CN107484358B - It is a kind of without pressing the manufacturing method of multi-layer circuit board without drilling - Google Patents
It is a kind of without pressing the manufacturing method of multi-layer circuit board without drilling Download PDFInfo
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- CN107484358B CN107484358B CN201710620150.6A CN201710620150A CN107484358B CN 107484358 B CN107484358 B CN 107484358B CN 201710620150 A CN201710620150 A CN 201710620150A CN 107484358 B CN107484358 B CN 107484358B
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- layer circuit
- copper
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- plate
- board
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
Abstract
The invention discloses a kind of without manufacturing method of multi-layer circuit board of the pressing without drilling, comprising the following steps: internal layer circuit is made on core plate；It is filled and led up between internal layer circuit with megohmite insulant；Then heavy copper and electric plating of whole board process are carried out to core plate, forms a laminate electrolytic copper layer on internal layer circuit；Outer-layer circuit is made on plate electrolytic copper layer with positive blade technolgy, etches away the plate electrolytic copper layer of non-outer layer circuit pack during making outer-layer circuit；Successively after production solder mask, surface treatment and molding, multilayer circuit board is made in core plate.The method of the present invention is during making multilayer circuit board without drilling, it can be avoided wiring board and CAF phenomenon occur, and reduce the process of de-smear, prevent chemical article from polluting environment, the production cost for reducing wiring board, production efficiency can be effectively improved by optimizing production procedure.
Description
Technical field
The present invention relates to printed wiring board manufacture technology fields, and in particular to a kind of without multilayer circuit board of the pressing without drilling
Production method.
Background technique
As electronic equipment is also rapidly developed to miniaturization, lightweight while improving function and performance, so that print
The route of wiring board processed is also increasingly thinner, and spacing is smaller and smaller, and insulating layer is more and more thinner, bore size also Xiang Geng little closeer side
To development, and due to the promotion of information transfer rate and for the sake of reducing fever, so that the work that printed wiring board is born
A possibility that temperature rises constantly, everything both increases the formation of CAF phenomenon.
CAF (Conductive Anodic Filamentation conductive anodic silk) be can cause electric short circuit or
The by-product of the electrochemical corrosion course of open circuit；It usually occur between via hole and via hole, between via hole and inside and outside sandwich circuit,
Between outer layer conductor, between inner conductor, so that decreasing insulating between two adjacent conductors be caused even to cause short circuit.
CAF's primarily forms reason are as follows: the PP piece as used in printed wiring board is by glass braid into glass
Cloth is made after then applying epoxy resin semi-solid preparation, and the adhesive force between epoxy resin and glass cloth is insufficient, or parent's colloidality when impregnation
It is bad, it is easy to appear gap between the two, and in printed wiring board manufacturing process, when carrying out drilling operating, due to tangential
The effect of pulling force and longitudinal impact force further destroys the bonding force of resin, adds the gap between epoxy resin and glass cloth
Greatly, when carrying out subsequent heavy copper step, if two hole potentials being closer are different, anode portion copper ion is under voltage driving
It is migrated by the gap in PP piece to cathode, forms CAF between two via holes, caused short-circuit between via hole and via hole.
There are also be exactly printed circuit board drill hole later need to carry out de-smear process, but be easy to appear hole wall handle it is not clean
Situation, and use chemical article de-smear, be easy pollution environment and make the high production cost of printed wiring board.
Summary of the invention
For existing line plate, be easy to produce CAF phenomenon between Kong Yukong causes line short to the present invention in the production process
The problem of pollution environment is easy during with de-smear, provide it is a kind of without manufacturing method of multi-layer circuit board of the pressing without drilling, should
Method, without drilling, can be avoided wiring board and CAF phenomenon occur, and reduce de-smear during making multilayer circuit board
Process, prevent chemical article pollute environment, reduce the production cost of wiring board, life can be effectively improved by optimizing production procedure
Produce efficiency.
In order to solve the above-mentioned technical problems, the present invention provides a kind of without multilayer circuit board production side of the pressing without drilling
Method, comprising the following steps:
S1, production internal layer circuit: internal layer circuit is made on core plate；
S2, filling megohmite insulant: it is filled and led up between internal layer circuit with insulant；
S3, heavy copper, electric plating of whole board: and then heavy copper, electric plating of whole board process are carried out to core plate, one layer is formed on internal layer circuit
Plate electrolytic copper layer；
S4, production outer-layer circuit: making outer-layer circuit on plate electrolytic copper layer with positive blade technolgy, in production outer-layer circuit process
It is middle to etch away the plate electrolytic copper layer of non-outer layer circuit pack；
S5, rear process: successively after production solder mask, surface treatment and molding, wiring board is made in core plate.
Preferably, between step S2 and S3, further include step S21, baking sheet: core plate is toasted, by the insulation
Substance solidification.
Preferably, the parameter of the baking sheet is to toast 50-80min in 145-155 degree.
It preferably, further include step S22, nog plate between step S21 and S3: by the insulant on internal layer circuit copper face
Matter is ground off.
Preferably, for different layers of wiring boards are needed, can continue to be superimposed line layer according to actual needs, i.e., in step
Between S4 and step S5, step S2 to S4 is repeated, until reaching the required number of plies.
Preferably, the core plate is single-side coated copper plate or double face copper.
Preferably, the megohmite insulant is resin.
Compared with prior art, the invention has the following beneficial effects:
After core plate makes internal layer circuit, megohmite insulant is filled between internal layer circuit and toasts core plate makes absolutely the present invention
The solidification of edge substance, is then not required to the process for being drilled and being pressed, and directly carries out heavy copper and electric plating of whole board process, the shape on core plate
At a laminate electrolytic copper layer, outer-layer circuit is made by positive blade technolgy on plate electrolytic copper layer later, during making outer-layer circuit
The plate electrolytic copper layer of non-outer layer circuit pack is etched away, process, which is handled, after finally carrying out again is made route board finished product；Side of the present invention
Method during making multilayer circuit board without drilling, the case where can be avoided bring CAF phenomenon when sinking copper after drill process,
And reduce the process of de-smear, because not needing to remove the glue residue on hole wall using chemical method, avoid chemical article dirt
Environment is contaminated, and can effectively reduce the production cost of wiring board, reduces the process of drilling, de-smear and pressing, optimizes production
Process can effectively improve the production efficiency of wiring board.
Detailed description of the invention
Fig. 1 is the schematic diagram for forming plate electrolytic copper layer in embodiment 1 on core plate；
Fig. 2 is the schematic diagram of wiring board in embodiment 1；
Fig. 3 is wiring board schematic diagram in embodiment 2；
Fig. 4 is wiring board schematic diagram in embodiment 3.
Specific embodiment
In order to more fully understand technology contents of the invention, below in conjunction with the accompanying drawings and the specific embodiments to of the invention
Technical solution is described further and illustrates.
Embodiment 1
As depicted in figs. 1 and 2, shown in the present embodiment it is a kind of without pressing the manufacturing method of multi-layer circuit board without drilling, according to
Secondary includes following treatment process: sawing sheet → production internal layer circuit → filling megohmite insulant → baking sheet → abrasive belt grinding → electric plating of whole board
→ production outer-layer circuit → welding resistance → silk-screen character → heavy nickel gold → molding → electric performance test → final inspection, specific steps are such as
Under:
(1), sawing sheet: core plate 1 is outputed by jigsaw size 320mm × 420mm, core plate is single-side coated copper plate.
(2), make internal layer circuit (negative film technique): inner figure transfer is coated with light-sensitive surface, light-sensitive surface with vertical application machine
8 μm of film thickness monitoring, using Full-automatic exposure machine, internal layer circuit 2 is completed with 5-6 lattice exposure guide rule (21 lattice exposure guide rule) and is exposed；It is interior
Core plate after exposure development is etched line pattern by layer etching, and it is 3mil that internal layer line width, which measures,；Internal layer AOI, then in inspection
The defects of opening short circuit, route notch, route pin hole of sandwich circuit 2, defective to scrap processing, flawless product goes out to lower one stream
Journey.
(3), it fills megohmite insulant: filling megohmite insulant 4 between internal layer circuit using stencil printing and fill and lead up；Wherein
Megohmite insulant 4 can be resin, also can also be other insulating materials.
(4), baking sheet: core plate 1 being placed in 145-155 degree and toasts 50-80min, and megohmite insulant 4 is solidified.
(5), abrasive belt grinding: the megohmite insulant 4 on 2 copper face of internal layer circuit is ground off, and exposes 2 copper face of internal layer circuit.
(6), heavy copper: carrying out heavy copper process makes plate face metallize, and backlight tests 9.5 grades.
(7), with the current density electric plating of whole board 20min of 1.8ASD, one layer of 5- electric plating of whole board: is formed on internal layer circuit 2
The plate electrolytic copper layer 3 of 10 μ m-thicks.
(8), outer-layer circuit (positive blade technolgy) is made: outer graphics transfer, it is luxuriant and rich with fragrance using Full-automatic exposure machine and positive route
Woods completes outer-layer circuit exposure with 5-7 lattice exposure guide rule (21 lattice exposure guide rule), developed, forms outer-layer circuit on plate electrolytic copper layer
Figure；Outer graphics plating, then distinguishes copper facing and tin plating, copper facing is with the full plate of the current density of 1.8ASD on plate electrolytic copper layer
60min is electroplated, face copper is added and is plating to 4OZ thickness, tin plating is that 10min, 3-5 μm of tin thickness is electroplated with the current density of 1.2ASD；Then
Film is successively moved back again, etches and move back tin, outer-layer circuit 5 is etched on core plate, and outer-layer circuit 5 contacts connection with internal layer circuit 2；Erosion
When quarter, the plate electrolytic copper layer 3 of non-outer layer circuit pack is etched away；Then outer layer AOI checks that the short-circuit, route of opening of outer-layer circuit 5 lacks
The defects of mouth, route pin hole, defective to scrap processing, flawless product goes out to downstream.
(9), solder mask and silk-screen word welding resistance, silk-screen character: are made on core plate according to the prior art and by design requirement
Symbol, that is, use the white face wire mark brush TOP solder mask, and the face TOP character adds " UL label ".
(10), the nickel that sinks is golden: the copper face of welding resistance windowing position leads to the principles of chemistry, and uniform deposition centainly requires the nickel gold of thickness.
(11), it forms: according to the prior art and pressing design requirement gong shape, wiring board is made.
(12), electric performance test: detecting the electric property of wiring board, detects qualified wiring board and enters next processing
Link；
(13), final inspection: taking a sample test appearance, hole copper thickness, thickness of dielectric layers, green oil thickness, internal layer copper thickness of finished product etc. respectively,
Qualified product can shipment.
Embodiment 2
As shown in figure 3, the present embodiment provides it is a kind of without pressing the manufacturing method of multi-layer circuit board without drilling, successively include with
Lower treatment process: outside sawing sheet → production internal layer circuit → filling megohmite insulant → baking sheet → abrasive belt grinding → electric plating of whole board → production
Sandwich circuit one → filling megohmite insulant → baking sheet → abrasive belt grinding → electric plating of whole board → two → welding resistance of production outer-layer circuit → silk-screen
Character → heavy nickel gold → molding → electric performance test → final inspection, the specific steps are as follows:
(1), sawing sheet: core plate 1 is outputed by jigsaw size 320mm × 420mm, core plate is single-side coated copper plate.
(2), make internal layer circuit (negative film technique): inner figure transfer is coated with light-sensitive surface, light-sensitive surface with vertical application machine
8 μm of film thickness monitoring, using Full-automatic exposure machine, internal layer circuit 2 is completed with 5-6 lattice exposure guide rule (21 lattice exposure guide rule) and is exposed；It is interior
Core plate after exposure development is etched line pattern by layer etching, and it is 3mil that internal layer line width, which measures,；Internal layer AOI, then in inspection
The defects of opening short circuit, route notch, route pin hole of sandwich circuit 2, defective to scrap processing, flawless product goes out to lower one stream
Journey.
(3), it fills megohmite insulant: filling megohmite insulant 4 between internal layer circuit using stencil printing and fill and lead up；Wherein
Megohmite insulant 4 can be resin, also can also be other insulating materials.
(4), baking sheet: core plate 1 being placed in 145-155 degree and toasts 50-80min, and megohmite insulant 4 is solidified.
(5), abrasive belt grinding: the megohmite insulant 4 on 2 copper face of internal layer circuit is ground off, and exposes 2 copper face of internal layer circuit.
(6), heavy copper: carrying out heavy copper process makes plate face metallize, and backlight tests 9.5 grades.
(7), with the current density electric plating of whole board 20min of 1.8ASD, one layer of 5- electric plating of whole board: is formed on internal layer circuit 2
The plate electrolytic copper layer 3 of 10 μ m-thicks.
(8), outer-layer circuit one (positive blade technolgy) is made: outer graphics transfer, using Full-automatic exposure machine and positive route
The film completes outer-layer circuit exposure with 5-7 lattice exposure guide rule (21 lattice exposure guide rule), developed, and outer layer line is formed on plate electrolytic copper layer 3
One 6 figure of road；Outer graphics plating, then distinguishes copper facing and tin plating, copper facing is close with the electric current of 1.8ASD on plate electrolytic copper layer 3
Electric plating of whole board 60min is spent, face copper is added and is plating to 4OZ thickness, tin plating is that 10min, tin thickness 3-5 μ is electroplated with the current density of 1.2ASD
m；Then film is successively moved back again, etches and move back tin, outer-layer circuit 1 is etched on core plate, outer-layer circuit 6 connects with internal layer circuit 2
Touching connection；When etching, the plate electrolytic copper layer 3 of one 6 part of non-outer layer route is etched away；Then outer layer AOI checks outer-layer circuit 1
The defects of opening short circuit, route notch, route pin hole, defective to scrap processing, flawless product goes out to downstream.
(9), it fills megohmite insulant: filling megohmite insulant 4 between outer-layer circuit 1 using stencil printing and fill and lead up；
Megohmite insulant 4 therein can be resin, also can also be other insulating materials.
(10), baking sheet: core plate 1 being placed in 145-155 degree and toasts 50-80min, and megohmite insulant 4 is solidified.
(11), abrasive belt grinding: the megohmite insulant 4 on one 6 copper face of outer-layer circuit is ground off, and exposes one 6 copper face of outer-layer circuit.
(12), heavy copper: carrying out heavy copper process makes plate face metallize, and backlight tests 9.5 grades.
(13), with the current density electric plating of whole board 20min of 1.8ASD, one layer electric plating of whole board: is formed in outer-layer circuit 1
The plate electrolytic copper layer 3 of 5-10 μ m-thick.
(14), outer-layer circuit two (positive blade technolgy) is made: outer graphics transfer, using Full-automatic exposure machine and positive route
The film is completed outer-layer circuit 27 with 5-7 lattice exposure guide rule (21 lattice exposure guide rule) and is exposed, developed, is formed on plate electrolytic copper layer 3 outer
27 figure of sandwich circuit；Outer graphics plating, then distinguishes copper facing and tin plating, copper facing is the electricity with 1.8ASD on plate electrolytic copper layer
Face copper is added and is plating to 4OZ thickness by current density electric plating of whole board 60min, and tin plating is that 10min is electroplated with the current density of 1.2ASD, and tin is thick
3-5μm；Then film is successively moved back again, etches and move back tin, and outer-layer circuit 27, outer-layer circuit 7 and outer-layer circuit are etched on core plate
6 contact connections；When etching, the plate electrolytic copper layer 3 of 27 part of non-outer layer route is etched away；Outer layer AOI, then checks outer-layer circuit
27 the defects of opening short circuit, route notch, route pin hole, defective to scrap processing, flawless product goes out to downstream.
(15), solder mask and silk-screen word welding resistance, silk-screen character: are made on core plate according to the prior art and by design requirement
Symbol, that is, use the white face wire mark brush TOP solder mask, and the face TOP character adds " UL label ".
(16), the nickel that sinks is golden: the copper face of welding resistance windowing position leads to the principles of chemistry, and uniform deposition centainly requires the nickel gold of thickness.
(17), it forms: according to the prior art and pressing design requirement gong shape, wiring board is made.
(18), electric performance test: detecting the electric property of wiring board, and detection eligible line plate enters next processing ring
Section；
(19), final inspection: taking a sample test appearance, hole copper thickness, thickness of dielectric layers, green oil thickness, internal layer copper thickness of finished product etc. respectively,
Qualified product can shipment.
Embodiment 3
As shown in figure 4, the present embodiment provides a kind of without manufacturing method of multi-layer circuit board of the pressing without drilling, this method and reality
The essentially identical of example 1 is applied, the difference is that core plate uses double face copper, on the two sides of copper-clad plate simultaneously with embodiment 1
Method carries out production route and is superimposed route, and wiring board is finally made.
In other embodiments, for the wiring board for needing more numbers of plies, it can continue to be superimposed route according to actual needs
Layer can constantly repeat step (3) as the method for embodiment 2 and arrive (8) that is, between 1 step of embodiment (8) and step (9),
Until reaching the required number of plies.
Core plate used can be single-side coated copper plate in the present invention, be also possible to double face copper；Above-mentioned side can be passed through
Method is constantly superimposed route in the single side of core plate and forms multi-layer board, can also be in the two-sided of core plate while constantly folded by the above method
Ledger line road forms multi-layer board.
It is provided for the embodiments of the invention technical solution above to be described in detail, specific case used herein
The principle and embodiment of the embodiment of the present invention are expounded, the explanation of above embodiments is only applicable to help to understand this
The principle of inventive embodiments；At the same time, for those skilled in the art, according to an embodiment of the present invention, in specific embodiment party
There will be changes in formula and application range, in conclusion the contents of this specification are not to be construed as limiting the invention.
Claims (6)
1. a kind of without manufacturing method of multi-layer circuit board of the pressing without drilling, which comprises the following steps:
S1, production internal layer circuit: internal layer circuit is made on core plate；
S2, filling megohmite insulant: it is filled and led up between internal layer circuit with megohmite insulant；
S22, nog plate: the megohmite insulant on internal layer circuit copper face is ground off；
S3, heavy copper, electric plating of whole board: and then heavy copper, electric plating of whole board process are carried out to core plate, laminate electricity is formed on internal layer circuit
Layers of copper；
S4, production outer-layer circuit: making outer-layer circuit on plate electrolytic copper layer with positive blade technolgy, will during making outer-layer circuit
The plate electrolytic copper layer of non-outer layer circuit pack etches away；
S5, rear process: successively after production solder mask, surface treatment and molding, wiring board is made in core plate.
2. it is according to claim 1 without pressing the manufacturing method of multi-layer circuit board without drilling, which is characterized in that step S2 and
Further include step S21 baking sheet between S22: core plate is toasted, the megohmite insulant is solidified.
3. according to claim 2 without manufacturing method of multi-layer circuit board of the pressing without drilling, which is characterized in that the baking sheet
Parameter be toast 50-80min in 145-155 degree.
4. according to claim 2 without manufacturing method of multi-layer circuit board of the pressing without drilling, which is characterized in that for needs
Different layers of wiring boards can continue to be superimposed line layer according to actual needs, i.e., between step S4 and step S5, repeat step
S2 to S4, until reaching the required number of plies.
5. according to any one of claims 1 to 4 without manufacturing method of multi-layer circuit board of the pressing without drilling, feature exists
In the core plate is single-side coated copper plate or double face copper.
6. according to claim 5 without manufacturing method of multi-layer circuit board of the pressing without drilling, which is characterized in that the insulation
Substance is resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710620150.6A CN107484358B (en) | 2017-07-26 | 2017-07-26 | It is a kind of without pressing the manufacturing method of multi-layer circuit board without drilling |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710620150.6A CN107484358B (en) | 2017-07-26 | 2017-07-26 | It is a kind of without pressing the manufacturing method of multi-layer circuit board without drilling |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107484358A CN107484358A (en) | 2017-12-15 |
| CN107484358B true CN107484358B (en) | 2019-06-21 |
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ID=60598336
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710620150.6A Active CN107484358B (en) | 2017-07-26 | 2017-07-26 | It is a kind of without pressing the manufacturing method of multi-layer circuit board without drilling |
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| CN (1) | CN107484358B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109618508A (en) * | 2018-12-27 | 2019-04-12 | 胜宏科技（惠州）股份有限公司 | A kind of HDI board manufacturing method |
| CN110691478A (en) * | 2019-09-18 | 2020-01-14 | 九江明阳电路科技有限公司 | Method and system for manufacturing board for testing IST (integrated test) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5210568A (en) * | 1974-12-28 | 1977-01-26 | Hideo Machida | Method of manufacturing multilayered printed wiring substrate |
| CN105163523A (en) * | 2015-08-04 | 2015-12-16 | 永利电子铜陵有限公司 | Super-thick copper etching technique for PCB |
| CN106973507A (en) * | 2017-04-20 | 2017-07-21 | 深圳崇达多层线路板有限公司 | A kind of preparation method of filling holes with resin wiring board |
-
2017
- 2017-07-26 CN CN201710620150.6A patent/CN107484358B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5210568A (en) * | 1974-12-28 | 1977-01-26 | Hideo Machida | Method of manufacturing multilayered printed wiring substrate |
| CN105163523A (en) * | 2015-08-04 | 2015-12-16 | 永利电子铜陵有限公司 | Super-thick copper etching technique for PCB |
| CN106973507A (en) * | 2017-04-20 | 2017-07-21 | 深圳崇达多层线路板有限公司 | A kind of preparation method of filling holes with resin wiring board |
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|---|---|
| CN107484358A (en) | 2017-12-15 |
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Effective date of registration: 20210806 Address after: 116000 the Great Wall Road, Changxing Island Economic Zone, Dalian, Liaoning 108 Patentee after: DALIAN SUNTAK ELECTRONICS Co.,Ltd. Address before: 529000 Lian Hai Road 363, Jiangmen high tech Zone, Guangdong Province Patentee before: JIANGMEN SUNTAK CIRCUIT TECHNOLOGY Co.,Ltd. |
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