CN110996535B - Method for manufacturing circuit layer stepped copper thick copper base circuit board by using additive method - Google Patents
Method for manufacturing circuit layer stepped copper thick copper base circuit board by using additive method Download PDFInfo
- Publication number
- CN110996535B CN110996535B CN201911166250.1A CN201911166250A CN110996535B CN 110996535 B CN110996535 B CN 110996535B CN 201911166250 A CN201911166250 A CN 201911166250A CN 110996535 B CN110996535 B CN 110996535B
- Authority
- CN
- China
- Prior art keywords
- copper
- circuit
- electroplating
- line
- thick
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses a method for manufacturing a circuit board with a stepped copper thick copper base on a circuit layer by using an addition method, and relates to the technical field of circuit board manufacturing. The copper substrate comprises a copper base surface and a circuit surface, the circuit surface is provided with a thick copper area, and the manufacturing method comprises the following steps: the first circuit → solder mask → the second circuit → pattern plating → the third circuit. The invention discloses a method for manufacturing a copper-based circuit board with a circuit layer with a step copper thickness by utilizing an additive process, exposing a position needing to manufacture thick copper through pattern transfer of a semi-finished circuit board which is subjected to solder mask, and then carrying out pattern electroplating for multiple times. The method can ensure that the difference between the electroplating area of the circuit surface and the electroplating area of the copper substrate is not more than 5 percent during electroplating operation, the local thick copper of the circuit surface can meet the customer requirements (the copper thickness is more than 140um) by producing according to conventional equipment, and the minimum line width of the dense circuit of the copper thick circuit layer can be 0.14mm without additionally adding new equipment.
Description
Technical Field
The invention relates to the technical field of circuit board manufacturing, in particular to a method for manufacturing a circuit board with a stepped copper thick copper base on a circuit layer by using an addition method.
Background
Because of its good heat dissipation capability (the thermal conductivity of copper metal is 400W/m.k), the metal-based printed circuit board is often applied to products with high power and high heat dissipation requirements.
The circuit layer of the conventional circuit board requires uniform copper thickness, the copper thickness difference is less than 5um, when the copper thickness of the circuit layer is increased, the minimum line width and the minimum line distance of the circuit layer are increased, and the minimum line width and the minimum line distance are in a direct proportion relation; when a customer designs local thick copper (the copper thickness difference is larger than 100um) of a circuit layer, and the minimum line width and the minimum line distance of the circuit layer are ensured to be smaller, the current production process flow cannot be achieved.
Disclosure of Invention
The invention aims to solve the technical problem of how to consider local thick copper (the difference of copper thickness is more than 100um) on a circuit surface, and the minimum line width of a dense circuit on a thick copper circuit layer is as small as possible.
In order to solve the above problems, the present invention proposes the following technical solutions:
a method for manufacturing a circuit board with a circuit layer step copper thick copper base by utilizing an additive method, wherein the copper base plate comprises a copper base surface and a circuit surface, the circuit surface is provided with a thick copper area, and the manufacturing method comprises the following steps:
the first circuit → solder mask → the second circuit → pattern plating → the third circuit;
the first circuit step comprises the steps of arranging an auxiliary electroplating line and an electroplating clamping edge on a line pavement, wherein the auxiliary electroplating line is communicated with the electroplating clamping edge;
the step of solder mask comprises exposing copper to the thick copper area of the circuit surface;
the second circuit step comprises windowing and copper exposing at a position corresponding to the thick copper area on the copper base surface, wherein the windowing position and area are the same as those of the thick copper area;
the step of pattern plating comprises carrying out double-sided plating at least once;
and the third circuit step comprises the step of etching away the copper at the auxiliary electroplating line and the windowing position of the copper substrate.
Further, in the step of pattern electroplating, the thickness of the electroplated copper is 35-40 um each time.
Further, the auxiliary plating line is disposed in an inactive cell area of the line surface to facilitate removal.
Further, the manufacturing method comprises the following steps:
cutting → first circuit → solder mask → second circuit → pattern plating → third circuit → character → gold sinking → drilling → gong board → test → inspection → packaging.
Further, the first routing step specifically includes:
s101, arranging an auxiliary electroplating line on a line surface, and pasting dry films on two sides of a copper substrate;
s102, exposing, wherein the whole surface of the copper substrate dry film is exposed;
s103, developing;
s104, etching the line surface to enable the auxiliary electroplating line to be communicated with the electroplating clamping edge;
and S105, removing the film.
Further, the second routing step specifically includes:
s201, pasting dry films on two sides of a copper substrate;
s202, exposure;
and S203, developing to expose copper in the thick copper area of the circuit surface, the electroplating clamping edge and the windowing position of the copper base surface.
Further, the third routing step specifically includes:
s301, removing the film, and removing the dry film on the plated surface of the pattern;
s302, pasting dry films on two sides of the copper substrate;
s303, exposure;
s304, developing, wherein the auxiliary plating line is exposed on the line surface, and the windowing position is exposed on the copper surface;
s305, double-sided etching is carried out, wherein copper at the windowing position of the auxiliary electroplating line and the copper substrate of the line surface is etched away;
and S306, removing the film.
Further, the solder mask step specifically comprises:
printing the line surface with solder resist ink, and prebaking at 60-80 deg.C for 20-40 min;
and performing solder mask exposure and development to expose copper in the thick copper area of the circuit surface.
Compared with the prior art, the invention can achieve the following technical effects: the method can ensure that the difference between the electroplating area of the circuit surface and the electroplating area of the copper substrate is not more than 5 percent during electroplating operation, the local thick copper of the circuit surface can meet the customer requirements (the copper thickness is more than 140um) by producing according to conventional equipment, and the minimum line width of the dense circuit of the copper thick circuit layer can be 0.14mm without additionally adding new equipment; during production, no additional increase of discharge of industrial wastewater and waste gas is caused, and the method has positive significance for environmental protection.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic cross-sectional view of a copper substrate after a first wiring step;
FIG. 2 is a schematic cross-sectional view of a copper substrate after a patterned electroplating step;
FIG. 3 is a schematic cross-sectional view of a copper substrate after a third circuit formation step.
Reference numerals
The circuit comprises a copper substrate 1, a copper base surface 2, a circuit surface 3, a copper base surface windowing position 4 and a circuit surface thick copper area 5.
Detailed Description
The technical solutions in the embodiments will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, wherein like reference numerals represent like elements in the drawings. It is apparent that the embodiments to be described below are only a part of the embodiments of the present invention, and not all of them. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It will be understood that the terms "comprises" and/or "comprising," when used in this specification and the appended claims, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
It is also to be understood that the terminology used in the description of the embodiments of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the embodiments of the invention. As used in the description of embodiments of the present invention and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
Referring to fig. 1 to fig. 3, an embodiment of the present invention provides a method for manufacturing a circuit board with a step copper thick copper base by using an additive method, where a copper substrate 1 includes a copper base surface 2 and a circuit surface 3, and the circuit surface 3 is provided with a thick copper area 5, and the manufacturing method includes the steps of:
the first circuit → solder mask → the second circuit → pattern plating → the third circuit;
the first circuit step comprises the steps that an auxiliary electroplating line and an electroplating clamping edge are arranged on the line surface 3, and the auxiliary electroplating line is communicated with the electroplating clamping edge;
the step of solder mask comprises exposing copper to the thick copper area of the circuit surface;
the second circuit step comprises the steps of windowing and copper exposing at a copper base surface 2 position corresponding to the thick copper area 5, wherein the copper base surface windowing position 4 and the area are the same as those of the circuit surface thick copper area 5;
the step of pattern plating comprises carrying out double-sided plating at least once;
the third wiring step includes etching away the copper of the auxiliary plating line and the copper-based face-windowing location 4.
It should be noted that, for the circuit board with the circuit layer stepped copper thick copper base, the copper thickness of the circuit surface is not uniform, and the local copper thickness can be larger than 140um according to the design requirement, so that the scheme finishes the operation of electroplating and copper adding on the thick copper area needing to increase the copper thickness by arranging the auxiliary electroplating line so as to meet the design requirement; in addition, for double-sided electroplating, the difference between the electroplating area of the circuit surface and the electroplating area of the copper base surface is ensured to be not more than 5%, otherwise, the electroplating area is burnt or copper particles are generated due to uneven current, so that quality problems occur.
According to the embodiment of the invention, the position of thick copper to be manufactured is exposed from a semi-finished circuit board which is subjected to solder mask by using an additive process through pattern transfer, and the stepped copper thickness of the circuit layer is manufactured through multiple times of pattern electroplating, so that the difference between the electroplating area of the circuit surface and the electroplating area of the copper-based surface is not more than 5% during electroplating, the local thick copper of the circuit surface can be ensured to meet the customer requirements (the copper thickness is more than 140 mu m) by producing according to conventional equipment, and the minimum line width of dense circuits of the copper-based circuit layer can be 0.14mm without additionally adding new equipment.
In other embodiments, the uniformity of electroplating can be ensured by multiple times of electroplating, and in the step of pattern electroplating, the thickness of the electroplated copper is 35-40 um each time until the thickness of the copper meets the design requirement. For example, the circuit surface is required to have a thickness of 100-120 um for electroplating, and three times of electroplating operations can be performed, each time the thickness of the electroplating is 35-40 um.
In other embodiments, the auxiliary plating line is provided in the inactive cell area of the line surface 3 to facilitate removal. It can be understood that the function of the plating auxiliary line is to assist the pattern plating step so as to plate and thicken the thick copper area, and after the plating is completed, the auxiliary plating line needs to be removed.
In one embodiment, the method comprises the following steps:
cutting → first circuit → solder mask → second circuit → pattern plating → third circuit → character → gold sinking → drilling → gong board → test → inspection → packaging.
In an embodiment, the first routing step specifically includes:
s101, arranging auxiliary electroplating lines in the non-effective unit area of the line surface 3, and pasting dry films on the two sides of the copper substrate 1;
s102, exposure, wherein the whole surface of the copper-based surface dry film is exposed, and the circuit surface is exposed according to conventional operation;
s103, developing;
s104, etching the line surface 3 to enable the auxiliary electroplating line to be communicated with the electroplating clamping edge; after etching, an optical automatic detector is used for calling standard data to compare with the etched circuit, and the auxiliary plating line is confirmed to be communicated with the plating clamping edge.
And S105, removing the film.
In other embodiments, the second routing step specifically includes:
s201, pasting dry films on two sides of the copper substrate 1;
s202, exposing the circuit surface 3 and the copper substrate surface 2 on two sides;
and S203, developing to expose copper in the thick copper area 5, the electroplating clamping edge and the copper base surface windowing position 4 of the circuit surface, performing double-sided comparison by using a standard film and a real object circuit board, and confirming the copper exposure in the thick copper area, the electroplating clamping edge and the copper base surface windowing position of the circuit surface.
In an embodiment, the third routing step specifically includes:
s301, removing the film, and removing the dry film on the plated surface of the pattern;
s302, pasting dry films on two sides of the copper substrate 1;
s303, exposure;
s304, developing, wherein the circuit surface 3 only exposes out of the auxiliary electroplating line, and the rest positions are protected by a dry film; the copper base surface 2 only exposes the windowing position 4;
s305, double-sided etching is carried out, the auxiliary electroplating line on the line surface 2 is etched away, and the dielectric layer is exposed; copper at the copper base surface windowing position 4 is etched away, so that the height difference of the copper base surface is reduced;
and S306, removing the film.
In one embodiment, the step of solder mask specifically comprises:
printing the line surface with solder resist ink, and prebaking at 60-80 deg.C for 20-40 min;
and performing solder mask exposure and development to expose copper in the thick copper area 5 of the circuit surface, and comparing the developed thick copper area with a real circuit board by using a standard film to confirm the copper exposure in the thick copper area.
In one embodiment, a copper-based surface grinding step is further included between the third circuit step and the character step.
In the above embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
While the invention has been described with reference to specific embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (8)
1. A method for manufacturing a circuit board with a circuit layer step copper and a thick copper base by using an additive method is characterized in that a copper base plate comprises a copper base surface and a circuit surface, the circuit surface is provided with a thick copper area, and the manufacturing method comprises the following steps:
the first circuit → solder mask → the second circuit → pattern plating → the third circuit;
the first circuit step comprises the steps of arranging an auxiliary electroplating line and an electroplating clamping edge on a line pavement, wherein the auxiliary electroplating line is communicated with the electroplating clamping edge;
the step of solder mask comprises exposing copper to the thick copper area of the circuit surface;
the second circuit step comprises windowing and copper exposing at a position corresponding to the thick copper area on the copper base surface, wherein the windowing position and area are the same as those of the thick copper area;
the step of pattern plating comprises carrying out double-sided plating at least once;
and the third circuit step comprises the step of etching away the copper at the auxiliary electroplating line and the windowing position of the copper substrate.
2. The method for manufacturing the circuit layer stepped copper thick copper base circuit board according to claim 1, wherein in the step of pattern electroplating, the thickness of the electroplated copper is 35-40 um each time.
3. The method of additively manufacturing a circuit-layer stepped copper thick copper based circuit board as claimed in claim 2, wherein said auxiliary plating line is provided in an inactive cell area of the circuit surface for removal.
4. The method of claim 3, wherein the step copper thick copper-based wiring board comprises the steps of:
cutting → first circuit → solder mask → second circuit → pattern plating → third circuit → character → gold sinking → drilling → gong board → test → inspection → packaging.
5. The method of manufacturing a circuit layer step copper thick copper-based circuit board according to claim 4, wherein the first circuit step specifically includes:
s101, arranging an auxiliary electroplating line on a line surface, and pasting dry films on two sides of a copper substrate;
s102, exposing, wherein the whole surface of the copper substrate dry film is exposed;
s103, developing;
s104, etching the line surface to enable the auxiliary electroplating line to be communicated with the electroplating clamping edge;
and S105, removing the film.
6. The method of manufacturing a circuit layer step copper thick copper based circuit board according to claim 4, wherein the second circuit step specifically comprises:
s201, pasting dry films on two sides of a copper substrate;
s202, exposure;
and S203, developing to expose copper in the thick copper area of the circuit surface, the electroplating clamping edge and the windowing position of the copper base surface.
7. The method of manufacturing a circuit layer step copper thick copper-based circuit board according to claim 4, wherein the third circuit step specifically includes:
s301, removing the film, and removing the dry film on the plated surface of the pattern;
s302, pasting dry films on two sides of the copper substrate;
s303, exposure;
s304, developing, wherein the auxiliary plating line is exposed on the line surface, and the windowing position is exposed on the copper surface;
s305, double-sided etching is carried out, wherein copper at the windowing position of the auxiliary electroplating line and the copper substrate of the line surface is etched away;
and S306, removing the film.
8. The method for manufacturing the circuit layer stepped copper thick copper base circuit board according to claim 4, wherein the solder mask step specifically comprises:
printing the line surface with solder resist ink, and prebaking at 60-80 deg.C for 20-40 min;
and performing solder mask exposure and development to expose copper in the thick copper area of the circuit surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911166250.1A CN110996535B (en) | 2019-11-25 | 2019-11-25 | Method for manufacturing circuit layer stepped copper thick copper base circuit board by using additive method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911166250.1A CN110996535B (en) | 2019-11-25 | 2019-11-25 | Method for manufacturing circuit layer stepped copper thick copper base circuit board by using additive method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110996535A CN110996535A (en) | 2020-04-10 |
| CN110996535B true CN110996535B (en) | 2020-12-01 |
Family
ID=70086512
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911166250.1A Active CN110996535B (en) | 2019-11-25 | 2019-11-25 | Method for manufacturing circuit layer stepped copper thick copper base circuit board by using additive method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110996535B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113939112A (en) * | 2020-07-13 | 2022-01-14 | 庆鼎精密电子（淮安）有限公司 | Circuit board manufacturing method and circuit board |
| CN112739037B (en) * | 2020-11-07 | 2022-08-09 | 龙南骏亚柔性智能科技有限公司 | Manufacturing method of flexible circuit board with three copper thicknesses |
| CN112638051B (en) * | 2021-03-04 | 2021-06-04 | 惠州市大亚湾科翔科技电路板有限公司 | Copper plating thickening process for printed circuit board |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06196858A (en) * | 1992-12-25 | 1994-07-15 | Meikoo:Kk | Manufacture of printed-circuit board |
| KR100499008B1 (en) * | 2002-12-30 | 2005-07-01 | 삼성전기주식회사 | Two-sided PCB without via hole and the manufacturing method thereof |
| CN105282985A (en) * | 2014-05-26 | 2016-01-27 | 深圳崇达多层线路板有限公司 | Circuit board single-sided local gold plating method and circuit board |
| CN105611725B (en) * | 2016-02-02 | 2019-07-26 | 中特银佳盟科技有限公司 | Ultralight ultra-thin rub of intelligence rolls over electronic component and preparation method thereof |
| CN107105577B (en) * | 2017-04-17 | 2020-09-29 | 复旦大学 | Template transfer process for preparing double-sided and multilayer printed circuit |
-
2019
- 2019-11-25 CN CN201911166250.1A patent/CN110996535B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN110996535A (en) | 2020-04-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110996535B (en) | Method for manufacturing circuit layer stepped copper thick copper base circuit board by using additive method | |
| CN103619125B (en) | A kind of PCB electro-plating method for improving electroplating evenness | |
| CN103002660A (en) | Circuit board and processing method thereof | |
| CN102651946A (en) | Manufacturing process for step circuit of PCB (Printed Circuit Board) | |
| CN112788857A (en) | Circuit board fine circuit processing method | |
| CN102316677A (en) | Electroplating method for double-side and multilayer flexible printed circuit board | |
| CN104812178A (en) | Manufacturing method for circuit board with segmented metal pin | |
| CN105282985A (en) | Circuit board single-sided local gold plating method and circuit board | |
| CN102036506B (en) | Manufacturing method of golden fingers | |
| CN109496080B (en) | Circuit board electroplating process method | |
| CN212752725U (en) | Short circuit prevention circuit board | |
| CN103203955B (en) | A hybrid production process for a step stencil | |
| CN115802601B (en) | Flush printed circuit board and production method thereof | |
| CN104703401A (en) | Circuit board electroplating method | |
| CN103974541A (en) | Metal circuit manufacturing method and printed circuit board | |
| CN216217750U (en) | Electroplating type stepped welding pad PCB | |
| CN104735926A (en) | Resin hole filling method for circuit board | |
| CN103203959B (en) | A kind of it is mixed with technique and stepped formwork that this kind of technique prepares | |
| JP2008302567A (en) | Metal mask for printing | |
| KR20090060481A (en) | Method of manufacture for pcb | |
| CN111065207A (en) | Method for processing poor back-drilled board of PCB | |
| US20180317325A1 (en) | Circuit board and method for manufacturing the same | |
| CN103354702A (en) | Manufacturing method for microwave circuit board and circuit board manufactured by using the same | |
| CN117377223A (en) | Production process of multilayer circuit board with high qualification rate and circuit board thereof | |
| CN116456627A (en) | Sectional gold finger electroplating method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |