CN204046940U - The encapsulating structure of novel embedded type component and circuit board - Google Patents
The encapsulating structure of novel embedded type component and circuit board Download PDFInfo
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- CN204046940U CN204046940U CN201420484667.9U CN201420484667U CN204046940U CN 204046940 U CN204046940 U CN 204046940U CN 201420484667 U CN201420484667 U CN 201420484667U CN 204046940 U CN204046940 U CN 204046940U
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- circuit board
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- 238000004806 packaging method and process Methods 0.000 abstract description 3
- 238000005516 engineering process Methods 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000012792 core layer Substances 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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- Structure Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The utility model provides a kind of encapsulating structure of novel embedded type component, comprises multilayer circuit board, and described multilayer circuit board comprises the pcb board, glue-line and the FPC plate that set gradually, and described FPC plate is electrically connected with pcb board; Described multilayer circuit board is provided with some flutings, and described fluting runs through pcb board and glue-line; The circuit incoming end for being connected with multilayer circuit board by the components and parts of inserting in fluting is provided with in described fluting.The utility model also provides a kind of circuit board of novel embedded type component.The flush type that the utility model realizes components and parts is installed, and reduces multiple-plate thickness; Achieve being separated of pcb board and components and parts, components and parts are inserted in chip groove after base plate for packaging fluting again, protects components and parts, reduce the scrappage of components and parts, saved great amount of cost.
Description
Technical field
The utility model relates to a kind of encapsulating structure of circuit board, particularly the encapsulating structure of novel embedded type component and circuit board.
Background technology
Volume is little, lightweight, thickness is thin is a development trend of electronic product, and the components and parts in traditional circuit-board are all arranged on circuit board surface, certainly will add circuit board thickness like this, also cannot be used for manufacturing multilayer circuit board simultaneously.Small and exquisite and frivolous in order to what electronic product was done, flush type multilayer circuit board arises at the historic moment.As its name suggests, flush type multilayer circuit board is exactly electronic devices and components are embedded to inner circuit board.
More common a kind of flush type encapsulating structure is by implanted chip pcb board now, is then sticked with glue by pcb board and links on FPC plate, make it connect closely again after adhesion through moulding.This encapsulating structure no doubt meets the requirement of flush type, but currently still there is some shortcomings part: 1, in the current state-of-the-art, pcb board obtains yield can only reach 95%, when adopting above-mentioned encapsulating structure, when pcb board is scrapped, the chip implanted wherein can not re-use.But the price of pcb board is comparatively cheap, and chip is expensive, causes chip to be wasted because pcb board is defective, makes the multiple-plate cost of flush type significantly promote.2, easily damaged by pressure by chip in moulding process, this is also the Another reason causing cost higher.
Utility model content
The utility model object is to overcome the deficiencies in the prior art, provides a kind of encapsulating structure of novel embedded type component, realizes imbedding of components and parts, and the destruction avoided components and parts and waste.
Another object of the utility model is the circuit board in order to provide a kind of novel embedded type component.
In order to achieve the above object, the utility model is by the following technical solutions:
An encapsulating structure for novel embedded type component, comprises multilayer circuit board, and described multilayer circuit board comprises the pcb board, glue-line and the FPC plate that set gradually; Described multilayer circuit board is provided with some flutings, and described fluting runs through pcb board and glue-line; The circuit incoming end for being connected with multilayer circuit board by the components and parts of inserting in fluting is provided with in described fluting.
As preferably, described circuit incoming end is arranged on the bottom of fluting.
As preferably, described fluting is chip groove.
A circuit board for novel embedded type component, comprises described encapsulating structure, arranges at least one components and parts in described fluting, and described components and parts are electrically connected with circuit incoming end.
As preferably, stacked at least two components and parts in described fluting.
Compared with prior art, the utility model has following beneficial effect:
By notching construction, the flush type realizing components and parts is installed, and reduces multiple-plate thickness.Achieve being separated of pcb board and components and parts by said structure, components and parts are inserted in chip groove after base plate for packaging fluting again, protects components and parts, reduce the scrappage of components and parts, saved great amount of cost.
Accompanying drawing explanation
Fig. 1 is the structural representation of the encapsulating structure of novel embedded type component of the present utility model;
Fig. 2 is the structural representation of the circuit board of novel embedded type component of the present utility model.
In figure:
11-pcb board; 12-glue-line; 13-FPC plate; 14-fluting; 2-chip.
Now the utility model is described in further detail with specific embodiment by reference to the accompanying drawings.
Embodiment
As shown in Figure 1, be the encapsulating structure of a kind of novel embedded type component described in the utility model, comprise multilayer circuit board, multilayer circuit board comprises the pcb board 11, glue-line 12 and FPC plate 13, the FPC plate 13 that stack gradually and is electrically connected with pcb board 11; Multilayer circuit board is provided with some flutings 14, fluting 14 runs through pcb board 11 and glue-line 12; Be provided with the circuit incoming end for being connected with multilayer circuit board by the components and parts of inserting in fluting in fluting 14, circuit incoming end is electrically connected with pcb board 11 and/or FPC plate 13.Circuit incoming end can be arranged on the bottom of fluting 14.When fluting 14 can be chip 2 groove.
As shown in Figure 2, for the circuit board of a kind of novel embedded type component described in the utility model, comprise above-mentioned encapsulating structure, and in fluting 14, put components and parts such as chip 2 grade, and these components and parts can stackedly be placed, components and parts such as chip 2 grade are electrically connected with circuit incoming end.The components and parts being placed in fluting 14 can be electrically connected to each other.
The practical application of the utility model encapsulating structure: components and parts such as chip 2 grade are inserted in the fluting in the encapsulating structure of novel embedded type component described in the utility model, stacked one by one; And by demand, components and parts such as chip 2 grade are electrically connected with pcb board 11 and/FPC plate 13.
The effect of the part-structure of the encapsulating structure of novel embedded type component described in the utility model:
Glue-line 12: for connecting PCB board 11 and FPC plate 13.
Fluting 14: for components and parts such as chip placement 2 grade; Fluting 14 runs through pcb board 11 and glue-line 12, ensures that the electrical connection of components and parts in fluting 14 and pcb board 11 and FPC plate 13 is more convenient.
Circuit incoming end: arrange circuit incoming end in fluting 14 inside, makes the circuit of the components and parts access pcb board 11 in fluting 14 or FPC plate 13 more direct, reduces the impact of external conducting medium on multilayer circuit board, also reduce quality and the thickness of multilayer circuit board.
The multilayer circuit board of pcb board 11, glue-line 12 and FPC plate 13 composition: volume is little, quality is light because high density assembling, line minimizing between parts (comprising parts), thus add reliability; Can wiring layers be increased, then increase design flexibility, can be formed and there is certain high speed transmission circuit; Can initialization circuit, electro-magnetic screen layer; Also metal core layer can be installed, meet function and the demands such as special heat is heat insulation; Easy for installation, reliability is high.Pcb board 11 and FPC plate 13 combine mutually, can possess the advantage of FPC, and strengthen bulk strength by pcb board 11.
The flush type that the utility model realizes components and parts is installed, and reduces multiple-plate thickness.Achieve being separated of pcb board 11 and chip 2 (components and parts); chip 2 (components and parts) is inserted in fluting 14 again after base plate for packaging fluting 14; protect chip 2 (components and parts), reduce the scrappage of chip 2 (components and parts), saved great amount of cost.
The utility model is not limited to above-mentioned execution mode, if do not depart from spirit and scope of the present utility model to various change of the present utility model or modification, if these are changed and modification belongs within claim of the present utility model and equivalent technologies scope, then the utility model is also intended to comprise these changes and variation.
Claims (5)
1. an encapsulating structure for novel embedded type component, is characterized in that, comprises multilayer circuit board, and described multilayer circuit board comprises the pcb board, glue-line and the FPC plate that set gradually; Described multilayer circuit board is provided with some flutings, and described fluting runs through pcb board and glue-line; The circuit incoming end for being connected with multilayer circuit board by the components and parts of inserting in fluting is provided with in described fluting.
2. the encapsulating structure of novel embedded type component according to claim 1, is characterized in that, described circuit incoming end is arranged on the bottom of fluting.
3. the encapsulating structure of novel embedded type component according to claim 1 and 2, is characterized in that, described fluting is chip groove.
4. a circuit board for novel embedded type component, is characterized in that, comprises encapsulating structure as claimed in claim 1 or 2, arranges at least one components and parts in described fluting, and described components and parts are electrically connected with circuit incoming end.
5. the circuit board of novel embedded type component according to claim 4, is characterized in that, stacked at least two components and parts in described fluting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420484667.9U CN204046940U (en) | 2014-08-26 | 2014-08-26 | The encapsulating structure of novel embedded type component and circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420484667.9U CN204046940U (en) | 2014-08-26 | 2014-08-26 | The encapsulating structure of novel embedded type component and circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204046940U true CN204046940U (en) | 2014-12-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420484667.9U Active CN204046940U (en) | 2014-08-26 | 2014-08-26 | The encapsulating structure of novel embedded type component and circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204046940U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104159400A (en) * | 2014-08-26 | 2014-11-19 | 安捷利电子科技（苏州）有限公司 | Packaging structure and circuit board of novel embedded components |
| WO2020063645A1 (en) * | 2018-09-29 | 2020-04-02 | 维沃移动通信有限公司 | Circuit board structure and electronic device |
-
2014
- 2014-08-26 CN CN201420484667.9U patent/CN204046940U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104159400A (en) * | 2014-08-26 | 2014-11-19 | 安捷利电子科技（苏州）有限公司 | Packaging structure and circuit board of novel embedded components |
| WO2020063645A1 (en) * | 2018-09-29 | 2020-04-02 | 维沃移动通信有限公司 | Circuit board structure and electronic device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20231123 Address after: Room 530, Room 1303, No. 99 Songyu South Second Road, Xiamen Area, China (Fujian) Pilot Free Trade Zone, Xiamen City, Fujian Province, 361026 Patentee after: Agilent Meiwei Electronics (Xiamen) Co.,Ltd. Address before: 215129 No. 188 Lushan Road, Suzhou High-tech Zone, Jiangsu Province Patentee before: AKM ELECTRONICS TECHNOLOGY (SUZHOU) Co.,Ltd. |