KR100704934B1 - Multi-layer Printed Circuit Board Having Embedded Condenser and Fabricating Method therefor - Google Patents

Abstract

Disclosed are a multilayer printed circuit board having a capacitor and a method of manufacturing the same. A printed circuit board including a laminated plate having a cavity formed therein, a capacitor inserted into the cavity and having a surface treated with a silane coupling agent, and a filling resin layer laminated between the capacitor and the cavity, and a manufacturing method thereof is a capacitor. Reliability is improved because the separation between the resin composition and the resin composition can be prevented and the bending and warping of the substrate can be prevented.

Shiran coupling agent, printed circuit board, condenser

Description

Multi-layer Printed Circuit Board Having Embedded Condenser and Fabricating Method therefor}

1 is a cross-sectional view of a multi-layer printed circuit board with a capacitor according to an embodiment of the present invention.

2 is a cross-sectional view showing a state in which a plurality of cavities are formed in a laminate.

3 is a cross-sectional view showing a state where a condenser is placed in a cavity;

4 is a cross-sectional view showing a state where the filling resin layer and the copper foil on the upper surface of the laminated plate and the prepreg and copper foil on the lower surface.

Fig. 5 is a cross-sectional view showing a state in which a filling resin layer and a copper foil and a prepreg and a copper foil are stacked to be filled with a capacitor and a cavity.

6 is a cross-sectional view of a multi-layer printed circuit board with a capacitor according to another embodiment of the present invention.

7 is a flowchart illustrating a method of manufacturing a capacitor-embedded multilayer printed circuit board according to an exemplary embodiment of the present invention.

* Description of the reference numerals for the main parts of the drawings *

10: laminated sheet 11: cavity 20: filling resin layer

30: inner layer circuit 31: copper foil 40: prepreg

50: blind via hole 51: through hole 60: condenser

70: permanent protective coating

The present invention relates to a multilayer printed circuit board and a method for manufacturing the same, and more particularly, to a multilayer printed circuit board with a capacitor and a method for manufacturing the same.

Recently, according to the miniaturization, thinness, and lightening of electronic devices, printed circuit boards (PCBs) used therein are also required to be compact and lightweight. In a conventional packaged printed circuit board, a chip capacitor is mounted on the surface of the printed circuit board to reduce loop inductance from the power supply to the power supply and earth of the IC chip. However, in electronic devices that are becoming smaller and denser, there are many difficulties in surface mounting of capacitors as the surface area of the printed circuit board itself decreases and the number of electronic components to be mounted on the surface increases. Since the reactance component of the loop inductance depends on the frequency, the surface mount of the capacitor cannot sufficiently reduce the loop inductance when the driving frequency of the IC chip is increased. In order to solve this problem, a method of embedding a capacitor inside a substrate is widely used today.

As described above, conventional methods of mounting a capacitor inside a substrate include JP-A-06-326472, JP-A-07-263619, JP-A-2001-332437, and the like.

However, Japanese Patent Laid-Open Nos. 06-326472 and 07-263619 have a problem in that the reliability of the capacitor is inferior and the adhesion between the capacitor and the resin is bad. In the above-mentioned Japanese Patent Application Laid-Open No. 2001-332437, which improved such a problem, a part of the capacitor was harmonized in order to improve the adhesion between the capacitor and the resin, but this also did not exhibit sufficient adhesion. Further, in the method according to Japanese Patent Laid-Open No. 2001-332437, one side of the capacitor is adhered to one side of the resin film without substrate reinforcement, and then connected by conductor plating of the blind via hole and multilayered by the build-up method. However, the resin composition layer having no substrate reinforcement has a large thermal expansion, and stress is generated at the connecting portion due to the difference between the thermal expansion rate of the capacitor and the thermal expansion rate of the resin composition due to the connection of the semiconductor chip during heating molding. This stress not only destroys the connection portion between the capacitor and the resin, but also causes warpage of the entire substrate.

The present invention is derived to solve the problems of the prior art as described above,

The present invention provides a capacitor-embedded multilayer printed circuit board having excellent adhesion between the capacitor and the filling resin layer filling the capacitor and improving the reliability of the substrate, and a method of manufacturing the same.

The present invention also provides a capacitor-embedded multilayer printed circuit board with less bending or warping of the substrate due to heat applied to the substrate forming process and a method of manufacturing the same.

The present invention is implemented by the following embodiments to solve the above technical problem.

According to an embodiment of the present invention, a multilayer printed circuit board having a capacitor includes a laminate in which a cavity is formed, a capacitor accommodated in a cavity, and a surface treated with a silane coupling agent, and a filling resin layer stacked while filling the capacitor and the cavity. Include.

It is preferable that an electrode is formed in the upper and lower surfaces of the capacitor. Moreover, it is preferable that a silane coupling agent is an epoxy silane coupling agent. It is preferable that the laminated board or the filling resin layer include a reinforcing base material. A plurality of inner layer circuits and prepregs are sequentially stacked on the filling resin layer and the laminate. The capacitor and the inner layer circuit are electrically connected by blind via holes. The blind via hole is preferably formed at the same position on both sides of the printed circuit board.

The prepreg preferably includes a reinforcing base. Permanent protective film may be formed on the inner layer circuit formed in the outermost layer. The permanent protective coating preferably includes a reinforcing base. It is preferable that a permanent protective film is a liquid crystal polyester resin composition.

According to one or more embodiments of the present invention, there is provided a method of manufacturing a multilayer printed circuit board having a capacitor, including forming a cavity in a laminate, placing a capacitor surface-treated with a silane coupling agent in the cavity, and thermosetting resin in the laminate. Laminating to fill between the capacitor and the cavity.

The method of manufacturing a capacitor-embedded multilayer printed circuit board may further include stacking prepregs, perforating blind via holes, and forming an inner layer circuit. In addition, the method of manufacturing a multilayer printed circuit board with a capacitor may further include forming a permanent protective film on an inner circuit layer formed on an outermost layer. The blind via hole electrically connecting the capacitor and the plurality of inner circuit layers is preferably formed at the same position on both sides of the printed circuit board.

Applicants will now be described with reference to the accompanying drawings, a capacitor embedded multilayer printed circuit board and a method of manufacturing the same.

1 is a cross-sectional view of a multilayer printed circuit board with a capacitor according to an embodiment of the present invention. As shown in FIG. 1, a multilayer printed circuit board with a capacitor according to an embodiment of the present invention may include a laminate 10 having a plurality of cavities 11 and a filling water inserted into the cavities 11. A capacitor 60 fixed by the ground layer 20, an inner layer circuit 30 and a prepreg 40 sequentially formed on the laminate 10 and the filling resin layer 20, and the capacitor 60. ) And a blind via hole 50 electrically connecting the inner circuit 30 and a permanent protective film 70 formed on the outermost layer of the printed circuit board.

2 is a cross-sectional view showing a state in which a plurality of cavities 11 are formed in the laminate 10.

A plurality of cavities 11 somewhat larger than the condenser 60 are formed in the laminate 10, and the condenser 60 is inserted into the cavities 11 and fixed by the filling resin layer 20. Therefore, the thickness of the laminate 10 is greater than the thickness of the capacitor 60. The filling resin layer 20 and the prepreg 40 are stacked on the laminate 10.

The laminate 10 may be generally known. For example, the printed circuit board of the buildup type | system | group gradually laminated by a well-known semi-additive method, the printed circuit board laminated | stacked using the prepreg, or the printed circuit board laminated | stacked using the copper foil with resin is mentioned. A copper clad laminated board can also use a well-known thing. For example, thermosetting resin copper clad laminates such as epoxy resin copper clad laminates, bismarimide copper clad laminates, cyanate ester resin copper clad laminates, polyimide copper clad laminates, and organic fiber cloth copper clad laminates using these resins, polyimide film copper clad plates, etc. And heat resistant organic film printed circuit boards. Of course, the laminate 10 is not limited thereto. It is preferable to add a reinforcing base material to the laminated plate 10 in order to prevent bending and warping due to heat.

The cavity 11 is formed slightly larger than the condenser 60 to accommodate the condenser 60. The condenser 60 is located in the cavity 11. The filling layer 20 is filled between the cavity 11 and the condenser 60.

3 is a cross-sectional view showing a state in which the condenser 60 is located in the cavity 11.

The capacitor 60 may be one of various shapes such as rectangular or triangular. In addition, the electrode of the condenser 60 may be any as long as it can be connected to the inner layer circuit 30 using the blind via hole 50. In particular, the electrode of the capacitor 60 is preferably the upper electrode 61 and the lower electrode 63 formed on almost the entire upper and lower surfaces. This is because when the electrodes are formed on both sides of the capacitor, cracking of the capacitor or peeling of the connection part may occur due to the tensile stress due to the expansion of the filling resin layer 20 during the substrate formation process. The upper electrode 61 and the lower electrode 63 are connected to the inner layer circuit 30 by the blind via hole 50.

The surface of the condenser 60 is treated with a silane coupling agent. The silane coupling agent may be one having an epoxy group, an amino group, a vinyl group, a melcap group, an acryloxy group or a methoxy group, an ethoxy group, and the like reacting with the thermosetting resin composition in a molecule. In particular, epoxysilane having an epoxy group is suitable. The silane coupling agent is hydrolyzed with a methoxy group and an ethoxy group, which is treated with water, which is hydrogen-bonded with the surface of the condenser 60 and chemically bonded by heat drying, thereby exhibiting a strong adhesive force. The remaining epoxy groups such as epoxy groups, amino groups, vinyl groups, melcap groups, and acryloxy groups react with the filling resin layer 20, which is a thermosetting resin composition, to be in close contact with the capacitor 60. As described above, the pretreatment of the silane coupling agent on the surface of the condenser 60 improves the adhesion between the filling resin layer 20 and the condenser 60, thereby improving the reliability of the substrate.

4 is a cross-sectional view showing a state where the filling resin layer 20 and the copper foil 31 are disposed on the upper surface of the laminate 10 and the prepreg 40 and the copper foil 31 are positioned on the lower surface thereof.

The filling resin layer 20 is charged between the condenser 60 and the cavity 11 to fix the condenser 60. As the filling resin layer 20, a general thermosetting resin may be used. For example, well-known resins, such as an epoxy resin, a cyanic acid ester resin, a maleimide resin, a polyimide resin, and a polyphenylene ether resin containing a functional group, can be used individually or in mixture of 2 or more types. In particular, a cyanate ester resin composition is preferable in order to prevent migration between conductor circuits and to improve heat resistance. In addition, brominated flame-retardant resin may be used in the thermosetting resin. When using it as a solvent-free liquid resin is added at room temperature.

And various additives can be mix | blended in the said thermosetting resin within the range which does not affect a characteristic largely as a composition. For example, various additives such as general inorganic or organic fillers, dyes, thickeners, lubricants, antifoaming agents, dispersants, leveling agents, brightening agents, polymerization initiators and the like may be added depending on the purpose and use. In addition, flame retardants may be used flame retarded with phosphorus or bromine, non-halogen type, non-flame retarded and the like. The silane coupling agent may be added to the thermosetting resin.

The filling resin layer 20 is cured by heating itself, but a general curing agent or a thermosetting catalyst may be added to increase the curing rate and improve productivity. And liquid crystalline polyester resin composition or its film type can also be used for lamination | stacking. In this case, it heats more than melting | fusing point of a liquid-crystal polyester resin composition, melts, laminates, and cools.

As the filling resin layer 20, an additive resin composition may also be used to form a fine circuit. An additive resin composition having a reinforcing base may be used to prevent bending or twisting of the filling resin layer 20. It is preferable. When the reinforcing base is not formed in the additive resin composition, it is preferable to add the reinforcing base to the permanent protective film 70.

The prepreg 40 is laminated on the bottom surface of the laminate 10, and the component is the same as that of the filling resin layer 20. The prepreg 40 is interposed between the inner layer circuits 30, as shown in FIG. A plurality of blind via holes are formed in the prepreg 40 and the filling resin layer 20.

The copper foil 31 is laminated on the top surface of the filling resin layer 20 and the prepreg 40 to become the inner circuit 30 by a general circuit forming process. The prepreg 40 and the inner layer circuit 30 are formed in a plurality of layers with the upper and lower symmetry around the laminate 10.

FIG. 5 is a cross-sectional view illustrating a state in which the filling resin layer 20, the copper foil 31, the prepreg 40, and the copper foil 31 are stacked to charge the capacitor 60 and the cavity 11. . The filling resin layer 20, the prepreg 40, and the copper foil 31 are thermocompressed in a vacuum state to simultaneously laminate the filling resin layer 20, the prepreg 40, and the copper foil on the laminate 10. The filling resin layer 20 fills the space between the cavity 11 and the condenser 60. At this time, the condenser 60 is firmly supported by the coupling of the silane coupling agent on the surface of the condenser 60 and the filling resin layer 20 which is a thermosetting resin.

As described above, a cavity 11 is formed in the laminate 10 so that the capacitor 60 is positioned, and the filling resin layer 20 or the prepreg 40 and the inner layer circuit 30 are sequentially stacked. The upper electrode 61 and the lower electrode 63 of the capacitor 60 and the inner layer circuit 30 are electrically connected to each other by the blind via hole 50. And, as shown in Figure 1, the permanent protective film 70 is laminated on the outermost side of the substrate. On the permanent protective film 70, a solder ball 81 for connecting a flip chip or a solder ball 83 for connecting to a main board (not shown) is formed.

The permanent protective film 70 serves to protect the inner circuit 30. The permanent protective film 70 is formed of a general thermosetting resin, it is preferable to use a B-stage thermosetting resin composition containing a reinforcing base to increase the rigidity (elastic modulus) to prevent bending or warping. In particular, when used in a high frequency environment, it is preferable to use a liquid crystal polyester resin composition layer for the surface layer as the permanent protective film (70).

6 is a cross-sectional view illustrating a multilayer printed circuit board with a capacitor according to another embodiment of the present invention. In the printed circuit board illustrated in FIG. 6, the capacitor 60 and the inner layer circuit 30 are electrically connected to each other through copper plating formed on the inner circumferential surface of the through hole 51.

7 is a cross-sectional view showing an embodiment of a method for manufacturing a multilayer printed circuit board with a capacitor according to an embodiment of the present invention.

As shown in FIG. 7, in the method of manufacturing a multilayer printed circuit board with a capacitor according to an embodiment of the present invention, forming the cavity 11 in the laminate 10 (S10) and surface treatment with a silane coupling agent. Positioning the condenser 60 in the cavity 11 (S20), the thermosetting resin such as the filling resin layer 20 is laminated on the laminate 10 to the condenser 60 and the cavity 11 Filling the gap (S30), laminating the prepreg 40 and forming the inner layer circuit 30 after the perforation of the blind via hole 50 (S40) and the permanent protective film 70 Forming step (S50) further comprises.

In step S10, as shown in FIG. 2, the cavity 11 having a size sufficient to completely accommodate the capacitor 60 is formed in the laminate 10. The cavity 11 may be formed by a known method. For example, a carbon dioxide laser, an UV-based excimer laser, a UV-YAG laser, a UV-vanadate laser, or the like may be used. In the case of carbon dioxide lasers, desmearing is necessary later. It is desirable to reduce the loop inductance by forming the cavity 11 as close as possible to the position where the semiconductor chip is to be mounted on the surface layer.

In step S20, as shown in FIG. 3, the condenser 60 surface-treated with a silane coupling agent is positioned in the cavity 11. The silane coupling agent may be included in the filling resin layer 20, but it is preferable to surface-treat the condenser 60 in advance.

In step S30, as shown in FIG. 5, the filling resin layer 20, which is a thermosetting resin, is laminated on the laminate 10 to fill the space between the capacitor 60 and the cavity 11. In the step S30, by applying a constant temperature and pressure, the filling resin layer 20 or the prepreg 40 is laminated while heating and curing. In this case, it is possible to prevent bubbles from being generated in the filling resin layer 20 or the prepreg 40 by heat curing in a vacuum state.

In step S40, as shown in FIG. 1, the prepreg 40 is stacked and the blind via hole 50 is formed to form the inner layer circuit 40. The prepreg 40 is heated and pressed together with the filling resin layer 20 to be stacked. The blind via hole 50 is drilled to the upper electrode 61 or the lower electrode 63 of the capacitor 60. Thereafter, if necessary, the remaining resin is removed by desmear or plasma treatment, and then the entire surface is copper plated, and the inner layer circuit 40 is formed on both surfaces. Then, if necessary, the surface of the conductor circuit is chemically treated by copper oxide black oxide treatment, CZ treatment by Mec Co., Ltd., and then prepreg, a copper foil with resin, or a semi-additive thermosetting resin composition is disposed on both sides of the multilayer printed circuit board. Make it.

In the step S50, as shown in FIG. 1, the permanent protective film 70 that protects the inner circuit 40 formed on the outermost layer is formed. The permanent protective film 70 may be formed by removing the fluororesin film after heating and pressing it at a predetermined temperature and pressure by placing the fluororesin film on the outside of the liquid crystal polyester resin composition sheet or the glass fiber fabric base BT resin preprene. have.

Hereinafter, by comparing the experimental example according to the embodiment of the present invention with the comparative example according to the prior art, the configuration and effects of the present invention in more detail.

Experimental Example 1

Electrodes were formed on the entire upper and lower surfaces, and a square capacitor having a width x length of 1 x 1 mm and a thickness of 0.2 mm was surface-treated with an epoxy silane coupling agent. And FR-5 type glass woven base material epoxy resin laminated board (trade name: E679F unclad board, Hitachi Chemical Co., Ltd.) which mix | blended silica of 0.3 mm of insulating layers is used as a laminated board. After drilling a cavity of 0.25 mm thicker than the capacitor with a router on the laminate, the capacitor is placed in the cavity, and the filler and prepreg of FR-5 type epoxy resin with 50 μm of silica is mixed on the front and back. 1 piece each of them, and then placed on both sides of the electrolytic copper foil having a thickness of 12㎛ on both sides, laminated molding for 90 minutes under a vacuum of 180 ℃, 25kgf / cm 3, 5mmHg or less by filling a thermosetting resin composition around the capacitor placed in the cavity A copper clad laminated board was produced.

Then, copper foil was etched on both sides of the double-sided copper-clad laminate, and the thickness was 3 μm. Then, a blind via hole having a diameter of 80 μm was punched to reach the internal capacitor by UV-YAG laser at about the same position, and copper plating was performed. Blind via holes were filled. Then, an inner layer circuit was formed on both sides through a circuit forming process, and CZ treatment of Mec Corporation was performed. Subsequently, a glass-woven silica-based silica-containing FR-5 type epoxy resin composition prepreg having a thickness of 40 µm was disposed on both surfaces, and an electrolytic copper foil layer having a thickness of 12 µm was disposed outside thereof, and the vacuum was 180 ° C., 25 kgf / cm 3, and 5 mm Hg or less. After laminating and bonding for 90 minutes, the copper foil thickness of the surface layer was etched to 3 μm, and the blind via holes having a diameter of 70 μm were drilled with UV-YAG laser on both sides, and the inside of the blind via holes was filled with copper plating to form a four-layer copper clad laminate. Produced.

After forming an inner layer circuit and performing CZ treatment on the surface of Mec, the liquid crystal polyester sheet (brand name: FA film, melting point 280 degreeC, Kraray Co., Ltd.) of 50 micrometers thick, and the electrolytic copper foil of 12 micrometers thick Cotton irregularities Rz: 1.7 mu m) were sequentially placed. Then, by laminating and molding for 10 minutes under a vacuum of 5 mmHg or less at a temperature of 295 ° C. and 25 kgf / cm 3, six copper clad laminates were produced. After dissolving the six-layer copper-clad laminate surface copper foil to 3 μm by etching, the blind via hole having a diameter of 70 μm was punched with a UV-YAG laser, and the inside of the hole was filled with copper plating to form an inner layer circuit on both sides.

After the CZ treatment of the inner circuit surface, a liquid crystal polyester resin composition sheet having a thickness of 25 μm having a melting point of 280 ° C. was disposed thereon for permanent protective coating thereon, and a fluorine resin film having a thickness of 50 μm was placed outside thereof at 295 ° C. , 25 kgf / cm 3 was heated and pressed for 10 minutes in a vacuum of 5 mmHg or less to form a permanent protective film on the surface layer. After that, the fluororesin film was peeled off, and then the permanent protective film of the noble metal plating was processed and removed by UV-YAG laser to form nickel and gold plating to form a permanent protective film. The semiconductor chip was flip-bond bonded to this surface, and the underfill resin was poured and hardened | cured, and the semiconductor package was produced. Before and after the reflow treatment of the multilayer printed circuit board fabricated as described above, the separation between the capacitor and the resin composition according to the temperature or the crack of the resin composition, the capacitance change rate, the migration resistance, and the transmission loss were measured. Indicated.

Experimental Example 2

In the BT resin laminated plate (trade name: CCL-HL832HS unclad plate, Mitsubishi Chemical Co., Ltd.) having a thickness of 0.30 mm, a cavity having a thickness of 0.25 mm deeper than the capacitor was formed with a router. And the electrode is formed on the front surface of the upper surface and the lower surface and the length and width of the capacitor of 1.6mm, 0.8mm and 0.20mm thickness, respectively, after treatment with epoxy silane coupling agent and placed in the cavity. Then, each of the filling resin layer and the prepreg formed of BT resin prepreg (GHPL-830LS, glass fiber woven fabric 0.03mm, Mitsubishi Chemical Co., Ltd.) having a thickness of 50 μm is disposed on the upper and lower surfaces of the laminated sheet, and then the outer sheet is disposed one by one. The electrolytic copper foil of 3 micrometers in thickness with the carrier copper foil of 35 micrometers in thickness was piled up, and it hardened | cured for 90 minutes in 190 degreeC, 30 kgf / cm <3>, and 5 mmHg or less in vacuum, and the double-sided copper clad laminated board was created.

After the carrier copper foil on the surface is peeled off, a through hole having a diameter of 100 μm is formed of a carbonate laser gas, and a blind via hole having a diameter of 80 μm is drilled to contact the internal condenser. At this time, the blind via hole is drilled at the same position around the condenser. Thereafter, the remaining resin was removed in a plasma apparatus, and 0.5 µm of electroless copper plating and 15 µm of electrolytic copper plating were attached to each other to form an inner layer circuit on both surfaces. Further, black acid copper oxide treatment was performed.

One BT resin prepreg is placed on each side of the substrate, and an electrolytic copper foil having a thickness of 3 μm with a carrier copper foil having a thickness of 35 μm is disposed on both sides of the substrate, and 90 ° under 190 ° C., 30 kgf / cm 3, and 5 mm Hg under vacuum. It cured for 4 minutes, and the 4-layer double-sided copper clad laminated board was produced. After peeling the carrier copper foil of 35㎛ attached to the four-layer double-sided copper clad laminate, and then perforated blind via hole of 50㎛ diameter by UV-YAG laser one by one, and attaching electroless copper plating 0.5㎛, electrolytic copper plating 15㎛, inner layer The circuit was formed to produce a four-layer printed circuit board.

After the CZ treatment of Mec Corporation on the surface of the four-layer printed circuit board, a glass fiber woven base material BT resin prepreg having a thickness of 50 μm was disposed on both sides thereof as a permanent protective film, and a 25 μm thick fluororesin film was placed on the outside thereof. The batch was cured for 90 minutes in a vacuum at 190 ° C., 30 kgf / cm 3, and 5 mmHg or less. After peeling off the fluororesin film, the lands for flip chip mounting and lands for solder ball connection were removed by UV-YAG laser, and nickel plated and gold plated were used to produce printed circuit boards.

In addition, the semiconductor chip was mounted by flip chip bonding, and the underfill resin was spilled and cured into a semiconductor package. Before and after the reflow treatment of the multilayer printed circuit board manufactured as described above, the condensation between the capacitor and the resin composition according to the temperature or the crack of the resin composition, the rate of change of capacitance, the migration resistance, and the transmission loss were measured. Indicated.

In comparison

In Experimental Example 1, a cavity was formed in the same manner using the same laminated plate having an insulation layer thickness of 0.30 mm. A capacitor having electrodes at both ends was placed in the cavity without any treatment on the surface. And it laminated | stacked twice on the surface using only semi-additive resin composition (brand name: ABF GX-13, Ajinomoto Co., Ltd.) as lamination resin composition. Both ends of the capacitor were connected with a blind via hole to fabricate a six-layer printed circuit board. Thereafter, a conventional UV selective thermosetting resist was applied and dried to have a thickness of 25 µm as a permanent protective coating to form a coating, and nickel plating and gold plating were performed.

Then, a semiconductor chip was fabricated by placing flip chip and pouring underfill resin. Before and after the reflow treatment of the multilayer printed circuit board manufactured as described above, the condensation between the capacitor and the resin composition according to the temperature or the crack of the resin composition, the rate of change of capacitance, the migration resistance, and the transmission loss were measured. Indicated.

Evaluation item Experimental Example 1 Experimental Example 2 Comparative Example 1 Bending and warping Before reflow (μm) <50 <50 <50 After reflow (μm) 67 55 401  Temperature cycle experiment Peeling Between Condenser and Resin Composition none none has exist Crack in Resin Composition none none has exist Hot oil cylcle experiment Peeling Between Condenser and Resin Composition none none has exist Crack in Resin Composition none none has exist Condenser Broken none none has exist  Capacity change rate (%) 3.5 2.6 Inability to measure  Migration resistance Steady state 5 × 10 ^ 13 6 × 10 ^ 13 5 × 10 ^ 13 200hrs 1 × 10 ^ 11 3 × 10 ^ 11 6 × 10 ^ 9 800hrs 7 × 10 ^ 9 2 × 10 ^ 10 <10 ^ 8  Transmission loss (at 25 GHz, dB) -3.4 -6.9 -25.3

How to measure

1. Printed circuit board is warped and distorted

36 printed circuit boards having a size of 30 × 30 mm were attached within a work size of 250 × 250 mm, and a multilayer printed circuit board having a capacitor was manufactured using the configuration of Experimental Example 1, Experimental Example 2, and Comparative Example. The printed circuit boards were individually separated and a 13 × 13 mm flip chip mounted in the center via reflow was placed on a table and the maximum value was measured by measuring warpage and distortion. Reflow temperature was 260 degreeC.

2 . Temperature cycle experiment

After 1000 cycles were repeated with 5 cycles at -55 ° C and 5 minutes at 150 ° C as one cycle, the test piece was taken out and the condenser portion was cut with a dicing saw. Thereafter, the cross section was observed under a microscope to observe peeling between the condenser and the resin composition and cracks of the resin composition itself.

3 . Hot oil cycle experiment

After dipping in oil at 260 ° C. for 10 seconds, the cycle left at room temperature for 30 seconds was used as one cycle, and repeated 150 cycles were observed for peeling between the condenser and the resin composition of the test piece and cracking and cracking of the resin composition itself. .

4. Capacity change rate

Using a picoammeter, the capacitance of the capacitor before and after the temperature cycle test was measured and the maximum value of the rate of change was recorded.

5. Ice resistance

In each experimental example and comparative example, 100 comb-shaped circuits having a line / space of 40/40 μm were fabricated on the most superficial layer and then connected to each other, and 85 ° C./85% RH / 100VDC was applied to measure insulation resistance between terminals.

6. Transmission loss

In the above experimental and comparative examples, the transmission loss at 25 GHz was measured in the outermost layer of the microstripline with an insulation layer thickness of 100 ± 15 μm, line width 220 ± 15 μm, line thickness 35 ± 5 μm and length 10 cm It was.

As can be seen in Table 1, it can be seen that the bending and distortion of Experimental Example 1 and Experimental Example 2 according to the present invention occurs less than the comparative example. In addition, the experimental examples did not cause peeling between the capacitor and the resin composition, cracks of the resin composition, and no cracking of the capacitor. In addition, it can be seen that the transmission loss occurred less than that of the comparative example. Therefore, the experimental examples according to the embodiment of the present invention can be seen that the reliability is excellent because there is no peeling between the capacitor and the resin composition and bending and distortion of the substrate does not occur.

Although the technical spirit of the present invention has been described in detail according to the above-described embodiments, the above-described embodiments are for the purpose of description and not of limitation, and a person of ordinary skill in the art will appreciate It will be understood that various embodiments are possible within the scope.

The present invention can achieve the following effects through the configuration as described above.

The present invention has the effect of providing a capacitor-embedded multilayer printed circuit board with excellent adhesion between the capacitor and the filling resin layer filling the capacitor and improving the reliability of the substrate, and a method of manufacturing the same.

The present invention can also provide an effect of providing a capacitor-embedded multilayer printed circuit board and a method for manufacturing the same, which are less warped or distorted by heat applied to the substrate forming process.

Claims (15)

A laminated plate having a cavity formed therein; A capacitor housed in the cavity and whose surface is treated with a silane coupling agent; A multilayer printed circuit board with a capacitor including a filling resin layer stacked while filling the capacitor and the cavity. The method of claim 1, The capacitor is a multilayer printed circuit board with a capacitor formed on the front and top of the capacitor. The method of claim 1, Wherein the coupling agent is an epoxy coupling agent is a capacitor embedded multilayer printed circuit board. The method of claim 1, The laminated plate or the filling resin layer is a capacitor embedded multilayer printed circuit board comprising a reinforcing substrate. The method of claim 1, And a plurality of inner layer circuits and prepregs sequentially formed in the filling resin layer and the laminated plate. The method of claim 5, And the capacitor and the inner layer circuit are electrically connected to each other by a blind via hole. The method of claim 6, The blind via hole is a multilayer printed circuit board with a capacitor formed at the same position on both sides of the printed circuit board. The method of claim 5, The prepreg is a multilayer printed circuit board with a capacitor including a reinforcing substrate. The method of claim 5, A multilayer printed circuit board with a capacitor having a permanent protective film formed on the inner circuit formed in the outermost layer. The method of claim 9, The permanent protective film is a multilayer printed circuit board with a capacitor including a reinforcing substrate. The method of claim 9, The permanent protective film is a capacitor embedded multilayer printed circuit board of the liquid crystal polyester resin composition. (A) forming a cavity in the laminate; (B) placing a condenser surface-treated with a silane coupling agent in the cavity; And laminating a thermosetting resin on the laminate to fill the space between the capacitor and the cavity. The method of claim 12, After completing step (c) The method of manufacturing a multilayer printed circuit board with a capacitor further comprising the step (d) of stacking prepregs and perforating blind via holes to form an inner layer circuit. The method of claim 13, After completing step (d), Method for manufacturing a printed circuit board with a capacitor further comprising the step (e) of forming a permanent protective film. The method of claim 13, A blind via hole for electrically connecting the capacitor and the plurality of inner layer circuit layers is formed at the same position on both sides of the printed circuit board.

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