CN114449737A - Printed circuit board and manufacturing method thereof - Google Patents
Printed circuit board and manufacturing method thereof Download PDFInfo
- Publication number
- CN114449737A CN114449737A CN202210047928.XA CN202210047928A CN114449737A CN 114449737 A CN114449737 A CN 114449737A CN 202210047928 A CN202210047928 A CN 202210047928A CN 114449737 A CN114449737 A CN 114449737A
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- China
- Prior art keywords
- circuit board
- printed circuit
- connecting plate
- rod
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- 238000003825 pressing Methods 0.000 claims abstract description 31
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 25
- 239000011889 copper foil Substances 0.000 claims abstract description 19
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 16
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 16
- 238000012545 processing Methods 0.000 claims abstract description 16
- 238000010030 laminating Methods 0.000 claims abstract description 13
- 238000004080 punching Methods 0.000 claims abstract description 7
- 239000000463 material Substances 0.000 claims abstract description 6
- 238000007747 plating Methods 0.000 claims abstract description 4
- 238000012546 transfer Methods 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 claims description 6
- 238000002360 preparation method Methods 0.000 claims description 4
- 230000003064 anti-oxidating effect Effects 0.000 claims description 3
- 238000009388 chemical precipitation Methods 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 238000005553 drilling Methods 0.000 claims description 3
- 238000009713 electroplating Methods 0.000 claims description 3
- 230000008054 signal transmission Effects 0.000 abstract description 7
- 238000012360 testing method Methods 0.000 abstract description 4
- 230000003028 elevating effect Effects 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 238000001514 detection method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention relates to the technical field of electronic product processing, in particular to a printed circuit board. The technical scheme comprises the following steps: the printed circuit board comprises a circuit board body, wherein the circuit board body comprises a core board, prepregs are arranged on two sides of the core board, a copper foil is connected to the other side of each prepreg, an aluminum plate is arranged on the other side of each copper foil, a blind hole is formed in the aluminum plate, and a signal hole is formed in the circuit board body. The manufacturing method of the printed circuit board comprises the following steps: s1, preparing materials; s2, punching and laminating; s3, processing the holes; s4, transfer plating. The printed circuit board is convenient to test, high in signal transmission stability, high in signal transmission accuracy, simple in pressing mode, capable of reducing processing steps and improving processing efficiency, suitable for processing circuit boards with different layers, capable of improving flexibility and universality of use and suitable for popularization and use.
Description
Technical Field
The invention relates to the technical field of electronic product processing, in particular to a printed circuit board and a manufacturing method of the printed circuit board.
Background
The printed circuit board is mainly composed of two materials, namely an insulating base material and a conductor, and plays a role in supporting, interconnecting and partially circuit elements in electronic equipment. The integrated circuit and the electronic components such as resistors and capacitors can only perform their functions in the whole body if the printed circuit board has a sufficient ground and is connected by a lead. The printed circuit board is a framework for supporting components and is a pipeline for communicating electric signals. In the actual production process, many electronic products cannot be successful at one time, so that repeated testing, debugging, retesting and other processes need to be carried out on the electronic products; the traditional printed circuit board reserves signal lines, and the mode can generate a lot of unnecessary troubles, branches or different signal widths during signal transmission; meanwhile, in the preparation of the circuit board, the multi-layer composition is pressed, PVB is fixedly clamped by two iron plates in the existing means, but the operation is inconvenient, a plurality of bolts are mainly connected between the two iron plates for assembling and pressing, the use is labor-consuming, and the working efficiency is low; in view of the above problems, a printed circuit board and a method for manufacturing the same are provided.
Disclosure of Invention
The invention aims to provide a printed circuit board and a manufacturing method thereof, which are used for stably and accurately transmitting detection signals, aiming at the problems in the background technology.
The technical scheme of the invention is as follows: the utility model provides a printed circuit board, includes the circuit board body, the circuit board body includes the core, the both sides of core are equipped with the prepreg, the opposite side of prepreg is connected with the copper foil, the opposite side of copper foil is equipped with aluminum plate, the blind hole has been seted up on the aluminum plate, the signal hole has been seted up on the circuit board body.
Preferably, the signal hole penetrates through the circuit board body, and an anti-oxidation layer is coated in the signal hole.
The technical scheme of the invention is as follows: a manufacturing method of a printed circuit board comprises the following steps:
s1, material preparation: preparing and processing component parts of each layer of the circuit board in advance, wherein the component parts comprise a core board, a prepreg, copper foil and an aluminum plate;
s2, punching and laminating: laying and laminating the core board, the prepreg, the copper foil and the aluminum board in sequence, and positioning and laminating through a laminating mechanism;
s3, processing holes: punching the circuit board body through a drilling machine, and carrying out copper chemical precipitation treatment on the inner wall of the hole;
s4, transfer plating: and pressing the photosensitive module on the copper foil by a film pressing machine, and electroplating after treatment.
Preferably, the pressing mechanism comprises a first connecting plate, a second connecting plate is arranged above the first connecting plate, fixed blocks are connected to two sides of the second connecting plate and two sides of the first connecting plate, guide rods penetrate through the fixed blocks above the two sides of the second connecting plate, a connecting plate is connected between the guide rods, a connecting rod penetrates through the connecting plate, a pressing plate is fixedly arranged at the bottom of the connecting rod, and an adjusting mechanism is arranged on one side of the connecting rod.
Preferably, adjustment mechanism includes the slide bar, the cover is equipped with the regulating block on the slide bar, bottom one side of regulating block is rotated and is connected with the push rod, the other end of push rod articulates and is connected with the elevator, one side of elevator is rotated and is connected with the bracing piece, the bottom and the clamp plate of bracing piece rotate and are connected.
Preferably, the bottom of the connecting plate is fixedly connected with a fixing rod, the fixing rod is provided with a lifting groove along the height direction of the fixing rod, the lifting block penetrates through the lifting groove and is in sliding connection with the inner wall of the lifting groove, and the fixing rod is of an I-shaped structure.
Preferably, the connecting plate is provided with an adjusting groove, two ends of the sliding rod are fixedly connected with the inner wall of the adjusting groove, the sliding rod is provided with a positioning groove along the length direction of the sliding rod, and a positioning bolt is arranged in the positioning groove.
Preferably, one side of the adjusting block is connected with a first spring, the other end of the first spring is fixedly connected with the inner wall of the adjusting groove, and the spring is sleeved on the outer ring of the adjusting block.
Preferably, the inner wall of the pressing plate is provided with a sliding groove, and a sliding block is arranged in the sliding groove in a sliding manner.
Compared with the prior art, the invention has the following beneficial technical effects:
1. according to the invention, the signal interface is reserved for the circuit board body, so that the signal calculation stability is good when the printed circuit board is detected, the condition of large transmission signal difference is avoided, and the test convenience of the printed circuit board is improved;
2. according to the invention, through the arrangement of the pressing mechanism and the adjusting mechanism, when the circuit board body is pressed, the use of bolts is reduced, the working efficiency of manufacturing the circuit board body is improved, the pressing and fixing mode of the circuit board body is simple, the determination of the pressing height can be completed only by pulling the adjusting block along the sliding rod, the pressing mechanism is suitable for processing and using printed circuit boards with different layers, and the use adaptability and flexibility are high;
3. in conclusion, the printed circuit board disclosed by the invention is convenient to test, high in signal transmission stability, high in signal transmission accuracy, simple in pressing mode, capable of reducing processing steps and improving the processing efficiency, suitable for processing circuit boards with different layers, capable of improving the flexibility and the universality of use and suitable for popularization and use.
Drawings
FIG. 1 is a schematic diagram of the structure of one embodiment of the present invention;
FIG. 2 is a schematic diagram of a press-fit of the printed circuit board of FIG. 1;
fig. 3 is a schematic front view of the pressing mechanism and the adjusting mechanism in fig. 2.
Reference numerals: 1. a circuit board body; 11. a core board; 12. a prepreg; 13. copper foil; 14. an aluminum plate; 15. blind holes; 16. a signal aperture; 2. a pressing mechanism; 21. a first connecting plate; 22. a second connecting plate; 23. a fixed block; 24. a guide bar; 25. a connecting plate; 26. a connecting rod; 27. pressing a plate; 3. an adjustment mechanism; 31. a slide bar; 32. an adjusting block; 33. a push rod; 34. a lifting block; 35. fixing the rod; 36. a support bar; 37. positioning a groove; 38. and (4) positioning the bolt.
Detailed Description
The technical solution of the present invention is further explained with reference to the accompanying drawings and specific embodiments.
Example one
As shown in fig. 1, the printed circuit board provided by the present invention includes a circuit board body 1, the circuit board body 1 includes a core board 11, two sides of the core board 11 are provided with prepregs 12, the other side of the prepregs 12 is connected with a copper foil 13, the other side of the copper foil 13 is provided with an aluminum plate 14, the aluminum plate 14 is provided with a blind hole 15, the circuit board body 1 is provided with a signal hole 16, the signal hole 16 penetrates through the circuit board body 1, and an antioxidation layer is coated in the signal hole 16.
In this embodiment, the printed circuit board is composed of the core board 11, the prepreg 12, the copper foil 13 and the aluminum plate 14, and the signal holes 16 are arranged to improve the stability of the circuit board body 1 during signal transmission detection, and reduce the difference of signal transmission.
Example two
As shown in fig. 2-3, compared to the first embodiment, the printed circuit board of the present invention further includes: the invention further provides a manufacturing method of the printed circuit board, which comprises the following steps:
s1, material preparation: preparing and processing component parts of each layer of the circuit board in advance, wherein the component parts comprise a core plate 11, a prepreg 12, a copper foil 13 and an aluminum plate 14;
s2, punching and laminating: laying and laminating the core plate 11, the prepreg 12, the copper foil 13 and the aluminum plate 14 in sequence, and positioning and laminating by a laminating mechanism 2;
s3, processing holes: punching the circuit board body 1 by a drilling machine, and carrying out copper chemical precipitation treatment on the inner wall of the hole;
s4, transfer plating: and pressing the photosensitive module on the copper foil by a film pressing machine, and electroplating after treatment.
In this embodiment: the pressing mechanism 2 comprises a first connecting plate 21, a second connecting plate 22 is arranged above the first connecting plate 21, fixing blocks 23 are connected to two sides of the second connecting plate 22 and the first connecting plate 21, guide rods 24 penetrate through the upper fixing blocks 23, a connecting plate 25 is connected between the two guide rods 24, a connecting rod 26 penetrates through the connecting plate 25, a pressing plate 27 is fixedly arranged at the bottom of the connecting rod 26, an adjusting mechanism 3 is arranged on one side of the connecting rod 26, the adjusting mechanism 3 comprises a sliding rod 31, an adjusting block 32 is sleeved on the sliding rod 31, the adjusting block 32 is of a T-shaped structure, a push rod 33 is rotatably connected to one side of the bottom of the adjusting block 32, a lifting block 34 is hinged to the other end of the push rod 33, a supporting rod 36 is rotatably connected to one side of the lifting block 34, the bottom of the supporting rod 36 is rotatably connected with the pressing plate 27, a fixing rod 35 is fixedly connected to the bottom of the connecting plate 25, and a lifting groove is formed in the height direction of the fixing rod 35, the elevating block 34 runs through the elevating groove, and with the inner wall sliding connection in elevating groove, dead lever 35 is "worker" font structure, and the both ends external diameter of dead lever 35 is greater than the biggest internal diameter in elevating groove, the adjustment tank has been seted up on the connecting plate 25, the both ends of slide bar 31 and the inner wall fixed connection of adjustment tank, constant head tank 37 has been seted up along its length direction on the slide bar 31, be equipped with the pilot pin 38 in the constant head tank 37, one side of adjustment block 32 is connected with spring one, the other end of spring one and the inner wall fixed connection of adjustment tank, the outer lane at adjustment block 32 is established to the spring one set, the spout has been seted up to the inner wall of clamp plate 27, it is equipped with the slider to slide in the spout, the slider rotates with the one end that the elevating block 34 is kept away from with bracing piece 36 and is connected.
In this embodiment, when the circuit board body 1 is pressed, the circuit board body 1 is integrally placed on the first connecting plate 21, the positioning bolt 38 is screwed out from the positioning groove 37, the adjusting block 32 is pulled along the sliding rod 31, so that the spring is compressed, the lifting block 34 at the other end of the pushing rod 33 slides downwards along the lifting groove on the fixing rod 35 under the pulling of the adjusting block 32, so that the supporting rod 36 at one side of the lifting block 34 pushes the pressing plate 27, the pressing plate 27 pushes the second connecting plate 22 downwards along the top connecting rod 26 under the pushing of the supporting rod 36, so that the distance between the second connecting plate 22 and the first connecting plate 21 is reduced, the circuit board body 1 is tightly attached and pressed, after the pressing operation, the positioning bolt 38 is rotated in the positioning groove 37 at one side of the adjusting block 32, the position of the adjusting block 32 is fixed, and the pressing force of the pressing plate 27 is determined.
The above embodiments are merely some preferred embodiments of the present invention, and those skilled in the art can make various alternative modifications and combinations of the above embodiments based on the technical solution of the present invention and the related teaching of the above embodiments.
Claims (9)
1. A printed circuit board, includes circuit board body (1), its characterized in that: the circuit board body (1) comprises a core board (11), prepregs (12) are arranged on two sides of the core board (11), copper foils (13) are connected to the other sides of the prepregs (12), aluminum plates (14) are arranged on the other sides of the copper foils (13), blind holes (15) are formed in the aluminum plates (14), and signal holes (16) are formed in the circuit board body (1).
2. A printed circuit board according to claim 1, characterized in that the signal holes (16) extend through the circuit board body (1) and that the signal holes (16) are internally coated with an anti-oxidation layer.
3. A manufacturing method of a printed circuit board is characterized by comprising the following steps:
s1, material preparation: preparing and processing each layer of component parts of the circuit board in advance, wherein the component parts comprise a core plate (11), a prepreg (12), a copper foil (13) and an aluminum plate (14);
s2, punching and laminating: laying and laminating the core board (11), the prepreg (12), the copper foil (13) and the aluminum plate (14) in sequence, and positioning and laminating through a laminating mechanism (2);
s3, processing holes: punching the circuit board body (1) by a drilling machine, and carrying out copper chemical precipitation treatment on the inner wall of the hole;
s4, transfer plating: and pressing the photosensitive module on the copper foil by a film pressing machine, and electroplating after treatment.
4. The method for manufacturing the printed circuit board according to claim 3, wherein the pressing mechanism (2) comprises a first connecting plate (21), a second connecting plate (22) is arranged above the first connecting plate (21), fixing blocks (23) are connected to two sides of the second connecting plate (22) and the first connecting plate (21), guide rods (24) penetrate through the upper fixing blocks (23), a connecting plate (25) is connected between the two guide rods (24), a connecting rod (26) penetrates through the connecting plate (25), a pressing plate (27) is fixedly arranged at the bottom of the connecting rod (26), and an adjusting mechanism (3) is arranged on one side of the connecting rod (26).
5. The manufacturing method of the printed circuit board according to claim 4, wherein the adjusting mechanism (3) comprises a sliding rod (31), an adjusting block (32) is sleeved on the sliding rod (31), one side of the bottom of the adjusting block (32) is rotatably connected with a push rod (33), the other end of the push rod (33) is hinged with a lifting block (34), one side of the lifting block (34) is rotatably connected with a supporting rod (36), and the bottom of the supporting rod (36) is rotatably connected with the pressing plate (27).
6. The method for manufacturing a printed circuit board according to claim 5, wherein a fixing rod (35) is fixedly connected to the bottom of the connecting plate (25), the fixing rod (35) has a lifting slot along the height direction thereof, the lifting block (34) penetrates through the lifting slot and is slidably connected to the inner wall of the lifting slot, and the fixing rod (35) has an I-shaped structure.
7. The method for manufacturing the printed circuit board according to claim 5, wherein the connecting plate (25) is provided with an adjusting groove, two ends of the sliding rod (31) are fixedly connected with the inner wall of the adjusting groove, the sliding rod (31) is provided with a positioning groove (37) along the length direction thereof, and a positioning bolt (38) is arranged in the positioning groove (37).
8. The manufacturing method of the printed circuit board as claimed in claim 7, wherein one side of the adjusting block (32) is connected with a first spring, the other end of the first spring is fixedly connected with the inner wall of the adjusting groove, and the first spring is sleeved on the outer ring of the adjusting block (32).
9. The method for manufacturing the printed circuit board according to claim 4, wherein the inner wall of the pressing plate (27) is provided with a sliding groove, and a sliding block is arranged in the sliding groove in a sliding manner.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210047928.XA CN114449737A (en) | 2022-01-17 | 2022-01-17 | Printed circuit board and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210047928.XA CN114449737A (en) | 2022-01-17 | 2022-01-17 | Printed circuit board and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114449737A true CN114449737A (en) | 2022-05-06 |
Family
ID=81368109
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210047928.XA Pending CN114449737A (en) | 2022-01-17 | 2022-01-17 | Printed circuit board and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114449737A (en) |
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|---|---|---|---|---|
| US20070125570A1 (en) * | 2005-12-07 | 2007-06-07 | High Tech Computer Corp. | Via Structure of a Printed Circuit Board |
| CN103906344A (en) * | 2013-12-01 | 2014-07-02 | 吴祖 | Heat-conductive two-side circuit board |
| CN204431012U (en) * | 2015-02-05 | 2015-07-01 | 山东交通学院 | A kind of wire-drawing frame of wire drawing depth adjustable |
| CN206024228U (en) * | 2016-08-17 | 2017-03-15 | 东莞市五株电子科技有限公司 | High radiating thickness copper coin |
| CN106604541A (en) * | 2016-12-30 | 2017-04-26 | 郑州云海信息技术有限公司 | Printed circuit board and manufacturing method thereof |
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| WO2020232670A1 (en) * | 2019-05-22 | 2020-11-26 | 深南电路股份有限公司 | Printed circuit board and manufacturing method therefor |
| CN112273768A (en) * | 2020-11-09 | 2021-01-29 | 温州职业技术学院 | Clothing printing scanning device |
| CN212573141U (en) * | 2020-06-08 | 2021-02-19 | 昆山顺灏电子科技有限公司 | Lamination device of multilayer circuit board |
| CN213462533U (en) * | 2020-11-16 | 2021-06-15 | 深圳市艾诺信射频电路有限公司 | Circuit board fusion device |
| CN214081953U (en) * | 2020-05-27 | 2021-08-31 | 武汉临空锐奇装饰材料制造有限公司 | Edge banding limiting pressing plate mechanism for edge banding production line |
| CN214873484U (en) * | 2021-05-07 | 2021-11-26 | 郑州龙洋印务有限公司 | Stable printed matter guiding mechanism for printing |
| CN215035080U (en) * | 2021-04-25 | 2021-12-07 | 青岛上达自动化系统有限公司 | Glass door pressfitting machine convenient to control pressfitting dynamics |
-
2022
- 2022-01-17 CN CN202210047928.XA patent/CN114449737A/en active Pending
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| US20070125570A1 (en) * | 2005-12-07 | 2007-06-07 | High Tech Computer Corp. | Via Structure of a Printed Circuit Board |
| CN103906344A (en) * | 2013-12-01 | 2014-07-02 | 吴祖 | Heat-conductive two-side circuit board |
| CN204431012U (en) * | 2015-02-05 | 2015-07-01 | 山东交通学院 | A kind of wire-drawing frame of wire drawing depth adjustable |
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| CN214081953U (en) * | 2020-05-27 | 2021-08-31 | 武汉临空锐奇装饰材料制造有限公司 | Edge banding limiting pressing plate mechanism for edge banding production line |
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| CN112273768A (en) * | 2020-11-09 | 2021-01-29 | 温州职业技术学院 | Clothing printing scanning device |
| CN213462533U (en) * | 2020-11-16 | 2021-06-15 | 深圳市艾诺信射频电路有限公司 | Circuit board fusion device |
| CN215035080U (en) * | 2021-04-25 | 2021-12-07 | 青岛上达自动化系统有限公司 | Glass door pressfitting machine convenient to control pressfitting dynamics |
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