CN114040577A - Manufacturing method and testing method of PCB (printed circuit board) - Google Patents
Manufacturing method and testing method of PCB (printed circuit board) Download PDFInfo
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- CN114040577A CN114040577A CN202111259438.8A CN202111259438A CN114040577A CN 114040577 A CN114040577 A CN 114040577A CN 202111259438 A CN202111259438 A CN 202111259438A CN 114040577 A CN114040577 A CN 114040577A
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- 238000012360 testing method Methods 0.000 title claims abstract description 95
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 30
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 32
- 238000000034 method Methods 0.000 claims description 27
- 239000002585 base Substances 0.000 claims description 25
- 239000011889 copper foil Substances 0.000 claims description 18
- 239000000523 sample Substances 0.000 claims description 18
- 229910052802 copper Inorganic materials 0.000 claims description 14
- 239000010949 copper Substances 0.000 claims description 14
- 230000008569 process Effects 0.000 claims description 12
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 9
- 230000000694 effects Effects 0.000 claims description 9
- 238000009434 installation Methods 0.000 claims description 8
- 238000004140 cleaning Methods 0.000 claims description 6
- 238000005553 drilling Methods 0.000 claims description 6
- 239000003513 alkali Substances 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims description 3
- 230000001678 irradiating effect Effects 0.000 claims description 3
- 238000003475 lamination Methods 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 230000008901 benefit Effects 0.000 abstract description 4
- 238000002360 preparation method Methods 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/162—Testing a finished product, e.g. heat cycle testing of solder joints
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/166—Alignment or registration; Control of registration
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Tests Of Electronic Circuits (AREA)
Abstract
The invention relates to the technical field of PCB manufacturing, and discloses a manufacturing method and a testing method of a PCB circuit board. According to the manufacturing method and the testing method of the PCB, the movable block is pushed to move in the movable groove by controlling the linear motor, the fixed rods move along with the movable block, when the two fixed rods are relatively close to each other, the PCB can be placed between the two fixed rods through the movable block, four corners of the PCB are placed at the four rubber blocks, the limiting spring located in the limiting groove can drive the limiting block to move towards the middle part, the rubber blocks are utilized to clamp the PCB, the two sides of the PCB can be conveniently processed simultaneously, and therefore the advantage that the two sides of the PCB can be processed simultaneously is achieved.
Description
Technical Field
The invention relates to the technical field of PCB manufacturing, in particular to a manufacturing method and a testing method of a PCB circuit board.
Background
A PCB, i.e., a printed wiring board, which is called a printed board for short, is one of important parts in the electronic industry. Almost every kind of electronic equipment, as small as electronic watches, calculators, as large as computers, communication electronics, military weaponry systems, has electronic components such as integrated circuits, and printed boards are used to electrically interconnect the various components. The printed circuit board consists of an insulating bottom plate, a connecting lead and a welding disc for assembling and welding electronic elements, and has double functions of a conductive circuit and the insulating bottom plate. The circuit can replace complex wiring to realize electrical connection among elements in the circuit, thereby simplifying the assembly and welding work of electronic products, reducing the wiring workload in the traditional mode and greatly lightening the labor intensity of workers; and the volume of the whole machine is reduced, the product cost is reduced, and the quality and the reliability of the electronic equipment are improved. The printed circuit board has good product consistency, can adopt standardized design, and is beneficial to realizing mechanization and automation in the production process. Meanwhile, the whole printed circuit board subjected to assembly and debugging can be used as an independent spare part, so that the exchange and maintenance of the whole product are facilitated. At present, printed wiring boards have been used very widely in the manufacture of electronic products.
The PCB circuit board needs to go through multiple processes such as preparation and test in the production process, generally all need corresponding making devices and testing arrangement and use different methods to realize preparation and test in preparation and test process, the PCB board among the prior art generally need place on the workstation and use outside instrument or device to make it in the preparation process, but the workstation among the prior art only can process the one side of PCB board part when using, and along with the continuous development of PCB technique, current PCB board most all is two-sided circuit board, can't accomplish the two-sided simultaneous processing of PCB board when adopting traditional workstation to add man-hour, the practicality is lower.
Along with the improvement of PCB board integrated level, current PCB board often can use the design of double-deck mainboard, is about to divide into two mainboards and goes up the lower plate and pass through the welding integration together, though this kind of manufacturing approach can show the integrated level that improves the PCB board and reduce the area of PCB board, but the PCB produces the condition that the layering perk appears in the easy high temperature that leads to of long-time back of using, influences product quality.
After a PCB manufacturing technology, a PCB is often required to be detected to perform subsequent surface mounting work, a test probe is generally used to test each circuit of the PCB to test the connectivity of the circuit in the conventional detection method, but the conventional test method is to manually place the PCB on a test board and test the PCB by using a test probe, a large amount of manpower is required to be consumed to perform feeding and taking of the test in a large batch of PCB test processes, and the automation degree is low.
Disclosure of Invention
The invention provides a manufacturing method and a testing method of a PCB (printed circuit board), which have the advantages of capability of simultaneously processing two sides, capability of reducing the possibility of PCB separation warping and simpler testing process, and solves the problems in the background technology.
The invention provides the following technical scheme: the manufacturing method and the testing method of the PCB comprise an installation base and a testing base, wherein movable grooves are formed in the front side and the rear side of the top end of the installation base, movable blocks are symmetrically and movably installed in the movable grooves, fixed rods are fixedly installed at the top ends of the movable blocks and located in the two movable grooves, limiting grooves are formed in the end, close to the fixed rods, of each fixed rod, limiting blocks are symmetrically and movably installed in the limiting grooves, rubber blocks are fixed at the other ends of the limiting blocks, limiting springs located in the limiting grooves are fixedly installed at one ends of the limiting blocks, and one ends of the limiting springs are fixedly connected with the other ends of the limiting grooves.
The manufacturing method of the PCB comprises the following steps:
s1: firstly, PCB layout is designed by utilizing PCB design software, printed on paper by a laser machine and then transferred to a copper-clad plate.
S2: promote the movable block through control linear electric motor and remove at the activity inslot portion, the dead lever removes thereupon this moment, and the accessible is placed the copper-clad plate between two dead levers when two dead levers are close to relatively to make four angles of copper-clad plate place in four rubber blocks departments, the spacing spring that lies in spacing inslot portion this moment can drive the stopper and remove towards the middle part, and utilize the rubber block to press from both sides tightly the copper-clad plate.
S3: and the upper surface and the lower surface of the copper-clad plate are simultaneously cleaned by adopting an external cleaning device, the surface of the copper-clad plate is covered with a photosensitive film, and a plurality of copper-clad plates are adopted for stacking to ensure that the stacking position of the copper-clad plates is accurate.
S4: and irradiating the photosensitive film on the copper foil by using a UV lamp on the photosensitive machine, curing the photosensitive film under the transparent film, and curing the copper foil covered under the cured photosensitive film to obtain the required PCB layout circuit.
S5: and cleaning the uncured photosensitive film by using alkali liquor, covering the required copper foil circuit with the cured photosensitive film, then etching the unnecessary copper foil by using NaOH, and finally tearing off the cured photosensitive film to expose the required copper foil of the PCB layout circuit.
S6: drilling holes at four corners of the PCB by using a drilling machine, inserting copper columns at the corner holes, attaching an upper layer PCB and a lower layer PCB by using a prepreg, then sending the upper layer PCB and the lower layer PCB into a vacuum hot press for lamination, melting epoxy resin in the prepreg at high temperature in the vacuum hot press, and fixing the core plates and the copper foils together under pressure.
Preferably, the length of the copper column is the same as the thickness of the PCB, and the upper end and the lower end of the copper column are respectively welded with the upper end and the lower end of the PCB.
Preferably, the cylinder is installed to both sides are inlayed around the test base bottom, the equal fixed mounting in top of cylinder has test platform, test base's top fixed mounting has the frame.
Preferably, the equal distance movable mounting of one end that the frame medial surface is close to relatively has the driving roller, the belt has been cup jointed in the lateral surface activity of driving roller, test platform is located between two belts and does not contact with the belt.
Preferably, the mounting groove has been seted up on the top of frame, the inside movable mounting of mounting groove has the ejector pin, the top fixed mounting of ejector pin has the handle, the bottom fixed mounting of ejector pin has the test probe that is located the test platform top.
A manufacturing method and a testing method of a PCB circuit board comprise the following testing steps:
s1: the PCB is conveyed to a belt on the test base through an external conveyor belt, and the PCB is moved upwards to be positioned above the belt and below the test probe by controlling the air cylinder to move upwards to push the test platform to ascend.
S2: and selecting a proper test probe and clamping the test probe with the mounting groove, and testing the surface circuit of the PCB by using the side-looking probe.
S3: after the test is finished, the air cylinder is controlled to move downwards, and when the test platform and the belt are in parallel relation, the PCB can be placed on the belt and is conveyed to discharge to finish a test process. The invention has the following beneficial effects:
1. the PCB circuit board manufacturing method and the PCB circuit board testing method are characterized in that the PCB circuit board manufacturing method comprises an installation base, movable grooves are formed in the front side and the rear side of the installation base, the movable grooves are movably clamped between the movable blocks and the movable grooves, fixed rods are fixed at the top ends of the movable blocks, when the PCB needs to be machined, the movable blocks can be pushed to move inside the movable grooves through the linear motors, the fixed rods move along with the movable grooves, when the two fixed rods are relatively close to each other, the PCB can be placed between the two fixed rods through the fixed rods, four corners of the PCB are placed at the four rubber blocks, limiting springs located inside the limiting grooves can drive the limiting blocks to move towards the middle portion, the rubber blocks are utilized to clamp the PCB, the two sides of the PCB are conveniently machined simultaneously, and the advantage that the two sides of the PCB can be machined simultaneously is achieved.
2. According to the manufacturing method and the testing method of the PCB, the four corners of the PCB are punched, the copper columns are inserted into the punched holes, the length of each copper column is equal to the thickness of the PCB, the copper columns and the upper end and the lower end of the PCB are welded and fixed, when the PCB is in high temperature, the copper columns located in the hole positions can prevent an adhesion meter between the two layers of PCBs from loosening due to the fact that the copper columns are tightly welded with the PCB, the PCB is prevented from being separated from a warped plate, and therefore the PCB can be prevented from being separated from the warped plate.
3. According to the manufacturing method and the testing method of the PCB, the cylinder is fixed at the top end of the testing base, the testing platform is fixed at the top end of the cylinder, the transmission roller is movably installed on the inner side of the testing base, the belt is sleeved on the outer side face of the transmission roller, when the PCB needs to be tested, the PCB can be conveyed to the belt on the testing base through the external conveying belt, the PCB is moved upwards to be located above the belt and below the testing probes by controlling the cylinder to move upwards to push the testing platform to ascend, the PCB is tested by selecting the appropriate testing probes, the cylinder is controlled to move downwards after the test is finished, when the testing platform and the belt are in a parallel relation, the PCB can be placed on the belt and is conveyed and discharged to complete a testing process, and therefore the advantage that the testing process is simple is achieved.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is an exploded view of the retaining bar structure of the present invention;
FIG. 3 is an exploded view of the stop block structure of the present invention;
FIG. 4 is an exploded view of the ejector pin structure of the present invention;
fig. 5 is an enlarged schematic view of the structure at a in fig. 3.
In the figure: 1. installing a base; 2. testing the base; 3. a movable groove; 4. a movable block; 5. fixing the rod; 6. a linear motor; 7. a limiting groove; 8. a limiting spring; 9. a limiting block; 10. a rubber block; 11. a frame; 12. mounting grooves; 13. a top rod; 14. testing the probe; 15. a handle; 16. a cylinder; 17. a test platform; 18. a driving roller; 19. a belt.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-5, a method for manufacturing a PCB circuit board and a method for testing the same include an installation base 1 and a test base 2, wherein the front side and the rear side of the top end of the installation base 1 are respectively provided with a movable groove 3, the movable grooves 3 are symmetrically and movably provided with movable blocks 4, the top ends of the two movable blocks 4 positioned inside the two movable grooves 3 are respectively and fixedly provided with a fixed rod 5, one end of the fixed rod 5, which is relatively close to the fixed rod, is respectively provided with a limiting groove 7, the inside of the limiting groove 7 is respectively and symmetrically and movably provided with a limiting block 9, the other end of the limiting block 9 is fixed with a rubber block 10, one end of the limiting block 9 is fixedly provided with a limiting spring 8 positioned inside the limiting groove 7, and one end of the limiting spring 8 is fixedly connected with the other end of the limiting groove 7.
The manufacturing method of the PCB comprises the following steps:
s1: firstly, PCB layout is designed by utilizing PCB design software, printed on paper by a laser machine and then transferred to a copper-clad plate.
S2: promote the movable block 4 through control linear electric motor 6 and remove in the inside of activity groove 3, dead lever 5 removes along with it this moment, and the accessible is placed the copper-clad plate between two dead levers 5 when two dead levers 5 are close to relatively to make four angles of copper-clad plate place in four rubber blocks 10 departments, be located spacing spring 8 of 7 inside of spacing grooves this moment and can drive stopper 9 and remove towards the middle part, and utilize rubber block 10 to press from both sides tightly the copper-clad plate.
S3: and the upper surface and the lower surface of the copper-clad plate are simultaneously cleaned by adopting an external cleaning device, the surface of the copper-clad plate is covered with a photosensitive film, and a plurality of copper-clad plates are adopted for stacking to ensure that the stacking position of the copper-clad plates is accurate.
S4: and irradiating the photosensitive film on the copper foil by using a UV lamp on the photosensitive machine, curing the photosensitive film under the transparent film, and curing the copper foil covered under the cured photosensitive film to obtain the required PCB layout circuit.
S5: and cleaning the uncured photosensitive film by using alkali liquor, covering the required copper foil circuit with the cured photosensitive film, then etching the unnecessary copper foil by using NaOH, and finally tearing off the cured photosensitive film to expose the required copper foil of the PCB layout circuit.
S6: drilling holes at four corners of the PCB by using a drilling machine, inserting copper columns at the corner holes, attaching an upper layer PCB and a lower layer PCB by using a prepreg, then sending the upper layer PCB and the lower layer PCB into a vacuum hot press for lamination, melting epoxy resin in the prepreg at high temperature in the vacuum hot press, and fixing the core plates and the copper foils together under pressure.
The length of the copper column is the same as the thickness of the PCB, and the upper end and the lower end of the copper column are welded with the upper end and the lower end of the PCB respectively.
Wherein, the cylinder 16 is inlayed and is installed to both sides around the test base 2 bottom, and the equal fixed mounting in top of cylinder 16 has test platform 17, and the top fixed mounting of test base 2 has frame 11.
Wherein, the equal distance movable mounting of one end that the inside surface of frame 11 is close to relatively has driving roller 18, and the outside surface activity of driving roller 18 has cup jointed belt 19, and test platform 17 is located between two belt 19 and does not contact with belt 19.
Wherein, the top of frame 11 has seted up mounting groove 12, and the inside movable mounting of mounting groove 12 has ejector pin 13, and the top fixed mounting of ejector pin 13 has handle 15, and the bottom fixed mounting of ejector pin 13 has test probe 14 that is located test platform 17 top.
A manufacturing method and a testing method of a PCB circuit board comprise the following testing steps:
s1: the PCB is transported by an external conveyor belt to a belt 19 on the test base 2 and the test platform 17 is raised by controlling the air cylinder 16 to move up so that the PCB moves up above the belt 19 and below the test probes 14.
S2: at this time, the proper test probe 14 is selected and clamped with the mounting groove 12, and the test of the PCB surface circuit is completed by using the side-looking probe.
S3: after the test is finished, the air cylinder 16 is controlled to move downwards, when the test platform 17 and the belt 19 are in a parallel relation, the PCB can be placed on the belt 19, and the PCB is conveyed and discharged to finish a test process.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. A PCB circuit board manufacturing method and a PCB circuit board testing method comprise an installation base (1) and a testing base (2), and are characterized in that: activity groove (3) have all been seted up to both sides around installation base (1) top, the equal symmetrical movable mounting in inside of activity groove (3) has movable block (4), is located two inside activity groove (3) the equal fixed mounting in top of movable block (4) has dead lever (5), spacing groove (7) have all been seted up to the one end that dead lever (5) are close to relatively, the equal symmetrical movable mounting in inside of spacing groove (7) has stopper (9), the other end of stopper (9) is fixed with rubber block (10), the one end fixed mounting of stopper (9) has spacing spring (8) that are located inside of spacing groove (7), the one end of spacing spring (8) and the other end fixed connection of spacing groove (7).
The manufacturing method of the PCB comprises the following steps:
s1: firstly, PCB layout is designed by utilizing PCB design software, printed on paper by a laser machine and then transferred to a copper-clad plate.
S2: promote movable block (4) through control linear electric motor (6) and remove in activity groove (3) inside, dead lever (5) remove thereupon this moment, accessible is placed the copper-clad plate between two dead levers (5) when two dead levers (5) are close to relatively, and make four angles of copper-clad plate place in four rubber block (10) departments, spacing spring (8) that lie in spacing groove (7) inside this moment can drive stopper (9) and remove towards the middle part, and utilize rubber block (10) to press from both sides tightly the copper-clad plate.
S3: and the upper surface and the lower surface of the copper-clad plate are simultaneously cleaned by adopting an external cleaning device, the surface of the copper-clad plate is covered with a photosensitive film, and a plurality of copper-clad plates are adopted for stacking to ensure that the stacking position of the copper-clad plates is accurate.
S4: and irradiating the photosensitive film on the copper foil by using a UV lamp on the photosensitive machine, curing the photosensitive film under the transparent film, and curing the copper foil covered under the cured photosensitive film to obtain the required PCB layout circuit.
S5: and cleaning the uncured photosensitive film by using alkali liquor, covering the required copper foil circuit with the cured photosensitive film, then etching the unnecessary copper foil by using NaOH, and finally tearing off the cured photosensitive film to expose the required copper foil of the PCB layout circuit.
S6: drilling holes at four corners of the PCB by using a drilling machine, inserting copper columns at the corner holes, attaching an upper layer PCB and a lower layer PCB by using a prepreg, then sending the upper layer PCB and the lower layer PCB into a vacuum hot press for lamination, melting epoxy resin in the prepreg at high temperature in the vacuum hot press, and fixing the core plates and the copper foils together under pressure.
2. The method for manufacturing and testing the PCB circuit board according to claim 1, wherein the method comprises the following steps: the length of the copper column is the same as the thickness of the PCB, and the upper end and the lower end of the copper column are respectively welded with the upper end and the lower end of the PCB.
3. The method for manufacturing and testing the PCB circuit board according to claim 1, wherein the method comprises the following steps: both sides are inlayed around test base (2) bottom and are installed cylinder (16), the equal fixed mounting in top of cylinder (16) has test platform (17), the top fixed mounting of test base (2) has frame (11).
4. The method for manufacturing and testing the PCB circuit board according to claim 3, wherein the method comprises the following steps: the equal distance movable mounting of one end that frame (11) medial surface is close to relatively has driving roller (18), belt (19) have been cup jointed in the lateral surface activity of driving roller (18), test platform (17) are located between two belt (19) and do not contact with belt (19).
5. The method for manufacturing and testing the PCB circuit board according to claim 3, wherein the method comprises the following steps: mounting groove (12) have been seted up on the top of frame (11), the inside movable mounting of mounting groove (12) has ejector pin (13), the top fixed mounting of ejector pin (13) has handle (15), the bottom fixed mounting of ejector pin (13) has test probe (14) that are located test platform (17) top.
6. The method for manufacturing and testing the PCB circuit board according to the claims 1-5, characterized in that: comprises the following testing steps:
s1: the PCB is conveyed to a belt (19) on a test base (2) through an external conveyor belt, and the PCB is moved upwards to be positioned above the belt (19) and below a test probe (14) by controlling a cylinder (16) to move upwards to push a test platform (17) to ascend.
S2: at the moment, a proper test probe (14) is selected and clamped with the mounting groove (12), and the PCB surface circuit test is completed by using the side-looking probe.
S3: after the test is finished, the air cylinder (16) is controlled to move downwards, and when the test platform (17) and the belt (19) are in a parallel relation, the PCB can be placed on the belt (19) and is conveyed and discharged to finish a test process.
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN115056295A (en) * | 2022-08-18 | 2022-09-16 | 晶通(高邮)集成电路有限公司 | Drilling equipment for producing integrated circuit board based on buoyancy propelling type |
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US20040075456A1 (en) * | 2002-10-18 | 2004-04-22 | Zhao Yue Qing | Test fixture for printed circuit board assembly |
CN109819594A (en) * | 2019-03-13 | 2019-05-28 | 淮安特创科技有限公司 | PCB circuit board fixes process equipment |
CN213240407U (en) * | 2020-08-06 | 2021-05-18 | 苏州杰林特电子科技有限公司 | PCB circuit on-off testing device |
CN212544188U (en) * | 2020-08-24 | 2021-02-12 | 武平县骏达电子科技有限公司 | Fixing device for exposure processing of circuit board |
CN112055467A (en) * | 2020-09-10 | 2020-12-08 | 丰顺县锦顺科技有限公司 | Method for intelligently improving high efficiency of circuit board processing |
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CN115056295A (en) * | 2022-08-18 | 2022-09-16 | 晶通(高邮)集成电路有限公司 | Drilling equipment for producing integrated circuit board based on buoyancy propelling type |
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