JP4287733B2 - Multi-layer printed wiring board with built-in electronic components - Google Patents

Multi-layer printed wiring board with built-in electronic components Download PDF

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JP4287733B2
JP4287733B2 JP2003373849A JP2003373849A JP4287733B2 JP 4287733 B2 JP4287733 B2 JP 4287733B2 JP 2003373849 A JP2003373849 A JP 2003373849A JP 2003373849 A JP2003373849 A JP 2003373849A JP 4287733 B2 JP4287733 B2 JP 4287733B2
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wiring board
printed wiring
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insulating layer
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JP2005142178A (en
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哲也 高橋
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日本シイエムケイ株式会社
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本発明は、電子部品を内蔵した多層プリント配線板、更に詳細には層間絶縁層内のスペースを有効的に利用して、厚さの異なる電子部品を層間絶縁層内に封止せしめた電子部品内蔵多層プリント配線板に関する。   The present invention relates to a multilayer printed wiring board containing electronic components, and more specifically, an electronic component in which electronic components having different thicknesses are sealed in an interlayer insulating layer by effectively using a space in the interlayer insulating layer The present invention relates to a built-in multilayer printed wiring board.
最近では、電子機器の高機能化に伴い、プリント配線板も多層化され軽薄短小化が進んでいる。その中で、プリント配線板の表面に実装されていた電子部品をプリント配線板内に内蔵することによって、層間絶縁層のスペースを活用するプリント配線板が提案されるようになってきている(例えば特許文献1参照)。   Recently, as electronic devices have higher functionality, printed wiring boards have become multilayered and are becoming thinner and lighter. Among them, printed wiring boards that utilize the space of the interlayer insulating layer by incorporating electronic components mounted on the surface of the printed wiring board into the printed wiring board have been proposed (for example, Patent Document 1).
また、同じ層間絶縁層内に色々な厚さの電子部品を実装し、プリント配線板内に内蔵している基板も提案されている(例えば特許文献2参照)。   There has also been proposed a board in which electronic components of various thicknesses are mounted in the same interlayer insulating layer and are built in a printed wiring board (see, for example, Patent Document 2).
従来のようにプリント配線板の表面の配線回路で部品同士の接続を行うと配線の長さが長くなり、配線の持つインピーダンスの影響で信号が減衰又は伝播遅延して電子部品に誤動作をきたす等の問題が発生する。また、この現象は電子部品の動作周波数の積として影響度が増大する事が知られている。
特開2001−119147号 特開2002−344146号
If parts are connected to each other with the wiring circuit on the surface of the printed wiring board as in the past, the length of the wiring will become long, and the signal will be attenuated or delayed due to the impedance of the wiring, causing malfunctions in the electronic parts, etc. Problems occur. Further, it is known that the influence of this phenomenon increases as the product of the operating frequencies of electronic components.
JP 2001-119147 A JP 2002-344146 A
厚さの異なる電子部品を内蔵する場合、最も厚い電子部品の高さに層間絶縁層の厚みを合わせるため、同一基板上に厚さの異なる電子部品が実装されると、その他の電子部品の厚さが低い場合、層間絶縁層が存在し無駄なスペースとなり、基板全体が厚くなってしまうため小型化出来ないという問題が発生している。   When electronic components with different thicknesses are built in, the thickness of the interlayer insulation layer is adjusted to the height of the thickest electronic component. Therefore, when electronic components with different thicknesses are mounted on the same substrate, the thickness of other electronic components If the thickness is low, an interlayer insulating layer is present, resulting in a useless space, and the entire substrate becomes thick, so that there is a problem that the size cannot be reduced.
また、電子部品の実装形態の異なる部品を実装する場合、同じ配線上で、同一工程において実装することができないという問題も発生していた。   Further, when mounting components with different electronic component mounting forms, there has been a problem that they cannot be mounted in the same process on the same wiring.
更に、表面に電子部品を実装し、表面の配線回路で電子部品同士を接続すると、配線回路の長さによっては、配線のインピーダンスによって信号の減衰や伝播遅延が発生して電子部品が誤動作する等の問題が発生する。   In addition, when electronic components are mounted on the surface and the electronic components are connected to each other by the wiring circuit on the surface, depending on the length of the wiring circuit, signal attenuation or propagation delay occurs due to the impedance of the wiring, and the electronic components malfunction. Problems occur.
表層に余分な配線回路を引き回すため、軽薄短小化の妨げにもなっている。   Since extra wiring circuits are routed on the surface layer, it also hinders light and thin.
従って、本発明は、上記の如き従来の問題を解消し得る電子部品内蔵多層プリント配線板を提供することを目的とする。   Accordingly, an object of the present invention is to provide a multilayer printed wiring board with built-in electronic components that can solve the conventional problems as described above.
本発明は、厚さの異なる複数の電子部品を内蔵した多層プリント配線板であって、電子部品を実装した第1の配線板と電子部品を実装した第2の配線板が、当該実装した電子部品側を互に向き合わせて、かつ層間絶縁層を介して積層されていると共に、当該第1の配線板(9a)と第2の配線板(9b)の少なくとも何れか一方(9b)に、層間絶縁層(12)よりも厚い電子部品(11b)が実装され、かつ他方の配線板(9a)に、当該層間絶縁層(12)よりも厚い電子部品(11b)の収納用開口部(10)が設けられていると共に、当該層間絶縁層(12)に、当該層間絶縁層(12)よりも厚い電子部品(11b)及び当該層間絶縁層(12)よりも薄い電子部品(11a)の収納用開口部(12a)が設けられていることを特徴とする部品内蔵多層プリント配線板によって上記目的を達成しているものである。 The present invention is a multilayer printed wiring board in which a plurality of electronic components having different thicknesses are incorporated, and the first wiring board on which the electronic components are mounted and the second wiring board on which the electronic components are mounted The component sides face each other and are laminated via an interlayer insulating layer, and at least one of the first wiring board (9a) and the second wiring board (9b) (9b), An electronic component (11b) thicker than the interlayer insulating layer (12) is mounted, and an opening (10) for storing an electronic component (11b) thicker than the interlayer insulating layer (12) is mounted on the other wiring board (9a). ) And an electronic component (11b) thicker than the interlayer insulating layer (12) and an electronic component (11a) thinner than the interlayer insulating layer (12) are stored in the interlayer insulating layer (12). Japanese that use apertures (12a) are provided The component-embedded multilayer printed wiring board and those that achieve the object.
斯かる構成とすることにより、層間絶縁層のスペースを有効活用することが出来、表面に実装する部品点数を削減することが可能となると共に、層間絶縁層の厚みを最も厚い電子部品の高さに合わせる必要がないため、基板全体をより薄く小型化することが可能となる。しかも、電子部品を実装した第1と第2の配線板において、電子部品の実装形態が異なる場合にも対応できるので、実装工程での効率化と歩留りの改善が可能となる。 With such a configuration, the space of the interlayer insulating layer can be effectively used, the number of components to be mounted on the surface can be reduced, and the thickness of the thickest electronic component can be reduced. Therefore, the entire substrate can be made thinner and smaller. In addition, since the first and second wiring boards on which the electronic components are mounted can cope with cases where the mounting forms of the electronic components are different, it is possible to improve the efficiency in the mounting process and improve the yield.
また、本発明は、前記部品内蔵プリント配線板において、配線板の電子部品が内蔵された反対側で、内蔵部品が実装されているパッドの裏側にビアホールを設けるか、あるいはパッドからランドを引き出しビアホールと配線を用いて、導電接続していることを特徴とする。ここに、導電接続は、金属フィラーを含有する樹脂ペーストあるいは金属めっきを付与してなるものが特に有利である。また、前記ビアホールには金属めっきが充填されているものが特に良い結果を与える。   According to the present invention, in the printed wiring board with built-in components, a via hole is provided on the opposite side of the wiring board on which the electronic component is built, or on the back side of the pad on which the built-in component is mounted. And a conductive connection using the wiring. Here, the conductive connection is particularly advantageous when a resin paste containing metal filler or metal plating is applied. In addition, the via hole filled with metal plating gives particularly good results.
斯かる構成、すなわち内蔵された電子部品とプリント配線板の外層に接続された電子部品とを接続するのにビアホールを利用して接続することによって、配線の距離が短くなり、インピーダンスを低減し、信号の減衰や伝播遅延による電子部品の誤動作を抑制することができる。   By connecting via the via hole to connect such a configuration, that is, an electronic component built in and an electronic component connected to the outer layer of the printed wiring board, the wiring distance is shortened, impedance is reduced, Electronic component malfunction due to signal attenuation and propagation delay can be suppressed.
本発明においては、厚さの異なる複数の電子部品が、層間絶縁層を有効に利用して内蔵せしめられているので、基板全体を薄く小型化することができる。   In the present invention, since a plurality of electronic components having different thicknesses are incorporated by effectively using the interlayer insulating layer, the entire substrate can be made thin and small.
また、本発明においては、第1の配線基板と第2の配線基板に電子部品が互に向き合う形で多層プリント配線板が構成されているため、各配線基板は、統一された実装工程で電子部品を実装し得るので、実装効率が上がり、生産性を向上せしめることができる。   In the present invention, since the multilayer printed wiring board is configured in such a manner that the electronic components face each other on the first wiring board and the second wiring board, each wiring board is an electronic component in a unified mounting process. Since components can be mounted, mounting efficiency can be improved and productivity can be improved.
また、本発明においては、ビアホールを利用して内蔵された電子部品と外層の電子部品とを接続することによって、配線の距離が短くなり、インピーダンスを低減し、信号の減衰や伝播遅延による電子部品の誤動作を抑制することができる。   Also, in the present invention, by connecting a built-in electronic component and an outer layer electronic component using a via hole, the wiring distance is shortened, the impedance is reduced, and the electronic component is caused by signal attenuation or propagation delay. Malfunction can be suppressed.
本発明の第一の実施形態を、図2(d)に示した多層プリント配線板P1を用いて簡単に説明する。   A first embodiment of the present invention will be briefly described using a multilayer printed wiring board P1 shown in FIG.
多層プリント配線板P1は、絶縁基材1の表裏に形成された配線パターン7(電極8を含む)と、当該表裏の配線パターン7を接続するめっき5で充填されたBVH6と、後に多層に積層する際に用いられる層間絶縁層12の厚さよりも厚い(背の高い)電子部品11bを収納するための収納用開口部10と、電極8に実装された多層に積層する際の層間絶縁層12の厚さよりも薄い(背の低い)電子部品11aとからなる第一プリント配線板9aと、当該第一プリント配線板9aにおける収納用開口部10を有さないで、且つ電極に実装された当該層間絶縁層12の厚さよりも厚い(背の高い)電子部品11bとからなる第二プリント配線板9bと、当該第一プリント配線板9aと第二プリント配線板9bとを、それぞれ電子部品11a、11b側が向き合うようにして積層接着する層間絶縁層12と、当該第一プリント配線板9aと第二プリント配線板9bの配線パターン間を接続するためのスルーホール13と、外層に形成されたソルダーレジスト14とからなる。   The multilayer printed wiring board P1 has a wiring pattern 7 (including electrodes 8) formed on the front and back sides of the insulating base 1, a BVH 6 filled with plating 5 for connecting the front and back wiring patterns 7, and is subsequently laminated in multiple layers. A storage opening 10 for storing an electronic component 11b that is thicker (tall) than the thickness of the interlayer insulating layer 12 used in the process, and the interlayer insulating layer 12 when stacked in a multilayer mounted on the electrode 8 The first printed wiring board 9a composed of the electronic component 11a that is thinner than the thickness of the first printed wiring board 9a, and the first printed wiring board 9a that does not have the storage opening 10 and is mounted on the electrode A second printed wiring board 9b composed of an electronic component 11b that is thicker (tall) than the thickness of the interlayer insulating layer 12, and the first printed wiring board 9a and the second printed wiring board 9b are respectively connected to the electronic component 11a, An interlayer insulating layer 12 that is laminated and bonded so that the 1b side faces, a through hole 13 for connecting the wiring patterns of the first printed wiring board 9a and the second printed wiring board 9b, and a solder resist formed in the outer layer 14 and.
前記、電子部品は、半導体集積回路等の能動部品、抵抗、コンデンサ、コイルなどの受動部品などが挙げられる。   Examples of the electronic component include active components such as semiconductor integrated circuits, passive components such as resistors, capacitors, and coils.
電子部品の実装方法としては、金−はんだ工法や異方性導電フィルム(ACF)工法及びスタッドバンプボンディング(SBB)工法などのバンプによる接続方法やはんだペーストによる加熱溶融接続、導電性ペーストや導電性フィルムによる接続などが挙げられる。   Electronic component mounting methods include gold-solder method, anisotropic conductive film (ACF) method and stud bump bonding (SBB) method such as bump connection method, heat-melt connection using solder paste, conductive paste and conductivity Examples include film connection.
層間絶縁層は、一般に使用されているプリプレグ(ガラス繊維にエポキシ樹脂を含浸させたもの)やボンディングシートなどの層間接着層を用いても構わない。   The interlayer insulating layer may be an interlayer adhesive layer such as a commonly used prepreg (glass fiber impregnated with epoxy resin) or a bonding sheet.
厚い(背の高い)電子部品を内蔵する場合、複数の接着シートを積層する場合があるが、プリント配線板の強度等を考慮すると少なくとも1枚以上のガラス繊維を含むプリプレグを使用する方が好ましい。   When a thick (tall) electronic component is built in, a plurality of adhesive sheets may be laminated, but it is preferable to use a prepreg containing at least one glass fiber in consideration of the strength of the printed wiring board. .
続いて、当該多層プリント配線板P1の製造工程について簡単に説明する。   Then, the manufacturing process of the multilayer printed wiring board P1 will be briefly described.
まず、図1(a)に示したように、絶縁基材1の表裏に金属箔2を備えた両面金属箔張積層板3を用意し、一方の金属箔2の所望の位置にレーザを照射することによって、他方の金属箔2に達する非貫通孔4を穿孔する(図1(b)参照)。当該レーザ加工は、上記のように、直接金属箔2にレーザを照射する他に、予めレーザを照射する部位の金属箔2をエッチング除去してから、レーザ加工を行ってもよい。   First, as shown in FIG. 1 (a), a double-sided metal foil-clad laminate 3 having metal foils 2 on the front and back sides of an insulating substrate 1 is prepared, and a laser beam is irradiated to a desired position on one metal foil 2. By doing so, the non-through-hole 4 which reaches the other metal foil 2 is pierced (refer FIG.1 (b)). As described above, in addition to directly irradiating the metal foil 2 with the laser, the laser processing may be performed after the metal foil 2 in the portion irradiated with the laser is previously removed by etching.
次に、非貫通孔4のデスミア処理を行った後、図示しない無電解めっきで表裏の金属箔2を接続し、次いで、フィルドビア形成用のめっき液を用いて電解めっきを行い、当該非貫通孔4を含んだ両面金属箔張積層板3の全面にめっき5を析出させる(図1(c)参照)。   Next, after the desmear treatment of the non-through holes 4 is performed, the front and back metal foils 2 are connected by electroless plating (not shown), and then electrolytic plating is performed using a plating solution for forming filled vias. 4 is deposited on the entire surface of the double-sided metal foil-clad laminate 3 including 4 (see FIG. 1C).
次に、レーザを照射した面の反対側の面のみ回路形成を行うことによって、めっき5が充填されたBVH6と片側に配線パターン7(電極8を含む)が形成された、図1(d)の両面プリント配線板9を得る。   Next, by forming a circuit only on the surface opposite to the surface irradiated with the laser, the BVH 6 filled with the plating 5 and the wiring pattern 7 (including the electrode 8) are formed on one side. FIG. The double-sided printed wiring board 9 is obtained.
次に、上記工程によって得られる両面プリント配線板9を2枚用意し、一方を、後に2枚の両面プリント配線板9を積層する際に用いられる層間絶縁層12の厚さよりも薄い電子部品11aの実装用(以降、これを第一プリント配線板9aと呼ぶことにする)とし、他方を、当該層間絶縁層12の厚さよりも厚い電子部品11bの実装用(以降、これを第二プリント配線板9bと呼ぶことにする)として、当該第一プリント配線板9aにおける、電子部品11bの実装位置に対応する部位に、当該電子部品11bの収納用開口部10を形成する(図2(a)参照)。   Next, two double-sided printed wiring boards 9 obtained by the above process are prepared, and one of the electronic parts 11a is thinner than the thickness of the interlayer insulating layer 12 used when two double-sided printed wiring boards 9 are laminated later. For mounting the electronic component 11b (hereinafter referred to as the first printed wiring board 9a), and for mounting the electronic component 11b thicker than the interlayer insulating layer 12 (hereinafter referred to as the second printed wiring board). As the board 9b, the opening 10 for storing the electronic component 11b is formed in a portion of the first printed wiring board 9a corresponding to the mounting position of the electronic component 11b (FIG. 2A). reference).
次に、図2(a)、(b)に示したように、それぞれ電子部品11a、11bを電極8上に実装することによって、第一プリント配線板9a及び第二プリント配線板9bを得る。   Next, as shown in FIGS. 2A and 2B, the first printed wiring board 9a and the second printed wiring board 9b are obtained by mounting the electronic components 11a and 11b on the electrodes 8, respectively.
次に、当該電子部品11a、11bの実装位置に対応する部位に開口部12aが形成された層間絶縁層12を用意し、第一プリント配線板9a及び第二プリント配線板9bの電子部品11a、11bが実装された側を向き合わせて配置するとともに当該層間絶縁層12を両プリント配線板9a、9b間に配置して積層する(図2(c)参照)。   Next, an interlayer insulating layer 12 having an opening 12a formed at a position corresponding to the mounting position of the electronic components 11a and 11b is prepared, and the electronic components 11a and 11b of the first printed wiring board 9a and the second printed wiring board 9b are prepared. The side on which the side 11b is mounted is disposed facing each other, and the interlayer insulating layer 12 is disposed between the printed wiring boards 9a and 9b and stacked (see FIG. 2C).
次に、第一プリント配線板9a及び第二プリント配線板9bの積層後に、収納用開口部10から突出した層間絶縁層12の樹脂を研磨除去し、次いで、表裏面を貫通するスルーホール13をドリル加工、めっき処理等の常法により形成する。次いで、外層の配線パターン7を形成した後、所望の形状にソルダーレジスト14を形成することによって、図2(d)に示した電子部品内蔵多層プリント配線板P1を得る。   Next, after laminating the first printed wiring board 9a and the second printed wiring board 9b, the resin of the interlayer insulating layer 12 protruding from the storage opening 10 is polished and removed, and then the through holes 13 penetrating the front and back surfaces are formed. It is formed by a conventional method such as drilling or plating. Next, after forming the outer layer wiring pattern 7, the solder resist 14 is formed in a desired shape to obtain the multilayer printed wiring board P <b> 1 with built-in electronic components shown in FIG.
本発明の第二の実施形態を、図3(d)に示した多層プリント配線板P2を用いて簡単に説明する。   A second embodiment of the present invention will be briefly described using the multilayer printed wiring board P2 shown in FIG.
多層プリント配線板P2は、絶縁基材1の表裏に形成された配線パターン7(電極8を含む)と、当該表裏の配線パターン7を接続するめっき5で充填されたBVH6と、後に多層に積層する際に用いられる層間絶縁層12の厚さよりも薄い(背の低い)電子部品11aと、電極8に実装された多層に積層する際の層間絶縁層12の厚さの1/2以下で更に薄い(背の低い)電子部品11cとからなる第三プリント配線板9cと、同じ構造の第四プリント配線板9dにおいて電子部品11cと11d同士が丁度向き合う位置となる様に積層接着する層間絶縁層12と、当該第三プリント配線板9cと第四プリント配線板9dの配線パターン間を接続するためのスルーホール13と、外層に形成されたソルダーレジスト14とからなる。   The multilayer printed wiring board P2 has a wiring pattern 7 (including electrodes 8) formed on the front and back sides of the insulating base 1, a BVH 6 filled with plating 5 for connecting the front and back wiring patterns 7, and a multilayer stacked later. The electronic component 11a that is thinner (shorter) than the thickness of the interlayer insulating layer 12 used in the process and the thickness of the interlayer insulating layer 12 that is stacked in a multilayer mounted on the electrode 8 is less than 1/2 the thickness. A third printed wiring board 9c composed of a thin (short) electronic component 11c and an interlayer insulating layer that is laminated and adhered so that the electronic components 11c and 11d are just facing each other in a fourth printed wiring board 9d having the same structure 12, a through hole 13 for connecting the wiring patterns of the third printed wiring board 9 c and the fourth printed wiring board 9 d, and a solder resist 14 formed in the outer layer.
前記、電子部品は、半導体集積回路等の能動部品、抵抗、コンデンサ、コイルなどの受動部品などが挙げられる。   Examples of the electronic component include active components such as semiconductor integrated circuits, passive components such as resistors, capacitors, and coils.
電子部品の実装方法としては、金−はんだ工法や異方性導電フィルム(ACF)工法及びスタッドバンプボンディング(SBB)工法などのバンプによる接続方法やはんだペーストによる加熱溶融接続、導電性ペーストや導電性フィルムによる接続などが挙げられる。   Electronic component mounting methods include gold-solder method, anisotropic conductive film (ACF) method and stud bump bonding (SBB) method such as bump connection method, heat-melt connection using solder paste, conductive paste and conductivity Examples include film connection.
層間絶縁層は、一般に使用されているプリプレグ(ガラス繊維にエポキシ樹脂を含浸させたもの)やボンディングシートなどの層間接着層を用いても構わない。   The interlayer insulating layer may be an interlayer adhesive layer such as a commonly used prepreg (glass fiber impregnated with epoxy resin) or a bonding sheet.
電子部品を内蔵する場合、背の高さに合わせて複数の接着シートを積層する場合があるが、プリント配線板の強度等を考慮すると少なくとも1枚以上のガラス繊維を含むプリプレグを使用する方が好ましい。   When electronic components are built in, a plurality of adhesive sheets may be laminated according to the height of the back, but considering the strength of the printed wiring board, it is better to use a prepreg containing at least one glass fiber. preferable.
続いて、当該多層プリント配線板P2の製造工程について簡単に説明する。   Subsequently, a manufacturing process of the multilayer printed wiring board P2 will be briefly described.
まず、図1(a)に示したように、絶縁基材1の表裏に金属箔2を備えた両面金属箔張積層板3を用意し、一方の金属箔2の所望の位置にレーザを照射することによって、他方の金属箔2に達する非貫通孔4を穿孔する(図1(b)参照)。当該レーザ加工は、上記のように、直接金属箔2にレーザを照射する他に、予めレーザを照射する部位の金属箔2をエッチング除去してから、レーザ加工を行ってもよい。   First, as shown in FIG. 1 (a), a double-sided metal foil-clad laminate 3 having metal foils 2 on the front and back sides of an insulating substrate 1 is prepared, and a laser beam is irradiated to a desired position on one metal foil 2. By doing so, the non-through-hole 4 which reaches the other metal foil 2 is pierced (refer FIG.1 (b)). As described above, in addition to directly irradiating the metal foil 2 with the laser, the laser processing may be performed after the metal foil 2 in the portion irradiated with the laser is previously removed by etching.
次に、非貫通孔4のデスミア処理を行った後、図示しない無電解めっきで表裏の金属箔2を接続し、次いで、フィルドビア形成用のめっき液を用いて電解めっきを行い、当該非貫通孔4を含んだ両面金属箔張積層板3の全面にめっき5を析出させる(図1(c)参照)。   Next, after the desmear treatment of the non-through holes 4 is performed, the front and back metal foils 2 are connected by electroless plating (not shown), and then electrolytic plating is performed using a plating solution for forming filled vias. 4 is deposited on the entire surface of the double-sided metal foil-clad laminate 3 including 4 (see FIG. 1C).
次に、レーザを照射した面の反対側の面のみ回路形成を行うことによって、めっき5が充填されたBVH6と片側に配線パターン7(電極8を含む)が形成された、図1(d)の両面プリント配線板9を得る。   Next, by forming a circuit only on the surface opposite to the surface irradiated with the laser, the BVH 6 filled with the plating 5 and the wiring pattern 7 (including the electrode 8) are formed on one side. FIG. The double-sided printed wiring board 9 is obtained.
次に、上記工程によって得られる両面プリント配線板9を2枚用意し、各々、後に2枚の両面プリント配線板9を積層する際に用いられる層間絶縁層12の厚さよりも薄い電子部品11aと、層間絶縁層12の厚さの1/2以下の厚さの更に薄い電子部品11cの実装用(以降、これを第三プリント配線板9c及び第四プリント配線板9dと呼ぶことにする)とする。(図3(a)、(b)参照)。   Next, two double-sided printed wiring boards 9 obtained by the above steps are prepared, and each of the electronic parts 11a is thinner than the thickness of the interlayer insulating layer 12 used when laminating the two double-sided printed wiring boards 9 later. For mounting a thinner electronic component 11c having a thickness of 1/2 or less of the thickness of the interlayer insulating layer 12 (hereinafter referred to as a third printed wiring board 9c and a fourth printed wiring board 9d). To do. (See FIGS. 3A and 3B).
次に、図3(c)、(d)に示したように、それぞれの電子部品11c、11dを電極8上に実装することによって、第三プリント配線板9c及び第四プリント配線板9dを得る。ここで、第三プリント配線板9cと第四プリント配線板9dにそれぞれ実装した電子部品11cと11dの位置は積層後に丁度向き合う位置となるようにしてある。   Next, as shown in FIGS. 3C and 3D, the third printed wiring board 9 c and the fourth printed wiring board 9 d are obtained by mounting the respective electronic components 11 c and 11 d on the electrode 8. . Here, the positions of the electronic components 11c and 11d respectively mounted on the third printed wiring board 9c and the fourth printed wiring board 9d are set so as to face each other after lamination.
次に、当該電子部品11c、11dの実装位置に対応する部位に開口部12aが形成された層間絶縁層12を用意し、第三プリント配線板9c及び第四プリント配線板9dの電子部品11c、11dが実装された側を向き合わせ、且つ電子部品11cが丁度向き合う位置として配置するとともに当該層間絶縁層12を両プリント配線板9c、9d間に配置して積層する(図3(c)参照)。   Next, an interlayer insulating layer 12 having an opening 12a formed at a position corresponding to the mounting position of the electronic components 11c and 11d is prepared, and the electronic components 11c and 4c of the third printed wiring board 9c and the fourth printed wiring board 9d are prepared. The side on which 11d is mounted faces each other, and the electronic component 11c is disposed so as to face each other, and the interlayer insulating layer 12 is disposed between the printed wiring boards 9c and 9d and stacked (see FIG. 3C). .
次に、第三プリント配線板9c及び第四プリント配線板9dの積層後に、表裏面を貫通するスルーホール13をドリル加工、めっき処理等の常法により形成する。次いで、外層の配線パターン7を形成した後、所望の形状にソルダーレジスト14を形成することによって、図3(d)に示した電子部品内蔵多層プリント配線板P2を得る。   Next, after the third printed wiring board 9c and the fourth printed wiring board 9d are laminated, the through holes 13 penetrating the front and back surfaces are formed by a conventional method such as drilling or plating. Next, after forming the wiring pattern 7 of the outer layer, the solder resist 14 is formed in a desired shape, thereby obtaining the multilayer printed wiring board P2 with built-in electronic components shown in FIG.
本発明で用いる両面プリント配線板の製造工程例を示す断面説明図。Cross-sectional explanatory drawing which shows the example of a manufacturing process of the double-sided printed wiring board used by this invention. 本発明の部品内蔵多層プリント配線板の製造工程例を示す断面説明図。Cross-sectional explanatory drawing which shows the example of a manufacturing process of the component built-in multilayer printed wiring board of this invention. 本発明の他の部品内蔵多層プリント配線板の製造工程例を示す断面説明図。Cross-sectional explanatory drawing which shows the example of a manufacturing process of the multilayer printed wiring board with other components of this invention.
符号の説明Explanation of symbols
1:絶縁基材
2:金属箔
3:両面銅張積層板
4:非貫通孔
5:めっき
6:BVH
7:配線パターン
8:電極
9:両面プリント配線板
9a:電子部品を実装した第一の両面プリント配線板
9b:電子部品を実装した第二の両面プリント配線板
9c:電子部品を実装した第三の両面プリント配線板
9d:電子部品を実装した第四の両面プリント配線板
10:電子部品収納用開口部
11a:層間絶縁層よりも薄い電子部品
11b:層間絶縁層よりも厚い電子部品
11c:層間絶縁層の1/2以下の厚みの薄い電子部品
12:層間絶縁層
12a:層間絶縁層開口部
13:スルーホール
14:ソルダーレジスト
P1:電子部品内蔵多層プリント配線板
P2:電子部品内蔵多層プリント配線板
1: Insulating base material 2: Metal foil 3: Double-sided copper-clad laminate 4: Non-through hole 5: Plating 6: BVH
7: Wiring pattern 8: Electrode 9: Double-sided printed wiring board 9a: First double-sided printed wiring board mounted with electronic components 9b: Second double-sided printed wiring board mounted with electronic components 9c: Third mounted with electronic components 9d: Fourth double-sided printed wiring board on which electronic components are mounted 10: Electronic component storage opening 11a: Electronic component thinner than interlayer insulating layer 11b: Electronic component thicker than interlayer insulating layer 11c: Interlayer Electronic component with a thickness of 1/2 or less of the insulating layer 12: Interlayer insulating layer 12a: Interlayer insulating layer opening 13: Through hole 14: Solder resist P1: Multi-layer printed wiring board with built-in electronic component P2: Multi-layer printed wiring with built-in electronic component Board

Claims (6)

  1. 厚さの異なる複数の電子部品を内蔵した多層プリント配線板であって、電子部品を実装した第1の配線板と電子部品を実装した第2の配線板が、当該実装した電子部品側を互に向き合わせて、かつ層間絶縁層を介して積層されていると共に、当該第1の配線板(9a)と第2の配線板(9b)の少なくとも何れか一方(9b)に、層間絶縁層(12)よりも厚い電子部品(11b)が実装され、かつ他方の配線板(9a)に、当該層間絶縁層(12)よりも厚い電子部品(11b)の収納用開口部(10)が設けられていると共に、当該層間絶縁層(12)に、当該層間絶縁層(12)よりも厚い電子部品(11b)及び当該層間絶縁層(12)よりも薄い電子部品(11a)の収納用開口部(12a)が設けられていることを特徴とする部品内蔵多層プリント配線板。 A multilayer printed wiring board in which a plurality of electronic components having different thicknesses are embedded, wherein the first wiring board on which the electronic component is mounted and the second wiring board on which the electronic component is mounted mutually connect the mounted electronic component side. And an interlayer insulating layer (9b) on at least one of the first wiring board (9a) and the second wiring board (9b). The electronic component (11b) thicker than 12) is mounted, and the other wiring board (9a) is provided with an opening (10) for storing the electronic component (11b) thicker than the interlayer insulating layer (12). In addition, an opening for storing an electronic component (11b) thicker than the interlayer insulating layer (12) and an electronic component (11a) thinner than the interlayer insulating layer (12) is formed in the interlayer insulating layer (12). parts, characterized in that 12a) is provided Built-in multi-layer printed wiring board.
  2. 前記記載の電子部品を実装した第1と第2の配線板において、電子部品の実装形態が異なることを特徴とする請求項記載の部品内蔵多層プリント配線板。 In the first and second wiring board mounted with electronic components of the described component-embedded multilayer printed wiring board according to claim 1, wherein the implementation of the electronic component are different.
  3. 前記記載の配線板の電子部品が内蔵された反対側で、内蔵部品が実装されているパッドを介してビアホールを設け、導電接続していることを特徴とする請求項1又は2記載の部品内蔵多層プリント配線板。 3. The component built-in according to claim 1, wherein a via hole is provided through a pad on which the built-in component is mounted on the opposite side of the wiring board on which the electronic component is built-in, and is electrically conductively connected. Multilayer printed wiring board.
  4. 前記記載の導電接続が、金属フィラーを含有する樹脂ペーストであることを特徴とする請求項記載の部品内蔵多層プリント配線板。 4. The component built-in multilayer printed wiring board according to claim 3, wherein the conductive connection is a resin paste containing a metal filler.
  5. 前記記載の導電接続が、金属めっきを付与してなることを特徴とする請求項記載の電子部品内蔵多層プリント配線板。 4. The multilayer printed wiring board with built-in electronic components according to claim 3, wherein the conductive connection is provided with metal plating.
  6. 前記記載のビアホールに、金属めっきが充填されていることを特徴とする請求項3〜5の何れか1項記載の部品内蔵多層プリント配線板。 6. The component built-in multilayer printed wiring board according to claim 3 , wherein the via hole is filled with metal plating.
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