and back of the insulating substrate, then the router, by a die or the like, an opening 8 in the portion to which the flexible substrate is placed after the formation by obtain a core substrate 7 shown in FIG. 1 (a) and FIG.

次に、当該開口部8に対応するサイズのフレキシブル基板1(配線パターン2形成済み)を用意し、図1(a)及び図2に示したように当該開口部8に、フレキシブル基板1を配置する。 Next, prepare a flexible substrate having a size corresponding to the opening 81 (the wiring pattern 2 already formed) on the opening 8, as shown in FIGS. 1 (a) and 2, placing the flexible substrate 1 to.

次に、コア基板7とフレキシブル基板1の表裏に、硬化後においても柔軟性を有する柔軟性絶縁接着剤層9と金属箔10とを順次積層するか、あるいは予め両者が積層された樹脂付金属箔を配置し(図1(a)及び図2参照)、次いで、積層プレスを行なうことによって、図1(b)の状態の基板を得る。 Then, on the front and back of the core substrate 7 and the flexible substrate 1, flexible insulating adhesive layer 9 and sequentially laminating the metal foil 10 or, alternatively advance with both laminated resins metal also having flexibility after curing place the foil (see FIG. 1 (a) and FIG. 2), then by performing a laminating press, to obtain a substrate in the state of FIG. 1 (b).

次に、図1(c)に示したように、層間接続を行なう部位に非貫通孔11、及び貫通孔12を穿孔し、次いで、当該非貫通孔11、及び貫通孔12のデスミア処理を行なった後、全面にめっき13を形成する(図1(d)参照)。 Next, as shown in FIG. 1 (c), and drilling a blind hole 11 and the through hole 12, a portion for performing inter-layer connection, then subjected to desmear treatment of the non-through hole 11, and the through-holes 12 after, to form a plating 13 on the entire surface (see FIG. 1 (d)).

次に、一般的なサブトラクティブ法により、外層に配線パターン2を形成するとともにブラインドバイアホール14、及びスルーホール5を形成し、次いで、外層の配線パターン2を保護するソルダーレジスト6を形成した後、外形加工を行なうことによって、リジッド部Rにフレックス部Fのフレキシブル基板1が存在しない、あるいは当該フレキシブル基板1の端部がリジッド部Rの領域に若干含まれる構成のリジッドフレックス多層プリント配線板Pを得る(図1(e)参照)。 Next, by a general subtractive method, a blind via hole 14 to form the wiring pattern 2 on the outer layer, and forming a through hole 5, then, after forming a solder resist 6 for protecting the outer layer of the wiring pattern 2 , by performing outline processing, the rigid portion flexible substrate 1 of the flex portion F does not exist in the R, or rigid-flex multilayer printed wiring board P of arrangement in which the end portion of the flexible substrate 1 is included slightly in the region of the rigid part R the obtained (see FIG. 1 (e)).

本発明を説明するに当たって、4層のリジッドフレックス多層プリント配線板を例にして説明したが、本発明の構成はこの限りでなく、これ以上の層構成としても本発明は有効に作用する。 In describing the present invention, although the rigid-flex multilayer printed wiring board of four layers has been described as an example, the configuration of the present invention is not as long as this, the present invention acts effectively as a further layer configuration.

本発明のリジッドフレックス多層プリント配線板の製造例を示す概略断面工程説明図。 Schematic cross-sectional process diagram showing an example of producing rigid-flex multilayer printed wiring board of the present invention. 図1(a)に示す積層体の分離斜視説明図。 Separated perspective view of the multilayer body shown in FIG. 1 (a). 従来のリジッドフレックス多層プリント配線板の概略断面説明図。 Schematic cross-sectional view of a conventional rigid-flex multilayer printed wiring board. 従来の他のリジッドフレックス多層プリント配線板の概略断面説明図。 Schematic cross-sectional view of another conventional rigid-flex multilayer printed wiring board.

符号の説明 DESCRIPTION OF SYMBOLS

1:フレキシブル基板2:配線パターン3:カバーレイ4:絶縁接着シート5:スルーホール6:ソルダーレジスト7:コア基板8:開口部9:柔軟性絶縁接着剤層 1: flexible substrate 2: wiring pattern 3: coverlay 4: insulating adhesive sheet 5: through-hole 6: solder resist 7: core substrate 8: opening 9: flexible insulating adhesive layer
10:金属箔 10: metal foil
11:非貫通孔 11: non-through hole
12:貫通孔 12: through-hole
13:めっき 13: Plating
14:ブラインドバイアホールP、Pa、Pb:リジッドフレックス多層プリント配線板 14: blind via hole P, Pa, Pb: rigid-flex multilayer printed wiring board

Claims (1)

  1. リジッド部とフレックス部とを備えたリジッドフレックス多層プリント配線板であって、少なくとも、リジッド部のコア基板と、当該コア基板の水平方向に隣接して配置されたフレキシブル基板と、当該コア基板とフレキシブル基板の表裏に積層された硬化後においても柔軟性を有する絶縁接着剤層と、リジッド部に位置する当該柔軟性を有する絶縁接着剤層上に形成された配線パターンと、各層に形成された配線パターン間を接続するブラインドバイアホール及び/又はスルーホールとを有することを特徴とするリジッドフレックス多層プリント配線板。 A rigid-flex multilayer printed wiring board comprising a rigid portion and a flex portion, at least, a core substrate of the rigid portion, and a flexible substrate disposed adjacent to the horizontal direction of the core substrate, the core substrate and the flexible an insulating adhesive layer also has a flexibility after curing which is laminated on the front and back surfaces of the substrate, a wiring pattern formed on the insulating adhesive layer having the flexibility to position the rigid portion, the wiring formed in each layer rigid-flex multilayer printed wiring board characterized by having a blind via hole and / or through holes for connecting the pattern.
JP2004326561A 2004-11-10 2004-11-10 Rigid flexible multilayer printed wiring board Pending JP2006140213A (en)

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WO2007135823A1 (en) 2006-05-19 2007-11-29 Asahi Glass Company, Limited Method of removing halogen gas and remover for halogen gas
JP2008021960A (en) * 2006-07-13 2008-01-31 Samsung Electro Mech Co Ltd Rigid flexible printed circuit board, and manufacturing method thereof
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US8925194B2 (en) 2006-10-23 2015-01-06 Ibiden Co., Ltd. Flex-rigid wiring board and method of manufacturing the same
US8476531B2 (en) 2006-10-23 2013-07-02 Ibiden Co., Ltd Flex-rigid wiring board and method of manufacturing the same
US8071883B2 (en) 2006-10-23 2011-12-06 Ibiden Co., Ltd. Flex-rigid wiring board including flexible substrate and non-flexible substrate and method of manufacturing the same
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US7982135B2 (en) 2006-10-30 2011-07-19 Ibiden Co., Ltd. Flex-rigid wiring board and method of manufacturing the same
US8479389B2 (en) 2006-10-30 2013-07-09 Ibiden Co., Ltd. Method of manufacturing a flex-rigid wiring board
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US9271405B2 (en) 2006-10-30 2016-02-23 Ibiden Co., Ltd. Flex-rigid wiring board and method of manufacturing the same
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EP2187720A1 (en) * 2008-03-10 2010-05-19 Ibiden Co., Ltd. Flexible wiring board, and its manufacturing method
EP2187720A4 (en) * 2008-03-10 2011-11-23 Ibiden Co Ltd Flexible wiring board, and its manufacturing method
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