JPH08139454A - Manufacturing method of printed-wiring board - Google Patents

Manufacturing method of printed-wiring board

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Publication number
JPH08139454A
JPH08139454A JP27762494A JP27762494A JPH08139454A JP H08139454 A JPH08139454 A JP H08139454A JP 27762494 A JP27762494 A JP 27762494A JP 27762494 A JP27762494 A JP 27762494A JP H08139454 A JPH08139454 A JP H08139454A
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wiring
forming
unit
layer
step
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JP27762494A
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Japanese (ja)
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JP3540396B2 (en )
Inventor
Koichiro Shibayama
耕一郎 柴山
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Toshiba Corp
株式会社東芝
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Abstract

PURPOSE: To provide the manufacturing method capable of manufacturing high quality printed-wiring board mass productively in high yield without any complicated steps or particular installation at all. CONSTITUTION: The title manufacturing method is composed of the four steps as follows i.e., the first step of lamination-arranging conductive metallic layers 6a, 6b on the surface of flexible wiring substrate 1 through the intermediary of bonding agent 4 in a plurality of layers, by pressure integrating said laminated body the second step of forming conductive metallic layer clad with conductive metallic layer board, the third step of forming hard wiring units 2, 3 by patterning said conductive metallic layer, the fourth step of forming hard wiring units 1' bendable between said hard wiring units 2, 3. Furthermore, at least one layer of bonding agent layers 4 positioned on the bendable wiring unit 1' formation part is selectively removed to form an aperture part.

Description

【発明の詳細な説明】 DETAILED DESCRIPTION OF THE INVENTION

【0001】 [0001]

【産業上の利用分野】本発明は、プリント配線板の製造方法に係り、特に硬質プリント配線ユニットおよびとフレキシブルな配線ユニットを備え、折り曲げ使用が可能なプリント配線板の製造方法に関する。 The present invention relates relates to a method for manufacturing a printed wiring board, in particular comprising a rigid printed wiring unit and a flexible wiring unit, a method of manufacturing a capable printed wiring board using bending.

【0002】 [0002]

【従来の技術】従来から、可撓性が要求される配線の接続部、機器の筐体などを兼用させた回路構成、もしくは回路装置のコンパクト化として、次のような構成の折り曲げ可能なプリント配線板が知られている。 Heretofore, connecting portions of the wiring flexibility is required, the circuit configuration is also used and the instrument housing, or as a compact circuit device, can print bending the following structure wiring board is known. すなわち、 That is,
フレキシブル配線素板面に、平面的に適宜離隔して硬質のプリント配線ユニットを積層一体化し、前記離隔部を成すフレキシブル配線素板によって、折り曲げ可能に構成したプリント配線板が知られている。 A flexible wiring material plate surface, the printed wiring unit of a hard integrally laminated appropriately spaced in a plane, by a flexible wiring material plates forming the isolation section is known can configured the printed wiring board folded.

【0003】図3は、このような折り曲げ可能なプリント配線板の、要部構成を断面的に示したもので、1は所要の配線パターン1a,1bを備えたフレキシブル配線素板、2,3は前記フレキシブル配線素板1の両主面に、 [0003] Figure 3 is of such a foldable printed circuit board, which was cross-sectionally shows a main configuration, 1 flexible wiring element plate having a predetermined wiring pattern 1a, 1b, 2,3 on both main surfaces of said flexible wiring material plate 1,
それぞれ接着剤層4を介して一体的に配設された硬質な配線ユニットである。 A rigid wiring unit which is disposed integrally to each other via the adhesive layer 4. そして、この硬質な配線ユニット2,3を単位とし、帯状に露出させたフレキシブルな配線ユニット1′を折り曲可能な部分とした構成を成している。 Then, the hard wiring unit 2 as a unit, and has a structure in which the exposed so flexible wiring unit 1 'a folding moiety in a strip shape. なお、図3において、4aは表面保護層(カバーレイフィルム層もしくは絶縁保護フィルム層)で接着剤層の一部を残し、これに兼用させることも可能であり、また5は硬質な配線ユニット2,3において、配線パターン1a,1b,2a,3aなどの層間接続を成すスルホール接続部である。 Incidentally, in FIG. 3, 4a leaves a portion of the adhesive layer with the surface protective layer (cover lay film layer or the insulating protective film layer), it is also possible to combined thereto, also 5 hard wiring unit 2 in 3, the wiring patterns 1a, 1b, 2a, 3a is a through hole connecting portion forming an interlayer connection, such as.

【0004】そして、この種のプリント配線板は、一般的に次のようにして製造されている。 [0004] Then, this type of printed wiring board is manufactured generally as follows. 図3は,その実施態様を模式的に示した断面図で、先ず、図4に示すごとく、フレキシブル配線素板1面に、たとえばエポキシ樹脂系などの複数の接着剤層(シート)4,4aを予め配置しておき、折り曲げ可能な配線ユニット1′に対応した領域面に、切り離し用のV溝もしくはスリット2b,3bが設けられ、かつ導電性金属層、たとえば銅箔張りの硬質な積層板2′,3′を位置決め,配置積層した後、加圧,加熱一体化する。 Figure 3 is a cross-sectional view schematically showing the embodiment, first, as shown in FIG. 4, the flexible wiring material plate 1 side, for example, a plurality of adhesive layers, such as epoxy resin (sheet) 4, 4a the advance arranged, in the region surface corresponding to the wiring unit 1 'can be bent, V grooves or slits 2b for disconnection, 3b are provided, and a conductive metal layer, for example, hard laminate copper foil-clad 2 ', 3' positioned after placing laminated, pressurized, heated integrated. ここで、切り離し用のV溝もしくはスリット2b,3bは、硬質な銅張積層板2′,3′の配線ユニット2,3と切離す線に沿って設けられており、 Here, V grooves or slits 2b for disconnection, 3b is rigid copper-clad laminate 2 ', 3' are provided along the wiring unit 2, 3 and disconnect the line,
さらにフレキシブル配線素板1の露出される領域(フレキシブルな配線ユニット1′)に対応する領域では、接着剤層4が一部選択的に除去され、開口・空間部を形成する形に加工されている。 Further in a region corresponding to an area to be exposed of the flexible wiring material plate 1 (flexible wiring unit 1 '), the adhesive layer 4 is selectively removed portions, is processed into a form of forming an opening-space there.

【0005】前記により、フレキシブルな配線素板1面に硬質な銅箔張り積層板2′,3′を一体化した後、最外層の銅箔についてフォトエッチングを施して、所要の配線パターン2a,3a化を行ない、さらに所要のスルホール接続5および外形加工など施す一方、前記硬質な銅張積層板2′,3′の切り離し用のV溝もしくはスリット [0005] By the flexible wiring material plate 1 side in the hard copper-clad laminate 2 ', 3' After integrating, subjected to photoetching for copper foil of the outermost layer, the required wiring patterns 2a, performs 3a of further while applying such the required through-hole connections 5 and trimmed, the hard copper-clad laminate 2 ', 3' V groove or slit for disconnecting the
2b,3bに沿って、非回路形成部(配線ユニット1′に対応した領域)を切り離し・剥離すことによって製造している。 2b, along 3b, it is prepared by (the corresponding area in the wiring unit 1 ') it to disconnect and peeling the non-circuit forming section.

【0006】 [0006]

【発明が解決しようとする課題】しかしながら、前記プリント配線板の製造方法においては、製造工程が煩雑で、量産性やコスト面で問題がある。 [SUMMARY OF THE INVENTION However, in the manufacturing method of the printed wiring board, a complicated manufacturing process, there is a problem in mass productivity and cost. すなわち、硬質な配線ユニット2,3の配線パター2a,3a化やスルホール接続部5の形成工程において、フレキシブル配線素板1 That is, the wiring pattern 2a of the rigid wiring unit 2, in the step of forming the 3a reduction and through-hole connection portion 5, the flexible wiring material plate 1
の折り曲げ可能な配線ユニット1′を成す領域を保護するため、前記のように硬質な銅張積層板2′,3′をカバーとして機能させた後、切り離し除去している。 'To protect the regions forming the said rigid copper clad laminate 2 as' possible wiring unit 1 folded in, after functioning as a cover 3' has been disconnected removed.

【0007】しかし、この非回路形成領域の剥離,除去には、切り離し用のV溝もしくはスリット2b,3b加工が必要で工程が煩雑化する一方、細かな注意や熟練技術などを要するので必然的にコストアップを招来する。 However, separation of the non-circuit forming region, the removal, while the V grooves or slits 2b for disconnection, 3b machining required process is complicated, inevitably it takes a like fine attention or skilled to lead to cost up to. また、前記剥離,除去後において、硬質な配線ユニット2,3が引き千切られる形態を採るため切断面が凹凸化したり、あるいは配線ユニット部2,3の損傷を招来するという問題がある。 Further, the release, after removal, the hard wiring units 2 and 3 has a problem that the cut surface for the form to be torn off is Shorai or texturing, or the damage of the wiring unit section 2,3. すなわち、前記プリント配線基板おいては、コンパクト化などの点から、高い寸法・精度などが要求されているのに対して、硬質な配線ユニット2,3を所要の位置で高精度に、あるいは外観良好に切断・分離し得ない場合がしばしば起こるとともに、ときには配線ユニット2,3の破損などを起こし、信頼性の高いリジッド−フレキシブル型プリント配線板を歩留まりよく製造し得ないという問題がある。 That is, keep the printed wiring board, in view of compactness, whereas such high dimensional-accuracy is required, with high precision hard wiring unit 2, 3 at the required position or appearance, well with the case where cutting and not be separated frequently occurs, sometimes cause such damage to the wiring unit 2, reliable rigid - there is a problem that the flexible type printed wiring board not be good yield. そして、このような問題は、作業性の大幅な低下を招来するばかりでなく、フレキシブルな配線ユニット1′の露出化領域面などの損傷、プリント配線板の品質低下をもたらすという不都合な問題を提起している。 Then, such a problem is not only lead to significant reduction in workability, damages such as the exposed region surface of the flexible wiring unit 1 ', raise inconvenient problem of providing quality degradation of a printed wiring board are doing.

【0008】本発明は上記事情に対処してなされたもので、繁雑な工程や格別な設備など要せずに、高品質なプリント配線板を量産的、かつ歩留まり良好に製造し得る方法の提供を目的とする。 [0008] The present invention has been made to address the above circumstances, without necessity such complicated steps and special equipment, provides a method capable of producing a high quality printed circuit board mass production, and yield good With the goal.

【0009】 [0009]

【課題を解決するための手段】本発明に係るプリント配線板の製造方法は、フレキシブルな配線素板の面に複数層の接着剤を介して導電性金属層を積層配置する工程と、前記積層体を加圧一体化して硬質な配線部を備えた導電性金属層張り積層板を形成する工程と、前記導電性金属層張り積層板の導電性金属層を配線パターニングして硬質な配線ユニットを形成する工程と、前記硬質な配線ユニット間に折り曲げ可能な配線ユニットを形成する工程とを具備して成るプリント配線板の製造方法であって、前記折り曲げ可能な配線ユニット形成部に位置する接着剤層の少なくとも一層を、選択的に除去し開口させておくことを特徴とする。 Means for Solving the Problems A method of manufacturing a printed wiring board according to the present invention includes the steps of stacked conductive metal layer via an adhesive a plurality of layers on the surface of the flexible wiring material plate, the laminated forming a pressure integral with the rigid wiring portion conductive metal layer clad laminate having a body, a rigid wiring unit to wire patterning the conductive metal layer of the conductive metal layer clad laminate forming a manufacturing method of a printed wiring board formed by and forming a possible wiring unit bent between said rigid wiring unit, the adhesive positioned on the wiring unit forming part bendable at least one layer, characterized in that allowed to open selectively removed.

【0010】本発明は、硬質な配線ユニットおよび折り曲げ可能なフレキシブルな配線ユニットが一体化して成るプリント配線板の製造方法において、中間成品である硬質な銅張積層板を用いずに、この硬質な銅張積層板の形成素材を直接用い、かつ折り曲げ可能な配線ユニット形成部の事前,事後の加工工程などの省略を図ったものである。 [0010] The present invention provides a method of manufacturing a printed wiring board comprising integral rigid wiring unit and foldable flexible wiring unit is, without using the hard copper-clad laminate which is an intermediate formed product, this simple rigid with formation material copper clad laminate directly and pre foldable wiring unit forming part, in which tried to omit such post-processing steps. つまり、フレキシブルな配線素板に、硬質な配線部を構成する領域を硬質な配線部を構成しない領域に対して段付けした形に選択的に積層形成し、硬質な配線ユニットを形成した後には、前記硬質な配線部を構成しない領域をそのまま折り曲げ可能な領域を成すフレキシブルな配線ユニットとして機能させる用にしたプリント配線板を得ることを骨子とした製造方法である。 That is, a flexible wiring material plate, the region constituting the rigid wiring portion selectively laminated on stage with the form to a region that does not constitute a rigid wire portion, after the formation of the hard wiring unit a manufacturing method and gist to obtain a printed wiring board for function as a flexible wiring unit constituting the intact foldable area regions not constitute the rigid wiring portion.

【0011】 [0011]

【作用】本発明に係るプリント配線板の製造方法によれば、硬質な配線ユニット間を接続するとともに、折り曲げなどを可能とするフレキシブルな配線ユニット領域は、硬質な配線ユニットを形成する領域面の接着剤層(絶縁体層)に比べて接着剤層(絶縁体層)の厚さを、 According to the manufacturing method of the printed wiring board according to the present invention, along with connecting the rigid wiring unit, a flexible wiring unit area to allow such bending is the region surface to form a rigid wiring unit adhesive layer as compared to the adhesive layer (insulator layer) the thickness of the (insulating layer),
折り曲げなど可能な程度に薄く設定し、銅張積層板を形成して、この銅張積層板の硬質な配線ユニット形成領域の配線パターニング(非回路形成部の銅層は全面的にエッチング除去される)、およびスルホール接続部を形成する。 Thin set to the extent possible, such as bent, to form a copper clad laminate, the copper layer of the wiring pattern (non-circuit forming portions of the rigid wiring unit formation region of the copper-clad laminate is entirely etched ), and forming a through hole connecting portion. つまり、硬質な配線ユニットを形成する銅張積層板を積層一体化する手段を採らないため、前記銅張積層板に対する切り離し用のV溝もしくはスリット加工など省略され、製造工程の簡略化が図られるとともに、選択的な剥離・除去に伴う硬質な配線ユニットの千切り現象などに解消(回避)される。 That is, since no taken a means for integrally laminating a copper-clad laminate to form a rigid wiring unit, it is omitted such as a V-groove or slit for disconnecting to said copper-clad laminate, simplify the manufacturing process can be achieved together they are overcome or avoid such shredded phenomenon of hard wiring unit with the selective stripped and removed. したがって、各配線ユニットなどの損傷発生や、寸法・精度の低下などの問題も確実になくなり、信頼性の高いプリント配線板を歩留まりよく提供し得ることになる。 Therefore, occurrence of damage and the like each wire unit, also eliminates ensures problems such as reduction in size and accuracy, so that a highly reliable printed wiring board can be provided with a high yield.

【0012】 [0012]

【実施例】以下、本発明の実施態様を模式的に示す図1 EXAMPLES The following Figure 1 an embodiment of the present invention is shown schematically
(a)〜 (c)を参照して本発明の実施例を説明する。 (A) With reference ~ to (c) illustrating the embodiment of the present invention.

【0013】先ず、両主面にそれぞれ所要の配線パターン1a,1bが設けられている厚さ 0.025mmのフレキシブルな配線素板1、および厚さ0.05mm程度の絶縁性接着剤シート、たとえば熱可塑性ポリイミド系フィルム4a,4b, [0013] First, a flexible wiring material plate 1 having a thickness of 0.025mm which required wiring patterns 1a respectively on both principal surfaces, 1b are provided, and the thickness of 0.05mm around insulating adhesive sheet, for example, thermoplastic polyimide films 4a, 4b,
4c、および厚さ35μm の通常プリント配線板の製造に用いられている電解銅箔6a,6bをそれぞれ用意した。 4c, and electrolytic copper foil 6a which normally are used in the manufacture of printed wiring board having a thickness of 35 [mu] m, 6b were prepared, respectively.

【0014】次いで、前記フレキシブルな配線素板1、 [0014] Next, the flexible wiring material plate 1,
熱可塑性ポリイミド系フィルム4a,4b,4c、および電解銅箔6a,6bを、図1 (a)に断面的に示すように、フレキシブルな配線素板1の両主面側に、熱可塑性ポリイミド系フィルム4a,4b,4cを介して電解銅箔6a,6bをそれぞれ積層配置した。 Thermoplastic polyimide films 4a, 4b, 4c, and electrolytic copper foil 6a, a 6b, as shown in cross section in FIG. 1 (a), on both main surfaces of the flexible wiring material plate 1, a thermoplastic polyimide film 4a, 4b, and stacked each electrolytic copper foil 6a, 6b of the through 4c. なお、ここで熱可塑性ポリイミド系フィルム4a,4b,4cのうち、熱可塑性ポリイミド系フィルム4b,4cは、その一部を予め平面的に切除して開口させたものである。 Here, the thermoplastic polyimide film 4a, 4b, among 4c, a thermoplastic polyimide film 4b, 4c is obtained is opened in advance planar resected part thereof. つまり、熱可塑性ポリイミド系フィルム That is, the thermoplastic polyimide film
4bはフレキシブルな配線ユニット1′領域面に対応する程度の口径に窓明けされ、また熱可塑性ポリイミド系フィルム4cは、前記熱可塑性ポリイミド系フィルム4bの窓明け領域より大きい口径に窓明けされている。 4b is Apertures in diameter to the extent that corresponding to the flexible wiring unit 1 'region surface, a thermoplastic polyimide film 4c have also been Apertures large diameter than the window drilling region of the thermoplastic polyimide film 4b .

【0015】その後、前記積層体に、加熱・加圧成型処理を施して、図1 (b)に断面的に示すように、フレキシブル配線素板1の両面に、熱可塑性ポリイミド系フィルム4(4a,4b,4c)を介して、電解銅箔6a,6bがそれぞれ積層一体化して成る銅箔張り積層板を得た。 [0015] Then, the laminate is subjected to a heating and press-molding process, as shown in cross section in FIG. 1 (b), on both sides of the flexible wiring material plate 1, a thermoplastic polyimide film 4 (4a , 4b, 4c) through the electrolytic copper foil 6a, 6b was obtained copper foil-clad laminate formed by laminating integrally respectively. 次いで、 Then,
前記銅箔張り積層板の外層銅箔6a,6bについて、所要のフォトエッチング処理を施し、硬質な配線ユニット2, The copper foil-clad laminate of the outer layer copper foils 6a, for 6b, subjected to predetermined photo-etching process, hard wiring unit 2,
3に対応する外層回路2a,3aを形成する。 Corresponding outer circuit 2a to 3, to form a 3a. このとき、同時に非回路形成領域,換言するとフレキシブルな配線ユニット1′領域に対応する外層銅箔6a,6bも、全面的にエッチング除去する。 At the same time the non-circuit forming region, in other words to the outer layer copper foil 6a corresponding to flexible wiring unit 1 'regions, 6b is also entirely removed by etching. さらに、要すれば、前記硬質な配線ユニット2,3領域に、スルホール接続部5を形成することによって、図1 (c)に断面的に示すように、硬質な配線ユニット2,3が折り曲げ可能なフレキシブル配線ユニット1′で接続された印刷配線板が得られた。 Further, if necessary, to the rigid wiring unit 2 region, by forming a through hole connection portion 5, as shown in cross section in FIG. 1 (c), hard wiring unit 2 is foldably connected printing wiring board was obtained in a flexible wiring unit 1 '.

【0016】上記では、絶縁性接着剤層として熱可塑性ポリイミド系フィルムを用いたが、熱可塑性ポリイミド系フィルムの代りに、たとえばポリフェニレンサルファイド系樹脂フイルム、エポキシ系樹脂フィルム、アクリル系樹脂フィルム、ガラス繊維強化ポリイミドプリプレグなどを用いても同様の結果が得られる。 [0016] In the above, using a thermoplastic polyimide film as an insulating adhesive layer, instead of the thermoplastic polyimide film, for example, polyphenylene sulfide-based resin film, an epoxy resin film, acrylic resin film, a glass fiber similar results using a reinforced polyimide prepreg is obtained. また、硬質な配線ユニット2,3は、前記外層回路2a,3aの形成後、 Moreover, hard wiring unit 2 and 3, the outer layer circuit 2a, 3a after the formation of,
この形成面に絶縁性接着剤層および銅箔の積層一体化、 Insulating adhesive layer on the forming surface and the copper foil laminated integration,
その外層銅箔についての配線パターニングを繰り返すことにより多層配線構造とすることも可能である。 It is also possible to employ a multi-layer wiring structure by repeating the wiring pattern on the outer layer copper foil.

【0017】なお、本発明は上記実施例に限定されるものでなく、発明の要旨を逸脱しない範囲でいろいろの変形例を採り得ることは勿論である。 [0017] The present invention is not limited to the above embodiments, it is obvious that can take various modifications without departing from the scope of the invention. たとえば、絶縁性接着剤層の配置は、フィルムもしくはシート類によらず、 For example, the arrangement of the insulating adhesive layer, regardless of the film or sheets,
一般的な塗布法や印刷塗布法などによって行うこともできる。 It can also be carried out by such ordinary coating method or a printing coating method. また、各素材積層配置も、製造するプリント配線板の構成によって、たとえば図2 (a), (b), (c)にそれぞれ示すような、各素材の積層配置が採られる。 Also, the material stacked, the configuration of the printed wiring board to be manufactured, for example, FIG. 2 (a), (b), as shown respectively (c), the laminated arrangement of the material is taken. 図2 Figure 2
(a), (b)は6層型プリント配線板の場合を、また、図2 (c)8層型プリント配線板の場合を示したもので、1 (A), (b) shows the case of a 6-layer printed circuit board, also shows the case of FIG. 2 (c) 8-layer printed circuit board, 1
はフレキシブルな配線素板、2″は両面型の硬質な配線ユニット、4aはカバーレイフィルム層、4b,4cは接着剤層、6a,6bは銅箔、7はポリイミドプリプレグ層である。 The flexible wiring material plate, 2 "double-sided rigid wiring unit, 4a coverlay film layer, 4b, 4c adhesive layer, 6a, 6b copper foil, 7 is a polyimide prepreg layer.

【0018】 [0018]

【発明の効果】以上説明したように本発明に係るプリント配線板の製造方法によれば、予め設定した位置・領域が、折り曲げ可能な領域として機能する信頼性の高いプリント配線板を容易に得ることができる。 According to the manufacturing method of the printed wiring board according to the present invention as described in the foregoing, the position-region set in advance, to easily obtain high printed circuit board reliable functioning as a possible area bent be able to. すなわち、製造工程において折り曲げ可能な領域を形成するために、 That is, to form a bendable region in the manufacturing process,
硬質な積層部を選択的に剥離・除去したりする作業,手段が省略されるので、機械的な引っ張りや切り剥がしなどに起因する各配線ユニットにおける回路構成の破損など回避され、精度や信頼性の高いプリント配線板を歩留まりよく、かつ低コストで製造し得る。 Work or to selectively stripped and removed a hard multilayer portion, since means is omitted, is avoided, such as breakage of the circuit configuration in each of the wiring units due to such mechanical tensile and tear-off tab, the accuracy and reliability yield high printed circuit board well and can be manufactured at low cost. そして、前記折り曲げ可能性に伴う回路機構のコンパクト化などを、容易に達成し得ることと相俟って実用上多くの利点をもたらすものといえる。 Then, it can be said that the results in practical number of advantages I that coupled with the compactness and the like, may readily be accomplished in circuitry associated with said folding possibilities.

【図面の簡単な説明】 BRIEF DESCRIPTION OF THE DRAWINGS

【図1】本発明に係る製造方法の実施態様を模式的に示したもので、 (a)は各素材を積層配置した状態を示す断面図、 (b)は積層一体化して銅張り積層板とした状態を示す断面図、 (c)は製造されプリント配線板の要部構造例を示す断面図。 [1] The embodiment of the production method according to the present invention an illustration schematically, (a) shows the cross-sectional view showing a state in which stacked each material, (b) copper-clad laminate by laminating integrally the section showing a state a view, cross-sectional view showing an essential part structure of (c) is manufactured printed wiring board.

【図2】本発明に係る製造方法の他の実施態様において、各素材を積層配置した状態を模式的に示したもので、 (a), (b)は6層型プリント配線板の場合を、 (c) In another embodiment of the manufacturing method according to the present invention, FIG, the state in which stacked each material an illustration schematically, the case of (a), (b) is 6-layer printed circuit board , (c)
は8層型プリント配線板の場合をそれぞれ示す断面図。 Sectional view showing a case of 8-layer printed wiring board, respectively.

【図3】従来のプリント配線板の要部構造例を示す断面図。 3 is a cross-sectional view showing the essential structure of a conventional printed wiring board.

【図4】従来の製造方法の実施態様で各素材を積層配置した状態を示す断面図。 4 is a cross-sectional view showing a state in which stacked each material in embodiments of the conventional manufacturing method.

【符号の説明】 DESCRIPTION OF SYMBOLS

1……フレキシブルな配線素板 1′……フレキシブルな配線ユニット 1a,1b,2a,3a……配線パターン 2,3……硬質な配線ユニット 2′,3′……銅張り積層板 2″……両面型硬質な配線ユニット 2b,3b……切り離し用のスリットもしくは溝 4 1 ... Flexible wiring material plate 1 '... flexible wiring unit 1a, 1b, 2a, 3a ... wiring patterns 2, 3 ... hard wiring unit 2', 3 '... copper-clad laminate 2 "... ... double-sided rigid wiring unit 2b, 3b ...... slits or grooves 4 for disconnecting
(4b,4c)……接着剤層 4a……カバーレイフィルム 5……スルホール接続部 6a,6b……銅箔 7……ポリイミドプリプレグ (4b, 4c) ...... adhesive layer 4a ...... coverlay film 5 ...... through hole connecting portions 6a, 6b ...... foil 7 ...... polyimide prepreg

Claims (1)

    【特許請求の範囲】 [The claims]
  1. 【請求項1】 フレキシブルな配線素板の面に複数層の絶縁性接着剤を介して導電性金属層を積層配置する工程と、 前記積層体を加圧一体化して硬質な配線部を備えた導電性金属層張り積層板を形成する工程と、 前記導電性金属層張り積層板の導電性金属層を配線パターニングして硬質な配線ユニットを形成する工程と、 前記硬質な配線ユニット間に折り曲げ可能な配線ユニットを形成する工程とを具備して成るプリント配線板の製造方法であって、 前記折り曲げ可能な配線ユニット形成部に位置する絶縁性接着剤層の少なくとも一層を、選択的に除去し開口させておくことを特徴とするプリント配線板の製造方法。 And 1. A process for stacked conductive metal layer through an insulating adhesive multiple layers on the surface of the flexible wiring element plate, with a rigid wire portion the laminate by pressure integrated forming a conductive metal layer clad laminate, and forming a rigid interconnection unit the conductive metal layer of the conductive metal layer clad laminate and the wiring pattern, foldable between the rigid wiring unit a Do wiring unit manufacturing method of a printed wiring board formed by and forming a at least a layer of insulating adhesive layer positioned on the wiring unit forming part bendable, selectively removed to open method for manufacturing a printed wiring board, characterized in that allowed to.
JP27762494A 1994-11-11 1994-11-11 Method for manufacturing a printed wiring board Expired - Fee Related JP3540396B2 (en)

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WO2004066697A1 (en) * 2003-01-20 2004-08-05 Fujikura Ltd. Multilayer printed wiring board and process for producing the same
JP2005244024A (en) * 2004-02-27 2005-09-08 Victor Co Of Japan Ltd Flex rigid wiring board and its manufacturing method
JP2006186178A (en) * 2004-12-28 2006-07-13 Elna Co Ltd Method for manufacturing rigid flexible printed circuit board
JP2006310541A (en) * 2005-04-28 2006-11-09 Ngk Spark Plug Co Ltd Multilayer wiring board and its production process, multilayer wiring board structure and its production process
JP2008235595A (en) * 2007-03-20 2008-10-02 Sumitomo Electric Printed Circuit Inc Multilayer printed wiring board
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US7786389B2 (en) * 2004-09-21 2010-08-31 Ibiden Co., Ltd. Flexible printed wiring board
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WO2012147484A1 (en) * 2011-04-26 2012-11-01 株式会社村田製作所 Rigid-flexible substrate and method for manufacturing same
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US7886438B2 (en) 2003-01-20 2011-02-15 Fujikura Ltd. Process for producing multilayer printed wiring board
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JP2005244024A (en) * 2004-02-27 2005-09-08 Victor Co Of Japan Ltd Flex rigid wiring board and its manufacturing method
US7786389B2 (en) * 2004-09-21 2010-08-31 Ibiden Co., Ltd. Flexible printed wiring board
JP4633457B2 (en) * 2004-12-28 2011-02-23 エルナー株式会社 Method for manufacturing a rigid flexible printed wiring board
JP2006186178A (en) * 2004-12-28 2006-07-13 Elna Co Ltd Method for manufacturing rigid flexible printed circuit board
JP4718889B2 (en) * 2005-04-28 2011-07-06 日本特殊陶業株式会社 Multi-layer wiring board and a manufacturing method thereof, the multilayer wiring substrate structure and a manufacturing method thereof
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JP2008235595A (en) * 2007-03-20 2008-10-02 Sumitomo Electric Printed Circuit Inc Multilayer printed wiring board
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US8493747B2 (en) 2010-02-05 2013-07-23 Ibiden Co., Ltd. Flex-rigid wiring board and method for manufacturing the same
WO2012147484A1 (en) * 2011-04-26 2012-11-01 株式会社村田製作所 Rigid-flexible substrate and method for manufacturing same
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US20140034366A1 (en) * 2011-04-26 2014-02-06 Murata Manufacturing Co., Ltd. Rigid-flexible substrate and method for manufacturing the same
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