TW556453B - PCB with inlaid outerlayer circuits and production methods thereof - Google Patents

Abstract

Printed circuit board (PCB) with inlaid outerlayer circuits and production methods thereof. The present invention provides an innovative thin flat printed circuit board having outerlayer circuitry inlaid into the dielectric layer, thus the circuitry has 3-side adhesion with the adjacent dielectric material. According to the methods for manufacturing such PCB of the present invention, various difficulties and defects incurred by using conventional copper clad laminate and/or copper foil are avoided. This invention employs the TIPTOP (template inlay precision transfer of patterns) process, using optical engraving and pattern metallization procedures conducted on a metal plate to form the circuit pattern, followed by transferring the pattern to a polymer-based dielectric material via lamination. Finally, a printed circuit is emerged after removal of metal plate and etching away the covering copper foil. This invention is particularly useful in manufacturing ultra thin PCB with very fine line width and pitch.

Description

V. Description of the invention (1) The invention of the invention relates to a printed circuit board, in particular, to a method and a furnace flag range from βA to Xe method, special method. / 、 The printed circuit board and its manufacturing of in-line outer conductors. The conventional printed circuit board manufacturing method is to make single, double-sided & "Conductive circuit or multi-layer printed circuit board" "Medium:" Prepreg ed. "Ly": Copper wire: 2 transfer, t ^^, 1 Λ? 1 V '" " 1 9 ^ ^ «" T1ϋ "stands for dielectric plywood, and the layered conductive line, the outermost conductive line and the dielectric f are widely used :: The adhesion of the core to the thick copper box, the wide line of traditional manufacturing methods — An economical and effective method for W circuits ... In order to respond to the development of electronic products toward light, thin, and short Γ brushes: the manufacture of road boards is also oriented to ultra-thin, conductive i:;: ;;,: tong ίΐί,! ΠΓ development Therefore, thin substrates and thin copper substrates have become the first method to manufacture ultra-thin and thin-circuit printed circuit boards according to Zhao Chuan :, the manufacturing process of printed circuit boards includes the ancient, θ a, Jin, and materials, but the leather is widely used. Temperature, humidity and strong acid treatment? In this soil environment, the thin substrate is easy to increase processing difficulty due to heat and cold, and it is difficult to produce a large area. 1 not only people # early and cause product defects; in addition, or Min helmet # because the outer wire is protruding, the product will be caused by the way Defects; or embarrassment & unevenness of the surface, and because of the description of the invention (2) Insufficient adhesion of the electric layer, so it is easy to be damaged due to external forces when it is cleaned. Lead to the use of traditional methods and cause bad products; all kinds of technologies that are originally economical or can not be effectively overcome when printed circuit boards with ultra-thin lines can be used: J principles' these are urgent needs to be resolved-but there is a clock here The printed circuit board of the present invention, as shown in Figures 2 and 3, has two types of printed wires with inlaid outer conductors. The conductive wires are embedded in the dielectric. =: == 100 represents the dielectric. The 120th generation is embedded in the dielectric. In the layer, because of & *, it is characterized by the outermost conductive line and therefore Jie Lei Ping and Gu Yi; 丄 a The present invention also provides-a kind of magnetic basis = :; Yes. The combination of surface ㈣. Roughly divided; = The method of the printed circuit board It is a thin film on a release mold, resistance / method.) Is formed first-conductive gold film, the other function is A. "The first use is. It is mainly used to form conduction in the trench formed by the release resistance: road Have :: Followed by electroplating in the light (electric AD =: r method, the second electric rabbit film is in a release template, M ^ resistance structure & fmgmfgk 1 can be obtained with tin film, tin alloy film or light: ΠΓίΓ can be obtained Conductive circuit. Then open y to form a thin metal film on the circuit and the template (as a punishment step. This method is to subtract the method Btra (: Tive). In order to enter the lamp connection, the, and the crimping surface is intended to provide A type of flat wire with an inlayed outer layer: =! Ί road board, and its characteristic is that the outermost wire is embedded in a dielectric layer composed of the same compound, and the mesh and the dielectric layer have two sides

556453

Adhesive combination of three interfaces on the top and bottom. Another object of the present invention is to provide a printed circuit board with a mosaic outer wire = γ-type printed circuit board, which is characterized in that the total thickness of the finished product is only after the layers of the dielectric adhesive sheet composed of the south polymer are laminated. Sum of the cumulative thickness and the thickness of the outermost protective film. Yet another object of the present invention is to provide a manufacturing method of a planar thin printed circuit board with a multilayer outer conductor and a multilayer printed circuit board ', which fundamentally eliminates the technical problems derived from thin substrates and thin steel foils. The printed circuit board with inlaid outer-layer wires of the present invention includes a dielectric layer and a wire layer, and is characterized in that the wire layer is embedded in the dielectric layer. The dielectric layer suitable for the present invention is a dielectric prepreg composed of an insulating material, and the insulating material is preferably a polymer resin, such as epoxy resin, modified epoxy Resin, Polyester, Acrylate, Fluoro-polymer, Polyphenylene Oxide, Polyimide, Phenolic Resin, Poly Maple (Polysulfone), Silicone polymer (Silicone polymer), BT resin (Bismaleimide Triazine Modified

Epoxy (BT Resin), Cyanate Ester and Pol ye thy 1 ene. The wire layer is preferably composed of copper, gold or aluminum, and the thickness of the single wire layer is preferably less than 76 microns (MICRON). The above-mentioned polymer material 'may also include a reinforcing material of glass fiber, Aramid fiber or PTFE fiber, and a modified filler of ceramic powder. According to an embodiment of the present invention (photoresist film method), it has a mosaic outer layer

556453 V. Description of the invention (4) Loose version of the printed circuit board of the lead; (b) Forming a photoresist layer on the release stencil, including: ja) * supply-release mold layer; = ^ form A metal layer; (c) forming a circuit pattern on the gold, and forming an exposed / first shadow layer on the edge-first resistance layer to form a wire layer to be exposed; a metal layer; (:) metallizing a conductive pattern having a predetermined circuit pattern 2 '(f) remove the 忒 photoresist layer and release the stencil and a dielectric acoustic ray wire layer on the stencil; (㈧ inlaid in the dielectric; make the wire layer and the dielectric layer tight Combined; ⑻ remove the release mold:. = To get. 'And G) remove the metal layer or 矣 ^ ^ 忒 忒 release plate is a surface polished from 300 to 1 600 particle size ：:: Plus: The metal sheet of the protective film. The metal layer suitable for the present invention is copper, tin or nickel, and the wire layer is preferably copper, gold or tin. According to: According to the invention, the production of a printed circuit board with a mosaic-type outer conductor ^ 4 The steps of metallization to form a metal layer can be performed by electroplating, electrolysis, chemical deposition, vapor deposition, or sputtering. . According to another embodiment of the present invention (laser ablation method), a method for manufacturing a printed circuit board with a mosaic-type conductive layer includes: (a) providing a release template '(b) sequentially in the release A wire $ and a protective layer are formed on one surface of the template; (c) the wire layer is formed into a desired circuit pattern through a patterning step; (d) the wire layer and the release template are metallized in a comprehensive manner. A metal layer is formed on the surface of the release stencil; (e) the release stencil is laminated with a dielectric, so that the wire layer and the dielectric layer are tightly combined and embedded;

Page 9 1 556453 5. Description of the invention (5) ----- In the dielectric layer, and the metal layer is in contact with the surface of the dielectric layer. (H) Remove the release template; and (I) It is obtained by removing metal two on the dielectric layer. In the above method, the protective layer is used for subsequent chemical etching + protecting the circuit board. It is preferably a tin film or a eutectic tin alloy, and the tin alloy is preferably a tin-lead alloy, a tin-copper alloy, Tin-silver alloy, man II 'tin-silver-copper alloy. η 4 or the method for manufacturing a printed circuit board with inlaid outer conductors according to the present invention can be used to manufacture a multilayer printed circuit board in addition to single or double-sided printing: alone or in plural. According to another embodiment of the present invention, the wire boards obtained by the above method can be stacked to form a multilayer printed circuit board. The method includes: (&) A printed circuit board in which a plurality of inlaid outer layer wires are formed by the above method. Inner layer circuit board, (b) forming a plurality of printed circuit boards with inlaid outer layer wires that have not been demolded as the outer layer circuit board in the above-mentioned method; (c) using an outer layer circuit board 9, a dielectric layer, and an inner layer circuit board A dielectric layer and an outer layer line are aligned and laminated; (d) removing the release template; and (e) removing the metal layer enclosed on the surface to form a multilayer printed circuit board with a mosaic-type outer conductor. The circuit boards in step (c) in the above method may also be staggered and aligned. The flat ultra-thin printed circuit board with inlaid outer wires of the present invention is mainly a method that does not require image transfer, etching, lamination, etc. on a thin substrate or copper backing, which is likely to cause product defects, through the traditional process. In clean

556453 V. Description of the invention (6) _ The use of optical molds and (MetaU ization) technology to form the necessary guidance on the net-smooth release template-case-based method to transfer and inlay this line in the ancient Hachiman Electric Deep Road ' And by pressing the glued sheet, and then covering the dielectric composed of the surface layer composition to display the required conductive lines; this Ming ^ removed by etching, the outermost wire from the board is embedded in the dielectric ^, The printed circuit diagram shown above is made to protrude above the dielectric layer, as shown in the following figure: Non-traditional manufacturing method such as the first adhesive bonding. / 、； 丨 Electric layer has three interfaces. According to the method of the present invention, thin-film printed circuits such as thin steel /, = ^, and, which are derived from the circuit board manufacturing process, can easily be wrinkled and have different layers. Alignment difficulties, outer layer guide; J substrate is easily deformed, peeled, and the surface of the circuit board is uneven due to the protruding wires of the wires. Κΐ: So ίί 2 2 High product yield. _No need to deal with thin substrates or thin substrates: Shrinkage-derived = Insufficient conductivity, can be made into thin wires = Boards and sharpen product yield and reduce manufacturing costs. The injustices are described below: 丄 The features and advantages are more obvious and easy to understand, and the following: Good examples, and the accompanying drawings are used to explain in detail, such as simple diagrams. Figure 1 shows the printed circuit of conventional technology Embodiment Structure of the Board FIG. 2 is a diagram showing the structure of a double-sided printed circuit board of the present invention.

556453

Figure 3 shows the fourth A to 4 J of the present invention. Figure 5 shows the present. 5 A to 5 I. Figure shows the present. 6 A to 6 C. Figure shows the present symbol. Explanation: Structure diagram. The schematic diagram of the manufacturing process of Example 1 of Mingzhiguan. The process schematic diagram of the second embodiment of the invention. The schematic diagram of the manufacturing process of the third embodiment. 11 0, 2 1 0, 3 1 0 ~ release template; 140, 240, 340 ~ metal layer; 12, 120, 220, 320 ~ wire layer; 1 50 0 α, 2 6 0 ~ photoresist; 230 ~ The protective layer;

10, 100, 200, 300 ~ dielectric layer; 160 ~ photomask; 9 2550 ~ laser dissolution. Example Example 1

Figures 4A ~ U are schematic diagrams showing the process of the embodiment of the present invention. As shown in FIG. 4A * ', a copper rhenium layer 14o is first formed by electroplating on a smooth and clean surface of the release template 11o. In addition to copper, it can be other conductive metals. Next, a negative type photoresist layer 15α is applied, as shown in FIG. 4β, and then the image of the circuit diagram is transferred to the photoresist layer 150 in an exposure manner as shown in FIG. On α, the exposed portion of the photoresist layer is hardened by photopolymerization as shown in FIG. 4D, and the unreacted portion of the photoresist layer is removed. 5α forms a trench as shown in FIG. 4E Photoresist layer 15 of the electroplated circuit model,

0747-7 598TWF; Phoebe.ptd Page 12 556453 V. Description of the invention (8) '— ^ --- — 5 52 Second, enter' electric money steel (or other conductive metal) to form the required steel guide, ^ 'As shown in Figure 4F. Then stripping the photoresist layer 150, the single-layer printed circuit is just as good as the 4G picture. PT is transferred to another layer of printed circuit board in the same way, and the two layers of printed circuit boards are facing each other with a dielectric adhesive sheet 100 and aligned. The operation is shown in Figure 411 The copper wire layer 120 is embedded in the dielectric adhesive sheet ^ 00, and then the release template 1 110 is removed to form a double-sided printed circuit covering the copper foil layer 140 as shown in FIG. 4I. Plate, and then carry out an etching operation to remove the copper foil layer 14 covering the surface, and then follow-up operations such as drilling, through-hole electric ore, anti-solder green paint, or surface protection treatment can be transferred to the 4th J as required. The figure shows a thin printed circuit board with inlaid outer conductors of the present invention. The present invention can also use a positive type photoresistor instead of a negative type photoresist, the exposed part of which is sliced and dissolved and removed during the development step, thereby forming a circuit pattern model. Mold mold Example 2-5th to 5th I to 5I are schematic diagrams showing the manufacturing process of Example 2 of the present invention. In Example 2, a laser-etching method was used to produce a flat, thin, double-sided printed circuit board with a mosaic outer conductor. In this embodiment, tin or tin alloy is used as the protective layer, and laser smelting (Laserab 1 at 丨 〇n) is used to replace the optical mold molding method. The detailed process is described as follows: On the surface of a clean and smooth release stencil 210, a copper falling layer 220 α (or other conductive metal foil) is formed by electroplating as shown in the fifth figure. Then coated with a layer of tin film 230 α (or tin alloy film) as shown in Figure 5B

556453 V. Description of the invention (9) ~ j After the protective layer is used, a portion of the tin film is removed by laser ablation 250, and the tin film 23 of the required circuit pattern as shown in FIG. 5C is retained, followed by chemical etching. The copper pig layer is obtained as shown in FIG. 5D and the copper wire layer 220 ′ is stripped in a pre-type manner as shown in FIG. 5E. Subsequently, power mining is performed to ensure that a copper foil layer 24 exists on the release template 210, such as the circuit board in FIG. 5F. 28. After that, another circuit board is prepared in the same way. A dielectric adhesive sheet 200 is placed between the two circuit boards and stacked, and the alignment pressure cooperation is performed as shown in Figure 5G. It is shown that the copper wire layer 22 is embedded in the dielectric adhesive sheet 200, and then the release template 21 is removed to form a double-sided printed circuit with a surface ^ copper box layer 240 as shown in FIG. 5H. Plate, and then perform an etching operation to remove and remove the surface copper foil layer 240, and then perform subsequent operations such as drilling, through-hole plating, = 1 green paint, or surface protection treatment to obtain two inlaid outer conductors. The flat thin printed circuit board is shown in Figure 51. Note: The optical tin film can also be replaced by a photoresist film, and the transfer image is described in Example 1 and 2 described in f. Only the double-sided printed circuit board is used as an example. Management can also make single-sided printed circuit boards. Example 3 of the present invention In addition to the single-sided printed circuit board, the t,, BA.C «m Λ / Λ ^! Process schematic diagram of the present invention. First, as shown in FIG. Detach the circuit board of the release template as the most ::: or 2 to make the mold template 310, the copper wire layer 32, and the copper layer _: preJ = including: J only table < double-sided inner layer

〇747-7598TWF; Phoebe.ptd $ 14 pages 556453 V. Description of the invention G) f circuit board ^ (including dielectric layer 300, copper wire layer 320) and the lowest layer of the release ^ version which has not been removed The template 31o, the copper wire layer 32o, and the steel / white layer 340) are sequentially superimposed 'to insert two intermediary Leixi plywood sheets between the aba to perform the counter pressure cooperation. Then remove the release stencil board 32 = to the multilayer printed circuit board whose surface is covered with the copper foil layer 34 °, as shown in Figure 6β, and then perform an etching operation to remove the surface copper foil layer 34 °. After drilling, through-hole plating, solder green paint or surface protection treatment, you can get the required flat thin multilayer printed circuit board with inlaid outer conductors as shown in Figure 6C. Therefore, from the foregoing description, it can be known that the printed circuit board of the present invention has the following advantages: there is a roll-in type outer layer wire 1. = an expensive thin substrate required for using a traditional process; It is a processing technical problem that the expansion and contraction deformation, the thin copper box is easy, and the folding can improve the product yield. Hurry 2. The outer wire is inlaid in the dielectric layer: so it adheres to the dielectric surface and increases the adhesion strength ;: two in the median lightning screen μ _ ^ ^ Youtian Yu ankle road is not convex Lu Wei refers to "'to avoid line buckle and fall off due to external forces during U work, resulting in product defects. Shou Shuang Green 3 · The main operation is attached to the release mold. · It is not deformed and not total, m. · Since the release template is strong and not easy to expand and contract, many problems can be avoided. θ < Misalignment of the ankle path can form a heat transfer path of the structural heat plate (Heat spreader) of ultra-thin and ultra-fine lines ^, and 0 heating elements to Huang Ba can reduce the use of materials ... economic benefits, more Shrink

0747-7598TWF; Phoebe.ptd Page 15 556453 V. Description of the invention (11) Volume of the sub-product 5. Excellent precision of precise impedance control 6. The surface is more peak and valley, which helps to summarize the road board and its manufacturing method The lack and difficulty of the thin substrate and thin copper of the circuit board, although the present invention limits the present invention, and within the scope, when the scope is viewed, the electric circuit and the inlay that can be clearly defined that the outer layer is no longer painted are innovative and the manufacturing method can be effectively used. South product good implementation of this skill may change the advantages of patent scope. Control guide point and flatness: solder-proof green, the hair, not only the structure, foil, but also to make it clear that the application of dielectric layer control with # 何 熟 可做 some can control the production of the line due to the operation of the line and the embedded surface of the outer layer can not only be overcome The transmission rate and downgrading are revealed, in the total dense shape of the product with the thickness defined by the refining, the quality of the flat outer layer of the conductive wire is expensive, the production process is low, and the above is not detached, so whichever prevails: thickness. The process of forming a thin, flat surface of a thin wire has the same cost as the cost of the invention, and the advantages of the preferred undulating printed circuit surface thin device of the present invention. Protection of non-use spirit

Claims (1)

556453 VI. Scope of patent application-1 · A printed circuit board with a mosaic-type outer conductor, comprising: a dielectric layer; and a conductor layer; wherein the conductor layer is embedded in the dielectric layer, and the dielectric The layers have three-sided adhesive bonds. 2. The inlaid outer conductor printed circuit board as described in item 1 of the Shenjing patent scope, wherein the dielectric layer is made of an insulating material. 3 · The inlaid outer conductor printed circuit board No. 8 in the patent application scope described in item 2 of the scope of patent application θ hai insulation material is South molecular polymer (P 〇1 ymer Resin) ° 4 · as described in the scope of the patent application The inlaid outer conductor printed circuit board can form single-sided, double-sided or multi-layer conductive circuits individually or in multiples. 5 · The inlaid outer conductor printed circuit board according to item 1 of the scope of patent application, wherein the conductor is composed of copper, gold or aluminum. 6 · The inlaid outer conductor printed circuit board according to item 1 of the scope of patent application, wherein the thickness of the single-layer conductor is less than 76 microns (MICRON). 7. The inlaid outer conductor printed circuit board according to item 3 of the scope of patent application, wherein the high molecular polymer is epoxy resin, modified epoxy resin, polyester, acrylic ester, and fluoropolymer (Fluoro-polymer), Polyphenylene Oxide, Polyimide, Phenolic resin, Polysulfone, Silicone polymer, BT Resin (Bismaleimide Triazine Modified Epoxy (BT Resin)), Cyanate Ester (Polyethylene) or Polyethylene (Polyethylene) o 0747-7598TWF; Phoebe.ptd Page 17 556453 6. Application scope of patent 8. The inlaid outer conductor printed circuit board as described in item 7 of the scope of application for patent, wherein the south molecular polymer also includes glass fiber, Aramid fiber or Reinforcement of PTFE fiber and modified filler of ceramic powder. 9. · A method for manufacturing a printed circuit board with a mosaic-type outer conductor, comprising: (a) providing a release stencil; (b) forming a metal layer on one surface of the release stencil; (c) forming the metal layer A photoresist layer is formed on the book; book (d) forming a predetermined circuit pattern on the photoresist layer by exposure and development, and exposing a part of the metal layer; (e) metallizing to form a wire layer on the exposed metal sound · (0) The photoresist layer is removed to form a green circuit with a predetermined circuit diagram on the release template; the wire layer (g) is a laminate of the release template and a dielectric, and the electrical layer is tightly planted. Seventh 人 —The human wire layer and the dielectric are fully interspersed with each other, and are embedded in the dielectric layer, and the surface of the electric layer is bonded; ϋ, the metal layer and the dielectric (h) remove the release template; And (1) It is obtained by removing the metal layer on the dielectric layer. I 0 · A method for manufacturing a printed circuit board having, as described in item 9 of the scope of the patent application, wherein the release mold: a type outer layer wire to 1 6 0 0 Grain level polishing or surface protection. The surface is 300 II. The method of manufacturing a printed circuit board with a wire as described in the item of the scope of interest, wherein the protective film is embedded with outer layer misleading, mineral titanium, titanium titanium nitrogen, or coated with p TF £. ,mine 0747-7598TWF; Phoebe.ptd Page 18 556453 6. Method for manufacturing a printed circuit board with a patent application line, wherein the metal layer is selected from the group consisting of steel, gold, aluminum, tin, and nickel . The method for manufacturing a printed circuit board with an inlaid outer layer conductor described in item 18 of the patent application scope, wherein the conductor layer is copper, gold, or aluminum alloy. 26. The method for manufacturing a printed circuit board with a mosaic-type outer conductor as described in item 8 of the patent application scope, wherein the step (d) of the metallization method is an electroplating method, an electrolytic deposition method, a chemical deposition method, or a vapor deposition method. Or sputtering. X 2 7 · The method for manufacturing a printed circuit board with an inlaid outer layer wire as described in item 8 of the scope of patent application, wherein the method can be applied to the manufacture of a surface, a double-sided printed circuit board, or a multilayer printed circuit board. Inner circuit. As early as 28 · The method for manufacturing a printed circuit board with a mosaic-type outer layer conductor as described in item 18 of the scope of patent application, wherein the dielectric layer is an insulating material. 29. The method of manufacturing an inlay outer layer = printed circuit board as described in item 28 of the scope of the patent application, wherein the insulating material is a polymer polymer I, including a multilayer printed circuit board including an inlay outer layer wire (U) Utilizing the method of printing electric wires of several inlaid outer conductors as described in item 9 or item 18 of the scope of patent application (b) forming a road board in step 9 of the scope of patent application, steps, steps ( 3) ~ (g) or the method described in item (a) ~ (e) of item 18 to form a number of inlaid outer panels that have not been demolded. Page 21 0747-7598TWF; Phoebe.ptd 556453 The printed circuit board (Γ) ^ m of the wire is the outer circuit board; the dielectric layers are: Λ circuit board, -dielectric layer, one. Inner layer circuit board,-layer circuit board (D) removing the release stencil; and (e) removing the metal layer enclosed on the surface to form a multilayer printed circuit board with a mosaic outer conductor. i 右 镇 私 i & & [of a silver-defining outer layer guide 3 1 · If the patent application scope of the item 18 households 'Among them (c) manufacturing method of the multilayer printed circuit board of these lines' /, The boards are superimposed in staggered alignment. 0747-7598TW; Phoebe, ptd p. 22