WO2020232670A1

WO2020232670A1 - Printed circuit board and manufacturing method therefor

Info

Publication number: WO2020232670A1
Application number: PCT/CN2019/087988
Authority: WO
Inventors: 杨继刚; 王悠; 刘世生; 陈绪东; 谢占昊; 邓杰雄; 崔荣
Original assignee: 深南电路股份有限公司
Priority date: 2019-05-22
Filing date: 2019-05-22
Publication date: 2020-11-26

Abstract

Provided in the present invention are a printed circuit board and a manufacturing method therefor, the printed circuit board comprising a base material combination and an embedding block. The base material combination comprises a plurality of base materials which are arranged in a stacked manner and bonded by means of first bonding layers; and a groove is provided in the base material combination, side walls of the embedding block are of irregular shape, the embedding block is arranged in the groove by means of a second bonding layer, and the first bonding layers of the base material combination and the second bonding layer are independent of each other. Therefore, the binding force between the embedding block and the base material combination is enhanced, and more circuit board laminated architectures are obtained.

Description

Printed circuit board and manufacturing method thereof

【Technical Field】

This application relates to the technical field of circuit boards, in particular to a printed circuit board and a manufacturing method thereof.

【Background technique】

In the process of preparing the embedded printed circuit board, the circuit pattern is generally made on the core board first, and the core board is slotted, and then the slotted core board is stacked together, and the embedded block is put into the slot. Then press the prepreg (PP glue). For example, the metal block is put into the groove of the core board, and then pressed by PP glue. The PP glue will melt into liquid at high temperature and flow into the gap between the metal block and the groove wall, and solidify at low temperature, thereby making the metal block Glue together with the groove wall.

However, when preparing an embedded printed circuit board, the above-mentioned process can only produce a laminated structure in which the core board is laminated with the core board, but cannot produce a laminated structure in which the core board is laminated with the copper foil. Because if the slotted core board and copper foil are pressed together, the copper foil will shift due to the flow of the PP glue melted by heat, causing the copper foil and the grooves on the core board to be misaligned, reducing product quality and reducing The bonding force between the embedded block and the core board.

[Content of the invention]

This application mainly provides a printed circuit board and a manufacturing method thereof. The printed circuit board can enhance the bonding force between the embedded block and the core board, and the manufacturing method can increase the laminated structure of the printed circuit board.

In order to solve the above-mentioned main technical problems, a technical solution adopted in this application is to provide a printed circuit board, the printed circuit board comprising a base material assembly and an embedded block, the base material assembly including a layered arrangement and through a first bonding Multiple substrates bonded in layers;

The substrate combination is provided with a groove, the side wall of the embedded block is irregularly shaped, the embedded block is arranged in the groove through a second adhesive layer, and the first adhesive of the substrate combination The layer and the second adhesive layer are mutually independent adhesive layers.

In order to solve the above-mentioned main technical problems, a technical solution adopted by this application is to provide a manufacturing method of a printed circuit board, including:

A substrate combination is provided, the substrate combination includes a plurality of substrates arranged in a stack and bonded by a first adhesive layer;

Grooving at the position where the base material combination needs to place the embedded block;

Placing an embedded block in the groove of the substrate assembly;

A second adhesive layer is filled in the groove to bond the embedded block and the base material assembly.

The beneficial effect of the present application is: different from the state of the art, the present application presses a multilayer substrate into a substrate combination, opens a groove in the substrate combination, and sets an embedded block in the groove, and the embedded block The side wall is set in an irregular shape to improve the bonding force between the embedded block and the substrate combination. In addition, the present application sets a groove on the laminated substrate combination, and places the embedded block in the groove through the second adhesive layer Combine the embedded block and the base material, so that the printed circuit board can not only make the laminated structure of the core board and the core board, but also can make the laminated structure of the core board and the copper foil to increase the printed circuit. The laminated structure of the board.

【Explanation of drawings】

Fig. 1a is a schematic structural diagram of a first embodiment of a printed circuit board of the present invention;

Figure 1b is a schematic structural view of the sidewall shape of a part of the embedded block listed in the present invention;

Figure 1c is a schematic structural diagram of the shape of part of the embedded blocks listed in the present invention;

2 is a schematic diagram of the structure of the second embodiment of the printed circuit board of the present invention;

3 is a schematic diagram of the structure of the third embodiment of the printed circuit board of the present invention;

4 is a schematic diagram of the structure of the fourth embodiment of the printed circuit board of the present invention;

5 is a schematic diagram of the structure of the fifth embodiment of the printed circuit board of the present invention;

6 is a schematic diagram of the structure of the sixth embodiment of the printed circuit board of the present invention;

Fig. 7 is a schematic structural view of a seventh embodiment of a printed circuit board of the present invention;

8 is a schematic diagram of the structure of the eighth embodiment of the printed circuit board of the present invention;

9 is a schematic structural diagram of a ninth embodiment of the printed circuit board of the present invention;

Figure 10a is a schematic diagram of the structure of the manufacturing method of the printed circuit board of the present invention;

Fig. 10b is a schematic structural view of a method for manufacturing a substrate assembly of a printed circuit board of the present invention.

【Detailed ways】

The present invention provides a printed circuit board and a manufacturing method thereof. The printed circuit board includes a substrate combination and an embedded block, the substrate combination includes a plurality of substrates laminated and bonded through a first adhesive layer; The substrate assembly is provided with a groove, the side wall of the embedded block has an irregular shape, and the embedded block is bonded in the groove through a second adhesive layer.

The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all of them. Based on the implementation in this application, all other implementations obtained by a person of ordinary skill in the art without creative work fall within the protection scope of this application.

Please refer to FIG. 1a, which is a schematic structural diagram of a first embodiment of a printed circuit board of the present invention. In this embodiment, the printed circuit board is formed by one-time pressing. In FIG. 1a, only a core board 201, two

copper foils

202, 203 and two

first bonding layers

204, 205 are schematically shown. In other embodiments, two, three, five, or other numbers of multiple core plates 201 can also be stacked according to actual needs.

The printed circuit board shown in this embodiment specifically includes: a substrate combination, the substrate combination includes a core board 201,

copper foils

202, 203 on both sides of the core board 201, and the core board 201 and The

first bonding layer

204, 205 between the

copper foils

202, 203; the first bonding layer 204 bonds the core board 201 and the copper foil 202, the first bonding layer 205 The core board 201 and the copper foil 203 are bonded together. The surfaces of the

copper foils

202 and 203 and the two

surfaces

2011 and 2012 connecting the core board 201 and the

first bonding layers

204 and 205 are formed with circuit patterns Floor. The printed circuit board further includes a groove 211 located on the base material assembly and penetrating the upper and lower surfaces of the base material assembly, an embedding block 212 embedded in the groove 211, and the embedding block 212 has the same height as the substrate. The combined height is the same. After the embedded block 212 is inserted into the groove 211, the embedded block 212 is flush with the substrate assembly; and the embedded block 212 is bonded between the embedded block 212 and the groove 211 And the second bonding layer 213 of the groove 211; the substrate combination is also provided with a plurality of vias, including the circuit pattern layer of the copper foil 202 and a surface 2011 of the core board 201 Layer and the

blind holes

207, 208 electrically connected between the circuit pattern layer of the copper foil 203 and the circuit pattern layer on the other surface 2012 of the core board 201, connecting the circuit pattern layer of the copper foil 202 with the copper The through hole 209 electrically connected to the circuit pattern layer of the foil 203 and the buried hole 206 that electrically connects the circuit pattern layer on the two

surfaces

2011 and 2012 of the core board 201. It should be noted that the core board 201,

copper foil

202, 203, and the

first bonding layer

204, 205 have the same shape and size, for example, the core board 201,

copper foil

202, 203, and the surface of the

first bonding layer

204, 205 All are rectangular, or the surfaces of the

copper foils

202 and 203 and the first

adhesive layers

204 and 205 are triangular, etc., which are not specifically limited.

In other embodiments, a plurality of core plates 201 and

copper foils

202 and 203 are stacked together, and the first adhesive layer 204 is stacked between the core plates 201 and between the core plate 201 and the

copper foils

202 and 203 205, where the

copper foils

202 and 203 are located on the outside of the multiple core plates 201; the multiple core plates, the copper foil, and the first adhesive layer are laminated together to obtain a base material combination, which is used for pressing A circuit pattern layer is formed on the surface of at least part of the core board. After pressing, the circuit pattern layer is fabricated on the copper foil located on the outer side of the core boards, and then grooves 211 are opened on the base material combination to insert the block 212 It is placed in the groove 211 and bonded by the second adhesive layer 213.

It should be noted that the material of the core board 201 is a copper clad laminate, specifically reinforced materials (such as a paper substrate, a glass fiber cloth substrate, a synthetic fiber cloth substrate, etc.) impregnated with resin, one or both sides are covered with copper foil, and heated Press forming is the basic material for printed circuit boards. Specifically, in this embodiment, the core board 201 may be a copper clad laminate coated with copper foil on one side, or may be a copper clad laminate coated with copper foil on both sides.

In addition, in this embodiment, the shape of the embedded block 212 is a square as shown in FIG. 1a, or it may be a boss type, an I-shape, or a T-shape as shown in FIG. 1c. The specific shape is not limited. The side wall of the embedded block 212 is irregularly shaped, such as a square convex shape as shown in FIG. 1a. In other embodiments, it may also be a triangular groove, a triangular protrusion, a semicircular groove, or a semicircular convex as shown in FIG. 1b. With the same shape, setting the embedded block 212 into this shape can improve the bonding force of the combination of the embedded block and the substrate. The embedded block material is metal material, such as copper block, iron block, aluminum block, etc.; it can also be high-speed material, such as high-speed steel, etc., in order to save material, high-speed materials are used where high-speed signals are required, and high-speed signals are not required. The location of the signal does not require high-speed materials. For example, low-speed materials can be used to save costs. In other embodiments, the embedding block can also be made of other materials, depending on the actual application, which is not specifically limited here.

In other embodiments, the electronic component 214 can be mounted on a surface of the embedded block 212. If the electronic component 214 is mounted on the upper surface of the embedded block, the lower surface of the embedded block 212 is used for For heat dissipation, if electronic components 214 are mounted on the lower surface of the embedded block 212, the upper surface of the embedded block 212 is used for heat dissipation. Electronic components 214 can also be mounted on the upper and lower surfaces of the embedded block. Wherein, the electronic components may specifically be high-power heating components.

It should be noted that the holes in this embodiment are obtained by laser drilling and/or mechanical drilling. Furthermore, after the holes are formed, conductive layers are formed in the

holes

206, 207, 208, and 209 by electroplating. Or conductive pillar, the conductive layer is specifically a copper layer, and the conductive pillar is specifically a copper pillar. The conductive layer or the conductive pillar is used to achieve electrical connection between the circuit pattern layers connected to the hole. When the conductive layer is provided in the hole, in order to prevent the production The printed circuit board is recessed and needs to be filled with resin after the conductive layer is formed; the printed circuit board in Figure 1a can produce four circuit pattern layers, namely on the two surfaces of the

copper foil

202, 203 and the core board 201 A total of four circuit pattern layers can be formed in 2011 and 2012. In other embodiments, it is also possible to form less than four circuit pattern layers according to actual requirements, such as forming three circuit pattern layers. In a specific embodiment, a total of three circuit patterns are formed on the

copper foil

202, 203 and the surface 2011. Layer, and only two

holes

207 and 209 are formed by drilling. In other embodiments, it is determined according to actual conditions, and this application does not make specific limitations here.

Specifically, the first

adhesive layers

204, 205 are prepregs, which are mainly composed of resin and reinforcing materials (glass fiber cloth, paper substrates, composite materials, etc.). The prepregs used in the production of multilayer printed boards are mostly made of glass. Fiber cloth is used as a reinforcing material, impregnated with resin, and then heat-treated, the prepreg will soften under heating and pressure, and will react and solidify after cooling. The second adhesive layer 213 is made of resin or conductive material. According to requirements, if the embedded block and the base material are to be separated from each other, resin is filled, such as phenolic resin, polyvinyl chloride resin, polyethylene, and polytetrafluoroethylene. For vinyl fluoride and the like, if the embedded block is to be electrically connected to the base material combination, a conductive material is filled, such as a resin with copper powder or silver powder.

It should be noted that if the embedded block is only used for heat dissipation, the resin is filled to bond the embedded block and the substrate together. If the embedded block is used for heat dissipation and also performs a conductive role, then The embedded block and the substrate are combined and bonded with a conductive resin containing copper powder or silver powder. The original state of the resin is a flowable liquid state, and becomes a stable solid state after heating. When it becomes a solid state after heating, the embedded block and the base material are combined and bonded.

Please refer to FIG. 2, which is a schematic structural diagram of a second embodiment of a printed circuit board of the present invention. Compared with the first embodiment, the difference between this embodiment and the first embodiment is that this embodiment further includes copper foils 311 and 312 on the outside of the copper foils 202 and 203, and between the copper foils 202 and 311 and the copper foils 203 and 203. The first

adhesive layers

313 and 314 are arranged between 312, and the copper foils 311 and 312 have circuit pattern layers. The printed circuit board shown in this embodiment is formed by pressing twice, that is, first pressing the core board 201, the

copper foil

202, 203, and the

first bonding layer

204, 205 to obtain the first substrate combination. The two

surfaces

2011 and 2012 of the core board 201 used for the first pressing are formed with circuit pattern layers; after pressing, the circuit pattern layers are also formed on the copper foils 202 and 203, and then on The

first bonding layer

313, 314 and the copper foils 311, 312 are stacked on the outer side of the copper foils 202, 203 to perform the second pressing. As in the first embodiment, the substrate assembly in this embodiment also includes a groove 320 in which an embedded block 321 is provided to bond the embedded block 321 and the second adhesive layer 322 of the substrate assembly; and A plurality of vias connecting the circuit pattern layer, in addition to the

holes

206, 207, 208, and 209 shown in the first embodiment, this embodiment also includes the circuit pattern layer of the copper foil 311 and the copper foil 312. The connecting via 319, the blind hole 317 which electrically connects the circuit pattern layer of the copper foil 311 with the circuit pattern layer on one surface 2011 of the core board 210, and connects the circuit pattern layer of the copper foil 312 with the The blind holes 318 electrically connected to the circuit pattern layer on one surface 2012 of the core board 210 respectively connect the circuit pattern layers of the copper foil 311 and the copper foil 202 and the copper foil 312 and the copper foil 203

Blind holes

315 and 316 are electrically connected to the circuit pattern layer.

Specifically, in this embodiment, the height of the embedded block 321 is equal to the height of the substrate assembly, and the embedded block 321 is embedded in the groove 320, and the embedded block 321 is flush with the substrate assembly.

Mount the electronic component 310 on a surface of the embedded block 321. If the electronic component 310 is mounted on the upper surface of the embedded block 321, the lower surface of the embedded block 321 is used for heat dissipation. Electronic components 310 are mounted on the lower surface of the embedded block 321, and the upper surface of the embedded block 321 is used for heat dissipation. The electronic components 310 can also be mounted on the upper and lower surfaces of the embedded block 321, or the embedded block Electronic components 310 are not mounted on the upper and lower surfaces.

In this embodiment, the shape of the embedded block 321 is square, and it can also be a boss-shaped, I-shaped, or T-shaped as shown in FIG. 1c, and it is not specifically limited. The side wall of the embedded block 321 is not A regular shape, such as a square convex shape. In other embodiments, it can also be a triangular groove, a triangular convex, a semicircular groove, a semicircular convex, etc., as shown in FIG. 1b, and the embedded block 321 is set to this This shape can improve the combination of the embedded block and the substrate.

Please refer to FIG. 3, which is a schematic structural diagram of a third embodiment of a printed circuit board of the present invention. The same as the second embodiment, the printed circuit board of this embodiment is also formed by pressing twice. Compared with the second embodiment, the difference is that the height of the embedded block 321 in this embodiment is smaller than that of the base material. The height of the combination, the groove 320 penetrates the upper and lower surfaces of the substrate combination, and the embedded block 321 is embedded in the groove 320. The embedded block 321 and the side wall of the groove 320 form a groove 323, The surface of the embedded block 321 in the groove 323 is provided with electronic components 310.

Wherein, as in the first embodiment, the shape of the embedding block 321 can be a boss-shaped, I-shaped, or T-shaped as shown in FIG. 1c, and the specific shape is not limited. The sidewalls of the embedding block 321 are irregular. The shape, such as a square convex shape, in other embodiments, can also be triangular grooves, triangular convexities, semi-circular concave grooves, semi-circular convex shapes, etc. as shown in FIG. 1b, and the embedded block 321 is configured as such The shape can improve the combination of the embedded block and the substrate.

Please refer to FIG. 4, which is a schematic structural diagram of a fourth embodiment of a printed circuit board of the present invention. Compared with the second embodiment, the difference is that this embodiment first presses the core board 201, the first

adhesive layer

204, 205 and the

copper foil

202, 203, and then opens them on the laminated substrate combination. Groove 320, the embedded block 321 is embedded in the groove 320, and the second adhesive layer 322 is filled to bond the embedded block 321 and the substrate combination, and the substrate combination and the embedded The first

adhesive layers

313 and 314 and the copper foils 311 and 312 are stacked on the outside of the block 321, and then the second pressure bonding is performed.

In this embodiment, the height of the embedded block 321 is smaller than the height of the substrate assembly, and the groove 320 penetrates the

copper foil

202 and 203 of the substrate assembly, and is covered by the first

adhesive layers

313, 314, and copper The

foils

311 and 312 are covered, and the embedded block 321 is embedded in the groove 320 and bonded by the second adhesive layer 322. In this embodiment, there is no need to mount electronic components, and the material of the embedded block 321 can be a high-speed material.

Wherein, as in the first embodiment, the shape of the embedding block can be a boss-shaped, I-shaped, or T-shaped as shown in FIG. 1c, and the specific shape is not limited. The side wall of the embedding block 321 is irregular in shape. , Such as a square convex shape, in other embodiments, it can also be triangular groove, triangular convex, semi-circular groove, semi-circular convex and other shapes shown in FIG. 1b, and the embedded block 321 is set to this shape It can improve the combination of the embedded block and the substrate.

Please refer to FIG. 5, which is a schematic structural diagram of a fifth embodiment of a printed circuit board of the present invention. Compared with the fourth embodiment, it is also formed by pressing twice. The difference is that the upper and lower surfaces of the embedded block 321 of this embodiment are connected to the upper and lower surfaces of the base material combination through

blind holes

324, 323. 323 has a metal layer, and electronic components 325 are attached to the blind holes 324 on the upper surface of the area corresponding to the position area of the embedded block 321 in the base material assembly, and the lower surface is used for heat dissipation, or the embedded block 321 in the base material assembly corresponds to Electronic components 325 are attached to the blind holes 323 on the lower surface of the location area, and the upper surface performs heat dissipation.

Please refer to FIG. 6, which is a schematic structural diagram of a sixth embodiment of a printed circuit board of the present invention. The printed circuit board includes a substrate combination and an embedded block 521. The embedded block 521 is arranged in the groove 520 through a second adhesive layer 523. The substrate combination includes a laminated arrangement and is adhered through the first

adhesive layers

504, 505, 513, and 514. The multiple substrates include

core boards

501, 511, 512 and copper foils 502, 503. The first adhesive layer 504 is located between the adjacent and spaced core board 501 and the copper foil 502, the first adhesive layer 505 is located between the adjacent and spaced core board 501 and the copper foil 503, and the first adhesive layer 513 is located between adjacent and spaced core plates 511 and copper foil 502, and the first adhesive layer 514 is located between adjacent and spaced core plates 512 and copper foil 503, that is, the adjacent and spaced core plates in FIG. 5 It is separated from the copper foil by the first adhesive layer. In Figure 5, the two

surfaces

5011 and 5012 of the core board 501, the two

surfaces

5111 and 5112 of the core board 511, the two

surfaces

5121 and 5122 of the core board 512, and the

copper foil

502 and 503 are formed with circuit pattern layers, that is, a total of eight layers of circuits Graphic layer: In this embodiment, the

first bonding layer

504, 505, 513, 514 and the second bonding layer 523 of the substrate combination are independent bonding layers.

In this embodiment, the volume of the embedded block 521 is not greater than the space of the groove 520. Further, the height of the embedded block 521 is less than the height of the groove 520. The grooves formed on the upper and lower surfaces of the embedded block 521 and the groove wall The electronic component 524 is mounted at 522. In other embodiments, the electronic component 524 may not be mounted; the first

adhesive layers

504, 505, 513, and 514 are prepregs, and the second adhesive layer 523 is a resin layer. The embedded block 521 is a metal block or high-speed material. The metal block is mainly used for heat dissipation and can increase the heat dissipation rate when the metal block is exposed to the air. The high-speed material is mainly used to change the signal transmission speed. The shape of the embedded block 521 is cylindrical. , Prismatic or rectangular parallelepiped or other shapes.

In this embodiment, the prepreg, resin, and core board materials are the same as those described in the first embodiment, and will not be repeated here.

The main difference from the above embodiment is that the base material on the outside of the substrate assembly of the above embodiment is the copper foils 311 and 312, while the base material on the outside of this embodiment is the

core plates

511 and 512.

Wherein, as in the first embodiment, the shape of the embedded block can be a boss type, an I-shape, or a T-shape as shown in FIG. 1c, and the specific shape is not limited. The side wall of the embedded block 521 has an irregular shape. , Such as a square convex shape, in other embodiments, it can also be in the shape of a triangular groove, triangular convex, semi-circular groove, semi-circular convex, etc. as shown in FIG. 1b, and the embedded block 521 is set to this shape It can improve the combination of the embedded block and the substrate.

Please refer to FIG. 7, which is a schematic structural diagram of a seventh embodiment of a printed circuit board of the present invention. The main difference from the second embodiment described above is that the outer substrates of the second embodiment are copper foils 311 and 312, while the outer substrates of this embodiment are

core plates

611 and 612. In this embodiment, the height of the embedded block 621 is equal to the height of the groove 620, and the upper and lower surfaces of the embedded block 621 embedded in the groove 620 are flush with the upper and lower surfaces of the substrate assembly. The copper foils 602 and 603 are fabricated with circuit pattern layers, and the two

surfaces

6011 and 6012 of the core board 601 are formed with circuit pattern layers on the two

surfaces

6111 and 6112 of the

core board

611, 6121 and 6122, namely There are eight layers of circuit graphics. Figure 6 shows a total of nine

holes

606, 607, 608, 609, 615, 616, 617, 618, and 619, which are the same as the second embodiment. The functions of the holes are all to electrically connect the pattern of the specified layer. connection.

Wherein, as in the first embodiment, the shape of the embedding block 621 may be a boss-shaped, I-shaped, or T-shaped as shown in FIG. 1c, and the specific shape is not limited. The sidewalls of the embedding block 621 are irregular. The shape, such as a square convex shape, in other embodiments, can also be the triangular groove, triangular convex, semi-circular groove, semi-circular convex, etc. as shown in FIG. 1b, and the embedded block 621 is set to this The shape can improve the combination of the embedded block and the substrate.

Please refer to FIG. 8, which is a schematic structural diagram of an eighth embodiment of a printed circuit board of the present invention. Compared with the fourth embodiment, the difference is that the outer substrates of the fourth embodiment are copper foils 311 and 312, while the outer substrates of this embodiment are

core plates

811 and 812. In this embodiment, the height of the embedded block 821 is less than the height of the substrate assembly, and the groove 820 penetrates the copper foils 802 and 803 of the substrate assembly, and is covered by the first

adhesive layers

813, 814 and the core The

plates

811 and 812 are covered, and the embedded block 821 is embedded in the groove 820 and bonded by the second adhesive layer 822. In this embodiment, there is no need to mount electronic components, and the material of the embedded block can be a high-speed material. The height of the embedded block 821 is equal to the height of the groove 820, and the upper and lower surfaces of the embedded block 821 embedded in the groove 820 are flush with the upper and lower surfaces of the groove.

Wherein, as in the first embodiment, the shape of the embedded block can be a boss type, an I-shape, or a T-shape as shown in FIG. 1c, and the specific shape is not limited. The side wall of the embedded block 821 has an irregular shape. , Such as a square convex shape, in other embodiments, it can also be in the shape of a triangular groove, triangular convex, semi-circular groove, semi-circular convex, etc. as shown in FIG. 1b, and the embedded block 821 is set to this shape It can improve the combination of the embedded block and the substrate.

Please refer to FIG. 9, which is a schematic structural diagram of a ninth embodiment of a printed circuit board of the present invention. The base material combination of this embodiment is composed of a core board and a core board by pressing together, including a core board 901,

core boards

904, 905 located outside the core board 901, and located between the core board 901 and the

core boards

904, 905 The first

adhesive layer

903, 902 between. After the

core plates

901, 904, 905 and the first

adhesive layers

903, 902 are pressed together to form a base material combination, a groove 906 is formed on the base material combination, and the side wall of the groove 906 The metal layer 909 is formed, specifically, it can be formed by electroplating, the embedded block 907 is embedded in the groove 906, and the second adhesive layer 908 is filled to combine the embedded block 907 with the substrate Bonding.

Wherein, the two surfaces of the

core boards

901, 904, and 905 respectively have a circuit pattern layer, or at least one surface of the

core boards

901, 904, 905 does not have a circuit pattern layer; formed on the sidewall of the groove of the core board The metal layer electrically connects the upper and lower circuit pattern layers of the core board. It should be noted that, in this embodiment, the process of forming a metal layer on the side wall of the groove of the core plate is: firstly, slot a plurality of core plates, and plate the metal layer on the groove wall, and then The core board is laminated through the first bonding, and the metal layer connects the circuit patterns of the upper and lower volumes of the core board. The core boards in the substrate combination of the printed circuit board described in this embodiment may be core boards of different materials, that is, the core boards in the same printed circuit board are copper clad laminates of different materials. A metal layer can also be provided on the sidewall of the groove in any of the above embodiments, as long as it can realize the electrical connection of the circuit pattern layer that needs to be electrically connected. In addition, in the present application, the number of layers of the core board forming the base material combination, the number of copper foil layers, and the positional relationship are not specifically limited, as long as they can meet the requirements.

Wherein, as in the first embodiment, the shape of the embedding block 907 can be a boss-shaped, I-shaped, or T-shaped as shown in FIG. 1c, and the specific shape is not limited. The sidewalls of the embedding block 907 are irregular. The shape, such as a square convex shape, in other embodiments, can also be triangular grooves, triangular convexities, semicircular grooves, semicircular convexities, etc., as shown in FIG. 1b, and the embedded block 907 is set to this The shape can improve the combination of the embedded block and the substrate.

Please refer to FIG. 10a, which is a schematic structural diagram of a manufacturing method of a printed circuit board of the present invention. include:

Step S11: Provide a substrate combination.

Specifically, please refer to FIG. 10b, which is a schematic structural diagram of the manufacturing method of the substrate assembly. Specifically:

Step S21: Provide multiple core boards, multiple layers of copper foil, and multiple first adhesive layers.

Wherein the copper foil is located on both sides of the core board and is bonded by a first bonding layer, and the surface of the copper foil and the two surfaces connecting the core board and the first bonding layer are formed with Line graphics layer.

Step S22: providing the first adhesive layer on at least part of the surface of the core board, at least part of the surface of the copper foil, or both surfaces.

Specifically, for example, a first adhesive layer is provided on both surfaces of a core board, and copper foil is provided on the first adhesive layer on both sides of the core board; or a first adhesive layer is provided on one surface of a core board, A first adhesive layer is provided on one surface of the copper foil, and the surface of the core board where the first adhesive layer is not provided is adjacent to the surface of the copper foil where the first adhesive layer is provided, and the first adhesive layer is provided on the core board. A copper foil is provided on one surface of the junction layer.

Step S23: The core board and the copper foil after the first adhesive layer are provided are alternately laminated together, so that the copper foil is arranged on the outside of the core board or on two adjacent core boards In between, they are pressed together to form a substrate combination.

Wherein, the copper foil can be located on both sides of the core board, or between the two core boards, and the first adhesive layer can bond two adjacent core boards, or bond the core board and the copper foil. After the core board, the copper foil and the first adhesive layer are set up as required, they are pressed together to make them tightly combined with the base material.

Specifically, the first adhesive layer is a prepreg, which is mainly composed of resin and reinforcing materials (glass fiber cloth, paper substrate, composite materials, etc.). The prepregs used in the production of multilayer printed boards are mostly made of glass fiber cloth. The reinforcing material is impregnated with resin, and then subjected to heat treatment, the prepreg will soften under heating and pressure, and will react and solidify after cooling.

Step S12: Grooving at the position where the embedded block needs to be placed in the base material assembly.

Specifically, the substrate assembly is provided with a circuit pattern layer. In order not to affect the integrity of the circuit pattern layer when grooving on the substrate assembly, when the circuit pattern layer is set, it is necessary to avoid positions that need to be grooved in advance. After pressing the circuit board, slotting is made at the position where the circuit pattern layer is not provided.

Step S13: placing an embedded block in the groove of the substrate assembly.

After the groove is set, the embedded block is placed in the groove. In this application, in order to improve the bonding force between the embedded block and the base material, the shape of the embedded block may be a boss type as shown in FIG. 1c. The shape of the font, the T shape, is not specifically limited. The side wall of the embedded block is irregular, such as a square convex shape. In other embodiments, it may also be a triangular groove or a triangular protrusion as shown in FIG. 1b. , Semi-circular groove, semi-circular convex and other shapes.

Step S14: Fill the groove with a second adhesive layer to bond the embedded block and the substrate.

After the embedded block is put into the groove, a second adhesive layer is filled around the embedded block, so that the embedded block is combined with the base material, and the second adhesive layer is a resin or a conductive material According to requirements, if the embedded block and the base material are to be independent of each other, then fill resin, such as phenolic resin, polyvinyl chloride resin, polyethylene, polytetrafluoroethylene, etc. When the base material is combined for electrical connection, a conductive material is filled, such as a resin with copper powder or silver powder.

In the present invention, the core board and the copper foil are first pressed through the first adhesive layer to form a base material combination, and then the base material combination is slotted, the embedded block is placed in the groove, and the embedded block is filled with The resin binds the embedded block to the substrate combination. After combining and bonding the embedded block and the substrate, a first adhesive layer and a core plate can be provided on the upper and lower surfaces of the embedded block, or the first adhesive can be provided on the upper and lower surfaces of the embedded block according to requirements. Layer and copper foil.

The present invention provides a printed circuit board and a manufacturing method thereof. The printed circuit board includes a base material assembly. The base material assembly is slotted and an embedded block is placed. The material of the embedded block is metal to achieve the The purpose of heat dissipation of the printed circuit board is to set the side wall of the embedded block into irregular shapes, such as triangular grooves, triangular protrusions, square grooves, square protrusions, circular grooves, and circular protrusions. Etc., in order to achieve the effect of enhancing the bonding force between the embedded block and the substrate combination. The manufacturing method of the printed circuit board is to make a base material combination by pressing first, slot the base material combination, and then place the embedded block in the base material combination, and fill the second adhesive layer (resin or conductive resin ) Combine it with the substrate for bonding. Afterwards, circuit boards of other structures can be arranged on the upper surface and/or lower surface of the embedded block as required. This increases the laminated structure of the printed circuit board.

The above are only implementations of this application, and do not limit the scope of this application. Any equivalent structural transformation made using the content of the description and drawings of this application, or directly or indirectly applied to other related technical fields, is the same The theory is included in the scope of patent protection of this application.

Claims

A printed circuit board in which,

The printed circuit board includes a substrate combination and an embedded block, and the substrate combination includes a plurality of substrates laminated and bonded through a first adhesive layer;

The substrate combination is provided with a groove, the side wall of the embedded block is irregularly shaped, the embedded block is arranged in the groove through a second adhesive layer, and the first adhesive of the substrate combination The layer and the second adhesive layer are mutually independent adhesive layers.
The printed circuit board according to claim 1, wherein the substrate combination includes a plurality of core boards, a multilayer copper foil, and the first bonding layer, and the copper foil is located outside the plurality of core boards Or between the core plates, the first adhesive layer is located between two adjacent core plates and between the adjacent core plates and the copper foil.
The printed circuit board according to claim 2, wherein the shape of the embedded block is one or any combination of a cylindrical shape, a prismatic shape, a rectangular parallelepiped, a U shape, a T shape, and an I-shape;

The irregular shape of the side wall of the embedded block is one or any combination of a square groove, a triangular groove, a semicircular groove, a semicircular protrusion, a square protrusion or a triangular protrusion;

The core boards are copper clad laminates of the same material and/or copper clad laminates of different materials;

The two opposite surfaces of the core board have circuit pattern layers and/or one surface of the core board has circuit pattern layers.
The printed circuit board according to claim 1, wherein the volume of the embedded block is less than or equal to the space size of the groove, and the embedded block and the groove wall of the groove are bonded by the second adhesive layer ；

A metal layer is provided on the groove wall of the groove.
The printed circuit board according to claim 4, wherein the height of the embedded block is equal to the height of the groove and is flush with the upper surface and/or the lower surface of the substrate, and the upper surface of the embedded block and /Or electronic components are attached to the bottom surface; or

The height of the embedded block is equal to the height of the groove, and the upper surface and/or the lower surface of the embedded block are covered by the core board and/or the copper foil and the first adhesive layer.
The printed circuit board according to claim 4, wherein the height of the embedded block is smaller than the height of the groove, the upper surface and/or the lower surface of the embedded block and the groove wall form a groove, and the concave Electronic components are pasted in the slot;

The upper surface and/or lower surface of the insert block is electrically connected to the upper surface and/or lower surface of the base material through the holes that penetrate the core plate and/or the copper foil and the first adhesive layer. Sexual connection.
The printed circuit board according to claim 1, wherein the first adhesive layer is a prepreg;

The second adhesive layer is a resin layer;

The material of the embedded block is metal or high-speed material.
A manufacturing method of a printed circuit board, characterized in that the method comprises:

A substrate combination is provided, the substrate combination includes a plurality of substrates arranged in a stack and bonded by a first adhesive layer;

Grooving at the position where the base material combination needs to place the embedded block;

Placing an embedded block in the groove of the substrate assembly;

A second adhesive layer is filled in the groove to bond the embedded block and the base material assembly.
The manufacturing method according to claim 8, wherein:

The provided substrate combination specifically includes:

Provide multiple substrates, the multiple substrates including multiple core boards and multilayer copper foils;

Disposing the first adhesive layer on at least part of the core board surface, at least part of the copper foil surface, or both surfaces;

Alternately stacking the core board and the copper foil after the first adhesive layer is provided, so that the copper foil is arranged on the outer side of the core board or between two adjacent core boards, Then they are pressed to form a substrate combination.
The manufacturing method according to claim 9, wherein:

After filling the second adhesive layer in the groove so that the embedded block and the base material are combined and bonded, the method further includes:

A third adhesive layer and a second core board are sequentially arranged on the upper surface and/or the lower surface of the substrate assembly in which the embedded block is embedded; or

A third adhesive layer and a second copper foil are sequentially arranged on the upper surface and/or the lower surface of the base material combination embedded with the embedded block.