CN114641141A - Manufacturing method of circuit board, circuit board and electronic device - Google Patents
Manufacturing method of circuit board, circuit board and electronic device Download PDFInfo
- Publication number
- CN114641141A CN114641141A CN202011488543.4A CN202011488543A CN114641141A CN 114641141 A CN114641141 A CN 114641141A CN 202011488543 A CN202011488543 A CN 202011488543A CN 114641141 A CN114641141 A CN 114641141A
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- copper layer
- circuit board
- substrate
- dry film
- corrosion
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 25
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 158
- 229910052802 copper Inorganic materials 0.000 claims abstract description 158
- 239000010949 copper Substances 0.000 claims abstract description 158
- 239000000758 substrate Substances 0.000 claims abstract description 44
- 238000005530 etching Methods 0.000 claims abstract description 43
- 238000005260 corrosion Methods 0.000 claims abstract description 33
- 230000007797 corrosion Effects 0.000 claims abstract description 32
- 239000002253 acid Substances 0.000 claims abstract description 24
- 238000005868 electrolysis reaction Methods 0.000 claims abstract description 17
- 238000000034 method Methods 0.000 claims description 45
- 238000009713 electroplating Methods 0.000 claims description 21
- 239000003814 drug Substances 0.000 claims description 7
- 239000007788 liquid Substances 0.000 claims description 7
- 238000004381 surface treatment Methods 0.000 claims description 6
- 230000001678 irradiating effect Effects 0.000 claims description 2
- 230000001737 promoting effect Effects 0.000 abstract description 5
- 238000007747 plating Methods 0.000 description 5
- 239000002585 base Substances 0.000 description 4
- 238000006116 polymerization reaction Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- 238000011161 development Methods 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000008054 signal transmission Effects 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 239000003513 alkali Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229920006280 packaging film Polymers 0.000 description 1
- 239000012785 packaging film Substances 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000009461 vacuum packaging Methods 0.000 description 1
- 238000003079 width control Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The application discloses a manufacturing method of a circuit board, the circuit board and an electronic device, wherein the manufacturing method comprises the following steps: pasting a corrosion-resistant dry film on the copper layer of the substrate, and exposing and developing the corrosion-resistant dry film to expose part of the copper layer; electrolyzing the copper layer at the exposed part to reserve the copper layer with a preset thickness range; and performing acid etching on the copper layer of the electroplated exposed part to remove the copper layer of the exposed part. This application is after the base plate electroplates one deck copper layer, and rethread electrolysis remains the copper layer of predetermineeing the thickness scope to make the electrolysis obtain promoting to the copper layer homogeneity of predetermineeing the thickness scope, the incomplete copper of etching that can be high-efficient accurate obtains the outer circuit of high accuracy.
Description
Technical Field
The present disclosure relates to circuit board technologies, and in particular, to a method for manufacturing a circuit board, and an electronic device.
Background
Along with the diversified development of the functional requirements in the circuit board industry, the circuit board is not only a conducting carrier of other devices, and gradually takes on a plurality of functions such as signal transmission, resistance control, device heat dissipation and the like. These functional requirements put higher demands on the control accuracy of the circuit board, wherein the line width control of the outer layer circuit directly affects the impedance of the device, i.e. the signal transmission performance.
The current processing method of the outer layer circuit comprises acid etching and alkali etching, wherein the basic processing flow comprises the following steps: acid etching: electroplating → external image pretreatment → external image exposure → external image development → acid etching → film removal; alkaline etching: electroplating → external image pretreatment → external image exposure → external image development → pattern electroplating (tin plating) → stripping → alkaline etching → stripping. In both methods, the outer layer pattern is obtained by etching the exposed copper surface through the dry film or tin plating to protect the pattern portion.
The difficulty of the current outer layer circuit etching mainly lies in factors such as uncertain copper layer thickness, uneven plating layer, complex specification, inconsistent circuit density and the like after electroplating. The complex board environment makes the etching process very difficult to control, thus causing the outer layer etching to become one of the process control bottlenecks of the circuit board.
Disclosure of Invention
The application provides a manufacturing method of a circuit board, the circuit board and an electronic device, and solves the problems that in the process of etching an outer layer circuit, the current distribution of a plate is large in extreme difference due to factors such as complex board surface environment, special positioning of conductive clamping points, and the exchange efficiency of liquid medicine in holes, and further the thickness of an electroplated copper layer is uneven.
In order to solve the technical problem, the application adopts a technical scheme that: provided is a method for manufacturing a circuit board, including: providing a substrate, wherein at least one side surface of the substrate is covered with a copper layer; pasting a corrosion-resistant dry film on the copper layer of the substrate, and exposing and developing the corrosion-resistant dry film to expose part of the copper layer; electrolyzing the copper layer at the exposed part to reserve the copper layer with a preset thickness range; performing acid etching on the copper layer of the electrolyzed exposed part to remove the copper layer of the exposed part; and (4) carrying out film stripping treatment on the copper layer subjected to acid etching.
Wherein, the specific steps of providing the substrate comprise: electroplating the surface of the substrate by preset current density, and covering at least one side surface of the substrate with a copper layer.
The step of electrolyzing the copper layer of the exposed part specifically comprises the following steps: and electrolyzing the copper layer of the exposed part by setting a current density, wherein the set current density is consistent with the preset current density.
Wherein the predetermined thickness range is 5-10 microns.
The method specifically comprises the following steps of carrying out film stripping treatment on the copper layer subjected to acid etching: and removing the residual dry corrosion-resistant film by using a liquid medicine to form an outer layer circuit on the surface of the substrate.
Wherein, the step before pasting the corrosion-resistant dry film on the copper layer of the substrate comprises the following steps: and carrying out surface treatment on the copper layer of the substrate.
The step of performing acid etching on the copper layer of the electrolyzed exposed part to remove the copper layer of the exposed part specifically comprises the following steps: and performing acid etching on the copper layer of the exposed part according to a preset thickness range to remove the copper layer of the exposed part.
Wherein, the step of exposing and developing the etching-resistant dry film specifically comprises: irradiating the corrosion-resistant dry film by ultraviolet light to transfer the outer layer circuit pattern to the corrosion-resistant dry film; and etching the resist dry film after the transfer of the outer layer circuit pattern by using a chemical solution to expose a part of the copper layer.
In order to solve the above technical problem, the present application adopts another technical solution: a circuit board is provided, which adopts the manufacturing method of the circuit board as any one of the above.
In order to solve the above technical problem, the present application adopts another technical solution: an electronic device is provided, and the electronic device comprises the circuit board.
The beneficial effect of this application is: in contrast to the prior art, the present application provides a method for manufacturing a circuit board, including: pasting a corrosion-resistant dry film on the copper layer of the substrate, and exposing and developing the corrosion-resistant dry film to expose part of the copper layer; electrolyzing the copper layer at the exposed part to reserve the copper layer with a preset thickness range; and performing acid etching on the copper layer of the electroplated exposed part to remove the copper layer of the exposed part. This application is after the base plate electroplates one deck copper layer, and rethread electrolysis remains the copper layer of predetermineeing the thickness scope to make the electrolysis obtain promoting to the copper layer homogeneity of predetermineeing the thickness scope, the incomplete copper of etching that can be high-efficient accurate obtains the outer circuit of high accuracy.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for the description of the embodiments will be briefly introduced below, it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without inventive efforts, wherein:
fig. 1 is a schematic flow chart of a first embodiment of a method for manufacturing a circuit board according to the present application;
fig. 2 is a schematic flow chart of a second embodiment of the method for manufacturing a circuit board according to the present application.
Detailed Description
In order to make the technical problems solved, the technical solutions adopted, and the technical effects achieved by the present application clearer, the technical solutions of the embodiments of the present application will be further described in detail below with reference to the accompanying drawings.
Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.
Referring to fig. 1, fig. 1 is a schematic flow chart of a manufacturing method of a circuit board according to a first embodiment of the present application.
Step S101: a substrate is provided.
In this embodiment, at least one side surface of the substrate is covered with a copper layer. Specifically, the substrate can be covered with a copper layer on at least one side surface of the substrate through an electroplating process. The coverage area of the copper layer is the whole board area, the copper layer is electroplated to a preset thickness through an electroplating process according to the requirement of a customer in the electroplating process, and the preset thickness is set according to the actual situation and is not limited herein.
Step S102: and pasting a corrosion-resistant dry film on the copper layer of the substrate, and exposing and developing the corrosion-resistant dry film to expose part of the copper layer.
In this embodiment, a dry film resist is attached to the copper layer on at least one side of the substrate, and the dry film resist can undergo a polymerization reaction under irradiation of ultraviolet light. And after the surface of the copper layer is pasted with the corrosion-resistant dry film, a preset circuit pattern is exposed on the corrosion-resistant dry film through a pattern transfer technology. And developing the exposed dry film resist, and washing the exposed dry film resist which is not subjected to polymerization reaction by using a developing solution so as to expose part of the copper layer.
Step S103: and electrolyzing the copper layer at the exposed part to reserve the copper layer with a preset thickness range.
In this example, the thickness of the copper layer at the exposed portion was not determined, and the plating layer was not uniform. And electrolyzing the copper layer of the exposed part, and controlling the electroplating time so that the copper layer of the exposed part is remained to a preset thickness range, wherein the preset thickness range is 5-10 micrometers. Specifically, a reverse process is used to electroplate the electrolytically exposed portion of the copper layer, and during the electroplating process, the electroplating time is controlled to retain a portion of the copper layer to a predetermined thickness. When the copper layer of the exposed part is electrolyzed to be 5-10 micrometers through a reverse procedure, the uniformity of the copper layer to be etched is improved, the residual copper layer can be efficiently and accurately etched, and the high-precision outer circuit layer is obtained.
Step S104: and performing acid etching on the copper layer of the electrolyzed exposed part to remove the copper layer of the exposed part.
In this embodiment, the copper layer uniformity of the exposed portion after electrolysis is improved. At the moment, the thickness of the copper layer of the exposed part is determined, acid etching is carried out according to the preset copper thickness parameter of the exposed part, and the copper layer of the exposed part is etched by acid liquid medicine according to the preset copper thickness parameter, so that the residual copper layer of the exposed part is efficiently and accurately etched, and further the residual copper layer of the exposed part can be completely etched and removed.
Step S105: and (4) carrying out film stripping treatment on the copper layer subjected to acid etching.
In this embodiment, the copper layer after the acid etching is removed, the non-circuit portion of the copper layer is still covered by the dry film resist, and the remaining dry film resist is removed by stripping. Specifically, the dry film of resist protecting the wiring layer is peeled off by a chemical solution, thereby exposing the wiring pattern.
Different from the prior art, the application provides a manufacturing method of a printed circuit board, which comprises the following steps: pasting a corrosion-resistant dry film on the copper layer of the substrate, and exposing and developing the corrosion-resistant dry film to expose part of the copper layer; and electrolyzing the copper layer at the exposed part to reserve the copper layer with a preset thickness range. This application is after the base plate electroplates one deck copper layer, and rethread electrolysis remains the copper layer of predetermineeing the thickness scope to make the electrolysis obtain promoting to the copper layer homogeneity of predetermineeing the thickness scope, the incomplete copper of etching that can be high-efficient accurate obtains the outer circuit of high accuracy.
Referring to fig. 2, fig. 2 is a schematic flow chart of a manufacturing method of a circuit board according to a second embodiment of the present application.
Step S201: providing a substrate, electroplating the surface of the substrate through a preset current density, and covering at least one side surface of the substrate with a copper layer.
In the embodiment, at least one side surface of the substrate is covered with a copper layer, and the copper layer can be covered on at least one side surface of the substrate as a circuit layer through an electroplating process. Specifically, the substrate may be formed by covering a copper layer with a preset thickness on at least one side surface of the substrate by an electroplating process at a preset current density, where the copper layer with the preset thickness is set according to a customer requirement, and is not specifically limited herein. The coverage area of the copper layer is the whole board area, and the preset current density is set according to the thickness of the copper layer after electroplating according to the requirements of customers in the electroplating process, which is not limited herein.
Step S202: and attaching a corrosion-resistant dry film on the copper layer of the substrate, and exposing and developing the corrosion-resistant dry film to expose part of the copper layer.
In this embodiment, at least one side surface of the substrate is covered with a copper layer by an electroplating process, and before the copper layer of the substrate is pasted with the corrosion-resistant dry film for pattern conversion, the copper layer on the substrate needs to be subjected to surface treatment to remove pollutants on the copper surface and increase the roughness of the copper surface, which is beneficial to better pressing the corrosion-resistant dry film together with the copper surface in a film pressing process.
In this embodiment, the copper layer on the substrate is surface-treated to be better bonded with the dry film resist. And attaching a dry corrosion-resistant film on the copper layer on at least one side surface of the substrate, wherein the dry corrosion-resistant film can generate polymerization reaction under the irradiation of ultraviolet light. And after the surface of the copper layer is pasted with the corrosion-resistant dry film, a preset circuit pattern is exposed on the corrosion-resistant dry film through a pattern transfer technology. And developing the exposed dry film resist, and washing the exposed dry film resist which is not subjected to polymerization reaction by using a developing solution so as to expose part of the copper layer.
Step S203: and electrolyzing the copper layer at the exposed part by setting the current density so as to reserve the copper layer in a preset thickness range.
In this embodiment, the copper layer of the exposed portion is electrolyzed by setting a current density, and the plating time is controlled so that the copper layer of the exposed portion remains to a predetermined thickness range, which is 5 micrometers to 10 micrometers. Specifically, a reverse procedure is used to electroplate the copper layer of the electrolytically exposed part, and in the electroplating process, a set current density is applied, the electroplating time is controlled, and part of the copper layer is kept to a preset thickness. The set current density is consistent with the preset current density in the step S201, and the distribution of the current density is mainly determined by the environment of the board surface under the condition that the clamps are the same, so that the current distribution in the electroplating process and the electrolysis process has a good corresponding relationship, so that when the electrolysis is performed until the residual copper is between 5 and 10 micrometers, the uniformity of a copper layer needing further etching is greatly improved, the residual copper can be efficiently and accurately etched, and the outer layer circuit with high precision is obtained.
Step S204: and performing acid etching on the copper layer of the exposed part according to a preset thickness range to remove the copper layer of the exposed part.
In the present embodiment, the copper layer of the exposed portion is exposed to a predetermined thickness range, and after the electrolysis, the uniformity of the copper layer of the exposed portion is improved, and the thickness of the copper layer is kept consistent. At this time, the chemical solution is configured according to the preset thickness range to perform acid etching on the copper layer of the exposed part, so that the copper layer of the exposed part is removed, and the copper layer covered by the corrosion-resistant dry film is kept on the surface of the substrate as a circuit due to the protection of the corrosion-resistant dry film. Wherein, dispose liquid medicine according to predetermineeing thickness range and carry out the acid etching to the copper layer of exposing the part, the incomplete copper of etching that can be high-efficient accurate ensures that the copper layer of exposing the part can be got rid of by the etching completely, avoids partial copper layer not to be got rid of by the etching completely, influences the performance of circuit board.
Step S205: and removing the residual dry corrosion-resistant film by using a liquid medicine to form an outer layer circuit on the surface of the substrate.
In this embodiment, the copper layer after the acid etching is removed, the copper layer at the non-circuit portion is still covered with the dry film resist, and the remaining dry film resist is removed by performing a stripping process on the remaining dry film resist. Specifically, the dry film of resist protecting the wiring layer is peeled off by a chemical solution, thereby exposing the wiring pattern.
In this embodiment, after the outer layer circuit of the completed circuit board is manufactured: the circuit board is subjected to post-process treatment, and according to product requirements, a positive film process, an AOI (automatic optical inspection) process, a solder resist process, a surface treatment process, an appearance process, an electrical measurement process and other post-processes are selected and adopted, and the circuit board can be finally treated only by meeting the requirement. Wherein, solder resist, silk screen printing characters: manufacturing a solder mask layer on a production board according to the prior art and the design requirement and silk-screening characters; surface treatment, detection and molding, namely performing surface treatment on the production board according to the prior art and design requirements, and then testing the electrical performance, the routing shape and the appearance of the production board again to obtain a finished product of the circuit board; and (4) packaging finished products, namely packaging the qualified finished circuit boards according to MI requirements by using a vacuum packaging film under the conditions of heating and vacuumizing, so that the finished circuit boards are prevented from getting damp and are convenient to store and transport.
Different from the prior art, the application provides a manufacturing method of a circuit board, which comprises the following steps: pasting a corrosion-resistant dry film on the copper layer of the substrate, and exposing and developing the corrosion-resistant dry film to expose part of the copper layer; and electrolyzing the copper layer at the exposed part to reserve the copper layer with a preset thickness range. This application is after the base plate electroplates one deck copper layer, and rethread electrolysis remains the copper layer of predetermineeing the thickness scope to make the electrolysis obtain promoting to the copper layer homogeneity of predetermineeing the thickness scope, the incomplete copper of etching that can be high-efficient accurate obtains the outer circuit of high accuracy.
Furthermore, the application also provides a circuit board, and the lead circuit board adopts any one of the manufacturing methods. According to the circuit board manufactured by the method, in the process of forming the circuit board, after the substrate is electroplated with the copper layer, the copper layer within the preset thickness range is reserved through electrolysis, so that the uniformity of the copper layer within the preset thickness range from electrolysis to the preset thickness range is improved, residual copper can be efficiently and accurately etched, and high-precision outer layer circuits can be obtained.
Furthermore, the application also provides an electronic device, and the lead circuit board comprises the circuit board. The electronic device uses the circuit board, so that the signal transmission performance of the electronic device is more stable.
Different from the prior art, the application provides a circuit board which adopts any one of the manufacturing methods. This application is after the base plate electroplates one deck copper layer, and rethread electrolysis remains the copper layer of predetermineeing the thickness scope to make the electrolysis obtain promoting to the copper layer homogeneity of predetermineeing the thickness scope, the incomplete copper of etching that can be high-efficient accurate obtains the outer circuit of high accuracy.
The above description is only an example of the present application and is not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes, which are made by the contents of the specification and the drawings, or which are directly or indirectly applied to other related technical fields, are intended to be included within the scope of the present application.
Claims (10)
1. A manufacturing method of a circuit board is characterized by comprising the following steps:
providing a substrate, wherein at least one side surface of the substrate is covered with a copper layer;
attaching a corrosion-resistant dry film on the copper layer of the substrate, and exposing and developing the corrosion-resistant dry film to expose part of the copper layer;
electrolyzing the copper layer of the exposed part to reserve the copper layer with a preset thickness range;
performing acid etching on the copper layer of the exposed part after electrolysis to remove the copper layer of the exposed part;
and carrying out film stripping treatment on the copper layer subjected to acid etching.
2. The method for manufacturing a circuit board according to claim 1, wherein the step of providing the substrate comprises:
electroplating the surface of the substrate by preset current density, and covering a copper layer on at least one side surface of the substrate.
3. The method of claim 2, wherein the step of electrolyzing the copper layer of the exposed portion comprises:
electrolyzing the copper layer of the exposed portion by a set current density, wherein the set current density is consistent with the preset current density.
4. The method of claim 1, wherein the predetermined thickness is in a range of 5-10 μm.
5. The method of claim 1, wherein the step of de-filming the copper layer after acid etching comprises:
and removing the residual dry corrosion-resistant film by using a liquid medicine to form an outer layer circuit on the surface of the substrate.
6. The method of claim 1, wherein the step of applying a dry film resist on the copper layer of the substrate comprises:
and carrying out surface treatment on the copper layer of the substrate.
7. The method of claim 1, wherein the step of performing an acid etching process on the copper layer of the exposed portion after the step of electrolyzing to remove the copper layer of the exposed portion comprises:
and performing acid etching on the copper layer of the exposed part according to the preset thickness range to remove the copper layer of the exposed part.
8. The method for manufacturing a circuit board according to claim 1, wherein the step of exposing and developing the dry resist film specifically comprises:
transferring an outer layer circuit pattern to the dry film resist by irradiating the dry film resist with ultraviolet light;
and etching the anti-corrosion dry film after the outer layer circuit pattern is transferred by using a liquid medicine to expose part of the copper layer.
9. A circuit board characterized by using the method for manufacturing a circuit board according to any one of claims 1 to 9.
10. An electronic device, characterized in that it comprises a circuit board according to claim 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011488543.4A CN114641141B (en) | 2020-12-16 | 2020-12-16 | Manufacturing method of circuit board, circuit board and electronic device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011488543.4A CN114641141B (en) | 2020-12-16 | 2020-12-16 | Manufacturing method of circuit board, circuit board and electronic device |
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| CN114641141A true CN114641141A (en) | 2022-06-17 |
| CN114641141B CN114641141B (en) | 2024-09-13 |
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| CN103813658A (en) * | 2012-11-13 | 2014-05-21 | 珠海方正科技多层电路板有限公司 | Manufacturing method for multilayer thick copper circuit board and manufacturing method for two-sided thick copper circuit board |
| CN105282985A (en) * | 2014-05-26 | 2016-01-27 | 深圳崇达多层线路板有限公司 | Circuit board single-sided local gold plating method and circuit board |
| CN104023480A (en) * | 2014-06-13 | 2014-09-03 | 金悦通电子（翁源）有限公司 | Processing method for shortening PCB plating process |
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