KR20130033851A - Multi layer pcb and manufacturing method thereof - Google Patents

Abstract

PURPOSE: A multilayer printed circuit board and a manufacturing method thereof are provided to form a thin multilayer structure by forming a first conductive pattern and a second conductive pattern at the both sides of a contacting sheet using a transferring method. CONSTITUTION: A first hardness PCB domain(100) comprises a single PCB(40) laminated with a plurality of layers and an adhering layer(42) adhering a space between the single PCB laminated with a plurality of layers and a single PCB. The single PCB comprises an adhering sheet(10), a first conductive pattern(20) transferred to one side of the adhering sheet, and a second conductive pattern(30) transferred to the other side of the adhering sheet. A FPCB(Flexible Printed Circuit Board) domain(200) is integrally connected to the first hardness PCB domain and has malleability. The FPCB domain is formed at one among the multiple single PCBs. A second hardness PCB domain(300) is integrally connected to the other side of the FPCB domain.

Description

Multilayer printed circuit board and its manufacturing method {MULTI LAYER PCB AND MANUFACTURING METHOD THEREOF}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multilayer printed circuit board, and more particularly, to a multilayer printed circuit board in which a plurality of layers are stacked by a transfer method, and a flexible printed circuit board (FPCB) region is integrally formed. It is about a method.

Recently, with the development of electronic components and component embedding technology, multilayer printed circuit boards which overlap circuit conductors have been continuously developed. The rapid development of semiconductor integrated circuits in the electronics industry has led to the development of surface-mounting technology that directly mounts small chips and their components. As electronic components become thinner and smaller, they are embedded in more complex and narrow spaces. It is necessary to make this easy.

PCBs are being developed to meet these demands. In particular, in the case of multi-layer PCB which is easy to laminate and high in use, due to the technological development of cameras, mobile phone batteries, printers, disk drives, small measuring instruments, LCDs, and medical devices, the use of the PCB increases rapidly and the technology development for the PCB And demands are increasing.

Conventional multilayer printed circuit boards and manufacturing methods are disclosed in Korean Patent Publication No. 10-1051491 (July 18, 2011).

The conventional multilayer printed circuit board includes a flexible region and a rigid region, the flexible region is a region formed of a flexible material in which the bent portion is formed, and the rigid region is formed of a hard material. The flexible region includes at least one flexible film having a first circuit pattern formed on at least one surface, and a laser blocking layer is formed on at least one surface of the first circuit pattern, and an electromagnetic shielding layer capable of blocking electromagnetic waves on the laser blocking layer. . The rigid region is formed adjacent to the flexible region and includes a plurality of pattern layers on at least one surface of an extension of the at least one flexible film.

Such a conventional multilayer printed circuit board has a problem in that the manufacturing process is complicated and the thickness of the multilayer substrate is thick because circuit patterns are formed on the substrate through copper plating and etching processes.

Patent Publication 10-1051491 (July 18, 2011)

SUMMARY OF THE INVENTION An object of the present invention is to provide a multilayer printed circuit board and a method of manufacturing the same, which can simplify the manufacturing process by forming a conductive pattern using a transfer method and make a thin multilayered structure.

Another object of the present invention is to simplify the manufacturing process and reduce the manufacturing cost because the flexible printed circuit board (FPCB) area interconnecting between the two rigid printed circuit board areas are manufactured integrally when manufacturing the rigid printed circuit board A multilayer printed circuit board and a method of manufacturing the same are provided.

Another object of the present invention is to provide a multilayer printed circuit board and a method for manufacturing the same, which can minimize the amount of metal nanoparticles by performing inkjet patterning, thereby reducing manufacturing costs.

Another object of the present invention is to provide a multilayer printed circuit board and a method of manufacturing the same, which can improve reliability by forming a conductive pattern by screen printing printing method or gravure printing method using Ag paste as a conductive material.

It is to be understood that both the foregoing general description and the following detailed description of the present invention are exemplary and explanatory and are intended to provide further explanation of the invention as claimed. .

In order to achieve the above object, the multilayer printed circuit board of the present invention includes a first rigid PCB region in which a single PCB is stacked in plurality, an FPCB region integrally connected to the first rigid PCB region and having flexible flexibility; And a second rigid PCB region integrally connected to the other side of the FPCB region, wherein the FPCB region is formed on one of the plurality of single PCBs.

The single PCB of the present invention is characterized in that it comprises an adhesive sheet, a first conductive pattern transferred to one surface of the adhesive sheet, and a second conductive pattern transferred to the other surface of the adhesive sheet.

The adhesive sheet is attached to the surface of the adhesive sheet of the present invention is characterized in that the stacking between the single PCB.

The first conductive pattern and the second conductive pattern of the present invention are seed layers printed on the surface of the substrate; And a plating layer plated on the surface of the seed layer.

The seed layer of the present invention is characterized by being formed by any one of an inkjet printing method using a conductive ink, a screen printing printing method using a conductive paste, and a gravure printing method.

The second rigid PCB region of the present invention is formed integrally with the first rigid PCB region.

The FPCB region of the present invention is an adhesive sheet, a first connection pattern transferred to one surface of the adhesive sheet and electrically connected between the first conductive pattern, and electrically connected between the second conductive pattern transferred to the other surface of the adhesive sheet. It characterized in that it comprises a second connection pattern.

An adhesive layer for protecting the surface of the first connection pattern and the second connection pattern may be attached to the surface of the first connection pattern and the surface of the second connection pattern of the present invention.

In the adhesive sheet of the present invention, a via hole is formed, and the via hole is filled with a conductive connection for electrically connecting the first conductive pattern and the second conductive pattern, and the conductivity of the first conductive pattern and the second conductive pattern is filled. The junction portion to be bonded to the connection portion is characterized in that the discharge hole for discharging the gas generated during the curing of the conductive connection portion and the conductive connection portion is filled to increase the contact area.

The conductive connection of the present invention is characterized in that any one of Ag paste, Nano Paste and Sn Solder Paste is used.

Ag paste of the present invention is characterized in that it comprises an Ag powder and a thermosetting resin or ultraviolet curable resin that binds the Ag powder.

Nano paste (Nano Paste) of the present invention is formed by mixing a nano conductive ink and a conductive powder, the nano conductive ink is a nano Ag ink or nano Cu ink is used, the conductive powder is characterized in that the Ag powder or Cu powder is used It is done.

Sn solder paste (Sn Solder Paste) of the present invention is characterized by being formed by mixing Cu, Sn solder and resin, or by mixing Ag, Sn solder and resin.

It further comprises an unevenness formed on the surface of the first conductive pattern and the second conductive pattern of the present invention to increase the contact area with the conductive connecting portion.

The unevenness of the present invention is formed by etching the surfaces of the first conductive pattern and the second conductive pattern.

The method of manufacturing a multilayer printed circuit board of the present invention includes the steps of manufacturing a single PCB having an FPCB region, manufacturing a plurality of single PCBs having a first rigid PCB region and a second rigid PCB region, and having the FPCB region. Stacking a plurality of single PCBs having a first rigid PCB region and a second rigid PCB region on a single PCB.

The step of manufacturing a single PCB of the present invention comprises the steps of preparing an adhesive sheet having a via hole filled with a conductive connection, transferring the first conductive pattern on one surface of the adhesive sheet, and the other surface of the adhesive sheet It characterized in that it comprises a step of transferring the two conductive patterns.

The conductive connection of the present invention is characterized in that the Ag paste mixed with the Ag powder and a thermosetting resin or an ultraviolet curable resin for binding the Ag powder is used.

The conductive connection of the present invention is characterized in that a nano paste in which a nano Ag ink or a nano Cu ink is mixed with an Ag powder or a Cu powder is used.

The conductive connection of the present invention is characterized in that Cu or Ag, Sn solder, and a Sn solder paste mixed with a resin are used.

Transferring the first conductive pattern and the second conductive pattern of the present invention comprises the steps of forming a first conductive pattern and a second conductive pattern on the surface of the substrate, and the first conductive pattern and the second conductive pattern of the adhesive sheet Adhering to both surfaces, and separating the first conductive pattern and the second conductive pattern from the substrate.

Forming the first conductive pattern and the second conductive pattern on the substrate of the present invention includes the steps of printing a seed layer on the surface of the substrate; And plating a plating layer on a surface of the seed layer, wherein the seed layer is formed by any one of an inkjet printing method, a screen printing printing method, and a gravure printing method.

The method may further include forming a discharge hole in a junction portion that is joined to the conductive connection portion of the first conductive pattern and the second conductive pattern of the present invention.

In the method of manufacturing a multilayer printed circuit board of the present invention, after forming a discharge hole at a junction portion of the first conductive pattern and the second conductive pattern, etching of the surfaces of the first conductive pattern and the second conductive pattern is performed to form irregularities. It includes more.

The manufacturing of a single PCB having an FPCB region of the present invention may include forming a first conductive pattern on one surface of the adhesive sheet, a first connection pattern connecting the first conductive patterns, and the other surface of the adhesive sheet. Forming a second conductive pattern and a second connection pattern connecting the second conductive patterns to each other, and forming an adhesive layer on both surfaces of the adhesive sheet.

As described above, the multilayer printed circuit board of the present invention simplifies the manufacturing process by forming the first conductive pattern and the second conductive pattern on both sides of the adhesive sheet by using a transfer method, and can make a thin multilayer structure. have.

In addition, the multilayer printed circuit board of the present invention can simplify the manufacturing process and reduce the manufacturing cost by allowing the rigid PCB region and the FPCB region electrically connecting the rigid PCB region to be integrally manufactured.

In addition, the multilayer printed circuit board of the present invention can minimize the amount of metal nanoparticles by performing inkjet patterning can reduce the manufacturing cost.

In addition, the present invention can improve the reliability by forming a conductive pattern by a screen printing printing method or a gravure printing method using Ag paste as a conductive material.

1 is a cross-sectional view of a multilayer printed circuit board according to an exemplary embodiment of the present invention.
FIG. 2 is an enlarged view of the portion A of FIG. 1.
3 is an enlarged view of a portion B of FIG. 1.
4 is an enlarged view of a portion 1C.
5 is a plan view of a conductive pattern bonding portion according to an embodiment of the present invention.
6 is a plan view of a conductive pattern bonding portion according to another exemplary embodiment of the present invention.
7 is an enlarged view of a portion A of FIG. 1 illustrating a junction structure of a conductive pattern and a conductive connection portion according to another exemplary embodiment of the present invention.
8 to 15 are cross-sectional views sequentially illustrating a manufacturing process of a multilayer printed circuit board according to an exemplary embodiment.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. The sizes and shapes of the components shown in the drawings may be exaggerated for clarity and convenience. In addition, terms defined in consideration of the configuration and operation of the present invention may be changed according to the intention or custom of the user, the operator. Definitions of these terms should be based on the content of this specification.

1 is a cross-sectional view of a multilayer printed circuit board according to an exemplary embodiment of the present invention.

Referring to FIG. 1, a multilayer printed circuit board according to an exemplary embodiment may include a plurality of first rigid PCB regions 100 stacked and rigid, and a flexible flexible body integrally connected to the first rigid PCB region 100. The FPCB region 200 includes a second rigid PCB region 300 integrally connected to the other side of the FPCB region 200.

The first rigid PCB region 100 includes a single PCB 40 that is stacked in plurality and an adhesive layer 42 that bonds to stack between the single PCBs 40.

As an example, as shown in FIG. 1, when a multilayer printed circuit board has a 10-layer structure, five single PCBs 40 are stacked, and the five single PCBs 40 are bonded by an adhesive layer 42.

The single PCB 40 includes an adhesive sheet 10, a draft pattern 20 transferred to one surface of the adhesive sheet 10, and a second conductive pattern 30 transferred to the other surface of the adhesive sheet 10. do.

As for the adhesive sheet 10, a bonding sheet or a pre-preg, which is a thermosetting resin, is preferably used.

As shown in FIGS. 2 and 3, the first conductive pattern 20 and the second conductive pattern 30 are formed of the seed layers 22 and 32 printed on the surface of the substrate and the seed layers 22 and 32. Plating layers 24 and 34 plated on the surface.

As the printing method of the seed layers 22 and 32, an inkjet printing method, a screen printing printing method, and a gravure printing method are used.

Conductive ink is used for the inkjet printing method, and conductive paste is used for the screen printing printing method and the gravure printing method. As the conductive paste, Ag paste or Cu paste may be applied.

Here, the thicknesses of the seed layers 22 and 32 may be as thin as 1 μm or less when using the inkjet printing method, and have a thickness of 10 μm or less when using the screen printing printing method and the gravure printing method.

In addition to the copper, the plating layer 24 may use any one of conductive metals such as Au, Ag, Al, Ni, and Sn, and the plating method is performed by wet plating.

As shown in FIG. 3, the second conductive pattern 30 includes a seed layer 32 in which conductive ink is patterned on a surface of a substrate by an inkjet patterning method, and a plating layer 34 plated on a surface of the seed layer 32. It includes.

The cover film 44 of an insulating material is attached to both sides of the stacked single PCB 40.

In addition, an adhesive layer 42 is formed between the single PCBs 40 so as to bond each other between the single PCBs 42 so that a plurality of single PCBs 40 are stacked.

As shown in FIG. 4, the adhesive sheet 10 includes a via hole 60 filled with a conductive connection 62 to electrically connect the first conductive pattern 20 and the second conductive pattern 30. Is formed.

The conductive connector 62 may be formed of Ag paste, nano paste, or Sn solder paste.

Ag paste is composed of a thermosetting resin or an ultraviolet curable resin that binds the Ag powder and the Ag powder. The thermosetting resin or the ultraviolet curable resin is a resin which is maintained in a liquid state at room temperature and then cured when heat or ultraviolet rays are applied. , Alkyd resins and the like can be used.

Nano paste is formed by mixing nano conductive ink and conductive powder. Here, the ink containing nano size Ag particle | grains or the ink containing nano size Cu particle | grains is used for nano conductive ink, Ag powder or Cu powder is used for electroconductive powder.

At this time, the Ag or Cu content of the nano paste is about 75 to 80%, the powder size is about 10 ~ 200nm. The viscosity of the nano paste is about 50000 to 200,000 cps, and the sintering temperature is set within 150 hours at 150 ° C to 180 ° C.

Specifically, the nano paste may be formed by mixing nano Ag ink and Ag powder, may be formed by mixing nano Ag ink and Cu powder, and may be formed by mixing nano Cu ink and Ag powder. And, it may be formed by mixing the nano Cu ink and Cu powder.

Sn solder paste is formed by mixing Cu, Sn solder and resin, or Ag, Sn solder and resin (Resin).

In addition, a via hole 66 is also formed in the adhesive layer 42 that bonds the single PCB 40 to each other, and the conductive hole 62 is filled in the via hole 66 to form a conductive pattern of the single PCB 40. Electrically connect the conductive patterns of a single PCB stacked next to each other.

Here, the first conductive pattern 20 and the second conductive pattern 30 and the conductive connecting portion 62, the peeling phenomenon occurs in the stacking process may cause a problem that causes a poor bonding, the conductive connecting portion ( 62) There is a fear that the gas generated during curing does not escape and is trapped inside the via hole 60 to prevent the bonding between the conductive pattern and the bonding surface of the conductive connection portion.

Therefore, as shown in FIGS. 4 and 5 to solve this problem, a plurality of discharge holes are formed at the junction where the conductive connection portion 62 of the first conductive pattern 20 and the second conductive pattern 30 is joined. 70).

Here, the shape of the discharge hole 70 may be formed in the form of a plurality of straight pattern, as shown in Figure 5, it may be formed of a plurality of polygonal holes, as shown in FIG.

As described above, a plurality of discharge holes 70 are formed at the junctions of the conductive connection parts 62 so that the gas generated during curing of the conductive connection parts 62 is discharged through the discharge holes 70. The conductive connection portion 62 is filled in the discharge hole 70 to maximize the contact area of the joint surface.

The process of forming the discharge hole 70 in the first conductive pattern 20 and the second conductive pattern 30 may be formed by covering the mask on which the discharge hole is formed when the conductive ink is patterned on the surface of the substrate. And may be directly formed into a pattern having discharge holes during patterning with an ink jet printer.

7 is an enlarged view of a portion of FIG. 1A showing a junction of a conductive connection portion according to another embodiment of the present invention.

According to another embodiment of the present invention, the junction of the conductive connection part is formed by forming the concave-convex 72 on the junction surface of the first conductive pattern 20 and the second conductive pattern 30 in the structure of the junction part described in the above embodiment. The pattern 20 increases the contact area between the joining surface of the second conductive pattern 30 and the joining surface of the conductive connection portion and generates an anchor effect to prevent the joining surface from peeling off.

Here, in the method of forming the concave-convex 72 on the joining surface of the first conductive pattern 20 and the second conductive pattern 30, the first conductive pattern 20 and the second conductive pattern 30 may be formed on the surface of the substrate. After patterning, the joint surfaces of the first conductive pattern 20 and the second conductive pattern 30 are etched to form irregularities.

In addition to the method of etching the bonding surface of the first conductive pattern 20 and the second conductive pattern 30, the uneven surface 72 may be formed on the bonding surface of the first conductive pattern 20 and the second conductive pattern 30. Any method that can be applied is applicable.

The second rigid PCB region 300 is formed by stacking together when a plurality of single PCBs are stacked to manufacture the first rigid PCB region 100 described above.

The FPCB region 200 is for electrically connecting between the conductive pattern of the first rigid PCB region 100 and the conductive pattern of the second rigid PCB region 300 and has a flexible shape so as to be deformable.

The FPCB region 200 is integrally formed with a single PCB positioned in the center of a single PCB stacked in multiple layers. For example, when a single PCB 40 is a 10-layer laminated structure, five adhesive sheets 10 are stacked, and are integrally formed on the third adhesive sheet.

The FPCB region 200 is transferred to the adhesive sheet 80 and one surface of the adhesive sheet 80 to between the first conductive patterns 20 of the first rigid PCB region 100 and the second rigid PCB region 300. The first connection pattern 82 electrically connecting the second connection patterns 82 and the second conductive patterns 30 of the first rigid PCB region 100 and the second rigid PCB region 300 to be transferred to the other surface of the adhesive sheet 80. It includes a second connection pattern 84 for connecting between.

The adhesive layer 86 protecting the first connection pattern 82 and the second connection pattern 84 is attached to surfaces of the first connection pattern 82 and the second connection pattern 84.

Here, the adhesive sheet 80 is formed integrally with the adhesive sheet 10 of the third single PCB, the first connection pattern 82 is formed integrally with the first conductive pattern 20, the second connection pattern 84 is integrally formed with the second conductive pattern 30. In addition, the adhesive layer 86 is also integrally formed when forming the adhesive layer 42 of the single PCB 40.

As such, since the FPCB region 200 is integrally formed when the first rigid PCB region 100 and the second rigid PCB region 300 are formed, a separate process may be unnecessary, thereby shortening the manufacturing process.

In addition, the FPBC region 200 is integrally formed with a single PCB positioned in the center of FIG. 1, but is not limited thereto, and may be formed integrally with another single PCB.

8 to 15 are cross-sectional views sequentially illustrating a manufacturing process of a multilayer printed circuit board according to an exemplary embodiment of the present invention.

First, a single PCB manufacturing process will be described.

Looking at a single PCB manufacturing process, as shown in Figure 8, to prepare a double-sided adhesive sheet 10 having an adhesive on both sides. In addition, the via sheet 60 is formed by drilling the adhesive sheet 10.

The conductive hole 62 is filled in the via hole 60.

The conductive connecting portion 2 may be any one of an Ag paste, a nano paste, or a Sn solder paste.

Ag paste is composed of a thermosetting resin or an ultraviolet curable resin that binds the Ag powder and the Ag powder. The thermosetting resin or the ultraviolet curable resin is a resin which is maintained in a liquid state at room temperature and then cured when heat or ultraviolet rays are applied. , Alkyd resins and the like can be used.

Nano paste is formed by dispersing nano conductive ink and conductive powder and sintering at low temperature to form a conductive connection portion. Here, the ink containing nano size Ag particle | grains or the ink containing nano size Cu particle | grains is used for nano conductive ink, Ag powder or Cu powder is used for electroconductive powder.

At this time, the Ag or Cu content of the nano paste (Nano Paste) is about 75 ~ 80%, the conductive powder size is about 10 ~ 200nm. The viscosity of the nano paste is about 50000 to 200,000 cps, and the sintering temperature is set within 150 hours at 150 ° C to 180 ° C.

Specifically, the nano paste may be formed by dispersing the nano Ag ink and Ag powder, and may be formed by dispersing the nano Ag ink and Cu powder, and dispersing the nano Cu ink and Ag powder. It can be formed, and the nano Cu ink and the Cu powder can be formed through dispersion.

Sn solder paste is formed by mixing Cu, Sn solder and resin, or Ag, Sn solder and resin (Resin).

As such, when the process of filling the conductive connecting portion 62 in the via hole 60 of the adhesive sheet 10 is completed, the first conductive pattern 20 and the second conductive pattern 30 are applied to the adhesive sheet 10. Perform the process of forming.

Referring to the process of forming the first conductive pattern 20, first, the first conductive pattern 20 is formed on the substrate 50.

The substrate 50 is formed of a transparent glass substrate, a flexible plastic substrate, or an opaque insulating substrate, for example, a polyimide film. Here, the thickness of the substrate 50 is preferably 8 μm to 1 mm.

The first conductive pattern 20 includes a seed layer 22 printed on the surface of the substrate 50 and a plating layer 24 plated on the surface of the seed layer 22.

The seed layer 22 may be printed by any of inkjet printing, screen printing, and viagra printing.

For example, in the case of the inkjet printing method, as shown in FIG. 9, the conductive ink 52 made of metal nanoparticles, for example, silver nanoparticles, is discharged from the nozzle of the print head 54 on the substrate 50. The inkjet patterning is carried out by stacking on the 50 in a predetermined pattern. Here, the thickness of the seed layer 22 is sufficient to be a thin thickness of 1 μm or less.

In the screen printing method and the viagra printing method, the seed layer 22 is formed using the conductive paste as the conductive material. At this time, the thickness of the seed layer 22 is 10 μm or less. Here, Ag paste or Cu paste may be used as the conductive paste.

The plating layer 24 is plated to be wrapped around the surface of the seed layer 22, as shown in FIG. That is, the seed layer 22 is surrounded by the plating layer on both sides and the top surface except for one surface of the substrate 50 attached.

The plating layer 24 is formed of a copper plating layer, for example. Here, in addition to copper, the plating layer 24 may use any one of conductive metals such as Au, Ag, Al, Ni, and Sn, and the plating method is performed by wet plating.

After the seed layer 22 is formed, a photosensitive film such as a photoresist may be patterned between the seed layers 22. The photoresist film is to prevent the plating layer 24 from growing laterally on the seed layer 22 to realize a more precise pattern. Therefore, the thickness of the photoresist film is preferably made thicker than or equal to the thickness of the seed layer 22 and thicker than or equal to the thickness of the plating layer 24.

Then, after plating the plating layer 24 to a predetermined thickness and size on the surface of the seed layer 22 except for the photoresist region, the photoresist layer may be removed.

Here, when the first conductive pattern 20 is formed on the surface of the substrate 50, as shown in FIG. 11, a plurality of discharge holes 70 are formed in the bonding surface that is joined to the conductive connecting portion 2. . Here, the discharge hole 70 may be formed by copper plating to have the discharge hole 70 in the pattern form of the plating layer 24 when plating the plating layer 24 on the surface of the substrate 50, the substrate ( 50 may be formed by disposing a mask on which the discharge hole 70 is formed on the surface of the substrate 50 and then performing copper plating.

In addition, when the uneven surface 72 is formed on the bonding surface of the first conductive pattern 20, as illustrated in FIG. 12, the uneven surface 72 is formed by etching the bonding surface of the first conductive pattern 20. do.

The second conductive pattern 30 is formed on the substrate 50 in the same manner as the method of making the first conductive pattern 20. That is, as shown in FIG. 13, the seed layer 32 is printed on the surface of the substrate 50 and the plating layer 34 is plated on the surface of the seed layer 32 to form a second conductive layer on the surface of the substrate 50. The pattern 30 is formed.

In addition, the discharge hole 70 is formed in the joint surface that is joined to the conductive connecting portion 62 of the second conductive pattern 30, and the surface of the second conductive pattern 30 is etched to form the unevenness 72. .

When the process of forming the first conductive pattern 20 and the second conductive pattern 30 on the substrate 50 is completed, the first conductive pattern 20 is transferred to one surface of the adhesive sheet 10, and the adhesive sheet ( A process of transferring the second conductive pattern to the other surface of 10) is performed.

That is, as shown in FIG. 14, the first conductive pattern 20 is positioned on one surface of the adhesive sheet 10, the second conductive pattern 30 is positioned on the other surface of the adhesive sheet 10, and then the adhesive is bonded. The first conductive pattern 20 is in contact with one surface of the sheet 10, and the second conductive pattern 30 is in contact with the other surface of the adhesive sheet 10.

At this time, since the conductive connection portion 62 is in a liquid state, the conductive connection portion 62 is inserted into the discharge hole 70 formed in the first conductive pattern 20 and filled in the discharge hole 70 formed in the second conductive pattern 30. Then, the contact area between the first conductive pattern 20 and the second conductive pattern 30 and the conductive connecting portion 62 is increased.

The conductive connecting portion 62 is inserted into the unevenness 72 formed in the first conductive pattern 20 and the second conductive pattern 30 to increase the contact area and to exhibit an anchor effect. In this state, when a predetermined amount of heat is applied for a predetermined time, the first conductive pattern 20 is adhered to one surface of the adhesive sheet 10, and the second conductive pattern 30 is adhered to the other surface of the adhesive sheet 10. do.

In addition, when a predetermined amount of heat or ultraviolet light is applied for a predetermined time, the conductive connection portion 62 is cured, and the gas generated in the process of curing the conductive connection portion 62 is discharged to the outside through the discharge hole 70.

When the substrate 50 is separated, as shown in FIG. 15, the first conductive pattern 20 is transferred to one surface of the adhesive sheet 10, and the second conductive pattern 30 is formed of the adhesive sheet 10. It is transferred to the other side.

In this case, the first conductive pattern 20 and the second conductive pattern 30 are electrically connected to each other by the conductive connection portion 62.

When a single PCB 40 is manufactured by performing such a process, the adhesive layer 44 is attached between the single PCB 40 to stack a plurality of single PCBs 40.

Here, the single PCB 40 has a structure in which the first rigid PCB region 100 and the second rigid PCB region 300 are integrally formed. That is, the adhesive sheet 10 of the first rigid PCB region 100 and the adhesive sheet 10 of the second rigid PCB region 300 are separated from each other.

In addition, one of the plurality of single PCBs has a structure in which the FPCB region 200 is integrally formed. That is, the single PCB 40 having the FPCB region 200 is formed in one sheet such that the adhesive sheet 10 connects the first rigid PCB region 100 and the second rigid PCB region 300 to each other. The first conductive pattern 20 and the second conductive pattern 30 are formed on both surfaces of the adhesive sheet 80 positioned in the rigid PCB region 100 and the second rigid PCB region 300, and the FPCB region 200 is formed. The first connection pattern 82 and the second connection pattern 84 are formed on both surfaces of the adhesive sheet 80 positioned at the.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is clearly understood that the same is by way of illustration and example only and is not to be construed as limited to the embodiments set forth herein. Various changes and modifications may be made by those skilled in the art.

10: adhesive sheet 20: first conductive pattern
22: seed layer 24: plating layer
30: second conductive pattern 42: adhesive layer
44: cover film 50: substrate
60: via hole 62: conductive connection
70: discharge hole 72: irregularities
80: adhesive sheet 82: first connection pattern
84: second connection pattern 86: adhesive layer
100: first rigid PCB area 200: FPCB area
300: second rigid PCB area

Claims (25)

A first rigid PCB region in which a single PCB is stacked in a plurality; a FPCB region integrally connected to the first rigid PCB region and having a flexible ductility; and a second rigid PCB region integrally connected to the other side of the FPCB region. Including,
Wherein said FPCB region is formed in one of said plurality of single PCBs. The method of claim 1,
The single PCB is an adhesive sheet;
A first conductive pattern transferred to one surface of the adhesive sheet; And
A multilayer printed circuit board comprising a second conductive pattern transferred to the other surface of the adhesive sheet. The method of claim 2,
A multilayer printed circuit board, characterized in that the adhesive layer is attached to the surface of the adhesive sheet laminated between the single PCB. The method of claim 2,
The first conductive pattern and the second conductive pattern may include a seed layer printed on a surface of the substrate; And
And a plating layer plated on a surface of the seed layer. 5. The method of claim 4,
The seed layer is a multilayer printed circuit board, characterized in that formed by any one of an inkjet printing method using a conductive ink, a screen printing printing method using a conductive paste and a gravure printing method. The method of claim 1,
And the second rigid PCB region is integrally formed with the first rigid PCB region. The method of claim 2,
The FPCB region may include an adhesive sheet, a first connection pattern transferred to one surface of the adhesive sheet to electrically connect the first conductive pattern, and a second connection pattern transferred to the other surface of the adhesive sheet to electrically connect the second conductive pattern. Multi-layer printed circuit board comprising a connection pattern. The method of claim 7, wherein
And a bonding layer for protecting the surface of the first connection pattern and the second connection pattern on the surface of the first connection pattern and the surface of the second connection pattern. The method of claim 2,
A via hole is formed in the adhesive sheet, and the via hole is filled with a conductive connection part for electrically connecting the first conductive pattern and the second conductive pattern.
Wherein the junction portion bonded to the conductive connection portion of the first conductive pattern and the second conductive pattern is characterized in that the discharge hole for discharging the gas generated during the curing of the conductive connection portion and the conductive connection portion is filled to increase the contact area Multilayer printed circuit boards. 10. The method of claim 9,
The conductive connection portion is a multilayer printed circuit board, characterized in that any one of Ag paste, nano paste (Nano Paste) and Sn solder paste (Sn Solder Paste) is used. The method of claim 10,
The Ag paste includes a Ag powder and a thermosetting resin or an ultraviolet curable resin that binds the Ag powder. The method of claim 10,
The nano paste is formed by mixing a nano conductive ink and a conductive powder,
The nano conductive ink is a nano Ag ink or nano Cu ink is used, the conductive powder is a multilayer printed circuit board, characterized in that the Ag powder or Cu powder is used. The method of claim 10,
The Sn solder paste (Sn Solder Paste) is formed by mixing Cu, Sn solder and resin, or a multilayer printed circuit board, characterized in that formed by mixing Ag, Sn solder and resin. 10. The method of claim 9,
And a concave-convex shape formed on surfaces of the first conductive pattern and the second conductive pattern to increase a contact area with the conductive connecting portion. 15. The method of claim 14,
The irregularities are formed by etching the surfaces of the first conductive pattern and the second conductive pattern. Fabricating a single PCB having an FPCB region;
Fabricating a plurality of single PCBs having a first rigid PCB region and a second rigid PCB region;
Stacking a plurality of single PCBs having a first rigid PCB region and a second rigid PCB region on a single PCB having the FPCB region. 17. The method of claim 16,
The manufacturing of the single PCB may include preparing an adhesive sheet having via holes filled with conductive connections;
Transferring a first conductive pattern to one surface of the adhesive sheet; And
And transferring the second conductive pattern to the other surface of the adhesive sheet. 18. The method of claim 17,
Wherein the conductive connecting portion Ag powder, and the Ag paste mixed with a thermosetting resin or ultraviolet curable resin that binds the Ag powder is used, characterized in that the printed circuit board manufacturing method. 18. The method of claim 17,
The conductive connecting portion is a nano paste or nano Cu ink, and a nano paste formed by mixing Ag powder or Cu powder is used. 18. The method of claim 17,
Wherein the conductive connection portion Cu or Ag, Sn solder, and a method of manufacturing a multilayer printed circuit board, characterized in that Sn solder paste mixed with a resin is used. 18. The method of claim 17,
The transferring of the first conductive pattern and the second conductive pattern may include forming a first conductive pattern and a second conductive pattern on a surface of the substrate;
Bonding the first conductive pattern and the second conductive pattern to both surfaces of the adhesive sheet; And
Method of manufacturing a multilayer printed circuit board comprising the step of separating between the first conductive pattern and the second conductive pattern and the substrate. The method of claim 21,
Forming a first conductive pattern and a second conductive pattern on the substrate may include printing a seed layer on a surface of the substrate; And plating a plating layer on a surface of the seed layer,
The seed layer is a multi-layer printed circuit board manufacturing method, characterized in that formed by any one of the inkjet printing method, screen printing printing method, gravure printing method. The method of claim 21,
The method of claim 1, further comprising forming a discharge hole in a junction portion of the first conductive pattern and the second conductive pattern that is joined to the conductive connection portion. The method of claim 21,
After forming the discharge hole in the junction portion of the first conductive pattern and the second conductive pattern and etching the surface of the first conductive pattern and the second conductive pattern further comprises the step of forming irregularities. . 17. The method of claim 16,
The manufacturing of a single PCB having the FPCB region may include forming a first conductive pattern on one surface of an adhesive sheet and a first connection pattern connecting the first conductive patterns to each other;
Forming a second conductive pattern and a second connection pattern connecting the second conductive patterns to the other surface of the adhesive sheet; And
Method of manufacturing a multilayer printed circuit board comprising the step of forming an adhesive layer on both sides of the adhesive sheet.

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