CN101087495A - Making method of multi-layer printed circuit board without leading hole - Google Patents
Making method of multi-layer printed circuit board without leading hole Download PDFInfo
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- CN101087495A CN101087495A CN 200610088588 CN200610088588A CN101087495A CN 101087495 A CN101087495 A CN 101087495A CN 200610088588 CN200610088588 CN 200610088588 CN 200610088588 A CN200610088588 A CN 200610088588A CN 101087495 A CN101087495 A CN 101087495A
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Abstract
A producing method of multilayer printed circuit board without conducting hole, the steps include providing the printed circuit board with presenting circuit, and the circuit which will conducts with circuit in other layer are connected with pad electrically, and the pad is extended to the edge of printed circuit board, and stacks the complex printed circuit board, the pads corresponding with different layers are connected electrically. So the multilayer printed circuit board can be made, and avoid the problems caused by familiar conducting hole.
Description
Technical field
The invention relates to a kind of manufacture method of multilayer board, especially about a kind of manufacture method of not having the multi-layer soft printing circuit board of guide hole.
Background technology
Known no matter be legal or with the prepared multi-layer soft printing circuit board of Layer increasing method (Build-upProcess) with compound preimpregnation material (Pre-preg) hot pressing, it all is the circuit that comes conducting adjacent layer circuit board via a via (plated through-hole), carry out so that the arrangement of circuit is able to tridimensional mode, can significantly reduce the required area that takies of printed circuit board (PCB) by this.But the preparation method of these known multi-layer soft printing circuit boards not only processing procedure is complicated, and can derive the problem on some processing procedures simultaneously.For example, the size breathing of flexible printed circuit board base board in the hot pressing processing procedure is difficult for accurately being controlled, and causes the circuit contraposition situation devious often between flexible printed wiring board layer and the layer to take place.On the other hand, for the plate face that makes substrate can more effectively be utilized, via has the more and more littler trend that is required, but this can make the degree of difficulty of via when electroplating heighten.In addition, along with the increase of unit are winding displacement density on the substrate, also make that whole degree of difficulty sharply increases.
In addition, this kind has the multilayer seal circuit board substrate of the via of perforation, also exists many problems in the use.For example, the size and the shape of this kind substrate are fixed, and can't adjust along with the shape of electronic product, and this can make the inner space of this electronic product effectively to be utilized.For overcoming this problem, U.S. Pat 6,005, disclose a kind of multilayer board and method for making thereof in No. 766, use and overcome aforesaid problem, this method system removes unnecessary sheet material with this multi-layer sheet with cutting way, to prepare the shape that meets this required by electronic product again by preparing a multi-layer sheet that meets the electronic product thickness demand of required preparation in advance.Though the method can solve the aforesaid problem of part, there is the too numerous and diverse and cost of manufacture of processing procedure to cross problems such as height.
Moreover in the application of high-frequency electronic product, the via of known printed circuit board (PCB) is a main cause that causes the decline of electronic product signal.When frequency was higher than 1GHz, the phenomenon of this signal decline promptly can become fairly obvious, and the problem of the high more signal decline of frequency is serious more.This phenomenon is commonly referred to as via resonance effects (Via resonance).For overcoming this problem, U.S. Pat 7,013 discloses in No. 452 a kind ofly by the method that increases the identical compensated line of two circuit lengths on line design, uses and overcomes this problem.Though the method that this patent disclosed has solved the problem of part, this method can make the complexity of line design significantly increase.For this reason, U.S. Pat 6,593 proposes in No. 535 a kind ofly to insert the method that links the circuit between different layers in the no copper-plated hole with multilayer wedge shape conductive material, overcomes this resonance effects by this.U.S. Pat 6,661 proposes in No. 316 a kind ofly according to the practical operation frequency, increases the method for suitable inductance and electric capacity in the line, uses and regulates its frequency response.The method that is disclosed in above-mentioned these patents though can solve the aforesaid problem of part, as will utilize those methods to carry out volume production the time, then all has problems such as the too high and processing procedure of processing procedure cost is too complicated, and makes it that its difficulty be arranged in practical application.
Summary of the invention
For solving the problem of aforementioned known techniques, purpose of the present invention promptly is to provide a kind of manufacture method of multilayer board of no conduction through hole, uses to overcome known multilayer board because of problem that its via caused.
For reaching purpose of the present invention, the manufacture method of the multilayer board of pointed a kind of no conduction through hole according to the present invention, its step comprises:
(1) printed circuit board (PCB) that provides plural layer to set in advance circuit wherein desire to be electrically connected to a weld pad (pad) with this circuit system of other layer circuit turn-on, and this weld pad system extends to the edge of this printed circuit board (PCB);
(2) these a plurality of printed circuit board (PCB)s of storehouse; And
(3) electrically connect corresponding this weld pad between the different layers printed circuit board (PCB).
The pointed method according to the present invention can be finished the electric connection between layer printed circuit board and the layer under nothing is provided with the situation of via, use making multilayer board.Because therefore setting that need not via in the prepared multilayer board of the inventive method will not have the problem that known via causes.
The present invention will be by being described further with reference to following execution mode, and execution mode described herein does not limit the content that disclose front of the present invention.Have the knack of skill person of the present invention, can do a little improvement and modification, but still do not break away from category of the present invention.
Description of drawings
Fig. 1 is an embodiment of the multi-layer soft printing circuit board of manufacturing no conduction through hole of the present invention;
Fig. 2 is the schematic perspective view of multi-layer soft printing circuit board made among Fig. 1 embodiment;
Fig. 3 is another enforcement sample attitude of embodiment among first figure;
Fig. 4 is the another embodiment of the multi-layer soft printing circuit board of manufacturing no conduction through hole of the present invention;
Fig. 5 is the cross-sectional schematic of the embodiment that electrically connects between printed circuit board (PCB); And
Fig. 6 is the cross-sectional schematic of another embodiment of electrically connecting between printed circuit board (PCB).
Wherein
10 printed circuit board (PCB)s
12 circuit
14 weld pads
16 electrically connect
18 registration holes
20 empty bridges
22 scolding tin
Embodiment
The manufacture method of the multilayer board of no conduction through hole of the present invention, it is by with behind the plural layer printed circuit board (PCB) storehouse, the weld pad that defaults in this printed circuit board edge is in advance electrically connected on the side of the multilayer board of this storehouse, can reach the purpose of circuit turn-on between the different layers printed circuit board (PCB) by this.
For making the easier understanding of the pointed method of the present invention, describe by Figure of description at this.See also Fig. 1, be an embodiment of the manufacture method of the multilayer board of no conduction through hole of the present invention.The printed circuit board (PCB) 10 that at first provides plural layer to be provided with required circuit 12.Circuit 12 on the printed circuit board (PCB) 10 can be provided with according to required circuit arrangement by known techniques, there is no any special restriction among the present invention.The circuit of circuit 12 conductings on desire and other layer printed circuit board 10 is electrically connected to a weld pad 14, and make its edge that extends to printed circuit board (PCB) 10 (as shown in Figure 1), or further extend to the side of printed circuit board (PCB) 10, to form the structure of similar known golden finger.The weld pad 14 that extends to printed circuit board (PCB) 10 edges can optionally be provided with on four limits of printed circuit board (PCB) 10 according to need.After finishing the protection and insulation of circuit 12, this plural layer printed circuit board (PCB) 10 is stacked into a sandwich structure (as shown in Figure 2) according to desired sequence with protection glued membrane (coverlay) or anti-solder ink (solder mask).Aforementioned protection glued membrane or anti-solder ink system covers the surface that whole printed circuit board (PCB) 10 is provided with circuit 12, except the weld pad 14 residing positions.
Then, electrically connect 16 by the weld pad 14 that will extend on each layer printed circuit board 10 edge (or sidewall), can make by this desire conducting each layer circuit 12 be able to conducting.The plural layer printed circuit board (PCB) 10 of aforementioned storehouse can connect it by any known method to each other, uses and fixes its shape.For example, staple, fourth of the twelve Earthly Branches nail, bonding, applying or known laminating technique (lamination techniques).Also without particular limitation among the method for aforementioned electric connection and the present invention, for example can electrically connect by the mode of scolding tin or plated metal.
For making 14 of weld pads that extend on each layer printed circuit board 10 edge (or sidewall) be convenient to carry out contraposition and connection, can reach by the width of widening weld pad 14, even also the width of weld pad 14 is greater than the width of circuit 12.
For making printed circuit board (PCB) 10 when the storehouse, being convenient to carry out each interlayer similarly is the contraposition demand that scolding tin or plating etc. electrically connect, and is preferably on the printed circuit board (PCB) 10 and is provided with a plurality of corresponding registration holes 18, as shown in Figure 3.When storehouse printed circuit board (PCB) 10, only need to carry out contraposition easily by this by the lead that alignment registration holes 18 can make each interlayer desire to electrically connect.Aforementioned printed circuit board (PCB) 10 behind storehouse can also can utilize fourth of the twelve Earthly Branches nail or its analog by the shape of passing after registration holes 18 fixes its storehouse, to reach fixing purpose by the mode of hot-press gluing each layer of fitting.
Consult Fig. 4, be an embodiment again of the multi-layer circuit board fabrication process of no conduction through hole of the present invention.In this embodiment, it is stepped that the edge system of plural layer printed circuit board (PCB) 10 is stacked into pyramid, can make the printed circuit board (PCB) 10 that is positioned at lower floor be exposed bigger weld pad 14 areas by this, the contraposition that can be convenient to 14 of each layer weld pads like this connects, and also can make the difficult phenomenon that opens circuit of electric connection of 14 of each layer weld pads.Be preferably the area that is slightly less than the lower circuit plate in this kind method board area at the middle and upper levels.The substrate of known printed circuit board (PCB) 10 is to be a dielectric layer (dielectric layer), and therefore when printed circuit board (PCB) during with preceding method storehouse of the present invention, the circuit 12 on each layer printed circuit board 10 promptly can be isolated by this dielectric layer.When desiring the circuit 12 of each layer printed circuit board 10 to be electrically connected with the inventive method, can set up bridge 20 in 14 of the weld pads that different layers extends to printed circuit board (PCB) 10 edges by welding manner, use electrically connecting, see also Fig. 5.Electrically connect the difficult phenomenon that opens circuit for making, also can on the side of different layers printed circuit board (PCB) 10, be solded into scolding tin 22,, see also Fig. 6 with the circuit between the conducting different layers 12 by welding manner.Outside this kind mode can guarantee that not only the difficult generation of the electric connection mat between the different layers printed circuit board (PCB) is opened circuit, also can further strengthen the shape of plural layer printed circuit board (PCB) storehouse.
The printed circuit board (PCB) that can be applicable among the present invention is preferably the diaphragm type printed circuit board (PCB), that is general known flexible printed wiring board, but the diaphragm type printed circuit board (PCB) of hard also can be applicable to this.Can be applied to the kind of the flexible printed wiring board among the present invention, not special restriction among the present invention, for example with polyimide (polyimide, PI) the formed two-layer equation flexible printed wiring board of film and Copper Foil (two-layer FCCL), add solid and the formed three-layer type flexible printed wiring board of Copper Foil (three-layer FCCL) with the polyimide film, or other flexible printed wiring board.In addition, can be applicable among the present invention as the copper foil layer that is made for circuit on the printed circuit board (PCB), it can be prepared by electrolytic copper foil (ElectricDeposited Copper Foil), rolled copper foil (Roll Annealed Copper Foil) or the Copper Foil after electrolysis heat treatment etc., but be not limited in this.But but, be preferable with rolled copper foil if when considering the flexility of printed circuit board (PCB).The aforementioned thickness that is made for the copper foil layer of circuit can be prepared according to need, not special restriction in the present invention.
Claims (10)
1. the manufacture method of the multi-layer soft printing circuit board of a no conduction through hole, step comprises:
(1) provide plural layer to set in advance the printed circuit board (PCB) of circuit;
(2) these a plurality of printed circuit board (PCB)s of storehouse; And
(3) electrically connect corresponding this weld pad between different layers
It is characterized in that: be arranged at this circuit system of desiring on this printed circuit board (PCB) with other layer circuit turn-on and be electrically connected to a weld pad, and this weld pad system extends to the edge of this printed circuit board (PCB).
2. the manufacture method of multi-layer soft printing circuit board as claimed in claim 1, it is characterized in that: this weld pad further extends to the sidewall of this printed circuit board (PCB).
3. the manufacture method of multi-layer soft printing circuit board as claimed in claim 1 is characterized in that: this printed circuit board (PCB) is provided with on the surface of circuit and is coated with an insulating barrier in this step (1).
4. the manufacture method of multi-layer soft printing circuit board as claimed in claim 3 is characterized in that: this insulating barrier is protection glued membrane or anti-solder ink.
5. the manufacture method of multi-layer soft printing circuit board as claimed in claim 1 is characterized in that: further comprise the step of this plural layer printed circuit board (PCB) of storehouse being fixed its storehouse shape after this step (2).
6. the manufacture method of multi-layer soft printing circuit board as claimed in claim 1 is characterized in that: be to electrically connect by scolding tin or plated metal between this weld pad.
7. the manufacture method of multi-layer soft printing circuit board as claimed in claim 1, it is characterized in that: the width of this weld pad is greater than the width of this circuit.
8. the manufacture method of multi-layer soft printing circuit board as claimed in claim 1 is characterized in that: be arranged with a plurality of corresponding registration holes on this plural layer printed circuit board (PCB).
9. the manufacture method of multi-layer soft printing circuit board as claimed in claim 1 is characterized in that: it is stepped that the edge system of this plural layer printed circuit board (PCB) is stacked into pyramid.
10. the manufacture method of multi-layer soft printing circuit board as claimed in claim 1, it is characterized in that: the Copper Foil series of strata that are made for circuit on this printed circuit board (PCB) are prepared by electrolytic copper foil, rolled copper foil or the Copper Foil after electrolysis heat treatment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610088588 CN101087495A (en) | 2006-06-06 | 2006-06-06 | Making method of multi-layer printed circuit board without leading hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610088588 CN101087495A (en) | 2006-06-06 | 2006-06-06 | Making method of multi-layer printed circuit board without leading hole |
Publications (1)
| Publication Number | Publication Date |
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| CN101087495A true CN101087495A (en) | 2007-12-12 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN 200610088588 Pending CN101087495A (en) | 2006-06-06 | 2006-06-06 | Making method of multi-layer printed circuit board without leading hole |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101958444A (en) * | 2010-05-27 | 2011-01-26 | 世达普(苏州)通信设备有限公司 | Packaging structure of microwave isolator |
| CN102035059A (en) * | 2010-11-25 | 2011-04-27 | 世达普(苏州)通信设备有限公司 | Printed circuit board interface structure for microwave circulator |
| CN102487579A (en) * | 2011-09-05 | 2012-06-06 | 深圳光启高等理工研究院 | Preparation method of metamaterial and the same |
| CN104684240A (en) * | 2013-11-27 | 2015-06-03 | 富葵精密组件(深圳)有限公司 | Circuit board and circuit board manufacturing method |
| CN105392279A (en) * | 2015-12-17 | 2016-03-09 | 王朝 | PCB board edge multi-row bonding pad and preparation method of multi-row edge ponding pad PCB board |
| CN108882517A (en) * | 2017-05-11 | 2018-11-23 | 美国西门子医疗解决公司 | The contact pad of electrical module component and multidimensional transducer array |
| CN113015324A (en) * | 2019-12-19 | 2021-06-22 | 华为技术有限公司 | Circuit board assembly, electronic device, and method of processing circuit board assembly |
-
2006
- 2006-06-06 CN CN 200610088588 patent/CN101087495A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101958444A (en) * | 2010-05-27 | 2011-01-26 | 世达普(苏州)通信设备有限公司 | Packaging structure of microwave isolator |
| CN102035059A (en) * | 2010-11-25 | 2011-04-27 | 世达普(苏州)通信设备有限公司 | Printed circuit board interface structure for microwave circulator |
| CN102487579A (en) * | 2011-09-05 | 2012-06-06 | 深圳光启高等理工研究院 | Preparation method of metamaterial and the same |
| CN102487579B (en) * | 2011-09-05 | 2013-09-04 | 深圳光启高等理工研究院 | Preparation method of metamaterial and the same |
| CN104684240A (en) * | 2013-11-27 | 2015-06-03 | 富葵精密组件(深圳)有限公司 | Circuit board and circuit board manufacturing method |
| CN105392279A (en) * | 2015-12-17 | 2016-03-09 | 王朝 | PCB board edge multi-row bonding pad and preparation method of multi-row edge ponding pad PCB board |
| CN108882517A (en) * | 2017-05-11 | 2018-11-23 | 美国西门子医疗解决公司 | The contact pad of electrical module component and multidimensional transducer array |
| CN108882517B (en) * | 2017-05-11 | 2022-05-27 | 美国西门子医疗解决公司 | Contact pads for electrical module assemblies and multi-dimensional transducer arrays |
| CN113015324A (en) * | 2019-12-19 | 2021-06-22 | 华为技术有限公司 | Circuit board assembly, electronic device, and method of processing circuit board assembly |
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