CN108551725A - A kind of method and its printed circuit board circuit of printed circuit board line electricity plating nickel gold - Google Patents
A kind of method and its printed circuit board circuit of printed circuit board line electricity plating nickel gold Download PDFInfo
- Publication number
- CN108551725A CN108551725A CN201810700579.0A CN201810700579A CN108551725A CN 108551725 A CN108551725 A CN 108551725A CN 201810700579 A CN201810700579 A CN 201810700579A CN 108551725 A CN108551725 A CN 108551725A
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- Prior art keywords
- resist layer
- plating resist
- copper
- gold
- photosensitive
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
A kind of method and its printed circuit board circuit of printed circuit board line electricity plating nickel gold, method are included in the first photosensitive plating resist layer of base layers of copper overlying of base material, are exposed using graphic file, and development removes unexposed first photosensitive plating resist layer, expose base layers of copper；It in first the second photosensitive plating resist layer of photosensitive plating resist layer overlying, is exposed using graphic file, development removes unexposed second photosensitive plating resist layer；The electro-coppering in the base layers of copper of exposing, and copper plate is higher by the top surface of the first photosensitive plating resist layer；Remove the second photosensitive plating resist layer；Plating nickel gold is powered in copper plate, the nickel-gold layer of formation wraps up copper plate；Remove the first photosensitive plating resist layer；Etching removal base layers of copper, forms printed circuit board circuit.Finished product nickel-gold layer of the present invention wraps up copper plate half, avoids the occurrence of ledge structure generation line side and collapses, and leads to the problem of spun gold short circuit, and copper plate, nickel-gold layer pass through base layers of copper conduction, homogeneous current distribution ensures circuit precision.
Description
Technical field
The present invention relates to Manufacturing Technology for PCB fields, more particularly to a kind of printed circuit board line electricity plating nickel gold
Method and its printed circuit board circuit.
Background technology
Electronickelling gold is one of common process of surface treatment of printed circuit board, and traditional nickel-gold electroplating process is usually：
One layer of photosensitive plating resist layer is first pasted on base material, then uses egative film or the LDI graph exposure on plating resist layer, reusing liquid medicine will not
The removal of plating resist layer is exposed, base copper is made to expose, electro-coppering and nickel gold, finally take off plating resist layer on the base copper then exposed again, and
Etch the base copper under plating resist layer.Traditional nickel-gold electroplating process, while base copper under etching plating resist layer, etching solution is golden from nickel
The electro-coppering of layer side attack nickel-gold layer lower layer, as shown in Figure 1, hanging shape, i.e. convex edge is presented in the nickel-gold layer on circuit side after etching
A, convex edge A are that traditional electronickelling gold printed circuit board line side collapses the basic reason for causing spun gold short circuit.
Current line also has in the industry the addition electroplating technology conducting wire in graphic making, completes electronickelling gold after graphic making, makes
Nickel-gold layer is fully wrapped around to layers of copper, and convex edge is avoided to collapse problem.But the technique is limited by figure, electroplated lead when figure complexity
It is difficult to remove, there are bus bar residue problems；And be electroplated by glodclad wire, current distribution is uneven, cause uneven coating even,
Line-width precision is not high.Therefore, it is necessary to a kind of better technological process be designed, to solve the above problems.
Invention content
In view of the problems of the existing technology, a kind of avoidable nickel gold of present invention offer, which collapses, causes spun gold short-circuit, electric current
It is evenly distributed, ensures the method and its printed circuit board circuit of the printed circuit board line electricity plating nickel gold of circuit precision.
To achieve the goals above, the present invention adopts the following technical scheme that：
A kind of method of printed circuit board line electricity plating nickel gold, including：
Step 1：It in the first photosensitive plating resist layer of base layers of copper overlying of base material, is exposed using graphic file, development removal does not expose
First photosensitive plating resist layer of light exposes base layers of copper；
Step 2：It in first the second photosensitive plating resist layer of photosensitive plating resist layer overlying, is exposed using graphic file, development removal is not
Second photosensitive plating resist layer of exposure；
Step 3：The electro-coppering in the base layers of copper of exposing, and copper plate is higher by the top surface of the first photosensitive plating resist layer；
Step 4：Remove the second photosensitive plating resist layer；
Step 5：Plating nickel gold is powered in copper plate, the nickel-gold layer of formation wraps up copper plate；
Step 6：Remove the first photosensitive plating resist layer；
Step 7：Etching removal base layers of copper, forms printed circuit board circuit.
Further, in step 3, the thickness of copper plate is more than the thickness of the first photosensitive plating resist layer, and photosensitive anti-less than first
The thickness of coating and the second photosensitive plating resist layer and.
Further, in step 6, after removing the first photosensitive plating resist layer, the nickel-gold layer is partly wrapped in the periphery of copper plate.
Further, it in step 2, is exposed using graphic file identical with step 1.
Further, in step 4 and step 6, the second photosensitive plating resist layer of removal and the method for removing the first photosensitive plating resist layer
It is different.
The printed circuit board circuit made of the method for above-mentioned printed circuit board line electricity plating nickel gold, including base material, if
The base layers of copper being placed on the outside of the base material, the base layers of copper outside are equipped with copper plate, and the copper plate is externally provided with nickel-gold layer, described
Nickel-gold layer portion envelops are in the periphery of the copper plate.
Beneficial effects of the present invention：
Present invention electro-coppering in base layers of copper, and copper plate is higher by the top surface of the first photosensitive plating resist layer, then removes second
After photosensitive plating resist layer, plating nickel gold is powered in copper plate, the nickel-gold layer of formation wraps up copper plate, then etches base layers of copper and removes
Afterwards, finished product nickel-gold layer wraps up copper plate half, avoids the occurrence of ledge structure generation line side and collapses, leads to the problem of spun gold short circuit,
And the method for the present invention can avoid conducting wire in electroplated lead method is difficult to remove, bus bar residual, electronickelling gold are uneven etc.
Problem, copper plate, nickel-gold layer are conductive by base layers of copper, homogeneous current distribution, ensure circuit precision.
Description of the drawings
Fig. 1 is that there are the schematic diagrames of convex edge for traditional nickel-gold electroplating process in background of invention；
Fig. 2 is schematic diagram of the step 1 of the present invention in the first photosensitive plating resist layer of base layers of copper overlying of base material；
Fig. 3 is that step 1 of the present invention is exposed using graphic file, and development removes unexposed first photosensitive plating resist layer, exposes
The schematic diagram of base layers of copper；
Fig. 4 is schematic diagram of the step 2 of the present invention in first the second photosensitive plating resist layer of photosensitive plating resist layer overlying；
Fig. 5 is that step 3 of the present invention powers on copper-plated schematic diagram in the base layers of copper of exposing；
Fig. 6 is the schematic diagram that step 4 of the present invention removes the second photosensitive plating resist layer；
Fig. 7 is schematic diagram of the step 5 of the present invention after copper plate powers on plating nickel gold；
Fig. 8 is that step 6 of the present invention removes the schematic diagram after the first photosensitive plating resist layer；
Fig. 9 is the schematic diagram that step 7 of the present invention etching removal base layers of copper forms printed circuit board circuit；
In figure, A-convex edge, 1-base material, 2-base layers of copper, the 3-the first photosensitive plating resist layer, the 4-the second photosensitive plating resist layer,
5-copper plates, 6-nickel-gold layers.
Specific implementation mode
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation describes, it is clear that described embodiment is only a part of the embodiment of the present invention, instead of all the embodiments.Base
Embodiment in the present invention, those of ordinary skill in the art obtained without creative efforts it is all its
His embodiment, shall fall within the protection scope of the present invention.
It is to be appreciated that the directional instruction (such as up, down, left, right, before and after ...) of institute is only used in the embodiment of the present invention
In explaining relative position relation, motion conditions etc. under a certain particular pose (as shown in the picture) between each component, if should
When particular pose changes, then directionality instruction also correspondingly changes correspondingly.
The present invention provides a kind of method of printed circuit board line electricity plating nickel gold, includes the following steps：
Such as Fig. 2 and Fig. 3, step 1：In 2 the first photosensitive plating resist layer 3 of overlying of base layers of copper of base material 1, exposed using graphic file
Light, development remove unexposed first photosensitive plating resist layer 3, expose base layers of copper 2.
Such as Fig. 4, step 2：In 3 the second photosensitive plating resist layer 4 of overlying of the first photosensitive plating resist layer, using identical with step 1
Graphic file exposes, and development removes unexposed second photosensitive plating resist layer 4.
Such as Fig. 5, step 3：The electro-coppering in the base layers of copper 2 of exposing, and copper plate 5 is higher by the top of the first photosensitive plating resist layer 3
Face.In the present embodiment, the thickness of copper plate 5 is more than the thickness of the first photosensitive plating resist layer 3, and is less than the first photosensitive plating resist layer 3
With the thickness of the second photosensitive plating resist layer 4 and.
Such as Fig. 6, step 4：Remove the second photosensitive plating resist layer 4.
Such as Fig. 7, step 5：Plating nickel gold is powered in copper plate 5, the nickel-gold layer 6 of formation wraps up copper plate 5.
Such as Fig. 8, step 6：The first photosensitive plating resist layer 3 is removed, nickel-gold layer 6 half is wrapped in the periphery of copper plate 5.Wherein remove
First photosensitive plating resist layer 3 is different from the removal method of the second photosensitive plating resist layer 4 so that the two will not be removed simultaneously.
Such as Fig. 9, step 7：Etching removal base layers of copper 2, forms printed circuit board circuit.
The present invention method, by double exposure, obtain 3 and second photosensitive plating resist layer 4 of the first photosensitive plating resist layer cover it is non-
Land, electro-coppering in the base layers of copper 2 then exposed again, and copper plate 5 is made to be higher by the first photosensitive plating resist layer 3 recycle the
One 3 and second photosensitive plating resist layer of photosensitive plating resist layer, 4 removing method difference, removes after the second photosensitive plating resist layer 4 that obtain copper plate 5 high
Go out the first photosensitive plating resist layer 3 so that the nickel-gold layer 6 obtained after electronickelling gold forms half package structure to copper plate 5, solves biography
Ledge structure, which leads to the problem of line side and collapses, in system technique causes spun gold short-circuit.Copper plate 5 and nickel-gold layer 6 pass through base layers of copper 2
Conduction, homogeneous current distribution ensure circuit precision, compared to the prior art the middle method using electroplating technology conducting wire, the present invention
Avoid the generation for the problems such as lead removal is difficult, and conducting wire remains, current distribution is uneven.
Such as Fig. 9, the printed circuit board circuit made of the method for above-mentioned printed circuit board line electricity plating nickel gold, including base
Material 1 is set to the base layers of copper 2 in 1 outside of base material, and 2 outside of base layers of copper is equipped with copper plate 5, and copper plate 5 is externally provided with nickel-gold layer 6, nickel gold
6 portion envelops of layer are in the periphery of copper plate 5.Base layers of copper 2 is used for the conduction of copper plate 5 and nickel-gold layer 6, avoids relying solely on plating
Current unevenness caused by bus bar conduction, thickness of coating difference is huge, and circuit precision is insufficient.Nickel-gold layer 6 wraps copper plate 5
It wraps up in, avoids the occurrence of ledge structure.After the etching removal of base layers of copper 2, finished product nickel-gold layer 6 is half packet effect to copper plate 5.
The above examples are only used to illustrate the technical scheme of the present invention and are not limiting, although with reference to preferred embodiment to this hair
It is bright to be described in detail, it will be appreciated by those skilled in the art that can technical scheme of the present invention be modified or be waited
With replacing, without departing from the objective and range of the technical program, should all cover in scope of the presently claimed invention.
Claims (6)
1. a kind of method of printed circuit board line electricity plating nickel gold, which is characterized in that including：
Step 1：It in the first photosensitive plating resist layer of base layers of copper overlying of base material, is exposed using graphic file, development removal is unexposed
First photosensitive plating resist layer exposes base layers of copper；
Step 2：It in first the second photosensitive plating resist layer of photosensitive plating resist layer overlying, is exposed using graphic file, development removal is unexposed
The second photosensitive plating resist layer；
Step 3：The electro-coppering in the base layers of copper of exposing, and copper plate is higher by the top surface of the first photosensitive plating resist layer；
Step 4：Remove the second photosensitive plating resist layer；
Step 5：Plating nickel gold is powered in copper plate, the nickel-gold layer of formation wraps up copper plate；
Step 6：Remove the first photosensitive plating resist layer；
Step 7：Etching removal base layers of copper, forms printed circuit board circuit.
2. the method for printed circuit board line electricity plating nickel gold according to claim 1, it is characterised in that：In step 3, plating
The thickness of layers of copper is more than the thickness of the first photosensitive plating resist layer, and less than the thickness of the first photosensitive plating resist layer and the second photosensitive plating resist layer
With.
3. the method for printed circuit board line electricity plating nickel gold according to claim 1, it is characterised in that：In step 6, go
After the first photosensitive plating resist layer, the nickel-gold layer is partly wrapped in the periphery of copper plate.
4. the method for printed circuit board line electricity plating nickel gold according to claim 1, it is characterised in that：In step 2, adopt
It is exposed with graphic file identical with step 1.
5. the method for printed circuit board line electricity plating nickel gold according to claim 1, it is characterised in that：Step 4 and step
In six, the second photosensitive plating resist layer of removal is different from the first photosensitive method of plating resist layer of removal.
6. the printed circuit board circuit made of the method for printed circuit board line electricity plating nickel gold described in claim 1,
It is characterized in that, including：Base material, the base layers of copper being set on the outside of the base material, the base layers of copper outside are equipped with copper plate, the plating
Layers of copper is externally provided with nickel-gold layer, and the nickel-gold layer portion envelops are in the periphery of the copper plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810700579.0A CN108551725B (en) | 2018-06-29 | 2018-06-29 | Method for electroplating nickel and gold on printed circuit board circuit and printed circuit board circuit thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810700579.0A CN108551725B (en) | 2018-06-29 | 2018-06-29 | Method for electroplating nickel and gold on printed circuit board circuit and printed circuit board circuit thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108551725A true CN108551725A (en) | 2018-09-18 |
| CN108551725B CN108551725B (en) | 2020-11-10 |
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ID=63494197
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810700579.0A Active CN108551725B (en) | 2018-06-29 | 2018-06-29 | Method for electroplating nickel and gold on printed circuit board circuit and printed circuit board circuit thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108551725B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115633444A (en) * | 2022-12-19 | 2023-01-20 | 浙江万正电子科技股份有限公司 | Full-plate gold-plated circuit board blank suitable for large copper thickness |
| WO2023083360A1 (en) * | 2021-11-12 | 2023-05-19 | 深圳中科四合科技有限公司 | Manufacturing method for lead frame, and lead frame structure |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3990926A (en) * | 1971-08-30 | 1976-11-09 | Perstorp Ab | Method for the production of material for printed circuits |
| CN101364586A (en) * | 2007-08-10 | 2009-02-11 | 全懋精密科技股份有限公司 | Construction for packaging substrate and preparation thereof |
| CN101388376A (en) * | 2007-09-14 | 2009-03-18 | 全懋精密科技股份有限公司 | Semi-conductor package substrate construction |
| CN104640348A (en) * | 2013-11-14 | 2015-05-20 | 三星电机株式会社 | Printed circuit board and method of manufacturing printed circuit board |
-
2018
- 2018-06-29 CN CN201810700579.0A patent/CN108551725B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3990926A (en) * | 1971-08-30 | 1976-11-09 | Perstorp Ab | Method for the production of material for printed circuits |
| CN101364586A (en) * | 2007-08-10 | 2009-02-11 | 全懋精密科技股份有限公司 | Construction for packaging substrate and preparation thereof |
| CN101388376A (en) * | 2007-09-14 | 2009-03-18 | 全懋精密科技股份有限公司 | Semi-conductor package substrate construction |
| CN104640348A (en) * | 2013-11-14 | 2015-05-20 | 三星电机株式会社 | Printed circuit board and method of manufacturing printed circuit board |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023083360A1 (en) * | 2021-11-12 | 2023-05-19 | 深圳中科四合科技有限公司 | Manufacturing method for lead frame, and lead frame structure |
| CN115633444A (en) * | 2022-12-19 | 2023-01-20 | 浙江万正电子科技股份有限公司 | Full-plate gold-plated circuit board blank suitable for large copper thickness |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108551725B (en) | 2020-11-10 |
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