CN114900970A - Manufacturing method of blood gas analysis and test medical board, PCB and terminal equipment - Google Patents
Manufacturing method of blood gas analysis and test medical board, PCB and terminal equipment Download PDFInfo
- Publication number
- CN114900970A CN114900970A CN202210618085.4A CN202210618085A CN114900970A CN 114900970 A CN114900970 A CN 114900970A CN 202210618085 A CN202210618085 A CN 202210618085A CN 114900970 A CN114900970 A CN 114900970A
- Authority
- CN
- China
- Prior art keywords
- production
- board
- gold
- plate
- treatment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 110
- 239000008280 blood Substances 0.000 title claims abstract description 39
- 210000004369 blood Anatomy 0.000 title claims abstract description 39
- 238000012360 testing method Methods 0.000 title claims abstract description 25
- 238000004868 gas analysis Methods 0.000 title claims abstract description 24
- 239000010931 gold Substances 0.000 claims abstract description 44
- 229910052737 gold Inorganic materials 0.000 claims abstract description 42
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 36
- 238000000034 method Methods 0.000 claims abstract description 28
- 238000009713 electroplating Methods 0.000 claims abstract description 27
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 26
- 229910052802 copper Inorganic materials 0.000 claims abstract description 24
- 239000010949 copper Substances 0.000 claims abstract description 24
- 238000007747 plating Methods 0.000 claims abstract description 20
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Substances [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims abstract description 17
- 238000012545 processing Methods 0.000 claims abstract description 17
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 claims abstract description 16
- 238000011161 development Methods 0.000 claims abstract description 13
- 229910052697 platinum Inorganic materials 0.000 claims abstract description 13
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 15
- 230000002378 acidificating effect Effects 0.000 claims description 9
- 239000003795 chemical substances by application Substances 0.000 claims description 9
- 229910052759 nickel Inorganic materials 0.000 claims description 7
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 6
- 230000008021 deposition Effects 0.000 claims description 6
- 238000007641 inkjet printing Methods 0.000 claims description 6
- 238000007654 immersion Methods 0.000 claims description 4
- 239000011889 copper foil Substances 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims description 3
- 238000004159 blood analysis Methods 0.000 abstract description 8
- 238000009534 blood test Methods 0.000 abstract description 7
- JUWSSMXCCAMYGX-UHFFFAOYSA-N gold platinum Chemical compound [Pt].[Au] JUWSSMXCCAMYGX-UHFFFAOYSA-N 0.000 abstract description 7
- 238000004381 surface treatment Methods 0.000 abstract description 5
- ZBTDWLVGWJNPQM-UHFFFAOYSA-N [Ni].[Cu].[Au] Chemical compound [Ni].[Cu].[Au] ZBTDWLVGWJNPQM-UHFFFAOYSA-N 0.000 abstract description 3
- 238000005530 etching Methods 0.000 description 12
- 238000005406 washing Methods 0.000 description 12
- 239000007789 gas Substances 0.000 description 9
- 238000013461 design Methods 0.000 description 5
- 238000001035 drying Methods 0.000 description 5
- 238000004806 packaging method and process Methods 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 4
- 239000003814 drug Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- 238000007650 screen-printing Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000005553 drilling Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000001723 curing Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000003745 diagnosis Methods 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 238000001039 wet etching Methods 0.000 description 2
- 206010021143 Hypoxia Diseases 0.000 description 1
- 241001657258 Pachycare flavogriseum Species 0.000 description 1
- 208000004756 Respiratory Insufficiency Diseases 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000002274 desiccant Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003487 electrochemical reaction Methods 0.000 description 1
- 229940124645 emergency medicine Drugs 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 210000002216 heart Anatomy 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 208000018875 hypoxemia Diseases 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 210000003734 kidney Anatomy 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 210000004185 liver Anatomy 0.000 description 1
- 210000004072 lung Anatomy 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 230000007102 metabolic function Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000002640 oxygen therapy Methods 0.000 description 1
- 238000006213 oxygenation reaction Methods 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 238000004393 prognosis Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 201000004193 respiratory failure Diseases 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0002—Apparatus or processes for manufacturing printed circuits for manufacturing artworks for printed circuits
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/145—Measuring characteristics of blood in vivo, e.g. gas concentration, pH value; Measuring characteristics of body fluids or tissues, e.g. interstitial fluid, cerebral tissue
- A61B5/14542—Measuring characteristics of blood in vivo, e.g. gas concentration, pH value; Measuring characteristics of body fluids or tissues, e.g. interstitial fluid, cerebral tissue for measuring blood gases
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
Abstract
The invention relates to a manufacturing method of a blood gas analysis test medical board, a PCB (printed Circuit Board) and terminal equipment, wherein the manufacturing method comprises the steps of pasting a film on a production board, and forming an outer layer circuit pattern on the production board after exposure and development; carrying out pattern electroplating on the production board, and plating a copper layer on the outer layer circuit pattern; carrying out nickel-gold electroplating treatment on the production plate; carrying out electric hard gold treatment on the production plate; performing electro-platinum treatment on the production plate; the ink-jet treatment was performed on the electrode PAD position on the production plate. According to the scheme provided by the application, the surface treatment of the electrode PAD adopts the methods of copper-nickel-gold plating, hard-gold plating and platinum-gold plating, so that the purity of the gold layer is obviously improved, and the requirement of blood analysis and test is met; meanwhile, the ink-jet processing does not need exposure and development, so that the PAD gold surface of the electrode is prevented from being polluted by ink, the production efficiency of the product is improved, the concentricity of the ink-jet processing can be controlled within 25um, and the quality of the product is further improved.
Description
Technical Field
The invention relates to the technical field of printed circuit board manufacturing, in particular to a manufacturing method of a blood gas analysis test medical board, a PCB and terminal equipment.
Background
The blood gas refers to oxygen and carbon dioxide contained in blood, the blood gas analysis is an important aspect of evaluating the stability of the internal environment of a patient at the time of blood gas and acid-base balance, is an important content of emergency medicine, can help people to determine the type and severity of respiratory failure of a newborn and a patient, judge prognosis, know the degree of hypoxemia, guide oxygen therapy and instrument ventilation, and meanwhile, can timely make a treatment scheme according to the blood gas analysis result so as to save the life of the patient.
The hospital has higher requirements on the blood gas analyzer at present, and the blood gas analyzer is required to be measured in the shortest time of collection due to the particularity of detection parameters, so that the accuracy of the acquired data is ensured, and doctors are helped to quickly diagnose and timely treat patients. The advanced blood gas analyzer can greatly improve the efficiency of diagnosis and treatment, so that the blood gas analyzer becomes indispensable equipment for ICU and CCU, operating rooms, emergency departments and the like.
At present, a blood gas analyzer is developed from traditional analysis for singly judging acid-base balance to comprehensive critical parameter monitoring meeting the requirements of modern clinical medicine, and a system can be used for comprehensively diagnosing the functions of heart, lung, liver and kidney, acid-base balance, oxygenation state, metabolic function and the like of a patient. Therefore, the application of the blood gas analysis will lead the patient to obtain the most comprehensive diagnosis and the best monitoring treatment in the shortest time based on the development requirements of clinical medicine, particularly critical medicine, and the development level of scientific technology, particularly computer and biosensor technology.
Blood gas analysis is an electrochemical reaction, and blood directly reacts with liquid medicine on a PCB, which exceeds the standard and requirement of the conventional PCB. At present, the prior PCB manufacturing process flow is shown in figure 4, solder mask is manually silk-screened for three times, and surface treatment uses OSP, tin deposition, silver deposition, nickel deposition, gold plating and the like, however, as shown in figure 5, the prior PCB manufacturing process is only suitable for welding or a friction-resistant plug-in unit, which affects the surface performance of an electrode PAD and is not beneficial to blood analysis and test, or as shown in figure 6, when a blood groove at the position of the electrode PAD needs to be processed by three times of solder mask silk-screen printing exposure development baking plates to form a pit shape, because the process is repeatedly aligned and developed, the concentricity precision of the blood groove cannot be controlled within +/-20um tolerance, and ink components can partially remain on the bottom plate of the pit, and are difficult to clean, so that the electrode PAD is polluted and is not beneficial to blood analysis and test.
Disclosure of Invention
Therefore, it is necessary to provide a method for manufacturing a medical board for blood gas analysis and test, a PCB board and a terminal device, aiming at the problem that a PCB board formed by the existing PCB manufacturing process is not beneficial to blood analysis and test.
The invention provides a method for manufacturing a blood gas analysis and test medical plate, which comprises the following steps:
pasting a film on the production board, and forming an outer layer circuit pattern on the production board after exposure and development;
carrying out pattern electroplating on the production board, and plating a copper layer on the outer layer circuit pattern;
carrying out nickel-gold electroplating treatment on the production plate;
carrying out electric hard gold treatment on the production plate;
performing electro-platinum treatment on the production plate;
the ink-jet treatment was performed on the electrode PAD position on the production plate.
In one embodiment, in the nickel-gold electroplating treatment of the production plate, the thickness of the nickel layer is controlled to 118-.
In one embodiment, the thickness of the electric hard gold is controlled to be 36.5-37.5 u' in the electric hard gold treatment of the production plate.
In one embodiment, the thickness of the electro-platinum is controlled to be 9.82-9.86 u' in the electro-platinum treatment of the production plate.
In one embodiment, the method further comprises, before the ink jetting the electrode PAD locations on the production plate:
and (3) deoiling the production plate by using an acidic deoiling agent, wherein the concentration of hydrochloric acid in the acidic deoiling agent is 100ml/L, and the temperature of the acidic deoiling agent is kept at 30-40 ℃.
In one embodiment, the inkjet processing of the electrode PAD locations on the production plate comprises:
jetting ink to the position of the electrode PAD on the production plate by an ink jetting device;
thermally curing the ink;
and baking the production board.
In one embodiment, the method further comprises: carrying out nickel and gold immersion treatment on the golden finger position on the production plate; windowing the golden finger position to expose the golden finger position; and carrying out electric thick gold treatment on the golden finger position on the production plate.
In one embodiment, the production board is a multilayer board formed by laminating an inner core board and an outer copper foil into a whole through a prepreg, and the production board is subjected to copper deposition and full-board electroplating.
The invention further provides a PCB, wherein at least one circuit layer in the PCB is manufactured by adopting the manufacturing method of the blood gas analysis test medical board as described in any embodiment of the application.
The invention further provides terminal equipment, and the terminal equipment comprises the PCB in the embodiment of the application.
The beneficial effects of the invention include:
according to the manufacturing method of the medical board for analyzing and testing the blood gas, provided by the invention, the PAD surface treatment of the electrode adopts a copper-nickel-gold plating method, a hard-gold plating method and a platinum-gold plating method, so that the purity of a gold layer is obviously improved, and the requirement of blood analysis and test is met; meanwhile, the ink-jet processing does not need exposure and development, so that the pollution of ink on the gold surface of the electrode PAD is avoided, compared with the original manual three-time screen printing processing, the manufacturing method disclosed by the invention has the advantages that the flow is optimized and reduced, the production efficiency of the product is improved, the concentricity of the ink-jet processing can be controlled within 25 mu m, and the quality of the product is further improved.
Drawings
Fig. 1 is a schematic flow chart illustrating a method for manufacturing a blood gas analysis test medical plate according to an embodiment of the present invention;
FIG. 2 is a schematic view of a blood gas analysis test medical board according to an embodiment of the present invention;
FIG. 3 is yet another schematic view of FIG. 2;
FIG. 4 is a schematic diagram of a conventional PCB;
FIG. 5 is a schematic diagram of a conventional PCB;
fig. 6 is a schematic diagram of a conventional PCB.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, but are not intended to indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and are not to be construed as limiting the invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.
The medical Board for blood gas analysis and test in the invention is a Printed Circuit Board (PCB), which is called Printed Circuit Board (PCB) in chinese, is an important electronic component, is a support for electronic components, and is a carrier for electrical interconnection of electronic components. The PCB comprises a circuit layer and a dielectric layer, the circuit layer comprises a circuit used for conducting each electronic device, under the condition that the number of the electronic devices is large, in order to prevent conducting circuits between different electronic devices from influencing each other, a plurality of circuit layers are arranged frequently, the dielectric layer is made of insulating materials and used for isolating different circuit layers, the most common dielectric layer is a PP sheet (prepreg which is a sheet bonding material synthesized by resin and a carrier), and generally speaking, the substrate of the PCB is the same as the dielectric layer. For the PCB with the simplest structure, only one dielectric layer and one or two circuit layers are provided, and the surface of the circuit layer is subjected to resistance welding treatment. For a PCB with a large number of layers, there may be a plurality of circuit layers and a plurality of dielectric layers disposed adjacent to each other, that is, the adjacent layers of the dielectric layers are circuit layers.
The existing total flow of manufacturing the PCB board includes: raw material preparation- > blanking- > inner layer pretreatment- > press film- > exposure- > development- > etching- > membrane removal- > AOI inspection- > press fit- > drilling- > PTH- > outer layer pretreatment- > press film- > exposure- > development- > pattern electroplating- > touch- > outer layer etching- > tin stripping- > solder resist-photosensitive screen printing- > surface treatment- > character and mark symbol- > curing- > appearance processing- > cleaning and drying treatment- > inspection and test- > packaging of a finished product, wherein etching (etching) is a technology for removing a material by using a chemical reaction or a physical impact effect. The etching technology can be divided into wet etching (wet etching) and dry etching (dry etching), and the method for manufacturing the circuit layer of the PCB provided in the embodiment of the present application does not limit the specific etching manner for etching the preset characters and the preset circuits.
Because the PCB board that current PCB manufacture craft formed is unfavorable for blood analysis and test, as shown in fig. 1, this application provides the manufacturing approach of a blood gas analysis test medical treatment board, and this method includes:
step 110: pasting a film on the production board, and forming an outer layer circuit pattern on the production board after exposure and development;
step 120: carrying out pattern electroplating on the production board, and plating a copper layer on the outer layer circuit pattern;
step 130: carrying out nickel-gold electroplating treatment on the production plate;
step 140: carrying out electric hard gold treatment on the production plate;
step 150: performing electro-platinum treatment on the production plate;
step 160: the ink-jet treatment was performed on the electrode PAD position on the production plate.
Specifically, the manufacturing method comprises the following processing procedures:
cutting: the core board is cut according to the size of the jointed board of 520mm multiplied by 620mm, the thickness of the core board is 1.2mm, and the thickness of the outer copper surface of the core board is 0.5 OZ. Transferring the inner layer pattern, coating a photosensitive film by using a vertical coating machine, controlling the film thickness of the photosensitive film to be 8 mu m, and completing the exposure of the inner layer circuit by using a full-automatic exposure machine and 5-6 exposure rulers (21 exposure rulers); etching the inner layer, etching the exposed and developed core board to form an inner layer circuit, wherein the line width of the inner layer is measured to be 3 mil; and (4) inner layer AOI, and then, detecting defects of an inner layer circuit, such as open short circuit, circuit notch, circuit pinhole and the like, and performing defect scrapping treatment, wherein a defect-free product is discharged to the next flow. And (3) laminating: the browning speed is that the core plate, the prepreg and the outer layer copper foil are sequentially laminated according to the requirement according to the browning of the bottom copper and the copper thickness, and then the laminated plate is pressed by selecting proper lamination conditions according to the Tg of the plate material to form a production plate 11;
drilling: according to the known drilling technique, the production plate 11 is drilled according to the design requirements. Copper deposition: the holes in the production plate 11 are metallized. Electroplating the whole plate: carrying out full-plate electroplating on the production plate 11 according to the prior art and the design requirements, and forming an outer layer of patterns: pasting a dry film on a production plate, adopting a full-automatic exposure machine and a positive film line film, completing outer layer line exposure by using 5-7 exposure rulers (21 exposure rulers), and forming an outer layer line pattern on the production plate through development. Pattern electroplating, then electroplating copper on the production board, setting electroplating parameters according to the required finished copper thickness, and forming a first copper layer 12 and a second copper layer 13 on the upper surface and the lower surface of the production board 11 as shown in figure 2 and combined with figure 3;
electroplating nickel-gold, performing surface treatment on a production board according to the prior art and design requirements, as shown in fig. 2, electroplating a first nickel-gold layer 14 on one side of a first copper layer 12, which is far away from the production board 11, through a nickel-gold electroplating process, electroplating a second nickel-gold layer 15 on one side of a second copper layer 13, which is far away from the production board 11, then electroplating a first hard gold layer 16 on one side of the first nickel-gold layer 14, which is far away from the first copper layer 12, electroplating a second hard gold layer 17 on one side of the second nickel-gold layer 15, which is far away from the second copper layer 13, electroplating a first platinum-gold layer 18 on one side of the first hard gold layer 16, which is far away from the first nickel-gold layer 14, and electroplating a second platinum-gold layer 19 on one side of the second hard gold layer 17, which is far away from the second nickel-gold layer 15;
and (3) electroplating post-treatment: the production plate 11 is sequentially subjected to steps of pressurized water washing, ultrasonic immersion washing, water column type washing, hot DI water washing, strong wind drying, drying (at the temperature of 80 ℃), hot wind drying and cooling, and is used for cleaning the surface of the platinum layer and drying the platinum layer;
outer layer etching: after the film is removed, etching an outer layer circuit on the production board through an etching process;
carrying out ink-jet treatment on the position of an electrode PAD on the production board, and then baking and washing the board; namely, a first ink-jet treatment 20 is carried out on the side of the first platinum-gold layer 18 facing away from the first hard-gold layer 16, and a second ink-jet treatment 21 is carried out on the side of the second platinum-gold layer 19 facing away from the second hard-gold layer 17;
solder resist and silk screen printing of characters: according to the prior art and according to design requirements, a solder mask is made on a production board and characters are silk-screened. Molding: according to the prior art and according to the design requirement, routing the shape, and obtaining the circuit board with the external tolerance of +/-0.05 mm. And (3) testing electrical performance: detecting the electrical performance of the circuit board, and enabling the qualified circuit board to enter the next processing link; FQC: and respectively measuring whether the appearance, the hole copper thickness, the dielectric layer thickness, the green oil thickness, the inner layer copper thickness and the like of the finished product meet the requirements of customers. And (4) packaging, namely hermetically packaging the finished plates according to the packaging mode and the packaging quantity required by the customer, putting a drying agent and a humidity card, and then delivering.
In summary, the process flow of the medical plate for analyzing and testing blood gas of the present invention is: cutting → drilling → removing the glue residue → copper plating → full plate plating → grinding plate → outer layer pattern → pattern plating nickel gold → washing plate → secondary dry film → washing plate → pattern electric hard gold → film withdrawal → tertiary dry film → washing plate → platinized gold → film withdrawal → outer layer etching → washing plate → etching QC → washing plate → ink jet (using heat curing ink processing) → baking plate → washing plate → character → testing → gong plate → V-CUT → washing plate-FQC → FQC → delivery.
According to the manufacturing method provided by the application, the surface treatment of the electrode PAD adopts the methods of copper-nickel-gold plating, hard-gold plating and platinum-gold plating, so that the purity of the gold layer is obviously improved, and the requirement of blood analysis and test is met; meanwhile, the ink-jet processing does not need exposure and development, so that the pollution of ink on the gold surface of the electrode PAD is avoided, compared with the original manual three-time screen printing processing, the manufacturing method disclosed by the invention has the advantages that the flow is optimized and reduced, the production efficiency of the product is improved, the concentricity of the ink-jet processing can be controlled within 25 mu m, and the quality of the product is further improved.
In some embodiments, the thickness of the Ni layer is controlled to be 118-196u 'and the thickness of the Au layer is controlled to be 2.5-3.5 u' in the Ni-Au electroplating treatment of the production plate in the application. Specifically, the copper-in-copper nickel-gold via copper requires 18um, and the copper plating parameters are as follows: 15ASF 60min, nickel layer thickness requirement 118-.
In some embodiments, the thickness of the electrofax is controlled to be 36.5-37.5u "in the electrofax treatment of the production sheet in the present application. Specifically, the gold thickness of the electric hard gold is required to be 37 u', the gold plating parameter is 12ASF for 6min, and the purity of the electroplated gold layer is more than 99.95%.
In some embodiments, the thickness of the electro-platinumretal is controlled to be 9.82-9.86u "in the electro-platinumretal treatment of the production plate herein. Specifically, the thickness of the platinum in the electro-platinum requires 9.84u ", the platinum plating parameter is 10ASF for 2min, and the purity of the electro-gold layer is more than 99.95%, so that the blood analysis test requirement can be met.
In some embodiments, the method herein further comprises, prior to ink jetting the electrode PAD locations on the production plate: and (3) deoiling the production plate by using an acidic deoiling agent, wherein the concentration of hydrochloric acid in the acidic deoiling agent is 100ml/L, and the temperature of the acidic deoiling agent is kept at 30-40 ℃.
In some embodiments, ink jet processing of electrode PAD locations on a production panel herein includes: jetting ink to the position of the electrode PAD on the production plate by an ink jetting device; thermally curing the ink; and baking the production board.
Specifically, pretreatment only has the pickling in this application, can not grind the board, follows up customer's drawing requirement and directly uses inkjet equipment + thermosetting printing ink + roast board processing to accomplish (do not need the exposure development), and the blood groove concentricity tolerance of inkjet processing electrode PAD position can be controlled within 25um to do not need the exposure development, electrode PAD can not be contaminated by printing ink in the blood groove.
In some embodiments, the method of making a blood gas analysis test medical plate of the present application further comprises: carrying out nickel and gold immersion treatment on the golden finger position on the production plate; windowing the golden finger position to expose the golden finger position; and carrying out electric thick gold treatment on the golden finger position on the production plate.
This application is through sinking nickel gold to the golden finger position and handling, continues the electric thick gold on the golden finger position again, can reduce process flow to can save the process of pasting the dry film or scribbling anti-electric gold printing ink in the current flow, thereby can avoid falling the dry film and pollute the golden face, move back the appearance of the incomplete, develop unclean, fall the appearance of phenomena such as anti-electric gold printing ink and get rid of the gold problem.
The invention further provides a PCB, wherein at least one circuit layer in the PCB is manufactured by adopting the manufacturing method of the blood gas analysis test medical board in any embodiment of the application.
The invention further provides terminal equipment, and the terminal equipment comprises the PCB board in the embodiment of the application.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A method for manufacturing a blood gas analysis test medical plate is characterized by comprising the following steps:
pasting a film on the production board, and forming an outer layer circuit pattern on the production board after exposure and development;
carrying out pattern electroplating on the production board, and plating a copper layer on the outer layer circuit pattern;
carrying out nickel-gold electroplating treatment on the production plate;
carrying out electric hard gold treatment on the production plate;
performing electro-platinum treatment on the production plate;
the ink-jet treatment was performed on the electrode PAD position on the production plate.
2. The method as claimed in claim 1, wherein the thickness of the nickel layer is controlled to 118-196u "and the thickness of the gold layer is controlled to 2.5-3.5 u" during the ni/au electroplating process.
3. The method of manufacturing a blood gas analysis test medical plate according to claim 1, wherein the thickness of the electro-hard gold is controlled to be 36.5-37.5u "in the electro-hard gold processing of the production plate.
4. The method for manufacturing a medical plate for blood gas analysis and test according to claim 1, wherein the thickness of the electro-platinum is controlled to be 9.82 to 9.86u "in the electro-platinum treatment of the production plate.
5. The method of claim 1, wherein prior to ink-jetting the electrode PAD locations on the production plate, the method further comprises:
and (3) deoiling the production plate by using an acidic deoiling agent, wherein the concentration of hydrochloric acid in the acidic deoiling agent is 100ml/L, and the temperature of the acidic deoiling agent is kept at 30-40 ℃.
6. The method of manufacturing a blood gas analysis test medical plate of claim 1, wherein the inkjet processing of the electrode PAD locations on the production plate comprises:
jetting ink to the position of the electrode PAD on the production plate by an ink jetting device;
thermally curing the ink;
and baking the production board.
7. The method of manufacturing a blood gas analysis test medical plate of claim 1, further comprising:
carrying out nickel and gold immersion treatment on the golden finger position on the production plate;
windowing the golden finger position to expose the golden finger position;
and carrying out electric thick gold treatment on the golden finger position on the production plate.
8. The method for manufacturing a medical board for blood gas analysis and test according to claim 1, wherein the production board is a multi-layer board formed by laminating an inner core board and an outer copper foil together by a prepreg, and the production board is subjected to copper deposition and full-board electroplating.
9. A PCB board, wherein at least one circuit layer in the PCB board is manufactured by the manufacturing method of the blood gas analysis test medical board as claimed in any one of claims 1 to 8.
10. A terminal device characterized in that it comprises a PCB board according to claim 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210618085.4A CN114900970A (en) | 2022-06-01 | 2022-06-01 | Manufacturing method of blood gas analysis and test medical board, PCB and terminal equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210618085.4A CN114900970A (en) | 2022-06-01 | 2022-06-01 | Manufacturing method of blood gas analysis and test medical board, PCB and terminal equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114900970A true CN114900970A (en) | 2022-08-12 |
Family
ID=82726480
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210618085.4A Pending CN114900970A (en) | 2022-06-01 | 2022-06-01 | Manufacturing method of blood gas analysis and test medical board, PCB and terminal equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114900970A (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102098880A (en) * | 2011-02-18 | 2011-06-15 | 深南电路有限公司 | Surface processing method of PCB (printed circuit board) |
| KR20130033851A (en) * | 2011-09-27 | 2013-04-04 | 주식회사 아모그린텍 | Multi layer pcb and manufacturing method thereof |
| CN104284520A (en) * | 2014-09-29 | 2015-01-14 | 江门崇达电路技术有限公司 | PCB surface treatment method |
| CN104717826A (en) * | 2013-12-17 | 2015-06-17 | 深圳崇达多层线路板有限公司 | Method for manufacturing gold-plated circuit board and gold-plated circuit board |
| WO2015085933A1 (en) * | 2013-12-11 | 2015-06-18 | 广州兴森快捷电路科技有限公司 | Method for manufacturing leadless printed circuit board locally plated with hard gold |
| CN108668459A (en) * | 2018-05-22 | 2018-10-16 | 深圳崇达多层线路板有限公司 | A kind of printed board Novel electric platinum surface treatment method |
| CN108925061A (en) * | 2018-07-31 | 2018-11-30 | 王俊 | A kind of production method of PCB soldermask layer |
| CN109688719A (en) * | 2019-01-29 | 2019-04-26 | 深圳市迅捷兴科技股份有限公司 | The production method that thick golden plate is plated in part |
| CN215517681U (en) * | 2021-08-26 | 2022-01-14 | 广东通元精密电路有限公司 | PCB nickel-gold plating production line |
| CN114148108A (en) * | 2021-11-26 | 2022-03-08 | 东莞市启思达智能技术有限公司 | Efficient ink-jet method and system |
-
2022
- 2022-06-01 CN CN202210618085.4A patent/CN114900970A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102098880A (en) * | 2011-02-18 | 2011-06-15 | 深南电路有限公司 | Surface processing method of PCB (printed circuit board) |
| KR20130033851A (en) * | 2011-09-27 | 2013-04-04 | 주식회사 아모그린텍 | Multi layer pcb and manufacturing method thereof |
| WO2015085933A1 (en) * | 2013-12-11 | 2015-06-18 | 广州兴森快捷电路科技有限公司 | Method for manufacturing leadless printed circuit board locally plated with hard gold |
| CN104717826A (en) * | 2013-12-17 | 2015-06-17 | 深圳崇达多层线路板有限公司 | Method for manufacturing gold-plated circuit board and gold-plated circuit board |
| CN104284520A (en) * | 2014-09-29 | 2015-01-14 | 江门崇达电路技术有限公司 | PCB surface treatment method |
| CN108668459A (en) * | 2018-05-22 | 2018-10-16 | 深圳崇达多层线路板有限公司 | A kind of printed board Novel electric platinum surface treatment method |
| CN108925061A (en) * | 2018-07-31 | 2018-11-30 | 王俊 | A kind of production method of PCB soldermask layer |
| CN109688719A (en) * | 2019-01-29 | 2019-04-26 | 深圳市迅捷兴科技股份有限公司 | The production method that thick golden plate is plated in part |
| CN215517681U (en) * | 2021-08-26 | 2022-01-14 | 广东通元精密电路有限公司 | PCB nickel-gold plating production line |
| CN114148108A (en) * | 2021-11-26 | 2022-03-08 | 东莞市启思达智能技术有限公司 | Efficient ink-jet method and system |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN100508692C (en) | Method of fabricating printed circuit board having thin core layer | |
| TWI406614B (en) | Printed wiring substrate and producing method thereof | |
| CN104486910A (en) | Method used for manufacturing multi-layer circuit board by employing 3D printing technology | |
| CN104363720A (en) | Method of forming deep blind groove in printed circuit board (PCB) | |
| CN111511120B (en) | Raided Pad manufacturing method | |
| CN104883820B (en) | A kind of outer-layer circuit production method of the structure asymmetry backboard of warpage | |
| CN109587968A (en) | One kind preventing consent or the undesirable PCB production method of plated hole | |
| CN111867266A (en) | Circuit design method for preventing short circuit of isolated circuit of PCB | |
| CN106028665B (en) | Tin plating process capability test method | |
| CN114900970A (en) | Manufacturing method of blood gas analysis and test medical board, PCB and terminal equipment | |
| CN110545633A (en) | Manufacturing method of circuit board of blind hole plug-in | |
| CN112533399A (en) | PCB metallization half-hole manufacturing process | |
| CN111741615B (en) | Method for pressing and filling glue of blind hole with high thickness-diameter ratio | |
| CN105517373A (en) | Manufacture method of outer-layer line pattern of PCB backplane | |
| CN105555040B (en) | A kind of production method for the PCB that outer graphics and bore position precision can be improved | |
| CN115243478A (en) | Manufacturing method of butterfly-shaped rigid-flex board | |
| CN114040577A (en) | Manufacturing method and testing method of PCB (printed circuit board) | |
| CN111315141B (en) | Method for manufacturing explosion-proof plate of thick plate and thick copper plate, thick plate and thick copper plate | |
| KR101513404B1 (en) | Method of manufacturing multilayer wiring substrate, and multilayer wiring substrate | |
| CN113891578A (en) | HDI board manufacturing method for local electroplating hole filling and HDI board | |
| CN103582306A (en) | Printed circuit board manufacturing method | |
| CN117042317B (en) | Surface conducting layer removing method in circuit board processing, circuit board and processing method thereof | |
| CN113923870B (en) | Circuit board preparation method | |
| CN115767955A (en) | Multilayer circuit board preparation method, multilayer circuit board and copper deposition defect detection method | |
| CN116441180A (en) | Manufacturing process of high-performance circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |