CN112739037A - Manufacturing method of flexible circuit board with three copper thicknesses - Google Patents
Manufacturing method of flexible circuit board with three copper thicknesses Download PDFInfo
- Publication number
- CN112739037A CN112739037A CN202011234496.0A CN202011234496A CN112739037A CN 112739037 A CN112739037 A CN 112739037A CN 202011234496 A CN202011234496 A CN 202011234496A CN 112739037 A CN112739037 A CN 112739037A
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- Prior art keywords
- circuit board
- substrate
- flexible circuit
- film
- copper
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
Abstract
The invention discloses a method for manufacturing flexible circuit boards with three copper thicknesses, which belongs to the technical field of flexible circuit board manufacturing and comprises the following steps: s1, primarily cutting the substrate of the flexible circuit board, and cutting; s2, drilling a substrate of the flexible circuit board for designing the shape of the substrate; s3, carrying out whole-board electroplating on the substrate of the flexible circuit board, forming conductive paths among different layers, and realizing the copper thickness of the whole area of the flexible circuit board; s4, chemically cleaning the substrate of the flexible circuit board; s5, carrying out first dry film pressing treatment on the substrate of the flexible circuit board; and S6, carrying out exposure and development processing for the first time on the substrate of the flexible circuit board. The manufacturing method of the flexible circuit board is realized by using a manufacturing method of matching whole-board electroplating, selective electroplating and selective copper reduction, the problem of step difference existing in three copper thicknesses can be effectively avoided, the phenomenon of unreal dry film in the circuit manufacturing process is caused, and the circuit manufacturing yield is greatly improved.
Description
Technical Field
The invention belongs to the technical field of flexible circuit board manufacturing, and particularly relates to a manufacturing method of three copper-thick flexible circuit boards.
Background
At present, the copper thickness of the conventional flexible circuit board in the industry is uniform, namely, one product only has one copper thickness requirement; due to the bending requirement of special products, two copper thicknesses can be formed in a pattern electroplating mode so as to meet the product requirement.
With the continuous updating and rapid development of products, the existing product structure can not meet the requirements of customers, and through research and repeated tests, three manufacturing methods of flexible circuit boards with copper thicknesses are developed to meet the requirements of the design structures of the customers, and can be realized through a manufacturing method of whole board electroplating, selective electroplating and selective copper reduction matching according to the copper thickness requirements of the customers on different areas.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a method for manufacturing three copper-thick flexible circuit boards, which aims to solve the problems in the background art.
In order to achieve the purpose, the invention provides the following technical scheme: a manufacturing method of flexible circuit boards with three copper thicknesses comprises the following steps:
s1, primarily cutting the substrate of the flexible circuit board, and cutting;
s2, drilling a substrate of the flexible circuit board for designing the shape of the substrate;
s3, carrying out whole-board electroplating on the substrate of the flexible circuit board, forming conductive paths among different layers, and realizing the copper thickness of the whole area of the flexible circuit board;
s4, chemically cleaning the substrate of the flexible circuit board;
s5, carrying out first dry film pressing treatment on the substrate of the flexible circuit board;
s6, carrying out exposure and development treatment on the substrate of the flexible circuit board for the first time;
s7, chemically etching the substrate of the flexible circuit board;
s8, removing the film of the etched flexible circuit board;
s9, performing a second film drying process, a second exposure and a second development process on partial areas of the flexible circuit board according to the structural design requirements of customers;
s10, selectively electroplating in a designated area according to the structural design requirements of customers, and increasing the copper thickness of the circuit board in the area;
s11, performing secondary film stripping treatment on the circuit board in the designated area;
s12, performing third film pressing and drying treatment, third exposure and third development treatment on partial area of the flexible circuit board according to the structural design requirements of customers;
s13, selectively reducing copper in a designated area according to the structural design requirements of customers, and reducing the copper thickness of the circuit board in the area;
s14, carrying out film stripping treatment for the third time on the circuit board in the designated area;
and S15, finishing the subsequent normal flow of the flexible circuit board.
Further optimizing the technical scheme, in the step S4, the chemical cleaning is laser cleaning to clean the oxide layer on the substrate, and the copper oxide on the copper foil of the substrate can continuously oxidize the flexible printed circuit board, which can reduce the service life of the flexible printed circuit board.
Further optimize this technical scheme, in S5, the main constitution of dry film is PE, photosensitive film and PET, and wherein, PE layer and PET layer play the guard action, need remove before the press mold, and the photosensitive film is located the centre of dry film, the photosensitive film is the photosensitive resistance agent, needs to have certain viscidity and good photosensitivity.
Further optimizing the technical solution, in S6, the substrate of the flexible printed circuit board is manufactured on the film, and the circuit on the film is exposed on the substrate of the flexible printed circuit board with the photosensitive film attached thereon by using an exposure machine, so that the circuit can be transferred to the copper foil of the substrate, and the developing solution is dripped to develop the circuit.
Further optimizing the technical scheme, in S7, when chemical etching is used, hydrochloric acid acidic solution is used for etching the flexible circuit board, and sulfuric acid acidic solution is used for etching the hard circuit board.
Further optimizing the technical scheme, the dry film is attached to the substrate of the flexible circuit board, the circuit is basically molded after exposure and development, and the dry film mainly plays a role in image transfer and circuit protection in the etching process.
Further optimizing the technical scheme, the second film pressing and drying treatment, the second exposure, the second developing treatment and the second film removing treatment are the same as the first treatment method.
Further optimizing the technical scheme, the third film pressing and drying treatment, the third exposure, the third developing treatment and the third film removing treatment are the same as the first treatment method.
Compared with the prior art, the invention provides a method for manufacturing three copper-thick flexible circuit boards, which has the following beneficial effects:
the manufacturing method of the flexible circuit board with three copper thicknesses is realized by using a manufacturing method of whole-board electroplating, selective electroplating and selective copper reduction matching, the problem that the three copper thicknesses have step differences and the phenomenon that a dry film is not real in the circuit manufacturing process is caused can be effectively avoided, and the circuit manufacturing yield is greatly improved.
Drawings
Fig. 1 is a schematic product structure diagram of a three copper-thick flexible circuit board manufacturing method provided by the invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The first embodiment is as follows:
a manufacturing method of flexible circuit boards with three copper thicknesses comprises the following steps:
s1, primarily cutting the substrate of the flexible circuit board, and cutting;
s2, drilling a substrate of the flexible circuit board for designing the shape of the substrate;
s3, carrying out whole-board electroplating on the substrate of the flexible circuit board, forming conductive paths among different layers, and realizing the copper thickness of the whole area of the flexible circuit board;
s4, chemically cleaning the substrate of the flexible circuit board;
s5, carrying out first dry film pressing treatment on the substrate of the flexible circuit board;
s6, carrying out exposure and development treatment on the substrate of the flexible circuit board for the first time;
s7, chemically etching the substrate of the flexible circuit board;
s8, removing the film of the etched flexible circuit board;
s9, performing a second film drying process, a second exposure and a second development process on partial areas of the flexible circuit board according to the structural design requirements of customers;
s10, selectively electroplating in a designated area according to the structural design requirements of customers, and increasing the copper thickness of the circuit board in the area;
s11, performing secondary film stripping treatment on the circuit board in the designated area;
s12, performing third film pressing and drying treatment, third exposure and third development treatment on partial area of the flexible circuit board according to the structural design requirements of customers;
s13, selectively reducing copper in a designated area according to the structural design requirements of customers, and reducing the copper thickness of the circuit board in the area;
s14, carrying out film stripping treatment for the third time on the circuit board in the designated area;
and S15, finishing the subsequent normal flow of the flexible circuit board.
Specifically, in S4, the chemical cleaning is laser cleaning to clean an oxide layer on the substrate, and the copper oxide on the copper foil of the substrate can continuously oxidize the flexible printed circuit board, which can reduce the service life of the flexible printed circuit board.
Specifically, in S5, the dry film mainly includes PE, a photosensitive film and PET, where the PE layer and the PET layer are used for protection and need to be removed before lamination, the photosensitive film is located in the middle of the dry film, and the photosensitive film is a photosensitive resist and needs to have a certain viscosity and good photosensitivity.
Specifically, in S6, the substrate of the flexible printed circuit board is formed on the film, and the circuit on the film is exposed on the substrate of the flexible printed circuit board with the photosensitive film attached thereto by using an exposure machine, so that the circuit is transferred onto the copper foil of the substrate, and the substrate is developed by dropping a developing solution.
Specifically, in S7, when the chemical etching is used, the flexible printed circuit board is etched by using an acidic hydrochloric acid solution, and when the hard circuit board is etched, the flexible printed circuit board is etched by using an acidic sulfuric acid solution.
Specifically, the dry film is attached to a substrate of the flexible circuit board, and after exposure and development, the circuit is basically molded, so that the dry film mainly plays a role in image transfer in the process and plays a role in protecting the circuit in the etching process.
Specifically, the second press drying film treatment, the second exposure, the second developing treatment and the second film removing treatment are the same as the first treatment method.
Specifically, the third press-drying film treatment, the third exposure, the third developing treatment and the third film removing treatment are the same as the first treatment method.
Example two:
referring to fig. 1, the three copper thickness requirements are sequentially that a B area is greater than or equal to a area and greater than or equal to a C area, the copper thickness of the a area is realized by performing a first treatment through whole plate electroplating, the copper thickness of the B area is realized by performing a second treatment through selective electroplating, and the copper thickness of the C area is realized by performing a third treatment through selective copper reduction, that is, the three copper thickness requirements are finally realized through a manufacturing method of adding and reducing, so that the copper thickness of the a area is 35um, the copper thickness of the B area is 55um, and the copper thickness of the a area is 20 um. Meanwhile, by adopting the manufacturing method, the batch manufacturing of products is realized, and the structural design requirements of customers are met.
The test results of the two examples show that: the manufacturing method of the flexible circuit board with three copper thicknesses is realized by using a manufacturing method of whole-board electroplating, selective electroplating and selective copper reduction matching, the problem that the three copper thicknesses have step differences and the phenomenon that a dry film is not real in the circuit manufacturing process is caused can be effectively avoided, and the circuit manufacturing yield is greatly improved.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. A manufacturing method of flexible circuit boards with three copper thicknesses is characterized by comprising the following steps:
s1, primarily cutting the substrate of the flexible circuit board, and cutting;
s2, drilling a substrate of the flexible circuit board for designing the shape of the substrate;
s3, carrying out whole-board electroplating on the substrate of the flexible circuit board, forming conductive paths among different layers, and realizing the copper thickness of the whole area of the flexible circuit board;
s4, chemically cleaning the substrate of the flexible circuit board;
s5, carrying out first dry film pressing treatment on the substrate of the flexible circuit board;
s6, carrying out exposure and development treatment on the substrate of the flexible circuit board for the first time;
s7, chemically etching the substrate of the flexible circuit board;
s8, removing the film of the etched flexible circuit board;
s9, performing a second film drying process, a second exposure and a second development process on partial areas of the flexible circuit board according to the structural design requirements of customers;
s10, selectively electroplating in a designated area according to the structural design requirements of customers, and increasing the copper thickness of the circuit board in the area;
s11, performing secondary film stripping treatment on the circuit board in the designated area;
s12, performing third film pressing and drying treatment, third exposure and third development treatment on partial area of the flexible circuit board according to the structural design requirements of customers;
s13, selectively reducing copper in a designated area according to the structural design requirements of customers, and reducing the copper thickness of the circuit board in the area;
s14, carrying out film stripping treatment for the third time on the circuit board in the designated area;
and S15, finishing the subsequent normal flow of the flexible circuit board.
2. The method as claimed in claim 1, wherein in step S4, the chemical cleaning is laser cleaning to remove an oxide layer on the substrate, and the copper oxide on the copper foil of the substrate can continuously oxidize the flexible printed circuit board and reduce the service life of the flexible printed circuit board.
3. The method as claimed in claim 1, wherein in S5, the dry film mainly comprises PE, photosensitive film and PET, wherein the PE layer and the PET layer are used for protection and need to be removed before lamination, the photosensitive film is located in the middle of the dry film, and the photosensitive film is a photoresist and needs to have certain viscosity and good photosensitivity.
4. The method of claim 1, wherein in step S6, a substrate of the flexible printed circuit board is formed on a film, and the circuits on the film are exposed on the substrate of the flexible printed circuit board with a photosensitive film attached thereon by using an exposure machine, so that the circuits are transferred onto the copper foil of the substrate, and a developing solution is dropped to develop the circuits.
5. The method as claimed in claim 1, wherein in step S7, the flexible printed circuit board is etched by hydrochloric acid solution when chemical etching is used, and etched by sulfuric acid solution when hard printed circuit is etched.
6. The method according to claim 3, wherein the dry film is attached to a substrate of the flexible printed circuit board, and after exposure and development, the circuit is substantially formed, and the dry film mainly functions as an image transfer function and protects the circuit during etching.
7. The method of claim 1, wherein the second drying process, the second exposure, the second developing process and the second stripping process are the same as the first process.
8. The method of claim 1, wherein the third press drying process, the third exposure process, the third developing process and the third stripping process are the same as the first process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011234496.0A CN112739037B (en) | 2020-11-07 | 2020-11-07 | Manufacturing method of flexible circuit board with three copper thicknesses |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011234496.0A CN112739037B (en) | 2020-11-07 | 2020-11-07 | Manufacturing method of flexible circuit board with three copper thicknesses |
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| Publication Number | Publication Date |
|---|---|
| CN112739037A true CN112739037A (en) | 2021-04-30 |
| CN112739037B CN112739037B (en) | 2022-08-09 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202011234496.0A Active CN112739037B (en) | 2020-11-07 | 2020-11-07 | Manufacturing method of flexible circuit board with three copper thicknesses |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114945250A (en) * | 2021-12-29 | 2022-08-26 | 龙南骏亚电子科技有限公司 | Process and equipment for reserving copper at edge of inner coating plate of HDI circuit board |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3121131A1 (en) * | 1981-05-27 | 1983-06-01 | AEG-Telefunken Nachrichtentechnik GmbH, 7150 Backnang | Process for producing printed circuit boards provided with conductor tracks and having metallic plated-through holes |
| CN103731997A (en) * | 2013-12-24 | 2014-04-16 | 广州兴森快捷电路科技有限公司 | PCB containing stepped copper thickness patterns and manufacturing method thereof |
| CN104470234A (en) * | 2014-11-28 | 2015-03-25 | 广东依顿电子科技股份有限公司 | Method for producing step copper-plated PCB |
| CN104717849A (en) * | 2013-12-12 | 2015-06-17 | 深南电路有限公司 | Method for manufacturing local-thick-copper circuit board and local-thick-copper circuit board |
| CN105338758A (en) * | 2014-06-11 | 2016-02-17 | 深南电路有限公司 | Multistage perforated copper differential circuit board and processing method thereof |
| CN105472900A (en) * | 2014-09-05 | 2016-04-06 | 深南电路有限公司 | Processing method of circuit board |
| TW201625096A (en) * | 2014-12-29 | 2016-07-01 | 欣興電子股份有限公司 | Method for manufacturing circuit board and circuit board thereof |
| CN107683025A (en) * | 2017-11-01 | 2018-02-09 | 汕头凯星印制板有限公司 | A kind of manufacture method of the non-homogeneous copper thickness pcb board of same aspect |
| CN108289388A (en) * | 2017-12-07 | 2018-07-17 | 江门崇达电路技术有限公司 | The undesirable PCB production methods of tin in a kind of prevention |
| CN110475426A (en) * | 2018-05-11 | 2019-11-19 | 南亚电路板股份有限公司 | Printed circuit board arrangement and forming method thereof |
| CN110996535A (en) * | 2019-11-25 | 2020-04-10 | 景旺电子科技(龙川)有限公司 | Method for manufacturing circuit layer stepped copper thick copper base circuit board by using additive method |
| CN111278229A (en) * | 2020-03-20 | 2020-06-12 | 盐城维信电子有限公司 | Preparation method of voice coil motor flexible circuit board |
-
2020
- 2020-11-07 CN CN202011234496.0A patent/CN112739037B/en active Active
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3121131A1 (en) * | 1981-05-27 | 1983-06-01 | AEG-Telefunken Nachrichtentechnik GmbH, 7150 Backnang | Process for producing printed circuit boards provided with conductor tracks and having metallic plated-through holes |
| CN104717849A (en) * | 2013-12-12 | 2015-06-17 | 深南电路有限公司 | Method for manufacturing local-thick-copper circuit board and local-thick-copper circuit board |
| CN103731997A (en) * | 2013-12-24 | 2014-04-16 | 广州兴森快捷电路科技有限公司 | PCB containing stepped copper thickness patterns and manufacturing method thereof |
| CN105338758A (en) * | 2014-06-11 | 2016-02-17 | 深南电路有限公司 | Multistage perforated copper differential circuit board and processing method thereof |
| CN105472900A (en) * | 2014-09-05 | 2016-04-06 | 深南电路有限公司 | Processing method of circuit board |
| CN104470234A (en) * | 2014-11-28 | 2015-03-25 | 广东依顿电子科技股份有限公司 | Method for producing step copper-plated PCB |
| TW201625096A (en) * | 2014-12-29 | 2016-07-01 | 欣興電子股份有限公司 | Method for manufacturing circuit board and circuit board thereof |
| CN107683025A (en) * | 2017-11-01 | 2018-02-09 | 汕头凯星印制板有限公司 | A kind of manufacture method of the non-homogeneous copper thickness pcb board of same aspect |
| CN108289388A (en) * | 2017-12-07 | 2018-07-17 | 江门崇达电路技术有限公司 | The undesirable PCB production methods of tin in a kind of prevention |
| CN110475426A (en) * | 2018-05-11 | 2019-11-19 | 南亚电路板股份有限公司 | Printed circuit board arrangement and forming method thereof |
| CN110996535A (en) * | 2019-11-25 | 2020-04-10 | 景旺电子科技(龙川)有限公司 | Method for manufacturing circuit layer stepped copper thick copper base circuit board by using additive method |
| CN111278229A (en) * | 2020-03-20 | 2020-06-12 | 盐城维信电子有限公司 | Preparation method of voice coil motor flexible circuit board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114945250A (en) * | 2021-12-29 | 2022-08-26 | 龙南骏亚电子科技有限公司 | Process and equipment for reserving copper at edge of inner coating plate of HDI circuit board |
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| CN112739037B (en) | 2022-08-09 |
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