CN106793578A - A kind of PCB preparation methods in electric thick gold hole - Google Patents
A kind of PCB preparation methods in electric thick gold hole Download PDFInfo
- Publication number
- CN106793578A CN106793578A CN201710124428.0A CN201710124428A CN106793578A CN 106793578 A CN106793578 A CN 106793578A CN 201710124428 A CN201710124428 A CN 201710124428A CN 106793578 A CN106793578 A CN 106793578A
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- Prior art keywords
- gold
- electric
- hole
- electricity
- preparation methods
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
Abstract
The present invention relates to printed wiring board manufacture field, specially a kind of PCB preparation methods in electric thick gold hole, the PCB preparation methods in this electric thick gold hole, some electric gold wires are set around electric gold hole site by outer graphics are upper, then electric gold wire is etched when outer layer is etched, by setting electricity gold outer graphics, it would be desirable to expose on the surface of electricity gold.During electric gold, electric gold process is completed by the way that electric gold wire is conductive, after the completion of electricity gold, electric gold wire gong is broken.By way of the electric gold wire of this addition, can not only meet only in hole site electricity gold, it is also possible to meet the making requirement of half bore electricity gold, and golden thickness reaches certain thickness, improves weld strength.
Description
Technical field
The present invention relates to printed wiring board manufacture field, more particularly to a kind of PCB preparation methods in electric thick gold hole.
Background technology
PCB (Printed Circuit Board), Chinese is printed circuit board, also known as printed substrate.PCB is
The supporter of electronic component, for electronic component provides electrical connection.The technological process of production of PCB is generally：Sawing sheet → interior
Layer pattern transfer → internal layer etching → lamination → drilling → heavy copper → whole plate plating → outer graphics transfer → graphic plating → erosion
Quarter → welding resistance → surface treatment → processing and forming etc..
In PCB manufacturing processes, some half bore need to be surface-treated.In most cases, half bore is done at common turmeric
Reason, the method that turmeric treatment uses chemical deposition.The layer gold thickness of turmeric treatment is general very thin, if layer gold thickness will
It is general using turmeric treatment if asking not high.
With the integrated level more and more higher of IC, IC pin are also more much closeer.Using it is more be surface electricity gold, surface electricity gold
Particularly may be divided into the technique such as local electricity gold and whole plate electricity gold, surface electricity gold and other surface treatments.Electric gold process has coating pure
Degree is high, Joint Strength advantage high.As the integrated level more and more higher of integrated circuit, the particularly PTH in resinous consent lead to
In the manufacture field of the printed wiring board in hole and NPTH back drills hole, turmeric treatment thickness of thin originally, the low shortcoming of weld strength
Increasingly highlight, can not meet existing demand, it would therefore be highly desirable to the golden technique of electricity in a kind of half bore.
The content of the invention
The present invention is directed to layer gold thickness of thin, the low problem of weld strength, there is provided one kind can meet electricity gold in half bore, and electricity gold
Layer reaches the PCB preparation methods in the electric thick gold hole of certain thickness.
To achieve the above object, the present invention uses following technical scheme：
A kind of PCB preparation methods in electric thick gold hole, comprise the following steps：
S1, bore on production plate preceding electricity gold hole for making electric gold hole；Production plate is through heavy copper
After the processing of electric plating of whole board operation, outer graphics, the outer layer are made on production plate
Preceding electricity gold hole location is located on figure electric gold wire is set；
When S2, outer layer etching work procedure, electric gold wire is etched；
S3, carry out welding resistance operation and surface treatment procedure；
S4, the making electricity gold outer graphics on production plate, the golden hole of electricity before exposing；
S5, local electricity gold is carried out, preceding electricity gold hole is fabricated to electric gold hole；
When S6, production sheet metal forming, gong breaks each electric gold wire；
S7, carry out subsequent handling until complete PCB making.
Further, generation is draped over one's shoulders in the step S5, including when carrying out electric gold hole for preventing gong half bore and electric gold wire
The pretreatment of cutting edge of a knife or a sword, pretreatment refers to that the half hole site two ends that needs processing is located on electric gold hole carry out secondary drilling operation.
Further, in the step S6, when gong electricity gold wire is needed, also including gong half bore operation.
Further, in the step S5, after local electricity gold, carry out electric gold outer graphics takes off film process.
Further, after taking off film process, performance detection is carried out to electric gold hole.
Further, in the step S2, after electric gold wire is etched, AOI inspections are carried out to outer-layer circuit.
Further, in the step S1, graphic plating operation is carried out after outer graphics operation.
Compared with prior art, the beneficial effects of the invention are as follows：The PCB preparation methods in this electric thick gold hole, by outer layer
It is located on figure around electricity gold hole site and electric gold wire is set, electric gold wire is etched when outer layer is etched, by setting electricity gold
Outer graphics, it would be desirable to expose on the surface of electricity gold.During electric gold, electric gold process is completed by the way that electric gold wire is conductive, after the completion of electricity gold,
Electric gold wire gong is broken.By way of the electric gold wire of this addition, can not only meet only in hole site electricity gold, it is also possible to full
The making requirement of sufficient half bore electricity gold, and golden thickness reaches certain thickness, improves weld strength.
Brief description of the drawings
The invention will be further described below in conjunction with the accompanying drawings：
Fig. 1 is the schematic diagram after the golden hole operation of electricity before completing to bore on the production plate in embodiment；
Fig. 2 is that preceding electricity gold hole completes the schematic diagram after sink copper plate electric operation in embodiment；
Fig. 3 is the schematic diagram of the preceding electric gold wire of electricity gold hole setting in embodiment；
Fig. 4 is the schematic diagram of secondary drilling position in embodiment；
Fig. 5 is the schematic diagram that electric gold wire gong is disconnected and gong goes out after half bore in electricity gold hole in embodiment.
Specific embodiment
In order to more fully understand technology contents of the invention, with reference to specific embodiment to technical scheme
It is described further and illustrates.
Embodiment
Referring to figs. 1 to Fig. 5, the present invention provides a kind of PCB preparation methods in electric thick gold hole, comprises the following steps that：
(1) the production plate with outer-layer circuit
According to prior art, sequentially pass through sawing sheet → negative film technique and make internal layer circuit → pressing → drilling → sink copper → entirely
Plate plating → positive blade technolgy makes outer-layer circuit, and base material is fabricated to the production plate with outer-layer circuit.It is specific as follows：
A, sawing sheet：Core plate, core thickness 0.5mm H/H are outputed by jigsaw size 520mm × 620mm.
B, internal layer circuit (negative film technique)：Produced with vertical application machine, 8 μm of film thickness monitoring, using Full-automatic exposure machine, with
5-6 lattice exposure guide rule (21 lattice exposure guide rule) completes internal layer circuit exposure, and line pattern is etched after development, and internal layer line width measures and is
3miL.Then check internal layer opens the defects such as short circuit, circuit breach, circuit pin hole, defective to scrap treatment, flawless product
Go out to downstream.
C, pressing：Brown speed after lamination, is entered according to plate Tg according to bottom copper copper thickness brown from appropriate lamination
Row pressing, thickness 1.3mm after pressing.
D, drilling：Drilling operation is carried out using borehole data；Electricity gold hole before boring.
E, heavy copper：Make the hole metallization on production plate, backlight tests 10 grades.
F, electric plating of whole board：With the current density electric plating of whole board 20min of 18ASF, MIN5 μm of hole copper thickness.
G, outer-layer circuit (positive blade technolgy)：Using Full-automatic exposure machine and positive line film, with 5-7 lattice exposure guide rule (21
Lattice exposure guide rule) outer-layer circuit exposure is completed, it is developed, outer-layer circuit figure is formed on production plate, on outer-layer circuit figure
Positioned at preceding electricity gold hole location, electric gold wire 1 is set；Then copper facing and tin plating, the plating ginseng of copper facing parameter are distinguished on production plate
Number:1.8ASD × 60min, tin plating electroplating parameter：1.2ASD × 10min, tin thickness is 3-5 μm；Then film, etching are taken off successively again
With move back tin, etch outer-layer circuit and each electric gold wire 1 on production plate, the copper thickness of outer-layer circuit is 130 μm, produces the plate of plate
The region that base material exposes on face is base material position.
(2) AOI detections are carried out to outer-layer circuit
AOI is Automatic Optic Inspection, full name automatic optics inspection, for detecting PCB (printed circuits
Plate) processing quality.
(3) pre-treatment
Nog plate treatment is carried out to production plate, for cleaning plate face and roughening plate face, so as to follow-up enhancing plate face and welding resistance oil
The adhesion of ink, prevents from getting rid of oil.
(4) welding resistance
After coating solder mask on production plate, first to production plate vacuumize process, then production plate is placed at 75 DEG C
Baking 45min, then the solder mask photocuring made on base material position is exposed with positive line film, then develop to remove not
By the solder mask of photocuring.Production plate is placed in after development 30min is toasted at 155 DEG C, the welding resistance oil on heat cure base material position
Ink, forms welding resistance bottom.
(5) nickel that sinks is golden
Heavy nickel gold is then the chemical plating last layer nickel phosphorus on the basis of palladium core by chemically reacting in the surface replacement palladium of copper
Alloy-layer, then again by replacing plated surface last layer gold of the reaction in nickel.Chemical nickel and gold is mainly used at the surface of circuit board
Reason, the copper for preventing circuit board surface is oxidized or corrodes and for welding and being applied to contact class formation.
(6) local electricity gold
Electricity gold outer graphics are set, expose the preceding electricity gold hole of needs electricity gold, local electricity gold is carried out by electric gold wire 1, so
After take off film, test performance.
(7) pre-process
The half hole site two ends that needs processing is located on electric gold hole carry out secondary drilling operation.For prevent gong half bore and
Burr is produced during electric gold wire.
(8) gong power-off gold wire 1
During shaping, gong powers off gold wire 1 and gong half bore, and then carries out subsequent handling, until completing production.
The present invention can be not only met only in hole site electricity gold, it is also possible to full by way of the electric gold wire 1 of this addition
The making requirement of sufficient half bore electricity gold, and golden thickness reaches certain thickness, improves weld strength.Disclosure satisfy that what is increasingly become more meticulous
PCB production and processing requires that tool is of great significance.
The above only further illustrates technology contents of the invention with embodiment, is easier to understand in order to reader,
But embodiments of the present invention not being represented and being only limitted to this, any technology done according to the present invention extends or recreates, and is sent out by this
Bright protection.
Claims (7)
1. a kind of PCB preparation methods in electric thick gold hole, it is characterised in that comprise the following steps：
S1, bore on production plate preceding electricity gold hole for making electric gold hole；After production plate is processed through heavy copper and electric plating of whole board operation,
Outer graphics are made on production plate, preceding electricity gold hole location is located on the outer graphics electric gold wire is set；
When S2, outer layer etching work procedure, electric gold wire is etched；
S3, carry out welding resistance operation and surface treatment procedure；
S4, the making electricity gold outer graphics on production plate, the golden hole of electricity before exposing；
S5, local electricity gold is carried out, preceding electricity gold hole is fabricated to electric gold hole；
When S6, production sheet metal forming, gong breaks each electric gold wire；
S7, carry out subsequent handling until complete PCB making.
2. the PCB preparation methods in electric thick gold hole according to claim 1, it is characterised in that：It is in the step S5 including right
Electric gold hole produced during for preventing gong half bore and electric gold wire the pretreatment of burr, and pretreatment refers to be located on electric gold hole
Needing half hole site two ends of processing carries out secondary drilling operation.
3. the PCB preparation methods in electric thick gold hole according to claim 2, it is characterised in that：In the step S6, work as needs
During gong electricity gold wire, also including gong half bore operation.
4. the PCB preparation methods in electric thick gold hole as claimed in any of claims 1 to 3, it is characterised in that：The step
In rapid S5, after local electricity gold, carry out electric gold outer graphics takes off film process.
5. the PCB preparation methods in electric thick gold hole according to claim 4, it is characterised in that：After taking off film process, to electric gold hole
Carry out performance detection.
6. the PCB preparation methods in electric thick gold hole as claimed in any of claims 1 to 3, it is characterised in that：The step
In rapid S2, after electric gold wire is etched, AOI inspections are carried out to outer-layer circuit.
7. the PCB preparation methods in electric thick gold hole as claimed in any of claims 1 to 3, it is characterised in that：The step
In rapid S1, graphic plating operation is carried out after outer graphics operation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710124428.0A CN106793578A (en) | 2017-03-03 | 2017-03-03 | A kind of PCB preparation methods in electric thick gold hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710124428.0A CN106793578A (en) | 2017-03-03 | 2017-03-03 | A kind of PCB preparation methods in electric thick gold hole |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106793578A true CN106793578A (en) | 2017-05-31 |
Family
ID=58960948
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710124428.0A Pending CN106793578A (en) | 2017-03-03 | 2017-03-03 | A kind of PCB preparation methods in electric thick gold hole |
Country Status (1)
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| CN (1) | CN106793578A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107567207A (en) * | 2017-08-28 | 2018-01-09 | 东莞市卡小二智能卡有限公司 | The manufacture craft of Contact Type Ic Card PCB support plates |
| CN108419376A (en) * | 2018-05-14 | 2018-08-17 | 星河电路（福建）有限公司 | A kind of production method of the high thick copper pcb board of selective local plating |
| CN110149761A (en) * | 2019-06-14 | 2019-08-20 | 昆山大洋电路板有限公司 | A kind of blind circuit board structure for burying electric gold wire of internal layer and method |
| CN115696764A (en) * | 2022-07-29 | 2023-02-03 | 欣强电子（清远）有限公司 | Method for manufacturing electric gold lead of rigid-flex board and rigid-flex board |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104363704A (en) * | 2014-10-30 | 2015-02-18 | 江门崇达电路技术有限公司 | Manufacturing method of thick hole copper PCB |
| CN104981096A (en) * | 2014-04-14 | 2015-10-14 | 深南电路有限公司 | Processing method of suspended gold finger, and circuit board |
-
2017
- 2017-03-03 CN CN201710124428.0A patent/CN106793578A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104981096A (en) * | 2014-04-14 | 2015-10-14 | 深南电路有限公司 | Processing method of suspended gold finger, and circuit board |
| CN104363704A (en) * | 2014-10-30 | 2015-02-18 | 江门崇达电路技术有限公司 | Manufacturing method of thick hole copper PCB |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107567207A (en) * | 2017-08-28 | 2018-01-09 | 东莞市卡小二智能卡有限公司 | The manufacture craft of Contact Type Ic Card PCB support plates |
| CN108419376A (en) * | 2018-05-14 | 2018-08-17 | 星河电路（福建）有限公司 | A kind of production method of the high thick copper pcb board of selective local plating |
| CN110149761A (en) * | 2019-06-14 | 2019-08-20 | 昆山大洋电路板有限公司 | A kind of blind circuit board structure for burying electric gold wire of internal layer and method |
| CN115696764A (en) * | 2022-07-29 | 2023-02-03 | 欣强电子（清远）有限公司 | Method for manufacturing electric gold lead of rigid-flex board and rigid-flex board |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170531 |