KR20170077369A - Method for manufacturing radio wave absorption pattern utilizing printing technology - Google Patents
Method for manufacturing radio wave absorption pattern utilizing printing technology Download PDFInfo
- Publication number
- KR20170077369A KR20170077369A KR1020150187190A KR20150187190A KR20170077369A KR 20170077369 A KR20170077369 A KR 20170077369A KR 1020150187190 A KR1020150187190 A KR 1020150187190A KR 20150187190 A KR20150187190 A KR 20150187190A KR 20170077369 A KR20170077369 A KR 20170077369A
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- South Korea
- Prior art keywords
- radio wave
- wave absorption
- absorption pattern
- substrate
- printed
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q17/00—Devices for absorbing waves radiated from an antenna; Combinations of such devices with active antenna elements or systems
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
A method of manufacturing an electromagnetic wave absorption pattern using a printing technique according to an embodiment of the present invention includes the steps of designing an electromagnetic wave absorption pattern, printing conductive ink or magnetic ink on a substrate through a printing technique, And drying the printed radio wave absorbing pattern.
Description
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing an electromagnetic wave absorption pattern utilizing a printing technique.
Generally, the radio wave absorber is applied to the outermost surface of the object, and absorbs unwanted electromagnetic waves incident from the outside by corresponding to the incident waves with the highest priority.
2. Description of the Related Art [0002] Recently, there has been developed a radio wave induction technology such as a communication technology and an airplane, or a variety of electric and electronic devices such as a television, a radio and a cellular phone, In order to block high-frequency noise generated from unnecessary signals in a filter, a wave absorber wall, or a radio wave chamber, a radio wave absorber corresponding to each frequency band is required.
Especially, there is a need to develop an electronic product that requires the absorption of radio waves corresponding to a specific frequency, an information communication product (high pass system) that needs to solve the electromagnetic interference (EMI) problem, Etc.), the utilization of the radio wave absorber is increasing.
On the other hand, in manufacturing the radio wave absorption pattern of the radio wave absorber, a conductive material is coated on a substrate or the like using a photolithography process or coated on the entire surface using a coating process to produce a radio wave absorption pattern. Such a process requires a high cost, has a complicated process step, and can not form a radio wave absorption pattern on a material such as paper or fiber.
An object of the present invention is to provide a method of manufacturing an electromagnetic wave absorption pattern utilizing a printing technique which can be mass-produced at low cost by using a conductive ink or a magnetic ink and a printing technique and which forms a radio wave absorption pattern on a substrate of various materials.
Another object of the present invention is to provide a method of manufacturing a radio wave absorption pattern utilizing a printing technique for producing a radio wave absorbing pattern having various sheet resistances with one ink by controlling the printing thickness and the ink drying temperature by producing a radio wave absorbing pattern using a printing process .
According to an aspect of the present invention, there is provided a method of manufacturing an electromagnetic wave absorption pattern using a printing technique, the method comprising: designing an electromagnetic wave absorption pattern; printing conductive ink or magnetic ink on a substrate through a printing technique; Forming the radio wave absorption pattern on the substrate, and drying the printed radio wave absorption pattern.
In an embodiment, the printing technique comprises at least one of a relief plate, a screen, a flat plate, an ink jet, and a concave plate, wherein the conductive ink is selected from the group consisting of carbon black, graphite, carbon nano tube, graphene, , Cu, AgNW (silver nanowire) coated with Ag, Ni, Cu, Al, Ag or Si, and a conductive polymer.
In an embodiment, the substrate may include at least one of a polymer film, glass, paper and fiber to which the photolithography process is not applied.
In the embodiment, the step of printing the conductive ink or the magnetic ink on the substrate through the printing technique and forming the electromagnetic wave absorption pattern on the substrate may adjust the printing conditions including the printing pressure or the printing speed, And controlling the thickness or quality of the radio wave absorbing pattern on which the pattern is printed on the substrate.
In the embodiment, the step of drying the printed radio wave absorbing pattern may include adjusting the drying temperature of the printed radio wave absorbing pattern so that the thickness of the radio wave absorbing pattern printed on the substrate, the adhesion strength with the substrate, And controlling at least one or more of the at least one of the plurality of devices.
In the embodiment, the step of controlling the drying temperature of the printed radio wave absorption pattern to control the thickness of the radio wave absorption pattern to be printed on the substrate, the adhesion with the substrate and the sheet resistance characteristics may be performed by one of the conductive ink It is possible to control the sheet resistance so as to have a plurality of resistance values corresponding to the magnetic ink.
The effect of the method of manufacturing an electromagnetic wave absorption pattern utilizing the printing technique according to the present invention will be described as follows.
According to at least one of the embodiments of the present invention, it is possible to mass-produce the ink at a low cost by using the conductive ink or the magnetic ink and the printing technique, and to form the radio wave absorption pattern on the substrate of various materials.
In addition, according to at least one embodiment of the present invention, a radio wave absorption pattern having various sheet resistances with one ink can be produced by controlling the printing thickness and the ink drying temperature by making a radio wave absorption pattern using a printing process.
1 is a view showing a method of manufacturing an electromagnetic wave absorption pattern using a printing technique according to an embodiment of the present invention.
FIG. 2 is a diagram specifically showing a radio wave absorber formed through a method of manufacturing an electromagnetic wave absorption pattern using a printing technique according to an embodiment of the present invention.
Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings, wherein like reference numerals are used to designate identical or similar elements, and redundant description thereof will be omitted. The suffix "module" and " part "for the components used in the following description are given or mixed in consideration of ease of specification, and do not have their own meaning or role. In the following description of the embodiments of the present invention, a detailed description of related arts will be omitted when it is determined that the gist of the embodiments disclosed herein may be blurred. It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are intended to provide further explanation of the invention as claimed. , ≪ / RTI > equivalents, and alternatives.
Terms including ordinals, such as first, second, etc., may be used to describe various elements, but the elements are not limited to these terms. The terms are used only for the purpose of distinguishing one component from another.
It is to be understood that when an element is referred to as being "connected" or "connected" to another element, it may be directly connected or connected to the other element, . On the other hand, when an element is referred to as being "directly connected" or "directly connected" to another element, it should be understood that there are no other elements in between.
The singular expressions include plural expressions unless the context clearly dictates otherwise.
In the present application, the terms "comprises", "having", and the like are used to specify that a feature, a number, a step, an operation, an element, a component, But do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. It will be apparent to those skilled in the art that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof.
1 is a view showing a method of manufacturing an electromagnetic wave absorption pattern using a printing technique according to an embodiment of the present invention.
Referring to FIG. 1, the method of manufacturing an electromagnetic wave absorption pattern using a printing technique may include steps S110 to S150.
First, a radio wave absorption pattern can be designed (S110). Here, the designed radio wave absorption pattern can be designed in a regular lattice pattern. However, this regular lattice-like pattern is only one example included in the present invention, and the present invention includes an irregular lattice shape that is not a regular lattice shape, or a regular other shape is designed.
Thereafter, the radio wave absorption pattern designed in step S110 may be printed on the substrate using a printing technique (S130). Here, the radio wave absorbing pattern can be printed on the substrate through a printing process with a conductive ink or a magnetic ink.
Specifically, the conductive ink or the magnetic ink can be printed on the substrate through screen printing, gravure printing, and gravure off-set printing.
The conductive ink on which the substrate is printed may be carbon-based such as carbon black, graphite, carbon nano tube, graphene, carbon fiber, or a conductive metal powder such as Ag, Ni, Cu, Or a coated particle powder series such as Cu coated with Si, and at least one of AgNW (silver nanowire), CNT (carbon nano tube), graphene, and conductive polymer.
The substrate may include a polymer film and glass. Since the present invention utilizes a printing technique, a substrate including a paper and a fiber, which is a material to which a conventional photolithography process is not applied, May be included in the substrate. Here, the polymer film is formed of a synthetic resin such as polyethylene (PE), polyester (PET), polyimide (PI), polyethylene naphthalate (PEN), polyvinyl chloride (PVC) .
On the other hand, in the step S130 of printing the designed radio wave absorption pattern on the substrate using the printing technique, the printing conditions including the pressure (printing pressure) to be printed on the conductive ink or the magnetic ink Through this, the method of manufacturing an electromagnetic wave absorption pattern using the printing technique according to the present invention can arbitrarily control the thickness of the electromagnetic wave absorption pattern to be printed on the substrate or the quality to be printed.
Thereafter, the radio wave absorbing pattern printed in step S130 is dried to complete the manufacture of the radio wave absorbing pattern (S150).
Meanwhile, in the step of drying the printed radio wave absorbing pattern (S150), the drying temperature and the like of the printed radio wave absorbing pattern can be adjusted. Thus, the method of manufacturing the radio wave absorbing pattern using the printing technique according to the present invention The thickness of the radio wave absorption pattern to be printed, the adhesion force between the printed radio wave absorption pattern and the substrate, and the sheet resistance property of the pattern can be arbitrarily controlled.
Specifically, in order to absorb selective radio waves, a pattern having a specific sheet resistance (specific film thickness) must be realized. In the conventional photolithography process, a certain one sheet resistance (one film thickness ).
On the other hand, the method of manufacturing an electromagnetic wave absorption pattern using the printing technique according to the present invention is a method of manufacturing an electromagnetic wave absorption pattern by using printing technology, by controlling the printing thickness or the drying temperature of ink, It is possible to manufacture the radio wave absorbing pattern with a simple and low cost.
FIG. 2 is a diagram specifically showing a radio wave absorber formed through a method of manufacturing an electromagnetic wave absorption pattern using a printing technique according to an embodiment of the present invention.
Referring to FIG. 2, a radio wave absorber having a
The
As a result, the method of manufacturing an electromagnetic wave absorption pattern using the printing technique according to the present invention can mass-produce the electromagnetic wave absorption pattern at a low cost by using the conductive ink or the magnetic ink and the printing technique, and can form a radio wave absorption pattern on a substrate of various materials, It is possible to produce a radio wave absorption pattern having various sheet resistances with one ink by controlling the thickness and the ink drying temperature
Accordingly, the foregoing detailed description should not be construed in any way as limiting and should be considered illustrative. The scope of the present invention should be determined by rational interpretation of the appended claims, and all changes within the scope of equivalents of the present invention are included in the scope of the present invention.
Claims (6)
Printing conductive ink or magnetic ink on a substrate through a printing technique to form the radio wave absorption pattern on the substrate; And
And drying the printed radio wave absorption pattern.
The printing technique includes:
A concave plate, a convex plate, a screen, a flat plate, an ink jet, and a concave plate,
Wherein the conductive ink comprises:
At least one of Cu and AgNW (silver nanowire) coated with carbon black, graphite, carbon nano tube, graphene, carbon fiber, Ag, Ni, Cu, Al, Wherein the radio wave absorbing pattern is formed of a metal.
Wherein:
A method of manufacturing a radio wave absorption pattern utilizing a printing technique comprising at least one of a polymer film, glass, paper and fiber to which a photolithography process is not applied.
The step of printing the conductive ink or the magnetic ink on the substrate through the printing technique to form the radio wave absorption pattern on the substrate,
Controlling a printing condition including a printing pressure or a printing speed to control a thickness or a printed quality of the radio wave absorbing pattern on which the radio wave absorbing pattern is printed on the substrate, Way.
The step of drying the printed radio wave absorption pattern includes:
Controlling the drying temperature of the printed radio wave absorption pattern to control at least one of a thickness of the radio wave absorption pattern printed on the substrate, adhesion with the substrate and sheet resistance characteristics, / RTI >
Controlling the drying temperature of the printed radio wave absorption pattern to control the thickness of the radio wave absorption pattern printed on the substrate, the adhesion with the substrate and the sheet resistance characteristics,
Wherein the sheet resistance is controlled so as to have a plurality of resistance values corresponding to one of the conductive ink or the magnetic ink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020150187190A KR20170077369A (en) | 2015-12-28 | 2015-12-28 | Method for manufacturing radio wave absorption pattern utilizing printing technology |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020150187190A KR20170077369A (en) | 2015-12-28 | 2015-12-28 | Method for manufacturing radio wave absorption pattern utilizing printing technology |
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| KR20170077369A true KR20170077369A (en) | 2017-07-06 |
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| KR1020150187190A KR20170077369A (en) | 2015-12-28 | 2015-12-28 | Method for manufacturing radio wave absorption pattern utilizing printing technology |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107224973A (en) * | 2017-06-09 | 2017-10-03 | 安徽理工大学 | A kind of Cu2O/MWCNTs composites, preparation method and catalytic applications |
| CN107820337A (en) * | 2017-11-14 | 2018-03-20 | 杭州电子科技大学 | A kind of novel graphite alkene heating material |
| CN108666765A (en) * | 2018-04-28 | 2018-10-16 | 中国人民解放军军事科学院国防科技创新研究院 | A kind of adjustable absorbent structure of ultra-wideband microwave dynamic based on graphene |
| KR102050295B1 (en) | 2018-06-01 | 2019-12-02 | 한국과학기술연구원 | Method for manufacturing smart lends including 3-dimensionally patterned interconnects and the smart lends manufatured by the method |
| US11495889B2 (en) | 2019-01-25 | 2022-11-08 | Agency For Defense Development | Method of controlling dielectric constant of composite material by micro pattern printing |
| KR102483727B1 (en) * | 2021-07-07 | 2023-01-04 | 한국과학기술원 | Method for forming conductive pattern on dielectric fabric material and electromagnetic wave absorber including conductive pattern coupled to dielectric fabric material |
-
2015
- 2015-12-28 KR KR1020150187190A patent/KR20170077369A/en unknown
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107224973A (en) * | 2017-06-09 | 2017-10-03 | 安徽理工大学 | A kind of Cu2O/MWCNTs composites, preparation method and catalytic applications |
| CN107224973B (en) * | 2017-06-09 | 2020-07-21 | 安徽理工大学 | Cu2O/MWCNTs composite material, preparation method and catalytic application |
| CN107820337A (en) * | 2017-11-14 | 2018-03-20 | 杭州电子科技大学 | A kind of novel graphite alkene heating material |
| CN108666765A (en) * | 2018-04-28 | 2018-10-16 | 中国人民解放军军事科学院国防科技创新研究院 | A kind of adjustable absorbent structure of ultra-wideband microwave dynamic based on graphene |
| KR102050295B1 (en) | 2018-06-01 | 2019-12-02 | 한국과학기술연구원 | Method for manufacturing smart lends including 3-dimensionally patterned interconnects and the smart lends manufatured by the method |
| US11495889B2 (en) | 2019-01-25 | 2022-11-08 | Agency For Defense Development | Method of controlling dielectric constant of composite material by micro pattern printing |
| KR102483727B1 (en) * | 2021-07-07 | 2023-01-04 | 한국과학기술원 | Method for forming conductive pattern on dielectric fabric material and electromagnetic wave absorber including conductive pattern coupled to dielectric fabric material |
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