KR101718855B1 - Method of composite sheet for shielding electromagnetic wave and dissipating heat - Google Patents

Method of composite sheet for shielding electromagnetic wave and dissipating heat Download PDF

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Publication number
KR101718855B1
KR101718855B1 KR1020150100225A KR20150100225A KR101718855B1 KR 101718855 B1 KR101718855 B1 KR 101718855B1 KR 1020150100225 A KR1020150100225 A KR 1020150100225A KR 20150100225 A KR20150100225 A KR 20150100225A KR 101718855 B1 KR101718855 B1 KR 101718855B1
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KR
South Korea
Prior art keywords
ferrite
sheet
film
coating
sensitive adhesive
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Application number
KR1020150100225A
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Korean (ko)
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KR20170008981A (en
Inventor
박흥수
김제헌
이진우
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(주)인테코
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Priority to KR1020150100225A priority Critical patent/KR101718855B1/en
Publication of KR20170008981A publication Critical patent/KR20170008981A/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20472—Sheet interfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20472—Sheet interfaces
    • H05K7/20481—Sheet interfaces characterised by the material composition exhibiting specific thermal properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a composite sheet and a method of manufacturing the composite sheet. The adhesive sheet is coated on one surface of a heavy release film, a synthetic resin film is laminated on the adhesive layer, an adhesive layer is coated on one surface of the synthetic resin film, To form a double-sided pressure-sensitive adhesive sheet, peeling the lightly releasing film of the double-side pressure-sensitive adhesive sheet, laminating a graphite film thereon, and coating a ferrite on one surface of the heavy- The intermediate release film of the double-sided pressure-sensitive adhesive sheet is peeled off, and the ferrite sheet is laminated on the ferrite-coated surface so as to abut on the intermediate release film. Thus, Sheet can be provided.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a composite sheet for electromagnetic shielding and heat dissipation,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a composite sheet including a ferrite and / or a graphite sheet, and more particularly to a composite sheet which can shield electromagnetic waves and is excellent in heat dissipation, And a manufacturing method thereof.

2. Description of the Related Art [0002] Recently, as a mobile terminal market such as a smart phone has rapidly expanded, wireless communication modules such as an NFC (Near Field Communication) antenna, a Magnetic Secure Transmission device, and a wireless rechargeable battery have been widely used. However, as the wireless communication module is highly integrated and minimized, problems caused by heat generation or electromagnetic interference are also increasing.

In order to solve such problems, various technologies have been developed in recent years. For example, Korean Patent Laid-Open Publication No. 10-2014-0120142 (Patent Document 1) discloses an antenna array in which a portion corresponding to each of a plurality of antenna elements To an antenna device capable of normally operating each antenna element even if a swirling current is generated in a metal part by attaching a film that can prevent performance degradation of the antenna.

As another example, according to Korean Patent No. 10-1505017 (Patent Document 2), when the NFC antenna is mounted on a battery pack, the width of the frequency fluctuation is reduced, and a heat dissipation function is performed, A manufacturing method of an electromagnetic wave shielding sheet is proposed.

However, these conventional methods can not sufficiently secure both the electromagnetic wave shielding effect and the heat radiation effect, and the double-faced tape is often used to manufacture the composite sheet, and the manufacturing process is complicated. As a result, the cost is increased and the thickness of the sheet is increased.

Therefore, there is a need to develop a new composite sheet which further improves the existing performance and thickness and simplifies the manufacturing method.

Korean Patent Laid-Open Publication No. 10-2014-0120142 Korean Patent Registration No. 10-1505017

Disclosure of Invention Technical Problem [8] The present invention has been made to solve the problems of the conventional composite sheet and the manufacturing method thereof, and it is an object of the present invention to provide a composite sheet having excellent electromagnetic wave shielding and heat radiation effect, thin thickness and simple manufacturing method.

According to an aspect of the present invention, there is provided a method of manufacturing a composite sheet, including the steps of: coating a pressure-sensitive adhesive layer on one side of a heavy release film; laminating a synthetic resin film thereon; coating an adhesive layer on one side of the synthetic resin film; Forming a double-sided pressure-sensitive adhesive sheet by laminating a light-releasing release film thereon; Peeling off the lightly releasing film of the double-sided pressure-sensitive adhesive sheet and laminating a graphite film thereon; Forming a ferrite sheet by coating ferrite on one surface of the heavy release film; Separating the heavy-relieved release film of the double-sided pressure-sensitive adhesive sheet and laminating the ferrite sheet so that the ferrite-coated surface abuts on the peeled release film; peeling off the heavy-relieved release film of the ferrite sheet and printing a circuit pattern thereon ; Bonding an adhesive protective film onto the surface on which the circuit pattern is printed; Forming an additional double-sided pressure-sensitive adhesive sheet by coating a pressure-sensitive adhesive layer on one side of a heavy release film, coating a synthetic resin film thereon, coating an adhesive layer on one side of the synthetic resin film, and laminating a light- And separating the delaminated release film of the additional double-sided pressure-sensitive adhesive sheet and laminating it on one surface of the graphite film.

In the step of forming the ferrite sheet, a ferrite powder, a binder and a solvent may be stirred and dispersed, followed by defoaming to prepare a ferrite coating liquid.

The composite sheet produced by the method for producing a composite sheet described above comprises a graphite layer; A first synthetic resin layer laminated on the graphite layer through an adhesive layer; A ferrite layer laminated on the first synthetic resin layer through an adhesive layer; A circuit pattern layer printed on the ferrite layer; An adhesive protective layer laminated on the circuit pattern layer; A second synthetic resin layer interposed between the graphite layer and the adhesive layer; And a releasing film layer laminated on the second synthetic resin layer through an adhesive layer under the second synthetic resin layer.

According to the composite sheet of the present invention and its manufacturing method, the following effects can be expected.

First, by including both the ferrite layer and the graphite layer, the electromagnetic wave shielding effect and the heat radiation effect can be simultaneously exhibited.

Second, by minimizing the double-sided tape used to manufacture the composite sheet, the manufacturing process can be simplified and the thickness of the sheet can be reduced.

Third, by implementing a circuit pattern layer on a ferrite sheet by a direct roll type printing method, the process becomes simpler than the conventional method of joining a flexible printed circuit board (a flexible printed circuit board) and a ferrite sheet.

Fourth, since the entire process can be carried out by the roll method, it is possible to reduce raw material, improve workability, and improve productivity.

1 is a flow chart schematically showing a process procedure of a composite sheet manufacturing method according to an embodiment of the present invention.
2A to 2F are cross-sectional views illustrating a process of stacking a composite sheet according to an embodiment of the present invention.
3 is a cross-sectional view showing a method of manufacturing a pressure-sensitive adhesive composite sheet according to an embodiment of the present invention.
4A to 4C are cross-sectional views illustrating a composite sheet according to an embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

FIG. 1 is a flow chart showing a schematic process procedure of a method of manufacturing a composite sheet according to an embodiment of the present invention. FIG. 2 shows a process of stacking a composite sheet according to the manufacturing method of FIG.

As shown in FIG. 2A, the composite sheet of the present invention first forms a double-sided pressure-sensitive adhesive sheet 100 having both of the both surfaces thereof as adhesive surfaces (Step 10).

In the double-sided pressure-sensitive adhesive sheet 100, an adhesive layer 120 is first coated on one side of a heavy release film 110, and a synthetic resin film 130 is laminated thereon. Polyethylene (PE), polypropylene (PP), polyethylene terephthalate (PET), polyimide (PI) and the like are used as the synthetic resin film 130, but polyethylene terephthalate (PET) is most preferably used. Next, another adhesive layer 140 is coated on the synthetic resin film 130, and the lightly peelable release film 150 is laminated on the adhesive layer 140 to complete the double-sided adhesive sheet 100.

The use of the heavy-weight releasing film 110 and the light-releasing releasing film 150 in the double-faced pressure-sensitive adhesive sheet 100 according to the present invention by differentiating the releasing force of the releasing film from the peel- So that the release film on the other side can not be easily peeled off. That is, when the double-sided pressure-sensitive adhesive sheet described above is laminated with the graphite sheet at a later time, the lightly peeled portion is removed and laminated. At this time, if both sides are made of a lightly peelable film, the both sides may peel off at once. Therefore, by discriminating the peeling force of the release film from the double-sided pressure-sensitive adhesive sheet 100, such a problem can be prevented.

The coating of the adhesive layers 120 and 140 may be performed using a known coating method such as Micro Gravure, Comma, Slot Die and Knife, Drying is performed. The coating solution is prepared by stirring the adhesive agent and the solvent and defoaming the solution.

Next, as shown in Fig. 2B, the graphite film 200 is joined to the double-faced pressure-sensitive adhesive sheet 100 produced as described above (step 20).

Concretely, the lightly-peelable release film 150 of the double-sided pressure-sensitive adhesive sheet 100 is peeled off, and the graphite film 200 is joined to the release film 150. Since the graphite is a material having excellent heat dissipation property, an excellent heat radiation effect is exhibited by laminating the graphite film 200.

Next, as shown in FIG. 2C, the ferrite 320 is coated on one surface of the heavy release film 310 to form the ferrite sheet 300 (step 30). The ferrite sheet 300 serves to prevent electromagnetic interference such as an eddy current generated in an integrated circuit from affecting other components.

As with the coating of the adhesive layers 120 and 140, the coating of the ferrite 320 can be performed using microgravure, comma, slot die, knife, or the like, and hot air drying is performed after coating. The coating solution is prepared by stirring and dispersing a ferrite powder, a binder and a solvent, followed by degassing and coagulating.

Next, as shown in Fig. 2D, the ferrite sheet 300 is joined to the double-sided pressure-sensitive adhesive sheet 100 in which the graphite film 200 is joined (step 40).

Concretely, the ferrite sheet 300 is joined to the ferrite-coated surface 320 while contacting the ferrite-coated surface 320 while peeling off the heavy-relieved film 110 of the double-sided pressure-sensitive adhesive sheet 100.

Through the above-described steps 10 to 40, a simple composite sheet (A) comprising a graphite layer and a ferrite layer is completed. Hereinafter, a process of additionally attaching a circuit pattern such as an integrated circuit to such a simple composite sheet (A) will be described.

First, as shown in Fig. 2E, a circuit pattern 400 is formed on the simple composite sheet (A) (step 50).

Concretely, the circuit pattern 400 is formed thereon by the printing method while peeling off the heavy release film 310 of the ferrite sheet 300. As a method of printing the circuit pattern 400, known printing methods such as gravure printing, screen printing, inkjet printing, dispensing printing and offset printing can be used, and hot air drying is performed after printing. As the conductive paste used for printing, materials such as Ag, CNT, graphene, and conductive polymer can be used.

By implementing the circuit pattern through direct roll type printing on the ferrite sheet 300 in this manner, the process becomes simpler than the conventional method in which the ferrite sheet is laminated after implementing the circuit pattern on the flexible printed circuit board (FPCB).

Next, as shown in Fig. 2F, the adhesive protective film 500 is laminated on the circuit pattern 400 (step 60).

That is, the protective film 500 having adhesiveness is attached to the surface on which the circuit pattern 400 is printed to protect the circuit pattern 400.

Through the above-described steps 10 to 60, the basic composite sheet B including the graphite layer and the ferrite layer and printed with the circuit pattern is completed.

On the other hand, a double-sided pressure-sensitive adhesive sheet can be added to the above basic type composite sheet B to generate a pressure-sensitive adhesive composite sheet C which can be easily attached to a wireless communication module. The production method thereof is shown in Fig.

As shown in Fig. 3, by adhering the double-sided adhesive sheet 100 to the basic composite sheet B of Fig. 2F while peeling the lightly peelable release film 150 of the double-sided adhesive sheet 100 of Fig. The composite sheet C can be formed. Such a pressure-sensitive adhesive composite sheet (C) can be attached immediately after removing the heavy release film (110), so that it can be easily and conveniently applied to a wireless device or the like.

As described above, various types of composite sheets can be manufactured by the manufacturing method according to the embodiment of the present invention, which is shown again in FIG.

First, as shown in FIG. 4A, according to the steps 10 to 40, the synthetic resin layer interposed between the graphite layer and the graphite layer via the adhesive layer, and the synthetic resin layer interposed between the graphite layer and the graphite layer, A simple composite sheet (A) comprising a ferrite layer and a release film formed on a ferrite layer can be produced.

Further, as shown in FIG. 4B, according to the steps 10 to 60, the synthetic resin layer interposed between the graphite layer and the graphite layer via the adhesive layer, the ferrite layer interposed between the synthetic resin layer and the adhesive layer via the adhesive layer, A basic composite sheet (B) including an adhesive protective layer laminated on the circuit pattern layer and the circuit pattern layer can be produced.

As shown in Fig. 4C, according to the steps 10 to 70, the first synthetic resin layer laminated on the graphite layer and the graphite layer through the adhesive layer, the ferrite layer laminated on the first synthetic resin layer through the adhesive layer, A circuit pattern layer printed on the ferrite layer, a pressure-sensitive adhesive protective layer laminated on the circuit pattern layer, a second synthetic resin layer interposed between the graphite layer and the pressure-sensitive adhesive layer, and a releasable film (C) can be produced.

The composite sheet according to the embodiment of the present invention and its manufacturing method can exhibit an excellent electromagnetic shielding and heat radiation effect when applied to a wireless communication module such as an NFC antenna, a magnetic security transmission device, and a wireless rechargeable battery. Further, if necessary, it can be easily applied to many electronic devices other than the wireless communication module.

While the present invention has been described with reference to the preferred embodiments described above and the accompanying drawings, it is to be understood that the invention may be embodied in different forms without departing from the spirit or scope of the invention. Accordingly, the scope of the present invention is defined by the appended claims, and is not to be construed as limited to the specific embodiments described herein.

100: double-sided pressure-sensitive adhesive sheet 110: heavy release film
120, 140: adhesive layer 130: synthetic resin film
150: light-releasing release film 200: graphite film
300: ferrite sheet 310: release film
320: Ferrite 400: Circuit pattern
500: Adhesion protective film

Claims (10)

Forming a double-sided pressure-sensitive adhesive sheet by coating a pressure-sensitive adhesive layer on one surface of a heavy release film, coating a synthetic resin film thereon, coating an adhesive layer on one surface of the synthetic resin film, and laminating a light-
Peeling off the lightly releasing film of the double-sided pressure-sensitive adhesive sheet and laminating a graphite film thereon;
Forming a ferrite sheet by coating ferrite on one surface of the heavy release film; And
Peeling off the heavy-relieved release film of the double-sided pressure-sensitive adhesive sheet, and laminating the ferrite sheet so that the ferrite-coated surface is in contact therewith,
Peeling off the heavy-relieved film of the ferrite sheet, and printing a circuit pattern thereon through roll-type printing; And
Further comprising laminating an adhesive protective film on the surface on which the circuit pattern is printed,
Forming an additional double-sided pressure-sensitive adhesive sheet by coating a pressure-sensitive adhesive layer on one side of a heavy release film, coating a synthetic resin film thereon, coating an adhesive layer on one side of the synthetic resin film, and laminating a light- And
Peeling off the delamination release film of the additional double-sided pressure-sensitive adhesive sheet and laminating it on one surface of the graphite film,
Wherein all the process steps are performed by a roll process.
delete delete The method according to claim 1,
Wherein the step of forming the ferrite sheet comprises stirring and dispersing a ferrite powder, a binder and a solvent, followed by defoaming to prepare a ferrite coating solution.
The method according to claim 1,
The coating of the adhesive layer and the coating of the ferrite may be carried out using any one of micro gravure, comma, slot die and knife coating methods, By weight based on the total weight of the composite sheet.
The method according to claim 1,
Wherein the synthetic resin film is polyethylene terephthalate (PET).
The method according to claim 1,
Wherein the step of printing the circuit pattern uses one of gravure printing, screen printing, inkjet printing, dispensing printing, and offset printing, and performing hot air drying. delete delete delete
KR1020150100225A 2015-07-15 2015-07-15 Method of composite sheet for shielding electromagnetic wave and dissipating heat KR101718855B1 (en)

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Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2682048B1 (en) * 2017-03-15 2019-06-26 Desarrollos Agricolas Febesa S L PROCEDURE OF IMPLEMENTATION OF CHIP WIRELESS TO AN OBJECT
KR102104044B1 (en) * 2017-05-02 2020-04-23 주식회사 에이디플러스 Compressed heat dissipation sheet
US11355687B2 (en) 2017-08-21 2022-06-07 Hag Mo Kim Graphite-laminated chip-on-film-type semiconductor package having improved heat dissipation and electromagnetic wave shielding functions

Citations (2)

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Publication number Priority date Publication date Assignee Title
KR101342660B1 (en) * 2011-11-30 2013-12-19 김정훈 Shield film of electromagnetic wave
KR101510301B1 (en) * 2014-01-07 2015-04-08 주식회사 이엠따블유 Adhesive sheet for preparing the ferrite sheet complex

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Publication number Priority date Publication date Assignee Title
KR101716344B1 (en) * 2011-06-28 2017-03-15 조인셋 주식회사 Ferrite Sheet Assembly and Method for making the same
KR20110099190A (en) * 2011-07-13 2011-09-07 장동원 Graphene graphite sheet, utilizing the mobile telecommunications technology for mobile phones, and how the heat utilization technology
KR101505017B1 (en) 2012-10-11 2015-03-24 주식회사 아모텍 Electromagnetic shielding sheet for antenna, and munufacturing method thereof, and antenna comprising the same, and battery pack comprising the antenna
KR20140120142A (en) 2013-04-02 2014-10-13 주식회사 아이엠텍 Antenna apparatus and method manufacturing the same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101342660B1 (en) * 2011-11-30 2013-12-19 김정훈 Shield film of electromagnetic wave
KR101510301B1 (en) * 2014-01-07 2015-04-08 주식회사 이엠따블유 Adhesive sheet for preparing the ferrite sheet complex

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