CN114765929A - Laminating method of circuit board and circuit board - Google Patents
Laminating method of circuit board and circuit board Download PDFInfo
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- CN114765929A CN114765929A CN202110048974.7A CN202110048974A CN114765929A CN 114765929 A CN114765929 A CN 114765929A CN 202110048974 A CN202110048974 A CN 202110048974A CN 114765929 A CN114765929 A CN 114765929A
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- inner core
- prepregs
- laminating
- circuit board
- glue filling
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- 238000010030 laminating Methods 0.000 title claims abstract description 56
- 238000000034 method Methods 0.000 title claims abstract description 53
- 239000003292 glue Substances 0.000 claims abstract description 104
- 239000000463 material Substances 0.000 claims abstract description 24
- 229920005989 resin Polymers 0.000 claims abstract description 23
- 239000011347 resin Substances 0.000 claims abstract description 23
- 238000010438 heat treatment Methods 0.000 claims abstract description 12
- 239000000853 adhesive Substances 0.000 claims description 11
- 230000001070 adhesive effect Effects 0.000 claims description 11
- 238000002844 melting Methods 0.000 claims description 10
- 230000008018 melting Effects 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 28
- 239000011889 copper foil Substances 0.000 abstract description 17
- 239000000945 filler Substances 0.000 abstract description 16
- 239000003365 glass fiber Substances 0.000 abstract description 9
- 230000000694 effects Effects 0.000 abstract description 8
- 230000002411 adverse Effects 0.000 abstract description 7
- 238000003825 pressing Methods 0.000 abstract description 2
- 229910052802 copper Inorganic materials 0.000 description 11
- 239000010949 copper Substances 0.000 description 11
- 238000003475 lamination Methods 0.000 description 10
- 238000010586 diagram Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000005429 filling process Methods 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4632—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating thermoplastic or uncured resin sheets comprising printed circuits without added adhesive materials between the sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/036—Multilayers with layers of different types
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The application discloses a laminating method of a circuit board and the circuit board, wherein the laminating method of the circuit board comprises the following steps: providing at least one patterned inner core board and at least two prepregs; one inner core board is clamped between any two prepregs so that at least one inner core board is arranged in a laminated mode; wherein, a glue filling layer is also adhered between each prepreg and the inner core plate which is abutted against the prepreg, and the glue filling layer is made of resin materials; and heating the at least one inner core plate, the at least two prepregs and the at least two glue filling layers which are arranged in a laminated manner to a preset temperature so as to melt the glue filling layers, filling the glue filling layers into the patterned grooves of each inner core plate, and then laminating. In this way, this application has effectively reduced the not enough risk of filling with glue and glass fibre or filler direct contact to inner core board copper foil through pressing from both sides between prepreg and inner core board and establish the layer of glue filling, has also avoided the filler to the adverse effect of the mechanical stress of circuit board inner layer copper foil.
Description
Technical Field
The present disclosure relates to the field of circuit board processing technologies, and in particular, to a circuit board and a laminating method thereof.
Background
Nowadays, with the integration development of electronic product functions, the requirement of electronic products for heat dissipation performance is becoming higher and higher. One of the key means for enhancing the heat dissipation of the electronic product is to increase the thickness of the copper foil of the PCB (circuit board) in the electronic product, so that the PCB gradually develops toward the trend of thick copper.
However, in the process of pressing the thick copper PCB, the amount of glue filling required by the inner layer pattern increases with the increase of the thickness of the inner layer copper, which is very likely to cause the risks of insufficient glue filling and contact of glass fibers or fillers with the copper foil of the inner layer core board, and further cause serious influence on the reliability of the product.
At present, aiming at the problem, a measure generally adopted in the industry is to increase the glue content of PP (prepreg) in the PCB, but because the fluidity of PP also has limitation, particularly in a high-speed product, the problem of insufficient glue filling still cannot be effectively solved, and the adverse effect of a filler on the mechanical stress of an inner layer copper foil cannot be avoided.
Disclosure of Invention
The application provides a laminating method of a circuit board and the circuit board, which aim to solve the problems that the laminating method of the circuit board in the prior art is easy to cause insufficient glue filling and risks that glass fibers or fillers contact copper foils and the like, and adverse effects of the fillers on mechanical stress of inner copper foils of the circuit board cannot be avoided.
In order to solve the technical problem, the application adopts a technical scheme that: provided is a circuit board laminating method, wherein the circuit board laminating method comprises the following steps: providing at least one patterned inner core board and at least two prepregs; one inner core board is clamped between any two prepregs so that at least one inner core board is arranged in a laminated mode; wherein, a glue filling layer is also adhered between each prepreg and the inner core plate which is abutted against the prepreg, and the glue filling layer is made of resin materials; and heating the at least one inner core plate, the at least two prepregs and the at least two glue filling layers which are arranged in a laminated manner to a preset temperature so as to melt the glue filling layers, filling the glue filling layers into the patterned grooves of each inner core plate, and then laminating.
Wherein, press from both sides one of them inlayer core board between arbitrary two prepregs to make at least one inlayer core board stromatolite step of setting up after, with at least one inlayer core board, at least two prepregs and at least two rubber packing layer heating that the stromatolite set up to preset temperature, with the melting rubber packing layer, and after filling the recess of the patterning to each inlayer core board, before carrying out the lamination, still include: respectively laminating a first copper-clad plate and a second copper-clad plate on the outer side surfaces of two prepregs on the outermost layer; heating at least one inner core plate, at least two prepregs and at least two adhesive filling layers which are arranged in a laminated manner to a preset temperature so as to melt the adhesive filling layers, filling the adhesive filling layers into the patterned grooves of each inner core plate, and then laminating the inner core plates, wherein the step of laminating comprises the following steps: and heating at least one inner core plate, at least two prepregs, at least two adhesive filling layers, a first copper-clad plate and a second copper-clad plate which are arranged in a laminated manner to a preset temperature so as to melt the adhesive filling layers, filling the adhesive filling layers into the patterned grooves of each inner core plate, and laminating.
Wherein, one of the inner core boards is clamped between any two prepregs so that at least one inner core board is arranged in a lamination way, the method further comprises the following steps: and preparing a glue filling layer on one side surface of two prepregs, and preparing the glue filling layers on two opposite sides of other prepregs in the at least two prepregs respectively.
Wherein, one of the inner core boards is sandwiched between any two prepregs so that before the step of arranging at least one inner core board in a laminated manner, the method further comprises the following steps: preparing at least two glue filling layers; one inner core board is clamped between any two prepregs, so that the step of laminating at least one inner core board comprises the following steps: one of the inner core boards is sandwiched between any two prepregs, and a glue filling layer is further sandwiched between each prepreg and one of the inner core boards, so that at least one inner core board is arranged in a laminated manner.
Wherein, the volume ratio of the volume of each glue filling layer to the volume of the patterned groove at the corresponding side of the inner core plate which is abutted against the glue filling layer is 1: (0.7-0.8).
The prepreg comprises a resin material, and the resin material in the prepreg is homologous with the resin material in the glue filling layer.
Wherein the fluidity of the underfill layer is higher than that of the prepreg.
Wherein the melting point of the glue filling layer is lower than that of the prepreg.
Wherein the melting point of the glue filling layer is 0-20 ℃ lower than that of the prepreg.
In order to solve the above technical problem, the present application adopts another technical solution: there is provided a circuit board, wherein the circuit board is laminated by a laminating method of the circuit board as described in any one of the above.
The beneficial effect of this application is: different from the prior art, in the circuit board laminating method in the application, one inner core board is clamped between any two prepregs so as to enable at least one inner core board to be arranged in a laminated manner, a glue filling layer is attached between each prepreg and the inner core board which is abutted against the prepreg, the glue filling layer is made of resin materials, when the at least one inner core board, the at least two prepregs and the at least two glue filling layers which are arranged in the laminated manner are heated to the preset temperature, the glue filling layer can be melted so as to fill the patterned grooves of each inner core board and then carry out lamination, so that the risks of insufficient glue filling in the circuit board and direct contact of glass fibers or fillers to the copper foil of the inner core board can be effectively reduced through the arrangement of the glue filling layer, and the glue filling layer is made of resin materials, so that the adverse effect of the fillers on the mechanical stress of the inner copper foil of the circuit board is avoided, and the reliability of the product is effectively improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without inventive efforts, wherein:
FIG. 1a is a schematic flow chart of a first embodiment of a method for laminating a circuit board according to the present invention;
FIGS. 1 b-1 d are schematic structural diagrams of an embodiment corresponding to S11-S13 in FIG. 1 a;
fig. 2 is a schematic flow chart of a second embodiment of the circuit board laminating method of the present application.
Detailed Description
In order to make the technical problems solved, technical solutions adopted, and technical effects achieved by the present application clearer, the technical solutions of the embodiments of the present application will be further described in detail with reference to the accompanying drawings.
Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the present application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.
Referring to fig. 1a to 1d, fig. 1a is a schematic flow chart of a first embodiment of a circuit board laminating method of the present application, and fig. 1b to 1d are schematic structural diagrams of an embodiment corresponding to S11 to S13 in fig. 1 a. The implementation mode comprises the following steps:
s11: at least one patterned inner core 11 and at least two prepregs 12 are provided.
Specifically, as shown in fig. 1b, in the process of laminating the circuit board, it is first required to pattern each inner core board 11 to be laminated in the circuit board, and in order to achieve more reliable bonding between every two adjacent inner core boards 11 in the lamination, a half-cured sheet 12 is further required to be correspondingly sandwiched.
In the present embodiment, at least one patterned inner core 11, that is, the inner core 11 formed with the patterned grooves 111, and at least two prepregs 12 are provided first.
S12: one inner core board 11 is sandwiched between any two prepregs 12, so that at least one inner core board 11 is arranged in a laminated manner, wherein a glue filling layer 13 is further attached between each prepreg 12 and the inner core board 11 abutted thereto, and the glue filling layer 13 is made of a resin material.
Further, as shown in fig. 1c, one of the inner core boards 11 is sandwiched between any two prepregs 12, so as to further laminate at least one patterned inner core board 11 and at least two prepregs 12 provided this time, and a glue filling layer 13 is further attached between each prepreg 12 and the inner core board 11 abutting against the prepreg 12. That is, at least one side of each prepreg 12 is pre-attached with a glue filling layer 13, and in the corresponding obtained laminated structure, two sides of each inner core board 11 are the glue filling layers 13, and two sides of each glue filling layer 13 are the prepreg 12 and the inner core board 11 respectively, so that the prepreg 12 is separated from the inner core board 11 by the glue filling layers 13, and thus, the filler or the glass fiber in the prepreg 12 can be effectively prevented from directly contacting the copper foil of the inner core board 11.
The glue filling layer 13 is made of resin materials, and the glue filling layer 13 does not contain filler and glass fiber cloth, so that the glue filling layer 13 has good fluidity, and therefore, in the subsequent lamination process, when the melted glue filling layer 13 is filled in the patterned grooves 111 of the corresponding inner core plate 11, unnecessary mechanical stress can be reduced, and meanwhile, the glue filling of the inner core plate 11 can be ensured to be more sufficient, and the risk of layering is reduced.
For convenience of description, in the present embodiment, taking 3 patterned core boards 11, 4 prepregs 12 and 6 underfill layers 13 as examples, the core boards 11, the prepregs 12 and the underfill layers 13 are sequentially stacked at intervals as shown in fig. 1 c. It is understood that in other embodiments, any reasonable number of inner cores 11, prepregs 12 and underfill layers 13 may be provided, which is not limited in this application.
In an embodiment, a copper-clad layer is further attached to the outermost side of the circuit board through the prepreg 12, for example, the first copper-clad plate 14 and the second copper-clad plate 15 are further respectively stacked on the outermost sides of the stacked 3 inner core boards 11, 4 prepregs 12 and 6 underfill layers 13.
S13: heating the at least one inner core board 11, the at least two prepregs 12 and the at least two glue filling layers 13 to a predetermined temperature to melt the glue filling layers 13, filling the grooves 111 of each inner core board 11 with the melted glue filling layers, and laminating the inner core boards.
Further, as shown in fig. 1d, at least one inner core board 11, at least two prepregs 12 and at least two glue filling layers 13, which are stacked, are heated to a predetermined temperature to melt the glue filling layers 13 therein, so that the melted glue filling layers 13 flow and are filled into the patterned grooves 111 of each inner core board 11, and then lamination is performed, so that each groove 111 is filled with the melted glue filling layers 13, thereby obtaining a finished circuit board.
It can be understood that, because the glue filling layer 13 is directly abutted to the inner core board 11 in the laminating process of the circuit board, the filler in the prepreg 12 or the glass fiber is effectively prevented from directly contacting the copper foil of the inner core board 11, the risk of insufficient glue filling possibly generated in the groove 111 of the inner core board 11 is also reduced, and because the glue filling layer 13 is made of the resin material, the adverse effect of the filler on the mechanical stress of the inner copper foil of the circuit board is also avoided, and the reliability of the final finished product is effectively improved.
Further, in an embodiment, after S11 and before S12 of the method for laminating a circuit board of the present application, the method may further include: the underfill layers 13 are prepared on one side of two of the prepregs 12, and the underfill layers 13 are respectively prepared on the opposite sides of the other prepregs 12 of the at least two prepregs 12.
Specifically, a copper-clad layer is usually attached to the outermost side of the circuit board through the prepreg 12, and the copper-clad layer is not patterned, so that no underfill process is required, that is, no corresponding underfill layer 13 needs to be prepared on the side of the prepreg 12 abutting against the copper-clad layer in the circuit board.
When at least two prepregs 12 are provided, a glue filling solution may be directly coated on one side of two prepregs 12, and a semi-curing process may be further performed to obtain glue filling layers 13 respectively attached to one sides of the two prepregs 12.
Further, the underfill layers 13 are respectively prepared on opposite sides of the other prepregs 12 than the two prepregs 12, on one side of which the underfill layers 13 have been prepared, among the at least two prepregs 12.
It is understood that when only two prepregs 12, one patterned inner core 11 and two copper clad layers are provided, the corresponding underfill layers 13 can be prepared on only one side of the two prepregs 12.
Further, in an embodiment, before the above S12 of the method for laminating a circuit board of the present application, the method may further include: preparing at least two glue filling layers 13;
specifically, at least two underfill layers 13 may be prepared separately on a substrate prepared in advance, and after removing the substrate, at least two separate underfill layers 13 may be obtained.
Further, in an embodiment, the above S12 of the method for laminating a circuit board of the present application may further include: one of the inner core boards 11 is sandwiched between any two prepregs 12, and a glue filling layer 13 is further sandwiched between each prepreg 12 and one of the inner core boards 11, so that at least one inner core board 11 is stacked.
Specifically, when at least two separate underfill layers 13 are obtained, one of the underfill layers 13 may be further sandwiched between each of the prepregs 12 and one of the inner core boards 11 provided this time, and one of the inner core boards 11 may be further sandwiched between any two prepregs 12, so as to further stack the corresponding inner core boards 11, prepregs 12, and underfill layers 13.
Optionally, the thickness of each glue filling layer 13 is 10 to 200 micrometers, and the thickness of the glue filling layer 13 may be reasonably selected and set according to the copper thickness of the corresponding inner core board 11 and the residual copper rate after patterning, which is not limited in this application.
Alternatively, the ratio of the volume of each of the glue layers 13 to the volume of the patterned groove 111 on the corresponding side of the inner core board 11 abutting against the glue layer is 1: (0.7-0.8), that is, the ratio of the total volume of the underfill layer 13 in the finally obtained circuit board to the total volume of the patterned grooves 111 therein is 1: (0.7-0.8) to ensure that each patterned groove 111 therein can be filled with the melted underfill layer 13, and further the melted underfill layer 13 can effectively separate two adjacent prepregs 12 and copper foils in the core board 11.
The total volume of the patterned grooves 111 in each inner core 11 can be calculated by the following formula: the core area of the inner core 11 is copper thickness (1-residual copper ratio).
Optionally, the manufacturing material of the prepreg 12 further includes a resin material, and the resin material in the prepreg 12 and the resin material in the underfill layer 13 are homologous resin materials, for example, both are epoxy resins, so that the signal loss of the correspondingly obtained circuit board in the subsequent use process can ensure consistency.
In some embodiments, the fluidity of the underfill layer 13 is higher than that of the prepreg 12, that is, the fluidity of the underfill layer 13 is better than that of the prepreg 12, so that unnecessary mechanical stress can be reduced when the underfill layer 13 is filled in the patterned grooves 111 of the corresponding inner core board 11 in the subsequent lamination process, and simultaneously, the corresponding underfill can be ensured to be more sufficient, thereby reducing the risk of delamination.
Optionally, the melting point of the underfill layer 13 is lower than that of the prepreg 12, so that during the lamination process by heating at least one inner core board 11, at least two prepregs 12 and at least two underfill layers 13 arranged in a stacked manner to a preset temperature, the underfill layer 13 can be melted before the prepregs 12 to fill the patterned grooves 111 of the corresponding inner core boards 11, so as to ensure that the underfill is sufficient.
Alternatively, the melting point of the underfill layer 13 is 0-20 ℃ lower than the melting point of the prepreg 12.
Optionally, the melting point of the underfill layer 13 is 40 ℃ to 60 ℃, and the melting point of the prepreg 12 is 60 ℃ to 80 ℃.
Different from the prior art, in the circuit board laminating method in the application, one inner core board is clamped between any two prepregs so as to enable at least one inner core board to be arranged in a laminated manner, a glue filling layer is attached between each prepreg and the inner core board which is abutted against the prepreg, the glue filling layer is made of resin materials, when the at least one inner core board, the at least two prepregs and the at least two glue filling layers which are arranged in the laminated manner are heated to the preset temperature, the glue filling layer can be melted so as to fill the patterned grooves of each inner core board and then carry out lamination, so that the risks of insufficient glue filling in the circuit board and direct contact of glass fibers or fillers to the copper foil of the inner core board can be effectively reduced through the arrangement of the glue filling layer, and the glue filling layer is made of resin materials, so that the adverse effect of the fillers on the mechanical stress of the inner copper foil of the circuit board is avoided, and the reliability of the product is effectively improved.
Referring to fig. 2, fig. 2 is a schematic flow chart of a second embodiment of a circuit board laminating method according to the present application. The circuit board laminating method of the present embodiment is a schematic flow chart of a detailed embodiment of the circuit board laminating method in fig. 1a, and includes the following steps:
s21: at least one patterned inner core 11 and at least two prepregs 12 are provided.
S22: one inner core board 11 is sandwiched between any two prepregs 12, so that at least one inner core board 11 is arranged in a laminated manner, wherein a glue filling layer 13 is further attached between each prepreg 12 and the inner core board 11 abutted against the prepreg 12, and the glue filling layer 13 is made of a resin material.
S21 and S22 are the same as S11 and S12 in fig. 1a, and please refer to S11 and S12 and their related text descriptions, which are not described herein again.
S23: and a first copper-clad plate 14 and a second copper-clad plate 15 are respectively laminated on the outer side surfaces of the two prepregs 12 at the outermost layer.
Specifically, as shown in fig. 1c, a copper-clad layer, such as a first copper-clad plate 14 and a second copper-clad plate 15, is further attached to the outermost side of the circuit board through a prepreg 12, so that the first copper-clad plate 14 and the second copper-clad plate 15 are respectively stacked on the outer side surfaces of at least one inner core 11, at least two prepregs 12 and at least two outermost prepregs 12 of the at least two stacked layers 13.
S24: heating at least one inner core board 11, at least two prepregs 12, at least two glue filling layers 13, a first copper-clad plate 14 and a second copper-clad plate 15 which are arranged in a laminated manner to a preset temperature so as to melt the glue filling layers 13, filling the glue filling layers into the patterned grooves 111 of each inner core board 11, and then laminating.
Further, as shown in fig. 1d, at least one inner core board 11, at least two prepregs 12, at least two glue filling layers 13, a first copper clad laminate 14 and a second copper clad laminate 15 which are stacked are heated to a preset temperature to melt the glue filling layers 13 therein, so that the melted glue filling layers 13 flow and are filled into the patterned grooves 111 of each inner core board 11, and then the inner core boards are laminated, so that each groove 111 can be filled with the melted glue filling layers 13, thereby manufacturing the finished circuit board.
Further, in an embodiment, after S21 and before S22 of the method for laminating a circuit board of the present application, the method may further include: the underfill layers 13 are prepared on one side of two of the prepregs 12, and the underfill layers 13 are respectively prepared on the opposite sides of the other prepregs 12 of the at least two prepregs 12.
Specifically, a copper-clad layer is usually attached to the outermost side of the circuit board through the prepreg 12, for example, the first copper-clad plate 14 and the second copper-clad plate 15 in the embodiment are not patterned, so that the glue filling process is not required, that is, one side surface of the prepreg 12 abutting against the first copper-clad plate 14 and the second copper-clad plate 15 in the circuit board does not need to be provided with the corresponding glue filling layer 13.
When at least two prepregs 12 are provided, a glue filling solution may be directly coated on one side of two prepregs 12, and a semi-curing process may be further performed to obtain glue filling layers 13 respectively attached to one sides of the two prepregs 12.
Further, the underfill layers 13 are respectively prepared on opposite sides of the other prepregs 12 than the two prepregs 12, on one side of which the underfill layers 13 have been prepared, among the at least two prepregs 12.
It is understood that when only two prepregs 12, one patterned inner core 11 and two copper clad layers are provided, the corresponding underfill layers 13 can be prepared on only one side of the two prepregs 12.
Based on the general inventive concept, there is also provided a circuit board, wherein the circuit board is laminated by a laminating method of the circuit board as described in any one of the above.
Different from the situation of the prior art, in the method for laminating the circuit board in the application, one inner core board is clamped between any two prepregs so as to enable at least one inner core board to be arranged in a laminated manner, a glue filling layer is attached between each prepreg and the inner core board which is abutted against the prepreg, the glue filling layer is made of resin materials, when the at least one inner core board, the at least two prepregs and the at least two glue filling layers which are arranged in the laminated manner are heated to the preset temperature, the glue filling layer can be melted so as to fill the patterned grooves of each inner core board and then carry out lamination, so that the risks of insufficient glue filling in the circuit board and direct contact of glass fibers or fillers to copper foil of the inner core board can be effectively reduced through the arrangement of the glue filling layer, and the glue filling layer is made of resin materials, so that the adverse effect of the fillers on the mechanical stress of the copper foil of the inner layer of the circuit board is avoided, and the reliability of the product is effectively improved.
The above description is only for the purpose of illustrating embodiments of the present application and is not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes, which are made by the contents of the specification and the drawings of the present application or are directly or indirectly applied to other related technical fields, are also included in the scope of the present application.
Claims (10)
1. A circuit board laminating method, comprising:
providing at least one patterned inner core board and at least two prepregs;
one inner core board is clamped between any two prepregs so that at least one inner core board is arranged in a laminated mode; a glue filling layer is further attached between each prepreg and the inner core plate abutted to the prepreg, and is made of resin materials;
and heating at least one inner core plate, at least two prepregs and at least two glue filling layers which are arranged in a laminated manner to a preset temperature so as to melt the glue filling layers, filling the glue filling layers into the patterned grooves of each inner core plate, and then laminating.
2. The method according to claim 1, wherein after the step of laminating at least one core board by sandwiching one of the core boards between any two prepregs, and after the step of heating the at least one core board, at least two prepregs, and at least two underfill layers to a predetermined temperature to melt the underfill layers and fill the patterned grooves of each core board, before the step of laminating, the method further comprises:
respectively laminating a first copper-clad plate and a second copper-clad plate on the outer side surfaces of the two prepregs on the outermost layer;
the step of heating at least one inner core board, at least two prepregs and at least two adhesive filling layers arranged in a stacked manner to a preset temperature to melt the adhesive filling layers and fill the grooves patterned in each inner core board, and then laminating the inner core boards comprises the following steps:
and heating at least one inner core plate, at least two prepregs, at least two adhesive filling layers, the first copper-clad plate and the second copper-clad plate which are arranged in a laminated manner to a preset temperature so as to melt the adhesive filling layers, filling the adhesive filling layers into the patterned grooves of each inner core plate, and laminating.
3. The circuit board laminating method according to claim 2, wherein before the step of interposing one of the core boards between any two prepregs so that at least one of the core boards is laminated, the method further comprises:
preparing the glue filling layer on one side surface of two prepregs, and respectively preparing the glue filling layer on two opposite sides of other prepregs in at least two prepregs.
4. The circuit board laminating method according to claim 1, wherein before the step of interposing one of the core boards between any two prepregs so that at least one of the core boards is laminated, the method further comprises:
preparing at least two glue filling layers;
the step of sandwiching one of the inner core boards between any two prepregs to enable at least one inner core board to be stacked comprises:
and one of the inner core boards is clamped between any two prepregs, and one of the glue filling layers is further clamped between each prepreg and one of the inner core boards, so that at least one inner core board is arranged in a laminated manner.
5. The method of laminating a circuit board according to claim 1,
the ratio of the volume of each glue filling layer to the volume of the patterned groove on the corresponding side of the inner-layer core plate abutted against the glue filling layer is 1: (0.7-0.8).
6. The method of laminating a circuit board according to claim 1,
the prepreg comprises a resin material, and the resin material in the prepreg is homologous with the resin material in the glue filling layer.
7. The method of laminating a circuit board according to claim 1, wherein the laminating step is a step of laminating the circuit board
The fluidity of the glue filling layer is higher than that of the prepreg.
8. The method of laminating a circuit board according to claim 1, wherein the laminating step is a step of laminating the circuit board
The melting point of the glue filling layer is lower than that of the prepreg.
9. The method of laminating a circuit board according to claim 8, wherein the laminating step is a step of laminating the circuit board
The melting point of the glue filling layer is 0-20 ℃ lower than that of the prepreg.
10. A circuit board, characterized in that it is laminated by the laminating method of the circuit board according to any one of claims 1 to 9.
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| CN202110048974.7A CN114765929A (en) | 2021-01-14 | 2021-01-14 | Laminating method of circuit board and circuit board |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101664733A (en) * | 2009-09-15 | 2010-03-10 | 广东生益科技股份有限公司 | Method for making prepreg used for thick copper multilayer printed circuit board and prepreg |
| CN202503814U (en) * | 2012-02-13 | 2012-10-24 | 东莞森玛仕格里菲电路有限公司 | Heavy copper printed circuit board with inner layer and outer layer |
| CN108323038A (en) * | 2018-01-22 | 2018-07-24 | 广州兴森快捷电路科技有限公司 | Thick copper PCB and preparation method thereof, bomb shelter method |
| CN108495487A (en) * | 2018-04-16 | 2018-09-04 | 深圳市景旺电子股份有限公司 | A kind of production method of multilayer heavy copper circuit board |
| CN110113898A (en) * | 2019-04-09 | 2019-08-09 | 沪士电子股份有限公司 | A kind of PCB plate production method based on liquid resin |
| CN110267465A (en) * | 2019-06-10 | 2019-09-20 | 江门崇达电路技术有限公司 | A kind of compression method improving thick copper circuit board plate thickness uniformity |
-
2021
- 2021-01-14 CN CN202110048974.7A patent/CN114765929A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101664733A (en) * | 2009-09-15 | 2010-03-10 | 广东生益科技股份有限公司 | Method for making prepreg used for thick copper multilayer printed circuit board and prepreg |
| CN202503814U (en) * | 2012-02-13 | 2012-10-24 | 东莞森玛仕格里菲电路有限公司 | Heavy copper printed circuit board with inner layer and outer layer |
| CN108323038A (en) * | 2018-01-22 | 2018-07-24 | 广州兴森快捷电路科技有限公司 | Thick copper PCB and preparation method thereof, bomb shelter method |
| CN108495487A (en) * | 2018-04-16 | 2018-09-04 | 深圳市景旺电子股份有限公司 | A kind of production method of multilayer heavy copper circuit board |
| CN110113898A (en) * | 2019-04-09 | 2019-08-09 | 沪士电子股份有限公司 | A kind of PCB plate production method based on liquid resin |
| CN110267465A (en) * | 2019-06-10 | 2019-09-20 | 江门崇达电路技术有限公司 | A kind of compression method improving thick copper circuit board plate thickness uniformity |
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