CN110621116A

CN110621116A - Manufacturing method of packaging substrate

Info

Publication number: CN110621116A
Application number: CN201910909371.4A
Authority: CN
Inventors: 叶新智; 王健; 杨洁; 孙彬; 沈洪; 李晓华
Original assignee: Jiangsu Shangda Electronics Co Ltd
Current assignee: Jiangsu Shangda Electronics Co Ltd
Priority date: 2019-09-25
Filing date: 2019-09-25
Publication date: 2019-12-27

Abstract

The invention relates to a manufacturing method of a packaging substrate, and belongs to the technical field of circuit boards. Forming an insulating resin layer reinforced metal layer on one surface of the metal layer by printing and other methods; coating a photoresist layer on the metal layer, then carrying out a series of processing such as exposure, development, etching, film stripping and the like, and removing the redundant metal layer to form a required circuit; then, a solder resist layer is formed on the circuit except the device region and the connection region. Compared with the prior manufacturing of the packaging substrate, the used base material is changed and replaced by the insulating resin, so that the thickness of the base material is reduced, the width of the metal layer is reduced, the metal frame of the product is reduced, and the requirement of lightening and thinning the circuit board is met; the insulating resin is directly arranged on the metal layer and then processed to form the circuit, the thin metal layer is used, the thin metal layer is more beneficial to forming the circuit, and the circuit with the smaller line width and line distance is processed, so that the circuit can be refined.

Description

Manufacturing method of packaging substrate

Technical Field

The invention relates to a manufacturing method of a packaging substrate, and belongs to the technical field of circuit boards.

Background

According to the technical scheme, the COF manufacturing method comprises the steps of enabling electronic equipment to be shorter, smaller, lighter and thinner, enabling a circuit board to be required to be lighter and thinner correspondingly, and enabling circuits to be required to be finer, in the COF manufacturing process, a substrate composed of a metal layer and an insulating film layer is generally adopted, processing such as coating photoresist on the metal layer of the substrate, exposing, developing and etching is conducted to form required circuits, then a solder resist layer is formed on the required positions of the circuits in a printing mode and the like, and the circuits are protected and enhanced.

Disclosure of Invention

In order to overcome the defects of the prior art, the invention provides the manufacturing method of the packaging substrate, which is characterized in that insulating resin is directly arranged on the metal layer and then processed to form a circuit, the thin metal layer is more favorable for forming the circuit, the circuit with smaller line width and line distance is processed, and the circuit is refined.

The invention is realized by the following technical scheme: a manufacturing method of a package substrate is characterized by comprising the following steps:

step A: preparing a base metal layer;

and B: arranging a layer of insulating resin on one surface of the metal layer;

and C: coating photoresist on the metal layer to generate a photoresist film;

step D: through the partial shielding of the exposure dry plate, the photoresist film is irradiated and exposed, and the photoresist property of the illumination part is changed;

step E: soaking the exposed product in the liquid medicine, developing the exposed photoresist film, removing the photoresist at the exposed part, and leaving the photoresist pattern at the part with the required pattern;

step F: processing the developed product, and etching to remove the metal layer at the part without the photoresist covering;

step G: soaking the product in the liquid medicine to make the residual photoresist film expand and peel off to obtain the required circuit pattern;

step H: arranging a solder resist layer on the metal layer;

step I: electronic devices such as ICs are mounted in the electronic device mounting area, and products on which the devices such as ICs are mounted are die-cut from a tape to obtain individual COF products.

The metal layer is conductive metal.

The conductive metal is copper.

And D, irradiating and exposing the photoresist film by using ultraviolet light.

And E, soaking the exposed product in a liquid medicine consisting of a sodium hydroxide solution, developing the exposed photoresist film, and removing the photoresist on the exposed part.

And F, etching and removing the metal layer at the part without the photoresist covering by using a copper chloride solution.

And G, soaking the product in a sodium hydroxide solution to strip the photoresist film to obtain the required circuit pattern.

And step H, arranging a solder resist layer on the metal layer in a printing mode.

The invention has the beneficial effects that: compared with the prior manufacture of the packaging substrate, the used base material is changed, the insulating film of the original base material is cancelled, and the insulating resin is used for replacing the base material, so that the thickness of the base material is reduced, and meanwhile, the width of the metal layer is reduced, so that the metal frame of the product is reduced, and the requirement of lightening and thinning the circuit board is met; because the insulating resin is directly arranged on the metal layer and then the metal layer is processed to form the circuit, a thin metal layer can be used, the thin metal layer is more beneficial to forming the circuit, the circuit with smaller line width and line distance can be processed, and the circuit can be refined.

Drawings

The invention is further illustrated below with reference to the figures and examples.

Fig. 1 is a flow chart of a method for manufacturing a package substrate according to the present invention.

In the figure: 1. metal layer, 2, insulating resin, 3, photoresist film, 4 and solder resist layer.

Detailed Description

The method for manufacturing a package substrate shown in fig. 1 is characterized by comprising the following steps:

step A: preparing a roll of substrate metal layer 1 with the thickness of 8 mu m and the width of 130 mm;

and B: arranging a layer of insulating resin 2 on one surface of the metal layer 1, wherein the thickness of the insulating resin 2 is 10 mu m, and the width of the insulating resin 2 is 158 mm;

and C: coating photoresist on the metal layer 1 to generate a photoresist film 3;

step D: through the partial shielding of the exposure dry plate, the photoresist film 3 is irradiated and exposed, and the photoresist property of the illumination part is changed;

step E: soaking the exposed product in the liquid medicine, developing the exposed photoresist film 3, removing the photoresist at the exposed part, and leaving the photoresist pattern at the part with the required pattern;

step F: processing the developed product, and etching to remove the metal layer 1 at the part without the photoresist covering;

step G: soaking the product in the liquid medicine to make the residual photoresist film 3 expand and peel off to obtain the required circuit pattern;

step H: a solder resist layer 4 is arranged on the metal layer 1;

step I: electronic devices such as ICs are mounted in the electronic device mounting area, and products on which the devices such as ICs are mounted are die-cut from a tape to obtain individual COF products, and the COF products are connected to other circuit boards for use in assembling electrical products.

The metal layer 1 is a conductive metal.

The conductive metal is copper.

And the step D is to irradiate and expose the photoresist film 3 by using ultraviolet light.

And E, soaking the exposed product in a liquid medicine consisting of a sodium hydroxide solution, developing the exposed photoresist film 3, and removing the photoresist on the exposed part.

And F, etching and removing the metal layer 1 at the part without the photoresist covering by using a copper chloride solution.

And G, soaking the product in a sodium hydroxide solution to strip the photoresist film 3 to obtain the required circuit pattern.

And step H, arranging a solder resist layer 4 on the metal layer 1 in a printing mode for reinforcing products and protecting circuits.

Compared with the prior manufacture of the packaging substrate, the used base material is changed, the insulating film of the original base material is cancelled, and the insulating resin is used for replacing the base material, so that the thickness of the base material is reduced, and meanwhile, the width of the metal layer is reduced, so that the metal frame of the product is reduced, and the requirement of lightening and thinning the circuit board is met; because the insulating resin is directly arranged on the metal layer and then the metal layer is processed to form the circuit, a thin metal layer can be used, the thin metal layer is more beneficial to forming the circuit, the circuit with smaller line width and line distance can be processed, and the circuit can be refined.

Claims

1. A manufacturing method of a package substrate is characterized by comprising the following steps:

step A: preparing a base metal layer (1);

and B: arranging a layer of insulating resin (2) on one surface of the metal layer (1);

and C: coating photoresist on the metal layer (1) to generate a photoresist film (3);

step D: through the partial shielding of the exposure dry plate, the photoresist film (3) is irradiated and exposed, and the photoresist property of the illumination part is changed;

step E: soaking the exposed product in the liquid medicine, developing the exposed photoresist film (3), removing the photoresist at the exposed part, and leaving the photoresist pattern at the required pattern part;

step F: processing the developed product, and etching to remove the metal layer (1) at the part without the photoresist covering;

step G: soaking the product in the liquid medicine to enable the residual photoresist film (3) to be expanded and stripped, so as to obtain the required circuit pattern;

step H: arranging a solder resist layer (4) on the metal layer (1);

2. The method of claim 1, wherein: the metal layer (1) is conductive metal.

3. The method of claim 2, wherein: the conductive metal is copper.

4. The method of claim 1, wherein: and the step D is to irradiate and expose the photoresist film (3) by using ultraviolet light.

5. The method of claim 1, wherein: and E, soaking the exposed product in a liquid medicine consisting of a sodium hydroxide solution, developing the exposed photoresist film (3), and removing the photoresist on the exposed part.

6. The method of claim 1, wherein: and F, etching and removing the metal layer (1) at the part without the photoresist covering by using a copper chloride solution.

7. The method of claim 1, wherein: and G, soaking the product in a sodium hydroxide solution to strip the photoresist film (3) to obtain the required circuit pattern.

8. The method of claim 1, wherein: and step H, arranging a solder mask layer (4) on the metal layer (1) in a printing mode.