CN101094564A - Method for preparing multilayer soft print circuit board with no conduction through hole - Google Patents
Method for preparing multilayer soft print circuit board with no conduction through hole Download PDFInfo
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- CN101094564A CN101094564A CN 200610093159 CN200610093159A CN101094564A CN 101094564 A CN101094564 A CN 101094564A CN 200610093159 CN200610093159 CN 200610093159 CN 200610093159 A CN200610093159 A CN 200610093159A CN 101094564 A CN101094564 A CN 101094564A
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- flexible printed
- printed wiring
- wiring board
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Abstract
The method comprises: providing a flexible printed wiring board pre-equipped with the circuit; folding the flexible printed wiring board in order to make the cubic stack to show a shape with even numbers of layers.
Description
Technical field
The present invention relates to a kind of method for preparing multilayer board, relate in particular to a kind of method for preparing the multi-layer soft printing circuit board of no guide hole.
Background technology
Known no matter be legal or with the prepared multi-layer soft printing circuit board of Layer increasing method (Build-upProcess) with compound preimpregnation material (Pre-preg) hot pressing, all come the circuit of conducting adjacent layer circuit board via a via (plated through-hole), carry out so that the arrangement of circuit is able to tridimensional mode, can significantly reduce the required area that takies of printed circuit board (PCB) by this.But the preparation method of these known multi-layer soft printing circuit boards not only processing procedure is complicated, and can derive the problem on some processing procedures simultaneously.For example, the size breathing of flexible printed circuit board base board in the hot pressing processing procedure is difficult for accurately being controlled, and causes the circuit contraposition between flexible printed wiring board layer and the layer to have the situation of deviation to take place often.On the other hand, for the plate face that makes substrate can more effectively be utilized, via has the more and more littler trend that is required, but this can make the degree of difficulty of via when electroplating heighten.In addition, along with the increase of unit are winding displacement density on the substrate, the also feasible whole rapid increase of degree of difficulty.
In addition, this kind has the multilayer seal circuit board substrate of the via of perforation, also exists many problems in the use.For example, the size and the shape of this kind substrate are fixed, and can't adjust along with the shape of electronic product, and this can make the inner space of this electronic product effectively to be utilized.Do not overcome this problem, U.S. Pat 6,005, disclose a kind of multilayer board and method for making thereof in No. 766, use and overcome aforementioned problem, this method is by preparing a multi-layer sheet that meets the electronic product thickness demand of required preparation in advance, again this multi-layer sheet being removed unnecessary sheet material with cutting way, to prepare the shape that meets this required by electronic product.Though this method can solve the aforementioned problem of part, there is the too numerous and diverse and cost of manufacture of processing procedure to cross problems such as height.
Moreover in the application of high-frequency electronic product, the via of known printed circuit board (PCB) is a main cause that causes the decline of electronic product signal.When frequency was higher than 1GHz, the phenomenon of this signal decline promptly can become fairly obvious, and the problem of the high more signal decline of frequency is serious more.This phenomenon is commonly referred to as via resonance effects (Via resonance).For overcoming this problem, U.S. Pat 7,013 discloses in No. 452 and a kind ofly overcomes this problem by increasing the method for the identical compensated line of two circuit lengths on line design, using.Though the method that this patent disclosed has solved the problem of part, this method can make the complexity of line design significantly increase.For this reason, U.S. Pat 6,593 proposes in No. 535 a kind ofly to insert the method that links the circuit between different layers in the no copper-plated hole with multilayer wedge shape conductive material, overcomes this effect that resonates by this.U.S. Pat 6,661 proposes in No. 316 a kind ofly according to the practical operation frequency, increases the method for suitable inductance and electric capacity in the line, uses and regulates its frequency response.The method that is disclosed in above-mentioned these patents though can solve the aforementioned problem of part, as will utilize those methods to carry out volume production the time, then all has problems such as the too high and processing procedure of processing procedure cost is too complicated, and makes it that its difficulty be arranged in practical application.
Summary of the invention
Be to solve the problem of aforementioned known techniques, the present invention's purpose promptly is to provide a kind of method for preparing the multi-layer soft printing circuit board of no conduction through hole, use overcome known more than layer printed circuit board because of the problem that is caused that is provided with of via.
For reaching the present invention's purpose, pointed a kind of method for preparing the multi-layer soft printing circuit board of no conduction through hole according to the present invention, its step comprises:
(1) provide a flexible printed wiring board that has set in advance circuit, and this circuit is provided with in the single sided board mode; And
(2) with folding this flexible printed wiring board of the folding mode of folding fan or circulating type, make its stereo-stacking be plural stratiform,
Wherein, this circuit is electrically connected to a weld pad (pad), and this weld pad is arranged on the surface that this flexible printed wiring board exposes after folding, uses for this flexible printed wiring board to be connected an external module.
The pointed method according to the present invention can make multilayer board under nothing is provided with the situation of via.Because therefore setting that need not via in the layer printed circuit board more than the inventive method is obtained will not have the problem that known via causes.
In addition, the inventive method only needs a slice flexible printed wiring board can finish the preparation of multi-layer soft printing circuit board when implementing, by this can be by the printed circuit board (PCB) three-dimensional is significantly dwindled its required area that takies.
The present invention will be by being described further with reference to following execution mode, said execution mode do not limit front of the present invention disclose within appearance.Those skilled in the art can do a little improvement and modification, but still do not break away from the present invention's category.
Description of drawings
Fig. 1 is the schematic perspective view of the flexible printed wiring board that uses in the inventive method;
Fig. 2 is the schematic perspective view of the enforcement sample attitude that flexible printed wiring board folds among Fig. 1 embodiment;
Fig. 3 is the schematic perspective view of multi-layer soft printing circuit board obtained among Fig. 1 embodiment;
Fig. 4 is the schematic perspective view of the embodiment of another folding mode of the inventive method; And
Fig. 5 is the schematic perspective view for multi-layer soft printing circuit board obtained among Fig. 4 embodiment.
Embodiment
The manufacture method of the multilayer board of the no conduction through hole of the present invention's proposition, be by with a flexible printed wiring board in folding mode, its stereo-stacking is plural stratiform after, use to reach and receive the purpose of a large amount of circuits in little space content.
For making the pointed method of the present invention be easier to be understood by the skill person in the technology of the present invention field, at this by appended graphic being described further of specification.See also Fig. 1, be one of the manufacture method of the multilayer board of no conduction through hole of the present invention embodiment.At first, the flexible printed wiring board 10 that provides a slice to set in advance required circuit 12, and this circuit 12 is provided with in the single sided board mode.Circuit 12 on the flexible printed wiring board 10 can be provided with according to required circuit arrangement by known technology, wherein this circuit arrangement is to be provided with in zone 16 scopes one by one on this flexible printed wiring board 10, each zone 16 is formed each layer in flexible printed wiring board 10 folding backs, and the circuitous pattern on each zone 16 is the required circuitous pattern of folding each layer of back.In addition, this circuit is electrically connected to a weld pad (pad) 14, and weld pad 14 is arranged on the surface that flexible printed wiring board 10 exposes after folding, uses for flexible printed wiring board 10 to be connected an external module.
Aforementioned flexible printed wiring board 10 is before folding; need elder generation to finish the protection and insulation back (but weld pad is exposed) of circuit 12 with protection glued membrane (coverlay) or anti-solder ink (solder mask); with this flexible printed wiring board 10 with the folding back of the mode of similar folding fan (as shown in Figure 2); make its stereo-stacking be plural stratiform, as sandwich structure (as shown in Figure 3).
The plural layer printed circuit board (PCB) 10 of aforementioned storehouse can connect it by any known method to each other, uses and fixes its shape.For example, staple, fourth of the twelve Earthly Branches nail, bonding, applying or known laminating technique (lamination techniques).
Consult Fig. 4, be an embodiment again of the inventive method.In this embodiment, flexible printed wiring board 10 folds by the folding mode of circulating type, makes its stereo-stacking be plural stratiform, as volume heart cake structure (as shown in Figure 4), afterwards again with its pressing and fixing (as shown in Figure 5).
The substrate that can be applicable among the present invention is a single-sided film formula flexible printed wiring board.Kind as for flexible printed wiring board, not special restriction in the present invention, for example with polyimide (polyimide, PI) flexible printed wiring board that film and Copper Foil formed (two-layer FCCL), add solid and the three-layer type flexible printed wiring board (three-layer FCCL) that Copper Foil was formed with the polyimide film, or other flexible printed wiring board.
In addition, can be applicable among the present invention as the conductive layer that is made for circuit on the printed circuit board (PCB), aluminium foil that can pass through aluminium foil (Copper Foil), electrolytic copper foil (Electric Deposited Copper Foil), rolled copper foil (RollAnnealed Copper Foil), electrolytic copper foil after heat treatment or tool conductivity etc. is prepared, but is not limited in this.But but, be preferable with rolled copper foil or aluminium foil if when considering the flexility of printed circuit board (PCB).The aforementioned thickness that is made for the conductive layer of circuit can be prepared according to need, not special restriction in the present invention.
Claims (6)
1. method for preparing the multi-layer soft printing circuit board of no conduction through hole comprises step:
(1) provide a flexible printed wiring board that has set in advance circuit, and this circuit is provided with in the single sided board mode; And
(2) with folding this flexible printed wiring board of the folding mode of folding fan or circulating type, make its stereo-stacking be plural stratiform,
Wherein, this circuit is electrically connected to a weld pad, and this weld pad is arranged on the surface that this flexible printed wiring board exposes after folding, uses for this flexible printed wiring board to be connected an external module.
2. the method for the multi-layer soft printing circuit board of preparation no conduction through hole as claimed in claim 1, wherein this flexible printed wiring board is provided with on the surface of this circuit and is coated with an insulating barrier, but makes this weld pad exposed.
3. the method for the multi-layer soft printing circuit board of preparation no conduction through hole as claimed in claim 2, wherein this insulating barrier is protection glued membrane (coverlay) or anti-solder ink (solder mask).
4. the method for the multi-layer soft printing circuit board of preparation no conduction through hole as claimed in claim 1 wherein further comprises the step of this flexible printed wiring board behind folding storehouse being fixed its storehouse shape after this step (2).
5. the method for the multi-layer soft printing circuit board of preparation no conduction through hole as claimed in claim 1, wherein this flexible printed wiring board is a single-sided film formula flexible printed wiring board.
6. the method for the multi-layer soft printing circuit board of preparation no conduction through hole as claimed in claim 1, the conductive layer that wherein is made for this circuit on this printed circuit board (PCB) are selected from by electrolytic copper foil (Electric DepositedCopper Foil), rolled copper foil (Roll Annealed Copper Foil), after heat treatment electrolytic copper foil and the group that forms of the aluminium foil of tool conductivity prepared.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610093159 CN101094564A (en) | 2006-06-23 | 2006-06-23 | Method for preparing multilayer soft print circuit board with no conduction through hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610093159 CN101094564A (en) | 2006-06-23 | 2006-06-23 | Method for preparing multilayer soft print circuit board with no conduction through hole |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101094564A true CN101094564A (en) | 2007-12-26 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200610093159 Pending CN101094564A (en) | 2006-06-23 | 2006-06-23 | Method for preparing multilayer soft print circuit board with no conduction through hole |
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| CN (1) | CN101094564A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101662897B (en) * | 2009-09-04 | 2011-01-05 | 东莞美维电路有限公司 | Manufacturing method for multilayer stacking printed wiring board |
| CN102256453A (en) * | 2010-05-21 | 2011-11-23 | 富葵精密组件(深圳)有限公司 | Multilayer circuit board manufacturing method |
| CN102480846A (en) * | 2011-05-11 | 2012-05-30 | 深圳光启高等理工研究院 | Method for preparing flexible substate and flexible substrate |
| CN103311161A (en) * | 2013-06-17 | 2013-09-18 | 华进半导体封装先导技术研发中心有限公司 | Modified flexible substrate packaging device |
| CN103311189A (en) * | 2013-06-17 | 2013-09-18 | 华进半导体封装先导技术研发中心有限公司 | Multilayer packaging device for flexible substrate |
| CN106304617A (en) * | 2016-08-24 | 2017-01-04 | 宇龙计算机通信科技(深圳)有限公司 | Multi-layer flexible printed circuit board and terminal |
| EP2323245A4 (en) * | 2008-09-09 | 2017-03-22 | Toyota Jidosha Kabushiki Kaisha | Voltage conversion device and electrical load drive device |
-
2006
- 2006-06-23 CN CN 200610093159 patent/CN101094564A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2323245A4 (en) * | 2008-09-09 | 2017-03-22 | Toyota Jidosha Kabushiki Kaisha | Voltage conversion device and electrical load drive device |
| CN101662897B (en) * | 2009-09-04 | 2011-01-05 | 东莞美维电路有限公司 | Manufacturing method for multilayer stacking printed wiring board |
| CN102256453A (en) * | 2010-05-21 | 2011-11-23 | 富葵精密组件(深圳)有限公司 | Multilayer circuit board manufacturing method |
| CN102256453B (en) * | 2010-05-21 | 2013-12-25 | 富葵精密组件(深圳)有限公司 | Multilayer circuit board manufacturing method |
| CN102480846A (en) * | 2011-05-11 | 2012-05-30 | 深圳光启高等理工研究院 | Method for preparing flexible substate and flexible substrate |
| CN103311161A (en) * | 2013-06-17 | 2013-09-18 | 华进半导体封装先导技术研发中心有限公司 | Modified flexible substrate packaging device |
| CN103311189A (en) * | 2013-06-17 | 2013-09-18 | 华进半导体封装先导技术研发中心有限公司 | Multilayer packaging device for flexible substrate |
| CN103311189B (en) * | 2013-06-17 | 2017-02-08 | 华进半导体封装先导技术研发中心有限公司 | Multilayer packaging device for flexible substrate |
| CN106304617A (en) * | 2016-08-24 | 2017-01-04 | 宇龙计算机通信科技(深圳)有限公司 | Multi-layer flexible printed circuit board and terminal |
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