CN108289388A - The undesirable PCB production methods of tin in a kind of prevention - Google Patents
The undesirable PCB production methods of tin in a kind of prevention Download PDFInfo
- Publication number
- CN108289388A CN108289388A CN201711288595.5A CN201711288595A CN108289388A CN 108289388 A CN108289388 A CN 108289388A CN 201711288595 A CN201711288595 A CN 201711288595A CN 108289388 A CN108289388 A CN 108289388A
- Authority
- CN
- China
- Prior art keywords
- copper
- layer
- layer circuit
- tin
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
Abstract
The invention discloses a kind of undesirable PCB production methods of tin in prevention, include the following steps：During making outer-layer circuit on producing plate, on the basis of copper layer thickness reaches design requirement plus one layer of layers of copper is plated, then etches outer-layer circuit；Include pad in the outer-layer circuit；Pad pasting on the pad to open a window is needed when producing plate post-production solder mask；The layers of copper of the non-pad pasting part of outer-layer circuit is thinned by etching；Return the film on production plate；Then making solder mask, silk-screen character, surface treatment and molding procedure are carried out to production plate successively, PCB is made.The method of the present invention is reduced the difference in height of pad and surrounding solder mask, is avoided PCB and occur the problem that rosin joint causes upper tin bad in SMT manufacturing process by the copper layer thickness of increase pad.
Description
Technical field
The present invention relates to printed wiring board manufacture technology fields, and in particular to the undesirable making sides PCB of tin in a kind of prevention
Method.
Background technology
Existing PCB manufacturing process, after having made outer-layer circuit, direct one layer of solder mask of silk-screen, passes through exposure in plate face
The copper face for needing to open a window is exposed in light, development, and the copper face at the above situation dropping window is less than the solder mask of surrounding；Can exist in this way
Problems with：It is less than the wiring board of 0.4mm pads for size, in SMT manufacturing process, when printing tin cream, corresponding above-mentioned size
The printing screen plate windowing of pad locations also mutually should be less than 0.4mm, the relatively entire other larger-size windowing pads of plate face, the position
The small size windowing pad (i.e. pad of the size less than 0.4mm) set is unable to get more tin cream amounts, so obtained tin cream amount
Also corresponding few, since paster pin size only has 0.4mm or less, plus the small size windowing pad of the position, (i.e. size is less than
The pad of 0.4mm) obtained tin cream amount can not make to fill between pad copper face and the difference in height of surrounding solder mask it is full, it may appear that
Rosin joint causes tin bad, in SMT, causes failure welding.
Invention content
The present invention is directed to the PCB for having dimensions less than 0.4mm pads in SMT manufacturing process, is susceptible to rosin joint, causes
The bad problem of upper tin, provides the undesirable PCB production methods of tin in a kind of prevention, this method pass through increase pad layers of copper it is thick
Degree reduces the difference in height of pad and surrounding solder mask, avoids PCB and occurs rosin joint in SMT manufacturing process and causes upper tin bad
The problem of.
In order to solve the above technical problem, the present invention provides a kind of undesirable PCB production methods of tin in prevention, including with
Lower step：
S1, produce plate on make outer-layer circuit during, on the basis of copper layer thickness reaches design requirement plus plating one
Layer layers of copper, then etches outer-layer circuit；Include pad in the outer-layer circuit；
S2, it needs to carry out pad pasting on the pad to open a window when producing plate post-production solder mask；
S3, the layers of copper that the non-pad pasting part of outer-layer circuit is thinned by etching；
S4, the film produced on plate is returned；
S5 then successively to production plate carry out making solder mask, silk-screen character, surface treatment and molding procedure, be made
PCB。
Preferably, in step S1, the copper thickness in outer-layer circuit figure adds one layer 10-50 μm of plating on the basis of design requirement
Thick layers of copper.
Preferably, the copper thickness of the non-pad pasting part of outer-layer circuit is thinned to the thickness of design requirement by etching.
Preferably, further include step S11 between step S1 and S2：AOI detections are carried out to outer-layer circuit.
Preferably, further include step S31 between step S3 and S4：AOI detections are carried out to outer-layer circuit.
Preferably, the production plate is the plank for having been subjected to heavy copper, electric plating of whole board.
It preferably,, first will be outer during graphic plating when carrying out making outer-layer circuit using positive blade technolgy in step S1
The copper thickness of sandwich circuit visuals, which adds, is plated to design requirement, then adds one layer of layers of copper of plating again.
Preferably, in step S1, when carrying out making outer-layer circuit using negative film technique, plate will be first produced in electric plating of whole board
The copper thickness of plate face, which adds, is plated to design requirement, then adds one layer of layers of copper of plating again.
Compared with prior art, the present invention has the advantages that：
The method of the present invention again plus plates one layer of layers of copper after the copper thickness of outer-layer circuit reaches design requirement, and non-pad is then thinned
The layers of copper for locating outer-layer circuit other parts, makes between pad and the circuit of surrounding that there are difference in height, line of the later stage at non-pad
After the silk-screen solder mask of road, make the upper surface of pad and the upper surface flush of solder mask or the upper surface higher than solder mask, in this way
The direct silk-screen of tin cream avoided rosin joint occur on small size pad, caused tin on pad in SMT manufacturing process later stage
Bad problem.
Specific implementation mode
In order to more fully understand the technology contents of the present invention, below in conjunction with specific embodiment to the technical side of the present invention
Case is described further and illustrates.
Embodiment 1
The undesirable PCB production methods of tin in a kind of prevention shown in the present embodiment include following treatment process successively：
(1), sawing sheet：Core plate is outputed by jigsaw size 720mm × 620mm, core thickness 1.2mm, the outer layer copper on core plate
Foil thickness is 1OZ.
(2), internal layer circuit makes (negative film technique)：Inner figure shifts, and light-sensitive surface, light-sensitive surface are coated with vertical application machine
8 μm of film thickness monitoring internal layer circuit exposure is completed, through aobvious with 5-6 lattice exposure guide rule (21 lattice exposure guide rule) using Full-automatic exposure machine
Movie queen forms inner line figure；Internal layer etches, and the core plate after exposure imaging is etched internal layer circuit, the measurement of internal layer line width is
3mil；Then internal layer AOI checks the defects of opening short circuit, circuit notch, circuit pin hole of internal layer circuit, defective to scrap processing,
Flawless product goes out to downstream.
(3), it presses：Brown speed carries out brown according to bottom copper copper thickness, by outer copper foil, prepreg, core plate, semi-solid preparation
Piece, outer copper foil overlap successively as required, then select lamination appropriate to be pressed according to plate Tg, form production
Plate.
(4), it drills：Drilling processing is carried out using borehole data.
(5), heavy copper：The hole metallization on production plate, backlight is set to test 10 grades, the heavy copper thickness in hole is 0.5 μm.
(6), electric plating of whole board：Electric plating of whole board is carried out according to the prior art and by design requirement to production plate, passes through full plate electricity
The copper thickness of plating plus plating is controlled at 5-10 μm.
(7), outer-layer circuit makes (positive blade technolgy)：Outer graphics shift, luxuriant and rich with fragrance using Full-automatic exposure machine and positive circuit
Woods completes outer-layer circuit exposure with 5-7 lattice exposure guide rule (21 lattice exposure guide rule), developed, and outer-layer circuit figure is formed on production plate
Shape；Outer graphics are electroplated, and first add the layers of copper in outer-layer circuit figure on production plate and are plated to design requirement, then add one layer of plating again
Layers of copper, tin plating on outer-layer circuit figure later, tin plating is that 10min, 3-5 μm of tin thickness is electroplated with the current density of 1.2ASD；So
It moves back film successively again afterwards, etch and move back tin, etch outer-layer circuit on production plate, include pad in outer-layer circuit；Outer layer
Then AOI checks the defects of opening short circuit, circuit notch, circuit pin hole of outer-layer circuit, defective to scrap processing, flawless
Product goes out to downstream.
Wherein, the layers of copper in outer-layer circuit figure adds be plated to design requirement after, later again plus plating copper layer thickness with after
The thickness of phase solder mask is identical or micro- thickness more than later stage solder mask, i.e., again plus the copper layer thickness of plating is controlled at 10-50 μm, makes
Obtain the upper surface of later stage pad and the upper surface flush of solder mask or the upper surface higher than solder mask.
(8), pad pasting：It needs to paste dry film on the pad to open a window when producing plate post-production solder mask, be protected with dry film
Pad makes other outer-layer circuit parts expose, and (such as golden finger draws for plated through-hole on plate and other lines that need not be etched
Line) also protected with dry film.
(9), it etches：The layers of copper being thinned in the outer-layer circuit part of non-pad pasting, the copper layer thickness of etching are etched by microetch
Control etches away again at 10-50 μm plus the layers of copper of plating, the copper layer thickness after being thinned controls the thickness in design requirement, to
Form the difference in height between pad and surrounding circuit.
(10), film is moved back：Return the dry film on production plate.
(11), outer layer AOI：Then the defects of opening short circuit, circuit notch, circuit pin hole of outer-layer circuit is checked, it is defective
Processing is scrapped, flawless product goes out to downstream.
(12), welding resistance, silk-screen character：White wire mark brush TOP is used according to the prior art and by design requirement on production plate
Face solder mask, the faces TOP character add " UL labels "；Solder mask upper surface after silk-screen and pad upper surface flush micro- are less than
Pad upper surface makes later stage PCB in SMT manufacturing process, and when silk-screen tin cream, the direct silk-screen of tin cream avoids on pad small
There is rosin joint on size pad, causes the problem that tin is bad
(13), surface treatment (heavy nickel gold):Principle is learned in pad copper face Tonghua of welding resistance windowing position, and uniform deposition centainly requires
The nickel layer and layer gold of thickness.
(14), it is molded：According to the prior art and design requirement gong shape is pressed, PCB is made in the +/- 0.05mm of external form tolerance.
(15), electric performance test：The electric property for detecting PCB detects qualified PCB and enters next processing link.
(16), final inspection：The appearance of production board is taken a sample test respectively.
(17)、FQA：Appearance, hole copper thickness, thickness of dielectric layers, green oil thickness, the internal layer copper thickness of production board are taken a sample test again
Enter in next step Deng, qualified product.
(18), it packs：By customer requirement, packaging is sealed to PCB, and is allowed to dry drying prescription and humidity card, then shipment.
Embodiment 2
The undesirable PCB production methods of tin in a kind of prevention shown in the present embodiment, the basic phase of this method and embodiment 1
Together, the difference is that step (6) and (7), specific as follows：
(6) electric plating of whole board carries out full plate electricity according to the prior art and by the outer-layer circuit copper thickness of design requirement to production plate
Plating, outer-layer circuit copper thickness add one layer of layers of copper of plating again after reaching design requirement.
Wherein, then add the copper layer thickness of plating identical as the thickness of later stage solder mask or micro- thickness more than later stage solder mask,
The copper layer thickness of plating is added to control at 10-50 μm again so that the upper end of later stage pad flushes or is slightly above with the upper end of solder mask
The upper end of solder mask.
(7), outer-layer circuit makes (negative film technique)：Outer graphics shift, and light-sensitive surface, light-sensitive surface are coated with vertical application machine
8 μm of film thickness monitoring outer-layer circuit exposure is completed, through aobvious with 5-6 lattice exposure guide rule (21 lattice exposure guide rule) using Full-automatic exposure machine
Movie queen forms outer-layer circuit figure；Outer layer etches, and the production plate after exposure imaging is etched outer-layer circuit, outer layer line width measures
Include pad in outer-layer circuit for 3mil；Outer layer AOI, then check outer-layer circuit opens short circuit, circuit notch, circuit
The defects of pin hole, defective to scrap processing, flawless product goes out to downstream.
Embodiment 3
The undesirable PCB production methods of tin in a kind of prevention shown in the present embodiment, the basic phase of this method and embodiment 1
Together, specific as follows the difference is that step (7) is to (9)：
(7), outer-layer circuit makes (negative film technique)：Outer graphics shift, and light-sensitive surface, light-sensitive surface are coated with vertical application machine
8 μm of film thickness monitoring outer-layer circuit exposure is completed, through aobvious with 5-6 lattice exposure guide rule (21 lattice exposure guide rule) using Full-automatic exposure machine
Movie queen forms outer-layer circuit figure；Outer layer etches, and the production plate after exposure imaging is etched outer-layer circuit, outer layer line width measures
Include pad of the size less than 0.4mm and the pad more than or equal to 0.4mm in outer-layer circuit for 3mil；Outer layer AOI,
Then the defects of opening short circuit, circuit notch, circuit pin hole of outer-layer circuit is checked, it is defective to scrap processing, flawless product
Go out to downstream.
Wherein, the layers of copper in outer-layer circuit figure adds be plated to design requirement after, later again plus plating copper layer thickness with after
The thickness of phase solder mask is identical or micro- thickness more than later stage solder mask, i.e., again plus the copper layer thickness of plating is controlled at 10-50 μm, makes
Obtain the upper surface of later stage pad and the upper surface flush of solder mask or the upper surface higher than solder mask.
(8), pad pasting：It needs to open a window when producing plate post-production solder mask and patch is dry on pad of the size less than 0.4mm
Film protects the pad that size is less than 0.4mm with dry film, so that other pads and outer-layer circuit part is exposed, and the gold on plate
Categoryization hole and other lines (such as gold finger lead) that need not be etched also are protected with dry film.
(9), it etches：The layers of copper being thinned in the outer-layer circuit part of non-pad pasting, the copper layer thickness of etching are etched by microetch
Control etches away again at 10-50 μm plus the layers of copper of plating, the copper layer thickness after being thinned controls the thickness in design requirement, to
Form the difference in height between pad and surrounding circuit of the size less than 0.4mm；Pad of the size more than or equal to 0.4mm is with it
Its outer-layer circuit layers of copper is equally etched thinned.
It is provided for the embodiments of the invention technical solution above to be described in detail, specific case used herein
The principle and embodiment of the embodiment of the present invention are expounded, the explanation of above example is only applicable to help to understand this
The principle of inventive embodiments；Meanwhile for those of ordinary skill in the art, embodiment according to the present invention, in specific embodiment party
There will be changes in formula and application range, in conclusion the content of the present specification should not be construed as limiting the invention.
Claims (8)
1. the undesirable PCB production methods of tin in a kind of prevention, which is characterized in that include the following steps：
S1, produce plate on make outer-layer circuit during, on the basis of copper layer thickness reaches design requirement plus plating one layer of copper
Layer, then etches outer-layer circuit；Include pad in the outer-layer circuit；
S2, pad pasting on the pad to open a window is needed when producing plate post-production solder mask；
S3, the layers of copper that the non-pad pasting part of outer-layer circuit is thinned by etching；
S4, the film produced on plate is returned；
S5 then successively to production plate carry out making solder mask, silk-screen character, surface treatment and molding procedure, be made PCB.
2. the undesirable PCB production methods of tin in prevention according to claim 1, which is characterized in that in step S1, in copper thickness
Add the layers of copper of one layer of 10-50 μ m-thick of plating on the basis of design requirement.
3. the undesirable PCB production methods of tin in prevention according to claim 2, which is characterized in that in step S3, pass through erosion
Carve the thickness that the copper thickness of the non-pad pasting part of outer-layer circuit is thinned to design requirement.
4. the undesirable PCB production methods of tin in prevention according to claim 1, which is characterized in that between step S1 and S2
Further include step S11：AOI detections are carried out to outer-layer circuit.
5. the undesirable PCB production methods of tin in prevention according to claim 4, which is characterized in that between step S3 and S4
Further include step S31：AOI detections are carried out to outer-layer circuit.
6. the undesirable PCB production methods of tin in prevention according to claim 1, which is characterized in that the production plate is
By heavy copper, the plank of electric plating of whole board.
7. the undesirable PCB production methods of tin in prevention according to claim 6, which is characterized in that in step S1, using just
When blade technolgy carries out making outer-layer circuit, first the copper thickness of outer-layer circuit visuals is added during graphic plating and is plated to design
It is required that then adding one layer of layers of copper of plating again.
8. the undesirable PCB production methods of tin in prevention according to claim 6, which is characterized in that in step S1, using negative
When blade technolgy carries out making outer-layer circuit, first the copper thickness for producing plate plate face is added in electric plating of whole board and is plated to design requirement, then
Again plus plating one layer of layers of copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711288595.5A CN108289388A (en) | 2017-12-07 | 2017-12-07 | The undesirable PCB production methods of tin in a kind of prevention |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711288595.5A CN108289388A (en) | 2017-12-07 | 2017-12-07 | The undesirable PCB production methods of tin in a kind of prevention |
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| Publication Number | Publication Date |
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| CN108289388A true CN108289388A (en) | 2018-07-17 |
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| CN201711288595.5A Pending CN108289388A (en) | 2017-12-07 | 2017-12-07 | The undesirable PCB production methods of tin in a kind of prevention |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112492755A (en) * | 2020-11-02 | 2021-03-12 | 江西旭昇电子有限公司 | Method for manufacturing micro solder mask definition bonding pad of lead-free tin-spraying plate |
| CN112739037A (en) * | 2020-11-07 | 2021-04-30 | 龙南骏亚柔性智能科技有限公司 | Manufacturing method of flexible circuit board with three copper thicknesses |
| CN113495384A (en) * | 2020-03-18 | 2021-10-12 | 华为技术有限公司 | Direct type backlight module, display device and manufacturing method of circuit board |
| CN115802601A (en) * | 2023-02-07 | 2023-03-14 | 四川英创力电子科技股份有限公司 | Flush printed circuit board and production method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113495384A (en) * | 2020-03-18 | 2021-10-12 | 华为技术有限公司 | Direct type backlight module, display device and manufacturing method of circuit board |
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| CN112492755B (en) * | 2020-11-02 | 2022-09-27 | 江西旭昇电子有限公司 | Method for manufacturing micro solder mask definition bonding pad of lead-free tin-spraying plate |
| CN112739037A (en) * | 2020-11-07 | 2021-04-30 | 龙南骏亚柔性智能科技有限公司 | Manufacturing method of flexible circuit board with three copper thicknesses |
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| CN115802601A (en) * | 2023-02-07 | 2023-03-14 | 四川英创力电子科技股份有限公司 | Flush printed circuit board and production method thereof |
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Application publication date: 20180717 |
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