CN216217750U

CN216217750U - Electroplating type stepped welding pad PCB

Info

Publication number: CN216217750U
Application number: CN202121272807.2U
Authority: CN
Inventors: 徐玉珊; 杨婵; 林均秀; 刘志勇
Original assignee: Zhuhai Zhongjing Yuansheng Electronic Technology Co ltd
Current assignee: Zhuhai Zhongjing Yuansheng Electronic Technology Co ltd
Priority date: 2021-06-08
Filing date: 2021-06-08
Publication date: 2022-04-05
Anticipated expiration: 2031-06-08

Abstract

The utility model discloses and provides an electroplating type stepped welding disc PCB and a manufacturing technology thereof, which can realize that part of PCB welding discs have stepped height difference and are not on the same plane, and after the PCB is applied, conventional components can be adopted to realize product design functions, thereby avoiding high component redevelopment cost and time cost. The PCB comprises a PCB substrate, a circuit arranged on the PCB substrate, solder resist ink or a cover film covering the circuit, and a plurality of bonding pads which are electrically connected with the circuit and are not covered by the solder resist ink or the cover film, wherein at least one bonding pad is an electroplating type step bonding pad, at least one electroplating layer is arranged on the electroplating type step bonding pad, two adjacent electroplating layers are mutually conducted, the bottom of the electroplating layer at the bottom layer is electrically connected with the electroplating type step bonding pad, and the top of the electroplating layer is a plane. According to the utility model, the secondary dry film is coated on the PCB which is coated with the cover film but not plated on the surface, and the pads needing to be heightened are exposed for secondary copper plating. The utility model is applied to the technical field of PCB manufacturing.

Description

Electroplating type stepped welding pad PCB

Technical Field

The utility model relates to a PCB, in particular to an electroplating type stepped welding disc PCB.

Background

With the development of electronic technology, PCBs used in electronic devices are more and more complex, and the PCBs generally need to be equipped with components for realizing complex functions. In some occasions, besides the beautiful board surface, what is more important is that special requirements are required for realizing the design function of a product, and the installation precision of some components is required to be brought forward, for example, some components require that one or more components are required to be ensured to be at the same height, such as some sensors and the like.

The components are usually produced according to a certain standard and have fixed height, thickness and other dimensions, and because the PCB pads are all planar, the PCB pads are at the same height, as shown in fig. 1 and 2. This may prevent certain components from meeting the height criteria. In this case, only components can be replaced or components can be separately manufactured. However, either method may affect the progress and cost of the project, and may even be difficult to solve.

SUMMERY OF THE UTILITY MODEL

The technical problem to be solved by the utility model is to overcome the defects of the prior art, and provide the electroplating type stepped welding disc PCB, which can realize that part of PCB welding discs have stepped height difference and are not on the same plane, and after the PCB is applied, the product design function can be realized by adopting conventional components, thereby avoiding the high component redevelopment cost and time cost.

The technical scheme adopted by the utility model is as follows: the electroplating type step welding pad PCB comprises a PCB base material, a circuit arranged on the PCB base material, solder resist ink or a covering film covering the circuit, and a plurality of welding pads which are electrically connected with the circuit and are not covered by the solder resist ink or the covering film, wherein at least one welding pad is an electroplating type step welding pad, at least one electroplating layer is arranged on the electroplating type step welding pad, two adjacent electroplating layers are mutually conducted, the bottom of the electroplating layer at the bottom layer is electrically connected with the electroplating type step welding pad, and the top of the electroplating layer is a plane.

Further, a plurality of dry films are pasted on the solder resist ink or the cover film.

Further, the total height of the plurality of layers of dry films is higher than that of the plurality of layers of electroplated layers on the electroplated stepped welding pad.

The utility model has the beneficial effects that: the utility model adopts the design of local secondary dry film copper plating, the electroplating type step pad PCB comprises a PCB substrate, a circuit arranged on the PCB substrate and solder resist ink or a cover film covering the circuit, the electroplating type step pad PCB also comprises a plurality of pads which are electrically connected with the circuit and are not covered by the solder resist ink or the cover film, at least one pad is an electroplating type step pad, at least one electroplating layer is arranged on the electroplating type step pad, two adjacent electroplating layers are mutually communicated, the bottom of the electroplating layer at the bottom layer is electrically connected with the electroplating type step pad, and the top of the electroplating layer is a plane. On the PCB which is provided with the covering film but is not provided with the surface plating, a secondary dry film mode is adopted, the bonding pad which needs to be heightened is exposed for secondary copper plating, and the unnecessary place is protected by the dry film. And then removing the dry film to form the stepped pad PCB with different heights. Even a PCB having various step pads can be formed through several times of dry film and copper plating from low to high. And then the height of the components can be increased through the subsequent component mounting.

Drawings

FIG. 1 is a schematic plan view of a PCB;

FIG. 2 is a schematic cross-sectional view of a PCB;

FIG. 3 is a simplified schematic of a two-sided sheet blank;

FIG. 4 is a second dry film application;

fig. 5 is dry film exposure development;

FIG. 6 is secondary copper plating;

fig. 7 shows the second dry film removed.

Detailed Description

As shown in fig. 6 and 7, in the present embodiment, the electroplated step pad PCB comprises a PCB substrate 1, a circuit 2 disposed on the PCB substrate 1, and a solder resist ink or a cover film 3 covering the circuit 2, the electroplated step pad PCB further comprises a plurality of pads 4 electrically connected to the circuit 2 and not covered by the solder resist ink or the cover film 3, at least one of the pads 4 is an electroplated step pad, at least one electroplated layer 5 is disposed on the electroplated step pad, two adjacent electroplated layers 5 are in conduction with each other, the bottom of the electroplated layer 5 at the bottom is electrically connected to the electroplated step pad, and the top of the electroplated layer 5 is a plane.

In this embodiment, the manufacturing technique of the electroplated stepped pad PCB includes the following steps:

a. manufacturing a PCB with a bonding pad;

b. pasting a dry film on the PCB with the cover film and without surface electroplating;

c. exposing the bonding pads needing to be heightened by a developing technology;

d. plating copper on the exposed pad after development to form an electroplated layer, wherein the height of the dry film in the step b is higher than that of the electroplated layer,

e. and then removing the dry film to form the stepped pad PCB with different heights.

And e, repeating the steps b to d according to the required thickness of the electroplated layer before the step e, and carrying out dry film drying, developing and copper plating for multiple times from low to high on the same bonding pad.

And e, repeating the steps b to d according to the required thickness of the electroplated layer before the step e is carried out, and carrying out dry film drying, developing and copper plating for multiple times from low to high to form the PCB with various stepped bonding pads.

Specifically, fig. 3 is a simplified schematic diagram of a double-sided board blank, showing only the substrate, the bonding pads, and the cover film. The double-sided board can be manufactured conventionally, and in order to increase operability, the PCB finished product cannot be cut into single pieces in the shape of punching.

Fig. 4 is a secondary dry film lamination. And (4) pasting dry films on the two sides of the PCB, wherein the thickness of the dry film is selected according to the thickness of the pad to be heightened, and the thickness of the dry film cannot be smaller than the thickness of the pad to be heightened. If one dry film is not high enough, multiple dry films can be attached.

Fig. 5 is dry film exposure development. Exposing the bonding pad needing to be heightened through exposure, and protecting the area without secondary copper plating by using a dry film. If the dry film is thick, even multiple layers of dry film are attached, the exposure energy needs to be adjusted to obtain sufficient exposure of the dry film. If the dry film is thick, the dry film design may need to be adjusted to obtain the desired pad shape due to the exposure apparatus light half angle.

FIG. 6 is secondary copper plating. The pad that needs the bed hedgehopping after the copper facing will be plated with the copper that has certain height according to the dry film shape, and other regions will keep the original state owing to there is the dry film protection.

Fig. 7 shows the second dry film removed. After the dry film is faded away, the bonding pad is plated with copper and is increased, other areas are kept unchanged, and the stepped bonding pad of the PCB is realized.

Repeating the above process, starting from the lowest height of the pad, the bonding pad with various step heights can be realized. And then the subsequent conventional processes such as surface electroplating and the like are completed, and the PCB with the stepped bonding pad can be obtained.

In conclusion, the technology provides a stepped pad PCB manufacturing technology, local pads of the PCB can be increased, conventional components are used, and development cost of non-standard components is avoided.

While the embodiments of the present invention have been described in terms of practical embodiments, they are not to be construed as limiting the meaning of the present invention, and modifications of the embodiments and combinations with other embodiments will be apparent to those skilled in the art in light of the present description.

Claims

1. An electroplated step pad PCB comprising a PCB substrate (1), a line (2) disposed on said PCB substrate (1) and a solder resist ink or cover film (3) covering said line (2), said electroplated step pad PCB further comprising a plurality of pads (4) electrically connected with said line (2) and not covered by said solder resist ink or said cover film (3), characterized in that: at least one pad (4) is electroplating formula ladder pad, be provided with at least one deck plating layer (5) on the electroplating formula ladder pad, adjacent two-layer plating layer (5) switch on each other, the bottom plating layer (5) bottom with electroplating formula ladder pad electricity is connected, the top of plating layer (5) is the plane.

2. An electroplated stepped pad PCB as claimed in claim 1, wherein: and a plurality of layers of dry films (6) are pasted on the solder resist ink or the cover film (3).

3. An electroplated stepped pad PCB as claimed in claim 2, wherein: the total height of the layers of the dry film (6) is higher than that of the layers of the electroplated layer (5) on the electroplated stepped welding pad.