CN103906354A - Circuit board and method for manufacturing the same - Google Patents
Circuit board and method for manufacturing the same Download PDFInfo
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- CN103906354A CN103906354A CN201310051726.3A CN201310051726A CN103906354A CN 103906354 A CN103906354 A CN 103906354A CN 201310051726 A CN201310051726 A CN 201310051726A CN 103906354 A CN103906354 A CN 103906354A
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- 238000000034 method Methods 0.000 title claims abstract description 39
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- 239000000758 substrate Substances 0.000 claims abstract description 29
- 230000004888 barrier function Effects 0.000 claims description 127
- 238000003466 welding Methods 0.000 claims description 47
- 230000007547 defect Effects 0.000 abstract description 6
- 238000005553 drilling Methods 0.000 abstract description 5
- 230000005540 biological transmission Effects 0.000 abstract description 4
- 238000009713 electroplating Methods 0.000 abstract description 4
- 239000003292 glue Substances 0.000 abstract 1
- 239000013078 crystal Substances 0.000 description 28
- 239000000463 material Substances 0.000 description 21
- 238000005516 engineering process Methods 0.000 description 7
- 238000000059 patterning Methods 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 239000002893 slag Substances 0.000 description 3
- 238000000280 densification Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 238000001259 photo etching Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 206010057855 Hypotelorism of orbit Diseases 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000001311 chemical methods and process Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000010297 mechanical methods and process Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
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- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention discloses a circuit board and a manufacturing method thereof. A first insulating layer is disposed on the substrate and has a plurality of first openings. The first conductive parts are arranged on the first insulating layer at intervals and correspondingly filled in the first openings. A second insulating layer is disposed on the first insulating layer and has a plurality of second openings to expose the first conductive features. The second conductive parts are arranged on the second insulating layer at intervals and filled in the second openings, wherein the second openings are smaller than the first openings. The invention can improve the contraposition ability in the process, so as to increase the available wiring area, the transmission rate and the transmission direction on the printed circuit board in a limited space, thereby meeting the requirement of high density. In addition, the difficulty and the possibility of defects of processes such as laser drilling, glue residue removal or electroplating can be reduced, and the quality of the printed circuit board is further improved.
Description
Technical field
The present invention relates to a kind of circuit board technology, relate in particular to a kind of circuit board and manufacture method thereof with small size conductive welding disk.
Background technology
Printed circuit board (PCB) (printed circuit board, PCB) be according to circuit design, the conducting wiring of connecting circuit part is drawn to wiring pattern, and then in modes such as mechanical and chemical process, surface treatments, on insulator, form the circuit board of electrical conductor.Foregoing circuit pattern is that the technology such as application of printed, photoetching, etching and plating form accurate distribution, as supporting the interconnective assembly platform of circuit between electronic component and part.
Along with electronic product continues towards light, thin, short, little and multi-functional future development, the volume of chip is dwindled gradually, and input and output (input and output, I/O) number increases, more crypto set causes connecting up, and the quantity of welding conductive structure is increased and hypotelorism, therefore the wiring area of printed circuit board (PCB) reduces and causes wiring difficulty more and more high.
Conventionally by dwindling the conductive welding disk of conductive structure, increase the wiring area of printed circuit board (PCB).But, cross conference and increase technology difficulty and cause the defect of printed circuit board (PCB) to produce owing to connecting the aspect ratio (aspect ratio) of via of conductive welding disk, the size of via is dwindled and reach bottleneck.Moreover, when the size of conductive welding disk is dwindled, can cause technologic contraposition difficulty to increase, and be difficult in limited space, increase available wiring area on printed circuit board (PCB).
Therefore, be necessary to seek a kind of circuit board and manufacture method thereof of novelty, it can solve or improve above-mentioned problem.
Summary of the invention
In order to overcome the defect of prior art, the embodiment of the present invention provides a kind of circuit board, comprises a substrate, has a relative first surface and a second surface; Multiple the first conducting blocks, are spaced on the first surface of substrate; One first insulating barrier, is arranged on the first surface of substrate, and has multiple the first openings, to expose the first conducting block; Multiple the first conductive components, are spaced on the first insulating barrier, and correspondence inserts the first opening, to be electrically connected the first conducting block; One second insulating barrier, is arranged on the first insulating barrier, and has multiple the second openings, to expose the first conductive component; Multiple the second conductive components, are spaced on the second insulating barrier, and insert the second opening, and wherein the second opening is less than the first opening.
The embodiment of the present invention provides a kind of manufacture method of circuit board, comprising: on a first surface of a substrate, form spaced multiple the first conducting block.On the first surface of substrate, form one first insulating barrier, it has multiple the first openings, to expose the first conducting block.On the first insulating barrier, form spaced multiple the first conductive component, and correspondence inserts the first opening, to be electrically connected the first conducting block.On the first insulating barrier, form one second insulating barrier, it has multiple the second openings, to expose the first conductive component.On the second insulating barrier, form spaced multiple the second conductive component, and insert the second opening, wherein the second opening is less than the first opening.
The present invention on can lifting process to capability, with in limited space, increase available wiring area, transfer rate and transmission direction on printed circuit board (PCB), and meet the demand of densification.In addition, also can reduce laser drill, the difficulty of the technique such as slag or plating of removing photoresist and occur the possibility of defect, and then promote the quality of printed circuit board (PCB).
Accompanying drawing explanation
Fig. 1 to Fig. 6 is the manufacture method generalized section that shows the circuit board of one embodiment of the invention; And
Fig. 7 is the generalized section that shows the circuit board of another embodiment of the present invention.
Wherein, description of reference numerals is as follows:
100 ~ substrate;
102 ~ first surface;
104 ~ second surface;
200 ~ the first conducting blocks;
210 ~ the first insulating barriers;
220 ~ the first openings;
230 ~ the first inculating crystal layers;
235 ~ the first dry films;
240 ~ the first conductive components;
245 ~ the first conductive welding disks;
250 ~ the second insulating barriers;
260 ~ the second openings;
270 ~ the second inculating crystal layers;
275 ~ the second dry films;
280 ~ the second conductive components;
285 ~ the second conductive welding disks;
300 ~ the second conducting blocks;
The 310 ~ three insulating barrier;
The 320 ~ three opening;
The 330 ~ three inculating crystal layer;
The 335 ~ three dry film;
The 340 ~ three conductive component;
The 345 ~ three conductive welding disk;
The 350 ~ four insulating barrier;
The 360 ~ four opening;
The 370 ~ four inculating crystal layer;
The 375 ~ four dry film;
The 380 ~ four conductive component;
The 385 ~ four conductive welding disk.
Embodiment
Circuit board and the manufacture method thereof of the embodiment of the present invention are below described.But, can understand easily embodiment provided by the present invention and only make and use the present invention for explanation with ad hoc approach, not in order to limit to scope of the present invention.Moreover, in the accompanying drawing of the embodiment of the present invention and description, represent same or analogous parts with identical label.
Please refer to Fig. 6, it shows the generalized section of the circuit board of one embodiment of the invention.In the present embodiment, circuit board comprises a substrate 100, multiple the first conducting block 200, one first insulating barrier 210, multiple the first conductive component 240, one second insulating barrier 250, the second conductive component 280, multiple the second conducting block 300, one the 3rd insulating barrier 310, multiple the 3rd conductive component 340, one the 4th insulating barrier 350 and the 4th conductive component 380.Substrate 100 has a relative first surface 102 and a second surface 104.In the present embodiment, substrate 100 can be made up of resin material.
The first conducting block 200 is spaced on the first surface 102 of substrate 100.The first insulating barrier 210 is arranged on the first surface 102 of the first conducting block 200 and substrate 100, and has multiple the first openings 220 (being shown in Fig. 1), to expose the first conducting block 200.The first conductive component 240 is spaced on the first insulating barrier 210, and correspondence inserts the first opening 220, and to be electrically connected the first conducting block 200, wherein each first conductive component 240 comprises the first conductive welding disk 245 being positioned on the first insulating barrier 210.The second insulating barrier 250 is arranged on the first conductive component 240 and the first insulating barrier 210, and has multiple the second openings 260 (being shown in Fig. 4), to expose the first conductive component 240.The second conductive component 280 is spaced on the second insulating barrier 250, and correspondence inserts the second opening 260, and wherein each second conductive component 280 comprises the second conductive welding disk 285 being positioned on the second insulating barrier 250.
In the present embodiment, the quantity of the second opening 260 can be same as the quantity of the first opening 220, make each first conductive component 240 can be electrically connected correspondence to insert each second conductive component 280 of the second opening 260, and the width of the second opening 260 is less than the width of the first opening 220.Based on electrical consideration, conducting structure between substrate layer (for example, the first conductive component 240 and the second conductive component 280) total sectional area and insulating barrier (for example, the first insulating barrier 210 and the second insulating barrier 250) the fixing situation of thickness under, make the width of the second opening 260 of top be less than the width of the first opening 220 of below, can reach the size of the second conductive welding disk 285 that dwindles top and the object to capability on lifting process simultaneously.Moreover, compared to known technology, because the aspect ratio of the first opening 220 and the second opening 260 all reduces, therefore can reduce and (for example form via, laser drill or etch process) or subsequent technique is (for example, slag or electroplating technology etc. remove photoresist) difficulty and there is the possibility of defect, and then promote the quality of printed circuit board (PCB).
In the present embodiment, the size of the second conductive welding disk 285 is less than the size of the first conductive welding disk 245.Make the width of the second opening 260 be less than the width of the first opening 220 and the size of the second conductive welding disk 285 is dwindled, when connect up area to increase, make the size of the first conductive welding disk 245 be greater than the size of the second conductive welding disk 285 simultaneously, can avoid the current path of conducting structure to reduce, to meet electrical demand, and can promote the first conductive component 240 to capability and be reduced in the possibility that produces dislocation while forming the second conductive component 280 on the first conductive component 240.
Similarly, the second conducting block 300 is spaced on the second surface 104 of substrate 100.The 3rd insulating barrier 310 is arranged on the second surface 104 of the second conducting block 300 and substrate 100, and has multiple the 3rd openings 320 (being shown in Fig. 1), to expose the second conducting block 300.The 3rd conductive component 340 is spaced on the 3rd insulating barrier 310, and correspondence inserts the 3rd opening 320, and to be electrically connected the second conducting block 300, wherein each the 3rd conductive component 340 comprises the 3rd conductive welding disk 345 being positioned on the 3rd insulating barrier 310.The 4th insulating barrier 350 is arranged on the 3rd conductive component 340 and the 3rd insulating barrier 310, and has multiple the 4th openings 360 (being shown in Fig. 4), to expose the 3rd conductive component 340.The 4th conductive component 380 is spaced on the 4th insulating barrier 350, and correspondence inserts the 4th opening 360, and wherein each the 4th conductive component 380 comprises the 4th conductive welding disk 385 being positioned on the 4th insulating barrier 350.
In the present embodiment, the quantity of the 4th opening 360 can be same as the quantity of the 3rd opening 320, make each the 3rd conductive component 340 can be electrically connected correspondence to insert each the 4th conductive component 380 of the 4th opening 360, and the width of the 4th opening 360 is less than the width of the 3rd opening 320.In the present embodiment, the size of the 4th conductive welding disk 385 is less than the size of the 3rd conductive welding disk 345.
In the present embodiment, coordinate electrically and actual demand, the material of the first insulating barrier 210 or thickness can be same as material or the thickness of the second insulating barrier 250, or the material of the 3rd insulating barrier 310 or thickness can be same as material or the thickness of the 4th insulating barrier 350.Moreover, first, second, third and the 4th insulating barrier 210,250,310 and 350 can be formed by ABF (Ajinomoto Build-up Film) or PP (Prepreg) material.In other embodiments, the material of the first insulating barrier 210 or thickness also can not be same as material or the thickness of the second insulating barrier 250, or the material of the 3rd insulating barrier 310 or thickness also can not be same as material or the thickness of the 4th insulating barrier 350.
Please refer to Fig. 7, it shows the generalized section of the circuit board of another embodiment of the present invention, and the parts that are wherein same as Fig. 6 use identical label, and also the description thereof will be omitted.In the present embodiment, the structure of circuit board is similar to the embodiment of Fig. 6, and different being in can be more than the quantity of the first opening 220 in the quantity of the second opening 260, and each first conductive component 240 can be electrically connected multiple the second conductive components 280.The quantity of the 4th opening 360 can be more than the quantity of the 3rd opening 320, and each the 3rd conductive component 340 can be electrically connected multiple the 4th conductive components 380.In other embodiments, be electrically connected the quantity of the second conductive component 280 of each the first conductive component 240, or be electrically connected the quantity of the 4th conductive component 380 of each the 3rd conductive component 340, can coordinate electrically and actual demand is adjusted to more than two or three.
Fig. 1 to Fig. 6 is the manufacture method generalized section that shows the circuit board of one embodiment of the invention.Please refer to Fig. 1, a substrate 100 is provided, it has a relative first surface 102 and a second surface 104.In the present embodiment, substrate 100 can be made up of resin material.On the first surface 102 of substrate 100 and second surface 104, form respectively a conductive layer (not illustrating), and by photoetching and etch process, patterned conductive layer, to form respectively spaced multiple the first conducting block 200 and multiple the second conducting block 300 on first surface 102 and second surface 104.Then, carry out a process for pressing, on the first surface 102 of substrate 100 and second surface 104, form respectively one first insulating barrier 210 and one the 3rd insulating barrier 310, to cover respectively the first conducting block 200 and the second conducting block 300.In the present embodiment, the first insulating barrier 210 or the 3rd insulating barrier 310 can be made up of ABF or PP material.Then, can pass through a laser drilling process, on the first insulating barrier 210 and the 3rd insulating barrier 310, form respectively multiple the first openings 220 and multiple the 3rd opening 320, to expose respectively the first conducting block 200 and the second conducting block 300.Carrying out, after laser drilling process, can going the step of de-smear, to remove the residue (not illustrating) in the first opening 220 and the 3rd opening 320 after laser drill.
Please refer to Fig. 2, by a depositing operation (for example, electroless plating), on the first insulating barrier 210 and the 3rd insulating barrier 310, form respectively one first seed crystal (seed) layer 230 and one the 3rd inculating crystal layer 330, and extend to respectively in the first opening 220 (being shown in Fig. 1) and the 3rd opening 320 (being shown in Fig. 1).Then, carry out image transfer, on the first inculating crystal layer 230 and the 3rd inculating crystal layer 330, form one first dry film 235 and one the 3rd dry film 335.Then, by exposure and developing process, patterning the first dry film 235 and the 3rd dry film 335, and expose respectively the first inculating crystal layer 230 and the 3rd inculating crystal layer 330 partly.Then, on the first inculating crystal layer 230 exposing and the 3rd inculating crystal layer 330, carry out an electroplating technology, to form respectively spaced multiple the first conductive component 240 and multiple the 3rd conductive component 340 on the first insulating barrier 210 and the 3rd insulating barrier 310.The first conductive component 240 and the 3rd conductive component 340 respectively correspondence are inserted in the first opening 220 and the 3rd opening 320, to be electrically connected respectively the first conducting block 200 and the second conducting block 300.
Forming after the first conductive component 240 and the 3rd conductive component 340, remove the first dry film 235 and the 3rd dry film 335 of patterning, and expose part the first inculating crystal layer 230 and the 3rd inculating crystal layer 330 of below.Then,, by etch process, remove the first inculating crystal layer 230 and the 3rd inculating crystal layer 330 that expose, as shown in Figure 3.In the present embodiment, each first conductive component 240 comprises one first conductive welding disk 245 being positioned on the first insulating barrier 210, and each the 3rd conductive component 340 comprises one the 3rd conductive welding disk 345 being positioned on the 3rd insulating barrier 310.
Please refer to Fig. 4, carry out process for pressing, on the first insulating barrier 210 and the 3rd insulating barrier 310, form respectively one second insulating barrier 250 and one the 4th insulating barrier 350.In the present embodiment, the second insulating barrier 250 or the 4th insulating barrier 350 can be made up of ABF or PP material.In the present embodiment, coordinate electrically and actual demand, the material of the first insulating barrier 210 or thickness can be same as material or the thickness of the second insulating barrier 250, or the material of the 3rd insulating barrier 310 or thickness can be same as material or the thickness of the 4th insulating barrier 350.In other embodiments, the material of the first insulating barrier 210 or thickness also can not be same as material or the thickness of the second insulating barrier 250, or the material of the 3rd insulating barrier 310 or thickness also can not be same as material or the thickness of the 4th insulating barrier 350.
Then, can pass through a laser drilling process, on the second insulating barrier 250 and the 4th insulating barrier 350, form respectively multiple the second openings 260 and multiple the 4th opening 360, to expose respectively the first conductive component 240 and the 3rd conductive component 340.Carrying out, after laser drilling process, can going the step of de-smear, to remove the residue (not illustrating) in the second opening 260 and the 4th opening 360 after laser drill.In the present embodiment, the width of the second opening 260 is less than the width of the first opening 220 (being shown in Fig. 1), and the width of the 4th opening 360 is less than the width of the 3rd opening 320 (being shown in Fig. 1).
Please refer to Fig. 5, by depositing operation (for example, electroless plating), on the second insulating barrier 250 and the 4th insulating barrier 350, form respectively one second inculating crystal layer 270 and one the 4th inculating crystal layer 370, and extend to respectively in the second opening 260 (being shown in Fig. 4) and the 4th opening 360 (being shown in Fig. 4).Then, carry out image transfer, on the second inculating crystal layer 270 and the 4th inculating crystal layer 370, form one second dry film 275 and one the 4th dry film 375.Then, by exposure and developing process, patterning the second dry film 275 and the 4th dry film 375, and expose respectively the second inculating crystal layer 270 and the 4th inculating crystal layer 370 partly.Then, in the second inculating crystal layer 270 exposing and the enterprising electroplating technique of the 4th inculating crystal layer 370, to form respectively spaced multiple the second conductive component 280 and multiple the 4th conductive component 380 on the second insulating barrier 250 and the 4th insulating barrier 350, and correspondence is inserted in the second opening 260 and the 4th opening 360 respectively, to be electrically connected respectively the first conductive component 240 and the 3rd conductive component 340.
Forming after the second conductive component 280 and the 4th conductive component 380, remove the second dry film 275 and the 4th dry film 375 of patterning, and expose below part the second inculating crystal layer 270 and the 4th inculating crystal layer 370, and pass through etch process, the second inculating crystal layer 270 that removal exposes and the 4th inculating crystal layer 370, as shown in Figure 6.In the present embodiment, each second conductive component 280 comprises one second conductive welding disk 285 being positioned on the second insulating barrier 250, and each the 4th conductive component 380 comprises one the 4th conductive welding disk 385 being positioned on the 4th insulating barrier 350.In the present embodiment, the size of the second conductive welding disk 285 is less than the size of the first conductive welding disk 245, and the size of the 4th conductive welding disk 385 is less than the size of the 3rd conductive welding disk 345.
In the present embodiment, the quantity of the second opening 260 can be same as the quantity of the first opening 220, and each first conductive component 240 can be electrically connected correspondence and insert each second conductive component 280 of the second opening 260.In the present embodiment, the quantity of the 4th opening 360 can be same as the quantity of the 3rd opening 320, and each the 3rd conductive component 340 can be electrically connected correspondence and insert each the 4th conductive component 380 of the 4th opening 360.
In another embodiment, the quantity of the second opening 260 can be more than the quantity of the first opening 220, and each first conductive component 240 can be electrically connected multiple the second conductive components 280.The quantity of the 4th opening 360 can be more than the quantity of the 3rd opening 320, and each the 3rd conductive component 340 can be electrically connected multiple the 4th conductive components 380, as shown in Figure 7.But, should be noted the quantity of the second conductive component 280 that is electrically connected each the first conductive component 240, or be electrically connected the quantity of the 4th conductive component 380 of each the 3rd conductive component 340, can coordinate electrically and actual demand is adjusted to more than two or three.
Based on electrical consideration, conducting structure between substrate layer (for example, the first conductive component 240 and the second conductive component 280, or the 3rd conductive component 340 and the 4th conductive component 380) total sectional area and insulating barrier (for example, the first insulating barrier 210 and the second insulating barrier 250, or the 3rd insulating barrier 310 and the 4th insulating barrier 350) the fixing situation of thickness under, form the combined type conducting structure being electrically connected up and down by the embodiment of the present invention, can make the size of the second conductive component 280 of top and the via of the 4th conductive component 380 be less than respectively the size of the first conductive component 240 of below and the via of the 3rd conductive component 340, and then can dwindle the second conductive welding disk 285 on printed circuit board (PCB) and the size of the 4th conductive welding disk 385, and simultaneously on lifting process to capability, with in limited space, increase available wiring area on printed circuit board (PCB), transfer rate and transmission direction, and meet the demand of densification.Moreover, form combined type conducting structure owing to can forming respectively the conductive component being electrically connected up and down, the aspect ratio of upper and lower via is reduced, therefore, can reduce laser drill, the difficulty of the technique such as slag or plating of removing photoresist and occur the possibility of defect, and then promote the quality of printed circuit board (PCB).
Although the present invention discloses as above with preferred embodiment; so it is not in order to limit the present invention; any those of ordinary skills; without departing from the spirit and scope of the present invention; when doing to change and retouching, the scope that therefore protection scope of the present invention ought define depending on appended claim is as the criterion.
Claims (20)
1. a circuit board, comprising:
One substrate, has a relative first surface and a second surface;
Multiple the first conducting blocks, are spaced on this first surface of this substrate;
One first insulating barrier, is arranged on this first surface of this substrate, and has multiple the first openings, to expose described multiple the first conducting block;
Multiple the first conductive components, are spaced on this first insulating barrier, and correspondence inserts described multiple the first opening, to be electrically connected described multiple the first conducting block;
One second insulating barrier, is arranged on this first insulating barrier, and has multiple the second openings, to expose described multiple the first conductive component; And
Multiple the second conductive components, are spaced on this second insulating barrier, and insert described multiple the second opening, and wherein said multiple the second openings are less than described multiple the first opening.
2. circuit board as claimed in claim 1, each of wherein said multiple the first conductive components comprises one first conductive welding disk, be positioned on this first insulating barrier, and each of described multiple the second conductive components comprises one second conductive welding disk, be positioned on this second insulating barrier, and wherein this second conductive welding disk is less than this first conductive welding disk.
3. circuit board as claimed in claim 1, the quantity of wherein said multiple the second openings is same as the quantity of described multiple the first openings, makes described multiple the second conductive components of the corresponding electric connection of described multiple the first conductive components.
4. circuit board as claimed in claim 1, the quantity of wherein said multiple the second openings is more than the quantity of described multiple the first openings, each that makes described multiple the first conductive components be electrically connected described multiple the second conductive components wherein two or more.
5. circuit board as claimed in claim 1, more comprises:
Multiple the second conducting blocks, are spaced on this second surface of this substrate;
One the 3rd insulating barrier, is arranged on this second surface of this substrate, and has multiple the 3rd openings, to expose described multiple the second conducting block;
Multiple the 3rd conductive components, are spaced on the 3rd insulating barrier, and correspondence inserts described multiple the 3rd opening, to be electrically connected described multiple the second conducting block;
One the 4th insulating barrier, is arranged on the 3rd insulating barrier, and has multiple the 4th openings, to expose described multiple the 3rd conductive component; And
Multiple the 4th conductive components, are spaced on the 4th insulating barrier, and insert described multiple the 4th opening, and wherein said multiple the 4th openings are less than described multiple the 3rd opening.
6. circuit board as claimed in claim 5, each of wherein said multiple the 3rd conductive components comprises one the 3rd conductive welding disk, be positioned on the 3rd insulating barrier, and each of described multiple the 4th conductive components comprises one the 4th conductive welding disk, be positioned on the 4th insulating barrier, and wherein the 4th conductive welding disk is less than the 3rd conductive welding disk.
7. circuit board as claimed in claim 5, the quantity of wherein said multiple the 4th openings is same as the quantity of described multiple the 3rd openings, makes described multiple the 4th conductive components of the corresponding electric connection of described multiple the 3rd conductive components.
8. circuit board as claimed in claim 5, the quantity of wherein said multiple the 4th openings is more than the quantity of described multiple the 3rd openings, each that makes described multiple the 3rd conductive components be electrically connected described multiple the 4th conductive components wherein two or more.
9. the circuit board as described in claim 1 or 5, wherein the thickness of this first insulating barrier is same as the thickness of this second insulating barrier, or the thickness of the 3rd insulating barrier is same as the thickness of the 4th insulating barrier.
10. the circuit board as described in claim 1 or 5, wherein the thickness of this first insulating barrier is different from the thickness of this second insulating barrier, or the thickness of the 3rd insulating barrier is different from the thickness of the 4th insulating barrier.
The manufacture method of 11. 1 kinds of circuit boards, comprising:
On a first surface of a substrate, form spaced multiple the first conducting block;
On this first surface of this substrate, form one first insulating barrier, it has multiple the first openings, to expose described multiple the first conducting block;
On this first insulating barrier, form spaced multiple the first conductive component, and correspondence inserts described multiple the first opening, to be electrically connected described multiple the first conducting block;
On this first insulating barrier, form one second insulating barrier, it has multiple the second openings, to expose described multiple the first conductive component; And
On this second insulating barrier, form spaced multiple the second conductive component, and insert described multiple the second opening, wherein said multiple the second openings are less than described multiple the first opening.
The manufacture method of 12. circuit boards as claimed in claim 11, each of wherein said multiple the first conductive components comprises one first conductive welding disk, be arranged on this first insulating barrier, and each of described multiple the second conductive components comprises one second conductive welding disk, be arranged on this second insulating barrier, and wherein this second conductive welding disk is less than this first conductive welding disk.
The manufacture method of 13. circuit boards as claimed in claim 11, the quantity of wherein said multiple the second openings is same as the quantity of described multiple the first openings, makes described multiple the second conductive components of the corresponding electric connection of described multiple the first conductive components.
The manufacture method of 14. circuit boards as claimed in claim 11, the quantity of wherein said multiple the second openings is more than the quantity of described multiple the first openings, each that makes described multiple the first conductive components be electrically connected described multiple the second conductive components wherein two or more.
The manufacture method of 15. circuit boards as claimed in claim 11, more comprises:
On a second surface at this substrate with respect to this first surface, form spaced multiple the second conducting block;
On this second surface of this substrate, form one the 3rd insulating barrier, it has multiple the 3rd openings, to expose described multiple the second conducting block;
On the 3rd insulating barrier, form spaced multiple the 3rd conductive component, and correspondence inserts described multiple the 3rd opening, to be electrically connected described multiple the second conducting block;
On the 3rd insulating barrier, form one the 4th insulating barrier, it has multiple the 4th openings, to expose described multiple the 3rd conductive component; And
On the 4th insulating barrier, form spaced multiple the 4th conductive component, and insert described multiple the 4th opening, wherein said multiple the 4th openings are less than described multiple the 3rd opening.
The manufacture method of 16. circuit boards as claimed in claim 15, each of wherein said multiple the 3rd conductive components comprises one the 3rd conductive welding disk, be arranged on the 3rd insulating barrier, and each of described multiple the 4th conductive components comprises one the 4th conductive welding disk, be arranged on the 4th insulating barrier, and wherein the 4th conductive welding disk is less than the 3rd conductive welding disk.
The manufacture method of 17. circuit boards as claimed in claim 15, the quantity of wherein said multiple the 4th openings is same as the quantity of described multiple the 3rd openings, makes described multiple the 4th conductive components of the corresponding electric connection of described multiple the 3rd conductive components.
The manufacture method of 18. circuit boards as claimed in claim 15, the quantity of wherein said multiple the 4th openings is more than the quantity of described multiple the 3rd openings, each that makes described multiple the 3rd conductive components be electrically connected described multiple the 4th conductive components wherein two or more.
The manufacture method of 19. circuit boards as described in claim 11 or 15, wherein the thickness of this first insulating barrier is same as the thickness of this second insulating barrier, or the thickness of the 3rd insulating barrier is same as the thickness of the 4th insulating barrier.
The manufacture method of 20. circuit boards as described in claim 11 or 15, wherein the thickness of this first insulating barrier is different from the thickness of this second insulating barrier, or the thickness of the 3rd insulating barrier is different from the thickness of the 4th insulating barrier.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101150038 | 2012-12-26 | ||
| TW101150038A TWI519221B (en) | 2012-12-26 | 2012-12-26 | Printed circuit board and methods for forming the same |
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| Publication Number | Publication Date |
|---|---|
| CN103906354A true CN103906354A (en) | 2014-07-02 |
| CN103906354B CN103906354B (en) | 2017-04-12 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201310051726.3A Active CN103906354B (en) | 2012-12-26 | 2013-02-17 | Circuit board and method for manufacturing the same |
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| CN (1) | CN103906354B (en) |
| TW (1) | TWI519221B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108271319A (en) * | 2017-01-03 | 2018-07-10 | 台虹科技股份有限公司 | Method for manufacturing flexible circuit board |
| CN108811302A (en) * | 2017-04-27 | 2018-11-13 | 三星电机株式会社 | Printed circuit board |
| CN109788663A (en) * | 2017-11-10 | 2019-05-21 | 鹏鼎控股(深圳)股份有限公司 | The production method of circuit board and circuit board obtained by this method |
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| CN1507311A (en) * | 2002-12-12 | 2004-06-23 | ���ǵ�����ʽ���� | Combined printed circuit board with superposed through holes and producing method thereof |
| CN1777348A (en) * | 2004-11-15 | 2006-05-24 | 三星电机株式会社 | Method of fabricating high density printed circuit board |
| CN101069458A (en) * | 2005-07-07 | 2007-11-07 | 揖斐电株式会社 | Multilayer printed wiring board |
| TWI371998B (en) * | 2009-11-03 | 2012-09-01 | Nan Ya Printed Circuit Board | Printed circuit board structure and method for manufacturing the same |
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| EP0727926A2 (en) * | 1995-02-17 | 1996-08-21 | International Business Machines Corporation | Multilayer printed writing board and method of manufacturing such a board |
| CN1507311A (en) * | 2002-12-12 | 2004-06-23 | ���ǵ�����ʽ���� | Combined printed circuit board with superposed through holes and producing method thereof |
| CN1777348A (en) * | 2004-11-15 | 2006-05-24 | 三星电机株式会社 | Method of fabricating high density printed circuit board |
| CN101069458A (en) * | 2005-07-07 | 2007-11-07 | 揖斐电株式会社 | Multilayer printed wiring board |
| TWI371998B (en) * | 2009-11-03 | 2012-09-01 | Nan Ya Printed Circuit Board | Printed circuit board structure and method for manufacturing the same |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108271319A (en) * | 2017-01-03 | 2018-07-10 | 台虹科技股份有限公司 | Method for manufacturing flexible circuit board |
| CN108811302A (en) * | 2017-04-27 | 2018-11-13 | 三星电机株式会社 | Printed circuit board |
| CN109788663A (en) * | 2017-11-10 | 2019-05-21 | 鹏鼎控股(深圳)股份有限公司 | The production method of circuit board and circuit board obtained by this method |
| CN109788663B (en) * | 2017-11-10 | 2021-08-24 | 鹏鼎控股(深圳)股份有限公司 | Manufacturing method of circuit board and circuit board manufactured by same |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103906354B (en) | 2017-04-12 |
| TW201427504A (en) | 2014-07-01 |
| TWI519221B (en) | 2016-01-21 |
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