JP2002217248A - Transfer plate for pattern formation and method of manufacturing substrate for semiconductor device using it - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a transfer plate for pattern formation that can improve the shape and alignment accuracy of the wiring pattern or the pattern of bumps, etc., of a substrate for semiconductor device at the time of forming the pattern, and to provide a method of manufacturing the substrate for semiconductor device using the plate. SOLUTION: The transfer plate 100 for pattern formation has a projecting pattern 21 formed on a base 11 and the upper surface of the pattern 21 is recessed. The pattern 21 is formed on the base 11 by using such an elastic material as silicone rubber, etc. A pattern forming material layer 51 is formed by supplying a pattern forming material to the recessed sections of the pattern 21 of the plate 100. The substrate for semiconductor device having a transferred pattern (bumps, etc.), 51a formed on a wiring board is obtained by pressing the projecting pattern 21 of the transfer plate 100 against a substrate 61 to be transferred composed of the wiring board and removing the plate 100 from the substrate 61 after applying a pressure to the plate 100.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a transfer plate for forming a pattern of a semiconductor device substrate on which a semiconductor chip or the like is mounted, and a method of manufacturing a semiconductor device substrate using the same. And a method for manufacturing a substrate for a semiconductor device using the same.

[0002]

2. Description of the Related Art Semiconductor device substrates for mounting semiconductor chips and the like include televisions, mobile phones, game machines, radios,
Consumer electronic devices such as audio equipment and VTRs, electronic computers,
It is widely used for industrial electronic equipment such as OA equipment, electronic applied equipment, electric measuring instruments, and communication equipment. In recent years, in particular, there has been an increasing demand for more compact electronic equipment. To meet these demands, electronic equipment is designed for miniaturization, high density, and high performance. Based on this, the wiring pattern of semiconductor devices used and the diameter of via holes are reduced. The diameter of land, pads, pads, and the like, the flexibility of the base material, the increase in the number of layers, and the increase in definition have been rapidly advancing.

[0003] Epoxy resins, phenolic resins, and acrylic resins have conventionally been used as insulating base materials for these semiconductor device substrates, but recently, polyimide films, polyester films, and the like having excellent mechanical strength and heat resistance have been used. A substrate for a semiconductor device such as a film carrier using a base material such as a fluorine-based resin, polyphenylene oxide, polysulfone, and polyetherimide is being developed with the aim of further improving the performance. Taking a film carrier as an example, sprocket holes for film transport and positioning are formed at both ends of an insulating film, and the sprocket holes are used as guides to form conductor layers, wiring patterns, electrodes, pads, and the like. In that case, a copper foil is stuck on a film, a resist pattern is formed on a conductor layer formed by plating or the like, and the conductor layer is etched using the resist pattern as a mask to form a wiring pattern, an electrode, a pad, and the like. Has formed.

[0004] Depending on the form of bonding between the semiconductor device substrate and elements such as semiconductor chips, bonding bumps may be formed on the semiconductor device substrate. As a method of forming the bump, there are a screen printing method in which only the necessary bump shape is formed by screen printing, and a method in which the conductive layer of the bump forming portion is exposed, the other portion is covered with a resin resist, and the bump is formed by plating. A plating method of depositing and forming a material is used.

[0005]

In these bump forming methods, the reference for alignment in the bump forming step is often a sprocket hole formed for transporting the film carrier. The shape of the sprocket hole changes during several times of transfer, and the positioning accuracy at the time of bump formation may be deteriorated.Therefore, there is a problem in alignment of a film carrier for high definition and high density. Become.

Further, when bumps are formed by using a screen printing method, the screen plate is elongated due to repeated pattern printing in a manufacturing process, and it is difficult to stably form a desired pattern. . On the other hand, in the bump formation by a plating method using a resin resist, after a bump material is deposited by plating, the resin resist is peeled to obtain a desired bump shape. However, depending on the specification of the bump shape, the bump height is several tens μm. Therefore, the plating time required to form a plating film thickness for the desired bump height may require a considerable amount of time depending on conditions and the like. It is necessary to improve the conditions.

SUMMARY OF THE INVENTION The present invention has been devised in view of the above-mentioned problems, and has been devised in order to form a wiring pattern or a bump on a semiconductor device substrate. It is an object of the present invention to provide a method for manufacturing a semiconductor device substrate.

[0008]

In order to solve the above-mentioned problems in the present invention, first, in claim 1, a transfer plate used for forming a pattern of a substrate for a semiconductor device has a desired pattern shape on a support. The transfer plate for pattern formation is characterized in that a convex pattern having the following pattern is provided, and the upper surface of the convex pattern is concave.

According to a second aspect of the present invention, there is provided the transfer plate for pattern formation, wherein at least an upper portion of the convex pattern of the transfer plate for pattern formation according to the first aspect is formed of an elastic material. Things.

According to a third aspect of the present invention, a pattern forming material is provided on the convex pattern of the pattern forming transfer plate by using the pattern forming transfer plate according to the first or second aspect. And forming a pattern by transferring a forming material to a transfer-receiving substrate.

[0011]

Embodiments of the present invention will be described below. The pattern-forming transfer plate according to claim 1, wherein a convex pattern having a desired pattern shape is provided on a support, and an upper surface of the convex pattern is concave. A predetermined amount of the pattern forming material can be held on the convex pattern of the transfer plate, and only the desired pattern shape can be easily transferred. Further, since the convex pattern provided on the support is limited to a portion necessary for pattern formation, the amount of the pattern forming material used can be suppressed to a necessary minimum amount.

FIG. 1 is a schematic sectional view showing one embodiment of a transfer plate for pattern formation of the present invention, and FIG. 2 is a schematic sectional view showing another embodiment of a transfer plate for pattern formation of the present invention. FIGS. 3A and 3B are schematic cross-sectional views showing an embodiment of the concave shape at the tip of the convex pattern of the transfer plate for pattern formation of the present invention. In the transfer plate for pattern formation of the present invention, as shown in FIG. 1, a convex pattern 21 is formed on a support 11, and the upper surface of the convex pattern 21 has a concave shape. Convex pattern 21
Is formed of an elastic material on the support 11, and the height of the convex pattern can be appropriately set according to the hardness and elasticity of the elastic material, but is preferably 50 μm or more. The elastic material is preferably an elastic body, particularly preferably urethane rubber or silicon rubber. Support 1
As 1, metal, plastic and the like can be used.

As another embodiment of the transfer plate for pattern formation of the present invention, there is a transfer plate for pattern formation 200, and as shown in FIG. It has a two-stage structure composed of a convex pattern 21 made of an elastic material. The convex pattern 12 is formed by, for example, processing the support 11 into a convex shape, or forming the support 11 on the support 11 by, for example, plating. The processed material is processed into a convex shape or the like. Such 2
The step-shaped convex pattern 30 can minimize the deformation of the convex pattern 21 made of an elastic material,
Pattern transfer with excellent positional accuracy can be performed.

As shown in FIG. 3A, the shape of the convex pattern of the transfer plate for pattern formation is such that the convex pattern rises almost at right angles from the support 11 to form the convex pattern.
As shown in FIG. 3B, the convex pattern is classified into a tapered shape. When the convex pattern is tapered, the convex pattern is less likely to be deformed when the pattern forming material is supplied and the pattern forming material is pressed and transferred to the substrate to be transferred, which is suitable for forming a fine pattern. Further, as shown in FIGS. 3A and 3B, there are various shapes of the concave portion at the tip of the convex pattern, and the type of the pattern forming material, the film thickness of the pattern forming material, the pattern shape to be transferred. It can be appropriately selected and set according to the above.

Hereinafter, a method for producing a transfer plate for pattern formation will be described. FIGS. 4A to 4E show an example of a method for producing a transfer plate for pattern formation. First, a photosensitive layer is formed on a glass substrate 41 using a black colored photosensitive resin, and patterning is performed to form a black pattern 13 (FIG. 4).
(A)). Here, the black pattern 13 serves as a mold for forming a concave portion at the tip of the convex pattern, and also functions as a light-shielding pattern of an exposure mask. Next, the glass substrate 41
Then, a photosensitive resin layer 14 having a predetermined thickness is formed on the black pattern 13 using a dry film (see FIG. 4B).

Next, the photosensitive resin layer 14 is exposed from the glass substrate 41 side, and a series of patterning processes such as development are performed to form a resin pattern 14a having an opening 15 on the glass substrate 41 (FIG. 1). 4 (c)). The opening 15 and the resin pattern 14a serve as a frame when a transfer plate for pattern formation is manufactured. Next, a curable silicone rubber is poured into the opening 15, a support 11 made of a stainless steel plate or the like is overlaid, and the silicon rubber is cured by applying pressure and heat, and the silicone rubber is bonded to the support 11 (FIG. 4).
(D)). Next, the glass substrate 41 and the resin pattern 14a are peeled off, so that the pattern-forming transfer plate 100 of the present invention in which the convex pattern 21 having the concave portion at the tip end is formed on the support 11 can be manufactured. (FIG. 4
(E)).

A method for manufacturing a substrate for a semiconductor device using the transfer plate for pattern formation of the present invention according to claim 3 will be described. FIGS. 5A to 5D show an example of a pattern forming method using a pattern-forming transfer plate. First, a pattern forming material is supplied to the concave portion of the convex pattern 21 of the pattern forming transfer plate 100 to form a pattern forming material layer 51 on the convex pattern 21 (FIG. 5B).
reference). As a pattern forming material, a normal resin resist is used when forming a resist pattern used when etching a conductive layer, and a conductive material made of copper, silver, carbon, or the like when directly forming a wiring pattern or a bump. Paste, solder paste, or the like can be used. As a method of supplying the pattern forming material, there are a screen printing method, a roller method, and the like. The pattern forming material can be selectively supplied, the supply amount can be controlled, and a necessary amount of the pattern forming material can be supplied to a necessary portion. The screen printing method is preferable because it can be performed efficiently.

Next, the transfer substrate 61 made of an insulating base material or the like
Pattern 2 on which a pattern forming material layer 51 is formed
1 and pressed (see FIG. 5C). here,
As the transferred substrate 61, a copper-clad laminate in which a copper foil or the like is laminated on an insulating base, a wiring board in which a wiring pattern or the like is formed in advance on the insulating base, or the like can be used. When the convex pattern 21 is pressed against the substrate 61 to be transferred, the distal end of the convex pattern 21 is formed of an elastic material.
Is obtained, and the pattern forming material layer 51 does not protrude from the convex pattern 21.

Further, the pattern-forming transfer plate is peeled off from the transfer substrate 61 to form a transfer pattern 51a on the transfer substrate 61 (see FIG. 5D). in this way,
In the pattern formation using the transfer plate for pattern formation, only a necessary pattern portion is selected and transferred, so that a desired pattern can be easily formed. Further, the transfer pattern 51a becomes a resist pattern when a resin resist is used as a pattern forming material, and a wiring pattern or a bump or the like is formed when a conductive paste or a solder paste is used as the pattern forming material.
Can be formed directly on top.

[0020]

The present invention will be described in detail with reference to the following examples.
First, a photosensitive layer was formed on a glass substrate 41 using a black colored photosensitive resin having the following composition, and exposed and developed to form a black resin pattern. Composition of colored photosensitive resin solution 8.2% by weight of acrylic resin (Composition: 15.7% by weight of ethyl methacrylate, 8.8% by weight of methyl methacrylate, 10.5% by weight of methyl acrylate, 65.0% of ethyl carbitol) % By weight) trimethylpropane triacrylate 4.9% by weight Trichloromethyl S-triazine 1.0% by weight butyl carbitol 58.9% by weight Black inorganic pigment (CuO.Cr ₂ O ₃ ) 27.0% by weight % Further, a low-melting glass paste LF-01 (manufactured by Nippon Electric Glass) is laminated on a black resin pattern and fired at 400 ° C. to form a black pattern 13 at a predetermined position on the glass substrate 41 (FIG. 4 ( a)).

Next, the glass substrate 41 and the black pattern 1
A photosensitive resin layer 14 was formed by pasting a negative dry film resist on 3 (see FIG. 4B).

Next, the photosensitive resin layer 14 is exposed from the glass substrate 41 side, and a series of patterning processes such as development are performed to form a resin pattern 14a having an opening 15 on the glass substrate 41, thereby forming a pattern. A mold for producing a transfer plate was prepared (see FIG. 4C).

Next, a curable silicone rubber was poured into the mold, and a 1.0 mm thick stainless steel plate (SUS30) was used.
After the support 14 made of 4) was overlaid and cured, the glass substrate 41 and the resin pattern 14a were peeled off from the mold to obtain a transfer plate 100 for pattern formation of the present invention (FIG. 4).
(E)).

Further, Sn63 is used as a pattern forming material.
A solder paste having a composition of 37% by weight of Pb is supplied to the concave portions of the convex pattern 21 of the transfer plate 100 for pattern formation by screen printing, and the pattern forming material layer 5 is formed.
1 was formed (see FIG. 5B).

Next, a pattern-forming transfer plate 100 having a pattern-forming material layer 51 formed on a transfer-receiving substrate 61, which is a wiring substrate having a wiring pattern or the like formed on an insulating base material, is positioned at a desired position. After being superposed, the transfer plate for pattern formation 100 was peeled off from the transferred substrate 61 after pressing with a laminator, and a semiconductor device substrate in which solder bumps were formed on a wiring substrate was manufactured. Here, it was confirmed that the pattern forming material layer 51 was completely transferred from the convex pattern 21 of the pattern forming transfer plate 100 and solder bumps were formed at desired positions as designed.

[0026]

The transfer plate for forming a pattern according to the present invention has a configuration in which a convex pattern is formed on a support, a concave portion is formed at the tip of the convex pattern, and the convex pattern is formed of an elastic material. As a result, a predetermined amount of the pattern forming material can be held, and only the desired pattern shape can be easily transferred, so that a stable pattern can be formed.

Further, by manufacturing a substrate for a semiconductor device using the transfer plate for pattern formation of the present invention, the pattern forming material is supplied to the convex pattern in a necessary and sufficient manner,
Since the transferability of the pattern forming material is also excellent, a resist pattern, a wiring pattern, a bump, and the like as designed can be easily and accurately formed on a wiring substrate, and it is possible to suppress pattern defects and the like. The alignment accuracy is obtained, and the production yield of the semiconductor device substrate is improved. Thus, it becomes possible to manufacture a semiconductor device substrate having excellent pattern shape and alignment accuracy,
It has excellent practical effects.

[Brief description of the drawings]

FIG. 1 is a schematic sectional view showing one embodiment of a transfer plate for pattern formation of the present invention.

FIG. 2 is a schematic sectional view showing another embodiment of the transfer plate for pattern formation of the present invention.

FIGS. 3 (a) and 3 (b) are schematic cross-sectional views showing an embodiment of a concave shape at the tip of a convex pattern of a transfer plate for pattern formation of the present invention.

FIGS. 4A to 4E are schematic sectional views showing an example of a method for producing a transfer plate for pattern formation of the present invention.

FIGS. 5A to 5D are schematic structural cross-sectional views schematically showing supply of a print forming material to a convex pattern and transfer to a substrate to be transferred using a transfer plate for pattern formation of the present invention. It is.

[Explanation of symbols]

11 ... Support 12 ... Convex pattern 13 ... Black pattern 14 ... Photosensitive resin layer 14a ... Resin pattern 15 ... Opening 21,22,23,24,25 ... Convex pattern 30 ... Two-stage convex pattern 31, 32, 33, 34, 35 Tapered convex pattern 41 Glass substrate 51 Pattern forming material layer 51a Transfer pattern 61 Transfer substrate 100, 200 .... Transfer plate for pattern formation

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H05K 3/20 H01L 23/12 Q F term (Reference) 2H113 AA01 AA02 BA01 BB22 CA17 DA62 DA64 FA10 2H114 AA01 AA08 DA60 DA62 EA01 EA04 5E343 AA02 BB72 DD56 DD62 DD64 FF02 FF08 GG08 5F044 MM33 MM49

Claims (3)

[Claims] In a transfer plate used for forming a pattern of a substrate for a semiconductor device, a convex pattern having a desired pattern shape is provided on a support, and an upper surface of the convex pattern is concave. A transfer plate for pattern formation, characterized in that: 2. A transfer plate for forming a pattern according to claim 1, wherein at least an upper portion of the convex pattern of the transfer plate for forming a pattern is formed of an elastic material. 3. A step of providing a pattern forming material on a convex pattern of a pattern forming transfer plate using the pattern forming transfer plate according to claim 1; Transferring a pattern to form a pattern.