JP2006253615A - Pattern shaped-body, method of manufacturing wiring, and wiring board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a pattern shaped-body capable of further miniaturization of wiring, and to provide a method of manufacturing the wiring and a wiring board. <P>SOLUTION: A pattern having an opening size of 20 μm is formed on a mold, and then, an ink containing silver nano-particles is supplied to the entire pattern. In this case, a coating layer 3 made of silver nano-particles is formed on the opening, and further, the silver nano-particles are fused. The mold is dipped into a copper pyrophosphoric acid solution, and copper plating is executed so that the film thickness is 3 μm. After that, an enclosure is provided using a frame material 5, a molding resin 6 for transfer is injected in a molten state, molding is performed and the mold is released after temporary curing, and a molded body having a transferred wiring 4 is cured to form the wiring. According to this procedure, a pattern-like insulating material is disposed on the substrate material, an exposed area of the substrate material surface is made smaller than an area of the opening on the surface of the insulating material, and the shape of a cross section is made to be a mound shape. Thus, since a force of exfoliating the molded body from the mold is decreased against an adhesion force to a substrate, the wiring can be satisfactorily transferred. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a pattern shape body, a wiring manufacturing method, and a wiring board, and more particularly to a pattern shape body, a wiring manufacturing method, and a wiring board that are applied as electronic component mounting, pattern formation technology, or pattern forming technology.

Conventionally, a pattern shape body is applied and used for substrate formation, for example. More specific application examples are listed below.
According to one thick film wiring forming method, a thick film wiring having a clean pattern shape with no soiling can be formed on the substrate (see Patent Document 1). In addition, another transfer medium manufacturing method provides a conductor wiring board, a transfer medium for transferring a conductor wiring having a good yield to an insulating substrate of the conductor wiring board, and a method for easily manufacturing these (patents). Reference 2). Furthermore, the printed wiring board can be easily created and the adhesive strength after transfer can be sufficiently maintained (Patent Document 3).
JP 2004-186556 A Japanese Patent No. 3431556 Japanese Patent Laid-Open No. 04-97249

However, with the miniaturization and high performance of wiring boards, higher miniaturization of wiring patterns is required. As a result, when the wiring board is formed by a transfer method, the releasability from the mold becomes important.
In Patent Document 1 listed above as a prior art example, a first step of embedding a conductive paste P in a pattern groove of an intaglio plate having a pattern groove corresponding to a desired thick film wiring pattern formed on the surface, and embedding in the pattern groove A second step of drying or curing the conductive paste P to a peelable hardness from the intaglio, and transferring the dried or hardened conductive paste P from the intaglio to an adhesive intermediate on the transfer surface And the fourth step of reducing the adhesiveness of the transfer surface of the intermediate, and the fifth step of retransferring the conductive paste P transferred to the intermediate to the substrate. ing. However, according to this method, it is necessary to dry the conductive paste, and the shape collapses at the time of transfer.

  Further, in Patent Document 2, the surface of the aluminum substrate for transfer medium is selectively exposed by a photoresist technique using a photosensitive resin, and the growth direction of the metal agglomerates is changed from the surface of the substrate by gloss plating on the exposed substrate surface. An almost parallel metal layer is formed, and a metal layer in which the growth direction of the metal agglomerates is almost perpendicular to the surface of the substrate is formed by matte plating, and the resulting transfer medium is insulated with an adhesive on the surface. This is achieved by pressure bonding to the substrate, transferring and embedding a metal layer serving as a conductor wiring on the surface of the insulating substrate, and chemically etching away the substrate of the transfer medium to obtain a wiring substrate. However, this method has a limitation in miniaturization because a larger surface roughness is required as the wiring width becomes smaller.

  Moreover, in patent document 3, a peeling layer consists of a hot-melt substance, and shall contain 1 or more types among waxes, resin, and unvulcanized rubber. The conductive layer is transferred onto the substrate by heat, and a material having a specific resistance of 0.1 Ω / cm or less is used. When this specific resistance is increased, the function as a wiring is reduced. Further, the adhesive layer is formed of a heat resistant resin that is cured by heat. As a result, the adhesive force between the conductive layer and the substrate is sufficiently exerted during thermal transfer printing, and the printed wiring board can be easily created to solve the problem. However, this method has a problem in that it is difficult to miniaturize the wiring because pattern displacement due to the adhesive layer and wiring pattern deformation due to hardening shrinkage of the adhesive layer occur during transfer.

  An object of the present invention is to provide a pattern shape body, a wiring manufacturing method, and a wiring board that can improve or eliminate the above-described conventional problems and enable higher wiring miniaturization.

  In the present invention, a fine wiring board can be formed at low cost by providing a mold capable of repeatedly supplying wiring. For this purpose, it is important to reduce the adhesion between the wiring and the mold, and the area where the wiring is in contact with the mold is made smaller than the area where the wiring is in contact with the substrate. This makes it possible to transfer the wiring satisfactorily.

  In the patterned body of the invention described in claim 1, a patterned insulating material is disposed on a base material, and the exposed area on the base material surface side is made smaller than the area of the opening on the surface of the insulating material. The cross-sectional shape is a mountain shape.

  The invention according to claim 2 is characterized in that, in the pattern shape body according to claim 1, a coating layer is formed on the surface of the substrate.

  The invention according to claim 3 is the pattern shape body according to claim 2, wherein the coating layer is composed of a conductive material and an insulating material.

  The invention according to claim 4 is the pattern-shaped body according to any one of claims 1 to 3, wherein the substrate has conductivity.

  The invention according to claim 5 is characterized in that, in the pattern shape body according to any one of claims 1 to 4, the opening on the substrate has hydrophilicity.

  The invention described in claim 6 is characterized in that, in the pattern shape body according to any one of claims 1 to 5, the insulating material has hydrophobicity.

  The invention described in claim 7 is characterized in that, in the pattern-shaped body according to any one of claims 1 to 6, the opening is configured in a tapered shape.

  According to an eighth aspect of the present invention, in the pattern-shaped body according to any one of the first to seventh aspects, the wiring is arranged in the opening, and the thickness of the wiring is smaller than the thickness of the insulating material. And

  The invention described in claim 9 is characterized in that, in the pattern-shaped body according to any one of claims 1 to 8, the wiring is constituted by electrolytic plating.

  The invention described in claim 10 is characterized in that, in the pattern-shaped body according to any one of claims 1 to 8, the wiring is configured by electroless plating.

  A wiring manufacturing method according to an eleventh aspect of the present invention provides a step of forming a pattern-shaped mold on a predetermined substrate, a step of supplying a conductive material into the mold, and a predetermined amount of the conductive material formed in the mold. And transferring to the insulating material.

  The invention according to claim 12 is the wiring manufacturing method according to claim 11, wherein the mold is a molding mold including a wiring forming mold, and an insulating material having fluidity is supplied into the mold, and the supply The insulating material is cured and released.

  In the wiring board according to the thirteenth aspect, a pattern-shaped mold is formed on a predetermined base material, a conductive material is supplied into the mold, and the conductive material formed in the mold becomes a predetermined insulating material. The mold is a molding mold including a wiring forming mold, and a wiring is formed by supplying a fluid insulating material into the mold and curing and releasing the supplied insulating material. It is characterized by that.

  A fourteenth aspect of the present invention is the wiring board according to the thirteenth aspect, wherein functional components are included in the wiring board.

  According to the present invention, a finer wiring board can be obtained.

  Next, with reference to the accompanying drawings, embodiments of a pattern shape body, a wiring manufacturing method, and a wiring board according to the present invention will be described in detail. 1 to 4 show an embodiment of a pattern shape body, a wiring manufacturing method, and a wiring board according to the present invention.

(Embodiment 1)
FIG. 1 includes processing diagrams of (1) mold formation, (2) film layer formation, (3) wiring formation, (4) resin injection, and (5) mold release. In FIG. 1, a resist (AZ4620 manufactured by Clariant) 2 was applied on a mold A1 made of nickel that was made hydrophilic by plasma treatment to obtain a film having a resist thickness of 5 μm. Thereafter, the film was exposed and developed with a photomask having a line having a width of 20 μm, and then cured in an oven at 110 ° C. for 30 minutes. As a result, a pattern having an opening diameter of 20 μm width could be formed on the mold A1.

  After the openings were formed, silver nanoparticle-containing ink (manufactured by Nippon Paint; Finesphere SVW102) was supplied to the entire pattern. At this time, since only the nickel surface was wetted well, the coating layer 3 made of silver nanoparticles could be formed in the opening. Furthermore, it heated at 200 degreeC for 30 minutes, and fused the silver nanoparticle.

  Thus, by providing the transfer die with the coating layer, the contact area between the die and the wiring can be reduced. Here, the coating layer defines a layer having a cavity in the film. By providing this cavity, the effective contact area between the wiring and the mold can be reduced, so that the transferability is excellent. . Further, even when a wiring material is present in the cavity, it can be peeled off at the coating layer interface during transfer, and can be easily transferred. In this case, sufficient adhesion to the mold of the coating layer is necessary. Moreover, if the film layer is a material having excellent releasability, transferability is particularly good.

As an electrolytic copper plating method, the mold A1 was dipped in a copper pyrophosphate plating solution (PY-61, manufactured by Uemura Kogyo Co., Ltd.), and copper plating was performed so that the film thickness was 3 μm.
Thereafter, an enclosure was provided by the mold B5, and a molding resin for transfer (G770-L, manufactured by Sumitomo Bakelite Co., Ltd.) 6 was poured in a molten state at 120 ° C. to perform molding. Molding was performed after temporary curing at 200 ° C. for 5 minutes, and the molded body onto which the wiring 4 was transferred was cured in an oven at 200 ° C. for 1 hour, and a favorable wiring could be formed.

  Further, when the mold A1 itself has conductivity, the wiring can be easily formed by electrolytic plating. In addition, since the transferability of the wiring is excellent, the wiring can be repeatedly used, and the wiring can be formed at low cost.

  Further, by using a hydrophilic material for the opening of the mold A1, the material can be supplied to the selective wiring portion. For example, when supplying the electroless plating catalyst, the catalyst can be selectively supplied to the hydrophilic portion even if the catalyst is supplied to the entire surface, so that the wiring can be easily formed.

  In the present embodiment, the copper wiring 4 is formed up to 3 μm from the apex, and by forming a coating layer on the mold A1, the adhesion of the plated and grown wiring to the mold A1 is reduced. For this reason, the wiring 4 was able to adhere | attach favorably. In this embodiment, the method for forming the coating layer 3 is performed by fusing nanoparticles. However, the dryness of the wiring 4 is also excellent in a dry state. In this case, the silver nanoparticles are formed on the wiring. It will be transferred in a state that contains.

  In this embodiment, in order to transfer the fine wiring onto the substrate, it is necessary to weaken the adhesion between the wiring and the transfer mold. However, the area of the wiring arranged in the opening is smaller than the area of the wiring itself. By doing so, it is possible to reduce the peeling force from the mold with respect to the adhesion force to the substrate at the time of transfer, and it is possible to transfer well.

  Furthermore, fine wiring can be formed by forming the wiring in the depression with a concave pattern in cross section as a plate structure. At this time, by reducing the thickness of the wiring compared to the thickness of the insulating material, the distance between adjacent patterns can be reduced and miniaturization is possible.

By the way, in this embodiment, although the manufacturing method using the thermosetting resin 6 is shown, as a material, it is not limited to this. For example, when implemented by injection molding, many thermoplastic resins are used, and this embodiment can be similarly formed. In particular, when heat resistance is required as in electronic parts, thermoplastic resin is also required to have high heat resistance. For this reason, it is necessary to set the molding temperature high, and although it is difficult in handling, there is an advantage that the curing time of the resin can be shortened.
Also, as the insulating material in the present embodiment, a resist material is used for simplicity, but other insulating materials can be applied. By using a more hydrophobic material for the insulating material, a structure with excellent mold release can be obtained. For example, it is composed of a polyimide resin, and after a resist material is applied on the film and the resist portion is photo-developed, the polyimide resin is formed into a pattern with an etchant, and then the resist is removed. . Thus, even for a wide range of insulating materials, it is effective as a mold forming method shown in the present embodiment, and is useful as a means for forming a pattern shape body.

  Further, since a difference in wettability with the hydrophilic region occurs, a selective solvent can be supplied, and a catalyst or the like can be supplied easily.

  As described above, according to the present embodiment, a fine pattern can be formed on a desired substrate. For this reason, the applicable range of a wiring board is wide. Further, when the wiring manufacturing method is formed by an additive method such as plating, unnecessary materials are not discharged. Therefore, it can be said that this is a manufacturing method with excellent material use efficiency.

  Furthermore, as a method for repetitive transfer, a wiring substrate excellent in mass productivity can be formed by supplying a fluid resin into a mold and transferring wiring when the resin is cured. Specific examples include injection molding and transfer molding. In particular, it is convenient as a method of manufacturing a wiring board with curved surfaces or multiple surfaces, and can be developed to a MID (molded interconnection device) or the like.

(Embodiment 2)
FIG. 2 includes processing diagrams of (1) mold formation, (2) mixed layer formation, (3) wiring formation, (4) resin injection, and (5) mold release.
As a mold, a nickel mold to which a patterned resist similar to that in Embodiment 1 was added was used. The feature point of the second embodiment is that the coating layer 3 is composed of an insulating portion 3a and a conductive portion 3b as shown in (2) mixed layer formation in FIG. Thereafter, a mixed solution of a silicone resin (Eporize SS-96 manufactured by Nippon Pernox Co., Ltd.) and a silver nanoparticle-containing ethanol solvent (SVE102 manufactured by Nippon Paint) was supplied to the entire mold surface. Thereafter, the mixed solution partially adhered to the resist portion was removed by wiping. In order to solidify the mixed layer, the mold was heated at 200 ° C. for 30 minutes. After that, after forming a wiring having a thickness of about 1 μm with copper electroless plating (Okuno Pharmaceutical Co., Ltd. TSP kappa), the wiring structure can be obtained in the same manner by molding and transferring in the same manner as in the first embodiment. It was.

  Thus, when the coating layer is composed of a mixed layer of a conductive material and an insulating material, since there is a conductive material, wiring formability by electrolytic plating becomes possible. In this case, since the insulating material is included, the interface is in a state of being easily released, which is particularly effective when the insulating material has releasability.

  Moreover, wiring can be easily formed by using an electroless plating catalyst as the conductive material. In this case, as shown in Embodiment 1, a method of supplying only to the hydrophilic portion can be similarly achieved.

(Embodiment 3)
The manufacturing procedure shown in FIG. 3 includes (1) resist exposure and development, (2) insulating film etching, (3) resist removal, (4) wiring formation, (5) resin coating, and (6) resin injection. Is done. On the mold A1 made of nickel, a polyimide solution was applied to a thickness of 5 μm and temporarily cured. After the temporary curing, a positive resist (OFPR-5000 manufactured by Tokyo Ohka Kogyo Co., Ltd.) was applied to obtain a film 7 having a resist thickness of 0.5 μm. Thereafter, the film was exposed and exposed with a photomask having a line having a width of 20 μm and developed, and then the polyimide film was etched into a pattern with a polyimide etching solution. Thereafter, the resist film was removed with acetone and then cured in an oven at 200 ° C. for 60 minutes. At that time, the formed opening has a tapered shape 7a. Thereafter, a copper wiring 4 having a thickness of 3 μm was formed by electrolytic plating as in the first embodiment. Next, an ultraviolet curable resin (SD2200 manufactured by Dainippon Ink & Chemicals, Inc.) 8 was applied as a first resin so as to cover the entire surface of the pattern with a dispenser. After supply, it was cured with a low-pressure mercury lamp. Next, as a resin molding method for the entire substrate, as in the first embodiment, a molding resin for transfer (G770-L manufactured by Sumitomo Bakelite Co., Ltd.) is used as the second resin in a state of surrounding the mold at 120 ° C. Was injected in a molten state and molded and released to form a wiring structure.

  Thus, the mold opening is small relative to the contact surface of the wiring during transfer. For this reason, it is excellent in releasability. Moreover, the resistance at the time of mold release on the side surface can be suppressed by using a tapered shape. As a result, the mold has excellent transferability.

By the way, in this Embodiment 3, although the example using an ultraviolet curable resin is shown, the point which can be hardened in a short time is an advantage, and it is effective for process tact shortening. In addition, when a thermoplastic resin is used as the resin material, there are cases where there is a problem in the adhesion with the wiring depending on the material to be selected. Adaptation to the case of forming the second resin with a thermoplastic resin in the obtained state is also possible. By selecting a different resin material, it is possible to easily remove the wiring pattern at the time of recycling and repair.
That is, a resin material having excellent adhesion and releasability can be selected by properly using a plurality of types of resins. As the resin material that comes into contact with the wiring, a resin having high adhesion is selected, and as the resin material that comes into contact with the mold, a material having excellent releasability is desirable. In addition, in order to increase the accuracy of shape dimensions, etc., a resin with a low shrinkage stress is selected as the resin in the vicinity of the wiring, such as a thermosetting resin, and a thermoplastic resin is used as the base material of the substrate, thereby producing a highly productive method It is also possible to select as

  Moreover, although the example which used the polyimide is shown in this embodiment, what is necessary is just an insulating material as a material. Moreover, although the method using a resist was shown as a manufacturing method, it is not limited to this manufacturing method example. For example, after a metal mask is adhered to an insulating material instead of a resist and etched into a pattern with an etchant, It can also be carried out by removing the metal mask, and is considered effective when a relatively rough pattern is formed in a large area.

(Embodiment 4)
FIG. 4 includes processing diagrams of (1) mold formation, (2) wiring formation, (3) component mounting, (4) resin injection, and (5) mold release. In FIG. 4, in the fourth embodiment, wiring is formed on the mold 1 as in the first embodiment. Thereafter, the epoxy conductive adhesive 9 is supplied to the connection terminal portion by dispensing, and then connected to the wiring pattern on the mold via the conductive adhesive 9 to the semiconductor chip, at 150 ° C. for 1 hour. The adhesive was cured. Thereafter, the resin substrate and the mold release were performed in the same manner as in the first embodiment, thereby forming the wiring substrate having the semiconductor chip 10 therein.

  As described above, as a method aiming at miniaturization, a method of incorporating components into the wiring board is also conceivable. In such a state, the resin can be injected and cured to achieve a more efficient miniaturization.

  In the fourth embodiment, the connection material is supplied by dispensing, but other methods can be used by supplying solder onto the wiring or functional component by plating.

It is a figure which shows the example of a procedure of the wiring board manufacturing method corresponding to the pattern shape body, wiring manufacturing method, and wiring board of this invention. It is a figure which shows an example of the manufacturing method corresponding to Embodiment 2 of the wiring structure of this invention. It is a figure which shows an example of the manufacturing method corresponding to Embodiment 3 of the wiring structure of this invention. It is a figure which shows an example of the manufacturing method corresponding to Embodiment 4 of the wiring structure of this invention.

Explanation of symbols

1 Mold A
2 resist 3 coating layer 4 wiring 5 type B
6 (Molding for transfer) Resin 7 Insulating film 7a Taper (Tapered component of insulating film)
8 UV curable resin 9 (Epoxy) conductive adhesive 10 Semiconductor chip

Claims (14)

  A patterned insulating material is arranged on the base material, the exposed area on the base material surface side is made smaller than the area of the opening on the surface of the insulating material, and the cross-sectional shape of the insulating material is a chevron shape Pattern shape body characterized by.   The pattern shape body according to claim 1, wherein a film layer is further formed on the surface of the base material.   The pattern shape body according to claim 2, wherein the coating layer is composed of a conductive material and an insulating material.   The pattern shaped body according to claim 1, wherein the base material has conductivity.   The pattern shaped body according to any one of claims 1 to 4, wherein the opening on the substrate has hydrophilicity.   The pattern shape body according to claim 1, wherein the insulating material has hydrophobicity.   The pattern shape body according to any one of claims 1 to 6, wherein the opening is configured in a tapered shape.   The pattern shape body according to claim 1, wherein a wiring is disposed in the opening, and a thickness of the wiring is smaller than a thickness of the insulating material.   The pattern shape body according to claim 1, wherein the wiring is formed by electrolytic plating.   The pattern shape body according to any one of claims 1 to 8, wherein the wiring is configured by electroless plating. Forming a pattern mold on a predetermined substrate;
Supplying a conductive material into the mold;
And a step of transferring the conductive material formed in the mold onto a predetermined insulating material.   The mold is a molding mold including a wiring forming mold, and a wiring is formed by supplying a fluid insulating material into the mold and curing and releasing the supplied insulating material. The wiring manufacturing method according to claim 11. A pattern mold is formed on a predetermined substrate, a conductive material is supplied into the mold, and the conductive material formed in the mold is transferred to a predetermined insulating material,
The mold is a molding mold including a wiring forming mold, and a wiring is formed by supplying a fluid insulating material into the mold and curing and releasing the supplied insulating material. Wiring board.   The wiring board according to claim 13, wherein a functional component is included in the wiring board.

Images