CN206790781U - Printed substrate is with covering copper composite plate - Google Patents
Printed substrate is with covering copper composite plate Download PDFInfo
- Publication number
- CN206790781U CN206790781U CN201720470597.5U CN201720470597U CN206790781U CN 206790781 U CN206790781 U CN 206790781U CN 201720470597 U CN201720470597 U CN 201720470597U CN 206790781 U CN206790781 U CN 206790781U
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- China
- Prior art keywords
- copper foil
- foil layer
- layer
- adhesion coating
- insulated substrate
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
The utility model discloses a kind of printed substrate with covering copper composite plate, including insulated substrate, upper copper foil layer and lower copper foil layer, there is the first epoxy glue adhesion coating between the insulated substrate and upper copper foil layer, there is the second epoxy glue adhesion coating between the insulated substrate and lower copper foil layer；The insulated substrate is made up of epoxy resin cure layer and at least two glass fabric in epoxy resin cure layer, and at least two glass fabric is parallel and is positioned apart from epoxy resin cure layer；The surface that the upper copper foil layer contacts with the first epoxy glue adhesion coating has the first lug boss, and the surface that the lower copper foil layer contacts with the second epoxy glue adhesion coating has the second lug boss.The utility model printed substrate is come off with covering copper composite plate and avoid the copper foil in PCB following process and etching, is also beneficial to reduce resistivity when copper foil conduction, while both cause product to have pliability and folding resistance.
Description
Technical field
A kind of copper clad laminate is the utility model is related to, more particularly to printed substrate belongs to track with copper composite plate is covered
Road plate field.
Background technology
Printed substrate is the supplier of electronic component electrical connection, and the major advantage using wiring board is that integration is various
The set of electronic component and functional module, greatly reduce hand layouts and assembling mistake, improve electronic product assembling from
Dynamicization level and production efficiency.Wiring board is cut into certain size using insulation board as base material, thereon with multiple conductive patterns, and
Via hole is furnished with, realizes the interconnection between electronic component.
In the prior art because miniaturization of electronic products, the arranging density of device are stepped up, the radiating of heat is increasingly
Seriously, so as to influence the service life of electronic product, therefore, how on the premise of board area is not increased as far as possible, effectively
Heat dispersion is improved, turns into the direction of those of ordinary skill in the art's effort.
The content of the invention
The utility model purpose is to provide a kind of printed substrate with copper composite plate is covered, and the printed substrate is compound with copper is covered
Plate avoids the copper foil in PCB following process and etching and come off, and is also beneficial to reduce resistivity when copper foil conduction, simultaneously
Both so that product has pliability and folding resistance.
To reach above-mentioned purpose, the technical solution adopted in the utility model is：A kind of printed substrate with covering copper composite plate,
Including insulated substrate, upper copper foil layer and lower copper foil layer, there is the first epoxy glue adhesion coating between the insulated substrate and upper copper foil layer,
There is the second epoxy glue adhesion coating between the insulated substrate and lower copper foil layer；
The insulated substrate is by epoxy resin cure layer and at least two glass fabric in epoxy resin cure layer
Composition, at least two glass fabric is parallel and is positioned apart from epoxy resin cure layer；
The surface that the upper copper foil layer contacts with the first epoxy glue adhesion coating has the first lug boss, the lower copper foil layer and
The surface of diepoxy adhesive layer contact has the second lug boss.
Further improved scheme is as follows in above-mentioned technical proposal：
1. in such scheme, between adjacent first lug boss at intervals of 2 ~ 4mm.
2. in such scheme, between adjacent second lug boss at intervals of 2 ~ 4mm.
3. in such scheme, the thickness of the insulated substrate is 50 ~ 200 microns.
4. in such scheme, the insulated substrate is aluminium base, copper base or iron substrate.
Because above-mentioned technical proposal is used, the utility model has following advantages and effect compared with prior art：
The utility model printed substrate is with copper composite plate is covered, copper foil layer contacts with the first epoxy glue adhesion coating thereon surface
With the first lug boss, the surface that the lower copper foil layer contacts with the second epoxy glue adhesion coating has the second lug boss, both improves
The adhesive strength of copper foil layer and epoxy glue adhesion coating, coming off in PCB following process and etching copper foil is avoided, is also beneficial to drop
Resistivity when low copper foil conduction；Secondly, its insulated substrate is by epoxy resin cure layer and in epoxy resin cure layer
At least two glass fabric composition, at least two glass fabric is parallel and is positioned apart from epoxy resin cure layer
It is interior, both cause product that there is pliability, and also improve folding resistance.
Brief description of the drawings
Accompanying drawing 1 is the utility model printed substrate with covering copper composite plate structure schematic diagram.
In the figures above：1st, insulated substrate；2nd, upper copper foil layer；3rd, the first epoxy glue adhesion coating；4th, epoxy resin cure layer；5、
Lower copper foil layer；6th, the second epoxy glue adhesion coating；7th, glass fabric；8th, the first lug boss；9th, the second lug boss.
Embodiment
The utility model is further described with reference to embodiment：
Embodiment 1：A kind of printed substrate is with covering copper composite plate, including insulated substrate 1, upper copper foil layer 2 and lower copper foil layer
5, there is the first epoxy glue adhesion coating 3 between the insulated substrate 1 and upper copper foil layer 2, the insulated substrate 1 and lower copper foil layer 5 it
Between there is the second epoxy glue adhesion coating 6；
The insulated substrate 1 is by epoxy resin cure layer 4 and at least two glass fibers in epoxy resin cure layer 4
Dimension cloth 7 forms, and at least two glass fabric 7 is parallel and is positioned apart from epoxy resin cure layer 4；
The surface that the upper copper foil layer 2 contacts with the first epoxy glue adhesion coating 3 has the first lug boss 8, the lower copper foil layer 5
The surface contacted with the second epoxy glue adhesion coating 6 has the second lug boss 9.
Between adjacent first lug boss 8 at intervals of 3mm.
Between adjacent second lug boss 9 at intervals of 3mm.
The thickness of above-mentioned insulated substrate 1 is 100 microns.
Above-mentioned insulated substrate 1 is aluminium base.
Embodiment 2：A kind of printed substrate is with covering copper composite plate, including insulated substrate 1, upper copper foil layer 2 and lower copper foil layer
5, there is the first epoxy glue adhesion coating 3 between the insulated substrate 1 and upper copper foil layer 2, the insulated substrate 1 and lower copper foil layer 5 it
Between there is the second epoxy glue adhesion coating 6；
The insulated substrate 1 is by epoxy resin cure layer 4 and at least two glass fibers in epoxy resin cure layer 4
Dimension cloth 7 forms, and at least two glass fabric 7 is parallel and is positioned apart from epoxy resin cure layer 4；
The surface that the upper copper foil layer 2 contacts with the first epoxy glue adhesion coating 3 has the first lug boss 8, the lower copper foil layer 5
The surface contacted with the second epoxy glue adhesion coating 6 has the second lug boss 9.
Between adjacent first lug boss 8 at intervals of 2.4mm.
Between adjacent second lug boss 9 at intervals of 3.8mm.
The thickness of above-mentioned insulated substrate 1 is 150 microns.
Above-mentioned insulated substrate 1 is iron substrate.
During using above-mentioned printed substrate with copper composite plate is covered, copper foil layer contacts with the first epoxy glue adhesion coating thereon surface
With the first lug boss, the surface that the lower copper foil layer contacts with the second epoxy glue adhesion coating has the second lug boss, both improves
The adhesive strength of copper foil layer and epoxy glue adhesion coating, coming off in PCB following process and etching copper foil is avoided, is also beneficial to drop
Resistivity when low copper foil conduction；Secondly, its insulated substrate is by epoxy resin cure layer and in epoxy resin cure layer
At least two glass fabric composition, at least two glass fabric is parallel and is positioned apart from epoxy resin cure layer
It is interior, both cause product that there is pliability, and also improve folding resistance.
For above-described embodiment only to illustrate technical concepts and features of the present utility model, its object is to allow be familiar with technique
Personage can understand content of the present utility model and implement according to this, the scope of protection of the utility model can not be limited with this.
All equivalent change or modifications made according to the utility model Spirit Essence, should all cover the scope of protection of the utility model it
It is interior.
Claims (5)
1. a kind of printed substrate is with covering copper composite plate, it is characterised in that：Including insulated substrate（1）, upper copper foil layer（2）With lower copper
Layers of foil（5）, the insulated substrate（1）With upper copper foil layer（2）Between there is the first epoxy glue adhesion coating（3）, the insulated substrate（1）
With lower copper foil layer（5）Between there is the second epoxy glue adhesion coating（6）；
The insulated substrate（1）By epoxy resin cure layer（4）With positioned at epoxy resin cure layer（4）Interior at least two glass
Fiber cloth（7）Composition, at least two glass fabric（7）It is parallel and be positioned apart from epoxy resin cure layer（4）It is interior；
The upper copper foil layer（2）With the first epoxy glue adhesion coating（3）The surface of contact has the first lug boss（8）, the lower copper foil
Layer（5）With the second epoxy glue adhesion coating（6）The surface of contact has the second lug boss（9）.
2. printed substrate according to claim 1 is with covering copper composite plate, it is characterised in that：Adjacent first lug boss
（8）Between at intervals of 2 ~ 4mm.
3. printed substrate according to claim 1 is with covering copper composite plate, it is characterised in that：Adjacent second lug boss
（9）Between at intervals of 2 ~ 4mm.
4. printed substrate according to claim 1 is with covering copper composite plate, it is characterised in that：The insulated substrate（1）'s
Thickness is 50 ~ 200 microns.
5. printed substrate according to claim 1 is with covering copper composite plate, it is characterised in that：The insulated substrate（1）For
Aluminium base, copper base or iron substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720470597.5U CN206790781U (en) | 2017-04-29 | 2017-04-29 | Printed substrate is with covering copper composite plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720470597.5U CN206790781U (en) | 2017-04-29 | 2017-04-29 | Printed substrate is with covering copper composite plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206790781U true CN206790781U (en) | 2017-12-22 |
Family
ID=60710295
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720470597.5U Active CN206790781U (en) | 2017-04-29 | 2017-04-29 | Printed substrate is with covering copper composite plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206790781U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020258161A1 (en) * | 2019-06-27 | 2020-12-30 | 瑞声声学科技(深圳)有限公司 | Printed circuit board and method for manufacturing same |
| CN114828447A (en) * | 2021-01-28 | 2022-07-29 | 鹏鼎控股(深圳)股份有限公司 | Circuit board and manufacturing method thereof |
-
2017
- 2017-04-29 CN CN201720470597.5U patent/CN206790781U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020258161A1 (en) * | 2019-06-27 | 2020-12-30 | 瑞声声学科技(深圳)有限公司 | Printed circuit board and method for manufacturing same |
| CN114828447A (en) * | 2021-01-28 | 2022-07-29 | 鹏鼎控股(深圳)股份有限公司 | Circuit board and manufacturing method thereof |
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