CN102487579B - Preparation method of metamaterial and the same - Google Patents
Preparation method of metamaterial and the same Download PDFInfo
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- CN102487579B CN102487579B CN 201110260999 CN201110260999A CN102487579B CN 102487579 B CN102487579 B CN 102487579B CN 201110260999 CN201110260999 CN 201110260999 CN 201110260999 A CN201110260999 A CN 201110260999A CN 102487579 B CN102487579 B CN 102487579B
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Abstract
Embodiments of the invention provide a preparation method of a metamaterial. The method comprises the following steps: adding a liquid-state high-molecular material in a mold and heating and curing to a viscous flow state so as to obtain a first flaky sheet material; aligning and pasting a first PCB possessing a metal microstructure array on the first flaky sheet material; further adding the liquid-state high-molecular material in the mold and heating and curing to the viscous flow state, and forming a second flaky sheet material on the first PCB; aligning and pasting a second PCB possessing the metal microstructure array on the second flaky sheet material. The embodiments of the invention also provide the metamaterial prepared by using the above preparation method. By using the method ofthe invention, malposition of the metal microstructure array on the PCB can be modified. Therefore, a preparation risk can be reduced and metamaterial quality can be guaranteed.
Description
[technical field]
The present invention relates to artificial compounded material technology field, be specifically related to a kind of super preparation methods and super material.
[background technology]
Super material refers to artificial composite structure or the composite material that some have the not available extraordinary physical property of natural material.Structurally ordered design by on the key physical yardstick of material can break through the restriction of some apparent natural law, thereby obtains to exceed the meta-materials function of the intrinsic common character of nature.The course of processing of super material mainly is that the pcb board that has metal micro structure array is together laminated, fills other media between the laminate.In stacked pcb board process with metal micro structure array, need each laminate whole, and need be with the metal micro structure array alignment of different pcb board layers.
In the prior art, the mode of co-curing is adopted in the preparation of super material, the pcb board that just multilayer is had the metal micro structure array one-shot forming behind the mould of packing into, co-curing causes the metal micro structure array dislocation on the pcb board layer easily, but can't revise, cause parts scrap, the development risk is bigger.
[summary of the invention]
Technical problem to be solved by this invention provides a kind of super preparation methods and super material, can avoid metal micro structure array dislocation on the pcb board, and situation about can't revise, thereby reduce the preparation risk, guarantee the quality of super material.
For solving the problems of the technologies described above, one embodiment of the invention provides a kind of super preparation methods, comprising:
In mould, add the liquid macroimolecule material, be heating and curing to viscous state and obtain the first sheet sheet material;
Paste first pcb board with metal micro structure array in described first sheet sheet material alignment;
In described mould, further add the liquid macroimolecule material, be heating and curing to viscous state, form the second sheet sheet material at described first pcb board;
Paste second pcb board with metal micro structure array in described second sheet sheet material alignment.
Another embodiment of the present invention also provides a kind of super material that adopts above-mentioned super preparation methods preparation.
Compared with prior art, technique scheme has the following advantages: the mode that adopts step curing, after with pcb board and the precuring of macromolecule sheet sheet material, can see intuitively whether pcb board has the metal micro structure array dislocation, can be by the position of adjusting pcb board that metal micro structure array is neat, thereby reduce the preparation risk, guarantee the super quality of materials of preparation.
[description of drawings]
In order to be illustrated more clearly in the technical scheme in the embodiment of the invention, the accompanying drawing of required use is done to introduce simply in will describing embodiment below, apparently, accompanying drawing in describing below only is some embodiments of the present invention, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is a kind of super preparation methods flow chart that the embodiment of the invention one provides;
Fig. 2 is a kind of super preparation methods flow chart that the embodiment of the invention two provides;
Fig. 3 is a kind of super preparation methods flow chart that the embodiment of the invention three provides;
Fig. 4 is the structural representation of a kind of super material of providing of the embodiment of the invention four.
[embodiment]
Below in conjunction with the accompanying drawing in the embodiment of the invention, the technical scheme in the embodiment of the invention is clearly and completely described, obviously, described embodiment only is the present invention's part embodiment, rather than whole embodiment.Based on the embodiment among the present invention, those of ordinary skills belong to the scope of protection of the invention not making all other embodiment that obtain under the creative work prerequisite.
Embodiment one,
Referring to Fig. 1, be a kind of super preparation methods flow chart that the embodiment of the invention one provides, this preparation method comprises:
S101: in mould, add the liquid macroimolecule material, be heating and curing to viscous state, obtain the first sheet sheet material.
Concrete, the liquid macroimolecule material is thermosetting resin, as epoxy resin and organic siliconresin.
Wherein, the volume that adds macromolecular material in the mould designs according to concrete requirement, for example, is the 48-60 milliliter; The temperature that is heating and curing is generally set according to the kind of macromolecular material, and for example macromolecular material is organic siliconresin, and then adding the temperature of solidifying is 105-115 ℃.
S102: first pcb board that on the first sheet sheet material, stickup is had metal micro structure array.
Wherein, each metal micro structure in the metal micro structure array is zhou duicheng tuxing, for example, and " worker " font and the figure of deriving thereof, " greatly " font and the figure of deriving thereof; Also can be non-zhou duicheng tuxing, for example, " Swastika " font and the figure of deriving thereof, parallelogram.
S103: in mould, further add the liquid macroimolecule material, be heating and curing to viscous state, form the second sheet sheet material at first pcb board.
S104: paste second pcb board with metal micro structure array in the alignment of the second sheet sheet material.
In the present embodiment, adopt the mode of step curing, after with pcb board and the precuring of macromolecule sheet sheet material, can see intuitively whether pcb board has the metal micro structure array dislocation, can be by the position of adjusting pcb board that metal micro structure array is neat, thereby reduce the preparation risk, guarantee the super quality of materials of preparation.
Embodiment two,
Referring to Fig. 2, be a kind of method flow diagram for preparing super material that the embodiment of the invention two provides, this preparation method comprises:
S201: form metal level at substrate.
Concrete, can adopt the mode of on substrate, pasting layer of metal with binding agent; Perhaps, adopt the mode of evaporated metal layer on substrate.
S202: at metal level coating one deck photoresist.
S203: photoresist is carried out photoetching according to default metal micro structure array figure.
Wherein, each metal micro structure in the metal micro structure array is zhou duicheng tuxing, for example, and " worker " font and the figure of deriving thereof, " greatly " font and the figure of deriving thereof; Also can be non-zhou duicheng tuxing, for example, " Swastika " font and the figure of deriving thereof, parallelogram.
S204: adopt etched mode that the figure on the photoresist is transferred on the metal level, obtain first pcb board.
S205: in mould, add the liquid organosilicon resin, be heating and curing to viscous state and obtain the first sheet sheet material.
S206: first pcb board that will have metal micro structure array presses on the first sheet sheet material of viscous state.
S207: in mould, further add the liquid organosilicon resin, be heating and curing to viscous state, form the second sheet sheet material at first pcb board.
S208: second pcb board that will have metal micro structure array presses on the second sheet sheet material of viscous state.
Wherein, the preparation process of second pcb board repeats no more referring to S201 to S204 herein.
Present embodiment during the preparation micro-structural, adopts etched mode that the figure on the photoresist is transferred on the metal level with respect to embodiment one; High-molecular organic material adopts organic siliconresin.
Embodiment three,
Referring to Fig. 3, be a kind of method flow diagram for preparing super material that the embodiment of the invention three provides, this preparation method comprises:
S301: form metal level at substrate.
Concrete, can adopt the mode of on substrate, pasting layer of metal with binding agent; Perhaps, adopt the mode of evaporated metal layer on substrate.
S302: at metal level coating one deck photoresist.
S303: photoresist is carried out photoetching according to default metal micro structure array figure.
Wherein, each metal micro structure in the metal micro structure array is zhou duicheng tuxing, for example, and " worker " font and the figure of deriving thereof, " greatly " font and the figure of deriving thereof; Also can be non-zhou duicheng tuxing, for example, " Swastika " font and the figure of deriving thereof, parallelogram.
S304: adopt the mode of etching that the figure on the photoresist is transferred on the metal level, obtain first pcb board.
S305: in mould, add liquid-state epoxy resin, be heating and curing to viscous state, obtain the first sheet sheet material.
S306: first pcb board that has metal micro structure array in the first sheet sheet material alignment pressing of viscous state.
S307: in mould, further add liquid-state epoxy resin, be heating and curing to viscous state, form the second sheet sheet material at first pcb board.
S308: second pcb board that has metal micro structure array in the second sheet sheet material alignment pressing of viscous state.
Wherein, the preparation process of second pcb board repeats no more referring to S301 to S304 herein.
Present embodiment during the preparation micro-structural, adopts the mode of etching that the figure on the photoresist is transferred on the metal level with respect to embodiment two; In addition, macromolecular material adopts epoxy resin.
Referring to Fig. 4, the structural representation of a kind of super material that provides for the embodiment of the invention four comprises:
At least two-layer pcb board 402 with metal micro structure array 401; And two-layer at least macromolecular material 403.
Wherein, the liquid macroimolecule material is thermosetting resin, as organic silicones and epoxy resin.
Wherein, each metal micro structure in the metal micro structure array 401 is zhou duicheng tuxing, for example, and " worker " font and the figure of deriving thereof, " greatly " font and the figure of deriving thereof; Also can be non-zhou duicheng tuxing, for example, " Swastika " font and the figure of deriving thereof, parallelogram.
The super material that present embodiment provides, adopt the mode of step curing, after with pcb board and the precuring of macromolecule sheet sheet material, can see intuitively whether pcb board has the metal micro structure array dislocation, can be by the position of adjusting pcb board that metal micro structure array is neat, thereby reduce the preparation risk, guarantee the super quality of materials of preparation.
More than the embodiment of the invention is described in detail, used specific case herein principle of the present invention and execution mode set forth, the explanation of above embodiment just is used for helping to understand method of the present invention and core concept thereof; Simultaneously, for one of ordinary skill in the art, according to thought of the present invention, the part that all can change in specific embodiments and applications, in sum, this description should not be construed as limitation of the present invention.
Claims (10)
1. a super preparation methods is characterized in that, comprising:
In mould, add the liquid macroimolecule material, be heating and curing to viscous state and obtain the first sheet sheet material;
Paste first pcb board with metal micro structure array in described first sheet sheet material alignment;
In described mould, further add the liquid macroimolecule material, be heating and curing to viscous state, form the second sheet sheet material at described first pcb board;
Paste second pcb board with metal micro structure array at the described second sheet sheet material, adjust the position of described second pcb board, the micro structure array on described the 2nd PCB metal is alignd with metal micro structure array on described first pcb board.
2. method according to claim 1 is characterized in that, also comprises before the described method:
Form metal level at substrate;
Adopt the mode of photoetching, etching or etch metal micro structure array on metal level obtains to have first pcb board of metal micro structure array.
3. method according to claim 2 is characterized in that, each metal micro structure in the described metal micro structure array is zhou duicheng tuxing.
4. method according to claim 3 is characterized in that, described zhou duicheng tuxing comprises: " worker " font and the figure of deriving thereof, " greatly " font and the figure of deriving thereof.
5. method according to claim 2 is characterized in that, each metal micro structure in the described metal micro structure array is non-zhou duicheng tuxing.
6. method according to claim 5 is characterized in that, described non-zhou duicheng tuxing comprises: “ Swastika " font and the figure of deriving thereof, parallelogram.
7. method according to claim 1 is characterized in that, and is described before described second sheet sheet material alignment stickup has second pcb board of metal micro structure array, also comprises:
Form metal level at substrate;
Adopt the mode of photoetching, etching or etch metal micro structure array on metal level obtains to have second pcb board of metal micro structure array.
8. method according to claim 1 is characterized in that, described macromolecular material is the liquid thermosetting resin.
9. method according to claim 8 is characterized in that, described liquid thermosetting resin is epoxy resin or organic siliconresin.
10. a super material is characterized in that, comprises the super material that adopts any described method preparation of claim 1 to 9.
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| CN 201110260999 CN102487579B (en) | 2011-09-05 | 2011-09-05 | Preparation method of metamaterial and the same |
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| CN 201110260999 CN102487579B (en) | 2011-09-05 | 2011-09-05 | Preparation method of metamaterial and the same |
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| CN102487579B true CN102487579B (en) | 2013-09-04 |
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| CN104345358B (en) | 2013-07-26 | 2016-02-10 | 上海煦源生物科技有限公司 | Stripping-mounting method is utilized to make the method for metal micro-nano structure at fiber end face |
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| CN1241894A (en) * | 1998-05-14 | 2000-01-19 | 松下电器产业株式会社 | Circuit board and its producing method |
| JP2006114489A (en) * | 2004-09-14 | 2006-04-27 | Nagoya Institute Of Technology | Dielectric meta-material and magnetic substance meta-material |
| CN101087495A (en) * | 2006-06-06 | 2007-12-12 | 冠品化学股份有限公司 | Making method of multi-layer printed circuit board without leading hole |
| CN101203095A (en) * | 2006-12-13 | 2008-06-18 | 富葵精密组件(深圳)有限公司 | Method for preparation of multi-layer flexible circuit board |
| CN101346043A (en) * | 2007-07-13 | 2009-01-14 | 阿克泰克萨特株式会社 | Method for manufacturing flexible printed circuit board and metallic wiring pattern of flexible printed circuit board using thereof |
| CN101466207A (en) * | 2007-12-19 | 2009-06-24 | 富葵精密组件(深圳)有限公司 | Circuit board and preparation method thereof |
| JP2009177005A (en) * | 2008-01-25 | 2009-08-06 | Nitto Denko Corp | Method of producing wiring circuit board |
| CN101765358A (en) * | 2008-12-25 | 2010-06-30 | 西北工业大学 | Meta-material absorber based on dendritic structure |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB0704642D0 (en) * | 2007-03-09 | 2007-04-18 | Strep Ltd | Security mark |
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Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1241894A (en) * | 1998-05-14 | 2000-01-19 | 松下电器产业株式会社 | Circuit board and its producing method |
| JP2006114489A (en) * | 2004-09-14 | 2006-04-27 | Nagoya Institute Of Technology | Dielectric meta-material and magnetic substance meta-material |
| CN101087495A (en) * | 2006-06-06 | 2007-12-12 | 冠品化学股份有限公司 | Making method of multi-layer printed circuit board without leading hole |
| CN101203095A (en) * | 2006-12-13 | 2008-06-18 | 富葵精密组件(深圳)有限公司 | Method for preparation of multi-layer flexible circuit board |
| CN101346043A (en) * | 2007-07-13 | 2009-01-14 | 阿克泰克萨特株式会社 | Method for manufacturing flexible printed circuit board and metallic wiring pattern of flexible printed circuit board using thereof |
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| JP2009177005A (en) * | 2008-01-25 | 2009-08-06 | Nitto Denko Corp | Method of producing wiring circuit board |
| CN101765358A (en) * | 2008-12-25 | 2010-06-30 | 西北工业大学 | Meta-material absorber based on dendritic structure |
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