JPH04181792A - Connecting device for printed circuit board - Google Patents

Abstract

PURPOSE:To enhance the degree of freedoms of disposing an electronic component and designing a pattern and to substantially accelerate a high density mounting by providing first and second mounting boards, superposing the boards with a conductive material interposed between their printed conductors to be integrated. CONSTITUTION:An anisotropically conductive film 43 is interposed to be opposed between the exposed surface of resin 40 of a mounting board 42 and the exposed surface of resin 401 of a mounting board 421, and both the boards 42, 421 are thermally press-bonded to be integrated. In this case, the film 43 has conductivity only in its thickness direction. Printed conductors 41, 411 are conducted at only opposed parts through the film 43, and the two boards 42, 42 are electrically connected therebetween. Accordingly, the conductors 41, 411 can be independently circulated without restriction to each other. Thus, the degree of freedoms of disposing an electronic component and designing a pattern can be enhanced, and a high density mounting can be substantially accelerated.

Description

[Detailed Description of the Invention] [Objective of the Invention] (Industrial Application Field) The present invention relates to a printed wiring board connecting device that electrically connects a plurality of printed wiring boards to each other, and particularly relates to a printed wiring board connecting device that electrically connects a plurality of printed wiring boards to each other. Regarding what I tried to implement.

(Prior Art) As is well known, in order to make electronic circuits thinner and smaller, techniques for mounting small electronic components on printed wiring boards at high density are being actively developed. Generally speaking, technical means to achieve such high-density packaging include thinning and multilayering wiring layers and miniaturizing electronic components. At the same time, conventionally, it has been difficult to achieve high-density mounting on printed wiring boards, and multiple printed wiring boards on which electronic components are mounted are electrically connected to each other.
Technological developments are also underway to efficiently accommodate these devices within the limited narrow space of the housing of electronic equipment.

FIG. 4 shows a conventional connection means for electrically connecting such printed wiring boards. That is, numeral 11 in the figure is a printed wiring board, in which a wiring layer 13 is printed by etching a copper foil on an insulating substrate made of paper phenol, glass epoxy resin, or the like. This printed wiring board 11 includes chip components 14 such as resistors and capacitors. Chip-type electrolytic capacitor 15 and package-type IC (integrated circuit) 1
It is mounted by soldering. Further, at one end of this printed wiring board 11, a plurality of wiring layers 17 for external connection are arranged at a predetermined pitch, and a plurality of connection terminals 18 connected to these wiring layers 17 and an insulating substrate 1
A connector 20 made of synthetic resin and having one fixed terminal for fixing to the connector 2 is attached.

Similarly, numeral 21 in the figure is a printed wiring board in which a wiring layer 23 is formed on an insulating substrate 22, and chip components 24, discrete electrolytic capacitors 25, etc. are mounted on one end of this printed wiring board 21. , a wiring layer 26 for multiple external connections
Arrays are formed at a predetermined pitch.

A strip-shaped base material 27 made of an insulating material such as polyimide
First, a flexible substrate 29 is prepared in which a plurality of wiring patterns 28 are buried in parallel at a predetermined pitch along the long direction of the substrate, and the wiring pattern 28 exposed from one end of the flexible substrate 29 is inserted and crimped into the connector 20. At the same time, the printed wiring boards 11 and 21 are electrically connected by soldering the wiring pattern 28 exposed from the other end to the wiring layer 26.

However, in the conventional electrical connection means between printed wiring boards as described above, the parts on the printed wiring board 11, 21 that require electrical connection to the outside are gathered at the ends by routing the pattern and connected to the outside. Since it is necessary to form wiring layers 17 and 26 for connection, only an extra pattern is required, which imposes restrictions on the arrangement of electronic components and reduces the degree of freedom in pattern design for wiring layers 13 and 23. However, this poses the problem of hindering high-density packaging.

In addition, with such conventional connection means, the electronic components mounted on each printed wiring board 1, 1, 21 are arranged vertically via two flexible substrates, giving the appearance of so-called three-dimensional mounting. Since the flexible substrate 29 requires a structure or a space for curving the flexible substrate 29, it also has the disadvantage of hindering high-density packaging of electronic components in electronic devices.

(Problems to be Solved by the Invention) As described above, the conventional printed wiring board connection means has the problem of hindering high-density packaging because it requires extra pattern routing and flexible substrates. are doing.

Therefore, the present invention was made in consideration of the above circumstances, and provides an extremely good printed wiring board connection device that increases the degree of freedom in the arrangement and pattern design of electronic components and substantially promotes high-density packaging. The purpose is to provide.

[Structure of the Invention] (Means for Solving the Problems) A printed wiring board connection device according to the present invention includes a printed wiring board formed by printing a wiring pattern on an insulating substrate, and a wiring pattern of this printed wiring board. a first electronic component to be connected to the first electronic component; a connecting conductor having one end connected to the wiring pattern of the printed wiring board and the other end set at a higher position than the first electronic component; The other end of the body is exposed and the first
a second electronic component that is embedded and fixed in this resin layer and has a connecting electrode portion exposed on the surface of the resin layer; A first and a first printed conductor having a printed conductor printed on the surface of the layer and electrically connecting the connecting electrode portion of the second electronic component exposed from the resin layer and the other end of the connecting conductor. The present invention includes two mounting boards, and the first and second mounting boards are stacked and integrated with a conductive member sandwiched between printed conductors.

Further, the printed wiring board connection device according to the present invention includes a first insulating substrate having a plurality of through holes formed at predetermined positions, and a first insulating substrate that is loosely inserted into the through holes of the first insulating substrate. A first electronic component fixed with resin such that a connection electrode portion is exposed on one side of the substrate, and a first electronic component inserted into a through hole of the first insulating substrate and having one end or one side of the first insulating substrate. a connecting conductor which is exposed at the other end or set at a higher position than the first electronic component; and a connecting conductor which is printed on one side of the first insulating substrate and is exposed from the first insulating substrate. A second electronic component is connected to a printed conductor that electrically connects the connecting electrode portion of the first electronic component and one end of the connecting conductor, and a wiring pattern printed on a second insulating substrate. and a printed wiring board to which the other end of the connecting conductor is connected, and the first and second mounting boards are sandwiched between the printed conductors with a conductive member between them. It is constructed so that they are superimposed and integrated.

Further, the printed wiring board connection device according to the present invention includes a resin body in which electronic components and connection conductors are embedded so that their connection electrode portions are exposed, and a resin body printed on the surface of the resin body, The first module board and the second module board each have a mark e11 conductor that electrically connects the connection electrode portion between the electronic component and the connection conductor, and the first module board and the second module board are connected between the printed conductors. The conductive members are stacked and integrated with each other with a conductive member sandwiched therebetween.

(Function) According to the above-mentioned configuration, there is no need to form wiring patterns for external connections as in the past, so there is no need to route unnecessary patterns, and freedom in electronic component placement and pattern design is achieved. It is possible to significantly improve the performance and substantially promote high-density packaging.

(Example) Hereinafter, an example of the present invention will be described in detail with reference to the drawings. In FIG. 1(a), reference numeral 30 denotes a printed wiring board, on which a wiring pattern 32 is printed by etching copper foil on both sides of an insulating substrate 31 made of glass epoxy resin or the like. Note that this printed wiring board 30 has a plurality of (two in the illustrated case) through holes 30a at predetermined positions.

30b are formed, and these through holes 30a,
Wiring pattern 32 on both sides of the insulating substrate 3 via 30b
Comrades or electrically connected.

A frame-shaped dam frame 33 made of glass epoxy resin or synthetic resin and having a constant height is pasted around one surface (the upper surface in the figure) of this printed wiring board 30.

Here, as shown in FIG. 1(b), the printed wiring board 3
Various electronic components such as chip components 34 and flat package ICs 35 are soldered 36 onto the wiring patterns 32 on both sides of the
Connect by. Also, the through hole 30a of the printed wiring board 30.

30b, a connecting conductive pin 37 is inserted upward in the figure and connected by solder 36. In this case, the dam frame 33 and the connection conductive bottle 37 are set to be at the same height, and the height is the same for various electronic components such as the chip component 34 and the flat package IC 35 connected to the printed wiring board 30. is set to exceed the height of In addition, dam frame 3
3 and the connecting conductive bottle 37 may be set in advance so that they have the same height, or one may be set higher and later polished to make the height the same. It is okay to do so.

Next, as shown in FIG. 1(c), a chip component 39 such as a chip resistor or a chip capacitor is attached to a predetermined position of a release sheet 38 whose one surface is coated with an adhesive. Then, the surface of the release sheet 38 to which the chip component 39 is attached is attached to the ends of the dam frame 33 and the electrically conductive bottle 37 for connection. Here, a through hole 38a is formed in the release sheet 38 at a predetermined position, and a liquid resin having an insulating property such as Evokin type or urethane type is injected through the through hole 38a. Then, as shown in FIG. 1(d), after the injected resin 40 has hardened, the release sheet 38 is peeled off. Then, the resin 4 after peeling off the release sheet 38
The surface of 0 is flattened, and the electrode portion of the chip component 39 and the end of the electrically conductive bottle 37 for connection are exposed.

Then, as shown in FIG. 1(e), a thermosetting conductive paste made of, for example, silver thread is screen printed on the 4° surface of the resin and thermally cured to form a printed conductor 4, thereby forming a chip component. Electrical connections are made between the three electrode portions and the ends of the connection conductive bottles 37, and the mounting board 42 is formed here.

Next, as shown in FIG. 1(f), a mounting board 42. is formed in the same manner as above. is provided.

Note that this mounting board 42. In the above mounting board 4
The same parts as 2 are indicated by the same reference numerals with the suffix 1 added. and the exposed surface of the resin 40 of the mounting board 42;
Mounting board 42. The exposed surface of the resin 401 is placed together with the anisotropic conductive film 43 in between, and both substrates 42 and 421 are bonded together by thermocompression. In this case, the anisotropic conductive film 43 is
Each printed conductor 41, . 41. Only the portions facing each other with the anisotropic conductive film 43 in between are electrically connected, thereby establishing an electrical connection between the two mounting substrates 42 and 421.

According to the configuration as in the above embodiment, the printed wiring board 30.3
0. Since there is no need to form a wiring layer for external connection as in the conventional case, there is only extra pattern routing, and the chip components 34, 39° 34, . 39. and flat package IC35゜351 layout and wiring pattern 32,3
The degree of freedom in routing the 21 can be greatly improved.

Further, printed wiring boards 30, 30 . Wiring pattern 32.3
21 and the printed conductor 41° 411 for external connection can be routed independently without restricting each other, so that the degree of freedom in pattern design can be improved in this respect as well.

Furthermore, both mounting boards 42, 42 . is an anisotropic conductive film 43
Since the electronic devices are integrated with each other sandwiched therebetween, it is possible to promote thinning, substantially achieve high-density packaging, and effectively promote thinning and miniaturization of electronic devices. For example, in the case of the above embodiment, the number of wiring layers is 30.30□ on each printed wiring board.
Wiring patterns 32, 32. and printed conductor 41,
41. There are 6 layers including +, but each printed wiring board 30
The thickness of the wiring pattern on both sides is 32°32,
The height of the flat package IC, which is a tall electronic component, is 35°35, or about 1.8 mm.
If the thickness is about 7.5 mm, the total thickness can be kept to about 7.5 mm.

In 22, the portions 2 of the printed conductors 41 and 411 facing each other with the anisotropic conductive film 43 in between are screen printed twice to increase the thickness, or plated. Good too. Moreover, each printed conductor 41. ,4
1. A resist layer can be selectively formed on the portions of the anisotropic conductive film 43 that are not electrically connected. Note that when the anisotropic conductive film 43 used was a film having a thickness of 25 μm and using metal nickel particles as the conductivity +4 material, the conduction resistance was about 100 mΩ.

Next, FIG. 2 shows a second embodiment of the invention. That is, in FIG. 2(a), 44 is an insulating substrate made of, for example, glass epoxy resin or synthetic resin, and a plurality of through holes 44a of various shapes are formed at predetermined positions. A backing tape 45 made of polyimide, polyester, or the like is attached to one surface (lower surface in the figure) of this insulating substrate 44. Here, the second
As shown in Figure (b), the corresponding through hole 4 of the insulating substrate 44
Drop the chip component 46 into 4a and apply the backing tape 45.
At the same time, the corresponding through hole 4 of the insulating substrate 44 is pasted.
Insert the conductive bottle 47 for connection into 4a and attach the lining tape 45.
Paste it on.

In this case, the chip component 46 is dropped into the through hole 44a.
is formed so that a gap is created between its side surface and the chip component 46, and a through hole 4 into which a conductive pin 47 for connection is inserted.
4a is formed so that a connecting conductive pin 47 is fitted therein. Moreover, the height of each conductive bottle 47 for connection is constant and is set higher than the chip component 46.

Then, as shown in FIG. 2C, the chip component 46 is injected into the gap between the chip component 46 and the through hole 44a and cured by injecting a liquid resin 48 having insulating properties such as epoxy resin. It is fixed to an insulating substrate 44. Furthermore, the electrically conductive pin 47 for connection is fixed to the insulating substrate 44 using the same resin 48 . Thereafter, the backing tape 45 is peeled off as shown in FIG. , the electrode portion of the chip component 46 and the end of the connecting conductive bottle 47 are exposed.
On the surface of the insulating substrate 44 on the side from which the backing tape 45 has been peeled off, for example, a silver-based thermosetting conductive paste is printed and thermoset to form a printed conductor 49.
Electrical connection is made between the electrode portion of the chip component 46 and the end of the electrically conductive bottle 47 for connection, and the basic mounting board 50 is formed here.

Here, as shown in FIG. 2(e), by connecting the basic mounting board 50 to a mounting printed wiring board 51, a mounting board 52 is constructed here.

Here, the mounted printed wiring board 51 includes various electronic components such as chip components 56 and a flat circuit board IC 5 connected by solder 58 to a printed wiring board 55 on which wiring patterns 54 are formed on both sides of an insulating substrate 53. It is something. The connection of the basic mounting board 5° to the mounting printed wiring board 51 is as follows.
This is done by bringing the tips of the connection conductive pins 47 of the basic mounting board 50 into contact with the wiring patterns 54 of the mounting printed wiring board 51 and fixing them with solder 58. An electrical connection is made between them.

Next, as shown in FIG. 2(f), a mounting board 521 formed in the same manner as above is provided.

In addition, in this mounting board 52□, the above mounting board 5
The same parts as 2 are indicated with the same reference numerals and suffixes. Then, the printed conductor 49 of the mounting board 52 and the mounting board 5
2. Printed conductor 49. By sandwiching the anisotropic conductive film 59 between them and thermocompressing and integrating the side substrates 52, 52°, the two mounting substrates 52, 52. Electrical connections are made between them. Also, with such a configuration, substantially the same effect as the embodiment shown in FIG. 1 can be obtained.

Further, FIG. 3 shows a third embodiment of the present invention. That is, in FIG. 3(a), 60 is a backing tape made of polyimide, polyester, etc., and a plurality of chip components 6] and connecting conductive pins 62 are attached to predetermined locations on the backing tape 60.
is pasted. In this case, the connecting conductive pin 62
The height is set to be equal to or higher than the six chip parts. As shown in FIG. 3(b), a frame-shaped dam frame 63 having the same height as the connection conductive pin 62 is pasted around one surface (the top surface in the figure) of the backing tape 60. It is attached. Further, a support plate 64 made of synthetic resin is attached to the upper part of the dam frame 63 in the figure. Note that the above-mentioned backing tape 60. A mold release agent or the like is applied in advance to the inner surfaces of the dam frame 63 and the support plate 6B.

Here, the support plate 63 has a through hole 63 at a predetermined position.
As shown in FIG. 3(c), a liquid resin 65 having insulating properties such as epoxy resin is injected through the through hole 63a.

After the injected resin 65 has hardened, FIG. 3(d)
As shown in , the backing tape 60. The dam frame 63 and support plate 63 are peeled off. Then, the surface of the resin 65 after peeling is flattened, and the electrode portions of the chip components 6 and the ends of the connecting conductive pins 62 are exposed. Therefore, the third
As shown in Figure (e), a printed conductor 66 is formed by screen printing a thermosetting conductive paste of, for example, silver thread on the surface of the resin 65 and thermally curing the paste, thereby forming a chip component 61.
An electrical connection is made between the electrode portion and the end of the connecting conductive pin 62, and a module substrate 67 is formed here.

Next, as shown in FIG. 3(f), a module substrate 671 formed in the same manner as above is provided. In this module board 671, the same parts as those of the module board 67 described above are indicated by the same reference numerals with a suffix 1 added thereto. Then, the printed conductor 66 of the module board 67 and the printed conductor 66 □ of the module board 67 are combined with the anisotropic conductive film 68 sandwiched between them, and the side boards 67 and 671 are thermocompression bonded to integrate the two. Accordingly, electrical connection between the two module boards 67 and 67+ is made here.

Then, as shown in FIG. 3(g), the module boards 67, 67+ integrated as described above are connected to six mounted printed wiring boards. Here, the mounted printed wiring board 69 is a printed wiring board 72 on which wiring patterns 71 are formed on both sides of an insulating substrate 70, and various electronic components such as a flat package IC 73 are connected by solder 74. The connection of the module substrates 67 and 67+ to the mounted printed wiring board 69 is performed by using an anisotropic conductive film between the printed conductor 661 of the module board 671 and the wiring pattern 71 of the mounted printed wiring board 69. 75 and align them together, and attach the side board 67.
+, by thermocompression bonding and integrating 69, here,
Electrical connections are made between the two module boards 67, 67 + and the six mounted printed wiring boards. Also, with such a configuration, substantially the same effect as the embodiment shown in FIG. 1 can be obtained.

It should be noted that the present invention is not limited to the above-described embodiments, and can be implemented with various modifications without departing from the gist thereof.

[Effects of the Invention] As detailed above, the present invention provides an extremely good printed wiring board connection device that increases the degree of freedom in the arrangement and pattern design of electronic components and substantially promotes high-density packaging. can be provided.

[Brief explanation of drawings]

FIG. 1 is a side sectional view showing an embodiment of a printed wiring board connection device according to the present invention, FIG. 2 is a side sectional view showing a second embodiment of the invention, and FIG. FIG. 4 is a side sectional view showing a conventional printed wiring board connection means. 1]...Printed wiring board, 12...Insulating substrate,]3...
Wiring layer, 14... Chip component, 15... Chip type electrolytic capacitor, 16... Package type IC. 17... Wiring layer, 18... Connection terminal, 19... Fixed terminal, 20... Connector, 21... Printed wiring board, 2
2... Insulating substrate, 23... Wiring layer, 24... Chip component, 25... Discrete electrolytic capacitor, 26
... Wiring layer, 27. Base material, 28... Wiring pattern, 29. Flexible board, 30 Mark [11 Wiring board, 3
1. Insulating board, 32. Wiring pattern, 33. Dam frame,
34...Chip parts, 35...Flat pan cage I
C136・Solder, 37・Conductive bottle for connection, 38・Release sheet, 39・Chip parts, 40 Resin, 41・
... Printed conductor, 42... Mounting board, 43 Anisotropic conductive film, 44... Insulating substrate, 45... Backing tape, 46...
...Chip parts, 47...Conductive bottle for connection, 48...
Resin, 49...Printed conductor, 50...Basic mounting board, 5
1... Mounted printed wiring board, 52... Mounted board, 53...
Insulating substrate, 54... Wiring pattern, 55... Printed wiring board, 56... Chip component, 57... Flat package IC, 58... Solder, 59 Anisotropic conductive film, 60...
- Backing tape, 61... Chip parts, 62 Conductive bottle for connection, 63 - Dam frame, 64 - Support plate, 65... Resin, 66... Printed conductor, 67... Mower, Neil board,
68... Anisotropic conductive film, 69... Mounted printed wiring board, 7
0. Insulating substrate, 7]... Wiring pattern, 72... Printed wiring board, 73 Flat package IC174... Solder, 75 Anisotropic conductive film. b tM1 Figure Figure 1

Claims (6)

[Claims] (1) A printed wiring board formed by printing a wiring pattern on an insulating substrate, a first electronic component connected to the wiring pattern of the printed wiring board, and one end connected to the wiring pattern of the printed wiring board. a connecting conductor whose other end is set at a higher position than the first electronic component; and a connecting conductor whose other end is set at a higher position than the first electronic component; a resin layer formed on a printed wiring board; a second electronic component that is embedded and fixed in this resin layer and has a connection electrode portion exposed on the surface of the resin layer; and a second electronic component that is printed and formed on the surface of the resin layer. first and second mounting boards each having a printed conductor that electrically connects a connecting electrode portion of the second electronic component exposed from the resin layer and the other end of the connecting conductor; 1. A printed wiring board connection device comprising: a first and a second mounting board, which are stacked and integrated with a conductive member sandwiched between the printed conductors of the first and second mounting boards. (2) The resin layer is configured to close a dam frame formed around the printed wiring board at substantially the same height as the connection conductor, and a space surrounded by the dam frame and the printed wiring board. The second electronic component is formed by injecting and curing a liquid resin into a space surrounded by the dam frame, the printed wiring board, and the mold release sheet. The connection electrode portion is embedded in the resin layer with the connecting electrode portion exposed by pasting it on a predetermined position on the inner surface of a mold release sheet and peeling off the mold release sheet after the resin has hardened. The printed wiring board connection device according to claim 1. (3) A first insulating substrate with a plurality of through holes formed at predetermined positions, and a connecting electrode portion that is loosely inserted into the through holes of the first insulating substrate and exposed on one side of the first insulating substrate. a first electronic component fixed with resin so that A connecting conductor set at a higher position than the electronic component and the first electronic component printed on one side of the first insulating substrate and exposed from the first insulating substrate. A second electronic component is connected to a printed conductor that electrically connects an electrode portion and one end of the connection conductor, and a wiring pattern printed on a second insulating substrate, and the connection conductor is connected to a second electronic component. The first and second mounting boards each have a printed wiring board to which the other end of the body is connected, and the first and second mounting boards are stacked and integrated with a conductive member sandwiched between the printed conductors. A printed wiring board connection device characterized in that it is configured to do so. (4) The first electronic component is attached by loosely inserting a through hole into a backing tape attached to one side of the first insulating substrate from the other side of the first insulating substrate. 4. The connecting electrode portion is fixed to one side of the first insulating substrate so as to be exposed by peeling off the backing tape in a state where the resin is injected and cured. Printed wiring board connection device. (5) A resin body in which an electronic component and a connecting conductor are buried so that their connecting electrode portions are exposed, and a connection between the electronic component and the connecting conductor is formed by printing on the surface of this resin body. first and second module substrates each having a printed conductor for electrically connecting the electrode portions, and the first and second module substrates are stacked and integrated with a conductive member sandwiched between the printed conductors. A printed wiring board connection device characterized in that it is configured as follows. (6) The resin body includes a backing tape on which the electronic component is pasted in a predetermined position, a dam frame formed around the backing tape at approximately the same height as the connection conductor, and the dam frame. A support plate installed to close the space surrounded by the dam frame, the backing tape, and the support plate is provided, and a liquid resin is injected into the space surrounded by the dam frame, the backing tape, and the support plate and cured. 6. The printed wiring board connection according to claim 5, wherein the electronic component and the connection conductor are buried with their connection electrode portions exposed by peeling off the dam frame, the backing tape, and the support plate. Device.