CN102480846A - Method for preparing flexible substate and flexible substrate - Google Patents
Method for preparing flexible substate and flexible substrate Download PDFInfo
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- CN102480846A CN102480846A CN2011101213868A CN201110121386A CN102480846A CN 102480846 A CN102480846 A CN 102480846A CN 2011101213868 A CN2011101213868 A CN 2011101213868A CN 201110121386 A CN201110121386 A CN 201110121386A CN 102480846 A CN102480846 A CN 102480846A
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Abstract
The invention provides a method for preparing a flexible substrate and a flexible substrate. The method comprises the following steps of: forming a layer of metal foil on flexible resin; coating a layer of photoresist on the metal foil and carrying out photoetching on the photoresist according to a preset metal microarray structure; forming a graph obtained after photoetching on the metal foil; and removing the photoresist coated on the metal foil to obtain the flexible structure with the metal microarray structure. Another embodiment of the invention also provides the flexible substrate. Therefore, the aim that the substrate can be bent and folded in the metamaterial machining process is fulfilled.
Description
[technical field]
The present invention relates to ultra material technology field, relate in particular to a kind of preparation method and flexible base, board of flexible base, board.
[background technology]
Along with the fast development of new and high technologies such as radar detection, satellite communication, Aero-Space, and the rise of research field such as anti-electromagnetic interference, stealth technique, microwave dark room, the research of microwave absorbing material more and more receives people's attention.Because very marvellous galvanomagnetic effect can appear in ultra material, can be used for fields such as absorbing material and stealth material, becomes the focus of absorbing material area research.The character of ultra material and function mainly come from its inner structure, how to prepare the key that the three-dimensional fine structure with periodic arrangement becomes ultra material preparation technology.
In the prior art, the course of processing of ultra material mainly is that the PCB that has the metal micro array structure (Printed Circuit Board, printed circuit board) substrate is together laminated, fills other media between the flaggy.
But the inventor finds in to the research of prior art and practice process, and traditional P CB plate is rigid substrates basically, and substrate is not flexible or folding in the course of processing of ultra material.
[summary of the invention]
Technical problem to be solved by this invention provides a kind of preparation method and flexible base, board of flexible base, board, can avoid the flexible or not folding phenomenon of substrate in ultra material processing.
For solving the problems of the technologies described above, one embodiment of the invention provides a kind of preparation method of flexible base, board, and this method comprises:
On flexible resin, form the layer of metal paper tinsel;
On said metal forming, apply one deck photoresist, said photoresist is carried out photoetching according to preset metal micro array structure;
With the figure transfer that forms after the photoetching on the photoresist on said metal forming;
Removal is coated in the photoresist on the said metal forming, obtains having the flexible base, board of said metal micro array structure.
Another embodiment of the present invention also provides a kind of flexible base, board that adopts the technique scheme preparation.
Technique scheme compared with prior art has the following advantages: through on flexible resin, forming the layer of metal paper tinsel, on metal forming, form preset metal micro array structure then, thereby obtain to have the flexible base, board of metal micro array structure.Because substrate is flexible, therefore can be crooked or folding, avoided the flexible or not folding phenomenon of substrate in ultra material processing.
[description of drawings]
In order to be illustrated more clearly in the technical scheme in the embodiment of the invention; The accompanying drawing of required use is done to introduce simply in will describing embodiment below; Obviously, the accompanying drawing in describing below only is some embodiments of the present invention, for those of ordinary skills; Under the prerequisite of not paying creative work property, can also obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the preparation status of processes figure of the flexible base, board that provides of the embodiment of the invention;
Fig. 2 is preparation method's flow chart that the present invention implements a kind of flexible base, board that provides;
Fig. 3 is preparation method's flow chart that the present invention implements two a kind of flexible base, boards of providing;
Fig. 4 is preparation method's flow chart that the present invention implements three a kind of flexible base, boards of providing;
Fig. 5 is preparation method's flow chart that the present invention implements four a kind of flexible base, boards of providing.
[embodiment]
To combine the accompanying drawing in the embodiment of the invention below, the technical scheme in the embodiment of the invention is carried out clear, intactly description, obviously, described embodiment only is the present invention's part embodiment, rather than whole embodiment.Based on the embodiment among the present invention, those of ordinary skills are not making all other embodiment that obtained under the creative work prerequisite, all belong to the scope of the present invention's protection.
At first, for those skilled in the art are more readily understood technical scheme of the present invention, technical scheme of the present invention is carried out overall introduction below in conjunction with Fig. 1:
Fig. 1 is the preparation status of processes figure of flexible base, board, and wherein: 11 is the state diagram shown in after forming the layer of metal paper tinsel on the flexible resin; 12 is the state diagram shown in after applying one deck photoresist on the metal forming; 13 are the state diagram shown in after etching required metal micro array structure figure on the photoresist; 14 for the state diagram shown in the figure transfer that forms after the photoetching on the photoresist is on the metal forming; 15 for the state diagram shown in removing on the metal forming behind the photoresist, can find out that from 15 the flexible base, board preparation method who adopts the embodiment of the invention to provide can prepare the flexible base, board with required metal micro array structure.
Embodiment one,
Referring to Fig. 2, be preparation method's flow chart that the present invention implements a kind of flexible base, board that provides, comprise the steps:
S21: on flexible resin, form the layer of metal paper tinsel.
This metal forming can be Copper Foil, silver foil or aluminium foil; This flexible resin can be polyimides precursor (N-methyl nitrosourea), epoxy resin, polyester or polyethylene.
S22: on metal forming, apply one deck photoresist.
Wherein, photoresist can be selected positive photoresist or negative photoresist, in concrete implementation process, selects as the case may be.
S23: the metal micro array structure according to preset carries out photoetching to photoresist.
In concrete implementation process, the metal micro array structure designs according to concrete requirement.Photoetching belongs to the technology of well known to a person skilled in the art, repeats no more here.
S24: with the figure transfer that forms after the photoetching on the photoresist on metal forming.That is: on metal forming, mold preset metal micro array structure.
S25: remove and be coated in the photoresist on the metal forming, obtain having the flexible base, board of metal micro array structure.
In the present embodiment; With the flexible resin is substrate, and metal forming and substrate are formed together, and at first on metal forming, applies one deck photoresist; On photoresist, make required metal micro array structure by lithography; The figure transfer that forms after the photoetching on the photoresist on said metal forming, is removed then and is coated in the photoresist on the metal forming, thereby obtain having the flexible base, board of metal micro array structure.Because this substrate is flexible, therefore can be crooked or folding, avoided the flexible or not folding phenomenon of substrate in ultra material processing.
Embodiment two,
Referring to Fig. 3, be preparation method's flow chart that the present invention implements two a kind of flexible base, boards of providing, comprise the steps:
S31: vapor deposition layer of metal paper tinsel on flexible resin.
For example; Being vapor deposition one deck polyimides precursor on the Copper Foil of 22 μ m at thickness, is under 185 ℃ the situation polyimides precursor to be heat-treated in temperature, makes it that imidization take place; Cool off then, on Copper Foil, forming thickness is the polyimide film of 30 μ m.
In concrete implementation process, the thickness of Copper Foil can be between 18 μ m to 36 μ m; Heat treated temperature can be between 160 ℃ to 190 ℃; The thickness of polyimide film is greater than or equal to 30 μ m.
S32: on metal forming, apply one deck photoresist.
For example, on metal forming, apply one deck positive photoresist or negative photoresist.
S33: the metal micro array structure according to preset carries out photoetching to photoresist, on photoresist, forms to have the shape of metal micro array structure.
S34: adopt the method for wet etching, etching the figure that forms after the photoetching on the photoresist on the metal material.
Wherein, the method for wet etching belongs to the technology of well known to a person skilled in the art, repeats no more here.
S35: adopt alkali cleaning to remove to be coated in the photoresist on the metal forming, obtain having the flexible base, board of metal micro array structure.
In concrete implementation process, can adopt the acetone flush away to be coated in the photoresist on the metal forming.
In the present embodiment; Adopt the mode of vapor deposition on flexible resin, to form the layer of metal paper tinsel; On metal forming, apply one deck photoresist, on photoresist, make required metal micro array structure by lithography, adopting the method for wet etching to etch the figure that forms after the photoetching on the photoresist on the metal material; Remove then and be coated in the photoresist on the metal forming, thereby obtain having the flexible base, board of metal micro array structure.Because this substrate is flexible, therefore can be crooked or folding, avoided the flexible or not folding phenomenon of substrate in ultra material processing.
Embodiment three,
Referring to Fig. 4, be preparation method's flow chart that the present invention implements three a kind of flexible base, boards of providing, comprise the steps:
S41: on flexible resin with adhesive pressing layer of metal paper tinsel.
For example, on metal forming, applying one deck adhesive, then with polyimide film and metal forming consistency from top to bottom, is 55kg/cm at pressure
2, temperature is punching press 5 minutes under 145 ℃ the condition, makes metal forming and polyimide film form an integral body.
In concrete implementation process, the punching press condition can for: pressure is at 50kg/cm
2To 60kg/cm
2Between; Temperature is between 142 ℃ to 150 ℃; The punching press time is between 5 minutes to 15 minutes.
S42: on metal forming, apply one deck photoresist.
For example, on metal forming, apply one deck positive photoresist or negative photoresist.
S43: the metal micro array structure according to preset carries out photoetching to photoresist, on photoresist, forms to have the shape of metal micro array structure.
S44: adopt the method for dry etching, etching the figure that forms after the photoetching on the photoresist on the metal forming.
Wherein, the method for dry etching belongs to the technology of well known to a person skilled in the art, repeats no more here.
S45: adopt alkali cleaning to remove to be coated in the photoresist on the metal forming, obtain having the flexible base, board of metal micro array structure.
In concrete implementation process, can adopt the acetone flush away to be coated in the photoresist on the metal forming.
Present embodiment is with respect to embodiment two, and the mode that on metal forming, forms flexible resin is different, and present embodiment adopts the mode of adhesive pressing flexible resin; The mode that microstructure graph on the resist is transferred on the metal material is different; Present embodiment is employed in and adopts the method for dry etching that the microstructure graph on the resist is transferred to the mode on the metal material on the metal forming; In concrete implementation process, select the execution mode that is fit to as the case may be.
Embodiment four,
Referring to Fig. 5, be preparation method's flow chart that the present invention implements four a kind of flexible base, boards of providing, comprise the steps:
S51: vapor deposition layer of metal paper tinsel on flexible resin.
For example; Being vapor deposition one deck polyimides precursor on the Copper Foil of 22 μ m at thickness, is under 185 ℃ the situation polyimides precursor to be heat-treated in temperature, makes it that imidization take place; Cool off then, on Copper Foil, forming thickness is the polyimide film of 30 μ m.
In concrete implementation process, the thickness of Copper Foil can be between 18 μ m to 36 μ m; Heat treated temperature can be between 160 ℃ to 190 ℃; The thickness of polyimide film is greater than or equal to 30 μ m.
S52: on metal forming, apply one deck photoresist.
For example, on metal forming, apply one deck positive photoresist or negative photoresist.
S53: the metal micro array structure according to preset carries out photoetching to photoresist, on photoresist, forms to have the shape of metal micro array structure.
S54: adopt the method for dry etching, etching the figure that forms after the photoetching on the photoresist on the metal forming.
Wherein, the method for dry etching belongs to the technology of well known to a person skilled in the art, repeats no more here.
S55: adopt alkali cleaning to remove to be coated in the photoresist on the metal forming.
In concrete implementation process, can adopt the acetone flush away to be coated in the photoresist on the metal forming.
Present embodiment is with respect to implementing three, and the mode that on metal forming, forms flexible resin is different, and present embodiment is employed in the mode of vapor deposition vapor deposition flexible resin on the metal forming.In concrete implementation process, select the execution mode that is fit to as the case may be.
The foregoing description has been described the preparation method of flexible base, board, in concrete implementation process, can further include following process:
1) after preparing flexible base, board with metal micro array structure, continue each step of repetition, on flexible base, board, further form flexible base, board, thereby obtain multilayer flexible substrate.
2) after preparing flexible base, board with metal micro array structure, flexible base, board is curled, folds or injection moulding, form ultra material.
The present invention also provides a kind of flexible base, board that adopts any embodiment preparation in the foregoing description one to embodiment four, and concrete implementation process can repeat no more referring to embodiment one to embodiment four here.
The flexible base, board that the flexible base, board preparation method who adopts the embodiment of the invention to provide prepares; Flexible parent metal is compared with traditional base material; Thickness is thinner, quality is lighter, better around song property and anti-flammability, dimensional stability is better; In making and use, can satisfy higher technological temperature or serviceability temperature requirement, use more convenient.
More than the embodiment of the invention has been carried out detailed introduction, used concrete example among this paper principle of the present invention and execution mode set forth, the explanation of above embodiment just is used for helping to understand method of the present invention and core concept thereof; Simultaneously, for one of ordinary skill in the art, according to thought of the present invention, the part that on embodiment and range of application, all can change, in sum, this description should not be construed as limitation of the present invention.
Claims (11)
1. the preparation method of a flexible base, board is characterized in that, said method comprises:
On flexible resin, form the layer of metal paper tinsel;
On said metal forming, apply one deck photoresist, said photoresist is carried out photoetching according to preset metal micro array structure;
With the figure transfer that forms after the photoetching on the photoresist on said metal forming;
Removal is coated in the photoresist on the said metal forming, obtains having the flexible base, board of said metal micro array structure.
2. method according to claim 1 is characterized in that, the said layer of metal paper tinsel that on flexible resin, forms comprises:
Vapor deposition layer of metal paper tinsel on flexible resin.
3. method according to claim 1 is characterized in that, the said layer of metal paper tinsel that on flexible resin, forms comprises:
On flexible resin with adhesive pressing layer of metal paper tinsel.
4. method according to claim 1 is characterized in that, said with the figure transfer that forms after the photoetching on the photoresist on said metal forming, comprising:
Adopt the method for wet etching, on said metal material, etch the figure that forms after the photoetching on the photoresist.
5. method according to claim 1 is characterized in that, said with the figure transfer that forms after the photoetching on the photoresist on said metal forming, comprising:
Adopt the method for dry etching, on said metal material, etch the figure that forms after the photoetching on the photoresist.
6. method according to claim 1 is characterized in that, said removal is coated in the photoresist on the said metal forming, comprising:
Adopt alkali cleaning to remove to be coated in the photoresist on the said metal forming.
7. method according to claim 6 is characterized in that, said employing alkali cleaning goes to be coated in the photoresist on the said metal forming, comprising:
Adopt the acetone flush away to be coated in the photoresist on the said metal forming.
8. method according to claim 1 is characterized in that, said method also comprises:
On said flexible base, board, further form one deck flexible base, board.
9. method according to claim 1 is characterized in that, said method also comprises:
Said flexible base, board is curled, folds or injection moulding, form ultra material.
10. method according to claim 1 is characterized in that, said metal forming is: Copper Foil, aluminium foil or silver foil.
11. a flexible base, board is characterized in that, by the flexible base, board of any described method preparation of claim 1 to 10.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101213868A CN102480846A (en) | 2011-05-11 | 2011-05-11 | Method for preparing flexible substate and flexible substrate |
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| CN2011101213868A CN102480846A (en) | 2011-05-11 | 2011-05-11 | Method for preparing flexible substate and flexible substrate |
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| CN2011101213868A Pending CN102480846A (en) | 2011-05-11 | 2011-05-11 | Method for preparing flexible substate and flexible substrate |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102969573A (en) * | 2012-11-20 | 2013-03-13 | 深圳光启创新技术有限公司 | Preparation method of three-dimensional-structure metamaterial |
| CN102983407A (en) * | 2012-11-20 | 2013-03-20 | 深圳光启创新技术有限公司 | Three-dimensional structure metamaterial |
| CN104519666A (en) * | 2014-12-17 | 2015-04-15 | 上海蓝沛新材料科技股份有限公司 | Flexible die and production method for manufacturing flexible printed circuit boards |
| CN104821280A (en) * | 2015-03-10 | 2015-08-05 | 上海蓝沛新材料科技股份有限公司 | Method for manufacturing high density copper etched circuit board |
| CN105140393A (en) * | 2015-07-06 | 2015-12-09 | Tcl集团股份有限公司 | Composite membrane structured polymer flexible substrate and manufacturing method thereof |
| US9653815B2 (en) | 2012-11-20 | 2017-05-16 | Kuang-Chi Innovative Technology Ltd. | Metamaterial, metamaterial preparation method and metamaterial design method |
| CN110167255A (en) * | 2013-03-15 | 2019-08-23 | 伟创力有限责任公司 | Method and apparatus for creating complete microwave absorption printed circuit board |
| CN110621116A (en) * | 2019-09-25 | 2019-12-27 | 江苏上达电子有限公司 | Manufacturing method of packaging substrate |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102969573A (en) * | 2012-11-20 | 2013-03-13 | 深圳光启创新技术有限公司 | Preparation method of three-dimensional-structure metamaterial |
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| US9653815B2 (en) | 2012-11-20 | 2017-05-16 | Kuang-Chi Innovative Technology Ltd. | Metamaterial, metamaterial preparation method and metamaterial design method |
| CN110167255A (en) * | 2013-03-15 | 2019-08-23 | 伟创力有限责任公司 | Method and apparatus for creating complete microwave absorption printed circuit board |
| CN104519666A (en) * | 2014-12-17 | 2015-04-15 | 上海蓝沛新材料科技股份有限公司 | Flexible die and production method for manufacturing flexible printed circuit boards |
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| CN104821280A (en) * | 2015-03-10 | 2015-08-05 | 上海蓝沛新材料科技股份有限公司 | Method for manufacturing high density copper etched circuit board |
| CN105140393A (en) * | 2015-07-06 | 2015-12-09 | Tcl集团股份有限公司 | Composite membrane structured polymer flexible substrate and manufacturing method thereof |
| CN110621116A (en) * | 2019-09-25 | 2019-12-27 | 江苏上达电子有限公司 | Manufacturing method of packaging substrate |
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Application publication date: 20120530 |