CN101346043B - Method for manufacturing flexible printed circuit board and metallic wiring pattern of flexible printed circuit board using thereof - Google Patents
Method for manufacturing flexible printed circuit board and metallic wiring pattern of flexible printed circuit board using thereof Download PDFInfo
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- CN101346043B CN101346043B CN200710152135XA CN200710152135A CN101346043B CN 101346043 B CN101346043 B CN 101346043B CN 200710152135X A CN200710152135X A CN 200710152135XA CN 200710152135 A CN200710152135 A CN 200710152135A CN 101346043 B CN101346043 B CN 101346043B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/064—Photoresists
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention relates to a method for manufacturing flexible printing circuit board by half addition style, and the flexible printing circuit board metal wiring pattern manufactured therefor. The metal wiring pattern of flexible printing circuit board for tape carrier semiconductor package is formed on insulation sheet and takes on multiple stripe appearance. At least one surface of the insulation sheet is plated orderly with a first clad layer- a copper layer, a second clad layer- nickel layer, a third clad layer- gold layer, the second clad layer and the third clad layer wraps upper surfaceand side surface of the first clad layer. The invention also discloses a method for manufacturing single-sided and double-faced printing circuit board for manufacturing the wiring pattern.
Description
Technical field
Along with electronic equipment gradually toward the development of directions such as light weight slimming, high performance, densification, need circuit board not only frivolous but also that be convenient to install recently day by day.And existing printed circuit board (PCB) is difficult to be configured on the miniaturized electronics because the hardness of its substrate itself is excessive, moreover also has the big problem of weight.Owing to this reason, what receive much attention recently is flexible printed wiring board (Flexible Printed Circuit Board, band carrier semiconductor packages FPCB) that adopts the flexibility excellence.
This flexible printed wiring board is a kind ofly to be made of copper film and resin molding, not only thin the but also flexual printed panel of tool.It is former to be used as military supplies purposes exploitation such as guided missile, be used in automatic focusing video camera consumer electronic devices such as (auto focus camera) afterwards, and taking this as an opportunity, because characteristics such as its light weight and pliability, be widely used in various electronic equipments, have recently that many flexible printed wiring boards are applied in around the liquid crystal of optical read head (pick-up), mobile phone, printer, digital camera of DVD devices such as (Digital Versatile Disc), articulated section parts such as (hinge).
Above-mentioned flexible printed wiring board can be divided into single-clad board and double-sided printed-circuit board, and the former covers Copper Foil and forms circuit on certain one side of dielectric polyimide film, be the most basic structure of flexible printed wiring board; The latter all covers Copper Foil and the structure that forms circuit on the upper and lower surface of dielectric polyimide film.And therefore the latter when installation elements, can improve the packing density of element because its upper and lower surface all can be provided with pad (land) under identical size.Yet double-sided printed-circuit board is owing to need to connect pattern on the polyimide film upper and lower surface, therefore need carry out punch out step and the hole treatment step is the copper facing step.And this is unnecessary on single-clad board.
Particularly, according to application technology and applying portion difference, described flexible printed wiring board is also just different to the requirement of copper film.For example along with needing the membrane of flip chip (COF of retrofit, ChipOn Film or Chip On Flexible) application in the technology, perhaps along with the bendability to the hingeline (hinge cable) that constitutes one with the multi-layer soft substrate require strict day by day, described flexible printed wiring board is also just more and more stricter to the requirement of copper film characteristic.
Background technology
At first have a look the wiring pattern generation type of single face flexible printed wiring board.As shown in Figure 4, the soft semiconductor substrate of COF in the past is the polyimide film that is coated with copper film by utilization, and utilization subtracts (Subtractive) mode to make.Specifically, as shown in Figure 4, this mode in the past is at first at raw material insulating trip 1) one side on be coated with flexible copper foil laminated plates (the Flexible Copper-Clad laminated board of copper film 2, FCCL) go up coating photoresist 3, and then with after its exposure, developing, to in the copper film 2 except that be formed with circuit pattern part 3 ' other exposed portions carry out etching, then remove residual photoresist 3 ', carry out the ending evaporation at last.
Yet, owing to need etched copper film 2 thicker, therefore not only can lose copper material greatly in the etching step, especially also can cause bad pattern.That is to say that sticking closing (Puddling) phenomenon owing in the etching process can make between adjacent circuit pattern to interconnect, thereby reduce the electric insulation impedance between circuit, therefore be difficult to form away the high-density circuit that distance between centers of tracks is 10-50 μ m (FINEPITCH).
In order to address the above problem, the present inventor once proposed a kind of manufacture method (Korean Patent 10-0691336 number) of flexible printed wiring board.This method becomes (Semi-additive) mode to replace the above-mentioned mode that subtracts into by soft etching or false add, and makes circuit board by the mode of single face lamination pattern when forming wiring pattern.
As shown in Figure 5, the above-mentioned false add that utilizes becomes (Semi-additive) mode to make the method for single face flexible printed wiring board, comprises the step (S60 and S70) of the step (S10) that insulating trip is provided, the step (S20) of evaporation conductive layer, the step (S30 to S50) that forms positive needle drawing case, lamination pattern, the step (S80) and the etching step (S90) of removal photoresist.Said method is specific as follows:
At first, preparing thickness as raw material is that the polyimide insulative sheet 10 of 25 μ m (is the step that insulating trip is provided, S10).For the ease of on insulating trip 10, carrying out copper electroplating layer step described later (S60), and in order to improve the cementability of 10 of copper layer 22 and described insulating trips, on described insulating trip 10 evaporation thickness be conducting metals such as the copper of 0.1-0.5 μ m or copper alloy with form conductive layer 21 (step of evaporation conductive layer, S20).
The step (S30 to S50) that forms positive needle drawing case is to apply photoresist 50 (S30) in the step (S20) of above-mentioned evaporation conductive layer on the formed conductive layer 21, and lay light shield 60 thereon, after scheduled time exposure (S40), remove light shield 60, and impose development (S50) step and finish.
After finishing the step (S30 is to S50) of above-mentioned formation sun needle drawing case, coated photoresist 50 will form the positive needle drawing case 50 of being scheduled to ' the reach conductive layer 21 that cloudy needle drawing case promptly appears.
The step of lamination pattern (S60 is to S70) is to become (semi-additive) evaporation mode to carry out by false add, and it is at the i.e. lamination metal on cloudy needle drawing case part of the part that does not form positive needle drawing case 50 '.
At first, utilize the copper plating step, copper facing on the conductive layer 21 that appears and form first coating 20 (S60), nickel plating thereon afterwards and form second coating 30, then gold-plated thereon (Au) and form i.e. the 3rd coating 40 of outermost layer, thus wiring pattern (S70) finished.
Described second coating 30 is used to prevent the corrosion of wiring pattern and the diffusion of lower metal; the 3rd coating 40 then is used to improve the cementability of chip, and comes the protecting cloth line pattern to avoid the erosion of etching solution as resist layer in etching step described later (S90).
Thereafter operation is for removing the step (S80) and the etching step (S90) of photoresist, in this two procedures, remove the photoresist layer (S80) that constitutes positive needle drawing case 50 ', and, remove residual conductive layer 21 by soft etching mode, to form the single face flexible printed wiring board of expection.
Above-mentioned manufacture method can reduce to greatest extent in the prior art owing to use the thick conductive layer of 6-8 μ m produce sticking phenomenon of closing in etching step (S90), and the while can also be saved the copper resource.
If but adopt this mode, and first coating 20 of the formed wiring pattern of mode by the lamination pattern is that the copper layer will be exposed in the air, if therefore form behind the wiring pattern long preservation under this state, this layer is with oxidized and corrode.
In addition, also there are some problems in the formation of copper film.The method that is coated with metal conducting layer 21 on insulating trip 10 roughly has spraying plating (sputtering), casting mold (casting), lamination modes such as (lamination), wherein spraying plating mode is regarded as can ensure height peel strength (peel strength), and the effective method that can form minuteness space because size (dimension) is stable, therefore all adopted the spraying plating mode in foregoing invention and existing flexible printer circuit manufacturing process.
Yet, though in Fig. 5, do not represent, adopt in order to form copper film under the situation of spraying plating mode, the problem that peel strength descends when preventing that directly spraying plating forms copper film on insulating trip 10, as shown in Figure 6, before spraying plating forms copper layer 21, must be pre-formed nichrome layer 21 ' with as inculating crystal layer (seed layer) or precoated shet (tie-coating layer).
As shown in Figure 6 because this inculating crystal layer 21 ' existence, in subsequent handling, need through extra inculating crystal layer etching step (S91), and use expensive etching solution the soft etching step (S90) of copper layer.Especially; when forming spacing between wiring pattern and promptly walk distance between centers of tracks (pitch) for the high density patterns of 10-50 μ m; even if through inculating crystal layer etching step (S91); inculating crystal layer 21 ' do not finish situation about divesting usually can take place; thereby cause the problem that the electric insulation impedance descends between circuit, this can have a strong impact on the qualification rate of product.
Summary of the invention
The present invention proposes in view of the above problems, its purpose is to provide a kind of manufacture method of printed circuit board (PCB), this method can suppress puddling phenomenon, can be easy to form ultra-fine circuit pattern, can also reduce etch quantity to greatest extent, improving the problems such as waste of environmental issue and copper resource, and then reduce expenses.
Another object of the present invention is to provide the manufacture method of a kind of single face and two-sided flexible printed circuit board, and a kind of metal line pattern with oxidation-resisting structure is provided.It can prevent first coating of wiring pattern, and is oxidized when promptly the copper layer is taken care of under the medium-term and long-term exposed state of air.
Another object of the present invention is to provide a kind of simplifying working process, and the good manufacture method of economy.It can omit in the prior art the inculating crystal layer etching step that must carry out owing to adopt the spraying plating mode when forming copper foil laminates.
Another object of the present invention is to provide a kind of manufacture method.It can be eliminated owing to residual inculating crystal layer, the possibility that the electric insulation impedance descends, and can improve product percent of pass.
Another object of the present invention is to provide a kind of product percent of pass height, and the manufacture method of the single face of good reliability and double-sided printed-circuit board.It forms the thin metal conductive layer that thickness is 1-4 μ m by the casting mold mode.
In order to achieve the above object, the manufacture method that is used to the single face flexible printed wiring board of carrier semiconductor packages of the present invention comprises:
The step of flexible copper foil laminated plates is provided,, thereby provides the flexible copper foil laminated plates at the one side formation metal conducting layer of insulating trip;
Form the step of positive needle drawing case, in the described step that the flexible copper foil laminated plates is provided, impose exposure on the formed metal conducting layer behind the coating photoresist and develop, carve circuit pattern thereby on described metal conducting layer, form sun;
Form the step of first coating,, on through the metal conducting layer that step exposed of the positive needle drawing case of described formation, further form first coating by the copper facing mode;
Remove the step of photoresist, remove formed photoresist sun needle drawing case in the step of the positive needle drawing case of described formation;
Etching step is removed in the described metal conducting layer institute's exposed portions except that first coating by soft etching mode; And
The step of lamination pattern forms second coating in the nickel plating mode on described first coating, and forms the 3rd coating in gold-plated (Au) mode on described second coating, thus lamination wiring pattern successively.
Wherein, in order to omit in the prior art the inculating crystal layer etching step that must carry out owing to take the spraying plating mode, thereby form reliable wiring pattern, the described step of flexible copper foil laminated plates that provides is preferably carried out by the casting mold mode, it is that the metal conducting layer side of 1-4 μ m is provided with mould at thickness, and carries out drying and cure process behind the insulating material of coated with melted on the described metal conducting layer.
In addition, the inculating crystal layer etching step that must carry out owing to take the spraying plating mode in order to omit in the prior art, thus forming reliable wiring pattern, the manufacture method that is used to the single face flexible printed wiring board of carrier semiconductor packages of the present invention comprises:
The step of flexible copper foil laminated plates is provided,, thereby provides the flexible copper foil laminated plates at the one side formation metal conducting layer of insulating trip;
Form the step of positive needle drawing case, in the described step that the flexible copper foil laminated plates is provided, impose exposure on the formed metal conducting layer behind the coating photoresist and develop, carve circuit pattern thereby on described metal conducting layer, form sun;
Form the step of first coating, utilize the copper facing mode, on by the metal conducting layer that step exposed of the positive needle drawing case of described formation, further form first coating;
The step of lamination pattern is utilized the nickel plating mode, forms second coating on described first coating, and utilizes gold-plated mode, forms the 3rd coating on described second coating, thus lamination wiring pattern successively;
Remove the step of photoresist, remove formed photoresist sun needle drawing case in the step of the positive needle drawing case of described formation; And
Etching step is removed in the metal conducting layer institute's exposed portions except that described first coating by soft etching mode, wherein,
The described step of flexible copper foil laminated plates that provides is finished by the casting mold mode, and it is that the metal conducting layer side of 1-4 μ m is provided with mould at thickness, and carries out drying and cure process behind the insulating material of coated with melted on the described metal conducting layer.
Wherein, the preferred thickness of described first coating is 5-12 μ m, can bring into play best characteristic like this.
In addition, as the preferred version that prevents that first coating is oxidized, the manufacture method that is used to the two-sided flexible printed circuit board of carrier semiconductor packages of the present invention comprises:
Punch out step is provided with via on the flexible copper foil laminated plates that the conductive layer by insulating trip and two sides thereof constitutes;
The step of coating hole by the spraying plating mode, forms the copper layer applying described via, and electrically connects the upper and lower surface of described flexible copper foil laminated plates in view of the above on the described flexible copper foil laminated plates that is provided with via;
Form the step of positive needle drawing case, at described flexible copper foil laminated plates two sides coating photoresist, thereby and impose exposure and develop and form sun and carve circuit pattern;
Form the step of first coating, utilize the copper facing mode, on by the two sides conductive layer that step exposed of the positive needle drawing case of described formation, further form first coating;
Remove the step of photoresist, remove formed photoresist sun needle drawing case in the step of the positive needle drawing case of described formation;
Etching step utilizes soft etching mode to remove in the described metal conducting layer institute's exposed portions except that first coating; And
The step of lamination pattern forms second coating in the nickel plating mode on described first coating, and forms the 3rd coating in gold-plated (Au) mode on described second coating, thus lamination wiring pattern successively.
Wherein, in order to omit the inculating crystal layer etching step that to carry out owing to adopt the spraying plating mode in the prior art, thereby form reliable wiring pattern, the described step of flexible copper foil laminated plates that provides is preferably finished by the casting mold mode, it is that the first metal conducting layer side of 1-4 μ m is provided with mould at thickness, and on described metal conducting layer the insulating material of coated with melted, and lamination thickness is the dry and described insulating material that hardens behind second metal conducting layer of 1-4 μ m thereon.
In addition, the inculating crystal layer etching step that must carry out owing to take the spraying plating mode in order to omit in the prior art, thus forming reliable wiring pattern, the manufacture method that is used to the two-sided flexible printed circuit board of carrier semiconductor packages of the present invention comprises:
Punch out step is provided with via on the flexible copper foil laminated plates that is made of the conductive layer on insulating trip and the two sides thereof;
The step of coating hole by the spraying plating mode, forms the copper layer applying described via, and electrically connects the upper and lower surface of described flexible copper foil laminated plates in view of the above on the described flexible copper foil laminated plates that is provided with via;
Form the step of positive needle drawing case, on described flexible copper foil laminated plates two sides, apply photoresist, and impose exposure and develop formation sun circuit pattern at quarter;
Form the step of first coating,, on by the two sides conductive layer that step exposed of the positive needle drawing case of described formation, further form first coating by the copper facing mode;
The step of lamination pattern forms second coating in the nickel plating mode on described first coating, and forms the 3rd coating in gold-plated mode on described second coating, thus lamination wiring pattern successively;
Remove the step of photoresist, remove formed photoresist sun needle drawing case in the step of the positive needle drawing case of described formation; And
Etching step is removed in the metal conducting layer institute's exposed portions except that described first coating by soft etching mode, wherein,
The described step of flexible copper foil laminated plates that provides is finished by the casting mold mode, it is that the first metal conducting layer side of 1-4 μ m is provided with mould at thickness, and on described metal conducting layer the insulating material of coated with melted, and lamination thickness is the dry and described insulating material that hardens behind second metal conducting layer of 1-4 μ m thereon.
Wherein, the preferred thickness of described first coating is 5-12 μ m, can bring into play best characteristic like this.
In addition, in order to prevent the oxidation of metal line pattern, the metal line pattern that is used to the flexible printed wiring board of carrier semiconductor packages of the present invention, preferably on the one side at least of insulating trip, set gradually copper layer, nickel dam and gold layer with respectively as first coating, second coating and the 3rd coating, and described second coating and the 3rd the coating top and side of wrapping up described first coating.
The manufacture method of flexible printed wiring board of the present invention, can suppress to adopt the puddling phenomenon that occurs in the processing procedure of flexible printed wiring board of etching mode in the past, thereby can form ultra tiny circuit pattern easily, can also reduce etch quantity to greatest extent, improving the problems such as waste of environmental issue and copper resource, and then reduce expenses.
Can provide the manufacture method of single or double flexible printed wiring board by the present invention, and the pattern of the metal line with oxidation-resisting structure can be provided.It can prevent that first coating of wiring pattern is oxidized when being the copper layer medium-term and long-term exposure of air and by keeping.
Can provide economy good manufacture method by the present invention, it is when forming copper foil laminates, can be omitted in the inculating crystal layer etching step that must carry out under the spraying plating mode in the past, thereby simplify working process, and can prevent the problem that the electric insulation impedance descends owing to residual inculating crystal layer.
The manufacture method of the single face and the double-sided printed-circuit board of good reliability can also be provided by the present invention in addition.It forms the thin metal conductive layer that thickness is 1-4 μ m by the casting mold mode.
Description of drawings
Fig. 1 is the manufacture method flow chart of the related single face flexible printed wiring board of embodiments of the present invention 1.
Fig. 2 is the manufacture method schematic diagram of the flexible copper foil laminated plates (FCCL) of the related flexible printed wiring board of embodiments of the present invention 2.
Fig. 3 is the manufacture method flow chart of the related two-sided flexible printed circuit board of embodiments of the present invention 3.
Fig. 4 is the manufacture method flow chart of existing single face flexible printed wiring board.
Fig. 5 is the manufacture method flow chart of existing single face flexible printed wiring board.
Fig. 6 is the existing flexible copper foil Manufacturing Methods of Build-up PCB flow chart that utilizes the spraying plating mode performed.
Embodiment
Below in conjunction with accompanying drawing, describe the structure and the effect of flexible printed wiring board of the present invention in detail.
Fig. 1 is the single face flexible printed wiring board manufacture method flow chart according to embodiment of the present invention 1.
As shown in Figure 1, be broadly divided into step (S60), the etching step (S70) of step (S10), the step (S20 is to S40) that forms pattern that insulating trip is provided, the step (S50) that forms first coating, removal photoresist, the step (S80) of lamination pattern according to the manufacture method of the single face flexible printed wiring board of embodiment of the present invention 1.
Specifically, by casting mold or spraying method, on insulating trip 10, attach metal conducting layer 21 such as copper to make single face flexible copper foil layer (FCCL) (S10), after then applying photoresist 50 (S20) thereon, lay light shield 60 thereon and impose exposure (S30) and development (S40), copper facing and form copper layer 22 on the metal conducting layer 21 that exposes afterwards, and form first coating 20 (S50) that constitutes by metal conducting layer 21 and copper layer 22 in view of the above, then remove residual, and constitute the photoresist (S60) of positive needle drawing case 50 ', then remove the part (S70) except that lamination has described first coating 20 in the conductive layer 21 by soft etching mode, and by galvanoplastic lamination second coating 30 and the 3rd coating 40 (S80) successively on described first coating 20, thereby finish the manufacture method of single face flexible printed wiring board of the present invention.
In as above manufacture method, the invention is characterized on the generation type of the step (S50) that forms first coating circuit pattern in the middle of the step (S80) of lamination pattern.And this technical characterictic can solve in the aforesaid drawbacks of conventional art, when first coating of wiring pattern is copper layer long term exposure during in air and by keeping, and the problem that wiring pattern is oxidized.
In addition, of the present invention another is characterised in that, the described step (S10) that the flexible copper foil laminated plates is provided can replace the spraying plating mode by the casting mold mode and finish, thereby the step that can omit etching inculating crystal layer in the conventional art like this shortens operation, and can prevent the problem that the electric insulation impedance descends owing to the existence of residual inculating crystal layer.To this, will in the execution mode 2 of back, describe in detail, and below, describe technical characterictic of the present invention in detail and promptly " form the mode of wiring pattern ".
Fig. 5 represents wiring pattern generation type in the past.Successively through plating, as second coating 30 and the 3rd coating 40, wherein said nickel dam is used to prevent the corrosion of wiring pattern with respectively for formation nickel dam and gold layer on first coating 20, described golden layer of cementability that then is used to improve chip.Then, remove residual photoresist sun needle drawing case 50 ' after, etching and remove conductive layer 21, thus form wiring pattern.
Yet, as making wiring pattern in the manner described above, can allow first coating 20 be that the copper layer is exposed in the air, if take care of for a long time, will make described first coating 20 oxidized, this problem illustrated in aforementioned part.
The present invention proposes in order to address the above problem, it at first carries out the step (S50) that forms first coating in the copper facing mode, to allow the thickness of first coating 20 that constitutes by conductive layer 21 and copper layer 22 reach 5-12 μ m, after being preferably 8-10 μ m, the step (S60) of then carrying out the removal photoresist is to remove photoresist sun needle drawing case 50 '.By etching step (S70), behind soft etching mode removal metal conducting layer, finally carrying out the step (S80) of lamination pattern afterwards, is the promptly golden layer of nickel dam and the 3rd coating with second coating 30 of plating mode lamination successively.
At this; when the thickness of described first coating 20 during less than 5 μ m; because thereby the photoresist layer that can resist etching solution protecting cloth line pattern additionally is not provided; therefore under the corrosiveness of etching solution; it is too small that the thickness of first coating 20 can become; thereby can't finish the plating of described second coating 30 smoothly, and can make the impedance of circuit become big.When the thickness of described first coating 20 during greater than 12 μ m, first coating 20 is that copper film can have excessive thickness, so economical inadequately.
In addition, the thickness of described first coating 20 is set as 5-12 μ m, the purpose that preferably is set as 8-10 μ m also is, in order to make first coating 20 through behind the etching action of etching solution, can also keep 3-10 μ m, is preferably the thickness of 6-8 μ m.
The step (S10) that the flexible copper foil laminated plates is provided through associating is in the formed single face flexible printed wiring board of step (S90) of lamination pattern, the section of metal line pattern is shown in a last enlarged drawing among Fig. 1, and the upper face of first coating 20 and side are wrapped up by second coating 30 and the 3rd coating 40 successively.
For complete metal line pattern, each layer thickness that can embody optimum performance is respectively that first coating 20 is 6-8 μ m; Second coating 30 is 0.1-2.5 μ m; The 3rd coating 40 is 0.1 μ m.Wherein its thickness dwindles when just beginning owing to be subjected to etching action for 20 of first coating.
Why forming said structure, is the following problem that exists in the prior art in order to solve.Promptly, because prior art forms first coating, 20 to the 3rd coating, 40 structures such as continuous stratification such as grade under the state that has photoresist sun needle drawing case 50 ', sun needle drawing case 50 ' also can be surrounded the sidepiece of first coating 20, therefore just can't allow the gold plating liquid of second coating 30 and the 3rd coating 40 stick to this part by galvanoplastic.In contrast, according to the present invention, at first divest photoresist sun needle drawing case 50 ' after forming first coating 20, and remove metal conducting layer 21, thereby make second coating 30 and the 3rd coating 40 be sticked to the side of first coating 20 to form coating by etching mode.
In view of the above; first coating 20 that is easy to oxidation is the copper layer; can be that nickel dam and the 3rd coating 40 are that the gold layer is protected by second coating 30 that in air, is difficult for oxidation, under the situation of long-term keeping, also can solve the phenomenon that wiring pattern opens circuit under oxidation and corrosiveness.
But, even adopt aforesaid way to form the metal line pattern, if when execution provides the step (S10) of flexible copper foil laminated plates, take the spraying plating mode, in the step of etching metal conductive layer 21, can't allow enough etching solutions immerse between the wiring pattern that distance between centers of tracks is 10-50 μ m in the fine slit, thereby the nichrome inculating crystal layer that can cause metal conducting layer 21 lower floors is not by complete etched phenomenon.
When so under the state that inculating crystal layer (mark 21 among Fig. 6 ') is not eliminated fully, electroplating second coating 30 and the 3rd coating 40, finally can make gold plating liquid also stick to residual inculating crystal layer 21 ' on, this can cause the conducting between the metal line pattern, thus the phenomenon that can cause the electric insulation impedance to descend.
The manufacture method of the flexible printed wiring board that the execution mode 2 of narration in the back is related can produce the flexible printer circuit of omitting described inculating crystal layer, therefore can overcome foregoing problems, and then can form ultra-fine wiring pattern circuit.
Fig. 2 is in the related flexible printed wiring board manufacture method of embodiment of the present invention 2, the manufacture method flow chart of copper foil laminates (FCCL).
What embodiment of the present invention shown in Figure 22 was related is the method for making the flexible copper foil laminated plates with the casting mold mode, and this manufacture method is all applicable on single face and double-sided printed-circuit board.
At first, in order to prepare the flexible copper foil laminated plates by the casting mold mode, the conductive layer 21 that is provided is that thickness is 1-4 μ m, is preferably the metal conductive layers such as copper of 2-3 μ m, and has and insulating material 10 contacted surfaces.
Wherein, why limit the thickness of metal conducting layer 21, be to close (puddling) phenomenon, and prevent that puddling phenomenon from also being one object of the present invention because if the thickness of described metal conducting layer 21 greater than 4 μ m, just is difficult to prevent glue; If it is copper layer 22 that thickness less than 1 μ m, just is difficult to form wiring pattern, the problem that also can cause production efficiency to descend.
After preparing described metal conducting layer 21, described metal conducting layer 21 is put faceup, mould 23 then is set thereon, and make mould 23 surround the periphery of conductive layer 21.Afterwards, directly pouring into thereon or apply insulating trip 10 materials with the roll-in mode is the polyimides liquation.
The flexible copper foil laminated plates (FCCL) that is used for two-sided flexible printed circuit is then utilized two identical plate-shape metal conductive layers, i.e. first metal conducting layer and second metal conducting layer, and prepare by the casting mold mode.Specifically, at thickness is that the sidepiece of first metal conducting layer of 1-4 μ m is provided with mould, and on described metal conducting layer, be coated with the coating insulation material liquation, then thereon behind second metal conducting layer of lamination same thickness, through the super-dry and the described insulating material liquation that hardens, prepare described laminated plates.
After finishing described applying step, the dry and described insulating trip 10 material liquations that harden can be finished described flexible copper foil laminated plates.
Except that said method, can also use strippable copper film.This is on conductive layer 21, the apparent surface who pours insulating trip 10 material liquations into is gone up the strippable foils of lamination (carrier foil), thereby ensure that enough thickness bears the temperature of insulating trip 10 material liquations.Described foils is made of separated type material and metal material, and described separated type material then is made of release binding agent.
When using above-mentioned strippable copper film, inject insulating trip 10 material liquations and after super-dry and sclerosis, from the described foils that constitutes by separated type material and metal material of the sur-face peeling of described conductive layer 21, thus the FCCL that final acquisition is made of insulating trip 10 and last conductive layer 21 thereof.Described method can can't be born insulating trip 10 material liquations because conductive layer 21 is thin excessively, thereby uses might cause being out of shape the time.
Described execution mode 2 can provide the manufacture method of the FCCL that can solve following problem.
The first, owing to can omit requisite inculating crystal layer (Seed layer) in the prior art (as shown in Figure 6) that adopts the spraying plating mode, therefore in down-stream, also can omit the step (S91) of etching inculating crystal layer;
The second, for spacing be the high-density wiring pattern of 10-50 μ m, although can solve the step (S91 that has carried out the etching inculating crystal layer in the prior art, as shown in Figure 6), but owing to be not eliminated still at residual inculating crystal layer the problem that the electric insulation impedance descends between wiring.
That is to say,, can simplify working process that the etching solution that also can save the costliness that is used to remove inculating crystal layer can also be realized more effectively high-density wiring pattern to obtain economic effect by execution mode 2.
Then, in conjunction with Fig. 3, describe manufacture method in detail according to the two-sided flexible printed circuit board of execution mode 3.
Fig. 3 is the flow chart of the related two-sided flexible printed circuit board manufacture method of execution mode 3.
As shown in Figure 3, whole operations of manufacturing two-sided flexible printed circuit board of the present invention comprise, the step (S800) of step (S600), etching step (S700) and the lamination pattern of step (S100), the punch out step (S200) of flexible copper foil laminated plates, the step (S300) of coating hole, the step (S410 is to S420) that forms positive needle drawing case, the step (S500) that forms first coating, removal photoresist is provided.Specific as follows:
The step (S100) of flexible copper foil laminated plates is provided, and this is first procedure of this technology.In order to be 25 μ m at thickness, preferably conductive characteristic is given on the film base material two sides that constitutes with polyimides, the casting mold mode of utilization in aforementioned embodiments 2, preparation is provided with the flexible copper foil laminated plates (FCCL) of conductive layer 210, wherein said conductive layer 210 is 1-4 μ m by thickness, and the last conductive layer 211 and the lower conductiving layer 212 that are preferably 2-3 μ m constitute.
When using the spraying plating mode to carry out the described step (S100) that the flexible copper foil laminated plates is provided, after earlier thickness being the metal conducting layer spraying plating of 0.1-0.5 μ m, be thickness that the last conductive layer 211 of 1-4 μ m and lower conductiving layer 212 are electroplated on the base material two sides forming conductive layer 210 respectively, thus preparation FCCL.
Here, the explanation to step (S10) that the flexible copper foil laminated plates is provided is the same in the reason of restriction metal conducting layer 210 thickness and the execution mode 1.
Secondly, carry out punch out step (S200), this step is provided with via 600 on the prepared flexible copper foil laminated plates in the described step (S100) that the flexible copper foil laminated plates is provided.
The purpose that via 600 is set is that allow can conducting between the formed wiring pattern of upper and lower faces of flexible copper foil laminated plates.Described via 600 can be the plated-through-hole (PTH) that connects described flexible copper foil laminated plates, perhaps only on the thickness direction of plate, and the blind hole (BVH) that part forms.What represent among Fig. 3 is plated-through-hole.
Specifically, plated-through-hole connects last conductive layer 211, polyimide insulative sheet 100, the lower conductiving layer 212 of flexible copper foil laminated plates successively; Blind hole then beat from conductive layer 211 till the bottom of insulating trip 100, and stay lower conductiving layer 212.When forming described hole, can adopt three kinds of modes such as laser method, chemical method for etching, mechanical stamping method.
When carrying out the step (S300) of coating hole, utilize the electroless gold plating mode, on the substrate of getting the hole by described punch out step (S200), form coating and at least a portion of coating hole, thereby allow the upper and lower faces of described flexible copper foil laminated plates electrically connect.And the step of described coating hole (S300) also can adopt following spraying plating mode to carry out.
In the step (S300) of the coating hole that adopts the spraying plating mode, reach spraying plating copper or copper alloy on the whole surface of going up conductive layer 211 or lower conductiving layer 212 in inner surface, to form copper layer 200 ' by the formed via 600 of described punch out step (S200).
The step of coating hole (S300) can further comprise the copper plating step, and this step is by going up with plating mode copper facing at described copper layer 200 ', thereby blocks described hole 600 fully, goes up at described copper layer 200 ' perhaps that to form thickness be the copper film of 1-4 μ m.
Secondly, apply photoresist 500 (S410), and impose exposure (S420) and development (S430), to form positive needle drawing case (S400) according to conventional method.
Afterwards, the same with the manufacture method of aforementioned single face flexible printed wiring board, two-sided flexible printed circuit board also needs to make through following steps, thereby prevents that first coating 200 from being the oxidation of copper layer.Described steps in sequence comprises: the step (S500) that forms first coating; Remove the step (S600) of photoresist, in order to remove residual photoresist sun needle drawing case 500 '; Etching step (S700) is in order to remove metal conducting layer 210 by soft etching mode; The step of lamination pattern (S800) is in order to lamination nickel dam and gold layer (Au layer) successively on formed first coating 200, with respectively as second coating 300 and the 3rd coating 400.
That is to say, the step (S500) that forms first coating is on the wiring pattern that the step (S400) by the positive needle drawing case of described formation is exposed, just further to impose plating on conductive layer 210a, thereby lamination copper layer 220 has the first thick coating 200 of 5-12 μ m with formation.Thereafter step carry out to be removed step (S600), the etching step (S700) of photoresist, the step (S800) of lamination pattern as previously mentioned successively, prepare with execution mode 1 in the single face flexible printed wiring board have identical shaped metal line pattern.
Below by embodiment 1 and comparative example 1, the characteristic variations of flexible printer circuit wiring pattern when using of manufacturing according to the method described above is described.
Utilize the manufacture method of the single face flexible printed wiring board of while application implementation mode 1 and execution mode 2, when making wiring pattern, by described casting mold mode, be on the copper metal conducting layer 21 of 2 μ m the insulating trip 10 that thickness is 25 μ m to be set at thickness, with preparation FCCL, behind coating photoresist 50 on the described metal conducting layer 21, impose exposure and development afterwards.On the metal conducting layer that step exposed 21, copper layer 22 is set then, thereby allows the full depth of described first coating 20 reach 9 μ m by described formation pattern.Then; after removing photoresist sun needle drawing case 50 '; remove metal conducting layer 21 by soft etching mode; nickel plating alloy and form second coating 30 that thickness is 0.2 μ m thereon afterwards; gold-plated thereon again (Au) and to form thickness be that the 3rd coating 40 of 0.1 μ m is with as protective layer; thereby form the metal line pattern, finish the manufacturing of single face flexible printed wiring board.
Make the single face flexible printed wiring board according to embodiments of the present invention 1.But in preparation during FCCL, employing be the spraying plating mode, increase extra inculating crystal layer etching step in addition.In addition, additive method is all identical with embodiment 1.
Make the single face flexible printed wiring board according to embodiments of the present invention 2.By the casting mold mode, be on the copper metal conducting layer 21 of 2 μ m the insulating trip 10 that thickness is 25 μ m to be set at thickness, thus preparation FCCL.And when forming wiring pattern, behind continuous stratification first coating 20, second coating 30 and the 3rd coating 40, remove photoresist sun needle drawing case 50 ', remove metal conducting layer 21 with soft etching mode afterwards.All the other methods are all identical with embodiment 1.
Comparative example
Manufacture method according in the past single face flexible printed wiring board is made the single face flexible printed wiring board.When forming wiring pattern, prepare FCCL by the spraying plating mode, behind continuous stratification first coating 20, second coating 30 and the 3rd coating 40, remove photoresist sun needle drawing case 50 ' afterwards, then utilize soft etching mode to remove metal conducting layer 21.All the other methods are all identical with embodiment 1.
Afterwards, estimated the characteristic of prepared semiconductor substrate test piece.Assessment item is as follows, and evaluation result as shown in Table 1.
Pattern stability
According to IPC TM 650 2.2.4, detect the poor of the size (Dimen-sion) of test piece before and after etching and heating.
Peel strength (Peel strength)
According to IPC TM 640 2.4.9, detect the copper-stripping intensity of unit are.
Surface roughness
Use AFM (Atomic Force Microscope), detect required other surface roughness of level.
Insulation impedance
Apply the direct voltage DC of 500V between separate circuit, application time is 1 fen kind.Detect the insulation impedance between adjacent patterns afterwards.It is good that evaluation criterion is that impedance is considered as when being 100M Ω.
Proof voltage
Apply the alternating voltage AC of 500V between separate circuit, application time is 1 minute, then detects.If do not occur opening circuit or the phenomenon of insulation breakdown, then be considered as good.
Anti-tortuosity
Under 500g pressure and 135.5 ℃ of temperature conditions, use R=0.38mm, detect after rotating 20 times.Evaluation criterion is, the no Copper Foil be full of cracks or the phenomenon that fractures, and be considered as when not having any problem electrically outstanding.
Corrosion resistance
According to the test of KS M 8012 neutral salt spray test methods, wherein the concentration of sodium chloride is 40g/l, and pressure of compressed air is 1.2kgf/cm
2, spray amount is 1.51ml/80cm
3/ h, the temperature of air saturator (saturator) is 47 ℃, and salt water tower temperature is 35 ℃, and the experimental tank temperature is 35 ℃.Evaluation criterion is that impedance rate of change is within 10%, and nothing opens circuit, naked is considered as outstanding when destroying.
Thermal shock
By-55 ℃ to room temperature (30 fens kinds), again by the variations in temperature of room temperature to 120 ℃ (30 fens kinds) as a cycle period, and be exactly the means of this test with the variations in temperature of carrying out 10 above-mentioned cycle periods in 5 minutes.Evaluation criterion is, impedance rate of change in 10%, outward appearance and (or) no anyly be considered as well when unusual on the structure.
Moisture-proof
In temperature is that 60 ℃, humidity are to place 96 hours in 90～95% the environment, detects after room temperature (15～35 ℃) is placed 1～2 hour down afterwards.Evaluation criterion is, outward appearance and (or) no any abnormality on the structure, insulation impedance is more than 10 Ω, and impedance rate of change is considered as well in 10% the time.
Thermal endurance
In temperature is to place 96 hours in 85 ℃ ± 2 ℃ the environment, at room temperature places afterwards after 1～2 hour and detects.Evaluation criterion is, outward appearance and (or) no any abnormality on the structure, insulation impedance is more than 10 Ω, and impedance rate of change is considered as well in 10% the time.
＜table one 〉
| Type | Spacing | Copper layer structure and thickness among the FCCI | Whether need the etching inculating crystal layer | The stability of pattern | Be adjacent to power | Surface roughness | Insulation impedance | Proof voltage | Anti-tortuosity | Corrosion resistance | Thermal shock | Moisture-proof | Thermal endurance | Remarks | |
| Deposited metal | | ||||||||||||||
| Embodiment | |||||||||||||||
| 1 | 25μm | ?- | 2μm | Do not need | ⊙ | ⊙ | ⊙ | ⊙ | ⊙ | ⊙ | ⊙ | ⊙ | ⊙ | ⊙ | Simplify working |
| Embodiment | |||||||||||||||
| 2 | ?0.2μm | 2μm | Need | △ | ⊙ | ⊙ | △ | ⊙ | ⊙ | ⊙ | ⊙ | ⊙ | ⊙ | | |
| Embodiment | |||||||||||||||
| 3 | ?- | 2μm | Do not need | ⊙ | ⊙ | ⊙ | △ | △ | ⊙ | × | △ | × | ⊙ | Simplify working process | |
| Comparative example | ?0.2 | 2μm | Need | △ | ⊙ | ⊙ | △ | △ | ⊙ | × | △ | × | ⊙ | Increase operation | |
⊙: outstanding zero: good △: general *: bad
From last table one as can be seen, embodiment 1 all shows outstanding result in all assessment items; Embodiment 2 shows general result on pattern stability and insulation impedance; Comparative example shows bad result on corrosion resistance and moisture-proof.
From The above results as can be known, when adopting the casting mold mode, just need not to carry out the inculating crystal layer etching step, and, to compare when utilizing the spraying plating mode to prepare the flexible copper foil laminated plates, it shows good characteristic on pattern stability and insulation impedance.
In addition, form wiring pattern, can expect as described above, significantly improve the corrosion resistance and the moisture-proof of pattern according to method of the present invention.
Above, by being illustrated in conjunction with the preferred embodiments of the present invention.But the scope of protection of present invention is not limited to the foregoing description, and can realize various forms of embodiment in the scope of being put down in writing in claims.Therefore, in not exceeding technological thought scope claimed in claims, the technical staff who has general knowledge level and general knowledge in this area all can implement various distortion and modification, and this ought to be considered as being included in the scope of protection of present invention.
Claims (9)
1. a manufacture method that is used to the single face flexible printed wiring board of carrier semiconductor packages is characterized in that, comprising:
The step of flexible copper foil laminated plates is provided, on the one side of metal conducting layer, forms insulating trip, thereby the flexible copper foil laminated plates is provided;
Form the step of positive needle drawing case, in the described step that the flexible copper foil laminated plates is provided on the formed metal conducting layer coating photoresist after overexposure and development are carved circuit pattern to form sun on described metal conducting layer;
Form the step of first coating,, on by the metal conducting layer that step exposed of the positive needle drawing case of described formation, further form first coating by the copper facing mode;
Remove the step of photoresist, remove formed photoresist sun needle drawing case in the step of the positive needle drawing case of described formation;
Etching step is removed in the metal conducting layer institute's exposed portions outside described first coating by soft etching mode; And
The step of lamination pattern forms second coating in the nickel plating mode on described first coating, and forms the 3rd coating in gold-plated mode on described second coating, thus lamination wiring pattern successively.
2. the manufacture method that is used to the single face flexible printed wiring board of carrier semiconductor packages according to claim 1 is characterized in that,
The described step of flexible copper foil laminated plates that provides is finished by the casting mold mode, and it is that the metal conducting layer side of 1-4 μ m is provided with mould at thickness, and imposes drying and cure process behind the insulating material of coated with melted on the described metal conducting layer.
3. manufacture method that is used to the single face flexible printed wiring board of carrier semiconductor packages comprises:
The step of flexible copper foil laminated plates is provided, on the one side of metal conducting layer, forms insulating trip, thereby the flexible copper foil laminated plates is provided;
Form the step of positive needle drawing case, in the described step that the flexible copper foil laminated plates is provided, impose exposure on the formed metal conducting layer behind the coating photoresist and develop, carve circuit pattern on described metal conducting layer, to form sun;
Form the step of first coating,, on by the metal conducting layer that step exposed of the positive needle drawing case of described formation, further form first coating by the copper facing mode;
The step of lamination pattern by the nickel plating mode, forms second coating on described first coating, and by gold-plated mode, formation the 3rd coating on described second coating, thereby lamination wiring pattern successively;
Remove the step of photoresist, remove formed photoresist sun needle drawing case in the step of the positive needle drawing case of described formation; And
Etching step is removed in the metal conducting layer institute's exposed portions except that described first coating by soft etching mode,
It is characterized in that,
The described step of flexible copper foil laminated plates that provides is finished by the casting mold mode, and it is that the metal conducting layer side of 1-4 μ m is provided with mould at thickness, and carries out drying and cure process behind the insulating material of coated with melted on the described metal conducting layer.
4. according to any one described manufacture method that is used to the single face flexible printed wiring board of carrier semiconductor packages in the claim 1 to 3, the thickness that it is characterized in that described first coating is 5-12 μ m.
5. a manufacture method that is used to the two-sided flexible printed circuit board of carrier semiconductor packages is characterized in that, comprising:
Punch out step is provided with via on the flexible copper foil laminated plates that is made of the conductive layer on insulating trip and the two sides thereof;
The step of coating hole by the spraying plating mode, is provided with the copper layer applying described via, and electrically connects the upper and lower surface of described flexible copper foil laminated plates in view of the above on the described flexible copper foil laminated plates that is provided with via;
Form the step of positive needle drawing case,, and impose exposure and develop the positive circuit pattern of carving of formation at described flexible copper foil laminated plates two sides coating photoresist;
Form the step of first coating,, on by the two sides conductive layer that step exposed of the positive needle drawing case of described formation, further form first coating by the copper facing mode;
Remove the step of photoresist, remove formed photoresist sun needle drawing case in the step of the positive needle drawing case of described formation;
Etching step is removed in the metal conducting layer institute's exposed portions except that described first coating by soft etching mode; And
The step of lamination pattern forms second coating in the nickel plating mode on described first coating, and forms the 3rd coating in gold-plated mode on described second coating, thus lamination wiring pattern successively.
6. the manufacture method that is used to the two-sided flexible printed circuit board of carrier semiconductor packages according to claim 5 is characterized in that,
Provide described flexible copper foil laminated plates by the casting mold mode, be that the first metal conducting layer side of 1-4 μ m is provided with mould wherein at thickness, and on described metal conducting layer the insulating material of coated with melted, and lamination thickness is the dry and described insulating material that hardens behind second metal conducting layer of 1-4 μ m thereon.
7. manufacture method that is used to the two-sided flexible printed circuit board of carrier semiconductor packages comprises:
Punch out step is provided with via on the flexible copper foil laminated plates that is made of the conductive layer on insulating trip and the two sides thereof;
The step of coating hole by the spraying plating mode, is provided with the copper layer applying described via, and electrically connects the upper and lower surface of described flexible copper foil laminated plates in view of the above on the described flexible copper foil laminated plates that is provided with via;
Form the step of positive needle drawing case,, and impose exposure and develop the positive circuit pattern of carving of formation at described flexible copper foil laminated plates two sides coating photoresist;
Form the step of first coating,, on by the two sides conductive layer that step exposed of the positive needle drawing case of described formation, further form first coating by the copper facing mode;
The step of lamination pattern forms second coating in the nickel plating mode on described first coating, and forms the 3rd coating in gold-plated mode on described second coating, thus lamination wiring pattern successively;
Remove the step of photoresist, remove formed photoresist sun needle drawing case in the step of the positive needle drawing case of described formation; And
Etching step is removed the metal conducting layer that is exposed outside described first coating by soft etching mode,
It is characterized in that,
Provide described flexible copper foil laminated plates by the casting mold mode, be that the first metal conducting layer side of 1-4 μ m is provided with mould wherein at thickness, and on described metal conducting layer the insulating material of coated with melted, and lamination thickness is the dry and described insulating material that hardens behind second metal conducting layer of 1-4 μ m thereon.
8. according to any one described manufacture method that is used to the two-sided flexible printed circuit board of carrier semiconductor packages in the claim 5 to 7, it is characterized in that,
Described first thickness of coating is 5-12 μ m.
9. metal line pattern that is used to the flexible printed wiring board of carrier semiconductor packages, its a plurality of striated patterns for forming on insulating trip is characterized in that,
At least be disposed with on the one side of described insulating trip copper layer, nickel dam and gold layer with respectively as first coating, second coating and the 3rd coating, and described second coating and the 3rd coating cover the top and side of described first coating.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
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| KR10-2007-0070443 | 2007-07-13 | ||
| KR1020070070443 | 2007-07-13 | ||
| KR1020070070443A KR100874172B1 (en) | 2007-07-13 | 2007-07-13 | Method for manufacturing flexible printed circuit board and metallic wiring pattern of flexible printed circuit board using thereof |
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| CN101346043A CN101346043A (en) | 2009-01-14 |
| CN101346043B true CN101346043B (en) | 2010-12-29 |
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| CN200710152135XA Expired - Fee Related CN101346043B (en) | 2007-07-13 | 2007-09-14 | Method for manufacturing flexible printed circuit board and metallic wiring pattern of flexible printed circuit board using thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102480846A (en) * | 2011-05-11 | 2012-05-30 | 深圳光启高等理工研究院 | Method for preparing flexible substate and flexible substrate |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101021344B1 (en) | 2009-10-19 | 2011-03-14 | (주)인터플렉스 | Method of manufacturing flexible printed circuit board |
| KR101305596B1 (en) * | 2011-08-09 | 2013-09-09 | 엘지이노텍 주식회사 | LED module |
| CN102487579B (en) * | 2011-09-05 | 2013-09-04 | 深圳光启高等理工研究院 | Preparation method of metamaterial and the same |
| CN104047041B (en) * | 2013-03-15 | 2017-04-26 | 深圳市九和咏精密电路有限公司 | Preparation method for printed circuit board |
| CN105611738A (en) * | 2016-03-09 | 2016-05-25 | 深圳市信维通信股份有限公司 | Manufacturing method of corrosion-resistant FPC |
| TWI643537B (en) * | 2018-02-07 | 2018-12-01 | 易華電子股份有限公司 | Bendable soft circuit board |
| CN108718485B (en) * | 2018-06-07 | 2021-02-02 | 珠海元盛电子科技股份有限公司 | Semi-additive technology for manufacturing fine-wire thick-copper double-sided FPC |
| CN110690124A (en) * | 2019-11-14 | 2020-01-14 | 江苏上达电子有限公司 | Manufacturing method of packaging substrate for improving residual copper in edge curling |
| CN111063268A (en) * | 2019-12-12 | 2020-04-24 | 深圳市华星光电半导体显示技术有限公司 | Micro light-emitting diode display panel, preparation method thereof and display device |
| CN113972146A (en) * | 2020-07-22 | 2022-01-25 | 盛合晶微半导体(江阴)有限公司 | Packaging method capable of improving gold pad identification degree and semiconductor packaging structure |
| CN115361791B (en) * | 2022-08-23 | 2024-09-13 | 宁波华远电子科技有限公司 | Preparation process of circuit board |
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| US5288951A (en) * | 1992-10-30 | 1994-02-22 | At&T Bell Laboratories | Copper-based metallizations for hybrid integrated circuits |
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| CN101346043A (en) | 2009-01-14 |
| KR100874172B1 (en) | 2008-12-15 |
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