CN106714453A - Pseudo rigid-flex board and preparation method thereof - Google Patents
Pseudo rigid-flex board and preparation method thereof Download PDFInfo
- Publication number
- CN106714453A CN106714453A CN201611193006.0A CN201611193006A CN106714453A CN 106714453 A CN106714453 A CN 106714453A CN 201611193006 A CN201611193006 A CN 201611193006A CN 106714453 A CN106714453 A CN 106714453A
- Authority
- CN
- China
- Prior art keywords
- groove
- bending groove
- wall
- layer
- rigid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention relates to the technical field of circuit board manufacturing, and specifically relates to a pseudo rigid-flex board and a preparation method thereof. A bending groove is made by two times of depth-controlled routing. During first depth-controlled routing, an upper bending groove is made, and the upper bending groove is metalized through an eletcroless plating copper process and full-board electroplating. Then, second depth-controlled routing is carried out on the basis of the upper bending groove to get a bending groove. As the wall of the upper bending groove is metalized during the eletcroless plating copper process and full-board electroplating, part of the wall of the bending groove is coated with an electroplated copper layer. According to the pseudo rigid-flex board prepared using the method, as the wall of the bending groove can be partially electroplated with copper, high-speed signal transmission in part of the inner layer of a circuit board is realized, reflection and interference caused by excess electroplated copper on the inner wall of the bending groove to signals in the process of high-speed signal transmission are reduced, and the integrity of signal transmission is guaranteed. The board can better adapt to and meet the diverse needs of the market. The market competitiveness of products is improved.
Description
Technical field
The present invention relates to board production technical field, more particularly to a kind of false rigid-flex combined board and preparation method thereof.
Background technology
PCB (Printed Circuit Board), Chinese is printed circuit board, also known as printed substrate.Common
PCB is made up of hardboard, cannot be bent during installation and use, does not possess bending.Install and used to meet
The requirement of bending property in journey, can be combined making PCB, such PCB and be referred to as rigid-flex combined board by soft board and rigid plate.Rigid-flexible combination
Plate has rigid layer and flexible layers concurrently, is the circuit board for combining to form the flexible layers and rigid layer of lamelliform.Rigid-flex combined board changes
Traditional planar designs concept is become, design concept is expanded to the three dimensions of solid, brought huge to product design
It is convenient.Additionally, an also class PCB is referred to as false rigid-flex combined board, false rigid-flex combined board refers to using the production of conventional rigid plate
A kind of PCB product of alternative rigid-flex combined board that can realize three-dimensional installation that equipment, material and technique are manufactured.It is false
It is high that rigid-flex combined board is applied to some reliability requirements, but is not subjected to multiple dynamic bending, and only need to be in installation and maintenance
Bear finite number of time bending electronic product in.False rigid-flex combined board has the spies such as relatively low cost, low price and easy processing
Point.The conventional preparation method of existing false rigid-flex combined board is the deep gong channel process of control, that is, making with many of required circuit
Laminate and after having carried out surface treatment and processing and forming, needs the area for possessing bending property on multilayer boards by way of controlling deep gong groove
The bending groove of domain gong certain depth, because the thickness of slab at bending groove is smaller, so bending groove has certain bending, can bear
The bending of certain number of times.The conventional Making programme of existing false rigid-flex combined board is as follows：Sawing sheet → inner figure → internal layer erosion
Quarter → internal layer AOI → brown → pressing → outer layer drills → sinks the erosion of copper → electric plating of whole board → outer graphics → graphic plating → outer layer
Carve → take off tin → outer layer AOI → silk-screen welding resistance/character → surface treatment → shaping → control depth gong → electrical testing → FOC → FQA →
Packaging.With the high speed development and the demand of market diversification of electronic product performance, it is necessary to produce one kind and can further improve
Circuit board section internal layer high speed transmission of signals simultaneously reduces bending groove inwall because unnecessary electro-coppering is during high speed transmission of signals
The reflection and interference caused to signal, it is ensured that the false rigid-flex combined board of signal transmission integrality.
The content of the invention
It is false rigid-flexible without copper plate that the present invention can only make bending groove inwall for the deep gong groove process of existing control
The problem of board, there is provided a kind of internal partial wall of bending groove has a copper-plated false rigid-flex combined board, and this kind it is false just
The preparation method of flex combined board.
To achieve the above object, the present invention uses following technical scheme.
A kind of false rigid-flex combined board, including rigid region and flexure region, the flexure region are provided with bending groove, institute
The inwall for stating bending groove is divided into upper inside wall and lower inner wall, and the lower inner wall is connected with the bottom land of bending groove, the top
Inwall is located at the top of lower inner wall and is connected with lower inner wall；The outer layer of the upper inside wall is copper plate.
The preparation method of above-described false rigid-flex combined board, comprises the following steps：
Groove is bent on S1：Core material and outer copper foil are pressed by prepreg according to prior art and is integrated and root
Outer layer is completed according to borehole data to drill to form multilayer production plate；The multilayer production plate is provided with rigid region and flexure region；
Then, to control deep gong groove in the way of in flexure region gong groove, upper bending groove is obtained.
S2 hole slots metallize：Heavy copper and electric plating of whole board processing are carried out successively to multilayer production plate, multilayer is produced on plate
Hole and upper bending groove metallize.
S3 outer graphics and graphic plating：Patch dry film and exposed and developed processing on multilayer production plate, in multilayer life
Produce and outer-layer circuit figure is formed on plate, then electro-coppering and electrotinning successively on outer-layer circuit figure.
S4 bends groove：Continue gong groove at the bottom land of upper bending groove in the way of to control deep gong groove, bending groove is obtained；On described
The inwall for bending groove is the upper inside wall for bending groove, and the inwall bent between the bottom land and upper inside wall of groove is referred to as lower inner wall.
S5 outer-layer circuits：Removing the dry film on multilayer production plate and produce plate to multilayer according to prior art carries out outer layer erosion
Processing is carved, the tin layers on multilayer production plate are then taken off, outer-layer circuit figure is obtained.
Operation after S6：Solder mask, surface treatment, shaping are made according to prior art successively on multilayer production plate and is surveyed
Examination.
Preferably, above-described surface treatment is heavy nickel gold surface treatment.
Compared with prior art, the beneficial effects of the invention are as follows：Present invention system by way of using two secondary controls depth gong groove
Make bending groove, first made in the first secondary control depth gong groove and bend groove, upper bending groove metal is made through heavy copper and electric plating of whole board processing
Change, then carry out the second secondary control depth gong groove on the basis of upper bending groove again, bending groove is thus obtained.Because upper bending groove is heavy
Its cell wall has metallized in the processing of copper and electric plating of whole board, so as to realize that the part cell wall for bending groove has copper electroplating layer.Pass through
The inventive method make false rigid-flex combined board because bend groove inwall can parcel plating copper, circuit board is realized portion inner layer
High speed transmission of signals and reduce bending groove inwall it is anti-caused by unnecessary electro-coppering is during high speed transmission of signals to signal
Penetrate and disturb, it is ensured that the integrality of signal transmission, can better adapt to and meet the diversified demand in market, improve product
The market competitiveness.
Brief description of the drawings
Fig. 1 is the structural representation of false rigid-flex combined board in embodiment；
Fig. 2 be embodiment in made it is upper bending groove multilayer produce plate structural representation；
Fig. 3 is the structural representation of the upper multilayer production plate bent after groove metallization in embodiment.
Specific embodiment
In order to more fully understand technology contents of the invention, with reference to specific embodiment to technical scheme
It is described further and illustrates.
Embodiment
Reference picture 1, the present embodiment provides a kind of four layers of false rigid-flex combined board, and the false rigid-flex combined board is by rigid region
Domain and flexure region are constituted, and are from top to bottom successively copper plates 40 in Fig. 1, have been made the outer copper foil layer of outer-layer circuit
31st, layer of prepreg 21, made the core material layer 10, layer of prepreg 22 of internal layer circuit and made the outer of outer-layer circuit
Layer copper foil layer 32.Bending groove 50 is provided with the flexure region of false rigid-flex combined board, and the inwall for bending groove 50 is divided into
Portion's inwall 51 and lower inner wall 52, the lower inner wall 52 are connected with the bottom land 53 of bending groove 50, and upper inside wall 51 is located at bottom
The top of inwall 52 is simultaneously connected with lower inner wall 52, and the outer layer of upper inside wall 51 is copper plate 40.
Make comprising the following steps that for the false rigid-flex combined board described in the present embodiment：
(1) operation before
According to prior art, sequentially pass through sawing sheet → negative film technique and make internal layer circuit → pressing → outer layer drilling, will be interior
Layer core plate and outer copper foil are fabricated to multilayer production plate, i.e., will have been made by prepreg the core material of internal layer circuit with it is outer
Layer Copper Foil pressing is integrated and completes outer layer according to borehole data and drill to form multilayer production plate；The multilayer production plate is provided with
Rigid region and flexure region.It is specific as follows：
A, sawing sheet：Core plate, core thickness 1.1mm H/H are outputed by jigsaw size 520mm × 620mm.
B, internal layer circuit (negative film technique)：LDI dry films, stand 30min, using Full-automatic exposure machine, with 6 lattice exposure guide rules
(21 lattice exposure guide rule) completes internal layer circuit exposure, and line pattern is etched after development, and it is 3mil that internal layer line width is measured.
C, internal layer AOI：Check internal layer opens the defects such as short circuit, circuit breach, circuit pin hole, defective to scrap treatment, nothing
The product of defect goes out to downstream.
D, pressing：Brown speed is selected according to thickness of slab.After lamination, pressed from appropriate lamination according to plate Tg
Close.
E, outer layer drilling：Drilling operation (including through hole and blind hole) is carried out using borehole data.
(2) groove is bent on
The flexure region gong groove of plate is produced in multilayer using the existing accurate deep gong groove equipment of control, the depth of control flume is into
Groove inwall is bent in product needs the depth of electro-coppering, and the groove for being formed is referred to as bending groove, as shown in Figure 2.In Fig. 2, on toward
Under be successively that outer copper foil layer 31, layer of prepreg 21, core material layer 10, layer of prepreg 22, outer copper foil layer 32,60 is
Upper bending groove.
(3) hole slot metallization
Heavy copper and electric plating of whole board processing are carried out successively to multilayer production plate, multilayer is produced the hole on plate and upper bending groove gold
Categoryization.The inwall for bending groove is plated layers of copper covering, that is, the top layer for bending groove inwall is copper electroplating layer, as shown in Figure 3.In Fig. 3,
It is successively from top to bottom copper plate 40, outer copper foil layer 31, layer of prepreg 21, core material layer 10, layer of prepreg 22, outer
Layer copper foil layer 32,70 is the upper bending groove after metallization.
(4) outer graphics and graphic plating
Patch dry film and exposed and developed processing on multilayer production plate, outer-layer circuit figure is formed on multilayer production plate
Shape, then electro-coppering and electrotinning successively on outer-layer circuit figure.It is specific as follows：
(5) groove is bent
Continue down gong groove at the bottom land of upper bending groove using the existing accurate deep gong groove equipment of control, the step institute gong
Groove constitutes bending groove together with upper bending groove, and the inwall of upper bending groove is the upper inside wall of bending groove, bend the bottom land of groove with
Inwall between upper inside wall is referred to as lower inner wall.
(6) outer-layer circuit
Removing the dry film on multilayer production plate and produce plate to multilayer according to prior art carries out outer layer etching and processing, then
The tin layers on multilayer production plate are taken off, outer-layer circuit figure is obtained.Then carry out outer layer AOI, check the line width of circuit, spacing,
Circuit pin hole and whether there is circuit breach, and check product and product requirement whether mutually equal relevant item.
(6) operation afterwards
Solder mask, surface treatment, shaping are made according to prior art successively on multilayer production plate and is tested.Specifically such as
Under：
A, silk-screen welding resistance, character：Using white wire mark brush TOP faces solder mask, TOP faces character addition UL marks.
B, heavy nickel gold：By chemically reacting, the copper surface opened a window in welding resistance deposits one layer of nickel and one layer of gold respectively, has it
There is excellent solderability and wearability etc..
C, shaping：Gong external form, the +/- 0.05mm of external form tolerance.
D, electrical testing：The electric property of test-based examination production board.
E, eventually inspection：Check that the aesthetic appearance of production board is bad.
f、FQA：Outward appearance, measured hole copper thickness, thickness of dielectric layers, green oil thickness, internal layer copper thickness etc. are taken a sample test again.
The above only further illustrates technology contents of the invention with embodiment, is easier to understand in order to reader,
But embodiments of the present invention not being represented and being only limitted to this, any technology done according to the present invention extends or recreates, and is sent out by this
Bright protection.
Claims (3)
1. a kind of false rigid-flex combined board, including rigid region and flexible region, the flexible region are provided with bending groove, and its feature exists
In the inwall of the bending groove is divided into upper inside wall and lower inner wall, and the lower inner wall is connected with the bottom land of bending groove, described
Upper inside wall is located at the top of lower inner wall and is connected with lower inner wall；The outer layer of the upper inside wall is copper plate.
2. it is a kind of as claimed in claim 1 false rigid-flex combined board preparation method, it is characterised in that comprise the following steps：
Groove is bent on S1：Core material and outer copper foil are pressed by prepreg according to prior art and is integrated and according to brill
Hole data completes outer layer and drills to form multilayer production plate；The multilayer production plate is provided with rigid region and flexure region；
Then, to control deep gong groove in the way of on flexible region gong groove, upper bending groove is obtained；
S2 hole slots metallize：Heavy copper and electric plating of whole board processing are carried out successively to multilayer production plate, make multilayer produce the hole on plate and
Upper bending groove metallization；
S3 outer graphics and graphic plating：Patch dry film and exposed and developed processing on multilayer production plate, plate is produced in multilayer
Upper formation outer-layer circuit figure, then electro-coppering and electrotinning successively on outer-layer circuit figure；
S4 bends groove：Continue gong groove at the bottom land of upper bending groove in the way of to control deep gong groove, bending groove is obtained；The upper bending
The inwall of groove is the upper inside wall for bending groove, and the inwall bent between the bottom land and upper inside wall of groove is referred to as lower inner wall；
S5 outer-layer circuits：Remove the dry film on multilayer production plate and outer layer etching is carried out to multilayer production plate according to prior art and add
Work, then takes off the tin layers on multilayer production plate, and outer-layer circuit figure is obtained；
Operation after S6：Solder mask, surface treatment, shaping are made according to prior art successively on multilayer production plate and is tested.
3. a kind of preparation method of false rigid-flex combined board according to claim 2, it is characterised in that described in step S6
It is heavy nickel gold surface treatment to be surface-treated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611193006.0A CN106714453B (en) | 2016-12-21 | 2016-12-21 | A kind of false rigid-flex combined board and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611193006.0A CN106714453B (en) | 2016-12-21 | 2016-12-21 | A kind of false rigid-flex combined board and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106714453A true CN106714453A (en) | 2017-05-24 |
| CN106714453B CN106714453B (en) | 2019-04-02 |
Family
ID=58938578
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611193006.0A Active CN106714453B (en) | 2016-12-21 | 2016-12-21 | A kind of false rigid-flex combined board and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106714453B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111295053A (en) * | 2020-03-31 | 2020-06-16 | 生益电子股份有限公司 | PCB (printed circuit board) with embedded heat conductor and preparation method thereof |
| CN112261800A (en) * | 2020-10-26 | 2021-01-22 | 景旺电子科技(龙川)有限公司 | Manufacturing method of high-heat-dissipation PCB |
| CN112351585A (en) * | 2020-09-16 | 2021-02-09 | 东莞康源电子有限公司 | PCB side wall metallization manufacturing method |
| CN115843158A (en) * | 2023-02-22 | 2023-03-24 | 遂宁睿杰兴科技有限公司 | Printed circuit board with embedded inductance magnetic core and manufacturing method thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101365298A (en) * | 2008-08-22 | 2009-02-11 | 汕头超声印制板公司 | Manufacturing method for semi-flexible printed circuit board |
| CN102686025A (en) * | 2012-05-07 | 2012-09-19 | 华为技术有限公司 | Printed circuit board (PCB) of power supply module, power supply module and manufacturing method thereof |
| CN102802361A (en) * | 2012-08-27 | 2012-11-28 | 皆利士多层线路版(中山)有限公司 | Making method of semi-flexible printed circuit board |
| CN103096647A (en) * | 2011-10-31 | 2013-05-08 | 健鼎（无锡）电子有限公司 | Method for manufacturing bent type printed circuit board (PCB) |
| CN103298240A (en) * | 2012-08-09 | 2013-09-11 | 伟裕(厦门)电子有限公司 | Flexibility and hardness combined circuit board and manufacturing method thereof |
| CN105163526A (en) * | 2015-08-21 | 2015-12-16 | 深圳崇达多层线路板有限公司 | Manufacturing method of stepped grooves, and printed circuit board comprising stepped grooves |
-
2016
- 2016-12-21 CN CN201611193006.0A patent/CN106714453B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101365298A (en) * | 2008-08-22 | 2009-02-11 | 汕头超声印制板公司 | Manufacturing method for semi-flexible printed circuit board |
| CN103096647A (en) * | 2011-10-31 | 2013-05-08 | 健鼎（无锡）电子有限公司 | Method for manufacturing bent type printed circuit board (PCB) |
| CN102686025A (en) * | 2012-05-07 | 2012-09-19 | 华为技术有限公司 | Printed circuit board (PCB) of power supply module, power supply module and manufacturing method thereof |
| CN103298240A (en) * | 2012-08-09 | 2013-09-11 | 伟裕(厦门)电子有限公司 | Flexibility and hardness combined circuit board and manufacturing method thereof |
| CN102802361A (en) * | 2012-08-27 | 2012-11-28 | 皆利士多层线路版(中山)有限公司 | Making method of semi-flexible printed circuit board |
| CN105163526A (en) * | 2015-08-21 | 2015-12-16 | 深圳崇达多层线路板有限公司 | Manufacturing method of stepped grooves, and printed circuit board comprising stepped grooves |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111295053A (en) * | 2020-03-31 | 2020-06-16 | 生益电子股份有限公司 | PCB (printed circuit board) with embedded heat conductor and preparation method thereof |
| CN111295053B (en) * | 2020-03-31 | 2021-07-16 | 生益电子股份有限公司 | PCB (printed circuit board) with embedded heat conductor and preparation method thereof |
| CN112351585A (en) * | 2020-09-16 | 2021-02-09 | 东莞康源电子有限公司 | PCB side wall metallization manufacturing method |
| CN112261800A (en) * | 2020-10-26 | 2021-01-22 | 景旺电子科技(龙川)有限公司 | Manufacturing method of high-heat-dissipation PCB |
| CN115843158A (en) * | 2023-02-22 | 2023-03-24 | 遂宁睿杰兴科技有限公司 | Printed circuit board with embedded inductance magnetic core and manufacturing method thereof |
| CN115843158B (en) * | 2023-02-22 | 2023-05-12 | 遂宁睿杰兴科技有限公司 | Printed circuit board embedded with inductance magnetic core and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106714453B (en) | 2019-04-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101951736B (en) | Process for producing circuit board metallized semi-holes | |
| CN104717846B (en) | The preparation method of metallization slotted eye in a kind of PCB | |
| CN100574569C (en) | A kind of production method with long and short golden finger circuit board | |
| CN104363720B (en) | A kind of method for making deep blind slot in the pcb | |
| CN106714453B (en) | A kind of false rigid-flex combined board and preparation method thereof | |
| CN104363704B (en) | A kind of thick hole copper PCB preparation method | |
| CN105208790B (en) | A method of making solder mask on PCB | |
| CN110678011A (en) | Manufacturing method of rigid-flex printed circuit board | |
| CN105764270A (en) | Manufacturing method of PCB possessing entire board electrolytic gold and golden finger surface processing | |
| CN105848423B (en) | A kind of production method of the PCB with electroplating gold and chemical two kinds of surface treatments of turmeric | |
| CN107027245B (en) | A kind of production method of welding resistance bridge | |
| CN108260303A (en) | The production method that laser drill and back drill hole are filled out in a kind of while plating | |
| CN104378931B (en) | The preparation method of metallization counterbore in a kind of PCB | |
| CN110337200A (en) | A kind of production method of high frequency mixed pressure printed circuit board | |
| CN107708316A (en) | A kind of preparation method of superfinishing fine rule road | |
| CN106982521A (en) | A kind of copper-plated preparation method of high thickness to diameter ratio printed circuit board through hole | |
| CN110430677A (en) | It is a kind of to improve back drill hole burr and crimp hole PCB preparation method less than normal | |
| CN111787698B (en) | Z-shaped slot hole machining method | |
| CN108811353A (en) | A kind of engraving method of two sides different Cu thickness PCB | |
| CN106793578A (en) | A kind of PCB preparation methods in electric thick gold hole | |
| CN108551731A (en) | Production method of the aperture without the exposed non-metallic hole of base material on a kind of wiring board | |
| CN108449883A (en) | A kind of surface treatment is the production method for the wiring board that electric nickel gold adds part electricity gold | |
| CN108289388A (en) | The undesirable PCB production methods of tin in a kind of prevention | |
| CN108401381A (en) | A kind of production method of disconnecting golden finger class printed circuit board | |
| CN110121239A (en) | A kind of production method of mechanical blind hole half bore |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |