CN105282985A - Circuit board single-sided local gold plating method and circuit board - Google Patents
Circuit board single-sided local gold plating method and circuit board Download PDFInfo
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- CN105282985A CN105282985A CN201410226188.1A CN201410226188A CN105282985A CN 105282985 A CN105282985 A CN 105282985A CN 201410226188 A CN201410226188 A CN 201410226188A CN 105282985 A CN105282985 A CN 105282985A
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- copper
- clad plate
- dry film
- gold
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Abstract
The invention is applicable to the field of circuit boards, and provides a circuit board single-sided local gold plating method and a circuit board manufactured by using the method. The method comprises the steps of providing a copper-clad plate, manufacturing a protection dry film at both sides of the copper-clad plate, and exposing copper areas beyond a circuit pattern at the obverse side; etching the circuit pattern at the obverse side, and removing the protection dry film; manufacturing a protection dry film at the obverse side, exposing an area to be plated, wherein the area to be plated is electrically connected with a copper layer at the reverse side through conductive holes in the circuit pattern at the obverse side, then carrying out gold plating on the area to be plated, and removing the protection dry film thereafter; manufacturing a protection dry film at both sides of the copper-clad plate, exposing copper areas beyond a circuit pattern to be manufactured at the reverse side, and removing the copper areas exposed at the reverse side by acid etching; and then removing the protection dry film at both sides of the copper-clad plate. Compared with an existing method, the method provided by the invention removes the steps of sand belt grinding, tin plating and tin stripping, simplifies the working procedures, and improves the efficiency; and the method also solves a gap problem at a connecting part of a gold plating area and a copper circuit area.
Description
Technical field
The invention belongs to field of circuit boards, the circuit board particularly relating to a kind of circuit board one side partially plating gold method and use the method to obtain.
Background technology
Au-plated board is divided into two-sided Au-plated board, one side Au-plated board.Wherein one side Au-plated board is divided into again the full Au-plated board of one side and one side partially plating gold circuit board.When prior art carries out one side partially plating gold to circuit board, its manufacturing process is form copper-clad plate through two-sided heavy copper plating, for convenience of describing, definition copper-clad plate needs gold-plated one side to be front, and its relative another side is reverse side; The positive and negative two sides of copper-clad plate covers dry film, and produce partially plating gold regional graphics on the front of copper-clad plate; Gold-plated to partially plating gold regional graphics carry out again; Remove the dry film on copper-clad plate two sides again; The reverse side of the flat copper-clad plate of belt sanding afterwards; Re-use dry film and cover the two sides of copper-clad plate, make and expose the copper wire figure on two sides, and gold-plated region is used dry film protection; On copper wire region, copper facing is zinc-plated; Then remove the dry film on copper-clad plate two sides, alkali etching, formed and there is zinc-plated copper wire and gold-plated region; Dry film protection is covered again on gold-plated region; Then move back tin, move back dry film.This method complex manufacturing process, efficiency is low, and gold-plated rear belt sanding copper-clad plate, easily cause postorder to make copper wire graph position deviation; When alkali etching, gold-plated region and non-gold-plated copper wire junction, because the anti-etching ability of gold is better than tin, and cause gold-plated region and non-gold-plated copper wire junction easily to form open circuit breach.
Summary of the invention
The object of the present invention is to provide a kind of circuit board one side partially plating gold method, be intended to solve prior art circuits plate one side partially plating gold process complexity, efficiency is low, and easily form the problem of breach of opening a way in gold-plated region and non-gold-plated copper wire joint area place.
The present invention is achieved in that a kind of circuit board one side partially plating gold method, comprises the steps:
S1) provide a copper-clad plate, the tow sides of described copper-clad plate are all coated with layers of copper, and described copper-clad plate is provided with conductive hole;
S2) outer graphics I is made: make protection dry film on the whole reverse side of described copper-clad plate and on the line pattern to be produced in described copper-clad plate front, the copper region outside the line pattern to be produced exposing described copper-clad plate front;
S3) I is etched: by step S2) the copper region acidity exposed etches away, and obtains the line pattern in copper-clad plate front;
S4) move back film I: removal step S3) in protection dry film on line pattern, expose the line pattern in front and the layers of copper of reverse side;
S5) make outer graphics II: in step S4) after the tow sides of described copper-clad plate again make protection dry film, and expose described line pattern treat gold-plated region and edges of boards electroplating clamp edge regions;
S6) gold-plated: in step S5) in treat gold-plated region is carried out gold-plated;
S7) move back film II: removal step S6) after the protection dry film on the positive and negative two sides of described copper-clad plate;
S8) make outer graphics III: in step S7) after the positive and negative two sides of described copper-clad plate again make protection dry film, and the copper region outside the line pattern to be produced exposing the reverse side of described copper-clad plate;
S9) II is etched: by step S8) the copper region acidity exposed etches away;
S10) move back film III: removal step S9) after the protection dry film on the positive and negative two sides of described copper-clad plate.
Another object of the present invention is to provide a kind of circuit board, made by circuit board one side partially plating gold method as above.
Compared with the circuit board one side partially plating gold method of prior art, eliminate the step of the reverse side of the flat copper-clad plate of belt sanding, eliminate step zinc-plated on copper wire region, correspondingly, also eliminate etch away the step of zinc-plated (namely moving back tin), thus simplify manufacturing procedure, correspondingly, improve efficiency.It also avoid due to injustice of polishing, cause the distortion of plate face harmomegathus, and cause when making line pattern, the problem of contraposition generation deviation.Meanwhile, also can avoid gold-plated region and copper wire joint area place that breach occurs.
Accompanying drawing explanation
Fig. 1 is a kind of copper-clad plate Facad structure schematic diagram that the embodiment of the present invention provides.
Embodiment
In order to make object of the present invention, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
A kind of circuit board one side partially plating gold method that the embodiment of the present invention provides.Referring to Fig. 1, for convenience of describing, definition copper-clad plate 1 needs gold-plated one side to be front 10, and its relative another side being reverse side.The method comprises the steps:
S1) provide a copper-clad plate 1, the tow sides of described copper-clad plate 1 are all coated with layers of copper, and described copper-clad plate 1 is provided with conductive hole 13;
S2) outer graphics I is made: make protection dry film on the whole reverse side of described copper-clad plate 1 and on the line pattern to be produced 12 in described copper-clad plate 1 front 11, the copper region outside the line pattern to be produced 12 exposing described copper-clad plate 1 front 11;
S3) I is etched: by step S2) the copper region acidity exposed etches away, and obtains the line pattern 12 in copper-clad plate 1 front 11; And owing to there is protection dry film on the line pattern 12 in the line pattern of the reverse side of copper-clad plate 1 and front 11, during acid etching, the layers of copper on it is retained, and copper on other region is etched;
S4) move back film I: removal step S3) in protection dry film on line pattern 12, expose the line pattern 12 in front 11 and the layers of copper of reverse side;
S5) make outer graphics II: in step S4) after the tow sides of described copper-clad plate 1 again make protection dry film, and expose described line pattern 12 treat gold-plated region 121 and edges of boards electroplating clamp edge regions; Due to gold-plated be adopt plating mode, be generally carry out in layers of copper gold-plated, thus treat gold-plated region 121 be etch line pattern 12 on subregion; Simultaneously, copper-clad plate 1 is provided with conductive hole 13, line pattern 12 then on front 11 is electrically connected with the layers of copper of reverse side by conductive hole 13, when in the edges of boards electroplating clamp edge regions that electroplating clamp is clamped in copper-clad plate 1, copper-clad plate 1 reverse side is coated with layers of copper, and electroplating clamp must be electrically connected with layers of copper on the contrary, and then is electrically connected with the line pattern 12 on front 11 by conductive hole 13, namely also with treat that gold-plated region 121 is electrically connected, thus convenient plating;
S6) gold-plated: in step S5) in treat gold-plated region 121 is carried out gold-plated; Thus make the line pattern 12 in copper-clad plate 1 front 11 be divided into gold-plated region 121 and copper wire region 122;
S7) move back film II: removal step S6) after the protection dry film on the positive and negative two sides of described copper-clad plate 1;
S8) make outer graphics III: in step S7) after the positive and negative two sides of described copper-clad plate 1 again make protection dry film, and the copper region outside the line pattern to be produced exposing the reverse side of described copper-clad plate 1; The front 11 of now copper-clad plate 1 obtains the protection protecting dry film, and the line pattern region to be processed of reverse side also obtains the protection protecting dry film;
S9) II is etched: by step S8) the copper region acidity exposed etches away; Copper on region outside the reverse side of copper-clad plate 1 protection dry film can be etched away, the copper on the region outside line pattern region namely to be processed etches away;
S10) move back film III: removal step S9) after the protection dry film on the positive and negative two sides of described copper-clad plate 1; Just can obtain reverse side line pattern, copper wire region, front 11 122 and gold-plated region 121.
Compared with the circuit board one side partially plating gold method of prior art, eliminate the step of the reverse side of the flat copper-clad plate 1 of belt sanding, eliminate step zinc-plated on copper wire region 122, correspondingly, also eliminate etch away the step of zinc-plated (namely moving back tin), thus simplify manufacturing procedure, correspondingly, improve efficiency.
Owing to eliminating the step of the reverse side of the flat copper-clad plate 1 of belt sanding, it also avoid due to injustice of polishing, cause the distortion of plate face harmomegathus, and cause when making line pattern 12, the problem of contraposition generation deviation.Meanwhile, because copper-clad plate 1 front 11 first makes line pattern 12, more gold-plated, finally make reverse side line pattern 12, thus also can avoid gold-plated region 121, with junction, copper wire region 122 123, breach occurs.
When gold-plated, the layers of copper for convenience of the positive and negative two sides of copper-clad plate 1 is electrically connected, and can be electrically connected, to facilitate plating in the heavy copper hole in copper-clad plate 1.
Further, described step S8) in also comprise expose described copper-clad plate 1 front 11 to be produced for without copper region corresponding to the region in copper hole 14.Due to copper-clad plate 1 make time, also sink in perforate on it and be coated with layers of copper, when thus will make without copper hole 14 (NPTH hole), just need the layers of copper on the region without copper hole 14 correspondence to be exposed, so that the equipment that loses falls without the layers of copper on the region of copper hole 14 correspondence.Be mainly used in the circuit board of fixing making without copper hole 14 or other components and parts are installed on circuit boards.
Step S1) in copper-clad plate 1 can use existing, also can manufacture separately, its manufacture method, for providing a substrate, offers the first through hole for making conductive hole on the substrate, and appointed thickness layers of copper is electroplated to the two-sided of described substrate, thus obtain copper-clad plate 1.The first through hole also offered by substrate, with copper heavy in the first through hole, thus makes conductive hole 13, the circuit of each layer of circuit board is electrically connected, or the circuit on its two sides is electrically connected.
Further, this substrate can be formed through pressing by multilayer circuit board, and this substrate is multilayer circuit board.In other embodiments, substrate also can use single layer substrate.Do not limit the number of plies of the wiring board of substrate in the present invention, individual layer, bilayer, three layers etc. all passable.
Sometimes conveniently fix this circuit board, or other components and parts are installed, circuit board also will being arranged some holes without the need to heavy copper, namely without copper hole 14, then correspondingly, substrate also offering the second through hole for making without copper hole 14.
Further, the manufacture method of described protection dry film is as follows:
P1) in the respective face of described copper-clad plate 1, one deck dry film is pasted;
P2) expose: in step P1) in dry film on need to remove corresponding dry film region on closely connected lighttight egative film, adopt ultraviolet light to expose, copper-clad plate 1 formed exposure area and unexposed area; Egative film can use film material or other light-proof material to make;
P3) develop: step P2 is fallen in development) in unexposed area on dry film, retain the dry film on exposure area, obtain described protection dry film.
Concrete as step S2) make in outer graphics I and protect being made as of dry film: at the Double-face adhesive dry film of copper-clad plate 1, owing to needing the line pattern 12 protecting copper-clad plate 1 front 11, and layers of copper on other region, front 11 will be exposed, namely the region (being defined as exposed area) removing corresponding dry film is needed, thus the shape of egative film, namely egative film figure is identical with exposed area shape, and in this exposed area this egative film closely connected, expose through ultraviolet light again, because egative film is light tight, thus, the dry film in copper-clad plate 1 front 11 is made to form exposure area and unexposed area, and the reverse side of copper-clad plate 1 does not paste egative film, it is all exposure area, remove the dry film on the unexposed area in copper-clad plate 1 finally by development, namely the dry film stayed on exposure area is made into protection dry film.
Concrete as step S5) make in outer graphics II and protect being made as of dry film: paste dry film in the front 11 of copper-clad plate 1, owing to needing the subregion protected on the line pattern 12 in copper-clad plate 1 front 11, the i.e. copper wire region 122 in front 11, and gold-plated region 121, front 11 will be exposed, namely gold-plated region 121 is the region that need remove corresponding dry film, thus the shape of egative film, namely egative film figure is identical with gold-plated region 121 shape, and on gold-plated region 121 this egative film closely connected, expose through ultraviolet light again, because egative film is light tight, thus, the dry film in copper-clad plate 1 front 11 is made to form exposure area and unexposed area, remove the dry film of the unexposed area in copper-clad plate 1 finally by development, expose gold-plated region 121, namely the dry film retaining exposure area is made into protection dry film.
Concrete as step S8) make in outer graphics III and protect being made as of dry film: paste dry film on the two sides of copper-clad plate 1, owing to needing the protection line pattern 12 in copper-clad plate 1 front 11 and the line pattern of copper-clad plate 1 reverse side, and the exterior domain of copper-clad plate 1 reverse side line pattern will be exposed, namely the exterior domain of reverse side circuit is the region that need remove corresponding dry film, thus the shape of egative film, namely egative film figure is identical with region shape outside reverse side circuit, and on the exterior domain of reverse side circuit this egative film closely connected, expose through ultraviolet light again, because egative film is light tight, thus, the dry film of copper-clad plate 1 reverse side is made to form exposure area and unexposed area, and egative film is not pasted in the front 11 of copper-clad plate 1, it is all exposure area, remove the dry film of the unexposed area in copper-clad plate 1 finally by development, expose the exterior domain of reverse side circuit, namely the dry film retaining exposure area is made into protection dry film.
Further, due to some special requirements, on gold-plated region 121, the gold-plated needs in subregion may be had relatively thick, then at described step S7) before also comprise step S6.1) local plates thick gold: at described step S6) after the local location in gold-plated region 121 again gold-plated to appointed thickness, namely reach the thickness that client specifies.Certainly; for making S6.1) to plate the zone location of thick gold more accurate in local; can also in step S6) after; in step S6.1) before; use the method for the protection of making as above dry film in copper-clad plate 1, make protection dry film; other locality protection in copper-clad plate 1 is got up, only exposes needs and carry out the region that thick gold is plated in local.
Certainly, in the present embodiment, gold-plated can be plating proof gold, also can wait other metal or alloy, as step S6 for electronickelling gold) gold-plated for as described in treat that gold-plated region 121 powers on plating nickel gold.
Further, for measuring the quality of the circuit board of making better, in step S10) after, full-automatic optical detection is carried out in the described copper-clad plate 1 also comprised obtaining, and namely AOI checks.Certainly, after full-automatic optical detects, welding resistance, character operation is also comprised.
Namely welding resistance arranges soldering-resistance layer in copper-clad plate 1; coated printed board do not need weld circuit and base material on; in case circuit bridge is taken during welding; long electric circumstance and chemical resistance protection are provided; formed " coat " that printed board is beautiful, comprise thermoset epoxy green oil (containing ultraviolet uv green oil) and liquid photosensitive solder mask two Iarge-scale system.Be generally green, also have black, yellow, white, blue welding resistance.
Character and element character: provide yellow, white or density bullet, installing to element and keeping in repair printed board from now on provides information.
Certainly, silk-screen anti-ization bronze ink can also be comprised, to protect gold-plated region 121.The finishing operations such as surface treatment procedure can also be comprised.
Refer to Fig. 1, the invention also discloses a kind of circuit board using foregoing circuit plate one side partially plating gold method to make.The production process of this circuit board is simple, and efficiency is high, gold-plated region 121 and junction 123, copper wire region 122 non-notch.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, all any amendments done within the spirit and principles in the present invention, equivalent replacement and improvement etc., all should be included within protection scope of the present invention.
Claims (10)
1. a circuit board one side partially plating gold method, is characterized in that, comprise the steps:
S1) provide a copper-clad plate, the tow sides of described copper-clad plate are all coated with layers of copper, and described copper-clad plate is provided with conductive hole;
S2) outer graphics I is made: make protection dry film on the whole reverse side of described copper-clad plate and on the line pattern to be produced in described copper-clad plate front, the copper region outside the line pattern to be produced exposing described copper-clad plate front;
S3) I is etched: by step S2) the copper region acidity exposed etches away, and obtains the line pattern in copper-clad plate front;
S4) move back film I: removal step S3) in protection dry film on line pattern, expose the line pattern in front and the layers of copper of reverse side;
S5) make outer graphics II: in step S4) after the tow sides of described copper-clad plate again make protection dry film, and expose described line pattern treat gold-plated region and edges of boards electroplating clamp edge regions;
S6) gold-plated: in step S5) in treat gold-plated region is carried out gold-plated;
S7) move back film II: removal step S6) after the protection dry film on the positive and negative two sides of described copper-clad plate;
S8) make outer graphics III: in step S7) after the positive and negative two sides of described copper-clad plate again make protection dry film, and the copper region outside the line pattern to be produced exposing the reverse side of described copper-clad plate;
S9) II is etched: by step S8) the copper region acidity exposed etches away;
S10) move back film III: removal step S9) after the protection dry film on the positive and negative two sides of described copper-clad plate.
2. circuit board one side partially plating gold method as claimed in claim 1, is characterized in that, described step S8) in also comprise expose described copper-clad plate front to be produced for without copper region corresponding to the region in copper hole.
3. circuit board one side partially plating gold method as claimed in claim 1, it is characterized in that, the manufacture method of described protection dry film is as follows:
P1) in the respective face of described copper-clad plate, one deck dry film is pasted;
P2) expose: in step P1) in copper-clad plate dry film on need to remove corresponding dry film region on closely connected lighttight egative film, adopt ultraviolet light to expose, make the dry film in this copper-clad plate form exposure area and unexposed area;
P3) develop: step P2 is fallen in development) in unexposed area on dry film, retain the dry film on exposure area, obtain described protection dry film.
4. circuit board one side partially plating gold method as claimed in claim 1, it is characterized in that, described step S7) before also comprise step S6.1) local plates thick gold: at described step S6) after the local location in gold-plated region again gold-plated to appointed thickness.
5. the circuit board one side partially plating gold method as described in any one of claim 1-4, is characterized in that, described step S6) gold-plated for treating that gold-plated region powers on plating nickel gold described.
6. the circuit board one side partially plating gold method as described in any one of claim 1-4, it is characterized in that, described step S1) in the manufacture method of copper-clad plate be: a substrate is provided, described substrate offers the first through hole for making conductive hole, and appointed thickness layers of copper is electroplated to the two-sided of described substrate.
7. circuit board one side partially plating gold method as claimed in claim 6, it is characterized in that, described substrate is formed through pressing by multilayer circuit board.
8. circuit board one side partially plating gold method as claimed in claim 6, is characterized in that, described substrate offering the second through hole for making without copper hole.
9. the circuit board one side partially plating gold method as described in any one of claim 1-4, is characterized in that, in step S10) after, full-automatic optical detection is carried out in the described copper-clad plate also comprised obtaining.
10. a circuit board, is characterized in that, is made by the circuit board one side partially plating gold method described in any one of claim 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410226188.1A CN105282985A (en) | 2014-05-26 | 2014-05-26 | Circuit board single-sided local gold plating method and circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410226188.1A CN105282985A (en) | 2014-05-26 | 2014-05-26 | Circuit board single-sided local gold plating method and circuit board |
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| CN105282985A true CN105282985A (en) | 2016-01-27 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410226188.1A Pending CN105282985A (en) | 2014-05-26 | 2014-05-26 | Circuit board single-sided local gold plating method and circuit board |
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Cited By (5)
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| CN109121313A (en) * | 2018-10-16 | 2019-01-01 | 江苏迪飞达电子有限公司 | A kind of secondary dry film production technology of selectivity coated plate |
| CN109890145A (en) * | 2019-03-14 | 2019-06-14 | 胜宏科技（惠州）股份有限公司 | A kind of keypad gold plating method |
| CN110719698A (en) * | 2019-11-28 | 2020-01-21 | 苏州晶鼎鑫光电科技有限公司 | Manufacturing method for manufacturing prefabricated gold tin on copper-clad plate for 5G optical module |
| CN110996535A (en) * | 2019-11-25 | 2020-04-10 | 景旺电子科技(龙川)有限公司 | Method for manufacturing circuit layer stepped copper thick copper base circuit board by using additive method |
| CN114641141A (en) * | 2020-12-16 | 2022-06-17 | 深南电路股份有限公司 | Manufacturing method of circuit board, circuit board and electronic device |
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| CN110996535A (en) * | 2019-11-25 | 2020-04-10 | 景旺电子科技(龙川)有限公司 | Method for manufacturing circuit layer stepped copper thick copper base circuit board by using additive method |
| CN110719698A (en) * | 2019-11-28 | 2020-01-21 | 苏州晶鼎鑫光电科技有限公司 | Manufacturing method for manufacturing prefabricated gold tin on copper-clad plate for 5G optical module |
| CN114641141A (en) * | 2020-12-16 | 2022-06-17 | 深南电路股份有限公司 | Manufacturing method of circuit board, circuit board and electronic device |
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Application publication date: 20160127 |
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