CN108271319A - Method for manufacturing flexible circuit board - Google Patents
Method for manufacturing flexible circuit board Download PDFInfo
- Publication number
- CN108271319A CN108271319A CN201710099995.5A CN201710099995A CN108271319A CN 108271319 A CN108271319 A CN 108271319A CN 201710099995 A CN201710099995 A CN 201710099995A CN 108271319 A CN108271319 A CN 108271319A
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- China
- Prior art keywords
- metal layer
- layer
- patterning
- circuit board
- patterned
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- 230000009975 flexible effect Effects 0.000 title claims abstract description 126
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 60
- 238000000034 method Methods 0.000 title claims description 30
- 229910052751 metal Inorganic materials 0.000 claims abstract description 148
- 239000002184 metal Substances 0.000 claims abstract description 148
- 238000000059 patterning Methods 0.000 claims description 92
- 229920002120 photoresistant polymer Polymers 0.000 claims description 56
- 238000012545 processing Methods 0.000 claims description 26
- 239000000126 substance Substances 0.000 claims description 11
- 208000007578 phototoxic dermatitis Diseases 0.000 claims description 10
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 9
- 229910052737 gold Inorganic materials 0.000 claims description 9
- 239000010931 gold Substances 0.000 claims description 9
- 238000007747 plating Methods 0.000 claims description 8
- 238000007654 immersion Methods 0.000 claims description 7
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 4
- 238000002386 leaching Methods 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 239000004332 silver Substances 0.000 claims description 4
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 claims description 3
- BSIDXUHWUKTRQL-UHFFFAOYSA-N nickel palladium Chemical compound [Ni].[Pd] BSIDXUHWUKTRQL-UHFFFAOYSA-N 0.000 claims description 3
- 238000004544 sputter deposition Methods 0.000 claims description 3
- 239000003795 chemical substances by application Substances 0.000 claims description 2
- 238000009413 insulation Methods 0.000 claims 1
- 239000010410 layer Substances 0.000 description 213
- 239000000463 material Substances 0.000 description 25
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 16
- 230000015572 biosynthetic process Effects 0.000 description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 238000000576 coating method Methods 0.000 description 8
- 238000005530 etching Methods 0.000 description 8
- 229910052759 nickel Inorganic materials 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 6
- -1 polyethylene terephthalate Polymers 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 238000005553 drilling Methods 0.000 description 5
- 238000013461 design Methods 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 238000010276 construction Methods 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 238000005336 cracking Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000012774 insulation material Substances 0.000 description 3
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 239000011112 polyethylene naphthalate Substances 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 239000004696 Poly ether ether ketone Substances 0.000 description 2
- 239000004695 Polyether sulfone Substances 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000013508 migration Methods 0.000 description 2
- 230000005012 migration Effects 0.000 description 2
- 229920000636 poly(norbornene) polymer Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920006393 polyether sulfone Polymers 0.000 description 2
- 229920002530 polyetherether ketone Polymers 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- LCJRHAPPMIUHLH-UHFFFAOYSA-N 1-$l^{1}-azanylhexan-1-one Chemical compound [CH]CCCCC([N])=O LCJRHAPPMIUHLH-UHFFFAOYSA-N 0.000 description 1
- 229910000570 Cupronickel Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 229920002292 Nylon 6 Polymers 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 238000004380 ashing Methods 0.000 description 1
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000007596 consolidation process Methods 0.000 description 1
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- MOWMLACGTDMJRV-UHFFFAOYSA-N nickel tungsten Chemical compound [Ni].[W] MOWMLACGTDMJRV-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 239000012994 photoredox catalyst Substances 0.000 description 1
- 229950001919 policapram Drugs 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention provides a manufacturing method of a flexible circuit board, which comprises the following steps. Providing a first flexible carrier and forming a first metal layer on the first flexible carrier. The first metal layer is patterned to form a first opening. A first patterned photosensitive insulating layer is formed on the first metal layer, the first patterned photosensitive insulating layer having a via hole exposing the first metal layer. A seed layer is formed on the first patterned photosensitive insulating layer and filled into the through hole, and a via hole is formed in the through hole. A second metal layer is formed on the seed layer, the second metal layer having a second opening exposing the seed layer. The seed layer is patterned by using the second metal layer as a mask to expose a portion of the first patterned photosensitive insulating layer. A second patterned photosensitive insulating layer is formed in the second opening.
Description
Technical field
The present invention relates to a kind of manufacturing method of circuit board, and more particularly to a kind of manufacturing method of flexible circuit board,
It is without using drilling to handle and can form the flexible circuit board of the double-sided circuit structure with different line widths.
Background technology
Printed circuit board (printed circuit board, PCB) is material indispensable in electronic product, at present
It is widely used in computer and its peripheral equipment, communication product and consumer electrical product.With various electronic products
Demand sustainable growth, the demand for printed circuit board is also growing day by day.For flexible circuit board, with notebook
The update of the carrying devices such as computer or mobile phone, demand rapidly increase outside, to the line specificities of flexible circuit board
It is it is required that also increasingly stringent.
In general, now in the manufacturing method of flexible circuit board using the processing such as machine drilling or laser drill with
Meet the feature that Double-side line can be connected.In addition, the processing of the circuit structure based on property circuit board, the line of soft double-sided PCB
Road specification is limited to specific and relatively narrow line width range, and limits to its occupation mode.Therefore, how to improve the system of flexible circuit board
Method is made to reach the requirement of current industry, actually current this field technology personnel, which desire most ardently, solves the problems, such as.
Invention content
The invention relates to a kind of manufacturing method of circuit board, in particular to a kind of manufacture of flexible circuit board
Method handles and can be formed the flexible circuit board of the double-sided circuit structure with different line widths without using to drill.
The present invention provides a kind of manufacturing method of flexible circuit board, includes the following steps.First flexible support plate is provided,
The first metal layer is formed on the first flexible support plate.Patterned first metal layer, to form patterned the first metal layer,
In patterned the first metal layer there is the first opening for exposing the first flexible support plate.It is exhausted to form the first patterning photonasty
Edge layer is on patterned the first metal layer, wherein the first patterning photonasty insulating layer has patterned first metal of exposure
The through-hole of a part for layer.Seed layer is formed on the first patterning photonasty insulating layer and inserts through-hole, with shape in through-holes
Into via hole.Second metal layer is formed on the seed layer, and wherein second metal layer has the second of a part for exposure seed layer
Opening.Using second metal layer as mask, patterned seed layer, to expose the first of part the patterning photonasty insulating layer.
Form the second patterning photonasty insulating layer in the second opening.
In an embodiment of the invention, wherein patterned first metal layer the step of include on the first metal layer
The the first patterning photoresist for exposing part the first metal layer is formed, using the first patterning photoresist as cover
Curtain removes by the part the first metal layer that the first patterning photoresist is exposed and forms patterned first metal
Layer.
In an embodiment of the invention, wherein forming the first patterning photonasty insulating layer patterned the
In step on one metal layer, the first patterning photonasty insulating layer is inserted and is full of the first opening.
In an embodiment of the invention, wherein the step of forming seed layer includes being conformally formed seed layer the
On one patterning photonasty insulating layer, seed layer inserts a part for through-hole and contacts patterned the first metal layer, with logical
Via hole is formed in hole, wherein by via hole, patterned the first metal layer is electrically connected with second metal layer.
In an embodiment of the invention, wherein the method for forming seed layer includes electroless copper processing or sputter
Method.
In an embodiment of the invention, wherein formed second metal layer the step of be included in be formed seed layer it
Afterwards, second photoresist is patterned on the seed layer, wherein there are the second patterning photoresist multiple openings to expose
Part seed layer；Using galvanoplastic in multiple openings of the second patterning photoresist, second metal layer is formed；And it moves
Except the second patterning photoresist, to form the second of second metal layer the opening.
In an embodiment of the invention, wherein after second metal layer is formed with before patterned seed layer,
The manufacturing method of flexible circuit board further includes to form at least one conductive connection pads in second metal layer, wherein forming at least one
Step of a conductive connection pads in second metal layer is after second metal layer is formed with removing the second patterning photoresist
Before, it is included in be formed after second metal layer, with forming the on the second patterning photoresist in second metal layer
There are multiple openings to expose part second metal layer for three patterning photoresists, wherein third patterning photoresist；
Using galvanoplastic in multiple openings of third patterning photoresist, at least one conductive connection pads are formed；And remove the
Three patterning photoresists.
In an embodiment of the invention, wherein the second patterning photoresist and third patterning photoresist
Agent is to remove simultaneously.
In an embodiment of the invention, wherein the method for patterned seed layer includes autoregistration patterned process.
In an embodiment of the invention, the manufacturing method of flexible circuit board is additionally included in form the second patterning
After photonasty insulating layer, the flexible support plate of stripping first.
In an embodiment of the invention, wherein patterned the first metal layer has the first line width, the second gold medal
Belonging to layer has the second line width, wherein the first line width is different from the second line width.
In an embodiment of the invention, wherein the first line width is at least twice or more than twice of the second line width.
It in an embodiment of the invention, can wherein before forming the first metal layer on the first flexible support plate
The manufacturing method of flexible electric circuit board further includes the flexible support plate of offer second, and the first metal is formed on the second flexible support plate
Layer；Form third patterning photonasty insulating layer on the first metal layer, wherein third patterning photonasty insulating layer has more
A third opening exposes part the first metal layer；At least one connection structure is formed in third patterning photonasty insulating layer
In multiple third openings；And at least one connection structure and third patterning photonasty insulating layer are conformed into the first pliability
Support plate.
In an embodiment of the invention, it is wherein photosensitive at least one connection structure is patterned with third
Property insulating layer conform to before the first flexible support plate, the flexible support plate of stripping second.
In an embodiment of the invention, wherein the method for forming at least one connection structure includes chemical nickel
Gold processing, the processing of chemical nickel palladium leaching gold, electroless immersion silver processing or chemical plating stannum processing.
Manufacturing method based on above-mentioned, of the invention flexible circuit board utilizes flexible support plate and photonasty insulation material
Material carries out the manufacture of line construction, forms the flexible circuit board of the present invention by processing such as lithographic, etching and plating, can have
Effect reduces manufacture cost with simplifying manufacturing process, without drilling is used to handle.In addition, in the present invention, it is exhausted by photonasty
The flexible circuit board that edge material is formed has flexible effect, can avoid occurring cracking state after repeatedly bending.More into one
For step, the flexible circuit board as obtained by the manufacturing method of the flexible circuit board of the present invention has at least twice of difference
Different line widths double-sided circuit structure so that its line specificities has wider line width range, and then improves it in various electricity
Utilization rate on sub- product.
To make the foregoing features and advantages of the present invention clearer and more comprehensible, embodiment cited below particularly elaborate as
Under.
Description of the drawings
Figure 1A to Fig. 1 I be the flexible circuit board of one embodiment of the present invention manufacturing method in various stage institutes shape
Into flexible circuit board diagrammatic cross-section；
Fig. 2A to Fig. 2 C be the flexible circuit board of another embodiment of the present invention manufacturing method in part stage institute
The diagrammatic cross-section of the flexible circuit board of formation；
Fig. 3 A to Fig. 3 D be the flexible circuit board of another embodiment of the present invention manufacturing method in part stage institute
The diagrammatic cross-section of the flexible circuit board of formation.
Reference sign：
100：Second flexible support plate；
50：Connection structure；
52：First part；
54：Second part；
110：Third patterns photonasty insulating layer；
112：Third is open；
120：The first metal layer；
120A：Patterned the first metal layer；
122：First opening；
130：First patterning photonasty insulating layer；
132：Through-hole；
140：Seed layer；
140A：Patterned seed layer；
150：Second metal layer；
152：Second opening；
160：First patterning photoresist；
160a、162a、164a：Opening；
162：Second patterning photoresist；
164：Third patterns photoresist；
170：Second patterning photonasty insulating layer；
180：At least one conductive connection pads；
200：First flexible support plate；
V：Via hole.
Specific embodiment
Herein, the range represented by " numerical value to another numerical value ", is that one kind avoids enumerating in the description
The summary representation of all numerical value in the range.Therefore, the record of a certain special value range, covers the numberical range
Interior any number and the relatively fractional value range defined by any number in the numberical range, as bright in the description
Text writes out any number and is somebody's turn to do as compared with fractional value range.
In addition, for ease of a component or feature and another component or the relationship of feature shown in description attached drawing,
Can be used herein for example "/in ... under ", "/in ... lower section ", " lower part ", "/in ... on ", "/in ... top ",
" top " and the spatially relative term of similar terms.Other than orientation shown in attached drawing, the spatially relative term meaning
Element to be covered being differently directed in use or operation.Equipment can be otherwise oriented and (be rotated by 90 ° or in other orientations), and
Spatially relative term used herein is correspondingly made explanations.It should be noted that according to the general job of this industry, various features
It is not drawn to scale.In fact, for clear explanation, the size of element may be arbitrarily zoomed in or out.
In addition, term " first " described in text, " second ", " third ", " the 4th " etc., use in the text is main
Elements or features similar or different shown in description figure are easy for, and can be according to the sequence or context that narration occurs
It describes and mutually exchanges use.
Figure 1A to Fig. 1 I is the section of each step of the manufacturing method of the flexible circuit board of one embodiment of the present invention
Schematic diagram.
Figure 1A is please referred to, provides the first flexible support plate 200, and the first metal is formed on the first flexible support plate 200
Layer 120.First flexible support plate 200 is flexible substrate.In one embodiment, the material example of the first flexible support plate 200
It is selected from polyethylene terephthalate (polyethylene terephthalate, PET) in this way, polyester (polyester), gathers
Carbonic ester (polycarbonate, PC), polyimides (polyimide, PI), polyethylene naphthalate (polyethylene
Naphthalate, PEN), poly- diether ketone (polyether ether ketone, PEEK), Aromatic polyester (polyarylate,
PAR), polycyclic alkene (polycylicolefin, PCO), polynorbornene (polynorbornene), polyether sulfone
The group that (polyethersulphone, PES) and cyclic olefin polymer (cycloolefin polymer, COP) are formed,
So the present invention not this to be limited.In an embodiment, the first metal layer 120 is, for example, copper foil；For example, rolled copper foil or
Electrolytic copper foil, the present invention not this to be limited.
In one embodiment, the first metal layer 120 is formed on the first flexible support plate 200, and to be included in first flexible
Property support plate 200 a surface on and/or a surface of the first metal layer 120 on be coated with one layer of adhesion layer (not shown), pressure
The first flexible support plate 200 and the first metal layer 120 are closed, and obtains putting in order as the first flexible support plate with film layer
200th, the layered structure of adhesion layer and the first metal layer 120.In other words, pass through the setting of adhesion layer, the first pliability of fitting
Support plate 200 and the first metal layer 120.Adhesion layer can increase between the first flexible support plate 200 and the first metal layer 120
Tackness can be conducive to follow-up manufactured reliability.
It is worth noting that, the present invention does not limit the material of adhesion layer, so after the application of an external force, adhesion layer should can be easily
It is torn off and come by the surface of the first metal layer 120, be not easy to remain in the surface of the first metal layer 120.
Referring to Figure 1B and Fig. 1 C, patterned first metal layer 120 exposes the first flexible support plate to be formed
200 the first opening 122.In one embodiment, the method for patterned first metal layer 120 includes lithographic
(photolithography) and etching process.As shown in Figure 1B, patterned first metal layer 120 is included with context of a photographic process the
The first patterning photoresist 160 is formed on one metal layer 120, wherein the first patterning photoresist 160 is with multiple
Be open 160a, and the 160a that is open exposes the first metal layer 120 of part.Then, made with the first patterning photoresist 160
For mask, by etching process, the part the first metal layer 120 being exposed by the first patterning photoresist 160 is removed,
Form patterned the first metal layer 120A.Specifically, patterned the first metal layer 120A has the multiple first openings
122, to expose the first flexible support plate 200, as shown in Figure 1 C.It is worth noting that, those of ordinary skill in the art can
According to structure design demand come adjust opening 160a and first opening 122 quantity, shape and size, the present invention not as
Limit.
In one embodiment, above-mentioned etching process is, for example, wet etch process.In other embodiments, also may be used
To use other suitable etching processes, the present invention is not limited.In one embodiment, above-mentioned context of a photographic process include according to
Sequence bestows coating (coating), pre-baked (prebacking), exposure (exposing), develops (developing) and baked after exposing
(postbaking) processing routines such as.In one embodiment, the first patterning photoresist 160 is, for example, that eurymeric is photic
Anticorrosive additive material, and above-mentioned coating process include rotary coating (spin coating), cast coat (cast coating) or
Coating methods, the present invention such as print roll coating (roll coating) are not particularly limited.In one embodiment, the first figure is removed
The method of case photoresist 160 is, for example, to divest processing such as (wet strip) to be ashed (ashing) or wet type.
Fig. 1 D are please referred to, form the first patterning photonasty insulating layer 130 on patterned the first metal layer 120A,
In the first patterning photonasty insulating layer 130 there is the through-hole 132 of the part for exposing patterned the first metal layer 120A,
And first photonasty insulating layer 130 insert and full of first opening 122.In one embodiment, the first pattern allelopathic is formed
Photosensitiveness insulating layer 130 includes photosensitive insulating material (not shown) being coated on through figure on patterned the first metal layer 120A
On case the first metal layer 120A, by pre-baked formation photonasty insulating film layer (not shown), wherein photonasty insulating film layer is filled out
Enter and be full of the first opening 122；Patterned exposure (partially cured) is carried out to photonasty insulating film layer；It is not exposed by developing to remove
Light region is (i.e.：Non- irradiation and without consolidation zone)；It finally performs and bakes processing after exposing and form the first figure with multiple through-holes 132
Case allelopathic photosensitiveness insulating layer 130, wherein the first photonasty insulating layer 130 is inserted and is full of the first opening 122, as shown in figure iD.
In other words, the first patterning photonasty insulating layer 130 is formed by the photonasty photoresist of minus；For example, example
Policapram (polyimide, PI) of minus or the like in this way.In addition, those of ordinary skill in the art can be according to structure
Design requirement adjusts the quantity of through-hole 132, shape and size, and the present invention is not limited.
Fig. 1 E are please referred to, form seed layer 140 on the first patterning photonasty insulating layer 130 and insert through-hole 132, with
Via hole V is formed in through-hole 132.In one embodiment, the step of forming seed layer 140 is included conformally
(conformally) seed layer 140 is formed on the first patterning photonasty insulating layer 130, and wherein seed layer 140 inserts through-hole
132 part simultaneously contacts patterned the first metal layer 120A, to form via hole V in through-hole 132.
In one embodiment, the unfilled entire through-hole 132 of seed layer 140, as referring to figure 1E, so the present invention is not with this
It is limited.In other embodiments, seed layer 140 can also fill up entire through-hole 132.Also, for suppressed copper migration (copper
Migration) phenomenon, seed layer 140 are, for example, comprising layers of copper nickel layer with configuration above nickel layer.In an embodiment
In, the formation of seed layer 140 for example first carries out electroless nickel plating processing or sputtering method come after forming nickel layer, then above nickel layer directly
Electroless copper processing or sputtering method are performed to form layers of copper.
Referring to Fig. 1 F and Fig. 1 G, second metal layer 150, wherein second metal layer are formed on seed layer 140
150 have the second opening 152 of a part for exposure seed layer 140, and second metal layer 150 inserts through-hole 132.Pass through conducting
Hole V, patterned the first metal layer 120A are electrically connected with second metal layer 150.In one embodiment, such as Fig. 1 F institutes
Show, form second metal layer 150 and be included in the second patterning of formation photoresist 162 on seed layer 140, wherein the second pattern
Changing photoresist 162, there are multiple opening 162a to expose part seed layer 140；Finally, using galvanoplastic in the second pattern
Change in multiple opening 162a of photoresist 162 and form second metal layer 150.Then, as shown in Figure 1 G, the second figure is removed
Case photoresist 162 and formed second metal layer 150 it is multiple second opening 152.In the present invention, the second patterning light
It causes the material of resist 162 and forms and remove the material of mode and the first patterning photoresist 160 and formed with removing
Mode is same or similar, therefore this will not be detailed here.It is worth noting that, those of ordinary skill in the art can be according to structure design
Demand adjusts quantity, shape and the size of the openings of opening 162a and second 152, and the present invention is not limited.In other realities
The step of applying in mode, second metal layer 150 can also be repeatedly formed, to obtain multilayer circuit structure (i.e.：In the first patterning
The top of photonasty insulating layer 130 forms the second metal layer 150 of multilayer).
Please continue to refer to Fig. 1 G, using second metal layer 150 as mask, patterned seed layer 140, to expose part
First patterning photonasty insulating layer 130.In one embodiment, there is exposure seed layer 140 by second metal layer 150
A part the second opening 152, using second metal layer 150 as mask, by etching process, remove and be open 152 by second
The part seed layer 140 that is exposed and form patterned seed layer 140A, as shown in Figure 1 G.In one embodiment,
The forming method of patterned seed layer 140A is, for example, autoregistration (self-align) patterned process.
Fig. 1 H are please referred to, form the second patterning photonasty insulating layer 170 in the second opening 152.In an embodiment party
In formula, the second patterning photonasty insulating layer 170 is formed in the first figure of part being exposed by patterned seed layer 140A
On case allelopathic photosensitiveness insulating layer 130, and fill up multiple second openings 152 of second metal layer 150.In the present invention, the second figure
The material and formation side of the material and generation type of case allelopathic photosensitiveness insulating layer 170 with the first patterning photonasty insulating layer 130
Formula is same or similar, therefore this will not be detailed here.
Please refer to Fig. 1 I, the flexible support plate 200 of stripping first.In one embodiment, by the first flexible support plate 200
It is separated with patterned the first metal layer 120A degummings.More specifically, by being located at the first flexible support plate 200 and warp
Adhesion layer between patterned first metal layer 120A, patterned the first metal layer 120A can easily with the first flexible support plate
200 separate.As shown in Figure 1 I, a surface of patterned the first metal layer 120A is exposed.
So far step, it is complete as the two-sided flexible circuit board made by the manufacturing method of the flexible circuit board of the present invention
Into wherein patterned the first metal layer 120A has the first line width, second metal layer 150 has the second line width, wherein first
Line width is different from the second line width.In one embodiment, the first line width of patterned the first metal layer 120A is at least
Twice or more than twice of second line width of two metal layers 150 so that by the manufacturing method institute of the flexible circuit board of the present invention
The line specificities of manufactured two-sided flexible circuit board have wider line width range, and then improve it in various electronic products
Utilization rate.
Manufacturing method based on above-mentioned, of the invention flexible circuit board utilizes flexible support plate and photonasty insulation material
Material carries out the manufacture of line construction, forms the flexible circuit board of the present invention by processing such as lithographic, etching and plating, can have
Effect reduces manufacture cost with simplifying manufacturing process, without drilling is used to handle.In addition, in the present invention, it is exhausted by photonasty
The flexible circuit board that edge material is formed has flexible effect, can avoid occurring cracking state after repeatedly bending.
Fig. 2A to Fig. 2 C be the flexible circuit board of another embodiment of the present invention manufacturing method in part stage institute
The diagrammatic cross-section of the flexible circuit board of formation.Specifically, in the flexible circuit board of another embodiment of the present invention
Manufacturing method in, before patterned first metal layer 120 (Figure 1B), at least one connection structure 50 can be additionally formed
On the first metal layer 120.In other words, before the step of performing Figure 1B, the step of first carrying out Fig. 2A to Fig. 2 C.
It is worth noting that, in the present embodiment, at least one connection structure 50 is, for example, double-layer structure, so the present invention
It is not limited；In other embodiments, at least one connection knot can be illustrated for single layer structure or more than double-layer structure
It is as follows.
Fig. 2A is please referred to, the second flexible support plate 100 is provided, the first metal layer is formed on the second flexible support plate 100
120.The practice herein is similar to the processing for forming the first metal layer 120 in Figure 1A on the first flexible support plate 200, therefore herein
No longer it is described in detail.Wherein, the second flexible support plate 100 is flexible substrate.In one embodiment, the second flexible support plate 100
There is the same or similar material with the first flexible support plate 200.
As shown in Figure 2 A, it forms third and patterns photonasty insulating layer 110 on the first metal layer 120, wherein third figure
There is case allelopathic photosensitiveness insulating layer 110 multiple thirds opening 112 to expose part the first metal layer 120.Third patterning is photosensitive
Property insulating layer 110 be negative type photoresist material.In the present invention, the material of third patterning photonasty insulating layer 110 and
Generation type and the material and formation of the first patterning photonasty insulating layer 130 and the second patterning photonasty insulating layer 170
Mode is same or similar, therefore this will not be detailed here.
Fig. 2 B are please referred to, the third for forming at least one connection structure 50 in third patterning photonasty insulating layer 110 is opened
In mouth 112.More specifically, in the present embodiment, at least one connection structure 50 is, for example, double-layer structure；Such as Fig. 2 B institutes
Show, at least one connection structure 50 includes the first part 52 of contact the first metal layer 120 and by connecting first part 52
And the second part 54 being electrically connected with the first metal layer 120.In one embodiment, the shape of at least one connection structure 50
Include at chemical nickel gold (also referred to as changing nickel leaching gold, electroless nickel immersion gold, ENIG) into method
Reason, therefore the material of first part 52 is nickel or nickel alloy, and the material of second part 54 is gold or billon.
In other embodiments, first part 52 and the forming method of second part 54 can also include chemical plating stannum
(electroless plating tin, eSn) processing.So, in other embodiments, at least one connection structure 50 can be
Single layer structure (such as with electroless immersion silver (immersion silver, iAg) or chemical wicking (immersion tin, iSn) etc.
Processing is formed) or more than double-layer structure (such as with chemical nickel palladium leaching gold (electroless nickel electroless
Palladium immersion gold, ENEPIG) handle to be formed).In other embodiments, at least one connection structure
50 forming method is, for example, to be formed with other similar to the other suitable processing of above-mentioned various processing, and the present invention is not special
As limit.
Fig. 2 C are please referred to, at least one connection structure 50 and third patterning photonasty insulating layer 110 are conformed to first
Flexible support plate 200 makes the first metal layer 120 be formed in the top of the first flexible support plate 200.In one embodiment,
It, will before at least one connection structure 50 and third patterning photonasty insulating layer 110 are conformed to the first flexible support plate 200
Second flexible support plate 100 by the first metal layer 120 sur-face peeling.Above-mentioned stripping mode is similar in Fig. 1 I by through pattern
Change the processing of the flexible support plate 200 of stripping first on the first metal layer 120A, and above-mentioned laminating type is also similar to that in Figure 1A
The processing of the first metal layer 120 is formed on the first flexible support plate 200, therefore this will not be detailed here.
After the step of completing Fig. 2 C, to pattern the first flexible support plate 200 can be had been formed on the step of hookup 1B
On the first metal layer 120, and sequentially perform subsequent step (i.e. Fig. 1 C to Fig. 1 I).Accordingly, the pliability of the present invention can be passed through
The manufacturing method (i.e. Fig. 2A to Fig. 2 C, Figure 1B to Fig. 1 I) of circuit board can come form the double-sided circuit structure with different line widths
Flexible electric circuit board.
Fig. 3 A to Fig. 3 D be the flexible circuit board of another embodiment of the present invention manufacturing method in part stage institute
The diagrammatic cross-section of the flexible circuit board of formation.The manufacturing method of the flexible circuit board of present embodiment and above-mentioned Figure 1A are extremely
The manufacturing method of the flexible circuit board of Fig. 1 I is similar, therefore the same or similar element is with identical or similar symbol table
Show, and be not repeated to illustrate.
Specifically, the manufacturing method of the flexible circuit board of present embodiment and the pliability electricity of above-mentioned Figure 1A to Fig. 1 I
The main difference of the manufacturing method of road plate be in, after second metal layer 150 is formed with before patterned seed layer 140,
The manufacturing method of the flexible circuit board of present embodiment also includes forming at least one conductive connection pads in second metal layer 150
180。
Fig. 3 A are please referred to, after the described manufacturing process of Figure 1A to Fig. 1 F, are subsequently formed at least one conductive connection pads 180
In second metal layer 150.In other words, with removing the second patterning photoresist 162 after second metal layer 150 is formed
Before, at least one conductive connection pads 180 are initially formed in second metal layer 150.
In one embodiment, at least one conductive connection pads 180 are formed to be included in be formed after second metal layer 150,
With forming third patterning photoresist 164 on the second patterning photoresist 162 in second metal layer 150, wherein
There are third patterning photoresist 164 multiple opening 164a to expose part second metal layer 150；Finally, plating is utilized
After method forms at least one conductive connection pads 180 in multiple opening 164a of third patterning photoresist 164, third is removed
Pattern photoresist 164.In one embodiment, the second patterning photoresist 162 and third patterning are photic
Resist 164 is to remove simultaneously.The right present invention is not limited, and in other embodiments, e.g. first removes third pattern
After changing photoresist 164, then remove the second patterning photoresist 162.
In one embodiment, the material of at least one conductive connection pads 180 is, for example, nickel tungsten or the like, so originally
Invention is not limited；In other embodiments, the material of at least one conductive connection pads 180 is, for example, to depend on subsequent processing
Required other suitable materials.In the present invention, the material of third patterning photoresist 164 and formation are with removing mode
The material of photoresist 162 is patterned with the first patterning photoresist 160 and second and is formed identical with removing mode
Or it is similar, therefore this will not be detailed here.It is worth noting that, those of ordinary skill in the art can adjust according to structure design demand
Quantity, shape and the size of whole opening 164a, the present invention are not limited.
Fig. 3 B are please referred to, using second metal layer 150 as mask, patterned seed layer 140, to expose the first of part
Pattern photonasty insulating layer 130.The method of patterned seed layer 140 with process to describe in figure 1g, therefore herein will no longer
It repeats.
Fig. 3 C are please referred to, form the second patterning photonasty insulating layer 170 in the second opening 152.Second pattern allelopathic
The formation of photosensitiveness insulating layer 170 will be repeated no longer herein described in Fig. 1 H.In one embodiment, the second pattern
Allelopathic photosensitiveness insulating layer 170 fills up the second opening 152 of second metal layer 150, and extends at least one conductive connection pads of cladding
180 side wall.
Please refer to Fig. 3 D, the flexible support plate 200 of stripping first.The stripping mode of first flexible support plate 200 is in Fig. 1 I
Described in, therefore will no longer repeat herein.
So far step, by manufacturing method (i.e. Figure 1A to Fig. 1 F, Fig. 3 A to Fig. 3 D) institute of the flexible circuit board of the present invention
Manufactured two-sided flexible circuit board has been completed, wherein patterned the first metal layer 120A has the first line width, the second metal
Layer 150 has the second line width, wherein the first line width is different from the second line width.In one embodiment, patterned first gold medal
The first line width of category layer 120A is at least twice or more than twice of the second line width of second metal layer 150.
In conclusion the manufacturing method of the flexible circuit board of the present invention utilizes flexible support plate and photonasty insulation material
Material carries out the manufacture of line construction, forms the flexible circuit board of the present invention by processing such as lithographic, etching and plating, can have
Effect reduces manufacture cost with simplifying manufacturing process, without drilling is used to handle.In addition, in the present invention, it is exhausted by photonasty
The flexible circuit board that edge material is formed has flexible effect, can avoid occurring cracking state after repeatedly bending.In addition, this
The line specificities of two-sided flexible circuit board made by the manufacturing method of the flexible circuit board of invention have wider line width
Range, and then improve its utilization rate in various electronic products.
Although the present invention is disclosed as above with embodiment, however, it is not to limit the invention, any affiliated technology neck
Technical staff in domain, without departing from the spirit and scope of the present invention, when can make a little change with retouching, therefore the present invention guarantor
Subject to shield range ought be defined depending on claims.
Claims (15)
1. a kind of manufacturing method of flexible circuit board, which is characterized in that including：
First flexible support plate is provided, the first metal layer is formed on the described first flexible support plate；
The first metal layer is patterned, to form patterned the first metal layer, wherein the patterned the first metal layer
With the first opening for exposing the described first flexible support plate；
The first patterning photonasty insulating layer is formed on the patterned the first metal layer, wherein the first pattern allelopathic
Photosensitiveness insulating layer has the through-hole of a part for the exposure patterned the first metal layer；
Seed layer is formed on the described first patterning photonasty insulating layer and inserts the through-hole, to be formed in the through-hole
Via hole；
Second metal layer is formed on the seed layer, wherein the second metal layer has a part for the exposure seed layer
Second opening；
Using the second metal layer as mask, the seed layer is patterned, to expose the first pattern allelopathic of part
Photosensitiveness insulating layer；And
The second patterning photonasty insulating layer is formed in the described second opening.
2. the manufacturing method of flexible circuit board according to claim 1, which is characterized in that patterning first metal
The step of layer be included in formed on the first metal layer expose the part the first metal layer the first patterning it is photic anti-
Agent is lost, using the described first patterning photoresist as mask, removes and is exposed by the described first patterning photoresist
Come the part the first metal layer and form the patterned the first metal layer.
3. the manufacturing method of flexible circuit board according to claim 1, which is characterized in that forming first pattern
In step of the allelopathic photosensitiveness insulating layer on the patterned the first metal layer, the first patterning photonasty insulating layer is filled out
Enter and be full of first opening.
4. the manufacturing method of flexible circuit board according to claim 1, which is characterized in that form the step of the seed layer
Rapid to include being conformally formed the seed layer on the described first patterning photonasty insulating layer, the seed layer is inserted described logical
The part in hole simultaneously contacts the patterned the first metal layer, to form the via hole in the through-hole, wherein passing through
The via hole, the patterned the first metal layer are electrically connected with the second metal layer.
5. the manufacturing method of flexible circuit board according to claim 1, which is characterized in that form the side of the seed layer
Method includes electroless treatment or sputtering method.
6. the manufacturing method of flexible circuit board according to claim 1, which is characterized in that form the second metal layer
The step of include：
After the seed layer is formed, the second patterning photoresist is formed on the seed layer, wherein described second
There are patterning photoresist multiple openings to expose the part seed layer；
Using galvanoplastic in the multiple opening of the described second patterning photoresist, the second metal layer is formed；
And
The second patterning photoresist is removed, to form second opening of the second metal layer.
7. the manufacturing method of flexible circuit board according to claim 6, which is characterized in that forming second metal
After layer with before patterning the seed layer, the manufacturing method further includes to form at least one conductive connection pads described second
On metal layer,
Wherein, it forms step of at least one conductive connection pads in the second metal layer and is forming the second metal layer
Later before the second patterning photoresist described with removal, including：
After the second metal layer is formed, shape on photoresist is patterned with described second in the second metal layer
Photoresist is patterned into third, wherein there are third patterning photoresist multiple openings to expose described in part
Second metal layer；
Using galvanoplastic in the multiple opening of third patterning photoresist, at least one conduction is formed
Connection pad；And
Remove the third patterning photoresist.
8. the manufacturing method of flexible circuit board according to claim 7, which is characterized in that second patterning is photic
Resist and third patterning photoresist are to remove simultaneously.
9. the manufacturing method of flexible circuit board according to claim 1, which is characterized in that pattern the seed layer
Method includes autoregistration patterned process.
10. the manufacturing method of flexible circuit board according to claim 1, which is characterized in that be additionally included in described in being formed
After second patterning photonasty insulating layer, the described first flexible support plate of stripping.
11. the manufacturing method of flexible circuit board according to claim 1, which is characterized in that described patterned first
Metal layer has the first line width, and the second metal layer has the second line width, wherein the First Line is wide to be different from described the
Two line widths.
12. the manufacturing method of flexible circuit board according to claim 11, which is characterized in that first line width is at least
Twice or more than twice for second line width.
13. the manufacturing method of flexible circuit board according to claim 1, which is characterized in that in the described first pliability
It is formed on support plate before the first metal layer, the manufacturing method further includes：
Second flexible support plate is provided, the first metal layer is formed on the described second flexible support plate；
It forms third and patterns photonasty insulating layer on the first metal layer, wherein third patterning photonasty insulation
There is layer multiple thirds opening to expose the part the first metal layer；
At least one connection structure is formed in the multiple third opening of third patterning photonasty insulating layer；And
At least one connection structure and third patterning photonasty insulating layer are conformed into the described first flexible load
Plate.
14. the manufacturing method of flexible circuit board according to claim 13, which is characterized in that will be described at least one
Before connection structure conforms to the described first flexible support plate with third patterning photonasty insulating layer, stripping described second
Flexible support plate.
15. the manufacturing method of flexible circuit board according to claim 13, which is characterized in that formed described at least one
The method of connection structure includes chemical nickel gold processing, chemical plating stannum processing, electroless immersion silver processing, chemical wicking processing or chemical nickel
Palladium leaching gold processing.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW106100086A TW201826899A (en) | 2017-01-03 | 2017-01-03 | Manufacturing method of flexible circuit board |
| TW106100086 | 2017-01-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108271319A true CN108271319A (en) | 2018-07-10 |
Family
ID=62770793
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710099995.5A Withdrawn CN108271319A (en) | 2017-01-03 | 2017-02-23 | Method for manufacturing flexible circuit board |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN108271319A (en) |
| TW (1) | TW201826899A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114040590A (en) * | 2021-10-22 | 2022-02-11 | 重庆康佳光电技术研究院有限公司 | Double-sided circuit substrate, display panel and preparation method thereof |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI815596B (en) * | 2022-08-09 | 2023-09-11 | 陳旭東 | Additive thin circuit board manufacturing method |
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| CN102693951A (en) * | 2011-03-23 | 2012-09-26 | 索尼公司 | semiconductor device, method of manufacturing the same, and method of manufacturing wiring board |
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| CN1552174A (en) * | 2001-09-05 | 2004-12-01 | �ձ�������ʽ���� | Mulitilayer circuit board, resin base material, and its production method |
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| CN102388683A (en) * | 2009-04-09 | 2012-03-21 | 埃托特克德国有限公司 | Method of manufacturing a circuit carrier layer and a use of said method for manufacturing a circuit carrier |
| CN102693951A (en) * | 2011-03-23 | 2012-09-26 | 索尼公司 | semiconductor device, method of manufacturing the same, and method of manufacturing wiring board |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114040590A (en) * | 2021-10-22 | 2022-02-11 | 重庆康佳光电技术研究院有限公司 | Double-sided circuit substrate, display panel and preparation method thereof |
| CN114040590B (en) * | 2021-10-22 | 2023-06-16 | 重庆康佳光电技术研究院有限公司 | Double-sided circuit substrate, display panel and preparation method of display panel |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201826899A (en) | 2018-07-16 |
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Application publication date: 20180710 |