TWI640233B - Circuit board unit with fine circuit and method for manufacturing same - Google Patents

Abstract

A method for manufacturing a circuit board unit with fine lines includes the following steps: providing a support plate, and bonding a layer of a peelable conductive film on the support plate; forming a layer of an insulating substrate on the surface of the peelable conductive film; A plurality of openings are formed in the material, and the openings expose the peelable conductive film; the positions of the plurality of openings and the surface of the peelable conductive film are electroplated to form fine lines; the peelable conductive film and the support plate are removed, thereby A circuit board unit with fine wiring was obtained. The invention also relates to a circuit board manufactured by this method.

Description

Circuit board with fine lines and manufacturing method thereof

The invention relates to the field of circuit board manufacturing, in particular to a circuit board with fine lines and a manufacturing method thereof.

With the rapid development of electronic products, printed circuit boards used as component supports and carriers for transmitting electrical signals should also gradually move towards miniaturization, light weight, high density, and multi-function, and then the production of fine circuits on printed circuit boards. Higher requirements are put forward. The width of the conventional printed circuit board production process is limited by the thickness of the copper layer. The thinner the copper layer, the thinner the circuit, so the use of thick copper to make thin circuits has its own limitations; and the conductive circuits of conventional printed circuit boards are usually reduced. The method is limited, but it is limited by the thickness of copper. It can only be used with thin copper for making fine lines, and there is a poor etching factor after fabrication. The etching is not clean and burrs are formed. It is difficult to fill the solder resist ink, and it is easy to generate bubbles.

In view of this, it is necessary to provide a circuit board manufactured by a circuit board manufacturing method capable of solving the above technical problems.

A method for manufacturing a circuit board unit with fine lines includes the following steps: providing a support plate, and bonding a layer of a peelable conductive film on the support plate; forming a layer of an insulating substrate on the surface of the peelable conductive film; Forming a plurality of openings in the material, the openings exposing the peelable conductive film; Conductive metal is plated on the surface of the peelable conductive film exposed by the plurality of openings to form a thin circuit; and the peelable conductive film and the support plate are removed to obtain a circuit board unit with a fine circuit.

A method for manufacturing a circuit board with fine lines includes the following steps: providing at least two circuit board units; and the surface of each circuit board unit to be pressed together with another circuit board unit is called a pressing surface. A layer of adhesive is laminated on the insulating substrate of the pressing surface of one circuit board unit of two adjacent circuit board units to be pressed together, and the thin line on the pressing surface of the other circuit board unit A layer of conductive paste is printed on the surface; the pressing surfaces are pressed together, and the insulating substrates of the various circuit board units are aligned with each other, and the fine lines are aligned, and the insulating substrates of the at least two circuit board units pass through the The adhesive layer is fixed, and the thin lines of the at least two circuit boards are fixed and electrically connected through the conductive paste, thereby forming a circuit board with fine lines.

A circuit board with fine lines includes a plurality of circuit board units with fine lines. The circuit board units are sequentially stacked together. Each circuit board unit includes an insulating substrate and a thin circuit formed between the insulating substrates. An adhesive layer is provided between the insulating substrates of each two adjacent circuit board units, and a conductive paste is provided between the thin lines of each two adjacent circuit board units. The two circuit board units are fixed together, and the conductive paste is used to fix and electrically conduct the thin wires of each adjacent two circuit board units.

Compared with the prior art, the method for manufacturing a circuit board with thin lines provided by the present invention and the circuit board produced thereby can increase the thickness of the copper arbitrarily, and the width of the circuit can be thinner, so that thick copper thin lines can be manufactured. That is, the width of the thin line can be kept unchanged, so that the thin line is not limited by the thickness of copper. Because the thin line is formed by electroplating, the burr phenomenon formed when the copper layer is etched to form a conductive line is avoided, and the conductive The problem of air bubbles filled with ink between the lines.

100,200‧‧‧Circuit board with fine lines

10‧‧‧ support plate

12‧‧‧ Peelable conductive film

14‧‧‧ Insulation

16‧‧‧ Copper foil layer

20‧‧‧ insulating substrate

22‧‧‧ opening

30‧‧‧ Fine Line

40‧‧‧Circuit board unit

401‧‧‧Compression surface

41‧‧‧Adhesive layer

42‧‧‧Conductive paste

FIG. 1 is a cross-sectional view of a support plate and a peelable conductive film formed on the support plate according to a first embodiment of the present invention.

2 is a cross-sectional view of an insulating base material formed on a peelable conductive film.

3 is a cross-sectional view of an opening formed by patterning an insulating substrate.

4 is a cross-sectional view of a circuit board unit obtained by forming a thin circuit between a surface of a peelable conductive film and an insulating base material.

5 is a cross-sectional view of providing two circuit board units, forming an adhesive layer on an insulating substrate of one of the circuit board units, and forming a conductive paste on a thin circuit of the other circuit board unit.

FIG. 6 is a cross-sectional view of two circuit board units being pressed together.

FIG. 7 is a cross-sectional view of a circuit board with a fine circuit obtained by removing a peelable conductive film and a support plate.

8 is a cross-sectional view of a plurality of circuit board units pressed together to form a circuit board according to a second embodiment of the present invention.

The circuit board and the manufacturing method thereof provided by the present invention will be further described in detail below with reference to the accompanying drawings and embodiments.

Please refer to FIGS. 1-7. A first embodiment of the present invention provides a method for manufacturing a circuit board with fine lines. The steps include:

In the first step, referring to FIG. 1, a supporting plate 10 is provided, and a peelable conductive film 12 is adhered on the supporting plate 10. In this embodiment, the support plate 10 is a single-sided copper-clad substrate. The single-sided copper-clad substrate includes an insulating layer 14 and a copper foil layer 16 formed on a surface of the insulating layer 14. The peelable conductive film 12 is bonded to The surface of the copper foil layer 14.

Step 2: Referring to FIG. 2, a layer of an insulating substrate 20 is laminated on the surface of the peelable conductive film 12, and the thickness of the insulating substrate 20 ranges from 10 to 35 μm. In this embodiment, the insulating substrate 20 is a photosensitive insulating substrate. In other embodiments, the insulating substrate 20 may be, for example, a thermosetting resin.

In the third step, referring to FIG. 3, a plurality of openings 22 are formed in the insulating substrate 20, and the openings 22 expose the peelable conductive film 12. Since the insulating base material 20 is a photosensitive insulating base material in this embodiment, the opening 22 can be formed by processes such as exposure and development of the insulating base material 20 by a photolithography technique. When the insulating substrate 20 is a thermosetting resin, an opening 22 can be formed by laser ablation. However, the opening 22 is preferably formed by a lithographic technique using a photosensitive insulating substrate.

The fourth step, please refer to FIG. 4, electroplating conductive metal on the surface of the peelable conductive film 12 exposed through the opening 22 to form a thin line 30; the thickness of the formed thin line 30 is consistent with the thickness of the insulating base material 20, That is, the thickness range of the thin line 30 is also 10 to 35 μm, so that a thick copper thin line is produced. In this embodiment, the electroplated conductive metal is copper, so that the circuit board unit 40 is formed on the surface of the peelable conductive film 12.

The fifth step, referring to 5-7, provides at least two circuit board units 40, each of which includes two opposite surfaces, and presses each circuit board unit 40 to another circuit board unit. The surface together is called a pressing surface 401, and an adhesive layer 41 is pasted on the insulating substrate of the pressing surface of one of the two adjacent circuit board units to be pressed together. A layer of conductive paste 42 is printed on the surface of the thin circuit 30 on the pressing surface 401 of the other circuit board unit 40, and then the adhesive layer 41 and the conductive paste 42 pressing surface 401 are respectively pressed, and each circuit board unit is pressed. The insulating base material 20 of 40 is aligned, and the fine lines 30 are aligned, so that each adjacent two circuit board units 40 are fixed together by the adhesive layer 41, and the thin lines of each adjacent two circuit board units 40 are aligned. The circuit 30 is conducted through the conductive paste 42 to obtain a circuit board 100 with a fine circuit. Finally, the peelable conductive film 12 and the support plate 10 are peeled from the circuit board 100. Wherein, the thickness of the conductive paste 42 (adhesive layer 41) ranges from 13 to 50 μm, so the total thickness of the circuit board formed by stacking the two circuit board units 40 ranges from 33 to 120 μm.

Please refer to FIG. 7, which is a schematic diagram of two circuit board units 40 pressed together to form a circuit board 100.

The adhesive layer 41 of the present invention is a prepreg or a resin, and the resin includes a phenolic resin, a polyvinyl chloride resin, a polyester resin, an epoxy resin, a polyurethane, a polyvinyl ester, a polyfluoro resin, a polyfluorocarbon resin, and a poly double-malay resin. Perylene imine resin, poly Malaysian triazine resin, polyimide resin, polycyanate resin or epoxy polyphenylene ether.

Referring to FIG. 8, a second embodiment of the present invention further provides a circuit board 200 manufactured by the method for manufacturing a circuit board with fine lines, which includes a plurality of circuit board units 40 with fine lines. The circuit board units 40 are sequentially Laminated together, each circuit board unit 40 includes an insulating substrate 20 and a thin circuit 30 formed between the insulating substrates 20. The thickness of the thin circuit 30 is consistent with the thickness of the insulating substrate 20, and two adjacent two An adhesive layer 41 is provided between the insulating substrates 20 included in the circuit board unit 40, and a conductive paste 42 is provided between the thin circuits 30 of two adjacent two circuit board units 40. The adhesive layer 41 is used for Adjacent two circuit board units 40 are fixed together, and the conductive paste 42 is used to fix and electrically conduct the fine lines 30 of each adjacent two circuit board units 40. After the fine lines 30 are stacked, a conductive circuit layer of the circuit board 200 is formed, and a thick copper fine line of the conductive circuit layer is realized.

In summary, in the method for manufacturing a circuit board with thin circuits and the circuit board manufactured by the present invention, the thickness of copper can be arbitrarily increased, so that thick copper thin circuits can be manufactured, that is, the width of the thin circuits can be maintained. Unchanged, so that the fine lines are not limited by the thickness of copper. Since the fine lines are formed by electroplating, the burr phenomenon formed when the copper layer is etched to form conductive lines is avoided, and the problem of air bubbles filled with ink between conductive lines is avoided. .

In summary, the present invention has indeed met the requirements for an invention patent, and a patent application was filed in accordance with the law. However, the above are only for the preferred embodiments of the present invention and the data listed are for testing and reference, and cannot be used to limit the scope of patent application in this case. For example, those who are familiar with the skills of this case and equivalent modifications or changes made in accordance with the spirit of the present invention should be covered by the following patent applications.

Claims (10)

A method for manufacturing a circuit board unit with fine lines includes the following steps: providing a support plate, and bonding a layer of a peelable conductive film on the support plate; forming a layer of an insulating substrate on the surface of the peelable conductive film; Forming a plurality of openings in the material, the openings exposing the peelable conductive film; electroplating conductive metal on the surface of the peelable conductive film exposed by the plurality of openings to form fine lines; and removing the peelable from the surface of the peelable conductive film The conductive film and the support plate are used to obtain a circuit board unit with a fine circuit. The circuit board unit with the fine circuit includes an insulating substrate and a thin circuit formed in the insulating substrate. The opposite two surfaces of the insulating substrate are flush. The method for manufacturing a circuit board unit with a fine line according to claim 1, wherein the insulating substrate is a photosensitive insulating substrate, and the plurality of openings are formed by a lithography process. The method for manufacturing a circuit board unit with a fine line according to claim 1, wherein the insulating substrate is a thermosetting resin, and the plurality of openings are formed by laser ablation. The method for manufacturing a circuit board unit with a thin line according to claim 1, wherein a thickness of the thin line formed is consistent with a thickness of the insulating base material. The method for manufacturing a circuit board unit with a fine line according to claim 1, wherein the supporting board is a single-sided copper-clad substrate, and the single-sided copper-clad substrate includes an insulating layer and a copper foil layer formed on a surface of the insulating layer. The peelable conductive film is adhered to the surface of the copper foil layer. A method for manufacturing a circuit board with fine lines, the steps are as follows: provide at least two circuit board units as described in any one of claims 1 to 5; and press each circuit board unit to another circuit board unit. The combined surface is called a pressing surface. A layer of adhesive is pasted on the insulating substrate of the pressing surface of one of the two adjacent circuit board units to be pressed together. A layer of conductive paste is printed on the surface of the thin circuit of the pressing surface of the opposite circuit board unit; the two pressing surfaces respectively provided with the adhesive layer and the conductive paste are pressed together, and the insulation of each circuit board unit is made. The substrates are aligned, and the thin lines are aligned. The insulating substrates of the at least 2 circuit board units are fixed by the adhesive layer, and the thin lines of the at least 2 circuit boards are fixed and electrically connected by the conductive paste. Form a circuit board with fine lines. A circuit board with fine lines includes at least two circuit board units with fine lines, and at least two of the circuit board units are sequentially stacked together, and each circuit board unit includes an insulating substrate and an insulating substrate formed in the insulating substrate. A plurality of openings, in which a thin line is formed, opposite ends of the thin line are flush with the opposite two surfaces of the insulating substrate, between the insulating substrates of each adjacent two circuit board units An adhesive layer is provided, and a conductive paste is provided between the thin lines of each adjacent two circuit board units. The adhesive layer is used to fix each adjacent two circuit board units. The conductive paste is used for The thin wires of each two adjacent circuit board units are fixed and electrically connected. The circuit board according to claim 7, wherein the insulating substrate is a photosensitive insulating substrate. The circuit board according to claim 7, wherein the insulating substrate is a thermosetting resin. The circuit board according to claim 7, wherein the adhesive layer is a prepreg.