CN104684280A - Manufacturing method of PCB with base copper-free metallized blind hole - Google Patents
Manufacturing method of PCB with base copper-free metallized blind hole Download PDFInfo
- Publication number
- CN104684280A CN104684280A CN201510104626.1A CN201510104626A CN104684280A CN 104684280 A CN104684280 A CN 104684280A CN 201510104626 A CN201510104626 A CN 201510104626A CN 104684280 A CN104684280 A CN 104684280A
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- China
- Prior art keywords
- blind hole
- copper
- pcb
- hole
- milling
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/421—Blind plated via connections
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09509—Blind vias, i.e. vias having one side closed
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0228—Cutting, sawing, milling or shearing
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention relates to the technical field of PCB manufacturing, in particular to a manufacturing method of a PCB with a base copper-free metallized blind hole. The manufacturing method comprises the following steps: firstly manufacturing a metallized blind hole, then performing pattern plating, adopting a depth controlled milling manner to remove a copper layer at the bottom of the hole before outer layer etching, and then etching the copper edge remaining at the bottom of the metallized blind hole through the outer layer etching, so that the milled edge is smooth, the problems that the copper edge remaining at the bottom of the base copper-free metallized blind hole is large in area and coarse can be avoided, and the quality of the base copper-free metallized blind hole is greatly improved; setting the perpendicular distance between the milled edge and the wall of the metallized blind hole to be 0.01-0.02 mm, and enabling the milled edge after outer layer etching to be basically flush with the hole wall; setting the depth controlled milling to be 0.1-0.11 mm deeper than the metallized blind hole, so as to ensure that the copper layer at the bottom of the hole is completely removed, and no influence is generated due to nonuniformity of the copper layer.
Description
Technical field
The present invention relates to PCB manufacture technology field, particularly relate to a kind of manufacture method being provided with the PCB of bottomless copper metallization blind hole.
Background technology
PCB (Printed Circuit Board) is one of vitals of electronics industry, is the carrier of the supporter of electronic devices and components, electrical connection.Increase along with electronic product function and the reduction of volume, impel PCB constantly to variation, densification, miniaturization development.PCB designs bottomless copper metallization blind hole (i.e. the hole wall of blind hole have copper and without copper at the bottom of hole), and for installing thereon and immobilising device thus realize some specific function, this is the diversified embodiment of PCB.But, according to existing technology, be difficult to directly non-metallic blind hole is directly made into bottomless copper metallization blind hole, existing way first non-metallic blind hole is made into metalized blind vias, then outer-layer circuit is made, to make after outer-layer circuit again by the mode of copper at the bottom of milling by the copper mill off bottom metalized blind vias, thus on PCB, form bottomless copper metallization blind hole.Existing manufacture method is in order to prevent hole wall copper facing damaged, need the length and width of copper at the bottom of pre-little milling, therefore by after end copper mill off, the copper of larger area bottom hole, can be remained near place with hole wall, and the copper bound of incision also can be very crude, have a strong impact on the quality of bottomless copper metallization blind hole.
Summary of the invention
The present invention is directed to prior art and make the PCB being provided with bottomless copper metallization blind hole, it is large, crude that bottomless copper metallization blind via bottom remains copper bound area, the problem that the quality of metalized blind vias is in urgent need to be improved, by improving Making programme, provide a kind of manufacture method being provided with the PCB of bottomless copper metallization blind hole.
For achieving the above object, by the following technical solutions, a kind of manufacture method being provided with the PCB of bottomless copper metallization blind hole, comprises the following steps in the present invention:
S1, on multilayer boards drilling blind hole, then carry out heavy copper and electric plating of whole board successively to multi-layer sheet, and described blind hole is made into metalized blind vias; Then outer graphics transfer and graphic plating is carried out on multilayer boards;
Described multi-layer sheet to be pressed together by prepreg by core material and outer copper foil and forms.
S2, by control dark milling mode by the bottom of the hole of metalized blind vias layers of copper removing, metalized blind vias is made into bottomless copper metallization blind hole.
Preferably, the milling area controlling dark milling is less than the cross-sectional area of metalized blind vias, and the vertical range of the hole wall of milling edge and metalized blind vias is 0.01-0.02mm.Preferred, the vertical range of the hole wall of milling edge and metalized blind vias is 0.02mm.
Preferably, the large 0.1-0.11mm of the degree of depth of the depth ratio metalized blind vias of dark milling is controlled.Preferred, control the large 0.105mm of the degree of depth of the depth ratio metalized blind vias of dark milling.
S3, multi-layer sheet carried out successively to skin etching and move back tin process, forming outer-layer circuit on multilayer boards.
S4, make solder mask on multilayer boards, then surface treatment and processing and forming are carried out to multi-layer sheet, obtained PCB.
Compared with prior art, the invention has the beneficial effects as follows: the present invention is by first making metalized blind vias, then after graphic plating and before skin etching, the mode of the dark milling of control is adopted to remove layers of copper at the bottom of hole, thus by skin etching, the copper bound remained bottom metalized blind vias is etched away, and milling edge can be made round and smooth, avoid the problem that copper bound area that bottomless copper metallization blind via bottom remains is large, crude, significantly improve the quality of bottomless copper metallization blind hole.The vertical range arranging the hole wall of milling edge and metalized blind vias is 0.01-0.02mm, and milling edge substantially can flush with hole wall after skin etching; The large 0.1-0.11mm of the degree of depth of the depth ratio metalized blind vias controlling dark milling is set, can ensures that at the bottom of hole, layers of copper is completely removed, can not be affected because of the uneven of layers of copper.
Accompanying drawing explanation
Fig. 1 is the cross-sectional view of the bottomless copper metallization blind hole made in embodiment 1;
Fig. 2 is the cross-sectional view of the bottomless copper metallization blind hole made in embodiment 2;
Fig. 3 is the cross-sectional view of the bottomless copper metallization blind hole made in embodiment 3.
Embodiment
In order to more fully understand technology contents of the present invention, below in conjunction with specific embodiment, technical scheme of the present invention being described further and being illustrated.
Embodiment 1
The present embodiment provides a kind of manufacture method being provided with the PCB of bottomless copper metallization blind hole, and concrete making step is as follows:
(1) pressing forms multi-layer sheet
First as the PCB production process of prior art, sawing sheet is carried out to the raw material of PCB and obtains central layer, on central layer, then adopt negative film technique to make internal layer circuit.Detected by internal layer AOI, check whether internal layer circuit exists out the defects such as short circuit, circuit breach, circuit pin hole, flawless product introduction pressing flow process.
Brown process is carried out to central layer, then by design data, central layer, prepreg and outer copper foil is carried out lamination, then select suitable pressing condition according to the Tg of plate, folded plate pressing is integrated, form multi-layer sheet.
(2) metal blind hole is made
The blind hole for making bottomless copper metallization blind hole is bored on multilayer boards according to borehole data, and other slotted eye.Then successively heavy Copper treatment and electric plating of whole board process are carried out to multi-layer sheet, make hole metallization, the metallization slotted eye of obtained metalized blind vias and other design.
Then, positive blade technolgy is adopted to carry out outer graphics transfer and graphic plating (distinguish copper facing and zinc-plated) on multilayer boards successively.
(3) bottomless copper metallization blind hole is made
By controlling the mode of dark milling by the layers of copper removing at the bottom of the hole of metalized blind vias, metalized blind vias is made into bottomless copper metallization blind hole.Wherein, the milling area controlling dark milling is less than the cross-sectional area of metalized blind vias, and the vertical range of the hole wall of milling edge and bottomless copper metallization blind hole is 0.02mm, and namely at the bottom of milling hole during copper, milling edge compares that hole wall is monolateral inside contracts 0.02mm.Control the large 0.105mm of the degree of depth of the depth ratio metalized blind vias of dark milling.
(4) skin etching is carried out to multi-layer sheet, by skin etching, the layers of copper outside outer-layer circuit is removed, only leave outer-layer circuit, thus form outer-layer circuit on multilayer boards.And when carrying out skin etching, in the lump the copper bound that bottomless copper metallization blind via bottom is residual is etched away, and make milling edge round and smooth, avoid bottomless copper metallization blind via bottom and remain large, the crude problem of copper bound area, significantly improve the quality of bottomless copper metallization blind hole.Then to decorporate tin layers, make outer-layer circuit completely out exposed.
Wherein, the cross-sectional view of bottomless copper metallization blind hole 10 as shown in Figure 1.Milling edge substantially can flush with hole wall 11 after skin etching, and milling edge is round and smooth, makes copper bound area residual bottom bottomless copper metallization blind hole 10 little, round and smooth; Under the severity control of the dark milling of control and the double shield of outer etching, the copper bottom bottomless copper metallization blind hole 10 is removed clean, noresidue; Significantly improve the quality of bottomless copper metallization blind hole 10.
By outer AOI, check whether outer-layer circuit exists out the defects such as short circuit, circuit breach, circuit pin hole, flawless product introduction downstream.
(5) at multiple-plate surperficial silk-screen welding resistance, character (adopt the solder mask in white reticulated printing TOP face, the character in TOP face adds " UL mark "), solder mask is made.Then according to product design needs, surface treatment is carried out to multi-layer sheet, as the process of heavy nickel gold surface (the thick control 3-5UM of nickel, gold is thick to be controlled at >=0.05UM).Obtained PCB.
After carrying out surface treatment, then carry out gong profile, electrical testing and inspection eventually successively, qualified product gets final product shipment.
Embodiment 2
The present embodiment provides a kind of manufacture method being provided with the PCB of bottomless copper metallization blind hole, concrete making step is substantially identical with embodiment 1, difference is: when the layers of copper at the bottom of the hole of metalized blind vias being removed by the mode controlling dark milling, the vertical range of the hole wall of milling edge and metalized blind vias is 0.03mm, namely, at the bottom of milling hole during copper, milling edge compares that hole wall is monolateral inside contracts 0.03mm.
The cross-sectional view of made bottomless copper metallization blind hole 20 as shown in Figure 2.Milling edge becomes round and smooth after skin etching, but milling edge obviously protrudes hole wall 21, makes copper bound area residual bottom bottomless copper metallization blind hole 20 larger.
Embodiment 3
The present embodiment provides a kind of manufacture method being provided with the PCB of bottomless copper metallization blind hole, concrete making step is substantially identical with embodiment 1, difference is: when the layers of copper at the bottom of the hole of metalized blind vias being removed by the mode controlling dark milling, the vertical range of the hole wall of milling edge and metalized blind vias is 0.005mm, namely, at the bottom of milling hole during copper, milling edge compares that hole wall is monolateral inside contracts 0.005mm.
The cross-sectional view of made bottomless copper metallization blind hole 30 as shown in Figure 3.Milling edge becomes round and smooth after skin etching, but milling edge obviously recessed hole wall 31.
In other embodiments, when the layers of copper at the bottom of the hole of metalized blind vias being removed by the mode controlling dark milling, the vertical range of the hole wall of milling edge and metalized blind vias can also be 0.01-0.02mm; The degree of depth controlling the depth ratio metalized blind vias of dark milling can also be 0.1-0.11mm on a large scale.
The above only further illustrates technology contents of the present invention with embodiment, so that reader is easier to understand, but does not represent embodiments of the present invention and is only limitted to this, and any technology done according to the present invention extends or recreation, all by protection of the present invention.
Claims (5)
1. be provided with a manufacture method of the PCB of bottomless copper metallization blind hole, it is characterized in that, comprise the following steps:
S1, on multilayer boards drilling blind hole, then carry out heavy copper and electric plating of whole board successively to multi-layer sheet, and described blind hole is made into metalized blind vias; Then outer graphics transfer and graphic plating is carried out on multilayer boards;
Described multi-layer sheet to be pressed together by prepreg by core material and outer copper foil and forms;
S2, by control dark milling mode by the bottom of the hole of metalized blind vias layers of copper removing, metalized blind vias is made into bottomless copper metallization blind hole;
S3, multi-layer sheet carried out successively to skin etching and move back tin process, forming outer-layer circuit on multilayer boards;
S4, make solder mask on multilayer boards, then surface treatment and processing and forming are carried out to multi-layer sheet, obtained PCB.
2. a kind of manufacture method being provided with the PCB of bottomless copper metallization blind hole according to claim 1, it is characterized in that, in described step S2, the milling area controlling dark milling is less than the cross-sectional area of metalized blind vias, and the vertical range of the hole wall of milling edge and metalized blind vias is 0.01-0.02mm.
3. a kind of manufacture method being provided with the PCB of bottomless copper metallization blind hole according to claim 2, it is characterized in that, in described step S2, the vertical range of the hole wall of milling edge and metalized blind vias is 0.02mm.
4. a kind of manufacture method being provided with the PCB of bottomless copper metallization blind hole according to claim 1, is characterized in that, in described step S2, control the large 0.1-0.11mm of the degree of depth of the depth ratio metalized blind vias of dark milling.
5. a kind of manufacture method being provided with the PCB of bottomless copper metallization blind hole according to claim 4, is characterized in that, in described step S2, control the large 0.105mm of the degree of depth of the depth ratio metalized blind vias of dark milling.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510104626.1A CN104684280B (en) | 2015-03-10 | 2015-03-10 | A kind of preparation method of the PCB provided with bottomless copper metallization blind hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510104626.1A CN104684280B (en) | 2015-03-10 | 2015-03-10 | A kind of preparation method of the PCB provided with bottomless copper metallization blind hole |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104684280A true CN104684280A (en) | 2015-06-03 |
| CN104684280B CN104684280B (en) | 2017-10-17 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510104626.1A Expired - Fee Related CN104684280B (en) | 2015-03-10 | 2015-03-10 | A kind of preparation method of the PCB provided with bottomless copper metallization blind hole |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101511148A (en) * | 2009-03-13 | 2009-08-19 | 深圳市深南电路有限公司 | Method for preparing resonant cavity integrated on PCB |
| CN101827496A (en) * | 2010-04-08 | 2010-09-08 | 深南电路有限公司 | Method for machining PCB with step groove |
| CN102110866A (en) * | 2009-12-24 | 2011-06-29 | 深南电路有限公司 | Manufacturing process of waveguide slot |
| CN102361539A (en) * | 2011-10-18 | 2012-02-22 | 沪士电子股份有限公司 | Method for manufacturing groove-type printed wiring board |
| CN103298245A (en) * | 2013-06-14 | 2013-09-11 | 东莞生益电子有限公司 | Manufacture method for high-frequency circuit board and circuit board manufactured through method |
| CN104185377A (en) * | 2014-08-21 | 2014-12-03 | 深圳崇达多层线路板有限公司 | Fine-line PCB manufacturing method |
-
2015
- 2015-03-10 CN CN201510104626.1A patent/CN104684280B/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101511148A (en) * | 2009-03-13 | 2009-08-19 | 深圳市深南电路有限公司 | Method for preparing resonant cavity integrated on PCB |
| CN102110866A (en) * | 2009-12-24 | 2011-06-29 | 深南电路有限公司 | Manufacturing process of waveguide slot |
| CN101827496A (en) * | 2010-04-08 | 2010-09-08 | 深南电路有限公司 | Method for machining PCB with step groove |
| CN102361539A (en) * | 2011-10-18 | 2012-02-22 | 沪士电子股份有限公司 | Method for manufacturing groove-type printed wiring board |
| CN103298245A (en) * | 2013-06-14 | 2013-09-11 | 东莞生益电子有限公司 | Manufacture method for high-frequency circuit board and circuit board manufactured through method |
| CN104185377A (en) * | 2014-08-21 | 2014-12-03 | 深圳崇达多层线路板有限公司 | Fine-line PCB manufacturing method |
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| CN104684280B (en) | 2017-10-17 |
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Granted publication date: 20171017 Termination date: 20200310 |