CN103906344B - Heat-conducting type double-sided PCB - Google Patents
Heat-conducting type double-sided PCB Download PDFInfo
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- CN103906344B CN103906344B CN201310750308.3A CN201310750308A CN103906344B CN 103906344 B CN103906344 B CN 103906344B CN 201310750308 A CN201310750308 A CN 201310750308A CN 103906344 B CN103906344 B CN 103906344B
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Abstract
The invention discloses a kind of heat-conducting type double-sided PCB, including insulated base material layer and be arranged on above insulated base material layer upper integrated circuit layer and it is following under integrated line layer, adhesive-layer bonding is provided with therebetween to be integrated, upper integrated circuit layer is to fill veneer as electronic component using what Copper Foil made, under integrated line layer be aluminium foil make serve as transmission of electricity and signal transmission thermal conductive surface, insulated base material layer is communicated with the via of integrated circuit layer integrated line layer with, and upper integrated circuit layer stretches downwards integrated line layer under contact along via；The present invention is intended to provide wherein one side uses copper material uses aluminium to meet the heat-conducting type double-sided PCB of the requirement of power supply and signal transmission and heat conduction to meet the requirement of electronic component dress patch and scolding tin link, another side, the present invention realizes two sides integrated circuit safety, effectively transmission signal and heat conduction, radiate and allow the longer technique effect of the service life of electronic component.
Description
Technical field
The present invention relates to a kind of LED circuit board, more specifically, more particularly to a kind of heat-conducting type double-sided PCB.
Background technology
Traditional LED circuit board, mainly has a ceramic circuit board and aluminum base circuit board in current market, ceramic base circuit board by
In its material expensive, manufacture craft is numerous and diverse, and production equipment is special, the yield rate not low factor of high efficiency, constrains ceramics
Application of the base circuit board on heat-conducting type circuit board, and aluminum base circuit board, are largely used.Aluminium base heat-conducting type wiring board
In, single-side aluminum circuit board and double-side aluminum circuit board are generally divided into, single-side aluminum circuit board is widely used, but with
The development that becomes more meticulous in market, the aluminum base circuit board of individual layer integrated circuit cannot meet the requirement that market becomes more meticulous, Gu Dancengji
Aluminum base circuit board into circuit must develop (i.e. double-side aluminum circuit board) to the aluminum base circuit board of double-deck integrated circuit, tradition
The manufacture craft of double-side aluminum circuit board be generally aluminium base processing via --- resin fill with via --- two-sided system of aluminium base
--- --- --- aluminium base covers Copper base material secondary drilling --- electroless copper --- plating to hot pressing to aluminium base double-sided copper-clad to make insulating barrier
Copper --- --- --- --- examine second time electroplating copper integrated circuit image transfer formation two-sided patch dry film by electrotinning --- corrosion --- circuit
--- shaping, whole process is numerous and diverse, there is secondary drilling, and its accuracy will for insulating protective layer processing --- note processing --- for survey
Ask also high, it is often more important that it requires the electroplating technologies such as electroless copper, electro-coppering, electrotinning, very big to environmental nuisance, to accomplish
Plating is reduced, pollution is reduced, clean manufacturing must just be modified, to the structure of double-side aluminum circuit board so that not using
Electroplating technology can just reach the various functions index of heat-conducting type double-sided PCB.
Further, it is known that aluminum metal is very easy to oxidation, it is corroded under the conditions of acid, alkali and easily, more cannot
The dress patch of electronic component, scolding tin connection etc. are directly carried out on aluminum surfaces, under the conditions of existing maturation process, be in aluminium table
Face dress patch electronic component carries out scolding tin connection etc., and one kind is that another kind is in aluminium surface in one layer of Copper Foil of aluminium surface hot pressing
One layer of copper is plated after zinc-plated nickel plating again, both the above technique, its totle drilling cost has exceeded the cost of Copper Foil, but also there is quality wind
Danger, and environment is polluted, therefore be not used.Two-sided integrated circuit board, in addition to dress patch electronic component, another critical function is just
It is the conducting of two-layer integrated circuit, is easily aoxidized based on aluminium, it is known in current industry easily by reasons such as acid, caustic corrosions
Plating conducting method, passes through silver, passes through copper, passes through carbon conducting method, passes through the conduction modes such as tin welding conducting method, all has not been able to make two sides aluminium knot
The double-sided PCB of structure or the face copper material structure of a face aluminium one is safely and effectively turned on.
The content of the invention
The technical problem to be solved in the present invention is directed to the above-mentioned deficiency of prior art, there is provided wherein one side use copper material with
Meet the requirement of electronic component dress patch and scolding tin link, another side and use aluminium and powered and signal transmission and heat conduction with meeting
It is required that and realize the heat-conducting type double-sided PCB of copper material and aluminium effectively conducting, realizing that it is same that copper material and aluminium can be turned on effectively
When by using aluminium heat dissipation characteristics realize have good heat-conducting effect.With safety, effectively transmission signal and heat conduction, dissipate
Heat and allow the longer technique effect of the service life of electronic component.
The technical scheme is that such：A kind of heat-conducting type double-sided PCB, including insulated base material layer and be arranged on
Above insulated base material layer upper integrated circuit layer and it is following under integrated line layer, wherein：Upper integrated circuit layer is used as electronics unit
Device fills veneer, under integrated line layer be the thermal conductive surface for serving as transmission of electricity and signal transmission that aluminium foil makes, insulated base material layer is provided with
The via of integrated circuit layer integrated line layer with in connection, upper integrated circuit layer stretches downwards integrated under contacting along via
Line layer.
A kind of above-mentioned heat-conducting type double-sided PCB, insulated base material layer is glass fabric or Kapton or poly- carbon
Acid esters film or polyester film or ceramic material and it is two-sided constituted with adhesive-layer, or the adhesive-layer of pure tacky film is constituted, on
Integrated circuit layer integrated line layer with is bonded by adhesive-layer and is integrated.
A kind of above-mentioned heat-conducting type double-sided PCB, upper integrated circuit layer outer surface of integrated line layer with is provided with and carries
The insulating protective layer of gluing composite bed.The viscose glue carried by protective layer upper and lower two-layer integrated circuit of sealing at via
Contact point, is allowed to turn into permanent conducting body with air exclusion, realizes that contact effect is good and increase the service life.
A kind of above-mentioned heat-conducting type double-sided PCB, upper integrated circuit layer is that can meet the gold that welding electronics unit device is requirement
Category material, metal material is using Copper Foil or electro-coppering or electronickelling or coated copper or coats nickel making, to ensure the integrated line with
Road floor is effectively turned on.
A kind of above-mentioned heat-conducting type double-sided PCB, via to upper integrated circuit layer surface stretch formation downwards
The adhesive or nonconducting adhesive sealing of conduction are provided with pit.By adhesive viscose glue, sealing is upper and lower at via
The contact point of two-layer integrated circuit, is allowed to turn into permanent conducting body with air exclusion.
A kind of above-mentioned heat-conducting type double-sided PCB, one layer of conductive viscose layer or conductive solder are provided with along conducting wall surface of the hole
Layer.By connecting the upper integrated circuit stretched downwards along the via layer space that integrated line layer is formed with after heating, can increase
Plus conducting sectional area realizes conduction superior technique effect.Conducting solder layer makes by when condition 180 degree~280 degree are heated
Fusing is integrated, and makes physical contact that the technique effect of sealing conducting is realized while conducting.
A kind of above-mentioned heat-conducting type double-sided PCB, adhesive-layer and insulating protective layer thermal conductivity factor are according to board design requirement
And be defined as heat conduction or not heat conduction.
A kind of above-mentioned heat-conducting type double-sided PCB, fills at via while insulating protective layer is covered by hot pressing
The upper integrated circuit layer pit that stretching is formed downwards.The viscose glue carried by protective layer upper and lower two-layer collection of sealing at via
Into the contact point of circuit, it is allowed to turn into permanent conducting body with air exclusion, realizes that contact effect is good and increase the service life.
A kind of above-mentioned heat-conducting type double-sided PCB, the upper integrated circuit layer relative with via is provided with leading than insulating barrier
The small perforate in the aperture of through hole, the hole edge via of the perforate stretches downwards integrated line layer under contact.
A kind of above-mentioned heat-conducting type double-sided PCB, conductive viscose layer or conducting solder layer are complete in whole via inner ring
Portion is covered with or part makes.
A kind of above-mentioned heat-conducting type double-sided PCB, insulating protective layer can be diaphragm or dielectric ink or paint or pure
Glue adhesive film material, insulating protective layer offers the steam vent relative with perforate, the small perforate in steam vent aperture, when realizing pressing and
When discharge inside gas, make the contact point of adhesive viscose glue effective upper and lower two-layer integrated circuit of sealing at via, be allowed to
Turn into permanent conducting body with air exclusion.
A kind of above-mentioned heat-conducting type double-sided PCB, double-sided PCB gross thickness is less than 800 microns；Wherein gluing thickness
It is 6 microns~150 microns to spend, and thickness of insulating layer is 10 microns~400 microns, and upper strata integrated circuit thickness degree is 6 microns~150
Micron, 6 microns~400 microns of lower floor's integrated circuit layer.
A kind of above-mentioned heat-conducting type double-sided PCB, the material of diaphragm is Kapton or poly- carbonic acid film or poly-
Ester film.
The basic structure procedure of processing of this heat-conducting type double-sided wiring board is：Processed on the two-sided insulating barrier with adhesive-layer and led
The laminating Copper Foil of one side, the laminating aluminium foil of another side after through hole, make after process circuit two of method known in industry
The outer surface of face integrated circuit makes insulating protective layer, and its fabrication processing can simplify：Insulation adhesive-layer processing is led
--- -- insulation adhesive-layer one side covers the face cladded aluminum foil of copper one, and --- -- hot pressing --- -- spreads printing ink to manufacture integrated circuit figure to through hole
Shape ----corrosion --- -- wireline inspection --- -- insulating protective layer processing --- -- mark processing --- -- shaping.
Using the invention of above-mentioned technical proposal, by the two-sided insulating barrier with adhesive-layer and its top and bottom respectively by gluing
Wherein one side, is used copper material and is linked with meeting electronic component dress patch and scolding tin by the layer of integrated circuit up and down that layer bonding is integrated
Requirement, another side use aluminium to meet power supply and signal transmission and the carrier of heat conduction requirement, and copper material and aluminium is had
Effect conducting, realizes thering is good heat-conducting effect by using aluminium.Wherein, the two-sided insulating barrier with adhesive-layer opens up conducting
Hole, upper strata integrated circuit layer open up one less than insulating barrier via aperture, by hot pressing by upper strata integrated circuit layer with
Layer integrated circuit layer physical contact, forms the double-sided wiring board of upper and lower two-layer integrated circuit layer conducting.The upper circuit for effectively turning on
The production method of layer and lower line layer can reduce energy resource consumption with improve production efficiency, strengthen electric conductivity.Upper and lower integrated circuit
Layer outer surface is provided with insulating protective layer.What then the insulating protective layer of recycling upper strata integrated circuit layer outer surface was carried is gluing
Layer is bonded together through the aperture of upper strata integrated circuit layer and the via of insulating barrier with lower floor integrated circuit, makes upper strata integrated
Line layer integrated line layer with is permanently bonded together, and forms permanent conducting body, and then produce what conduction property perfected
Double-sided PCB.Also the anticreep effect of waterproof is can reach, while increasing the service life of wiring board.The present invention is particularly suitable
Used in the LED of flexible circuit.
Concrete scheme of the invention is as follows：
(1) the integrated circuit layer in above-mentioned double-sided PCB is that one side is pasted using what Copper Foil made as electronic component dress
Face, and another side is made of aluminium foil, as transmission of electricity and the thermal conductive surface of signal transmission；
(2) integrated circuit layer in above-mentioned double-sided PCB center can also be that two sides is made using Copper Foil；
(3) above-mentioned double-sided PCB using aluminium foil make integrated circuit layer, be at the same play transmission of electricity and signal transmission and
Two functions of heat conduction；
(4) above-mentioned double-sided PCB is such as not required to heat conduction function, and its function is also complete and effective；
(5) in above-mentioned double-sided PCB, the hole of the aperture than the via of insulating barrier of the perforate of upper strata integrated circuit layer
Footpath is small, when base material is made, the effect of conducting, computational methods is physically contacted to play air guide and upper and lower two-layer：The integrated line in upper strata
The perforate radius of road floor subtracts the thickness of substrate layer less than the radius of insulating barrier via, and (thickness for setting insulating barrier is A, base material
The conducting pore radius of layer is B, and the perforate of upper strata integrated circuit layer is C, then C ＜ B-A) radius of upper strata integrated circuit layer perforate is only
Can meet the condition of " C ＜ B-A " exemplified as above just can, its size can be selected according to the adhesive property of selected insulating barrier
It is fixed, without fixed requirement, if the perforate of insulating layer perforating and upper strata integrated circuit layer is non-circular, perforate size can meet with
On enumerate condition, integrated circuit layer in upper strata can contact to turn on lower floor's integrated circuit layer and just may be used；
(6) in above-mentioned double-sided PCB its upper and lower two-layer integrated circuit layer conduction method, can also be in insulating barrier
The interior orifice ring or inner hole wall of via make one layer of conductive viscose layer makes upper strata integrated circuit integrated with lower floor by conductive viscose
Line layer is adhesively-bonded together to form conducting body；
(7) in above-mentioned double-sided PCB, its upper and lower two-layer integrated circuit layer realizes conducting by conductive viscose, in it
The conductive viscose layer of orifice ring or inner hole wall, can be that whole insulating barrier via inner ring is all covered with, or part is made
Make conductive viscose, only need to can meet function needs just may be used；
(8) above-mentioned double-sided PCB, described insulating barrier is two-sided glass fabric or polyimides with adhesive-layer
Film or the material such as polycarbonate film or polyester film or ceramics；
(9) insulating barrier described in above-mentioned double-sided PCB can also be without glass fabric or Kapton or poly-
The pure tacky film of carbonic ester film or polyester film etc.；
(10) adhesive layer on the insulating barrier two sides described in above-mentioned double-sided PCB or pure tacky film insulating barrier, can lead
Heat, or athermanous, its thermal conductivity factor can be depending on circuit board be required accordingly；
(11) protective layer of upper strata integrated circuit layer outer surface is not perforate at the via of circuit board, allows protective layer
The contact point of the upper and lower two-layer integrated circuit of the viscose glue for carrying sealing at via, as permanent conducting body；
(12) protective layer of upper strata integrated circuit outer surface can also be perforate at the via of circuit board, need to such as open
Hole, then to lead passing hole exterior open cell than upper strata integrated circuit small in its aperture, plays full sealing or the upper and lower two-layer collection of part sealing
Into the contact point of circuit, as permanent conducting body；
(13) can also be without the use of protective layer, directly using conductive adhesive at the via of upper strata integrated circuit
Or the contact point of nonconducting upper and lower two-layer integrated circuit of adhesive sealing, form permanent conduction；
(14) at the via of upper strata integrated circuit layer, such as using conductive or nonconducting upper and lower two-layer of adhesive sealing
The contact point of integrated circuit, the protective layer of the outer surface of upper strata integrated circuit layer can be protection film type, or exhausted
Edge ink, the material such as paint and pure glue glued membrane；
(15) above-mentioned double-sided PCB, under integrated line layer outer surface be provided with protective layer, this insulating protective layer can be band
The diaphragm, or dielectric ink, or paint of adhesive-layer can also be pure tacky films etc.；
(16) protective layer of upper and lower two-layer integrated circuit outer surface, mentioned diaphragm, dielectric ink, paint, pure glue
Film etc., can be heat-conducting type, or non-conductive type, and its thermal conductivity factor can set because of the requirement of double-sided PCB；
(17) protective layer of upper and lower two-layer integrated circuit outer surface, mentioned diaphragm, its material can be sub- polyamides
Amine film, or poly- carbonic acid film can also be polyester films etc.；
(18) above-mentioned double-sided PCB, the upper integrated circuit layer of integrated circuit layer is made using Copper Foil, to meet integrated circuit
Electronic component dress patch, and integrated circuit layer under integrated line layer using aluminium foil make, with meet circuit board electric current pass
Defeated and heat conduction and heat radiation function；
(19) surface can also be used in order to preferably meet the upper integrated circuit layer of heat conduction and heat radiation function integrated circuit layer
Electro-coppering or electronickelling, or the aluminium foil of the metal such as coated copper or cladding nickel replace, as long as welding electronics unit's device can be met to require
Metal material, electroplate or be coated on aluminium foil surface, you can use；
(20) its preferred gross thickness of above-mentioned double-sided PCB is less than 800 microns, for the soft of less than 400 microns gross thickness
Property wiring board is more superior；
(21) the adhesive layer thickness of above-mentioned double-sided wiring board can be 6 microns~150 microns, preferably 10 microns~
100 microns；
(22) thickness of insulating layer of above-mentioned double-sided PCB is 10 microns~400 microns, and preferably 10 microns~250 is micro-
Rice；
(23) Copper Foil or copper facing aluminium foil or nickel plating aluminium foil or cladding of the upper strata integrated circuit layer of above-mentioned double-sided PCB
The thickness of copper aluminium foil or cladding nickel aluminium foil is 6 microns~150 microns, preferably 10 microns~75 microns；
(24) aluminium foil or copper facing aluminium foil or nickel plating aluminium foil or color cladding of lower floor's integrated circuit layer of above-mentioned double-sided PCB
The thickness of copper aluminium foil or color cladding nickel aluminium foil is 6 microns~400 microns, preferably 10 microns~300 microns；
(25) the upper integrated circuit layer perforate described in above-mentioned double-sided PCB is smaller than base material via, by base material pressing
Afterwards, upper integrated circuit layer can under integrated line layer brought into physical contact, form conducting；
(26) diaphragm of the upper integrated circuit layer outer surface described in above-mentioned double-sided wiring board passes through upper integrated circuit layer
Perforate and the via of base material, allow glue integrated line layer perfusion bonding with of adhesive layer that diaphragm carries, allow integrated line
Road floor integrated line layer permanent contact with, ensures that its conducting function is sound for a long time, effective.
It is of the invention compared with traditional double-sided PCB, traditional two-sided electricity is calculated by well known preparation method in industry
The operation that road plate needs is 17 big basic operations, and heat-conducting type dual platen of the invention only needs eight basic operations, greatly
It is big to save the production time.In addition, traditional double-sided wiring board, it is necessary to use electroplating technology, to environmental concerns, collection is made
Must also be imaged using dry film into during line layer, costly, and this double-sided wiring board, its operation is simplified, and does not have electroplating technology,
Do not use dry film to be imaged, saved time and cost, reduce the destruction to environment.
Brief description of the drawings
Below in conjunction with the embodiment in accompanying drawing, the present invention is described in further detail, but does not constitute to the present invention
Any limitation.
Cross-sectional view when Fig. 1 is 1 encapsulation state of the specific embodiment of the invention；
Fig. 2 is the cross-sectional view after the completion of the specific embodiment of the invention 1 is encapsulated；
Fig. 3 is the cross-sectional view after the completion of the encapsulation of the further improvement project of the specific embodiment of the invention 1；
Fig. 4 is the cross-sectional view after the completion of the specific embodiment of the invention 2 is encapsulated；
Cross-sectional view when Fig. 5 is 3 encapsulation state of the specific embodiment of the invention；
Fig. 6 is the cross-sectional view after the completion of the specific embodiment of the invention 3 is encapsulated；
Fig. 7 is the cross-sectional view after the completion of the encapsulation of the further improvement project of the specific embodiment of the invention 3；
Cross-sectional view when Fig. 8 is 4 encapsulation state of the specific embodiment of the invention；
Fig. 9 is the cross-sectional view after the completion of the specific embodiment of the invention 4 is encapsulated；
Figure 10 is the further improvement project encapsulation state structural representation of the specific embodiment of the invention 4；
Figure 11 is the structural representation after the completion of the encapsulation of the further improvement project of the specific embodiment of the invention 4.
In figure：Insulated base material layer 1, adhesive-layer 2, upper integrated circuit layer 3, via 11, under integrated line layer 4, insulation protects
Sheath 5, adhesive 6.
Specific embodiment
Embodiment 1, as shown in Figures 1 to 3, a kind of heat-conducting type double-sided PCB of the invention, including insulated base material layer 1 and set
Put on insulated base material layer 1 upper integrated circuit layer 3 and it is following under integrated line layer 4, be the structure of adhesive-layer 2 of pure tacky film
Into, upper integrated circuit layer 3 for the metal material dress veneer that welding electronics unit device is requirement can be met, under integrated line layer 4 be aluminium
What paper tinsel made serves as the thermal conductive surface of transmission of electricity and signal transmission, and insulated base material layer 1 is communicated with the integrated line with of integrated circuit layer 3
The via 11 of road floor 4, upper integrated circuit layer 3 is along integrated line layer 4 under the stretching contact downwards of via 11；
Upper integrated circuit layer 3 for that can meet the metal material that welding electronics unit device is requirement, metal material using Copper Foil or
Electro-coppering or electronickelling or coated copper or cladding nickel making.
Embodiment 2, as shown in figure 4, on the basis of embodiment 1, being filled while insulating protective layer 5 is covered by hot pressing
The pit that stretching is formed downwards of upper integrated circuit layer 3 at via.
Embodiment 3, as shown in Fig. 5~7, on the basis of embodiment 1, insulated base material layer 1 is glass fabric or polyamides
Imines film or polycarbonate film or polyester film or ceramic material and it is two-sided constituted with adhesive-layer 2, upper integrated circuit layer 3
Integrated line layer 4 is bonded by adhesive-layer 2 and is integrated with.
As shown in Figure 6,7, via to 3 surface of upper integrated circuit layer stretch the pit of formation downwards in be provided with conduction
Adhesive or the sealing of nonconducting adhesive 6.
As shown in fig. 7, being provided with one layer of conductive viscose layer 12 along the wall of via 11.Conductive viscose layer 12 or conducting solder layer
It is all to be covered with or part making in whole via inner ring.
As shown in figure 5, the aperture that the upper integrated circuit layer 3 relative with via 11 is provided with the via than insulating barrier is small
Perforate 31, integrated line layer 4 under the stretching contact downwards of hole edge via 11 of perforate.
Embodiment 4, such as Fig. 4, Fig. 9, the upper outer surface of integrated line layer 4 with of integrated circuit layer 3 are provided with gluing multiple
Close the insulating protective layer 5 of layer.
Shown in Figure 10~11, insulating protective layer 5 offers the steam vent 51 relative with perforate 31, and the aperture of steam vent 51 is small
Perforate 31, realizes the gas inside discharge during pressing.
The adhesive-layer 2 and the thermal conductivity factor of insulating protective layer 5 of above-described embodiment are defined as heat conduction according to board design requirement
Or not heat conduction；Insulating protective layer 5 can be diaphragm or dielectric ink or paint or pure glue adhesive film material；The material of diaphragm
Matter is Kapton or poly- carbonic acid film or polyester film.
Double-sided PCB gross thickness is less than 800 microns；Wherein adhesive layer thickness be 6 microns~150 microns, insulating layer thickness
It is 10 microns~400 microns to spend, and upper strata integrated circuit thickness degree is 6 microns~150 microns, 6 microns of lower floor's integrated circuit layer~
400 microns.
The present invention is in specific production stage：
(1), according to the design data of double-sided wiring board, got out using digital control drilling machine on insulating materials 1 and position and lead
Through hole 5；
(2) perforate of location hole and Copper Foil via, is got out on Copper Foil 2 using same data；
(3), by thermal conductivity aluminum product 3 and the insulating materials 1 of via has been bored and has bored the Copper Foil of perforate at location hole and conducting
2, position be placed on pressing and forming on traditional pressing machine or fast press in order, its pressing condition is：Pressure is 120KG/CM, temperature
It is 180 DEG C ± 10 DEG C to spend, and pressing time is 30~80 seconds, and pressing post cure condition is 165 DEG C of ± 10 DEG C of X60min
(4), according to the design data of double-sided wiring board, using known method integration circuit in industry；
(5), outer surface laminating protection of the design data and location hole of foundation double-sided wiring board in double-deck integrated circuit layer
Layer, pressure is 120KG/CM, and temperature is 180 DEG C ± 10 DEG C, and pressing time is 30~80 seconds, and pressing post cure condition is 165 DEG C
±10℃X60min；
(6), the reference lamina of double-sided wiring board makes；
(7), the shaping of double-sided wiring board, shipment；
Material selection：
(1) it is 75 microns from gross thickness, the two-sided respectively its thickness with 25 micron thickness adhesive layers is 25 microns
Kapton bores location hole and via, a diameter of 1000 microns of via as insulating materials；
(2) from the Copper Foil that thickness is 35 microns, the perforate at location hole and via is bored according to design data, at via
Opening diameter be 600 microns；
(3) from the thermal conductivity aluminum product that thickness is 150 microns and the polyimide film and 35 microns of Copper Foil that have bored via
Pressing is positioned on pressing machine, condition is：Pressure is that 120KG/CM temperature is 185 DEG C, and the time is 60 seconds, presses rear curing time
It is 165 DEG C of X60min；
(4) using rust-proof oil ink print two sides integrated circuit after the base material cleaning that will have been pressed；
(5) integrated circuit corrosion；
(6) computer test of integrated circuit；
(7) the laminating polyimide type diaphragm of integrated circuit two sides appearance, condition is：Pressure is 120KG/CM, and temperature is
180 DEG C, the time is 60 seconds, and condition of cure is 165 DEG C of X60min；
(8) character marking is made；
(9) integrated circuit sheet metal forming.
Illustrated more than and can be seen that, traditional LED (double-sided PCB), based on well known preparation method is come in industry
Calculate, its operation for needing is 17 big basic operations, and this novel heat-conducting type dual platen only needs eight basic operations, significantly
Save the production time.In addition, traditional heat-conducting type double-sided wiring board, it is necessary to use electroplating technology, to environmental concerns, system
Make to be imaged using dry film during integrated circuit layer, it is costly, and this double-sided wiring board, its operation is simplified, without plating
Technique, does not use dry film to be imaged, and has saved time and cost, reduces the destruction to environment.
In sum, the present invention is made actual sample and through test is used for multiple times such as specification and diagramatic content, from making
Seen with the effect of test, the provable present invention can reach its desired purpose, and practical value is unquestionable.It is provided above
Embodiment is only used for the convenient illustration present invention, and any formal limitation, any affiliated technology neck are not made to the present invention
Has usually intellectual in domain, if being carried in the range of technical characteristic the present invention is not departed from, using disclosed technology
The Equivalent embodiments for locally being changed done by content or being modified, and without departing from technical characteristic content of the invention, still fall within
In the range of the technology of the present invention feature.
Claims (6)
1. a kind of heat-conducting type double-sided PCB, including insulated base material layer (1) and insulated base material layer (1) above upper integrated is arranged on
Line layer (3) and it is following under integrated line layer (4), it is characterised in that：Upper integrated circuit layer (3) is first for that can meet welding electronics
Device be requirement metal material dress veneer, under integrated line layer (4) for aluminium foil makes serve as transmit electricity and signal transmission heat conduction
Face, insulated base material layer (1) be communicated with integrated circuit layer (3) and under integrated line layer (4) via (11), with via
(11) relative upper integrated circuit layer (3) is provided with the small perforate (31) in aperture of the via than insulating barrier, the hole of the perforate
Integrated line layer (4) under edge via (11) stretching contact downwards, upper integrated circuit layer (3) and under integrated line layer (4)
Outer surface is provided with the insulating protective layer (5) with gluing composite bed, and insulating protective layer (5) is provided with the steam vent relative with perforate,
Upper integrated circuit layer (3) at via is filled while insulating protective layer (5) is covered by hot pressing and stretches the recessed of formation downwards
Hole, one layer of conductive viscose layer (12) or conducting solder layer, conductive viscose layer (12) or conductive weldering are provided with along via (11) wall
Connecing layer is all covered with or part making in whole conducting wall surface of the hole.
2. a kind of heat-conducting type double-sided PCB according to claim 1, it is characterised in that：Insulated base material layer (1) is glass
Fiber cloth or Kapton or polycarbonate film or polyester film or ceramic material and two-sided with adhesive-layer (2) structure
Into, or the adhesive-layer (2) of pure tacky film constitutes, upper integrated circuit layer (3) and under integrated line layer (4) by adhesive-layer (2)
Bonding is integrated.
3. a kind of heat-conducting type double-sided PCB according to claim 1, it is characterised in that：Metal material dress veneer uses copper
Paper tinsel makes.
4. a kind of heat-conducting type double-sided PCB according to claim 1, it is characterised in that：Via to upper integrated line
Road floor (3) surface stretches downwards the adhesive or nonconducting adhesive (6) sealing that conduction is provided with the pit of formation.
5. a kind of heat-conducting type double-sided PCB according to claim 1, it is characterised in that：Insulating protective layer (5) is insulation
Ink or paint or pure glue adhesive film material.
6. a kind of heat-conducting type double-sided PCB according to claim 2, it is characterised in that：Double-sided PCB gross thickness is
Less than 800 microns；Wherein adhesive-layer thickness is 6 microns~150 microns, and thickness of insulating layer is 10 microns~400 microns, upper strata collection
It is 6 microns~150 microns into line layer thickness, 6 microns~400 microns of lower floor's integrated circuit layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310750308.3A CN103906344B (en) | 2013-12-01 | 2013-12-01 | Heat-conducting type double-sided PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310750308.3A CN103906344B (en) | 2013-12-01 | 2013-12-01 | Heat-conducting type double-sided PCB |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103906344A CN103906344A (en) | 2014-07-02 |
| CN103906344B true CN103906344B (en) | 2017-06-06 |
Family
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| CN109757039B (en) * | 2017-11-04 | 2023-12-26 | 王定锋 | Circuit board of composite metal circuit and manufacturing method thereof |
| CN109757032A (en) * | 2017-11-04 | 2019-05-14 | 王定锋 | A kind of method of metal-foil circuits and wire circuit produced with combination circuit board |
| CN110300489A (en) * | 2018-03-24 | 2019-10-01 | 铜陵国展电子有限公司 | A kind of thermally conductive double-layer circuit board and preparation method thereof |
| CN110557904A (en) * | 2019-09-03 | 2019-12-10 | 东莞市震泰电子科技有限公司 | Double-sided circuit board and conduction method thereof |
| CN112584630A (en) * | 2019-09-27 | 2021-03-30 | 王定锋 | Discontinuously layered flexible laminated lamp strip circuit board and manufacturing method |
| CN114449737A (en) * | 2022-01-17 | 2022-05-06 | 上海卓冬应用技术工程有限公司 | Printed circuit board and manufacturing method thereof |
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| CN102858087A (en) * | 2012-08-27 | 2013-01-02 | 吴祖 | Blind-hole-conduction double-sided circuit board and processing method thereof |
| CN102883524A (en) * | 2011-07-15 | 2013-01-16 | 昆山雅森电子材料科技有限公司 | Interconnection conducting and heat-conducting method of double-faced circuit board and double-faced circuit board based on method |
| CN203896578U (en) * | 2013-12-01 | 2014-10-22 | 吴祖 | Heat conduction-type double-sided circuit board |
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| CN102883524A (en) * | 2011-07-15 | 2013-01-16 | 昆山雅森电子材料科技有限公司 | Interconnection conducting and heat-conducting method of double-faced circuit board and double-faced circuit board based on method |
| CN102858087A (en) * | 2012-08-27 | 2013-01-02 | 吴祖 | Blind-hole-conduction double-sided circuit board and processing method thereof |
| CN203896578U (en) * | 2013-12-01 | 2014-10-22 | 吴祖 | Heat conduction-type double-sided circuit board |
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