CN104185377A - Fine-line PCB manufacturing method - Google Patents
Fine-line PCB manufacturing method Download PDFInfo
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- CN104185377A CN104185377A CN201410416364.8A CN201410416364A CN104185377A CN 104185377 A CN104185377 A CN 104185377A CN 201410416364 A CN201410416364 A CN 201410416364A CN 104185377 A CN104185377 A CN 104185377A
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Abstract
The invention relates to the technical field of PCB manufacturing, in particular to a fine-line PCB manufacturing method. The fine-line PCB manufacturing method sequentially comprises a press-fit step, a drilling step, a copper foil removal step, a copper deposition step, a step of transferring an outer layer image, a pattern plating step, a micro-etching step and a common back-end work procedure. Outer layer copper foil arranged on a multi-layer board in a press-fit mode is removed, copper deposition is carried out on a prepreg layer, pattern manufacturing and pattern plating are directly carried out on a copper deposition layer, and press-fit of a copper foil layer is omitted, so that a base copper layer is thin, a micro-etching mode is adopted in the outer layer etching process, and therefore the phenomenon of serious lateral erosion of the two sides of a line is avoided. The lateral erosion quantity of the two sides of the line is less than 1 micrometer and is reduced by ten times or more compared with that of the existing manufacturing process, and the manufacturing quality of a fine-line PCB is guaranteed. The smooth surface of the copper foil and the prepreg are bonded together in a press-fit mode, the binding force between the copper foil and the prepreg is reduced, the copper foil and the prepreg are poorly bonded, as a result, the hole collapse problem can be avoided in the drilling process, and the copper foil can be torn off after the drilling step.
Description
Technical field
The present invention relates to PCB technology for producing field, relate in particular to a kind of manufacture method of fine lines PCB.
Background technology
PCB is the supporter of electronic devices and components, for electronic devices and components provide electrical connection.The technological process of production of PCB is generally: sawing sheet → inner figure transfer → internal layer etching → lamination → boring → heavy copper → whole plate plating → outer graphics transfer → graphic plating → etching → welding resistance → surface treatment → processing and forming etc.
In recent years, along with electronic product is constantly to light, thin, short, little development, PCB is also gradually towards highly dense intensity development, so the circuit pattern on PCB need have higher precision and density, i.e. fine-line.Manufacture method general step is first on the multi-layer sheet after lamination, to hole at present, then by heavy copper, whole plate, electroplates, and then carry out outer graphics transfer, then after development etching, graphic plating, outer etching completes the making of metal aperture and fine-line.The shortcoming of this manufacture method mainly contains: when the Copper Foil in logicalnot circuit region is carried out to etching, the side of circuit also can be subject to etching, has affected greatly the quality of fine-line; And technological process is complicated, and production efficiency is low.In existing PCB making, total copper thick (end copper is thick) of the copper layer that pressing Copper Foil and heavy copper and whole plate are electroplated is conventionally more than 10 μ m, and the line of fine-line is thin and line-spacing is less, during outer etching, circuit will inevitably be subject to lateral erosion, if single edge of circuit lateral erosion is 5 μ m, total lateral erosion of circuit is 10 μ m, as shown in Figure 1.The etched width of 10 μ m will produce significantly impact to fine-line.
Summary of the invention
The present invention is directed in existing fine lines PCB making, the problem that fine-line lateral erosion is serious, provides a kind of and avoids fine-line lateral erosion excessive, improves the manufacture method of fine lines PCB quality.
For achieving the above object, the present invention by the following technical solutions,
A manufacture method for fine lines PCB, comprises the following steps:
S1, by inner layer circuit board, prepreg and Copper Foil superimposed and lamination successively on request, form multi-layer sheet; The one side of described Copper Foil is hair side, and another side is light face; The light face of described Copper Foil and prepreg bonding.Preferably, the thickness of described Copper Foil is 1.5-2.5OZ.
S2, by designing requirement, on multi-layer sheet, hole, after boring, the Copper Foil on multi-layer sheet is removed.
The copper that sinks successively after S3, multi-layer sheet de-smear is processed, outer graphics shifts and graphic plating, then by microetch, carries out outer etching.
Preferably, the thickness that heavy copper is processed formed heavy copper layer is 0.3-0.5um, and the microetch amount of microetch is 0.5-0.6um.
Outer graphics shifts: first multi-layer sheet is carried out to pickling processes, then on multi-layer sheet, pad pasting also exposes successively and develops, and forms outer graphics on multi-layer sheet.
Graphic plating is: first multi-layer sheet is carried out to oil removal treatment and pickling processes successively, then electro-coppering and electrotinning successively on multi-layer sheet.
Skin is etched to: first move back film and expose circuit end copper part in addition, then by microetch, end copper microetch is fallen to the tin layer of then decorporating on circuit.
S4, on multi-layer sheet, make solder mask doubling lettering symbol, then carry out surface treatment, make fine lines PCB.
Compared with prior art, the invention has the beneficial effects as follows: the present invention is by removing the outer copper foil of pressing on multi-layer sheet, then direct heavy copper in layer of prepreg, and directly on heavy copper layer, make figure and electroplate figure, saved pressing copper foil layer, make end copper layer thinner, during outer etching, can adopt the mode of microetch to process, thereby avoided the both sides of circuit to occur serious side etching phenomenon.By the inventive method, the side etching quantity on outer-layer circuit both sides is less than 1um, and the side etching quantity of relatively existing manufacture craft reduces more than 10 times, has ensured the making quality of fine lines PCB.By the light face of Copper Foil and prepreg pressing are bonded together, reduce the adhesion between Copper Foil and prepreg, while making bonding between Copper Foil and prepreg both avoid holing, there is collapsing hole problem, can after boring, Copper Foil be torn again.Select the Copper Foil that thickness is 1.5-2.5OZ, can make Copper Foil be pressed together on preferably and on prepreg, be convenient to drilling operation, and can make Copper Foil remove smoothly and layer of prepreg not impacted compared with thick Copper Foil.In outer graphics transfering process, multi-layer sheet is only carried out to pickling processes, and do not do nog plate and microetch processing; And in graphic plating operation, only carry out oil removing, pickling processes, do not make microetch and process, can further improve the quality of fine-line.
Accompanying drawing explanation
Fig. 1 is in prior art, the side etching phenomenon schematic diagram that during outer etching, circuit exists;
Fig. 2 is in the embodiment of the present invention, the side etching phenomenon schematic diagram that the circuit after microetch exists.
Embodiment
In order to more fully understand technology contents of the present invention, below in conjunction with specific embodiment, technical scheme of the present invention is described further and is illustrated.
Embodiment 1
The manufacture method of a kind of fine lines PCB that the present embodiment provides, comprises the following steps:
(1) Copper Foil that is 2OZ by inner layer circuit board, prepreg and thickness is superimposed successively on request, and in the light of Copper Foil is faced, outwardly, the light face of Copper Foil and prepreg in opposite directions, form superimposed sheet to hair side.
Then superimposed sheet is moved in pressure stove and adopts heat pressing process to carry out pressing, form multi-layer sheet.In hot pressing, the situation that temperature and pressure gradually changes is in time as shown in the table, and total duration is 280min:
| Temperature | 140 | 165 | 185 | 210 | 195 | 195 | 195 | 175 | 140 | 140 |
| Pressure | 50 | 250 | 250 | 400 | 400 | 400 | 200 | 200 | 100 | 100 |
| Time | 8 | 7 | 9 | 40 | 15 | 70 | 30 | 20 | 18 | 1 |
(2) according to existing drilling technique, according to designing requirement, on multi-layer sheet, hole.After boring, the outer copper foil on multi-layer sheet is torn off.
(3) according to existing de-smear and heavy copper flow process, multi-layer sheet is carried out to de-smear and heavy copper is processed, and controls concentration, the temperature and time of chemical substance in heavy process for copper, make on prepreg and hole in the thickness of the heavy copper layer that forms be 0.4um.
(4) sink after copper is processed and directly carry out outer graphics transfer: according to prior art, multi-layer sheet is carried out to pickling processes, and then (dimensional gaughing → exposure → development of pad pasting → film inspection → film) makes outer graphics on multiple-plate heavy copper layer according to existing outer graphics transfer flow.
(5) then multi-layer sheet is carried out to oil removal treatment and pickling processes successively, then electro-coppering on multi-layer sheet forms copper electroplating layer on outer graphics.By the heavy copper layer under copper electroplating layer and copper electroplating layer, form outer circuit 3.Multi-layer sheet is zinc-plated on copper electroplating layer again after washing, makes electrotinning layer as resist layer 1.After again washing plate, complete graphic plating operation.
(6) after graphic plating, carry out outer etching, to remove outer circuit 3 copper layer in addition, remove outer circuit 3 heavy copper layer in addition.Outer etching adopts existing microetch technology to carry out (Na
2s
2o
8, 20g/L; H
2sO
4, 30mL/L; Temperature 26-30 ℃), and by microetch amount be controlled at 0.5um.As shown in Figure 2, prepreg 2 tops are outer-layer circuit 3, cover one deck resist layer 1 in outer-layer circuit 3 in the circuit lateral erosion that microetch causes.
(7) then according to the postorder of prior art, make flow process and process successively processing: move back tin to remove resist layer 1 → making solder mask → silk-screen character → moulding → performance test → visual examination → packing.Make fine lines PCB.
The side etching quantity of measuring outer-layer circuit both sides is respectively below 0.4um, and the side etching quantity of relatively existing manufacture craft reduces more than 10 times, has ensured the making quality of fine lines PCB.
In other embodiments, can also used thickness the Copper Foil that is 1.5-2.5OZ.Heavy copper also can be controlled the thickness 0.3-0.5um of heavy copper layer in processing, and can control microetch amount in microetch processing, be 0.5-0.6um, and microetch amount only need be greater than the thickness of heavy copper layer.
Embodiment 2
The conventional manufacture method of a kind of fine lines PCB that the present embodiment provides, comprises the following steps:
(1) Copper Foil that is 0.25OZ by inner layer circuit board, prepreg and thickness (the thinnest Copper Foil of industry at present) is superimposed successively on request, and the hair side of Copper Foil inwardly, outside light faces, the hair side of Copper Foil and prepreg in opposite directions, form superimposed sheet.
Then superimposed sheet is moved in pressure stove and adopts heat pressing process to carry out pressing, form multi-layer sheet.In hot pressing, the situation that temperature and pressure gradually changes is in time as shown in the table, and total duration is 280min:
| Temperature | 140 | 165 | 185 | 210 | 195 | 195 | 195 | 175 | 140 | 140 |
| Pressure | 50 | 250 | 250 | 400 | 400 | 400 | 200 | 200 | 100 | 100 |
| Time | 8 | 7 | 9 | 40 | 15 | 70 | 30 | 20 | 18 | 1 |
(2) according to existing drilling technique, according to designing requirement, on multi-layer sheet, hole.
(3) according to existing de-smear and heavy copper flow process, multi-layer sheet is carried out to de-smear and the processing of heavy copper, and control concentration, the temperature and time of chemical substance in heavy process for copper, make on prepreg and hole in the thickness of the heavy copper layer that forms be 0.4um, then carrying out whole plate, to electroplate 3-5um copper thick.
(4) sink and carry out outer graphics transfer after copper and whole plate electroplating processes: according to prior art, multi-layer sheet is carried out to pickling and nog plate is processed, and then on electric layer of multiple-plate heavy copper, plate, make outer graphics according to existing outer graphics transfer flow (dimensional gaughing → exposure → developments of pad pasting → film inspection → film).
(5) then multi-layer sheet is carried out to oil removal treatment, microetch and pickling processes successively, then in the circuit exposed portions serve of outer graphics, form copper electroplating layer.Multi-layer sheet is zinc-plated on copper electroplating layer again after washing, makes electrotinning layer as resist layer.After again washing plate, complete graphic plating operation.
(6) after graphic plating, carry out outer etching, to remove circuit copper layer in addition.While stripping outer graphics, institute pastes after dry film, and outer etching adopts ammonium chloride+ammoniacal liquor series etching solution to carry out etching.End copper is that 8.75um (0.25OZ) adds 3-5um (whole plate electro-coppering is thick), considers heavy copper pre-treatment, outer graphics pre-treatment, graphic plating pre-treatment, the thick 10um that is about of copper to be etched.
(7) then according to the postorder of prior art, make flow process and process successively processing: move back tin to remove resist layer 1 → making solder mask → silk-screen character → moulding → performance test → visual examination → packing.Make fine lines PCB.
The side etching quantity of measuring outer-layer circuit both sides is respectively 5um above (Optimal Production state).
Embodiment 3
The present embodiment is substantially the same manner as Example 1, and difference is: the copper thickness using in the step of the present embodiment (1) is 3OZ.
Use the thick Copper Foil of 3OZ copper, in boring procedure, bore and chew and can be damaged, bore the lost of life of chewing, and because Copper Foil is thicker, the cost of manufacture of fine lines PCB is increased.
Embodiment 4
The present embodiment is substantially the same manner as Example 1, difference is: in the step of the present embodiment (4), according to prior art, multi-layer sheet is carried out after pickling processes, first by the method for prior art, carry out nog plate, and then (dimensional gaughing → exposure → development of automatic coating → film inspection → film) makes outer graphics on multiple-plate heavy copper layer according to existing outer graphics transfer flow.
In the manufacturing process of PCB, heavy copper layer is destroyed, makes prepreg part out exposed, and very easily causing in graphic plating operation cannot complete plated with copper, causes the problems such as open circuit.
Embodiment 5
The present embodiment is substantially the same manner as Example 1, difference is: in the step of the present embodiment (4), according to prior art, multi-layer sheet is carried out after pickling processes, first by the method for prior art, carry out microetch (controlling microetch amount is 0.4um), and then (dimensional gaughing → exposure → development of automatic coating → film inspection → film) makes outer graphics on multiple-plate heavy copper layer according to existing outer graphics transfer flow.
In the manufacturing process of PCB, heavy copper layer is destroyed, makes prepreg part out exposed, and very easily causing in graphic plating operation cannot complete plated with copper, can not guarantee the electrically conducting of the circuit of made, causes the problems such as open circuit.
Embodiment 6
The present embodiment is substantially the same manner as Example 1, and difference is: in the step of the present embodiment (5), according to prior art, multi-layer sheet is carried out after oil removal treatment, carry out microetch processing (controlling microetch amount is 0.4um).And then electro-coppering on multi-layer sheet, on outer graphics, form copper electroplating layer.By the heavy copper layer under copper electroplating layer and copper electroplating layer, form outer circuit.Multi-layer sheet is zinc-plated on copper electroplating layer again after washing, makes electrotinning layer as resist layer.After again washing plate, complete graphic plating operation.
In the manufacturing process of PCB, heavy copper layer is destroyed, can not guarantee the electrically conducting of the circuit of made.
The above only further illustrates technology contents of the present invention with embodiment, so that reader is easier to understand, but does not represent that embodiments of the present invention only limit to this, and any technology of doing according to the present invention is extended or recreation, is all subject to protection of the present invention.
Claims (5)
1. a manufacture method for fine lines PCB, is characterized in that, comprises the following steps:
S1, by inner layer circuit board, prepreg and Copper Foil superimposed and lamination successively on request, form multi-layer sheet; The one side of described Copper Foil is hair side, and another side is light face; The light face of described Copper Foil and prepreg bonding;
S2, by designing requirement, on multi-layer sheet, hole, after boring, the Copper Foil on multi-layer sheet is torn;
The copper that sinks successively after S3, multi-layer sheet de-smear is processed, outer graphics shifts and graphic plating, then by microetch, carries out outer etching;
S4, on multi-layer sheet, make solder mask doubling lettering symbol, then carry out surface treatment, make fine lines PCB.
2. a kind of manufacture method of fine lines PCB according to claim 1, it is characterized in that: the outer graphics described in step S3 shifts and is: first multi-layer sheet is carried out to pickling processes, then on multi-layer sheet, pad pasting also exposes successively and develops, and forms outer graphics on multi-layer sheet.
3. a kind of manufacture method of fine lines PCB according to claim 2, is characterized in that: the graphic plating described in step S3 is: first multi-layer sheet is carried out to oil removal treatment and pickling processes successively, then electro-coppering and electrotinning successively on multi-layer sheet.
4. a kind of fine lines PCB manufacture method according to claim 3, is characterized in that: the thickness of described Copper Foil is 1.5-2.5OZ.
5. a kind of fine lines PCB manufacture method according to claim 4, is characterized in that: the thickness of processing the heavy copper layer forming by the heavy copper described in step S3 is 0.3-0.5um, and the microetch amount of microetch described in step 3 is 0.5-0.6um.
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| CN201410416364.8A CN104185377A (en) | 2014-08-21 | 2014-08-21 | Fine-line PCB manufacturing method |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104582332A (en) * | 2015-01-21 | 2015-04-29 | 广州兴森快捷电路科技有限公司 | Fine circuit packaging substrate and manufacturing method thereof |
| CN104684280A (en) * | 2015-03-10 | 2015-06-03 | 深圳崇达多层线路板有限公司 | Manufacturing method of PCB with base copper-free metallized blind hole |
| CN105611743A (en) * | 2016-02-29 | 2016-05-25 | 江门崇达电路技术有限公司 | Manufacturing method for fine circuit |
| CN105682363A (en) * | 2016-02-25 | 2016-06-15 | 江门崇达电路技术有限公司 | Fabrication method of PCB with metalized plate edges |
| CN106211568A (en) * | 2016-09-20 | 2016-12-07 | 四会富士电子科技有限公司 | A kind of extra thin copper foil material |
| CN106852003A (en) * | 2017-04-06 | 2017-06-13 | 宜兴硅谷电子科技有限公司 | A kind of preparation method without resist layer fine-line plate |
| CN108770243A (en) * | 2018-06-29 | 2018-11-06 | 沪士电子股份有限公司 | One kind on copper foil for being electroplated the later half potting circuit method of fine-line |
| CN110312370A (en) * | 2019-06-11 | 2019-10-08 | 江西弘高科技有限公司 | A kind of production method of printed wiring board memory bar |
| WO2020124649A1 (en) * | 2018-12-21 | 2020-06-25 | 广东科翔电子科技有限公司 | Method and system for manufacturing electroplated high-precision thin circuit pcb |
| CN114423186A (en) * | 2022-03-10 | 2022-04-29 | 广州添利电子科技有限公司 | Radar antenna PCB manufacturing process and antenna pattern manufacturing process and application thereof |
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Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104582332A (en) * | 2015-01-21 | 2015-04-29 | 广州兴森快捷电路科技有限公司 | Fine circuit packaging substrate and manufacturing method thereof |
| CN104684280A (en) * | 2015-03-10 | 2015-06-03 | 深圳崇达多层线路板有限公司 | Manufacturing method of PCB with base copper-free metallized blind hole |
| CN104684280B (en) * | 2015-03-10 | 2017-10-17 | 深圳崇达多层线路板有限公司 | A kind of preparation method of the PCB provided with bottomless copper metallization blind hole |
| CN105682363A (en) * | 2016-02-25 | 2016-06-15 | 江门崇达电路技术有限公司 | Fabrication method of PCB with metalized plate edges |
| CN105682363B (en) * | 2016-02-25 | 2018-10-02 | 江门崇达电路技术有限公司 | A kind of production method of the PCB of edges of boards metallization |
| CN105611743A (en) * | 2016-02-29 | 2016-05-25 | 江门崇达电路技术有限公司 | Manufacturing method for fine circuit |
| CN106211568A (en) * | 2016-09-20 | 2016-12-07 | 四会富士电子科技有限公司 | A kind of extra thin copper foil material |
| CN106852003A (en) * | 2017-04-06 | 2017-06-13 | 宜兴硅谷电子科技有限公司 | A kind of preparation method without resist layer fine-line plate |
| CN108770243A (en) * | 2018-06-29 | 2018-11-06 | 沪士电子股份有限公司 | One kind on copper foil for being electroplated the later half potting circuit method of fine-line |
| CN108770243B (en) * | 2018-06-29 | 2020-10-23 | 沪士电子股份有限公司 | Method for electroplating rear half-embedded circuit on copper foil |
| WO2020124649A1 (en) * | 2018-12-21 | 2020-06-25 | 广东科翔电子科技有限公司 | Method and system for manufacturing electroplated high-precision thin circuit pcb |
| CN110312370A (en) * | 2019-06-11 | 2019-10-08 | 江西弘高科技有限公司 | A kind of production method of printed wiring board memory bar |
| CN114423186A (en) * | 2022-03-10 | 2022-04-29 | 广州添利电子科技有限公司 | Radar antenna PCB manufacturing process and antenna pattern manufacturing process and application thereof |
| CN114423186B (en) * | 2022-03-10 | 2022-06-24 | 广州添利电子科技有限公司 | Radar antenna PCB manufacturing process and antenna pattern manufacturing process and application thereof |
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